KR101797968B1 - Light Emitting Device Package - Google Patents

Light Emitting Device Package Download PDF

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Publication number
KR101797968B1
KR101797968B1 KR1020110076022A KR20110076022A KR101797968B1 KR 101797968 B1 KR101797968 B1 KR 101797968B1 KR 1020110076022 A KR1020110076022 A KR 1020110076022A KR 20110076022 A KR20110076022 A KR 20110076022A KR 101797968 B1 KR101797968 B1 KR 101797968B1
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KR
South Korea
Prior art keywords
light emitting
layer
emitting device
resin layer
light
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KR1020110076022A
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Korean (ko)
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KR20130014718A (en
Inventor
박원화
권지나
조현경
권호기
Original Assignee
엘지이노텍 주식회사
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Priority to KR1020110076022A priority Critical patent/KR101797968B1/en
Publication of KR20130014718A publication Critical patent/KR20130014718A/en
Application granted granted Critical
Publication of KR101797968B1 publication Critical patent/KR101797968B1/en

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Abstract

A light emitting device package according to an embodiment includes a body formed with a cavity, first and second lead frames mounted on the body, a light emitting element electrically connected to the first and second lead frames, A second resin layer containing a phosphor on the resin layer and the first resin layer, and a protective layer formed between the second resin layer and the body.

Description

[0001] Light Emitting Device Package [0002]

An embodiment relates to a light emitting device package.

Light Emitting Diode (LED) is a device that converts electrical signals into light by using the characteristics of compound semiconductors. It is widely used in household appliances, remote control, electric signboard, display, and various automation devices. There is a trend.

Publication No. 10-2008-0068357 discloses a light emitting device package including a body formed with a cavity, a filler filled in the body, and a phosphor contained in the filler.

The light generated in the light emitting device in the light emitting device package passes through a predetermined resin layer and the light emitting phosphor excites the phosphor in the resin layer to generate the intended light. Meanwhile, the light emitting device package includes a body forming an outer appearance, and the body may include a photocatalyst such as a predetermined pigment. Meanwhile, since the photocatalyst contained in the body and the phosphor included in the resin layer interact with each other to interfere with the reliability of the light emitting device package, it is necessary to secure a predetermined separation distance between the body and the resin layer.

In the embodiment, a protective layer is formed between the body of the light emitting device package and the resin layer, thereby securing a separation distance between the phosphor included in the resin layer and the photocatalyst contained in the body, preventing the interaction between the photocatalyst and the phosphor, And provides the improved light emitting device package.

A light emitting device package according to an embodiment includes a body formed with a cavity, first and second lead frames mounted on the body, a light emitting element electrically connected to the first and second lead frames, A second resin layer containing a phosphor on the resin layer and the first resin layer, and a protective layer formed between the second resin layer and the body.

By forming a protective layer between the light emitting device body and the resin layer according to the embodiment, it is possible to secure the separation distance between the phosphor included in the resin layer and the photocatalyst contained in the body, to prevent the interaction between the photocatalyst and the phosphor, .

1 is a cross-sectional view illustrating a light emitting device package according to an embodiment,
FIG. 2 is an enlarged view of the area A in FIG. 1,
Fig. 3 is an enlarged view of the area A of Fig. 1,
Fig. 4 is an enlarged view of the area A in Fig. 1,
5 is a cross-sectional view illustrating a light emitting device package according to an embodiment,
Fig. 6 is an enlarged view of the area B in Fig. 5,
Fig. 7 is an enlarged view of the area B in Fig. 5,
FIG. 8 is an enlarged view of the area B in FIG. 5,
9 is a cross-sectional view illustrating a light emitting device package according to an embodiment,
10 is a cross-sectional view illustrating a light emitting device package according to an embodiment,
11 is a perspective view illustrating a lighting device including a light emitting device package according to an embodiment,
12 is a cross-sectional view illustrating a lighting device including a light emitting device package according to an embodiment,
13 is an exploded perspective view illustrating a liquid crystal display device including a light emitting device package according to an embodiment, and
14 is an exploded perspective view illustrating a liquid crystal display device including a light emitting device package according to an embodiment.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size of each component does not entirely reflect the actual size. The same reference numerals are used for the same components.

