CN110265387A - A kind of LED encapsulation structure, backlight module and display equipment - Google Patents
A kind of LED encapsulation structure, backlight module and display equipment Download PDFInfo
- Publication number
- CN110265387A CN110265387A CN201910527349.3A CN201910527349A CN110265387A CN 110265387 A CN110265387 A CN 110265387A CN 201910527349 A CN201910527349 A CN 201910527349A CN 110265387 A CN110265387 A CN 110265387A
- Authority
- CN
- China
- Prior art keywords
- chip
- light
- encapsulation structure
- led encapsulation
- lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133605—Direct backlight including specially adapted reflectors
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133609—Direct backlight including means for improving the color mixing, e.g. white
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
- H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Computer Hardware Design (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
- Planar Illumination Modules (AREA)
Abstract
The invention discloses a kind of LED encapsulation structure, backlight module and display equipment, are related to showing equipment technical field.The LED encapsulation structure includes bracket, chipset and reflecting layer, and encapsulation slot is provided on the bracket；The chipset is set in the encapsulation slot, and the chipset includes the first chip positioned at the encapsulation groove center, and first chip is provided with the second chip and third chip；The reflecting layer is set to the top of first chip.In the LED encapsulation structure, there are three types of chips for setting, wherein the first chip can be sending blue light, wherein the second chip and third chip can issue feux rouges and green light respectively, second chip and third chip distribution are in the periphery of the first chip, the blue light that first chip issues is spread around under the action of reflecting layer, and is mixed to form white light with feux rouges and green light, is conducive to the uniformity for improving three coloured light mixing, colour cast problem is avoided, display effect is improved.
Description
Technical field
The present invention relates to display equipment technical fields more particularly to a kind of LED encapsulation structure, backlight module and display to set
It is standby.
Background technique
Currently, LCD TV has become mainstream in plane display field, wherein including the LCD TV institute of LED backlight
The specific gravity accounted for is increasing.LED backlight has many advantages, such as, for example, without noxious material mercury, it is environmentally protective, with splendid
Colour gamut shows, has good mechanical shock stability etc..With the improvement of living standards, people increasingly focus on television colors side
The performance in face, color return the main task for becoming display, and therefore, wide colour gamut TV enters the sight of people.
Currently, the LCD technology of 100% NTSC color gamut covering, which may be implemented, quantum dot scheme, tri- color core of RGB
Piece LED scheme and the color film of KSF fluorescent powder collocation thicken the scheme of panel, and wherein technology of quantum dots is limited by the stability of material
And yield, product reliability is also poor while leading to high costs；KSF phosphor technologies can only arrange in pairs or groups an other color film surface
Panel products are just able to achieve the display effect of 100% NTSC, have significant limitation.In those early years since red green chip production is good
Rate is low, and luminous efficiency is low, and tri- color chip technology of RGB is caused never to be widely used in backlight module, and due to close
The skill upgrading of several years red green chips and the sharp fall of cost, the technology of tri- color chip LED of RGB are applied to again
In backlight module.
As depicted in figs. 1 and 2, it is provided with encapsulation 11 ' of slot on 1 ' of bracket, encapsulates and is provided with three color chips, 2 ' in 11 ' of slot, three
2 ' of chips is welded with 3 ' of electrode connecting region, to be connected with the circuit inside 1 ' of bracket.In order to meet LED issue white light and
Luminous brightness requirement, tri- chip of RGB of encapsulation it is of different sizes.Since the rim of a cup diameter of 1 ' of package support is 2.6mm, bottom
Diameter is 2.1mm, causes three chips, 2 ' to must satisfy certain dimension scale when encapsulating in 11 ' of slot, while also needing to protect
It is big as far as possible to demonstrate,prove size, to meet the brightness demand of LED.But the tri- color chip LED of RGB being currently applied in backlight module can be deposited
Inclined on one side partially red while when luminous cyan the phenomenon that, especially after increasing secondary lens, hot spot still will appear partially red on one side
On one side the phenomenon that inclined cyan, the display effect of backlight module has been seriously affected.
Summary of the invention
An object of the present invention is to provide a kind of LED encapsulation structures, can issue uniform white light, to eliminate colour cast
Problem.
To achieve this purpose, the present invention adopts the following technical scheme:
A kind of LED encapsulation structure, comprising:
Bracket is provided with encapsulation slot on the bracket；
Chipset, the chipset are set in the encapsulation slot, and the chipset includes being located at the encapsulation groove center
The first chip, around first chip setting the second chip and third chip；And
Reflecting layer, the reflecting layer are set to the top of first chip.
