CN218602468U

CN218602468U - TOP type LED packaging structure and LED module

Info

Publication number: CN218602468U
Application number: CN202222838076.4U
Authority: CN
Inventors: 谢杏星; 汪仁凯; 林远彬
Original assignee: Hubei Xinying Photoelectric Co ltd
Current assignee: Hubei Xinying Photoelectric Co ltd
Priority date: 2022-10-26
Filing date: 2022-10-26
Publication date: 2023-03-10
Anticipated expiration: 2032-10-26

Abstract

The application relates to a TOP type LED packaging structure and an LED module, which comprise a packaging support, an LED chip, a first glue layer and a packaging glue layer, wherein a bowl-shaped groove is formed in the packaging support; the LED chip is arranged at the bottom of the groove; the first adhesive layer covers the bottom of the groove and is positioned outside the LED chip, and the first adhesive layer is made of cured black colloid or gray colloid; the packaging adhesive layer is arranged in the groove and covers the first adhesive layer and the LED chip. First glue film covers in the bottom of recess, owing to adopt be black colloid or grey colloid, can reduce the background blackness under the black picture for the lamp pearl is darker, thereby has improved the contrast, makes the lamp pearl show the uniformity better, compares in adopting bigger chip to promote lamp pearl luminance, in order to improve the contrast, and this application utilizes first glue film to improve the contrast, and the cost is lower.

Description

TOP type LED packaging structure and LED module

Technical Field

The application relates to the technical field of LEDs, in particular to a TOP type LED packaging structure and an LED module.

Background

The LED display screen has the following advantages: high gray scale, wide viewing angle, rich color, and customizable screen shape. Therefore, the LED display screen is widely used in various fields such as industry, traffic, commercial advertisement, information distribution, sports events, and the like. The display requirements of the existing LED display screen are gradually improved along with the development of applications, and in order to meet the requirements of HDR on a display, so that the screen display brightness can reach a highlight standard for a long time and the black screen can reach the minimum brightness, the display brightness and the contrast of an LED need to be improved.

The brightness of the LED electronic display screen refers to the luminous intensity of the display screen in unit area when the display screen works normally, and the unit is cd/m ² (i.e., how much of the cd luminescence intensity is per square meter of area, "cd" in candela). The contrast of a display is actually the ratio of the brightness, defined as: in a dark room, the luminance in a white picture (brightest) is divided by the luminance in a black picture (darkest). The higher the brightness of the LED electronic display screen is, the better the brightness of the image is, and the clearer the image looks at a distance.

In the prior art, in order to improve the brightness of the lamp bead and improve the contrast, a larger chip is generally selected or the wavelength of the chip is changed to improve the display brightness of a screen; or increase the electric current through the lamp pearl to this luminous intensity who promotes the chip nevertheless uses bigger chip can lead to manufacturing cost's improvement, and the increase can lead to bigger consumption and make the lamp pearl produce more heats through the electric current of chip, and the influence heat dissipation leads to lamp pearl life to shorten.

Disclosure of Invention

The embodiment of the application provides a TOP type LED packaging structure and LED module to select bigger chip to promote lamp pearl luminance among the solution correlation technique, though can improve the contrast, nevertheless can improve manufacturing cost's problem also.

In a first aspect, a TOP type LED package structure is provided, which includes:

the packaging support is provided with a bowl-shaped groove;

the LED chip is arranged at the bottom of the groove;

the first adhesive layer covers the bottom of the groove and is positioned on the outer side of the LED chip, and the first adhesive layer is made of cured black colloid or gray colloid;

and the packaging adhesive layer is arranged in the groove and covers the first adhesive layer and the LED chip.

In some embodiments, the packaging adhesive layer is a transparent colloid or a milky colloid after being cured.

In some embodiments, a protrusion portion is formed on the surface of the encapsulation adhesive layer, and the height of the surface of the protrusion portion gradually decreases from the center to the periphery.

In some embodiments, the cross-sectional shape of the surface of the convex portion is one of a section of arc line, a curve formed by splicing a plurality of sections of arc lines, and a curve formed by splicing a straight line and an arc line.

In some embodiments, the groove side wall is formed with a step such that the groove includes a first groove and a second groove arranged from bottom to top;

the packaging adhesive layer comprises a main body portion and a protruding portion located on the main body portion, the main body portion is located in the first groove body, and the protruding portion is located in the second groove body.

In some embodiments, a second adhesive layer is disposed on a surface of the encapsulation adhesive layer, and the second adhesive layer is a cured black colloid or a gray colloid.

In some embodiments, the surface of the second adhesive layer does not exceed the maximum height of the surface of the convex part.

In some embodiments, the surface of the second adhesive layer, the maximum height of the surface of the convex part and the surface of the groove are flush.

In some embodiments, the groove sidewalls are provided with a reflective layer.

