TWI746002B - Led light source module which can be cut into various shapes - Google Patents

Abstract

An LED light source module which can be cut into various shapes includes a substrate, a first continuous conductive layer, a second continuous conductive layer, a plurality of LED chips and an insulating layer. The first continuous conductive layer and the second continuous conductive layer are respectively disposed on two opposite surfaces of the substrate. The first continuous conductive layer has a plurality of chip mounting areas that are spaced apart from each other and uniformly distributed. The LED chips are respectively disposed in the chip mounting areas and are electrically connected to the first continuous conductive layer and the second continuous conductive layer. The insulating layer is disposed on the second continuous conductive layer. Therefore, the LED light source module can meet the shaping requirements of light source products.

Description

Cut-out shape LED surface light source module

The present invention relates to an LED surface light source module, in particular to a cutable LED surface light source module, which can be applied to portable light sources, decorative/atmosphere light sources, various signs/kanbans, indicator lights, etc. after cutting.

Light-Emitting Diode (LED) has at least the advantages of small size, high luminous efficiency, low energy consumption, etc., and can emit light of different colors, so it has a good application prospect. In order to produce the luminous effect required by the application, the existing LED light source module arranges multiple LEDs on a module substrate, and uses the wiring arranged on the module substrate to electrically connect all the LEDs in parallel. All LEDs can be controlled at the same time. However, when the number of LEDs required by the module is increasing, or when the volume of the module needs to be smaller and smaller, the wiring design will become more complicated, and the overall production difficulty and production cost will be relatively increased; What's more, once the wiring is interrupted, some LEDs cannot be lit.

At present, the shape and size of this type of LED light source module are generally fixed. If the fixed shape and size of the LED light source module cannot meet the actual application needs, it can only be customized, and there are certain limitations in use. sex. Moreover, this type of LED light source module is generally made into an integrated structure, which is not convenient for cutting. Even if it can be cut, it cannot be cut into any shape, and it is not flexible and convenient in use.

In addition, because this type of LED light source module uses full parallel connection to multiple LEDs With power supply, the on-resistance of the line will increase as the transmission distance becomes longer and cause the current to decrease. As a result, the brightness of the LED closer to the power input terminal is higher, and the brightness of the LED farther away from the power input terminal is lower.

The technical problem to be solved by the present invention is to provide an LED surface light source module that can be cut and shaped in response to the deficiencies of the prior art.

In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a cut-out LED surface light source module, which includes a substrate, a first continuous conductive layer, a plurality of LED chips, a first Two continuous conductive layers and an insulating layer. The substrate has a first surface and a second surface opposite to the first surface, wherein the substrate has a plurality of first via holes; the first continuous conductive layer is disposed on the substrate On the first surface, the first continuous conductive layer has a plurality of die bonding regions, and each of the die bonding regions is provided with a first contact pad connected to the first continuous conductive layer, and A second contact pad that exists independently; a plurality of the LED chips are respectively disposed in a plurality of the die-bonding regions, and each of the LED chips has a first contact pad next to the corresponding first contact pad Electrode and a second electrode next to the corresponding second contact pad; the second continuous conductive layer is disposed on the second surface of the substrate and passes through a plurality of the first via holes Electrically connected to a plurality of the second contact pads; the insulating layer is disposed on the second continuous conductive layer.

Furthermore, the substrate has an inner side and an outer side, and the inner side has a plurality of the first via holes; a plurality of the die bonding regions of the first continuous conductive layer are located in the The upper part of the inner side is arranged in an array.

Furthermore, the first continuous conductive layer has a plurality of first lead-out parts arranged at intervals, the second continuous conductive layer has a plurality of second lead-out parts arranged at intervals, and a plurality of the The positions of the first lead-out portion and the plurality of second lead-out portions correspond to the outer portion of the substrate.

Furthermore, the outer portion of the substrate has a plurality of second via holes, a plurality of conductive pads are provided on the second surface of the substrate, and the plurality of conductive pads are connected to the second continuity The plurality of second lead portions of the conductive layer are alternately arranged and electrically insulated from each other, and the plurality of conductive pads respectively pass through the plurality of second via holes and the plurality of the first continuous conductive layer The first lead part is electrically connected.

Furthermore, the plurality of conductive pads and the plurality of second lead portions of the second continuous conductive layer are exposed from the insulating layer.

Furthermore, the cut-and-shape LED surface light source module further includes a protective layer, and the transparent layer covers a plurality of the LED chips.

Furthermore, the protective layer is a transparent layer or a fluorescent layer.

Furthermore, the protective layer contains a plurality of light diffusion particles uniformly distributed.

Furthermore, the emission wavelength of each of the LED chips is 430 nm to 470 nm.

Furthermore, the length and width of each of the LED chips are less than 500 microns.

