CN108878622B - LED packaging structure, backlight module and display device - Google Patents
LED packaging structure, backlight module and display device Download PDFInfo
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- CN108878622B CN108878622B CN201810642350.6A CN201810642350A CN108878622B CN 108878622 B CN108878622 B CN 108878622B CN 201810642350 A CN201810642350 A CN 201810642350A CN 108878622 B CN108878622 B CN 108878622B
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- retaining wall
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 41
- 230000000694 effects Effects 0.000 abstract description 12
- 238000005538 encapsulation Methods 0.000 abstract description 4
- 230000005284 excitation Effects 0.000 abstract description 4
- 239000000843 powder Substances 0.000 description 12
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 7
- 238000009792 diffusion process Methods 0.000 description 7
- 230000009286 beneficial effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 239000000741 silica gel Substances 0.000 description 3
- 229910002027 silica gel Inorganic materials 0.000 description 3
- 239000003086 colorant Substances 0.000 description 2
- 229920006336 epoxy molding compound Polymers 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229920000137 polyphosphoric acid Polymers 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 108010043121 Green Fluorescent Proteins Proteins 0.000 description 1
- 239000003677 Sheet moulding compound Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012788 optical film Substances 0.000 description 1
- 229920001123 polycyclohexylenedimethylene terephthalate Polymers 0.000 description 1
- 239000002096 quantum dot Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Nonlinear Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Planar Illumination Modules (AREA)
Abstract
The invention discloses an LED packaging structure, a backlight module and display equipment. The LED packaging structure comprises a support and at least two LED chips, wherein the support is concave inwards to form a bowl cup, a retaining wall is convexly arranged in the middle of the bottom surface of the bowl cup, the LED chips are arranged in the bowl cup and are distributed symmetrically, and a packaging layer is filled in the bowl cup. Among this LED packaging structure, be provided with convex barricade at the bowl cup middle part of encapsulation LED chip, the light that the LED chip sent will be reflected to the lateral part of bowl cup under the effect of barricade to control LED packaging structure is by the light that the middle part jetted out, increases support light all around, thereby increases the excitation efficiency of light to support encapsulated layer all around, improves the homogeneity of LED packaging structure colourity, thereby improves backlight unit's luminous effect.
Description
Technical Field
The invention relates to the technical field of display equipment, in particular to an LED packaging structure, a backlight module and display equipment.
Background
Along with the improvement of the power and the luminous efficiency of the LED, the LED product is widely applied to the fields of backlight modules of display products, general illumination and the like due to the characteristics of energy conservation, environmental protection, quick response, small volume, high luminous efficiency and the like. When the LED is applied to the direct type backlight module, the LED needs to be matched with a secondary lens for use. The secondary lens may make the luminance and chromaticity distribution more uniform. At present, most of the commonly used LED products excite yellow phosphor powder by blue LED chips, so the main component colors of the generated white light are blue light and yellow light.
Traditional LED packaging structure includes LED chip, support, phosphor powder, silica gel and gold thread etc. and the center department of the bowl cup in the support is put into usually to the LED chip in the encapsulation, then packs encapsulating material such as silica gel and phosphor powder in the bowl cup and encapsulates. The packaging structure causes different amounts of fluorescent powder at the part close to the LED chip and the part far away from the LED chip, the fluorescent powder layer around the LED chip is thinner, and the fluorescent powder layer far away from the LED chip and close to the edge of the bracket is thicker. Therefore, the chromaticity of the LED chip is not spatially distributed uniformly in the light emitting state, and the upper side of the LED chip is bluish and the periphery of the chip is yellowish. When the LED packaging structure is matched with the lens, the luminous chromaticity of the LED packaging structure is uneven, so that the light spots generated by the lens can have the phenomena of yellow light spots or yellow apertures and the like, and the luminous effect of the direct type backlight module is seriously influenced.
Disclosure of Invention
One objective of the present invention is to provide an LED package structure with uniform chromaticity distribution of light emission.
In order to achieve the purpose, the invention adopts the following technical scheme:
the utility model provides a LED packaging structure, includes support and two at least LED chips, the support indent forms the bowl cup, the protruding barricade that is equipped with in bottom surface middle part of bowl cup, at least two the LED chip set up in the bowl cup, and relative barricade symmetric distribution, the bowl cup intussuseption is filled with the encapsulated layer.