Hereinafter, embodiments will be described in detail with reference to the drawings.

1 is a perspective view showing a light emitting device package according to an embodiment, and Figs. 2 to 4 are enlarged views showing area A shown in Fig.

1 to 4, a light emitting device package 100 according to an embodiment includes a body 110 having a cavity 120 formed therein, first and second lead frames 140 and 150 mounted on the body 110, A light emitting element 130 electrically connected to the first and second lead frames 140 and 150 and a phosphor 170 and a resin layer 160 formed in the cavity 120 and a resin layer 160 And a protective layer 180 formed between the substrate 110 and the substrate 110.

The body 110 may be made of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), liquid crystal polymer (PSG), polyamide 9T (SPS), a metal material, sapphire (Al 2 O 3 ), beryllium oxide (BeO), and a printed circuit board (PCB). The body 110 may be formed by injection molding, etching, or the like, but is not limited thereto.

In addition, the body 110 may include a predetermined photocatalyst. For example, the photocatalyst may form the light generated by the light source unit 130 as white light, and may be a predetermined pigment such as TiO 2 .

A cavity 120 may be formed on the body 110, and an inner surface of the cavity 120 may be formed with an inclined surface. The reflection angle of the light emitted from the light emitting device 130 can be changed according to the angle of the inclined surface, and thus the directivity angle of the light emitted to the outside can be controlled.

Concentration of light emitted to the outside from the light emitting device 130 increases as the directional angle of light decreases. Conversely, as the directional angle of light increases, the concentration of light emitted from the light emitting device 130 to the outside decreases.

The shape of the cavity 120 formed in the body 110 may be circular, square, polygonal, elliptical, or the like, and may have a curved shape, but the present invention is not limited thereto.

The light emitting device 130 is electrically connected to the first and second lead frames 140 and 150. The light emitting device 130 may be a light emitting diode.

The light emitting diode may be, for example, a colored light emitting diode that emits light such as red, green, blue, or white, or a UV (Ultra Violet) light emitting diode that emits ultraviolet light. In addition, one or more light emitting diodes may be mounted.

In addition, the light emitting diode is applicable to both a horizontal type in which all the electric terminals are formed on the upper surface, a vertical type formed in the upper and lower surfaces, or a flip chip .

The resin layer 160 may be filled in the cavity 120 so as to cover the light emitting device 130.

The resin layer 160 may be formed of silicon, epoxy, or other resin material. The resin layer 160 may be filled with a predetermined resin in the cavity 120, and then may be formed by UV or thermal curing.

The resin layer 160 may include a phosphor 170 and the phosphor 170 may be selected to be a wavelength of light emitted from the light emitting device 130 so that the light emitting device package 100 may emit white light. have.

The phosphor 170 may be a blue phosphor, a blue-green light-emitting phosphor, a green light-emitting phosphor, a yellow-green light-emitting phosphor, a yellow light-emitting phosphor, a yellow-red light-emitting phosphor, One of the phosphors may be applied.

That is, the phosphor 170 is excited by the light having the first light emitted from the light emitting device 130 to generate the second light. For example, when the light emitting element 130 is a blue light emitting diode and the phosphor is a yellow phosphor, the yellow phosphor may be excited by blue light to emit yellow light, and blue light and blue light emitted from the blue light emitting diode As the excited yellow light is excited, the light emitting device package 100 can provide white light.

Similarly, when the light emitting device 130 is a green light emitting diode, a magenta fluorescent substance or a mixture of blue and red fluorescent materials is used. When the light emitting device 130 is a red light emitting diode, a cyan fluorescent material or a mixture of blue and green fluorescent materials For example.

The phosphor 170 may be a known phosphor such as YAG, TAG, sulfide, silicate, aluminate, nitride, carbide, nitridosilicate, borate, fluoride or phosphate.

