CN205542882U - Encapsulation body of LED - Google Patents
Encapsulation body of LED Download PDFInfo
- Publication number
- CN205542882U CN205542882U CN201620261736.9U CN201620261736U CN205542882U CN 205542882 U CN205542882 U CN 205542882U CN 201620261736 U CN201620261736 U CN 201620261736U CN 205542882 U CN205542882 U CN 205542882U
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- light
- emitting diode
- diode chip
- backlight unit
- substrate
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Abstract
The utility model relates to an encapsulation body of LED, include: the base plate, paste adorn in more than one emitting diode chip on the base plate, the fluorophor board, its dispose in it is on the more than one emitting diode chip, right the luminous light of more than one emitting diode chip carries out the wavelength transform, and wall portion, its dispose in on the base plate, surround the more than one emitting diode chip, the fluorophor board covers whole the higher authority of more than one emitting diode chip, the width of fluorophor board is greater than the width of more than one emitting diode chip. According to the utility model discloses, because the width of fluorophor board is greater than the emitting diode chip, therefore the luminous light of emitting diode chip can all release to the outside through the fluorophor board, has the effect of the colour difference of the light that can prevent encapsulation body of LED release.
Description
Technical field
This utility model relates to LED encapsulation body, more specifically, relates to one and does not discharges
LED encapsulation body to the aberration of outside light.
Background technology
The inorganic semiconductor element of the light that light emitting diode occurs because of electronics and hole-recombination as release,
The most just use in various field of display device, auto lamp or even general lighting.This luminous two
Pole pipe has that life-span length, power consumption be low, the advantage of fast response time.Therefore, sending out of light emitting diode is utilized
Electro-optical device is expected to substitute original light source.
Utilize the light-emitting diode chip for backlight unit of light emitting diode, be divided into horizontal type according to electrode position and structure
Light-emitting diode chip for backlight unit, flip chip type light-emitting diode chip for backlight unit and vertical-type light-emitting diode chip for backlight unit, its
In, flip chip type light-emitting diode chip for backlight unit is positioned at bottom due to electrode, thus has and can directly mount
The advantage used on substrate.Further, flip chip type light-emitting diode chip for backlight unit is in the horizontal direction
Fully there is current dissipation, there is the advantage that radiating efficiency is good, be widely used in lighting device with high power.
And, in order to utilize light-emitting diode chip for backlight unit as above, it is used for discharging white light or other ripple
The light-emitting device of long light, can be configured with fluorophor in portion on the led chips.Now, in the past
Mainly use phosphor coated in light-emitting diode chip for backlight unit top, or surrounding light-emitting diode chip for backlight unit
The method of the resin comprising fluorophor is injected in the inside of reflector.
, formed in light-emitting diode chip for backlight unit top comprising the resin-coated of fluorophor as mentioned above
Situation, due to fluorophor precipitation etc. during hardening of resin, fluorophor uniformly cannot divide in resin
Cloth.Therefore, when the luminous light excited fluophor of light-emitting diode chip for backlight unit and when being discharged into outside, it may appear that
The problem that the high region of proportion of fluorophor and low interregional aberration occur.
Utility model content
Technical problem
Problem to be solved in the utility model is to provide a kind of LED encapsulation body, works as light emitting diode
When the light that chip occurs is excited by fluorophor, it is possible to aberration does not occur.
Technical scheme
This utility model provides a kind of LED encapsulation body, including: substrate；It is mounted on described substrate
On more than one light-emitting diode chip for backlight unit；Fluorophor plate, it is configured at the luminescence of more than one
On diode chip for backlight unit, the light that light-emitting diode chip for backlight unit more than one is luminous is carried out wavelength conversion；
And wall portion, it is configured on described substrate, surrounds the light-emitting diode chip for backlight unit of more than one；Described
Fluorophor plate cover light-emitting diode chip for backlight unit more than one whole above, described fluorophor plate
Width is more than the width of light-emitting diode chip for backlight unit more than one.
