CN101271941A - Encapsulation colloid structure of LED - Google Patents
Encapsulation colloid structure of LED Download PDFInfo
- Publication number
- CN101271941A CN101271941A CNA2007100874655A CN200710087465A CN101271941A CN 101271941 A CN101271941 A CN 101271941A CN A2007100874655 A CNA2007100874655 A CN A2007100874655A CN 200710087465 A CN200710087465 A CN 200710087465A CN 101271941 A CN101271941 A CN 101271941A
- Authority
- CN
- China
- Prior art keywords
- light
- colloid
- emitting diode
- led
- matsurface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Abstract
The invention discloses a packaging colloid structure of a light emitting diode (LED), the main structure of the LED at least includes that a base connected with a terminal, an LED chip arranged on the base, a lead for connecting the LED chip and another terminal, and colloid is injected for fixing the components; a crippling surface or a rough surface which can facilitate the light produced by the LED chip to form refraction is arranged on the surface of the packaging collide. The packaging colloid structure of LED of the invention can disperse the directions of light emitting by means of refraction.
Description
Technical field
The present invention relates to a kind of structure of Encapsulation Moulds plastic composite structural element of light-emitting diode, instigate the encapsulation colloid structure of light refraction especially.
Background technology
In recent years,, make the luminous efficiency of light-emitting diode increase, therefore be applied on light fixture, flashlight or the auto bulb etc. because of the progress of light-emitting diode manufacturing technology and material application; Lower because of its power consumption, caloric value is few, low-voltage, do not produce reason such as poisonous object, existing a large amount of trend that replace original photophore.
Be illustrated in figure 1 as a kind of structure cut-away view of light-emitting diode monomer, as shown in the figure, this encapsulating structure comprise a pedestal A who connects a terminal, and the position on pedestal A, one be bowl-shape recess B, light-emitting diode chip for backlight unit C can be fixedly arranged on recess B, mat lead D is connected with another terminal.Forming colloid E again via potting resin makes above-mentioned formation fixing and protected.
Above-mentioned alleged colloid E it typically is epoxy resin, acryl or silica gel etc.
In luminescence technology now; because side direction, the back to light can lose its light transmission efficiency; for representing the efficient of light-emitting diode; usually can manage to make luminous to its place ahead ejaculation; that is light forms the state concentrate on the place ahead, and the light-emitting diode of this state is a phenomenon of avoiding light to concentrate when being applied to light fixture etc. and going up; usually the shell body of light fixture can be arranged to opaque body, and light be disperseed with arc or alternate manner.
Summary of the invention
Main purpose of the present invention does not form collected state at the emitted light of light-emitting diode, ties up on the top layer of colloid and is arranged to zig zag plane or matsurface, and light is disperseed via the direction that the refraction mode penetrates light.
The invention provides a kind of encapsulation colloid structure of light-emitting diode, its mainly construct comprise at least one be connected in the pedestal of a terminal, light-emitting diode chip for backlight unit be set on pedestal, a lead connects light-emitting diode chip for backlight unit and another terminal, and colloid is set above-mentioned formation is fixed, wherein warpage face or matsurface are arranged in the surface of colloid.
The zig zag plane of above-mentioned colloid or matsurface can be outwards to protrude or inwardly concave, and the ejaculation direction that makes light of mat is disperseed.
The zig zag plane of above-mentioned colloid or matsurface can when encapsulation (pressing mold, pour into or when sticking together) directly with molded; Also can be in colloid typing back with external force processing, for example with the appearance of Sandpapering colloid surface with formation refrangible light.
The encapsulation colloid structure of light-emitting diode of the present invention is arranged to zig zag plane or matsurface on the top layer of colloid, light is disperseed via the direction that the refraction mode penetrates light.
Description of drawings
Fig. 1 is the encapsulating structure schematic diagram of a known light-emitting diode;
Fig. 2 is a package structure for LED schematic diagram of the present invention ();
Fig. 3 is a package structure for LED schematic diagram of the present invention (two);
Fig. 4 package structure for LED schematic diagram of the present invention (three).
The primary clustering symbol description
A......... pedestal
B......... recess
C......... light-emitting diode chip for backlight unit
D......... lead
E......... colloid
10........ pedestal
20......... light-emitting diode chip for backlight unit
30......... lead
40......... terminal
50......... colloid
51......... projection
52......... chase
53......... surface
Embodiment
Shown in Fig. 2 and 3, the formation of light-emitting diode of the present invention comprises that light-emitting diode chip for backlight unit 20, a lead 30 that a pedestal 10, that is connected in a terminal is arranged on the pedestal 10 connect diode chip for backlight unit 20 and another terminal 40, and mat colloid 50 is fixed above-mentioned formation.