Wherein, the third chip and second chip are provided at least two, and the third chip and described
Second chip is staggered.
Wherein, there are three conductive path, first chip, second chip and the thirds for setting in the bracket
Chip is connected with the corresponding conductive path respectively.
Wherein, the LED encapsulation structure further include:
Lens, the lens are buckled on the bracket；And
Diffusion layer, the diffusion layer is between the lens and the bracket.
Wherein, the bottom setting of the lens is fluted, and the diffusion layer is located in the groove.
Wherein, the central axis of the diffusion layer, the lens incidence surface central axis and the lens light-emitting surface
Center overlapping of axles.
Wherein, the shadow surface that the light that the diffusion layer is completely covered that the chipset issues is formed on the lens.
Wherein, the diffusion layer with a thickness of 0.5-1mm.
It is another object of the present invention to propose a kind of backlight module, to eliminate colour cast problem.
To achieve this purpose, the present invention adopts the following technical scheme:
A kind of backlight module, including above-mentioned LED encapsulation structure.
Another object of the present invention is to propose a kind of display equipment, can eliminate colour cast problem, improve display effect.
To achieve this purpose, the present invention adopts the following technical scheme:
A kind of display equipment, including above-mentioned backlight module.
Beneficial effects of the present invention:
The present invention provides a kind of LED encapsulation structure, backlight module and display equipment.In the LED encapsulation structure, it is provided with
Three kinds of chips, there are three types of chips for setting, wherein the first chip can be sending blue light, center, the second chip and third chip
Feux rouges and green light can be issued respectively, what the second chip and third chip distribution were issued in the periphery of the first chip, the first chip
Blue light is spread around under the action of reflecting layer, and is mixed to form white light with feux rouges and green light, and it is mixed to be conducive to raising three coloured light
The uniformity of conjunction avoids colour cast problem, improves display effect.
Detailed description of the invention
Fig. 1 is the top view of LED encapsulation structure in the prior art；
Fig. 2 is the cross-sectional view of LED encapsulation structure in the prior art；
Fig. 3 is the top view of LED encapsulation structure provided by the invention；
Fig. 4 is the structural schematic diagram of LED encapsulation structure provided by the invention；
Fig. 5 is the cross-sectional view of LED encapsulation structure provided by the invention；
Fig. 6 is the structural schematic diagram of refraction type lens provided by the invention；
Fig. 7 is the cross-sectional view after refraction type lens provided by the invention and diffusion layer assembly；
Fig. 8 is the structural schematic diagram of reflective lens provided by the invention；
Fig. 9 is the cross-sectional view after reflective lens provided by the invention and diffusion layer assembly；
Figure 10 is the schematic diagram that light is propagated in LED encapsulation structure provided by the invention.
Wherein:
1 ', bracket；11 ', encapsulation slot；2 ', chip；3 ', electrode connecting region；
1, bracket；11, slot is encapsulated；21, the first chip；22, the second chip；23, third chip；31, it first is conductively connected
Area；32, second it is conductively connected area；33, third is conductively connected area；4, reflecting layer；5, lens；51, incidence surface；52, light-emitting surface；6,
Diffusion layer；7, substrate.
Specific embodiment
The embodiment of the present invention is described below in detail, the example of embodiment is shown in the accompanying drawings, wherein identical from beginning to end
Or similar label indicates same or similar element or element with the same or similar functions.It is retouched below with reference to attached drawing
The embodiment stated is exemplary, it is intended to is used to explain the present invention, and is not considered as limiting the invention.
In the description of the present invention, it should be noted that term " center ", "upper", "lower", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" be based on the orientation or positional relationship shown in the drawings, merely to
Convenient for description the present invention and simplify description, rather than the device or element of indication or suggestion meaning must have a particular orientation,
It is constructed and operated in a specific orientation, therefore is not considered as limiting the invention.In addition, term " first ", " second " are only
For descriptive purposes, it is not understood to indicate or imply relative importance.Wherein, term " first position " and " second position "
For two different positions.
Unless otherwise clearly defined and limited, term " installation ", " connected ", " connection ", " fixation " shall be understood in a broad sense,
For example, it may be being fixedly connected, may be a detachable connection；It can be mechanical connection, be also possible to be electrically connected；It can be straight
It connects connected, the connection inside two elements or the phase interaction of two elements can also be can be indirectly connected through an intermediary
With relationship.For the ordinary skill in the art, it can understand above-mentioned term in the present invention as the case may be
Concrete meaning.