Furthermore, the area of the first continuous conductive layer occupies more than 60% of the area of the first surface of the substrate, and the area of the second continuous conductive layer occupies the second surface of the substrate. More than 60% of the surface area.

One of the beneficial effects of the present invention is that the LED surface light source module of the present invention can be cut into any shape, is flexible and convenient to use, and can meet the diversified modeling requirements of light source products. In addition, the LED surface light source module of the present invention has a simple structure, does not require a complicated wiring/conductive structure, and has stable and reliable working performance.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings about the present invention. However, the drawings provided are only for reference and description, and It is not intended to limit the present invention.

Z: LED surface light source module

1: substrate

1a: inside

1b: Outer part

11a: First via

11b: second via

101: first surface

102: second surface

2: The first continuous conductive layer

21: The first lead-out part

200: Bonding area

3: LED chip

31: First electrode

32: second electrode

4: Second continuous conductive layer

41: The second lead part

5: Insulation layer

6: protective layer

61: Light diffusion particles

P1: first contact pad

P2: second contact pad

P3: Conductive pad

L1: Horizontal cutting line

L2: Longitudinal cutting line

FIG. 1 is a schematic top view of a cut-out LED surface light source module of the present invention.

2 is a partial three-dimensional schematic diagram of the LED surface light source module that can be cut and shaped according to the present invention.

3 is a schematic partial top view of the cut-out LED surface light source module of the present invention.

4 is a partial bottom view of the cut-out LED surface light source module of the present invention.

FIG. 5 is another partial bottom view of the cut-out shape LED surface light source module of the present invention.

6 is a schematic cross-sectional view of the LED surface light source module that can be cut and shaped according to the present invention.

FIG. 7 is another schematic cross-sectional view of the LED surface light source module that can be cut and shaped according to the present invention.

FIG. 8 is a schematic diagram of the use state of the cut-out LED surface light source module of the present invention.

The following is a specific embodiment to illustrate the implementation of the "cutable shape LED surface light source module" disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be based on different viewpoints and applications, without departing from Various modifications and changes are made under the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to actual dimensions, and are stated in advance. The following embodiments will further describe the related technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention. In addition, the term "or" used in this document may include any one or a combination of more of the associated listed items depending on the actual situation.

1 to 8, a preferred embodiment of the present invention provides an LED surface light source module Z, which mainly includes a substrate 1, a first continuous conductive layer 2, a plurality of LED chips 3, a second continuous Conductive layer 4 and an insulating layer 5. The first continuous conductive layer 2 and the second continuous conductive layer 4 are respectively disposed on two opposite surfaces of the substrate 1, wherein the first continuous conductive layer 2 has a plurality of mutually spaced die bonding regions 200, and a plurality of LED chips 3 They are respectively disposed in a plurality of die bonding regions 200 and electrically connected to the first continuous conductive layer 2 and the second continuous conductive layer 4, and the insulating layer 5 is disposed on the second continuous conductive layer 4. In this embodiment, the multiple die bonding regions 200 are formed by partially hollowing out the first continuous conductive layer 2. The method of partially hollowing out the first continuous conductive layer 2 may be photolithography, but is not limited to this.

When in use, a plurality of LED chips 3 are evenly arranged on the substrate 1. The substrate 1 can provide a basis for physical support and electrical conduction of the plurality of LED chips 3, and the first continuous conductive layer 2 and the second continuous conductive layer 4 can be The electrical signals from the outside are transmitted to multiple LED chips 3 at the same time. In this way, multiple LED chips 3 can be driven to emit light without a complicated wiring/conductive structure; and even if the substrate 1 together with the first continuous conductive layer 2 and the second continuous conductive layer 4 are cut to have a special shape , The leaf shape as shown in FIG. 8 will not affect the normal light emission of the remaining LED chips 3. After cutting, the LED surface light source module Z of the present invention can be applied to portable light sources, decorative/atmosphere light sources, various signs/kanban boards, indicator lights, etc., but is not limited thereto.

2 to 6, the substrate 1 may be formed of a resin substrate containing a reinforcing material (such as glass fiber). The substrate 1 has a first surface 101 (such as the upper surface) and a second surface 102 ( (The surface below), and the substrate 1 has a plurality of first via holes 11a. First continuous conductive layer 2 is disposed on the first surface 101 of the substrate 1, the first continuous conductive layer 2 can be a patterned copper foil layer, and occupies more than 60% of the area of the first surface 101 of the substrate 1; the first continuous conductive layer The multiple die bonding regions 200 of layer 2 are arranged in an array, and each die bonding region 200 is provided with a first contact pad P1 and a second contact pad P2, wherein the first contact pad P1 and the first continuous conductive layer 2 is connected, the second contact pad P2 exists in an independent form; the first contact pad P1, the second contact pad P2 and the first continuous conductive layer 2 can be formed in the same manufacturing process, but it is not limited to this. In this embodiment, the substrate 1 has an inner portion 1a and an outer portion 1b. The outer portion 1b is located on the outer side of the inner portion 1a and preferably surrounds the inner portion 1a; in addition, a plurality of first via holes 11a are formed in the inner portion 1a, and a plurality of die bonding regions 200 are located above the inner portion 1a. However, the above descriptions are only feasible implementation manners, and are not intended to limit the present invention.