The retaining wall is a hemisphere convexly arranged at the center of the bottom surface of the bowl cup, and the LED chips are uniformly distributed around the hemisphere.
Wherein, the retaining wall is a long strip-shaped bulge extending along the central axis of the bowl cup.
Wherein, the outer surface of the strip-shaped bulge is a circular arc surface.
The LED chip is triangular.
Wherein, the edge of the bottom surface of the bowl cup is convexly provided with an annular flange.
Wherein the height of the retaining wall protruding out of the bottom surface of the bowl is 1/4-1/2 of the depth of the bowl;
the height of the flange protruding out of the bottom surface is 1/4-1/2 of the height of the retaining wall.
Wherein, the surface of the flange is a circular arc surface.
Another objective of the present invention is to provide a backlight module, in which the LED package structure has uniform light emitting chromaticity, which is beneficial to improving the light emitting effect of the backlight module.
In order to achieve the purpose, the invention adopts the following technical scheme:
a backlight module comprises the LED packaging structure.
Another objective of the present invention is to provide a display device, in which the LED package structure has uniform luminance, which is beneficial to improve the light emitting effect of the backlight module and the display effect of the display device.
In order to achieve the purpose, the invention adopts the following technical scheme:
a display device comprises a display panel and further comprises the backlight module.
Has the advantages that: the invention provides an LED packaging structure, a backlight module and display equipment. Among this LED packaging structure, be provided with convex barricade at the bowl cup middle part of encapsulation LED chip, the light that the LED chip sent will be reflected to the lateral part of bowl cup under the effect of barricade to control LED packaging structure is by the light that the middle part jetted out, increases support light all around, thereby increases the excitation efficiency of light to support encapsulated layer all around, improves the homogeneity of LED packaging structure colourity, thereby improves backlight unit's luminous effect.
Drawings
Fig. 1 is a cross-sectional view of an LED package structure provided in embodiment 1 of the present invention;
fig. 2 is a propagation path diagram of light inside the LED package structure provided in embodiment 1 of the present invention;
fig. 3 is a schematic structural diagram of an LED package structure provided in embodiment 1 of the present invention;
FIG. 4 is a top view of FIG. 3;
fig. 5 is another schematic structural diagram of an LED package structure provided in embodiment 1 of the present invention;
FIG. 6 is a top view of FIG. 5;
FIG. 7 is a cross-sectional view of a stent provided in accordance with example 1 of the present invention;
fig. 8 is a schematic structural diagram of an LED package structure provided in embodiment 2 of the present invention;
fig. 9 is a top view of fig. 8.
Wherein:
1. a support; 11. a bowl cup; 12. retaining walls; 13. a flange; 2. an LED chip; 3. a packaging layer; 4. and (4) gold wires.
Detailed Description
In order to make the technical problems solved, the technical solutions adopted and the technical effects achieved by the present invention clearer, the technical solutions of the present invention are further described below by way of specific embodiments with reference to the accompanying drawings.
Example 1
The embodiment provides a display device which can be a television, a display, an advertising machine and the like. The display device comprises a display screen and a backlight module, wherein the backlight module supplies sufficient light sources with uniform brightness and distribution for the display panel, so that the display panel can normally display images.
In this embodiment, the backlight module is a direct type backlight module. The backlight module mainly comprises a back plate, a reflector plate, a light bar and an optical diaphragm, wherein the optical diaphragm comprises a diffusion plate. The diffusion plate is arranged above the back plate, and the reflector plate is arranged around the diffusion plate and is respectively connected with the diffusion plate and the back plate. The lamp strip can be arranged on the back plate in a double-sided adhesive tape, screw or buckle mode, and comprises a PCB (printed circuit board), an LED packaging structure and a lens buckled outside the LED packaging structure. Specifically, the PCB is long-strip-shaped, a plurality of LED packaging structures are arranged on the PCB along the length direction, each LED packaging structure is externally buckled with one lens, light emitted by the LED packaging structures is incident to the diffusion plate after being adjusted to the light-emitting angle in a proper range through the lenses, and an even illumination area is formed on the display panel after being diffused by the diffusion plate.