Technique effect
According to this utility model, owing to the width of fluorophor plate is more than light-emitting diode chip for backlight unit, thus luminous
The light of diode chip for backlight unit luminescence all can be discharged into outside by fluorophor plate, has and is prevented from occurring
The effect of the aberration of the light of LED encapsulation body release.
Further, the fluorophor plate in the attachment of the top of light-emitting diode chip for backlight unit is more than light-emitting diodes tube core
Sheet width ground formed, when fluorophor plate being mounted on the top of light-emitting diode chip for backlight unit, though have with
The alignment of light-emitting diode chip for backlight unit is inaccurate, and the light of lumination of light emitting diode also is able to be released by fluorophor plate
It is put into the effect of outside.
It addition, along with fluorophor plate more than light-emitting diode chip for backlight unit formed, with surround light emitting diode
Forming space between the wall portion of chip, the light of light-emitting diode chip for backlight unit release reflects in wall portion, to luminous two
Pole die upper direction reflection, thus there is the effect of the light efficiency that can improve LED encapsulation body
Really.
Accompanying drawing explanation
Fig. 1 is the axonometric chart of the LED encapsulation body of diagram one embodiment of this utility model；
Fig. 2 is the profile of the LED encapsulation body of diagram one embodiment of this utility model；
Fig. 3 be the LED encapsulation body for one embodiment of this utility model is described fluorophor
Plate is mounted on the figure of the situation of light-emitting diode chip for backlight unit.
Description of reference numerals
100: LED encapsulation body 110: substrate
111: substrate 112: the first goes between
113: the second lead-in wires 114: first substrate pad
115: second substrate pad 116: the first through hole
117: the second through holes 118: cooling pad
120: light-emitting diode chip for backlight unit 130: fluorophor plate
140: wall portion 140a: reflecting surface
150: lens 152: plate portion
154: circular top part G: gap
A: snap point
Detailed description of the invention
The LED encapsulation body of one embodiment of this utility model may include that substrate；It is mounted on institute
State the more than one light-emitting diode chip for backlight unit on substrate；Fluorophor plate, it is configured at more than one
Light-emitting diode chip for backlight unit on, the light that light-emitting diode chip for backlight unit more than one is luminous is carried out wavelength
Conversion；And wall portion, it is configured on described substrate, surrounds the light-emitting diode chip for backlight unit of more than one；
Described fluorophor plate can cover the above entirety of the light-emitting diode chip for backlight unit of more than one, described glimmering
The width of body of light plate can be more than the width of light-emitting diode chip for backlight unit more than one.
Now, in the side of the light-emitting diode chip for backlight unit that described wall portion can cover more than one at least
A part for one.
It addition, described wall portion can cover a part at least one in described fluorophor plate side, described
Wall portion can cover a part at least one in the side of described light-emitting diode chip for backlight unit so that forms quilt
The gap that described fluorophor plate, light-emitting diode chip for backlight unit and wall portion surround.Now, described gap can be wrapped
Enclose at least some of of described light-emitting diode chip for backlight unit outer peripheral face.
Wherein, the medial surface in the wall portion surrounding described gap can be reflecting surface, and described reflecting surface can be with
The shape protruded to described light-emitting diode chip for backlight unit direction is formed.
It addition, described fluorophor plate can comprise more than one fluorophor.
And, the center of described fluorophor plate can be consistent with the center of described light-emitting diode chip for backlight unit, or
Described in person, the center of described light-emitting diode chip for backlight unit can be deviateed in the center of fluorophor plate.
It addition, described substrate can include the snap point for arranging described fluorophor plate.
And, described substrate may include that substrate；First lead-in wire and the second lead-in wire, it is in described substrate
Formed above, electrically connect with light-emitting diode chip for backlight unit more than one；And first substrate pad and second
Substrate pad, it is formed below in described substrate, electrically connects with described first lead-in wire and the second lead-in wire respectively.
Now, described substrate can also include the first through hole and the second through hole, described first through hole and second
The through described substrate of through hole, make described first lead-in wire and the second lead-in wire respectively with described first substrate pad and the
Two substrate pad electrical connections；Can also include described light-emitting diode chip for backlight unit is occurred below described substrate
Heat carries out the cooling pad dispelled the heat.