In addition, the second continuous conductive layer 4 is disposed on the second surface 102 of the substrate 1, and is electrically connected to the plurality of second contact pads P2 through the plurality of first via holes 11a. The second continuous conductive layer 4 can also be It is a patterned copper foil layer and occupies more than 60% of the area of the second surface 102 of the substrate 1. A plurality of LED chips 3 are respectively disposed in the plurality of die bonding regions 200 of the first continuous conductive layer 2, and each LED chip 3 is a flip-chip LED chip, which has a first electrode 31 and a second electrode 32 , Where the first electrode 31 is then connected to the first contact pad P1 to be electrically connected to the first continuous conductive layer 2, and the second electrode 32 is then connected to the second contact pad P2 to be connected to the second continuous conductive layer 4 Electrical connection. In this embodiment, each LED chip 3 is used to emit blue light, and its emission wavelength is preferably 430 nanometers to 470 nanometers, and the length and width of each LED chip 3 are both less than 500 microns. The insulating layer 5 is disposed on the second continuous conductive layer 4 to avoid short circuits. The insulating layer 5 can be formed of an insulating ink. However, the above descriptions are only feasible implementation manners, and are not intended to limit the present invention.

According to actual needs, colored ink can be used to draw multiple horizontal cutting lines L1 and multiple longitudinal cutting lines L2 on the insulating layer 5. The multiple horizontal cutting lines L1 can be arranged at intervals along the row direction of the array of the die bonding area 200. , And the plurality of longitudinal cutting lines L2 can be arranged at intervals along the column direction of the array in which the die bonding regions 200 are arranged, and the plurality of die bonding regions 200 can be located on the plurality of transverse cutting lines L1 and the plurality of longitudinal cutting lines. Between line L2. In this way, each cutting action can be along a horizontal cutting line L1 or a longitudinal cutting line L2, avoiding errors caused by manual cutting, improving accuracy, and ensuring that the finished product has the required shape.

In practical applications, the LED surface light source module Z of the present invention may include a plurality of electrical connection interfaces for receiving electrical signals from the outside; furthermore, as shown in FIGS. 1 to 4, the first continuous conductive layer 2 There are a plurality of first lead-out portions 21 arranged at intervals, any of the first lead-out portions 21 can introduce electrical signals to the first electrodes 31 of multiple LED chips 3, and the second continuous conductive layer 4 has multiple spaces Of the second lead-out portions 41 arranged, any one of the second lead-out portions 41 can introduce electrical signals to the second electrodes 32 of the plurality of LED chips 3. In this embodiment, the positions of the plurality of first lead portions 21 and the plurality of second lead portions 41 correspond to the outer portion 1b of the substrate 1.

For optimization purposes, the outer portion 1b of the substrate 1 may have a plurality of second via holes 11b, and the second surface 102 of the substrate 1 may be provided with a plurality of conductive pads P3; the conductive pads P3 and the second continuous conductive layer 4 may be Formed in the same manufacturing process, but not limited to this. In addition, the plurality of conductive pads P3 and the plurality of second lead portions 41 of the second continuous conductive layer 4 are alternately arranged on the same plane and are electrically insulated from each other. The plurality of conductive pads P3 respectively pass through the plurality of second vias. 11b is electrically connected to the plurality of first lead portions 21 of the first continuous conductive layer 2; in addition, the plurality of conductive pads P3 and the multiple second lead portions 41 of the second continuous conductive layer 4 are exposed from the insulating layer 5, To form an electrical conduction loop with external electronic devices or functional components. Thereby, the LED surface light source module Z of the present invention can be more easily combined with external electronic devices or functional elements.

Referring now to FIGS. 6 and 7, the LED surface light source module Z of the present invention may further include a protective layer 6 for covering the first continuous conductive layer 2 and the plurality of LED chips 3. The protective layer 6 can resist external impact and prevent water and oxygen from intruding to ensure the normal operation of multiple LED chips 3; the protective layer 6 can be formed of epoxy resin or silicone resin. In this embodiment, the protective layer 6 can be formed by compression molding, and the protective layer 6 can be a transparent layer (as shown in FIG. 6) or a fluorescent layer (as shown in FIG. 7); according to actual requirements, The protective layer 6 may contain a plurality of light diffusion particles 61 uniformly distributed, and the plurality of light diffusion particles 61 may be silicon dioxide particles or titanium dioxide particles to uniformly disperse the light emitted by the plurality of LED chips 3. However, the above descriptions are only feasible implementation manners, and are not intended to limit the present invention.