1, the resin layer 160 may include a first resin layer 162 and a second resin layer 164 formed on the first resin layer 162, and the second resin layer 162 164 may include a phosphor 170 and a protective layer 180 may be formed between the second resin layer 164 and the body 110.

The second resin layer 164 may be formed by filling the cavity 120 with a material forming the first resin layer 162 and curing the second resin layer 164 including the phosphor 170, On the ground layer 162, but is not limited thereto.

The first resin layer 162 and the second resin layer 164 may be formed of the same or different materials, but are not limited thereto.

Although the first and second resin layers 162 and 164 are formed in FIG. 1, the resin layer 160 may have a multi-layer structure in which an arbitrary number of layers are formed in addition to the first and second resin layers 162 and 164 , But is not limited thereto.

1, the first resin layer 162 covers the light source 110 and the second resin layer 164 including the fluorescent material is formed on the first resin layer 162. However, And may include, but is not limited to, phosphor 180.

The first and second lead frames 140 and 150 may be formed of a metal material such as titanium, copper, nickel, gold, chromium, tantalum, (Pt), tin (Sn), silver (Ag), phosphorus (P), aluminum (Al), indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium , Hafnium (Hf), ruthenium (Ru), and iron (Fe). Also, the first and second lead frames 140 and 150 may have a single-layer structure or a multi-layer structure, but the present invention is not limited thereto.

The first and second lead frames 140 and 150 are separated from each other and electrically separated from each other. The light emitting device 130 is mounted on the first lead frame 140 and the first lead frame 140 can be electrically connected to the light emitting device 130 directly or through a conductive material . Also, the second lead frame 150 may be electrically connected to the light emitting device 130 by the wire 134, but is not limited thereto. Accordingly, when power is supplied to the first and second lead frames 140 and 150, power may be applied to the light emitting device 130. Meanwhile, a plurality of lead frames (not shown) may be mounted in the body 110 and each lead frame (not shown) may be electrically connected to the light emitting device (not shown).

A protective layer 180 having a predetermined thickness may be formed between the second resin layer 164 and the body 110.

The protective layer 180 may be formed of at least one layer between the body 110 and the second resin layer 164 and may form several layers and may be formed on at least one side of the inner surface of the cavity 120 May be formed to cover the region.

The protective layer 180 may be formed, for example, by coating, vapor-depositing, or applying a predetermined material on at least one area of the inner side surface of the cavity and then curing the material. However, the protective layer 180 is not limited thereto.

The protective layer 180 may include a material having an insulating property. For example, a silicone resin including any one of SiO 2 , SiN, and Al 2 O 3 , or a coating layer containing an epoxy resin, but is not limited thereto. In addition, the protective layer 180 may include, but is not limited to, a reflective layer including a metal material having light reflectivity such as Ag or Al. For example, as described below, the protective layer 180 may include, but is not limited to, a metallic reflective layer and an insulating coating layer. Thus, the protective layer 180 may include, but is not limited to, at least one of an insulating layer or a reflective layer.

Further, the protective layer 180 may have a single layer or a multi-layer structure. Further, for example, the protective layer 180 has a multilayer structure, and each layer may be formed of a layer having a different refractive index from each other.

The phosphor 170 included in the second resin layer 164 is excited by the light generated in the light source unit 130 to generate light of white or another predetermined color and can generate free electrons. When the free electrons are transferred to the photocatalyst contained in the body 110, the photocatalyst contained in the body 110 forms active oxygen or hydroxyl radicals having high reactivity, The light emitting device package 100 may be damaged as well as the light emitting device package 110 may be damaged.

A protective layer 180 is formed between the body 110 and the second resin layer 164 to secure a separation distance between the body 110 and the second resin layer 164, Electrons may be transferred to the photocatalyst contained in the body 110 and prevented from reacting to improve the reliability of the light emitting device package 100.