Unless otherwise clearly defined and limited, fisrt feature second feature "upper" or "lower" may include first
Feature and second feature directly contact, also may include fisrt feature and second feature be not direct contact but by them it
Between other characterisation contact.Moreover, fisrt feature includes that fisrt feature exists above the second feature " above ", " above " and " above "
Right above second feature and oblique upper, or first feature horizontal height is merely representative of higher than second feature.Fisrt feature is second
Feature " under ", " lower section " and " following " include that fisrt feature is directly below and diagonally below the second feature, or is merely representative of first
Characteristic level height is less than second feature.
To further illustrate the technical scheme of the present invention below with reference to the accompanying drawings and specific embodiments.
A kind of display equipment is present embodiments provided, which can have for television set, display, advertisement machine etc.
The equipment of image display function.Show that equipment includes display panel and backlight module.Backlight module provides uniformly for display panel
Area source, for display need.
Backlight module includes backboard, light source and optical module.Support construction of the backboard as backlight module, for fixing light
Source and optical module.The light that light source issues is formed, area source on a display panel after optical module.
In the present embodiment, light source can be LED encapsulation structure.As shown in figure 3, LED encapsulation structure includes bracket 1, chip
And encapsulated layer (not shown).It is provided with encapsulation slot 11 on bracket 1, the side of built-in metal piece can be passed through inside bracket 1
Formula forms conductive path, and sheet metal partially protrudes into encapsulation, forms the conductive connection area being electrically connected with chip, chip and conduction
Bonding pad contact, so that chip to be connected to conductive path.The top of chip is arranged in encapsulated layer, for sealing and protecting core
Piece, so that chip to be fixed in encapsulation slot 11.
Because of the job requirement of backlight module, inner light source needs to issue white light, places in encapsulation slot 11 in the prior art
Three chips are mixed to form white light by the three coloured light that three chips issue.Due to the requirement of light-source brightness, the ruler of three chips
The very little ratio for needing to have certain, so that the three coloured light of different brightness is mixed to form the white light for meeting and needing.This structure causes
There are colour cast problems for LED encapsulation structure, even if matching secondary lens light mixing, also still remain more serious colour cast problem,
Seriously affect the display effect of backlight module.
To solve the above problems, as shown in Figure 3-Figure 5, LED encapsulation structure includes the chipset with multiple chips, chip
Group includes the first chip 21 positioned at encapsulation slot 11, and surround the second chip 22 and third chip of the first chip 21 setting
23, the top of the first chip 21 is provided with reflecting layer 4.Optionally, the first chip 21 can be the chip of sending blue ray, the
Two chips 22 and third chip 23 can be the chip of sending red light and green light.When LED encapsulation structure works, first
The blue light that chip 21 issues is spread around under the action of reflecting layer 4, and the feux rouges and third core issued with the second chip 22
The green light that piece 23 issues is mixed to form white light, is conducive to the uniformity for improving three coloured light mixing, monochromatic light is avoided directly to project, from
And colour cast problem is solved, improve display effect.
Optionally, the first chip 21 can be blue LED die, and the second chip 22 can be red LED chip, third core
Piece 23 can be green LED chip.First chip 21, the second chip 22 and third chip 23 may be that other can issue indigo plant
The structure of coloured light, red light and green light.
It can be formal dress, upside-down mounting or vertical structure with selection of land, the first chip 21, the second chip 22 and third chip 23
The bottom of light emitting diode, light emitting diode is fixed in encapsulation slot 11 by crystal-bonding adhesive or scolding tin.
To make the uniform white light of the emergent light of LED encapsulation structure everywhere, the second chip 22 and third chip 23 can be with
Setting two or more, third chip 23 and the second chip 22 are staggered in the periphery of the first chip 21, so that the first chip 21
All directions are distributed by the light of three kinds of colors, so that three coloured light preferably mixes.
In the present embodiment, the second chip 22 and third chip 23 are provided with two.By by the second chip 22 and third
The respectively setting two of chip 23 can increase the second chip 22 and third chip in the case where encapsulation 11 size of slot is certain as far as possible
23 size, so that LED encapsulation structure has enough brightness.
Optionally, reflecting layer 4 can be covered on the top surface of the first chip 21, can the white films made of silica
Layer is conducive to the reflectivity for improving reflecting layer 4.
Optionally, the first chip 21, the second chip 22 and third chip 23 all can be the luminous rectangular parallelepiped structures in five faces.
