JP2009038302A - Illuminator, and liquid crystal display device provided with the illuminator - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light source for improving light emission efficiency and controlling a light emission distribution in an illumination light source or a liquid crystal backlight light source module. <P>SOLUTION: A package light source 12 loaded on a unit substrate 10 includes a substrate, an LED element paired for each RGB arranged on the substrate, and a transparent resin for sealing the LED element. For a die bonding material for mounting the LED element on wiring, the white particles of submicrons are contained, a diffuse reflection factor is set high, intensity in an upper direction in the light emission distribution is increased and a radiation angle distribution is controlled. Further, by the recessed shape of the transparent resin sealing the LED element, the maximum value of the light emission intensity is provided in a direction having a prescribed inclination angle from a direction vertical to the substrate. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an illumination device using a light emitting diode element (LED element), and more particularly to a liquid crystal display device using the illumination device as a backlight.

  In recent years, modules equipped with LED elements have been developed as light sources for illumination devices and large liquid crystal display devices. Up to now, small liquid crystal display devices for cellular phones and the like equipped with white LED light sources using phosphors have been put into practical use. In the future, medium-sized and large-sized liquid crystal televisions will be equipped with red, green, and blue primary LED elements. As a result, the color reproduction range is wide, and the display performance for moving images and high image quality controlled independently at high speed is improved.

  When configuring a light source of an illumination device or a backlight light source module of a liquid crystal display device, first, uniform and highly efficient illumination light is required from the LED elements. The following publicly known examples are known for a package that realizes uniform illumination and applies a highly efficient configuration and a high heat dissipation member.

  Patent Document 1 below shows a case where a transparent or white insulating adhesive is used as a die bonding material for a blue LED element and bonded to a printed circuit board in a surface-mounted LED package. It is stated that the external quantum efficiency is improved by adjusting the thickness of the white insulating adhesive containing transparent or filler to set the blue LED element at a position higher than at least the red LED element.

  Patent Document 2 below shows a case where a white paste is used as a die bonding material in a bullet-type LED lamp. As a material, if a transparent epoxy material mixed with boron nitride (BN) filler is used as a paste material, the heat dissipation can be improved and the reflectance can be increased, so that the amount of light emitted to the outside is increased. It has been.

  Patent Document 3 below shows a white light emitting device that implements a white color that is less likely to cause color misregistration by mounting a purple LED element and combining with a phosphor. An example is described in which a silicone resin containing an inorganic material that does not absorb light and can maintain a high reflectance is applied to a mount material for a short-wavelength light source.

  The following Patent Document 4 shows that a resin paste having excellent adhesiveness, high heat dissipation, and high transparency is provided for a die bonding material of an LED element. As a material for realizing these, specifically, a curing comprising as a component a silicon compound having two SiH groups and two carbon-carbon double bonds in one molecule, a hydrosilylation catalyst, a silane coupling agent, and a silanol condensation catalyst. It is described that the reflectance is set high by using an adhesive composition as a resin paste and containing an inorganic member.

In the following Patent Document 5, in a surface mount type LED package, a light-emitting surface of the LED element is covered with a resin containing a phosphor, and a white resin is covered around the LED element. . It is described that the resin covering the periphery of the LED element is a white resin or a resin mixed with a white filler such as titanium oxide and having high diffuse reflection hardening.
JP 7-288341 A Japanese Patent Laid-Open No. 11-220179 Japanese Patent Laid-Open No. 2004-127988 JP 2004-266134 A JP 2005-277227 A

  In the above-mentioned patent document, a device for the die bonding material to be mounted is devised in the package of the LED element, and it is stated that the heat dissipation and the diffuse reflectance are improved by using a white resin or a filler-containing resin paste material. It has been. However, it is only described in individual elements and packages, and is not a content referring to a light source of a large area lighting device or a liquid crystal display device, but a configuration for achieving uniformity of luminance distribution and chromaticity distribution Is not explained. Further, there is no mention of a specific configuration of the LED element die bonding material for controlling the light emission distribution of the light source package, and no description is given on the design of the light emission distribution suitable as an illumination light source or a backlight light source. In the package configuration, when a plurality of LED elements are mounted, there is no corresponding explanation about the control of the radiation coupling efficiency and radiation angle distribution of the LED elements by the resin shape.