In addition, when the protective layer 180 includes a material having excellent bonding performance such as SiO 2 , the interface peeling between the body 110 and the second resin layer 164 can be prevented, The penetration of foreign matter, moisture, and the like between the second resin layers 164 can be prevented, and the reliability of the light emitting device package 100 can be further improved.

On the other hand, if the thickness T of the protective layer 180 is excessively large, the capacity of the cavity 120 may be ensured and the luminous efficiency may be deteriorated. If the thickness T is excessively small, a distance between the body 110 and the second resin layer 164 The thickness T of the protective layer 180 may be 10 nm or more and 100 nm or less.

The protective layer 180 may be formed between the body 110 and the second resin layer 164 so that the photocatalyst contained in the body 110 and the phosphor included in the second resin layer 164 170 can be ensured.

The passivation layer 180 is formed between the second resin layer 164 including the phosphor 170 and the body 110 by forming a layer including the phosphor 170 in the resin layer 160 and by forming the passivation layer 180 between the second resin layer 164 including the phosphor 170 and the body 110, The electric shorting phenomenon by the phosphor 170 can be prevented in advance and a uniform distribution of the phosphor 170 can be made possible.

3, the protective layer 180 includes a first coating layer 182 and a reflective layer 184 and a reflective layer 184 may be formed between the first coating layer 182 and the body 110 have.

The first coating layer 182 may be formed of an insulating material as described above, and may include a material such as a silicone resin including any one of SiO 2 , SiN, and Al 2 O 3 , or an epoxy resin , But not limited to.

The reflective layer 184 is formed of a material having light reflectivity, and may be formed of a metal material such as Ag or Al, but is not limited thereto.

Since the protective layer 180 includes the first coating layer 182 and the first coating layer 182 includes a material having excellent bonding performance such as SiO 2 , the distance between the body 110 and the second resin layer 164 Interface delamination can be prevented. Also, the penetration of foreign matter, moisture, and the like is prevented between the body 110 and the second resin layer 164, and the reliability of the light emitting device package 100 can be further improved.

The reflective layer 184 is formed under the first coating layer 182 so that the light generated by the light emitting device 130 is reflected without being absorbed by the body 110 to improve the light emitting efficiency of the light emitting device package 100 .

Further, the protective layer 180 includes the first coating layer 182 and the reflective layer 184, so that the distance between the phosphor 170 and the body 110 can be further secured.

Referring to FIG. 4, the protective layer 180 includes a second coating layer 186, and a second coating layer 186 may be formed between the reflective layer 184 and the body 110.

The second coating layer 186 may be formed of the same material as the first coating layer 182, but is not limited thereto. The second coating layer 186 may be formed of, for example, a silicone resin including any one of SiO 2 , SiN, and Al 2 O 3 , or an epoxy resin, but is not limited thereto.

The second coating layer 186 is formed between the reflective layer 184 and the body 110 so that bonding between the reflective layer 184 and the body 110 can be reliably formed.

The first and second coating layers 182 and 186 and the reflective layer 184 are formed between the body 110 and the second resin layer 162 so that the distance between the phosphor 170 and the body 110 Can be further secured.

5 to 8 are cross-sectional views illustrating a light emitting device package according to an embodiment.

5 to 8, a light emitting device package 200 according to an embodiment includes a body 210 having a cavity 220, first and second lead frames 240 and 250 mounted on the body 210, A resin layer 260 formed in the cavity 220 and a resin layer 260 including a light emitting element 230 and a phosphor 270 electrically connected to the first and second lead frames 240 and 250, And a protective layer (280) formed between the body (210).

The description of the body 210, the cavity 220, the light emitting element 230, the first and second lead frames 240 and 250, the resin layer 260, and the phosphor 270 is the same as described above, .

The resin layer 260 may include the phosphor 270. The phosphor 270 may be scattered within the resin layer 260, but is not limited thereto.

A protective layer 280 may be formed between the resin layer 260 and the body 210. The protective layer 280 is formed to cover the inner surface of the cavity 220 so that a separation distance can be secured between the resin layer 260 and the body 210.

As described above. The protective layer 280 is formed between the resin layer 260 and the body 210 so that the separation distance between the body 210 and the resin layer 260 can be secured. The free electrons generated in the phosphor 270 are prevented from being transferred to the photocatalyst contained in the body 210 and are prevented from reacting to improve the reliability of the light emitting device package 200 .

Meanwhile, as described above, the protective layer 280 may include at least one of a coating layer and a reflective layer formed of an insulating material.

6 through 8, the protective layer 280 may be formed of a coating layer or a reflective layer, or may include a first coating layer 282 and a reflective layer 284. [ 8, the protective layer 280 includes first and second coating layers 282 and 284 and a reflective layer 284 and is provided between the first and second coating layers 282 and 286, (284) may be formed.

The interface peeling between the body 210 and the second resin layer 260 can be prevented since the first and second coating layers 282 and 284 include materials having superior bonding performance such as SiO 2 . Also, the penetration of foreign matter, moisture, and the like is prevented between the body 210 and the second resin layer 260, so that the reliability of the light emitting device package 200 can be further improved.

The reflective layer 284 is formed so that the light generated by the light emitting device 230 can be reflected without being absorbed by the body 210 to improve the light emitting efficiency of the light emitting device package 200.

9 and 10 are views showing a light emitting device package according to an embodiment.

9, the light emitting device package 300 includes a body 310 having a cavity 320 formed therein. The cavity 320 includes a first cavity 322 and a second cavity 324, . ≪ / RTI >

The body 310 may include a cavity 320 and the cavity 320 may include a first cavity 322 and a second cavity 324.

The first and second cavities 322 and 324 may be defined by, for example, the partition wall 312 formed in the cavity 320 as shown in FIGS. 10 and 11, but are not limited thereto. Meanwhile, the height and shape of the partition 312 are not limited to those shown in FIGS. 10 and 11. FIG. In addition, the sizes and shapes of the first and second cavities 322 and 324 are not limited as shown in FIGS. 9 and 10. FIG.

The light emitting device 330 may be mounted on at least one of the first and second cavities 322 and 324. For example, as shown in FIGS. 9 and 10, the first light emitting device 332 may be mounted on the first cavity, and the second light emitting device 334 may be mounted on the second cavity 324, No.

Meanwhile, the light emitting device 330 may be mounted on one of the first and second cavities 322 and 324, and an ESD device (not shown) such as a Zener diode may be mounted on another cavity, but the present invention is not limited thereto .

A protective layer 380 may be formed between the first and second cavities 322 and 324 and the resin layer 360. The protective layer 380 is formed to cover the inner surfaces of the first and second cavities 322 and 324 so that a separation distance can be secured between the resin layer 360 and the body 310.

9, the resin layer 360 includes the first and second resin layers 362 and 364, the second resin layer 364 includes the phosphor 370, A protective layer 380 may be formed between the layer 364 and the body 310, but is not limited thereto.

As described above. The protective layer 380 is formed between the resin layer 360 and the body 310 so that the separation distance between the body 310 and the resin layer 360 can be secured. The free electrons generated in the phosphor 370 are prevented from being transferred to the photocatalyst contained in the body 310 and are prevented from reacting to improve the reliability of the light emitting device package 300 .

Meanwhile, as described above, the protective layer 380 may include at least one of a coating layer and a reflective layer formed of an insulating material.

Accordingly, the protective layer 380 may be formed of a coating layer (not shown) or a reflective layer (not shown), or may include a first coating layer (not shown) and a reflective layer (not shown). The protective layer 380 may include first and second coating layers (not shown) and a reflective layer (not shown), and a reflective layer (not shown) may be formed between the first and second coating layers have.

The interface peeling between the body 310 and the second resin layer 360 can be prevented because the first and second coating layers (not shown) include materials having superior bonding performance such as SiO 2 . Also, the penetration of foreign matter, moisture, and the like is prevented between the body 310 and the second resin layer 360, so that the reliability of the light emitting device package 300 can be further improved.

In addition, since the reflective layer (not shown) is formed, the light generated by the light emitting device 330 can be reflected without being absorbed by the body 310, thereby improving the light emitting efficiency of the light emitting device package 300.

FIG. 11 is a perspective view illustrating a lighting device including a light emitting device package according to an embodiment, and FIG. 12 is a cross-sectional view illustrating a C-C 'cross section of the lighting device of FIG.

12 is a cross-sectional view of the illumination device 400 of FIG. 11 cut in the longitudinal direction Z and the height direction X and viewed in the horizontal direction Y. FIG.

11 and 12, the lighting device 400 may include a body 410, a cover 430 coupled to the body 410, and a finishing cap 450 positioned at opposite ends of the body 410 have.

The light emitting device module 440 is coupled to a lower surface of the body 410. The body 410 is electrically connected to the light emitting device package 444 through a conductive material such that heat generated from the light emitting device package 444 can be emitted to the outside through the upper surface of the body 410. [ And may be formed of a metal material having excellent heat dissipation effect, but is not limited thereto.

The light emitting device package 444 may be mounted on the substrate 442 in a multi-color, multi-row manner to form a module. The light emitting device package 444 may be mounted at equal intervals or may be mounted with various spacings as needed. As such a substrate 442, MCPCB (Metal Core PCB) or FR4 PCB can be used.

The cover 430 may be formed in a circular shape so as to surround the lower surface of the body 410, but is not limited thereto.

The cover 430 protects the internal light emitting device module 440 from foreign substances or the like. The cover 430 may include diffusion particles to prevent glare of the light generated in the light emitting device package 444 and uniformly emit light to the outside and may include at least one of an inner surface and an outer surface of the cover 430 A prism pattern or the like may be formed on one side. Further, the phosphor may be coated on at least one of the inner surface and the outer surface of the cover 430.

Since the light generated from the light emitting device package 444 is emitted to the outside through the cover 430, the cover 430 must have a high light transmittance and sufficient to withstand the heat generated from the light emitting device package 444. [ The cover 430 may be made of polyethylene terephthalate (PET), polycarbonate (PC), polymethyl methacrylate (PMMA), or the like. It is preferable that it is formed of a material.

The finishing cap 450 is located at both ends of the body 410 and can be used for sealing the power supply unit (not shown). In addition, the fin 450 is formed on the finishing cap 450, so that the lighting device 400 according to the embodiment can be used immediately without a separate device on the terminal from which the conventional fluorescent lamp is removed.

13 is an exploded perspective view of a liquid crystal display device including an optical sheet according to an embodiment.

13, the liquid crystal display 500 may include a liquid crystal display panel 510 and a backlight unit 570 for providing light to the liquid crystal display panel 510 in an edge-light manner.

The liquid crystal display panel 510 can display an image using the light provided from the backlight unit 570. The liquid crystal display panel 510 may include a color filter substrate 512 and a thin film transistor substrate 514 facing each other with a liquid crystal therebetween.

The color filter substrate 512 can realize the color of an image to be displayed through the liquid crystal display panel 510.

The thin film transistor substrate 514 is electrically connected to a printed circuit board 518 on which a plurality of circuit components are mounted via a driving film 517. The thin film transistor substrate 514 may apply a driving voltage provided from the printed circuit board 518 to the liquid crystal in response to a driving signal provided from the printed circuit board 518. [

The thin film transistor substrate 514 may include a thin film transistor and a pixel electrode formed as a thin film on another substrate of a transparent material such as glass or plastic.

The backlight unit 570 includes a light emitting device module 520 that outputs light, a light guide plate 530 that changes the light provided from the light emitting device module 520 into a surface light source and provides the light to the liquid crystal display panel 510, A plurality of films 550, 566, and 564 for uniformly distributing the luminance of light provided from the light guide plate 530 and improving vertical incidence, and a reflective sheet (not shown) for reflecting light emitted to the rear of the light guide plate 530 to the light guide plate 530 540).

The light emitting device module 520 may include a PCB substrate 522 to mount a plurality of light emitting device packages 524 and a plurality of light emitting device packages 524 to form a module.

The backlight unit 570 includes a diffusion film 566 for diffusing light incident from the light guide plate 530 toward the liquid crystal display panel 510 and a prism film 550 for enhancing vertical incidence by condensing the diffused light And may include a protective film 564 for protecting the prism film 550. [

14 is an exploded perspective view of a liquid crystal display device including an optical sheet according to an embodiment. However, the parts shown and described in Fig. 13 are not repeatedly described in detail.

14, the liquid crystal display 600 may include a liquid crystal display panel 610 and a backlight unit 670 for providing light to the liquid crystal display panel 610 in a direct-down manner.

The liquid crystal display panel 610 is the same as that described with reference to FIG. 13, and thus a detailed description thereof will be omitted.

The backlight unit 670 includes a plurality of light emitting element modules 623, a reflective sheet 624, a lower chassis 630 in which the light emitting element module 623 and the reflective sheet 624 are accommodated, And a plurality of optical films 660 disposed on the diffuser plate 640.

The light emitting device module 623 may include a PCB substrate 621 to mount a plurality of light emitting device packages 622 and a plurality of light emitting device packages 622 to form a module.

The reflective sheet 624 reflects light generated from the light emitting device package 622 in a direction in which the liquid crystal display panel 610 is positioned, thereby improving light utilization efficiency.

The light emitted from the light emitting element module 623 is incident on the diffusion plate 640 and the optical film 660 is disposed on the diffusion plate 640. The optical film 660 is composed of a diffusion film 666, a prism film 650, and a protective film 664.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It should be understood that various modifications may be made by those skilled in the art without departing from the spirit and scope of the present invention.

110: body 120: cavity
130: light source 170: phosphor
180: protective layer 182: first coating layer
184: reflective layer 186: second coating layer

Claims (16)

A body formed with a cavity and comprising a photocatalytic agent;
First and second lead frames mounted on the body;
A light emitting element electrically connected to the first and second lead frames;
A second resin layer including a phosphor on the first resin layer, the first resin layer being filled in the cavity; And
And a protective layer formed between the second resin layer and the body,
Wherein the protective layer comprises a first coating layer, a second coating layer, and a reflective layer formed between the first coating layer and the second coating layer,
Wherein each layer of the protective layer has a different refractive index from each other,
Wherein the protective layer has a thickness of 10 nm or more and 100 nm or less. delete delete The method according to claim 1,
Wherein the coating layer comprises:
SiO 2 SiN, and Al 2 O 3 ,
Wherein,
Ag, or Al,
Wherein the photocatalyst comprises TiO2. delete delete delete delete delete The method according to claim 1 or 4,
Wherein the protective layer extends to contact the lead frame,
Wherein the body includes a partition wall portion,
Wherein the cavity includes first and second cavities defined by the partition wall portion,
The first light emitting device is mounted on the first cavity,
And the second light emitting device is mounted on the second cavity.
delete delete delete delete delete delete
KR1020110076022A 2011-07-29 2011-07-29 Light Emitting Device Package KR101797968B1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101958418B1 (en) * 2013-02-22 2019-03-14 삼성전자 주식회사 Light emitting device package
KR102170214B1 (en) * 2014-01-24 2020-10-26 엘지이노텍 주식회사 Light emittng device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000037615A (en) * 1998-07-23 2000-02-08 Mitsubishi Electric Corp Light source-integrated type photocatalytic apparatus and manufacture thereof
JP2002094128A (en) 2000-09-20 2002-03-29 Stanley Electric Co Ltd Light emitting diode and its manufacturing method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000037615A (en) * 1998-07-23 2000-02-08 Mitsubishi Electric Corp Light source-integrated type photocatalytic apparatus and manufacture thereof
JP2002094128A (en) 2000-09-20 2002-03-29 Stanley Electric Co Ltd Light emitting diode and its manufacturing method

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