Furthermore it is possible to also include lens, described lens portion on the substrate covers described light emitting diode
Chip, makes the light injection that described light-emitting diode chip for backlight unit is luminous, and described lens may include that plate portion, its
Cover described light-emitting diode chip for backlight unit；And circular top part, it is formed on top, described plate portion, makes described luminescence
The light of diode chip for backlight unit luminescence injects to outside.Now, the width in described wall portion can be more than described dome
The width in portion.
Referring to the drawings, preferred embodiment of the present utility model is more particularly described.
Fig. 1 is the axonometric chart of the LED encapsulation body of diagram one embodiment of this utility model, Fig. 2
It it is the profile of the LED encapsulation body of diagram one embodiment of this utility model.
As shown in Figures 1 and 2, the LED encapsulation body 100 of one embodiment of this utility model wraps
Include substrate 110, light-emitting diode chip for backlight unit 120, fluorophor plate 130, wall portion 140 and lens 150.
Substrate 110 is available for light-emitting diode chip for backlight unit 120 and is mounted on top, in order to the electricity supplied from outside
Source passes to light-emitting diode chip for backlight unit 120 and is equipped with.Alternatively, it is also possible to light-emitting diode chip for backlight unit 120
The heat occurred is dispelled the heat.To this end, substrate 110 includes substrate the 111, first lead-in wire 112 and the second lead-in wire
113, first substrate pad 114 and second substrate pad the 115, first through hole 116 and the second through hole 117 and
Cooling pad 118.
Substrate 111 can with include polymer material or ceramic masses insulating properties material formed, or with
Conductive material including metal etc. is formed.The shape of substrate 111 is as it can be seen, to have given thickness
Plate shape formed, be formed with the first lead-in wire 112 and the second lead-in wire 113 in upper side, as upper side
The bottom surfaces at the back side, could be formed with first substrate pad 114 and second substrate pad 115 and cooling pad 11
8。
First lead-in wire 112 and the second lead-in wire 113 are configured at substrate 111 upper side, can be so that mutually
The state configuration separated electric insulation.And, the first lead-in wire 112 and the second lead-in wire 113 can be with luminescences
Diode chip for backlight unit 120 electrically connects, and therefore, the first lead-in wire 112 and the second lead-in wire 113 can include respectively
The conductive material of metal etc..
First substrate pad 114 and second substrate pad 115 are configured at substrate 111 bottom surfaces, can so that
The state configuration separated electrically insulated from one another.Now, first substrate pad 114 and second substrate pad 115 can
To be different from the first lead-in wire 112 and the second lead-in wire 113, all bottom surfaces in substrate 111 are not formed, and
With the amesiality and state of opposite side, formed while there is given area.In the present embodiment, the first base
Plate pad 114 and second substrate pad 115 can be with adjacent substrate 111 bottom surfaces formed with quadrilateral shape
The state on two limits in opposite directions, the length direction along two limits is formed with having certain length.Now,
One substrate pad 114 and the shape of second substrate pad 115 and position can be different according to the shape of outside terminal.
First through hole 116 and the second through hole 117 can be distinguished through substrate 111 ground and be formed, the first through hole 1
16 electrical connection the first lead-in wire 112 and first substrate pads 114, the second through hole 117 electrically connects the second lead-in wire 11
3 with second substrate pad 115.Wherein, the first through hole 116 and the second through hole 117 can be gone between by with first
112 and second lead-in wire 113 or first substrate pad 114 and the identical conductive material shape of second substrate pad 115
Become.
And, region between first substrate pad 114 and second substrate pad 115 separate, can configure
There is cooling pad 118.Cooling pad 118 can so that with first substrate pad 114 and second substrate pad 115
The state separated, to contact the state configuration of substrate 111 bottom surfaces electric insulation.Therefore, cooling pad 11
8 regions that can be configured at the bottom surfaces central authorities including substrate 111.