  When a plurality of LED packages are arranged as a backlight of a liquid crystal display device or the like, it is a configuration that realizes uniformity of luminance distribution and chromaticity distribution in the entire system by designing the interaction of luminance and chromaticity distribution of each package. There is a need.

  Accordingly, an object of the present invention is to provide a backlight light source module having improved light emission efficiency and optimal light emission distribution characteristics in an LED package light source of a lighting device or a liquid crystal display device.

  In the present invention, not only a mounting configuration for one LED element in a package but also a pair of LED elements is configured in the same package. The present invention relates to a member and a configuration of a die bonding material of an LED element to be mounted and an arrangement configuration of the LED element, and further improves the coupling efficiency and controls the radiation distribution by the shape of a sealing resin for sealing the LED element.

  The present invention includes at least a substrate, wiring arranged on the substrate, LED elements connected to the wiring, and a transparent resin that seals the LED elements. A red LED element, a green LED element, or a blue LED element of the same color that is line-symmetric and paired is mounted, and is the same color that is line-symmetrical to the wiring and paired. The red LED element, the green LED element, and the blue LED element are integrated and mounted.

  Each LED element is mounted in series or in parallel. Each of the LED elements is driven independently.

  The white particles contained in the paste material for die-bonding the LED element are composed of ceramic particles having a submicron size, and the paste material covers the side wall of the LED element in a fillet shape and from 1/3 of the side wall. By covering the height of 1/2, the emission intensity emitted upward in the emission distribution of the LED element is relatively increased.

  In the configuration having the transparent resin for sealing the LED element, the transparent resin has a concave shape on the upper side, and the position of the tip of the concave shape is line-symmetric with respect to the pair of LED elements on the wiring. It is characterized by being arranged corresponding to the line.

  The concave shape of the transparent resin reflects the emitted light from the LED element, so that the emission distribution of the LED element has the maximum value of the emission intensity in the direction having a predetermined inclination angle from the direction perpendicular to the substrate. .

  According to another aspect of the present invention, there is provided a liquid crystal display device including a transparent resin LED package light source module having a concave shape. This LED package structure is characterized by a backlight light source having a radiation angle distribution indicating a maximum value of light emission intensity in a direction having a predetermined inclination angle in a direction reflecting on the side surface of the recessed area of the transparent resin. And Here, the radiation angle distribution has a distribution in which the emission intensity greatly decreases at an angle of 70 degrees or more.

  Furthermore, in the direction perpendicular to the direction of reflection on the side surface of the concave portion of the transparent resin and in the front and back directions, the radiation angle distribution is close to the perfect reflection Lambertian distribution, or the light emission intensity is almost uniform. Features a backlight source having a radiation angle distribution. Here, the radiation angle distribution has a distribution in which the emission intensity greatly decreases at an angle of 70 degrees or more.

  As described above, according to the present invention, not only the light emission efficiency of the LED element in the package light source can be improved, but also the light emission distribution can be controlled to provide an optimal light source for a liquid crystal display device or the like. In addition, the present invention can be applied as a backlight light source module for a light source of a lighting device, a liquid crystal display device for a large-sized liquid crystal television, a small-sized liquid crystal display device for a mobile phone or a personal computer.

  Embodiments of the present invention will be described below with reference to the drawings. In an embodiment of the present invention, a package configuration in which an LED element, which is a light source of a lighting device or a liquid crystal display device, is described below from the viewpoint of the configuration of a mounting member and optical design.

  The present embodiment will be described with reference to FIGS. First, FIG. 1 and FIG. 2 are comparative examples constituting a surface mount type package light source. FIG. 1 shows each LED element with R (red) G (green) G (green) B (blue) as one set. FIG. 2 shows that each LED element is mounted with R (red), G (green), and B (blue) as one set. 1 and 2, the surface mount type package configuration in which each LED element is incorporated is as follows. A wiring 2 is formed on a metal substrate with an insulating layer, a ceramic substrate, or a glass epoxy substrate 1, and a reflector 3 is integrally formed. As shown in FIG. 1, a red LED element 4, a green LED element 5, a green LED The element 6 and the blue LED element 7 are set as one set, or as shown in FIG. 2, the red LED element 4, the green LED element 5 and the blue LED element 7 are set as one set, and each LED element is Au (gold). An LED light source having a surface-mounting type package configuration is manufactured by mounting with the wire 8 and sealing the LED element with the transparent resin 9.