Reflecting layer 4 is arranged in the top of first chip 21, and the light that 21 top surface of the first chip is issued is reflexed to by reflecting layer 4
The surrounding of first chip 21, to be mixed with the red light of 21 surrounding of the first chip and green light.Remaining four sides of first chip 21
The light of sending is directly mixed with red light and green light.By the way that the first chip 21, the second chip 22 and third chip 23 are set
Tool is set to there are five the rectangular parallelepiped structure of light-emitting surface, is conducive to the light luminance for improving LED encapsulation structure.
Optionally, 90% of the top surface of sealant not higher than encapsulation 11 depth of slot, can be in the packaging effect for guaranteeing chip
On the basis of, the outgoing of light is not influenced.
In the prior art, by controlling the dimension scale of three color chips, to obtain better light mixing effect.But the ruler of chip
Very little ratio is limited by space in brightness demand and encapsulation slot 11, can not guarantee light mixing effect on the basis of guaranteeing brightness.
To solve the above problems, there are three conductive path, the first chips 21, the second core for setting in bracket 1 in the present embodiment
Piece 22 and third chip 23 are connected with corresponding conductive path respectively, so that the first chip 21, the second chip 22 and third chip
23 independently control, and will pass through the operating current of the first chip 21 of control, the second chip 22 and third chip 23, control is blue
The intensity of coloured light, red light and green light, to reach ideal light mixing effect.Compared to the prior art, pass through the ruler of chip
Very little ratio obtains the light luminance of varying strength, and blue light, red can be adjusted by adjusting the electric current of three kinds of chips in the present embodiment
The ratio of coloured light and green light realizes mixed white light, and the size of chip is unrestricted, and adjustment is more convenient, flexible.
Specifically, can be pre-buried there are three independent sheet metal in bracket 1 referring to Fig. 3, bracket is stretched out in one end of sheet metal
Conductive pin outside 1, as LED encapsulation structure.Each sheet metal is respectively connected with the exposed conductive connection in encapsulation 11 bottom surface of slot
Area, the conductive connection area can be sheet metal itself, or other conductive structures being electrically connected with sheet metal.Three conductions
Bonding pad is respectively first to be conductively connected area 31 by the way that gold thread or scolding tin are connect with the first chip 21, connect with the second chip 22
Second conductive connection area 32 and connect with third chip 23 third conductive connection area 33.
Optionally, sheet metal can be made of copper, aluminium or silver, and the surface of sheet metal can silver coated or nickel layer.Bracket 1
It can be by Electro Magnetic Compatibility (Electro Magnetic Compatibility, EMC), sheet molding compound (Sheet
Molding Compound, SMC), polyphosphoric acids (Polyphosphoric Acid, PPA), poly terephthalic acid Isosorbide-5-Nitrae-hexamethylene
There is the white such as alkane diformazan alcohol ester (PCT) material of high reflectance or ceramics to be made, and is conducive to light and projects outside bracket 1.
More the second chips 22 and more third chips 23 are connected with corresponding conductive connection area for convenience, and second is conductive
It includes the segmental arc with the first chip 21 for the center of circle that bonding pad 32 and third, which are conductively connected area 33, is distributed in outside the first chip 21
Second chip 22 and third chip 23 in week are at least partially disposed in corresponding conductive connection area, to facilitate electrical connection.
LED encapsulation structure further includes lens 5, and lens 5 are located on bracket 1, and the light that chip issues is penetrated by lens 5
Out, be conducive to improve the mixed effect of light and the uniformity of diffusion.
Optionally, lens 5 can be Fig. 6 and refraction type lens 5 shown in Fig. 7, or Fig. 8 and shown in Fig. 9 anti-
Penetrate formula lens 5.After light is emitted by refraction type lens 5 or reflective lens 5, the hot spot of round or ellipse, hot spot are formed
With certain diffusion angle, uniform area source can be formed by multiple hot spots.
The bottom of lens 5 is provided with interior recessed area, and the inner wall of interior recessed area forms incidence surface 51, and the top surface of lens 5 forms out light
Face 52, light are entered in lens 5 by incidence surface 51, are projected by the refraction or reflection of lens 5 by light-emitting surface 52, to form brightness
Uniform hot spot.
Optionally, lens 5 can be by optical grade organic glass (Polymethyl Methacrylate, PMMA), poly- carbonic acid
Ester (Polycarbonate, PC), polystyrene (Polystyrene, PS) or glass are made.