As shown in fig. 1, the LED package structure includes a support 1, an LED chip 2 and a package layer 3. The top surface of the support 1 is concave inwards to form a bowl 11, and the bowl 11 is used for accommodating the LED chip 2 and the packaging layer 3. Alternatively, the cross-sectional shape of the bowl 11 may be a polygon such as a rectangle, a triangle, etc., or may be a circle or an ellipse. The LED chip 2 may be bonded to the bottom surface of the bowl 11 by glue, wherein the glue may be die bond glue. The packaging layer 3 is composed of silica gel mixed with fluorescent powder, the packaging layer 3 is filled in the bowl 11, light emitted by the LED chip 2 excites the packaging layer 3 to generate white light, and the white light forms a uniform illumination area on the display panel after being acted by optical films such as a diffusion plate and the like.
Alternatively, the LED chip 2 may be a blue LED chip or an ultraviolet light chip. When the LED chip 2 is in a flip structure, the LED chip 2 may be electrically connected to the PCB board at the bottom of the support 1 through solder. When the LED chip 2 is of a normal mounting structure, the LED chip 2 may be connected to a circuit of the PCB board by gold wires 4. The fluorescent powder can be yellow fluorescent powder, red fluorescent powder, green fluorescent powder or quantum dot material, and can be excited by the light emitted by the LED chip 2 to emit light with different colors.
Alternatively, the stent 1 may be injection molded from polyphosphoric acid (PPA), polycyclohexylenedimethylene terephthalate resin, Epoxy Molding Compound (EMC) or smc (sheet Molding Compound) composite material, and the stent 1 may also be fired from ceramic material.
Due to the fact that the thicknesses of the packaging layers 3 right above the LED chip 2 and around the bowl 11 are different, the LED packaging structure is uneven in luminous chromaticity. In this embodiment, the LED chip 2 is a blue LED chip, and the phosphor is a yellow phosphor. Since the packaging layer 3 is thinner right above the LED chip 2, i.e. at a position close to the LED chip 2, the yellow light generated by the light exciting the yellow phosphor is less, and the blue light generated by the LED chip 2 is relatively more, so that the light at the position close to the LED chip 2 is blue. Conversely, the packaging layer 3 is thicker around the bowl 11, i.e. away from the LED chip 2, the yellow light generated by the yellow phosphor excited by the light is more, and the blue light transmitted out of the packaging layer 3 by the LED chip 2 is relatively less, which causes the light far away from the LED chip 2 to be yellow. After the LED packaging structure is matched with the lens, yellow spots or yellow light rings can be caused to appear on light spots generated by the lens, and the uniformity of light rays of the backlight module and the display effect of the display device are affected.
Through the analysis, in order to improve the uniformity of the chromaticity of the light emitted by the LED packaging structure, the retaining wall 12 is convexly arranged in the middle of the bottom surface of the bowl cup 11, the two LED chips 2 are arranged in the bowl cup 11, and the two LED chips 2 are symmetrically arranged relative to the retaining wall 12.
As shown in fig. 2, by arranging the retaining wall 12, the light emitted by the LED chip 2 is reflected by the side of the bowl 11 under the action of the retaining wall 12, so as to control the amount of light emitted from the middle of the LED package structure, increase the light around the support 1, reduce the blue light emitted from the middle, increase the excitation efficiency of the light on the package layer 3 around the support 1, improve the uniformity of the chromaticity of the LED package structure, and improve the light emitting effect of the backlight module.
As shown in fig. 3, the retaining wall 12 is an elongated protrusion extending along the central axis of the bowl 11, and the two LED chips 2 are symmetrically disposed on two sides of the elongated protrusion. In other embodiments, the number of the LED chips 2 may also be two or more, and the specific number may be adjusted according to actual needs.
Alternatively, the LED chip 2 may be rectangular, square, or triangular in shape. In order to conveniently adjust and control the amount of blue light emitted from the middle part of the LED packaging structure, the shape of the LED chip 2 is selected to be triangular in the embodiment, and the amount of blue light emitted from the middle part of the LED packaging structure can be effectively controlled by adjusting the angle and the direction of the triangular LED chip 2 in the bowl cup 11, so that the requirements of various LED products are met.
As shown in fig. 3 and 4, the triangular LED chip 2 may be disposed at a vertex angle toward the retaining wall 12, and at this time, the amount of blue light emitted from the middle of the LED package structure is relatively small; as shown in fig. 5 and fig. 6, the triangular LED chip 2 may have one side facing the retaining wall 12, and at this time, the amount of blue light emitted from the middle of the LED package structure is relatively large.
Alternatively, the retaining wall 12 and the bracket 1 may be integrally formed by injection molding or sintering, or may be a separate structure fixed to the bracket 1 by bonding or the like. In order to facilitate production and reduce cost, the retaining wall 12 is integrally formed with the bracket 1 in this embodiment.
As shown in fig. 7, the outer surface of the elongated protrusion may be a circular arc surface, which can enhance the effect of the retaining wall 12 to reflect light to the periphery of the support 1, thereby improving the uniformity of chromaticity of the LED package structure. In order to ensure that the light reflected by the strip-shaped bulge is vertically transmitted, the central angle of the circular arc surface is not more than 180 degrees. In other embodiments, the cross section of the elongated protrusion may have other shapes, such as a triangle, etc., as long as the light in the middle can be emitted to both sides of the bracket 1.
In order to avoid the phenomenon that the light reflection angle of the bottom of the side wall of the bowl cup 11 is too small, the edge of the bottom surface of the bowl cup 11 can be convexly provided with an annular flange 13, and the annular flange 13 can increase the reflection angle of the light at the bottom, so that the light is dispersed more uniformly, and the phenomenon of yellow light spots or yellow light rings is favorably eliminated. The outer surface of the annular flange 13 may also be a circular arc surface.
In this embodiment, the side wall of the bowl 11 can be inclined, so that the cross-sectional area of the bowl 11 is gradually increased from bottom to top, which is beneficial to enlarging the light-emitting angle of the LED package structure. In addition, the side wall of the obliquely arranged bowl cup 11 is matched with the retaining wall 12 and the flange 13, so that the excitation efficiency of light rays on fluorescent powder around the bowl cup 11 can be further improved, and the improvement of the uniformity of chromaticity is facilitated.
To ensure that the encapsulating layer 3 above the retaining wall 12 can be activated to a certain extent, the height of the retaining wall 12 can be 1/4-1/2 of the depth of the bowl 11, and in this embodiment, the height of the retaining wall 12 can be 1/3 of the depth of the bowl 11. Similarly, to ensure that the encapsulation layer 3 at the edge of the bowl 11 can also be activated to some extent, the height of the flange 13 may be 1/4-1/2 of the height of the retaining wall 12, and in this embodiment, the height of the flange 13 may be 1/3 of the height of the retaining wall 12.
In this embodiment, the bracket 1 may be a rectangular parallelepiped, and the bowl 11 has a circular cross-sectional shape. Wherein the length and width of the stent 1 may be 3.0mm by 3.0mm, 3.5mm by 2.8mm, 3.5mm by 3.5mm or 3.2mm by 2.8 mm. Correspondingly, the diameter of the rim of the bowl 11 may be 1.8mm, 2.1mm, 2.5mm, 2.6 mm.
Example 2
This embodiment provides a display apparatus having substantially the same structure as that in embodiment 1, except for the structure of the retaining wall 12 in embodiment 1.
As shown in fig. 8 and 9, in the embodiment, the retaining wall 12 is a hemisphere protruding from the center of the bottom surface of the bowl 11, and the at least two LED chips 2 are uniformly distributed around the hemisphere, which is beneficial to improving the uniformity of light, so as to better improve the uniformity of chromaticity.
In this embodiment, the number of the LED chips 2 is four, and the vertex angles of the four LED chips 2 are all set toward the center of the bowl 11. In other embodiments, the number, orientation and angle of the LED chips 2 can be adjusted according to actual needs.
The above description is only a preferred embodiment of the present invention, and for those skilled in the art, the present invention should not be limited by the description of the present invention, which should be interpreted as a limitation.
Claims (7)
1. The LED packaging structure is characterized by comprising a support (1) and at least two LED chips (2), wherein the support (1) is recessed inwards to form a bowl (11), a retaining wall (12) is convexly arranged in the middle of the bottom surface of the bowl (11), the at least two LED chips (2) are arranged in the bowl (11) and symmetrically distributed relative to the retaining wall (12), and a packaging layer (3) is filled in the bowl (11);
the LED chip (2) is triangular;
the height of the retaining wall (12) protruding out of the bottom surface of the bowl (11) is 1/4-1/2 of the depth of the bowl (11);
the edge of the bottom surface of the bowl cup (11) is convexly provided with an annular flange (13);
the height of the flange (13) protruding out of the bottom surface is 1/4-1/2 of the height of the retaining wall (12).
2. The LED packaging structure according to claim 1, wherein the retaining wall (12) is a hemisphere protruding from the center of the bottom surface of the bowl (11), and at least two LED chips (2) are uniformly distributed around the hemisphere.
3. The LED package structure according to claim 1, wherein the retaining wall (12) is an elongated protrusion extending along a central axis of the bowl (11).
4. The LED package structure of claim 3, wherein the outer surface of the elongated protrusion is a circular arc.
5. The LED package structure according to claim 1, wherein the surface of the flange (13) is a circular arc surface.
6. A backlight module comprising the LED package structure of any one of claims 1-5.
7. A display device comprising a display panel, further comprising the backlight module of claim 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810642350.6A CN108878622B (en) | 2018-06-21 | 2018-06-21 | LED packaging structure, backlight module and display device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810642350.6A CN108878622B (en) | 2018-06-21 | 2018-06-21 | LED packaging structure, backlight module and display device |
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| CN108878622A CN108878622A (en) | 2018-11-23 |
| CN108878622B true CN108878622B (en) | 2020-03-17 |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111244075A (en) * | 2018-11-28 | 2020-06-05 | 深圳Tcl新技术有限公司 | LED array and LED display screen |
| CN109459811B (en) * | 2018-12-14 | 2021-04-30 | 深圳创维－Rgb电子有限公司 | Reflector plate, backlight module and display device |
| CN110568666A (en) * | 2019-09-12 | 2019-12-13 | 青岛海信电器股份有限公司 | Display device and backlight module |
| CN114334930B (en) * | 2021-12-30 | 2022-09-27 | 惠州市艾斯谱光电有限公司 | Lighting lamp and lamp panel thereof |
| CN114370890A (en) * | 2021-12-31 | 2022-04-19 | 佛山市国星光电股份有限公司 | Sensing device and manufacturing method thereof |
| CN114442371B (en) * | 2022-01-18 | 2023-06-02 | 武汉华星光电技术有限公司 | Display backboard and display device |
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| CN101794851A (en) * | 2010-02-24 | 2010-08-04 | 中国科学院半导体研究所 | Symmetrical electrodes for triangular GaN-based light-emitting diode (LED) chip |
| CN201796887U (en) * | 2010-05-25 | 2011-04-13 | 深圳市聚飞光电股份有限公司 | Backlight LED |
| CN105098033A (en) * | 2015-07-21 | 2015-11-25 | 创维液晶器件(深圳)有限公司 | Bracket capable of improving chroma uniformity, a light-emitting diode (LED) and manufacturing method |
| CN106549088A (en) * | 2015-09-17 | 2017-03-29 | 光宝光电(常州)有限公司 | Light emitting display device |
| CN207250554U (en) * | 2017-08-17 | 2018-04-17 | 苏州汉瑞森光电科技股份有限公司 | A kind of LED encapsulation structure of specular removal |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101103674B1 (en) * | 2010-06-01 | 2012-01-11 | 엘지이노텍 주식회사 | Light emitting device |
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2018
- 2018-06-21 CN CN201810642350.6A patent/CN108878622B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101794851A (en) * | 2010-02-24 | 2010-08-04 | 中国科学院半导体研究所 | Symmetrical electrodes for triangular GaN-based light-emitting diode (LED) chip |
| CN201796887U (en) * | 2010-05-25 | 2011-04-13 | 深圳市聚飞光电股份有限公司 | Backlight LED |
| CN105098033A (en) * | 2015-07-21 | 2015-11-25 | 创维液晶器件(深圳)有限公司 | Bracket capable of improving chroma uniformity, a light-emitting diode (LED) and manufacturing method |
| CN106549088A (en) * | 2015-09-17 | 2017-03-29 | 光宝光电(常州)有限公司 | Light emitting display device |
| CN207250554U (en) * | 2017-08-17 | 2018-04-17 | 苏州汉瑞森光电科技股份有限公司 | A kind of LED encapsulation structure of specular removal |
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| CN108878622A (en) | 2018-11-23 |
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