In a second aspect, an LED module is provided, which includes the TOP type LED package structure as described above.

The beneficial effect that technical scheme that this application provided brought includes:

the embodiment of the application provides a TOP type LED packaging structure and LED module, first glue film covers in the bottom of recess, owing to adopt black colloid or grey colloid, can reduce the background blackness under the black picture for the lamp pearl is darker, thereby has improved the contrast, makes the lamp pearl show the uniformity better, compares in adopting bigger chip to promote lamp pearl luminance, in order to improve the contrast, this application utilizes first glue film to improve the contrast, and the cost is lower.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic view of a package support provided in an embodiment of the present application;

fig. 2 is a schematic view of a TOP type LED package structure provided in the embodiment of the present application.

In the figure: 1. packaging the bracket; 10. a groove; 100. a first tank body; 101. a second tank body; 2. an LED chip; 3. a first adhesive layer; 4. packaging the adhesive layer; 40. a boss portion; 5. a second adhesive layer; 6. and a reflective layer.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making creative efforts shall fall within the protection scope of the present application.

Referring to fig. 1 and fig. 2, a TOP type LED package structure provided in the embodiment of the present application includes a package support 1, an LED chip 2, a first adhesive layer 3, and a package adhesive layer 4; a bowl-shaped groove 10 is formed in the packaging support 1, and the size of the bottom of the groove 10 is smaller than that of the notch, so that the packaging support is shaped like a bowl; the LED chip 2 is arranged at the bottom of the groove 10 and is electrically connected with the packaging support 1; the LED chip 2 includes at least one of a first LED element, a second LED element, and a third LED element, which emit at least one of red light, green light, and blue light, respectively. When the LED chip 2 includes two or more LED elements, the arrangement order of the LED elements is not limited. Specifically, the LED chip 2 may be a single color, a double color, or a three-color combination of three chips, i.e., red, green, and blue, designed according to the functional requirements of the actual product, which is not limited herein. The event the utility model provides a LED packaging structure can cover the LED packaging structure design that multiple display screen (full-color, double-colored, monochromatic screen) was used.

The first adhesive layer 3 covers the bottom of the groove 10 and is located on the outer side of the LED chip 2, the first adhesive layer 3 is made of cured black colloid or gray colloid, the black colloid or gray colloid is made of common substances such as black ink or transparent epoxy resin added with a blackening agent, or other epoxy resin added with the blackening agent or black powder, the surface of the first adhesive layer 3 does not exceed the surface of the LED chip 2, the first adhesive layer 3 is formed by dispensing and curing, so that dispensing is performed in an area between the groove 10 and the LED chip 2 after the LED chip 2 is subjected to die bonding, and the first adhesive layer 3 is formed after curing; the packaging adhesive layer 4 is arranged in the groove 10 and covers the first adhesive layer 3 and the LED chip 2. The packaging adhesive layer 4 allows light generated by the LED chip 2 to be transmitted out, the packaging adhesive layer 4 is formed by curing glue, and may be transparent or opalescent, and the packaging adhesive layer 4 may be made of a common material, such as one of epoxy resin, silica gel, and silicone resin.

First glue film 3 covers in the bottom of recess 10, owing to adopt be black colloid or grey colloid, can reduce the background blackness under the black picture for the lamp pearl is darker, thereby has improved the contrast, makes the lamp pearl show the uniformity better, compares in adopting bigger chip to promote lamp pearl luminance, in order to improve the contrast, and this application utilizes first glue film 3 to improve the contrast, and the cost is lower.

For adding black encapsulation glue, encapsulation glue film 4 adopts transparent or ivory-white colloid, and the light intensity loss is still less, makes lamp pearl luminance higher.

Referring to fig. 2, a protrusion 40 is formed on the surface of the encapsulation adhesive layer 4, the height of the surface of the protrusion 40 gradually decreases from the center to the periphery, and the protrusion 40 enables the encapsulation adhesive layer 4 to become a lens of the LED chip 2, so that light emitted by the LED chip 2 is focused after being projected out of the surface of the bowl cup, thereby achieving a light focusing effect, improving the brightness of the LED encapsulation structure, and reducing power consumption and cost.

Note that the height of the surface of the protruding portion 40 refers to a distance from the surface of the protruding portion 40 to the bottom of the groove 10.

The shape of the protruding portion 40 can be selected from various shapes, for example, the cross-sectional shape of the surface of the protruding portion 40 is one of a section of arc line, a curve formed by splicing a plurality of sections of arc lines, and a curve formed by splicing a straight line and an arc line.

Referring to fig. 1 and 2, a step is formed on a side wall of the groove 10, so that the groove 10 includes a first groove 100 and a second groove 101 arranged from bottom to top, and a caliber of the first groove 100 is greater than a caliber of the second groove 101; the encapsulating adhesive layer 4 includes a main body portion and a protruding portion 40 located on the main body portion, the main body portion is located in the first tank 100, and the protruding portion 40 is located in the second tank 101.