  On the other hand, in this example, the surface mounting type package structure is prepared in the same manner as the comparative example shown in FIGS. 1 and 2, but each LED element is formed as shown in FIGS. It is implemented as a pair.

  As shown in FIG. 3, each of the red LED element 4, the green LED element 5, the green LED element 6, and the blue LED element 7 has two sets of LED elements, or as shown in FIG. 4, the red LED element The LED elements in the package are configured by making each of the LED elements of the element 4, the green LED element 5, and the blue LED element 7 into two sets.

  3 and 4 show a case where LED elements of the same color forming a pair are electrically connected in series on each substrate. In FIGS. 5 and 6, the package is configured in the same manner, but a pair of the same color LED elements is electrically connected in parallel on each substrate.

  As shown in the above mounting example, by arranging LED elements of the same color in pairs in one package, a light source for an illumination device or a liquid crystal display device can be realized with a small package configuration. For example, as can be seen by comparing FIG. 7 and FIG. 8, as shown in FIG. 7 as a comparative example, the case in which four packages 11 having RGB LED elements mounted on the unit substrate 10 are mounted in this embodiment. As an example, as shown in FIG. 8, it can be integrated into a case in which two packages 12 each mounting a pair of LED elements for each RGB are mounted. For this reason, the number of packages can be reduced and the cost can be reduced.

  Here, in a package in which LED elements paired for each RGB are mounted, colors tend to be mixed due to the proximity of each element, and white balance tends to be easily achieved, but the light irradiation area requires a distance in the horizontal direction. Therefore, countermeasures are required. Therefore, it will be described below that light irradiation expansion corresponding to uniform light irradiation can be achieved by devising a die bonding material and an adhesive structure for mounting and bonding elements and designing the shape of the sealing resin.

  As a die bonding material, as shown in FIG. 9 as a comparative example, the paste material 13 containing Ag (silver) particles was used for die bonding mounting. In this example, as shown in FIG. Then, die bonding mounting is performed using a paste material 14 containing fine white filler having a submicron size. At this time, in the die bonding paste material 13 shown in FIG. 9, the light component once emitted from the light emitting layer returns to the direction of the light emitting layer again by regular reflection by the Ag particles, and the light loss reabsorbed by the light emitting layer is reduced. Prone to occur.

  On the other hand, the die bonding paste material 14 having a high diffuse reflectance according to the present embodiment is configured to emit as much as possible from the substrate side to the outside. With a material with high diffuse reflectance, light that can be extracted from the substrate while reflecting the light component that has been confined to the substrate of the LED element by total reflection at a very wide angle and avoiding the condition of the total reflection angle. It contributes effectively to increasing the proportion of ingredients. For this reason, when a die bonding paste material having a high diffuse reflectance is used, the light emission amount of the element is increased, and an improvement in efficiency is expected.

  As shown in FIG. 10, the die bonding material containing the particulate white filler in this example has a fillet-like shape and is adhered to the substrate of the LED element 7, and the fillet-like shape is The side wall of the element substrate has a shape covered up to a higher region than when a conventional adhesive is used.

  At this time, light extraction from the substrate of the element to the outside is performed relatively effectively, reflecting the high diffuse reflectance of the fine particle white filler. The light component emitted from the light emitting layer of the device to the lower side of the substrate is reflected by the substrate surface and emitted upward. At this time, the die bonding material has a high diffuse reflectance. is required.

  When extracting light from the substrate of the element, to reduce the light component emitted downward and the light component emitted horizontally, as much as possible, and to obtain a light emission distribution in which the light component emitted upward is occupied The die bonding paste material needs to have a fillet shape and cover the element substrate up to a predetermined height.

  Although the optimum range varies depending on the length of the element, it is preferably covered to a height of ¼ to ½ with respect to the height of the substrate side wall of the element. Providing a die bonding material at a height higher than this is disadvantageous in terms of light quantity and efficiency. That is, when the substrate side wall of the element is covered with the die bonding paste material to a height higher than this, the reflected light component that is diffusely reflected and directed upward is reabsorbed by the light emitting layer. Conventionally, the light component that undergoes re-absorption becomes a light component that cannot be extracted to the outside, similarly to the light component confined in the substrate by total reflection, resulting in a decrease in external quantum efficiency due to internal light loss.

  As described above, by providing a die bonding paste material having a high diffuse reflectance to an optimum height on the substrate side wall of the element, the radiation distribution from the element increases the intensity of light emission distribution in the upward direction of the element. Can be set as follows. The size of the fine particle white filler is preferably the same as or smaller than the wavelength of visible light. The white filler material is insulating white particles, specifically, silica, alumina, titanium oxide, zinc oxide, gallium oxide, magnesium oxide, boron nitride, silicon nitride, aluminum nitride, gallium nitride, barium sulfate, Barium carbonate, magnesium carbonate, calcium carbonate and the like are desirable.

  By applying a die bonding paste material containing sub-micron fine particles and containing white filler to cover the side wall of the element substrate to a predetermined height, a mounting configuration in which light confinement and light loss in the substrate are avoided as much as possible is possible.

  11 (a) and 11 (b) show the characteristics of LED element A mounted using a die bonding paste material containing fine particulate white filler, together with the characteristics of LED element B of a conventional die bonding mounting containing Ag particles. Also in the luminous flux versus current characteristic shown in FIG. 11A and the luminous efficiency versus current characteristic shown in FIG. 11B, the LED element A mounted using the die bonding paste material containing the fine white filler is compared with the conventional one. Thus, it can be seen that the effect of 1.2 times or more is obtained in both the luminous flux and the luminous efficiency.

  In addition to increasing the efficiency of the device, it can also be effective in controlling the light emission distribution. FIG. 12 shows a package configuration in which one LED element 7 is mounted with a die bonding paste material 14 containing fine white filler as a comparative example, and the result of measuring the light emission distribution in this configuration in the horizontal direction of FIG. As shown in FIG. Further, as a present example, FIG. 14 shows a package configuration in which two LED elements 7 forming a pair are mounted by a die bonding paste material 14 containing fine particulate white filler, and the light emission distribution in this configuration is shown in FIG. The results measured in the direction are shown in FIG.

  Comparing these, in this embodiment, as shown in FIGS. 14 and 15, it can be seen that substantially the same radiation angle distribution is obtained even when two paired LED elements 7 are mounted. Here, the LED element has a size of about 0.3 mm, and a distance of one element is closely arranged as an interval space, but the light emission distribution is hardly affected by the adjacent elements, and FIG. 12 and FIG. As shown in FIG. 13, since the radiation angle distribution is obtained when one LED element 7 is mounted, the optical distribution behaves as if it is a package light source mounted with one LED element.

  Based on the above, in the package configuration in which the paired RGB LED elements are mounted, a configuration for expanding the light emission distribution was designed. 16 (a) and 16 (b) show a package upper surface and a cross-section in which a concave-shaped transparent resin 15 for sealing the LED element 7 is formed with respect to a package configuration in which two LED elements 7 forming a pair are mounted. Show. In this package configuration, FIG. 17 shows an example of each radiation distribution measured by simultaneously emitting light from two LED elements 7 forming a pair. FIGS. 17A and 17B show the horizontal distribution and the vertical distribution in FIG. 16, respectively.

  In FIG. 16, the emitted light from the LED element 7 is reflected by the concave shape of the center line of the transparent resin 15, so that the light emission distribution of the LED element 7 has a predetermined inclination angle from the vertical direction with respect to the substrate 1. In addition, it has the maximum value of the emission intensity.

  As shown in FIGS. 17A and 17B, according to the result of the radiation angle distribution, the light emission distribution can be expanded in the horizontal direction, and the light emission distribution having a substantially constant intensity up to a specific angle in the vertical direction becomes possible. ing. This means that the shape of the radiation angle distribution can be adjusted according to the purpose, and it shows that the radiation angle distribution of the element can be made anisotropic.

  In each of the horizontal and vertical radiation distributions corresponding to FIGS. 17A and 17B, the radiation intensity can be drastically reduced at an angle of 70 degrees or more. The suppression of the radiation intensity at an angle of 70 or more is effective for adjusting the radiation intensity of the overlapping boundary region in consideration of the irradiation area of the adjacent package light source. In order to obtain a highly uniform luminance distribution and chromaticity distribution even in the irradiation area boundary region of the adjacent package light source, optical design that appropriately suppresses the radiation intensity on the high angle side is important. In the entire system of the illumination device and the liquid crystal backlight, it is possible to cope with the structural design of the periodic arrangement of the unit substrates and the optical design of the irradiation area boundary region of the adjacent package light source.

  Although the liquid crystal display device has a horizontally long screen, even if the size is changed by designing a periodic arrangement configuration of the unit substrate, for example, the uniformity is adjusted to the size of the display having a screen ratio of 16: 9. Optimal optical design of a high backlight is possible.

  With the shape resin 15 in FIG. 16, the radiation angle distribution having the peak intensity on the high angle side can be controlled in the lateral direction, and the angle indicating the peak intensity can be set to a predetermined value by adjusting the shape of the molded product. . Thereby, an arrangement configuration having a uniform luminance distribution can be realized in the light source of the integrated lighting device or liquid crystal backlight module.

  According to the present embodiment, an optimal LED light source can be provided for controlling the illumination area of the illumination device and the area of the liquid crystal backlight according to the purpose. Furthermore, the number of packages and the shape of the sealing resin can be set appropriately depending on the size of the illumination device and the liquid crystal display device, and the brightness and chromaticity can be made uniform throughout the package configuration. As a result, it is possible to obtain a light source for a lighting device or a liquid crystal backlight module with low power consumption by realizing uniform luminance and chromaticity with as few elements as possible. By applying the configuration of the optimal minimum number of elements and the optimal arrangement, it is effective for a cost reduction technique by reducing the number of packages and elements.

  The LED element package configuration of the present embodiment can be applied not only as a backlight module light source for illumination light source devices and liquid crystal display devices, but also as a liquid crystal panel for personal computers, a backlight light source for in-vehicle car navigation, and other in-vehicle light sources. .

  The present embodiment will be described with reference to FIGS. In this example, a package structure is produced in the same manner as in Example 1. In this example, a suitable amount of a die bonding material containing fine particulate white filler is coated and adhered as a mounting member, whereby the reflection of Example 1 is achieved. A package configuration in which the plate 3 is removed is realized. Thereby, cost reduction of a package structure can be achieved.

  FIG. 18 and FIG. 19 show examples of package configurations in which no reflector is mounted. 18 and 19, the die bonding material 14 containing fine particulate white filler is appropriately set on the substrate side wall of the LED element 7 to emit light downward or horizontally with respect to the substrate of the LED element 7. The light component to be controlled is suppressed, and the external light extraction in the upward direction of the LED element 7 is improved by high diffuse reflection. As a result, a package configuration without introducing a reflecting plate is possible, and by adjusting the length and height of the transparent resin 9, the radiation direction of the element indicated by the arrow in the figure can be defined to have a lens effect. It is possible to correspond to a package configuration in which the radiation angle distribution is controlled.

  Furthermore, in order to design a configuration that expands the light emission distribution, it is necessary to control the radiation angle distribution by mounting a concave-shaped transparent resin. 20 (a) and 20 (b) show a package configuration in which two LED elements 7 forming a pair are mounted, and a top surface and a cross section of a package in which a concave transparent resin 15 is mounted, omitting a reflector. Show. In FIG. 20, since the radiation distribution emitted upward of the LED element 7 is defined by the die bonding material 14 containing the fine white filler, it is possible to cope with a package configuration in which the reflector is removed.

  In the present embodiment, similarly to the first embodiment, it is possible to design a configuration in which the light emission distribution is expanded in a package configuration in which two LED elements paired in each RGB are mounted. With this package configuration, the shape of the radiation angle distribution can be adjusted according to the purpose, and the radiation angle distribution of the element can be made anisotropic.

  The liquid crystal display device has a horizontally long screen, and for example, an optical design suitable for a display having a screen ratio of 16: 9 is possible. 20 can control the radiation angle distribution having the peak intensity on the high angle side in the lateral direction, and the angle indicating the peak intensity can be set to a predetermined value by adjusting the shape of the molded product. . Thereby, an arrangement configuration having a uniform luminance distribution can be realized in the light source of the integrated lighting device or liquid crystal backlight module.

  FIG. 21 shows a diagram in which the package configuration 16 having the LED elements for each RGB is arranged on the unit substrate 10, and FIG. 22 shows the package configuration 17 having a pair of LED elements for each RGB arranged on the unit substrate 10. The figure is shown.

  As shown in FIG. 22, a light source for an illuminating device or a liquid crystal display device can be realized with a small number of package configurations by arranging a pair of LED elements for each RGB in one package. In addition, as shown in FIG. 21, the unit which mounts four packages 16 which mount the LED element for every RGB, as shown in FIG. 22, the package 17 which mounts the LED element which makes a pair for every RGB is shown. Since this corresponds to a case of mounting two, the number of packages can be reduced and the cost can be reduced.

  According to the present embodiment, an optimum LED light source module can be provided for controlling the illumination area of the illumination device and the area of the liquid crystal backlight according to the purpose.

  23 and 24 show a case where a package 19 having LED elements paired for each RGB is arranged on the liquid crystal backlight casing 18, and each has a square lattice arrangement and a triangular lattice arrangement. Indicates the case of an array. Each arrangement configuration can be properly used depending on the illumination light source and the irradiation area according to the intended application, and the optical distribution can be controlled in accordance with the irradiation area depending on the shape of the transparent resin.

  Furthermore, the number of packages and the shape of the sealing resin can be set appropriately depending on the size of the illumination device and the liquid crystal display device, and the brightness and chromaticity can be made uniform throughout the package configuration. As a result, it is possible to obtain a light source for a lighting device or a liquid crystal backlight module with low power consumption by realizing uniform luminance and chromaticity with as few elements as possible. By applying the configuration of the optimal minimum number of elements and the optimal arrangement, it is effective for cost reduction by reducing the number of packages and elements.

  In actual applications, the size and conditions of use of the liquid crystal panel are different, so appropriate design and configuration should be made so that the design of the radiation angle distribution corresponds to the mounting configuration of the element and the shape control of the sealing resin. The required backlight module light source specifications can be set to desired conditions.

  The LED element package configuration of the present embodiment can be applied not only as a backlight module light source for illumination light source devices and liquid crystal display devices, but also as a liquid crystal panel for personal computers, a backlight light source for in-vehicle car navigation, and other in-vehicle light sources. .

  A present Example is described using FIGS. 25-28. This embodiment is the same as the second embodiment, but as shown in FIG. 25, when a package configuration is mounted in which LED elements that are paired for each RGB are manufactured, the LED elements that are paired for each RGB are independent. Each LED element is connected to the wiring 2 so as to correspond to each other. FIG. 26 shows a cross section of a package on which a pair of LED elements for each RGB is mounted. The reflecting plate is removed, and a concave region of a concave-shaped transparent resin 15 is lined between the paired LED elements 7. Place them symmetrically. According to the present embodiment, an optimum LED light source module can be provided for controlling the illumination area of the illumination device and the area of the liquid crystal backlight according to the purpose.

  FIG. 27 and FIG. 28 show the case where a package 19 having LED elements paired for each RGB is arranged on the liquid crystal backlight casing 18, each having a square lattice arrangement and a triangular lattice arrangement. The case of a staggered arrangement is shown. Each has a configuration in which the optical distribution is controlled according to the shape of the transparent resin, depending on the purpose of use, depending on the illumination light source and the irradiation area.

  In this embodiment, as shown in FIG. 25, each LED element can be driven independently. Therefore, in FIGS. 27 and 28, the left irradiation area 20 and the right side correspond to the mounting elements in the package. The irradiation area 21 can be controlled independently. This is equivalent to covering the entire irradiation area with half the number of light source packages compared to the conventional case. For each unit package, the irradiation area is enlarged. It also leads to a method of effectively dividing the irradiation area for the video signal.

  The overlap area 22 of the irradiation area shown in FIGS. 27 and 28 is an area where the radiation intensity is relatively weak because it is located at the boundary with the adjacent package light source, so that the light intensity is mutually complemented. Designing. Based on this optical design, highly uniform luminance distribution and chromaticity distribution can be realized in the entire system of illumination light source and liquid crystal backlight light source.

  Furthermore, with respect to the size of the illuminating device or the liquid crystal display device, the number of packages and the shape of the sealing resin can be appropriately set, and the brightness and chromaticity can be made uniform throughout the package configuration. As a result, it is possible to obtain a light source for a lighting device or a liquid crystal backlight module with low power consumption by realizing uniform luminance and chromaticity with as few elements as possible. By applying the configuration of the optimal minimum number of elements and the optimal arrangement, it is effective for cost reduction by reducing the number of packages and elements.

  In actual applications, the size and conditions of use of the liquid crystal panel are different, so appropriate design and configuration should be made so that the design of the radiation angle distribution corresponds to the mounting configuration of the element and the shape control of the sealing resin. The required backlight module light source specifications can be set to desired conditions.

  The LED element package configuration of the present embodiment is not limited to the backlight module light source of the liquid crystal display device for lighting devices and small TVs to large TVs, as in the first and second embodiments. It can also be applied as a backlight light source for panels and in-vehicle car navigation, and other in-vehicle light sources.

  This embodiment will be described with reference to FIGS. 29 to 31. FIG. An illumination light source and a backlight light source are manufactured in the same manner as in the above embodiment, and in this embodiment, a liquid crystal display device is configured using the above package light source. As shown in FIG. 29, after mounting and mounting a pair of LED elements on a backlight module housing 18, an optical system for a liquid crystal panel such as an optical sheet is mounted, and the optical system and the liquid crystal panel are mounted. In addition, a liquid crystal display device is manufactured.

  In FIG. 29, the light beam 23 emitted from the backlight module light source passes through the diffusion plate 24, the regular prism sheet 25, the polarization reflection sheet 26, and the liquid crystal display panel.

  The liquid crystal panel includes a pair of glass substrates, a liquid crystal layer 28 disposed between the pair of glass substrates, and a lower polarizing plate 27 and an upper polarizing plate 29 provided on each of the pair of glass substrates. Although omitted in FIG. 29, the liquid crystal display panel includes a plurality of scanning lines arranged in a direction transverse to the display surface and a direction orthogonal to the plurality of scanning lines, that is, the display surface. A plurality of signal lines arranged in the vertical direction and a plurality of switching elements arranged at intersections of the plurality of scanning lines and the plurality of signal lines are included. At this time, the uniformity of the luminance distribution and chromaticity distribution as the backlight module light source can be improved by controlling the radiation angle distribution according to the distance between the package light source and the diffusion plate.

  Not only can it be applied as a liquid crystal display device or a backlight module for medium to large televisions, but it can also be applied as a backlight module for small to medium-sized areas. In particular, when configuring a backlight module for a liquid crystal display panel having a relatively large ratio of length to length for a horizontally long screen, there is an advantage that it can be fully designed. A backlight light source can be configured with a minimum number of LED packages.

  FIG. 30 shows the configuration of the LED backlight light source housing module 30, the drive circuit 31, and the large liquid crystal display panel 32. FIG. 31 shows a liquid crystal display device for in-vehicle car navigation, which includes a liquid crystal display panel 33 including a backlight module and an optical system, circuit wiring 34, and a drive circuit 35.

  According to this embodiment, even if the size of the liquid crystal display device is reduced, the required luminance distribution and chromaticity distribution can be ensured by causing the backlight module having a controlled radiation angle distribution to function.

Top view of the configuration of the RGGB package light source in the comparative example Top view of configuration of RGB package light source in comparative example The top view of the structure of the RGGB package light source of the serial arrangement | sequence in Example 1. FIG. The top view of the structure of the RGB package light source of the serial arrangement | sequence in Example 1 The top view of the structure of the RGGB package light source of the parallel arrangement | sequence in Example 1. FIG. The top view of the structure of the RGB package light source of the parallel arrangement in Example 1 Top view of the unit board on which the package configuration in the comparative example is mounted Top view of a unit board on which the package configuration in the embodiment is mounted Sectional drawing of composition of package mounting member in comparative example Sectional drawing of the structure of the package mounting member in Example 1 Luminous flux vs. current characteristics and luminous efficiency vs. current characteristics Sectional drawing of the package structure which mounts one LED element in a comparative example Fig. 12 is a distribution diagram of the radial radiation angle of the package configuration shown in Fig. 12. Sectional drawing of the package structure of the LED element mounting which makes a pair in Example 1 FIG. 14 is a diagram showing the distribution of lateral radiation angles in the package configuration shown in FIG. The top view and sectional drawing of a structure of the reflector integrated package light source in Example 1 Horizontal direction radiation angle distribution diagram and longitudinal direction radiation angle distribution diagram of the package configuration shown in FIG. Cross-sectional view of the configuration of the transparent resin and light emission in the package configuration of Example 2 Cross-sectional view of the configuration of the transparent resin and light emission in the package configuration of Example 2 The top view and sectional drawing of the structure of the reflector removal type package light source in Example 2 Top view of the configuration of a unit light source mounting a package light source mounting LED elements for each RGB Top view of the configuration of a unit light source equipped with a package light source equipped with a pair of LED elements for each RGB The top view of the structure of the backlight module light source which arrange | positions the package light source in Example 2. FIG. The top view of the structure of the backlight module light source which arrange | positions the package light source in Example 2. FIG. Sectional drawing of the wiring structure in the package light source of Example 3 Sectional drawing of the structure of the reflector removal type package light source in Example 3 The top view of the structure of the backlight module light source which arrange | positions the package light source in Example 3 The top view of the structure of the backlight module light source which arrange | positions the package light source in Example 3 Sectional drawing of package light source backlight module configuration and optical film and liquid crystal panel configuration in Example 4 Configuration diagram of a large-sized liquid crystal display device mounting the package light source backlight module configuration in Example 3 Configuration diagram of medium- and small-sized liquid crystal display device mounted with package light source backlight module configuration in Example 3

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Board | substrate, 2 ... Wiring, 3 ... Reflection board, 4 ... Red LED element, 5 ... Green LED element, 6 ... Green LED element, 7 ... Blue LED element, 8 ... Au wire, 9 ... Transparent resin, 10 ... Unit Substrate, 11 ... package light source, 12 ... package light source, 13 ... silver paste die bonding material, 14 ... particulate white filler die bonding material, 15 ... concave transparent resin, 16 ... package light source, 17 ... package light source, 18 ... back Light module housing, 19 ... package light source, 20 ... left side radiation distribution light irradiation region, 21 ... right side radiation distribution light irradiation region, 22 ... boundary region of left and right side radiation distribution light irradiation, 23 ... light beam, 24 ... diffuser plate, 25 ... Positive prism sheet, 26 ... Polarized reflection sheet, 27 ... Lower polarizing plate, 28 ... Liquid crystal layer, 29 ... Upper polarizing plate, 30 ... Backlight housing, 31 ... Drive time , 32 ... large-size liquid crystal display panel, 33 ... Small-type liquid crystal display panel, 34 ... circuit wiring, 35 ... drive circuit

Claims (13)

  A substrate, a wiring arranged on the substrate, an LED element connected to the wiring, and a transparent resin encapsulating the LED element, and the LED element connected to the wiring is connected to the wiring And a pair of LED elements of the same color that are paired with each other are mounted.   The lighting device according to claim 1, wherein the LED elements of the same color are a red LED element, a green LED element, or a blue LED element forming a pair.   2. The illumination device according to claim 1, wherein the LED elements of the same color are mounted by integrating a pair of red LED elements, green LED elements, and blue LED elements.   2. The lighting device according to claim 1, wherein the LED elements of the same color are mounted in series symmetrically with respect to the wiring.   The lighting device according to claim 1, wherein the LED elements of the same color are mounted in parallel in line symmetry with respect to the wiring.   The lighting device according to claim 1, wherein the LED elements of the same color are driven independently with line symmetry with respect to the wiring.   A substrate, a wiring disposed on the substrate, an LED element connected to the wiring, and a transparent resin that seals the LED element, the transparent resin having a concave shape on the upper side; The illumination device characterized in that the position of the tip of the concave shape has a resin shape arranged corresponding to a line symmetric with respect to a pair of LED elements on the wiring.   8. The illumination device according to claim 7, wherein the concave shape of the transparent resin reflects the emitted light from the LED element, so that the light emission distribution of the LED element has a predetermined inclination angle from a direction perpendicular to the substrate. Lighting device characterized by having a maximum value of emission intensity in the direction   2. The lighting device according to claim 1, wherein the LED element of the same color is mounted on the wiring by a die bonding paste material containing white particles, and the white particles are mainly formed by diffuse reflection. Illumination device characterized in that it is constituted by a material to be produced   10. The lighting device according to claim 9, wherein the white particles are made of ceramic particles having a submicron size.   10. The lighting device according to claim 9, wherein the die bonding paste material covers a side wall of the LED element in a fillet shape and covers a height of 1/4 to 1/2 of the side wall. The illumination device is characterized in that the emission intensity emitted upward in the emission distribution of the lamp is relatively large   10. The illumination device according to claim 9, wherein the reflector in the package is removed by introducing a die bonding paste material containing white particles exhibiting diffuse reflection.   A substrate, a wiring arranged on the substrate, a pair of LED elements of the same color connected on the wiring by a die bonding paste material containing white particles, and a recess for sealing the LED elements of the same color forming the pair LIQUID CRYSTAL DISPLAY DEVICE HAVING A LIGHTING DEVICE COMPRISING A SHAPE RESIN RESIN