That is, cooling pad 118 can be configured at corresponding with the upper position of light-emitting diode chip for backlight unit 120 attachment
Bottom surfaces.It addition, cooling pad 118 can have the area more than light-emitting diode chip for backlight unit 120.Cause
This, it is possible to the heat making light-emitting diode chip for backlight unit 120 occur is promptly released into outside, it is possible to make light-emitting diodes
The impact of fluorophor plate 130 is realized minimizing by the heat that die 120 occurs.
In an embodiment of the present utility model, it it is the situation that substrate 111 is formed with insulating properties material
Illustrate, thus to the first lead-in wire 112 and the second lead-in wire 113 and first substrate pad 114 and the second base
Plate pad 115 directly contacts the upper side of substrate 111 and the situation of bottom surfaces illustrates.But, base is worked as
When the end 111, is formed with conductive material, first lead-in wire 112 and second lead-in wire 113 with substrate 111 it
Between, and between first substrate pad 114 and second substrate pad 115 and substrate 111, can get involved respectively
There is insulating barrier.
Light-emitting diode chip for backlight unit 120 is mounted on substrate 110 top, with the first lead-in wire 112 and the second lead-in wire 1
13 mount the most in electrical contact.And, in the present embodiment, light-emitting diode chip for backlight unit 120 can discharge
Blue light or ultraviolet, illustrate one light-emitting diode chip for backlight unit 12 of attachment on substrate 110 in the accompanying drawings
The situation of 0, but as required, multiple light-emitting diode chip for backlight unit 120 can be mounted.
In the present embodiment, light-emitting diode chip for backlight unit 120 includes n-type semiconductor layer and p-type semiconductor layer,
There is the power supply by means of supply, the structure of light can be discharged because of hole and being combined of electronics.To this end,
Active layer can be got involved between n-type semiconductor layer and p-type semiconductor layer.There is sending out of this structure
Luminous diode chip 120 can have the structures such as horizontal type, vertical-type or flip chip type, in this enforcement
In example, the situation utilizing flip chip type light-emitting diode chip for backlight unit 120 is illustrated.
And, in the present embodiment, although illustrate the most separately, but light-emitting diode chip for backlight unit 120 times
Face, portion, can form the first electrode for making electrical contact with respectively with the first lead-in wire 112 and the second lead-in wire 113
Pad and the second electronic pads.Therefore, the first electronic pads can be with the first lead-in wire 112 electrical contact, the second electrode
Pad can be with the second lead-in wire 113 electrical contact.That is, light-emitting diode chip for backlight unit 120 can direct face-down bonding
In the first lead-in wire 112 and the second lead-in wire 113 of substrate 110, or by means of SMT (surface mount
Technology, surface mounting technology) and electrically connect.
Light-emitting diode chip for backlight unit 120 can be mounted on the commitment positions of substrate 110 upper side, in this enforcement
In example, the situation of the central authorities that a light-emitting diode chip for backlight unit 120 is mounted on substrate 110 upper side is carried out
Explanation.Light-emitting diode chip for backlight unit 120 is so mounted on substrate 110 top, in the bottom surfaces of substrate 110
Cooling pad 118 can be configured with.Therefore, the heat that light-emitting diode chip for backlight unit 120 occurs can pass through substrate 1
10 are directly delivered to cooling pad 118, it is possible to increase LED encapsulation body 100 of the present utility model
Radiating efficiency.
Fluorophor plate 130 includes multiple fluorophor and resin.For multiple fluorophor, at fluorophor plate
Can comprise in the fluorophor of various kind in 130 more than one, as an example, can be stone
Garnet fluorophor, chlorate MClO 3 fluorescent substance, sulphide phosphor, oxonitride phosphor, nitride fluorescent
Body, fluoride phosphor and silicate phosphor etc..Furthermore, it is possible to by means of as above multiple glimmering
Body of light carries out wavelength conversion, and the light of light-emitting diode chip for backlight unit 120 luminescence is transformed into monochromatic light or white light.
Resin plays the effect of the supporting part of the most fluorophor of carrying, in the present embodiment, uses resin
The situation making supporting part is illustrated, but can utilize the material of such as glass or pottery, for resin
In the case of, it is also possible to utilize fluoropolymer resin.It addition, in the present embodiment, fluorophor plate 130 can
To be fabricated to the plate shape of both sizings when transparent resin is with the stirring of most fluorophor and to make
With.
Now, fluorophor plate 130 can include glass, and now, most fluorophor is permissible with bead
It is mutually mixed and condenses hardening.Along with so utilizing glass manufacture fluorophor plate 130, thus fluorophor plate 1
The most fluorophor comprised in 30 can be uniformly distributed in fluorophor plate 130.
It addition, in the present embodiment, light-emitting diode chip for backlight unit 120 when being mounted on substrate 110,
Being surrounded by wall portion 140 described later, the light-emitting diode chip for backlight unit 120 accordingly, as pyrotoxin can have
Airtight structure.Now, in the case of high electric current accesses light-emitting diode chip for backlight unit 120, in order to prevent
Because the heating in light-emitting diode chip for backlight unit 120 causes fluorophor plate 130 to deform, it is possible to use thermostability is good
Good glass manufacture fluorophor plate 130.
I.e., in the present embodiment, after fluorophor plate 130 is not coated with on light-emitting diode chip for backlight unit 120
Hardening is formed, but can make use separately.Now, in order to fluorophor plate 130 is configured at luminescence
On diode chip for backlight unit 120, it is possible to use other adhesive member.Adhesive member most seems fluorophor plate 13
0 equally utilizes the material that thermostability is outstanding.
And, in the present embodiment, fluorophor plate 130 can be formed to have more than light-emitting diodes tube core
The width of sheet 120 width.Detailed description related to this will be described later.
Fluorophor plate 130, when being formed with being so more than light-emitting diode chip for backlight unit 120 width, pastes
It is loaded on light-emitting diode chip for backlight unit 120.
Wall portion 140 is formed to surround and has mounted the light-emitting diode chip for backlight unit 120 of fluorophor plate 130 and covered
Substrate 110 top.Wall portion 140 can be formed with opaque silicon etc., in the present embodiment, and can be with
White is formed.Formed laterally it addition, wall portion 140 surrounds light-emitting diode chip for backlight unit 120, thus permissible
Including can the granule of light of Refl-Luminous diode chip for backlight unit 120 release.
Now, wall portion 140 is in order to prevent the fluorophor plate 130 of attachment on light-emitting diode chip for backlight unit 120
Separate from light-emitting diode chip for backlight unit 120, can form to surround the side part to fluorophor plate 130.
That is, wall portion 140 can when fluorophor plate 130 is mounted on light-emitting diode chip for backlight unit 120 shape
Become.
Wherein, the shape that the width at fluorophor plate 130 is formed with being more than light-emitting diode chip for backlight unit 120 width
During forming wall portion 140 under state, in fluorophor plate 130, light-emitting diode chip for backlight unit 120 and wall portion 1
Clearance G (gap) can be formed between 40.Clearance G is as in figure 2 it is shown, be mounted at fluorophor plate 130
Under the state on light-emitting diode chip for backlight unit 120 top, can be outside beyond light-emitting diode chip for backlight unit 120
The bottom of fluorophor plate 130 is formed.That is, wall portion 140 forms to include a part for fluorophor plate 130
Including, surround the side of light-emitting diode chip for backlight unit 120, wall portion 140 is not filled to fluorophor plate 130
The boundary line connected with light-emitting diode chip for backlight unit 120, thus clearance G can be formed.Therefore, clearance G can
With to surround the formation of light-emitting diode chip for backlight unit 120 outer peripheral face at least one of shape.
Between so being formed between fluorophor plate 130, light-emitting diode chip for backlight unit 120 and wall portion 140
Gap G, the light of light-emitting diode chip for backlight unit 120 luminescence can be discharged in the side of light-emitting diode chip for backlight unit 120
The clearance G that side, face is formed, the light being discharged into clearance G reflects in wall portion 140, can be to fluorophor plate 13
0 side (that is, the top of LED encapsulation body 100) direction is reflected.That is, the wall of clearance G is surrounded
The face in portion 140 can be reflecting surface 140a.