Above-mentioned alleged pedestal 10, light-emitting diode chip for backlight unit 20, lead 30 and terminal 40 are all known member, and purpose is that mat diode chip for backlight unit 20 is luminous, and alleged colloid 50 is then at fixing above-mentioned member.
The feature of this case is in colloid 50 structures, and therefore the light-emitting device or the structure of alleged light-emitting diode are not limited to described formation state.
As shown in Figure 2, be provided with some protrudingly 51 in the surface of colloid 50, the directly moulding when colloid 50 moulds are annotated of those projectioies 51 also can be binded separately.
As shown in Figure 3, some chases 52 are set in the surface of colloid 50, those chases 52 also directly constitute when colloid 50 moulds are annotated, and also can process cutting separately.
As shown in Figure 4, do the processing of non-even surface in the surface 53 of colloid 50, alleged surperficial 53 are not limited to the top of colloid 50, in other words, processing to alleged colloid 50 surfaces 53, it is except that can be some local location, also can or do the processing of warpage roughening etc. to its lateral surface, to adapt to different functional requirements comprehensively.
Mat above-mentioned alleged protruding 51 or chase 52 or surface 53 light that light-emitting diode chip for backlight unit 20 is produced can be refracted, and the light that is produced by light-emitting diode is not concentrated penetrated.
Into person is more arranged, for making the light-emitting diode that generally has smooth surface, but mat sand paper etc. on the surface of its colloid 50, rub, make the surface of colloid 50 form matsurface, it also can reach the above-mentioned purpose that makes light refraction.
According to the spirit of Patent Law, claim of the present invention is not limited to the accompanying drawing and the structure explanation that are proposed.
Disclosed person is preferred embodiment, and patent right category of the present invention is not all taken off in Ju Bu change or modification and come from technological thought of the present invention and be easy to the person of knowing by inference by the people who has the knack of this skill such as.
Claims (5)
1. the encapsulation colloid structure of a light-emitting diode, its mainly construct comprise at least one be connected in the pedestal of a terminal, light-emitting diode chip for backlight unit be set on pedestal, a lead connects light-emitting diode chip for backlight unit and another terminal, and colloid is set above-mentioned formation is fixed, it is characterized in that, warpage face or matsurface are arranged in the surface of colloid.
2. the encapsulation colloid structure of light-emitting diode as claimed in claim 1 is characterized in that, the warpage face of described colloid surface or matsurface are projection.
3. the encapsulation colloid structure of light-emitting diode as claimed in claim 1 is characterized in that, the warpage face of described colloid surface or matsurface are chase.
4. the encapsulation colloid structure of light-emitting diode as claimed in claim 1 is characterized in that, the warpage face of described colloid surface or the matsurface rough surface for being ground.
5. the encapsulation colloid structure of light-emitting diode as claimed in claim 1 is characterized in that, the warpage face of described colloid surface or the matsurface structure body for being binded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100874655A CN101271941A (en) | 2007-03-20 | 2007-03-20 | Encapsulation colloid structure of LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100874655A CN101271941A (en) | 2007-03-20 | 2007-03-20 | Encapsulation colloid structure of LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101271941A true CN101271941A (en) | 2008-09-24 |
Family
ID=40005733
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007100874655A Pending CN101271941A (en) | 2007-03-20 | 2007-03-20 | Encapsulation colloid structure of LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101271941A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010131090A1 (en) * | 2009-05-11 | 2010-11-18 | SemiLEDs Optoelectronics Co., Ltd. | Led device with light extracting rough structure and manufacturing methods thereof |
| CN102121691A (en) * | 2010-12-14 | 2011-07-13 | 山西乐百利特科技有限责任公司 | LED (light-emitting diode) mirror front lamp protecting layer, LED mirror front lamp and method for forming protecting layer in LED mirror front lamp |
| CN114220899A (en) * | 2021-11-01 | 2022-03-22 | 深圳市佑明光电有限公司 | Mini LED lamp bead, backlight module and display device |
-
2007
- 2007-03-20 CN CNA2007100874655A patent/CN101271941A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010131090A1 (en) * | 2009-05-11 | 2010-11-18 | SemiLEDs Optoelectronics Co., Ltd. | Led device with light extracting rough structure and manufacturing methods thereof |
| CN102121691A (en) * | 2010-12-14 | 2011-07-13 | 山西乐百利特科技有限责任公司 | LED (light-emitting diode) mirror front lamp protecting layer, LED mirror front lamp and method for forming protecting layer in LED mirror front lamp |
| CN114220899A (en) * | 2021-11-01 | 2022-03-22 | 深圳市佑明光电有限公司 | Mini LED lamp bead, backlight module and display device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20080924 |