To further increase to light diffusion effect, diffusion layer 6 is provided between lens 5 and bracket 1, light is by diffusion
Layer 6 further after mixing, diffusion, enters back into and carries out secondary diffusion in lens 5, is conducive to the uniformity and three coloured light that improve light
The mixed effect of line.
Optionally, diffusion layer 6 can be the transparent optical grade organic glass doped with organic or inorganic diffusion particle
(Polymethyl Methacrylate, PMMA), polycarbonate (Polycarbonate, PC), polystyrene
(Polystyrene, PS) or glass are made.Diffusion layer 6 can be, but not limited to as circle, as long as the light that chip issues can lead to
After crossing the diffusion of diffusion layer 6, lens 5 are entered back into.
For the position precision for improving the hot spot that the light of chip outgoing is formed by lens 5, the central axis of incidence surface 51 goes out
The central axis of smooth surface 52 and the center overlapping of axles of diffusion layer 6.
To guarantee that all light can block completely the incidence surface 51 of lens 5, and diffusion layer by diffusion layer 6, diffusion layer 6
The shadow surface that 6 light that chipset sending is completely covered are formed on lens 5, avoids omitting light.
Optionally, the thickness of diffusion layer 6 can be 0.5-1mm, can guarantee the diffusion effect to light within the scope of this,
The loss that can reduce light is conducive to the brightness for improving LED encapsulation structure.
Optionally, the bottom of lens 5 is also provided with groove, and diffusion layer 6 is contained in groove, is conducive to improve diffusion
The fixed effect of layer 6, reduces the size of LED encapsulation structure, structure is more compact.
Optionally, diffusion layer 6 can by injection molding or extrusion moulding, it is easy to process, it is at low cost.
As shown in Figure 10, LED encapsulation structure further includes substrate 7, one or more brackets 1 can be set on substrate 7, often
Chipset and lens 5 are provided on a bracket 1.When LED encapsulation structure works, blue light (Figure 10 of the first chip 21 generation
Shown dotted line) it is spread to its surrounding, and mixed with the red light and green light of the second chip of surrounding 22 and the sending of third chip 23,
Mixed light after diffusion layer 6, into lens 5 in secondary diffusion, form the hot spot of uniform luminance.
In other embodiments, the first chip 21, the second chip 22 and third chip 23 can also be taken using other colors
Match, to obtain the light mixing effect of needs.
The above is only a preferred embodiment of the present invention, for those of ordinary skill in the art, according to the present invention
Thought, there will be changes in the specific implementation manner and application range, and the content of the present specification should not be construed as to the present invention
Limitation.
Claims (10)
1. a kind of LED encapsulation structure characterized by comprising
Bracket (1) is provided with encapsulation slot (11) on the bracket (1)；
Chipset, the chipset are set in the encapsulation slot (11), and the chipset includes being located at the encapsulation slot (11)
First chip (21) at center, the second chip (22) and third chip (23) being arranged around first chip (21)；And
Reflecting layer (4), the reflecting layer (4) are set to the top of first chip (21).
2. LED encapsulation structure as described in claim 1, which is characterized in that the third chip (23) and second chip
(22) at least two are provided with, and the third chip (23) and second chip (22) are staggered.
3. LED encapsulation structure as described in claim 1, which is characterized in that there are three conductive logical for setting in the bracket (1)
Road, first chip (21), second chip (22) and the third chip (23) are logical with the corresponding conduction respectively
Road connection.
4. LED encapsulation structure as claimed in any one of claims 1-3, which is characterized in that the LED encapsulation structure is also wrapped
It includes:
Lens (5), the lens (5) are buckled on the bracket (1)；And
Diffusion layer (6), the diffusion layer (6) is between the lens (5) and the bracket (1).
5. LED encapsulation structure as claimed in claim 4, which is characterized in that fluted, institute is arranged in the bottom of the lens (5)
Diffusion layer (6) are stated to be located in the groove.
6. LED encapsulation structure as claimed in claim 4, which is characterized in that central axis, the lens of the diffusion layer (6)
(5) the center overlapping of axles of the light-emitting surface (52) of the central axis and lens (5) of incidence surface (51).
7. LED encapsulation structure as claimed in claim 4, which is characterized in that the chipset is completely covered in the diffusion layer (6)
The shadow surface that the light of sending is formed on the lens (5).
8. LED encapsulation structure as claimed in claim 4, which is characterized in that the diffusion layer (6) with a thickness of 0.5-1mm.
9. a kind of backlight module, which is characterized in that including LED encapsulation structure such as of any of claims 1-8.