It addition, clearance G is formed to surround at least some of, just of light-emitting diode chip for backlight unit 120 outer peripheral face
As previously described, clearance G is formed with empty space, thus light is from light-emitting diode chip for backlight unit 120
While clearance G side discharges, can reflect along with media variations simultaneously.Accordingly, because refractive index
Difference, can improve the power of light at reflecting surface 140a.
Further, for fluorophor plate 130 being bonded in the adhesive member of light-emitting diode chip for backlight unit 120
Utilize transparent material, thus by means of adhesive member refractive index and with the refractive index of clearance G, Ke Yiti
The power of the high light in reflecting surface 140a reflection.
Wherein, the shape of clearance G is formed along with the formation in wall portion 140, is covering according to wall portion 140
The degree of light-emitting diode chip for backlight unit 120 side is surrounded under the state of a fluorophor plate 130 side part,
The size of gap G and shape can differences.Reflecting surface 140a as the face in the wall portion 140 surrounding clearance G
As in figure 2 it is shown, can be formed with the shape protruded to light-emitting diode chip for backlight unit 120 direction.Certainly, exist
In the present embodiment, although illustrate reflecting surface 140a and formed with the shape protruded, but reflecting surface 140a
Shape can deform as desired.
As an example, when the LED encapsulation body 100 applying the present embodiment in headlight for vehicles
Time, headlight for vehicles manufactures according to about joining photodistributed regulation, thus LED encapsulation body 100
It is also required to manufacture accordingly.The LED encapsulation body 100 of the present embodiment as above-mentioned description,
Formed the side of light-emitting diode chip for backlight unit 120 is surrounded by wall portion 140, clearance G surrounds light emitting diode
Chip 120 outer peripheral face, thus the light of light-emitting diode chip for backlight unit 120 luminescence can only be to light-emitting diode chip for backlight unit
The top release of 120.Therefore, as shown in this embodiment, the light of LED encapsulation body 100 luminescence
Only discharge to top, it is thus possible to be conducive to design optical element so that the luminous intensity distribution meeting headlight for vehicles divides
Cloth specifies.
Lens 150 can be formed on the top of substrate 110.The shape of lens 150 can be as desired
Being formed with various shape, in the present embodiment, lens 150 may include that plate portion 152, and it is with tool
The quadrilateral shape with substrate 110 same widths is had to be formed；Circular top part 154, it is on top, plate portion 152,
As domed shape, for forming the shape of a part for ball.Therefore, lens 150 can be formed
Cover the fluorophor plate 130 and wall portion 140 formed on the top of substrate 110.
Now, the circular top part 154 of lens 150 can only be formed on fluorophor plate 130 top, according to need
, the width of circular top part 154 can be formed more than fluorophor plate 130 width ground.Plate portion 152 can cover
Lid substrate 110 is formed universally, but in the present embodiment, plate portion 152 can also form to obtain covering wall portion
The top part of 140, described wall portion 140 is formed to cover substrate 110 top.
Therefore, light-emitting diode chip for backlight unit 120, by the light of fluorophor plate 130 release, can pass through dome
The exit facet in portion 154 and major part is discharged into outside, but according to circumstances, have from circular top part 154 outgoing
The inner reflection in face is to the light of substrate 110 side.In order to make the light so reflected again reflex to circular top part 15
The exit facet side of 4, wall portion 140 can cover substrate 110 and be formed universally.Now, wall portion 140 is i.e.
Make not cover substrate 110 to be formed universally, it is also possible to formed more than circular top part 154 width, from wall portion
140 light reflected again can inject to outside by circular top part 154.Or, wall portion 140 can also be big
Being formed in ground, plate portion 152, wall portion 140 is exposed to the outside of plate 152.
Wherein, lens 150 include plate portion 152 and circular top part 154 may be integrally formed.
Fig. 3 be the LED encapsulation body for one embodiment of this utility model is described fluorophor
Plate is mounted on the figure of the situation of light-emitting diode chip for backlight unit.
In the present embodiment, LED encapsulation body 100 is as above-mentioned description, luminous two
Under the state that pole die 120 is mounted on substrate 110 top, fluorophor plate 130 can be mounted on luminescence
The top of diode chip for backlight unit 120.Now, fluorophor plate 130 answers covering luminousing diode chip 120 complete
Body ground is formed.
Therefore, when the fluorophor plate 130 made separately is mounted on light-emitting diode chip for backlight unit 120 top,
If fluorophor plate 130 and light-emitting diode chip for backlight unit 120 have identical width, then it is necessary fluorescence
Body plate 130 is arranged in light-emitting diode chip for backlight unit 120 top exactly and mounts.But, due to glimmering
Body of light plate 130 precise arrangement carries out attachment in light-emitting diode chip for backlight unit 120 top and is not easy to, thus glimmering
The width of body of light plate 130 is necessary to be formed more than light-emitting diode chip for backlight unit 120 width.
Therefore, shown in (a) of fluorescent screen such as Fig. 3, can be with the snap point A formed on substrate 110
On the basis of, it is mounted on light-emitting diode chip for backlight unit 120 top.Now, paste at light-emitting diode chip for backlight unit 120
Under the state of the tram being loaded on substrate 110, if attachment fluorophor plate 130, then such as (b) of Fig. 3
Shown in, can be configured that light-emitting diode chip for backlight unit 120 is consistent with the center of fluorophor plate 130.
, even if light-emitting diode chip for backlight unit 120 is not mounted on the tram of substrate 110, but slightly
Mounting with slightly staggering, as shown in (c) of Fig. 3, fluorophor plate 130 can also cover light-emitting diodes tube core
Sheet 120 mounts universally.At this point it is possible to in light-emitting diode chip for backlight unit 120 and fluorophor plate 130
The state configuration that the heart is inconsistent.Even if it addition, being mounted on tram at light-emitting diode chip for backlight unit 120
In the case of, if fluorophor plate 130 is not mounted on tram, then, light-emitting diode chip for backlight unit 120
Also can be inconsistent with the center of fluorophor plate 130.While it is true, fluorophor plate 130 is more than light-emitting diodes
Die 120 ground is formed, and can mount universally with covering luminousing diode chip 120.
Wherein, fluorophor plate 130 is not by the size for LED encapsulation body 100 independently
Make one, but the fluorophor plate 130 relatively largely made can be blocked and manufacture.Therefore,
The width of the fluorophor plate 130 blocked can occur set tolerance.It addition, with regard to light-emitting diode chip for backlight unit 12
For 0, owing to there is set tolerance, width may not be fixed.Therefore, as it has been described above, fluorescence
The width of the width ratio light-emitting diode chip for backlight unit 120 of body plate 130 relatively largely makes, so that glimmering
The above entirety of body of light plate 130 covering luminousing diode chip 120.Therefore, it is possible to prevent light-emitting diodes
The light of die 120 luminescence is discharged into outside with the state without fluorophor plate 130.
It addition, above to when first light-emitting diode chip for backlight unit 120 is mounted on substrate 110, glimmering
Body of light plate 130 is configured at the situation on light-emitting diode chip for backlight unit 120 top and is illustrated, but at fluorophor
Under the state that plate 130 is configured at light-emitting diode chip for backlight unit 120 top, light-emitting diode chip for backlight unit 120 also may be used
To be mounted on substrate 110.This is because, manufacturing process can be according to the luminescence two manufacturing the present embodiment
The operation of pole pipe packaging body 100 and different.
As description above, according to have references to the embodiment of accompanying drawing, carry out this utility model
Illustrate, but described embodiment is simply enumerated preferred exemplary of the present utility model and is illustrated, thus
Must not be interpreted as that this utility model is confined to described embodiment, interest field of the present utility model is interpreted as
Technical scheme and the concept of equivalence thereof.
Claims (17)
1. a LED encapsulation body, it is characterised in that including:
Substrate；
The more than one light-emitting diode chip for backlight unit being mounted on described substrate；
Fluorophor plate, it is configured on the light-emitting diode chip for backlight unit of more than one, to one
The light of above light-emitting diode chip for backlight unit luminescence carries out wavelength conversion；And
Wall portion, it is configured on described substrate, surrounds the light-emitting diode chip for backlight unit of more than one；
Described fluorophor plate cover light-emitting diode chip for backlight unit more than one whole above,
The width of described fluorophor plate is more than the width of light-emitting diode chip for backlight unit more than one.
LED encapsulation body the most according to claim 1, it is characterised in that:
At least one in the side of the light-emitting diode chip for backlight unit that described wall portion covers more than one
A part.
LED encapsulation body the most according to claim 1, it is characterised in that:
A part at least one in the side of the described fluorophor plate of described wall portion covering.
LED encapsulation body the most according to claim 3, it is characterised in that:
In the side of the described light-emitting diode chip for backlight unit of described wall portion covering, a part at least one makes
Form the gap surrounded by described fluorophor plate, light-emitting diode chip for backlight unit and wall portion.
LED encapsulation body the most according to claim 4, it is characterised in that:
Described gap surrounds at least some of of the outer peripheral face of described light-emitting diode chip for backlight unit.
LED encapsulation body the most according to claim 4, it is characterised in that:
The medial surface in the wall portion surrounding described gap is reflecting surface.
LED encapsulation body the most according to claim 6, it is characterised in that:
Described reflecting surface has the shape protruded to the direction of described light-emitting diode chip for backlight unit.
LED encapsulation body the most according to claim 1, it is characterised in that:
Described fluorophor plate comprises more than one fluorophor.
LED encapsulation body the most according to claim 1, it is characterised in that:
The center of described fluorophor plate is consistent with the center of described light-emitting diode chip for backlight unit.
LED encapsulation body the most according to claim 1, it is characterised in that:
The center of described light-emitting diode chip for backlight unit is deviateed at the center of described fluorophor plate.
11. LED encapsulation bodies according to claim 1, it is characterised in that:
Described substrate includes the snap point for arranging described fluorophor plate.
12. LED encapsulation bodies according to claim 1, it is characterised in that described base
Plate includes:
Substrate；
First lead-in wire and the second lead-in wire, it is formed at above described substrate, more than one
Light-emitting diode chip for backlight unit electrically connects；And
First substrate pad and second substrate pad, it is formed at below described substrate, respectively with described
One lead-in wire and the second lead-in wire electrical connection.
13. LED encapsulation bodies according to claim 12, it is characterised in that:
Described substrate also includes the first through hole and the second through hole, and described first through hole and the second through hole are through
Described substrate, make described first lead-in wire and second lead-in wire respectively with described first substrate pad and second substrate
Pad electrical connection.
14. LED encapsulation bodies according to claim 12, it is characterised in that:
Described substrate is additionally included in the heat below described substrate, described light-emitting diode chip for backlight unit occurred
Carry out the cooling pad dispelled the heat.
15. LED encapsulation bodies according to claim 1, it is characterised in that also include:
Lens, it covers described light-emitting diode chip for backlight unit, makes described luminous two on the top of described substrate
The light injection that pole die is luminous.
16. LED encapsulation bodies according to claim 15, it is characterised in that described
Mirror includes:
Plate portion, it covers described light-emitting diode chip for backlight unit；And
Circular top part, it is formed at the top in described plate portion, makes the light that described light-emitting diode chip for backlight unit is luminous
Inject to outside.
17. LED encapsulation bodies according to claim 16, it is characterised in that:
The width in described wall portion is more than the width of described circular top part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620261736.9U CN205542882U (en) | 2016-03-31 | 2016-03-31 | Encapsulation body of LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620261736.9U CN205542882U (en) | 2016-03-31 | 2016-03-31 | Encapsulation body of LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205542882U true CN205542882U (en) | 2016-08-31 |
Family
ID=56787100
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620261736.9U Active CN205542882U (en) | 2016-03-31 | 2016-03-31 | Encapsulation body of LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205542882U (en) |
-
2016
- 2016-03-31 CN CN201620261736.9U patent/CN205542882U/en active Active
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