One of the beneficial effects of the present invention is that the LED surface light source module of the present invention is provided on two opposite surfaces of the substrate through the first continuous conductive layer and the second continuous conductive layer, wherein the first continuous conductive layer The layer has a plurality of mutually spaced die-bonding regions, a plurality of LED chips are respectively arranged in the multiple die-bonding regions, and are electrically connected to the first continuous conductive layer and the second continuous conductive layer, and the insulating layer is provided in the second continuous The technical features of "on the conductive layer" can be cut into any shape, which is flexible and convenient to use, and can meet the diversified modeling needs of light source products. In addition, the LED surface light source module of the present invention has a simple structure, does not require a complicated wiring/conductive structure, and has stable and reliable working performance.

Furthermore, the area of the first continuous conductive layer and the area of the second continuous conductive layer each account for more than 60% of the area of the corresponding substrate surface. Therefore, the LED surface light source module of the present invention does not have an on-resistance variation. The problem that the transmission distance of the line becomes longer and increases.

The content disclosed above is only the preferred and feasible embodiments of the present invention, and does not limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made using the description and schematic content of the present invention are included in the application of the present invention. Within the scope of the patent.

Z: LED surface light source module

1a: inside

1b: Outer part

11a: First via

11b: second via

101: first surface

102: second surface

2: The first continuous conductive layer

21: The first lead-out part

3: LED chip

31: First electrode

32: second electrode

4: Second continuous conductive layer

5: Insulation layer

6: protective layer

P1: first contact pad

P2: second contact pad

P3: Conductive pad

Claims (11)

An LED surface light source module capable of cutting shapes, including: A substrate having a first surface and a second surface opposite to the first surface, wherein the substrate has a plurality of first via holes; A first continuous conductive layer is disposed on the first surface of the substrate, wherein the first continuous conductive layer has a plurality of die-bonding regions, and each of the die-bonding regions is provided with and A first contact pad connected to the first continuous conductive layer and an independent second contact pad; A plurality of LED chips are respectively disposed in a plurality of the die bonding regions, wherein each of the LED chips has a first electrode connected to the corresponding first contact pad and connected to the corresponding first contact pad. A second electrode on the contact pad; A second continuous conductive layer disposed on the second surface of the substrate and electrically connected to the plurality of second contact pads through the plurality of first via holes; and An insulating layer is arranged on the second continuous conductive layer. The cut-out LED surface light source module according to claim 1, wherein the substrate has an inner side and an outer side, and the inner side has a plurality of the first through holes; A plurality of the die bonding regions of a continuous conductive layer are located above the inner portion and arranged in an array. The cut-out LED surface light source module according to claim 2, wherein the first continuous conductive layer has a plurality of first lead portions arranged at intervals, and the second continuous conductive layer has a plurality of The second lead parts are arranged at intervals, and the positions of the plurality of first lead parts and the plurality of second lead parts correspond to the outer part of the substrate. The cut-out LED surface light source module according to claim 3, wherein the outer portion of the substrate has a plurality of second through holes, and the second surface of the substrate is provided with a plurality of Conductive pads, the plurality of conductive pads and the plurality of second lead portions of the second continuous conductive layer are alternately arranged and electrically insulated from each other, and the plurality of conductive pads respectively pass through the plurality of second The via hole is electrically connected with the plurality of first lead portions of the first continuous conductive layer. The cut-shaped LED surface light source module according to claim 4, wherein the plurality of conductive pads and the plurality of second lead portions of the second continuous conductive layer are exposed from the insulating layer. The cut-and-shape LED surface light source module according to claim 1, further comprising a protective layer, and the transparent layer covers a plurality of the LED chips. The cut-out LED surface light source module according to claim 6, wherein the protective layer is a transparent layer or a fluorescent layer. According to claim 7, the cut-out shape LED surface light source module, wherein the protective layer contains a plurality of light diffusion particles uniformly distributed. The cut-out LED surface light source module according to claim 1, wherein the emission wavelength of each LED chip is 430 nanometers to 470 nanometers. The LED surface light source module capable of cutting and shaping according to claim 1, wherein the length and width of each of the LED chips are less than 500 microns. The cut-out and shapeable LED surface light source module according to claim 1, wherein the area of the first continuous conductive layer occupies more than 60% of the area of the first surface of the substrate, and the first The area of the two continuous conductive layers accounts for more than 60% of the area of the second surface of the substrate.

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