The steps are arranged so that the grooves 10 form a first groove 100 and a second groove 101, and the purpose is to make the packaging adhesive slightly convex at the steps by surface tension when the packaging adhesive layer 4 is dispensed, thereby forming the convex parts 40.

Referring to fig. 2, a second adhesive layer 5 is disposed on the surface of the encapsulation adhesive layer 4, the second adhesive layer 5 is a cured black colloid or gray colloid, the black colloid or gray colloid is a common substance, such as black ink or transparent epoxy resin added with a blackening agent, or other epoxy resin added with a blackening agent or black powder, and the surface of the second adhesive layer 5 does not exceed the maximum height of the surface of the protrusion 40.

The existence of second glue film 5 can further reduce the background blackness under the black picture for the lamp pearl is darker, thereby has further improved the contrast, makes the lamp pearl show the uniformity better.

When encapsulation glue film 4 surface is bellied arc, the surface that second glue film 5 is connected with encapsulation glue film 4 becomes the arc structure, both can reduce the light loss of chip in the encapsulation is glued, can pass through the light gathering of arc structure with the inside and cup wall reflection of lamp pearl again, further promotes luminance.

Referring to fig. 2, the maximum height of the surface of the second adhesive layer 5 and the surface of the protruding portion 40 is flush with the surface of the groove 10, so that the ratio of the second adhesive layer 5 to the surface of the encapsulation adhesive layer 4 can be reduced, and the influence of the second adhesive layer 5 on the LED chip 2 can be reduced; also can be better throw out bowl cup surface with the light that LED chip 2 sent, promote the luminance that the lamp pearl can show.

Referring to fig. 2, a reflecting layer 6 is arranged on the side wall of the groove 10, the reflecting layer 6 is made of a common insulating reflective coating, the reflecting layer 6 can reduce diffuse reflection of light, light emitted from the LED chip 2 to the wall surface of the groove 10 is reflected to the surface of the bowl and emitted, and the brightness of the lamp bead is improved.

The embodiment of the present application further provides an LED module, which includes the TOP type LED package structure of any one of the above embodiments.

In the description of the present application, it should be noted that the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present application. Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as the case may be.

It is noted that, in this application, relational terms such as "first" and "second," and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising one of 8230; \8230;" 8230; "does not exclude the presence of additional like elements in a process, method, article, or apparatus that comprises the element.

The above description is merely exemplary of the present application and is presented to enable those skilled in the art to understand and practice the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A TOP type LED packaging structure is characterized by comprising:

the packaging support (1) is provided with a bowl-shaped groove (10);

an LED chip (2) disposed at the bottom of the groove (10);

the first adhesive layer (3) covers the bottom of the groove (10) and is positioned on the outer side of the LED chip (2), and the first adhesive layer (3) is made of cured black colloid or gray colloid;

and the packaging adhesive layer (4) is arranged in the groove (10) and covers the first adhesive layer (3) and the LED chip (2).

2. A TOP LED package structure as recited in claim 1, wherein:

the packaging adhesive layer (4) is transparent colloid or milky colloid after curing.

3. A TOP LED package structure as recited in claim 1, wherein:

the surface of the packaging adhesive layer (4) is provided with a protruding portion (40), and the height of the surface of the protruding portion (40) is gradually reduced from the center to the periphery.

4. A TOP LED package structure as recited in claim 3, wherein:

the cross-sectional shape on the surface of the convex part (40) is one of a curve formed by splicing one section of arc line and multiple sections of arc lines and a curve formed by splicing the straight line and the arc lines.

5. A TOP type LED package structure as claimed in claim 4, wherein:

a step is formed on the side wall of the groove (10), so that the groove (10) comprises a first groove body (100) and a second groove body (101) which are arranged from bottom to top;

the packaging adhesive layer (4) comprises a main body part and a protruding part (40) located on the main body part, the main body part is located in the first groove body (100), and the protruding part (40) is located in the second groove body (101).

6. A TOP LED package structure as recited in claim 3, wherein:

the surface of the packaging adhesive layer (4) is provided with a second adhesive layer (5), and the second adhesive layer (5) is a cured black colloid or a gray colloid.

7. A TOP LED package structure according to claim 6, wherein:

the surface of the second glue layer (5) does not exceed the maximum height of the surface of the bulge part (40).

8. A TOP LED package structure according to claim 6, wherein:

the surface of the second glue layer (5), the position where the height of the surface of the bulge (40) is maximum and the surface of the groove (10) are flush.

9. A TOP LED package structure as claimed in claim 1, wherein:

and a reflecting layer (6) is arranged on the side wall of the groove (10).

10. The utility model provides a LED module which characterized in that: comprising a TOP LED package structure according to any of claims 1 to 9.