10. a kind of display equipment, which is characterized in that including backlight module as claimed in claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910527349.3A CN110265387B (en) | 2019-06-18 | 2019-06-18 | LED packaging structure, backlight module and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910527349.3A CN110265387B (en) | 2019-06-18 | 2019-06-18 | LED packaging structure, backlight module and display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110265387A true CN110265387A (en) | 2019-09-20 |
| CN110265387B CN110265387B (en) | 2021-05-07 |
Family
ID=67919067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910527349.3A Active CN110265387B (en) | 2019-06-18 | 2019-06-18 | LED packaging structure, backlight module and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110265387B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115930173A (en) * | 2023-01-10 | 2023-04-07 | 硅能光电半导体(广州)有限公司 | Petal-shaped LED lamp bead and control method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1558284A (en) * | 2004-02-02 | 2004-12-29 | 友达光电股份有限公司 | Backlight assembly |
| JP2007207834A (en) * | 2006-01-31 | 2007-08-16 | Sanyo Electric Co Ltd | Light-emitting diode light source |
| CN206022420U (en) * | 2016-09-30 | 2017-03-15 | 深圳创维－Rgb电子有限公司 | A kind of packaging of flip LED chips and down straight aphototropism mode set |
| CN107219679A (en) * | 2017-05-22 | 2017-09-29 | 深圳市英唐光显技术有限公司 | Backlight module of LED liquid crystal display |
| CN109828410A (en) * | 2018-08-03 | 2019-05-31 | 海迪科（南通）光电科技有限公司 | A kind of display of novel LED backlight mould group |
-
2019
- 2019-06-18 CN CN201910527349.3A patent/CN110265387B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1558284A (en) * | 2004-02-02 | 2004-12-29 | 友达光电股份有限公司 | Backlight assembly |
| JP2007207834A (en) * | 2006-01-31 | 2007-08-16 | Sanyo Electric Co Ltd | Light-emitting diode light source |
| CN206022420U (en) * | 2016-09-30 | 2017-03-15 | 深圳创维－Rgb电子有限公司 | A kind of packaging of flip LED chips and down straight aphototropism mode set |
| CN107219679A (en) * | 2017-05-22 | 2017-09-29 | 深圳市英唐光显技术有限公司 | Backlight module of LED liquid crystal display |
| CN109828410A (en) * | 2018-08-03 | 2019-05-31 | 海迪科（南通）光电科技有限公司 | A kind of display of novel LED backlight mould group |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115930173A (en) * | 2023-01-10 | 2023-04-07 | 硅能光电半导体(广州)有限公司 | Petal-shaped LED lamp bead and control method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110265387B (en) | 2021-05-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8610255B2 (en) | Light emitting device package | |
| CN108878622B (en) | LED packaging structure, backlight module and display device | |
| CN105633255A (en) | Aspherical lens | |
| CN101546063A (en) | Ultra thin type LCD use backlight module taking LED as light source | |
| CN112599514A (en) | High-quality full-color semiconductor light source | |
| JP2009038302A (en) | Illuminator, and liquid crystal display device provided with the illuminator | |
| CN101071232A (en) | Planar lightsource device and its mkaing method, and liquid crystal display device with same | |
| EP2445020B1 (en) | Light emitting diode package structure | |
| CN110265387A (en) | A kind of LED encapsulation structure, backlight module and display equipment | |
| EP4016649A1 (en) | Light-emitting device and manufacturing method, and display screen and lighting equipment comprising said light-emitting device | |
| US20120074456A1 (en) | Light emitting device package | |
| WO2016078015A1 (en) | Led light-emitting unit | |
| CN211957678U (en) | LED lamp bead, LED module and LED display screen | |
| WO2013122330A1 (en) | Lighting device | |
| CN101684924B (en) | LED lighting module and preparation method | |
| JP2008258042A (en) | Illumination device and display device using this illumination device | |
| KR100765712B1 (en) | Light emitting device package and method of manufacturing the same | |
| KR20110061421A (en) | Light emitting diode package and liquid crystal display device having thereof | |
| CN209993620U (en) | LED light source module | |
| CN216434594U (en) | LED lamp bead and side-in type backlight module | |
| CN218602468U (en) | TOP type LED packaging structure and LED module | |
| CN215418170U (en) | Flip-chip LED lamp pearl, LED module and LED display screen | |
| CN220189645U (en) | LED packaging structure and LED display screen | |
| CN204717396U (en) | LED luminescence unit | |
| CN219873574U (en) | LED lamp bead, display module assembly and display screen |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |