TWM617169U - Light emitting display device - Google Patents
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- TWM617169U TWM617169U TW110200974U TW110200974U TWM617169U TW M617169 U TWM617169 U TW M617169U TW 110200974 U TW110200974 U TW 110200974U TW 110200974 U TW110200974 U TW 110200974U TW M617169 U TWM617169 U TW M617169U
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- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
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- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
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Abstract
本案提出發光顯示裝置,其具有基板、分別配置於基板的相對表面上的第一圖案化導電層及第二圖案化導電層、複數銲墊區及複數發光件。發光件彼此間的最小相隔距離為2至3毫米。第一圖案化導電層具有複數交織成網格狀的第一導線,第二圖案化導電層具有複數相互平行且彼此相隔的第二導線及自各個第二導線連接出的延伸部,基板用以隔離第一圖案化導電層和第二圖案化導電層之間的電性接觸。銲墊區彼此分隔開,一銲墊區和第一導線電性連接而其他銲墊區分別和三個彼此相鄰的第二導線的延伸部連接。This case proposes a light-emitting display device, which has a substrate, a first patterned conductive layer and a second patterned conductive layer respectively disposed on opposite surfaces of the substrate, a plurality of pad regions, and a plurality of light-emitting elements. The minimum distance between the light-emitting elements is 2 to 3 mm. The first patterned conductive layer has a plurality of first wires that are interwoven into a grid shape, and the second patterned conductive layer has a plurality of second wires that are parallel to each other and spaced apart from each other and extensions connected from each of the second wires. The substrate is used for Isolate the electrical contact between the first patterned conductive layer and the second patterned conductive layer. The bonding pad regions are separated from each other, one bonding pad region is electrically connected to the first wire, and the other bonding pad regions are respectively connected to the extensions of three adjacent second wires.
Description
本創作是關於一種顯示裝置,特別是關於一種發光顯示裝置。 This creation is about a display device, especially a light-emitting display device.
因應顯示器的顯示螢幕朝大尺寸化、平面化、薄型化、輕量化及具可撓性發展,以被動點發光源及主動點發光源作為顯示器的發光源且以可撓性基板作為配置這些發光源的基板的發光顯示技術開發日益重要。被動點發光源例如是發光二極體(Light emitting diode;LED),而主動點發光源例如是有機發光二極體(Organic Light-Emitting Diode;OLED)。一個技術發展分支中,以LED作為光源而開發出的供人們遠距離觀看的大屏幕發光顯示器的後續進展值得關注。 In response to the development of display screens that are larger in size, flattened, thinner, lighter, and flexible, passive point light sources and active point light sources are used as the light source of the display, and flexible substrates are used to configure these light sources. The development of light-emitting display technology for substrates has become increasingly important. The passive point light-emitting source is, for example, a light emitting diode (LED), and the active point light-emitting source is, for example, an organic light-emitting diode (OLED). In a branch of technological development, the follow-up development of large-screen light-emitting displays developed with LEDs as light sources for people to watch from a distance is worthy of attention.
這類供人們遠距離觀看的發光顯示器在製作上,可以選擇將含有多個LED所組成的LED燈珠或LED晶片以陣列的形式裝設在基板上,LED燈珠或LED晶片彼此間的距離不小於2毫米(mm),有別於供人們近距離觀看的有機發光二極體(OLED)顯示器或微尺寸發光二極體(Micro-LED)顯示器。為了讓陣列中每個LED燈珠或LED晶片能夠被點亮且具有符合需求的亮度,這些LED燈珠或LED晶片的配置基板及其配置導線必須具有良好的導電功率。此外,為了提升遠距離觀看這類發光顯示器的對比度,同時也必須降低這些LED燈珠或LED晶片的配置基板及其配置導線在顯示畫面中的可視性。另一方面,為了因應各種應用場合所需的顯示效果,這些LED燈珠或LED晶片的配置導線的製作必須具有良好的 設計變更性並能快速製作完成。針對以上這些技術問題,本創作希望能夠提出解決方案。 In the production of this kind of light-emitting display for people to watch from a distance, you can choose to install LED lamp beads or LED chips composed of multiple LEDs on the substrate in the form of an array. The distance between the LED lamp beads or the LED chips Not less than 2 millimeters (mm), which is different from organic light-emitting diode (OLED) displays or micro-size light-emitting diode (Micro-LED) displays for people to watch at close range. In order to enable each LED lamp bead or LED chip in the array to be lit and have a brightness that meets the requirements, the configuration substrate and configuration wires of these LED lamp beads or LED chips must have good conductive power. In addition, in order to improve the contrast of viewing this type of light-emitting display from a long distance, it is also necessary to reduce the visibility of the configuration substrates of these LED lamp beads or LED chips and their configuration wires in the display screen. On the other hand, in order to meet the display effect required by various applications, the production of the configuration wires of these LED lamp beads or LED chips must have a good The design is changeable and can be produced quickly. In view of the above technical problems, this author hopes to propose solutions.
有鑑於上述問題,本創作提供一種發光顯示裝置。 In view of the above-mentioned problems, the present creation provides a light-emitting display device.
一實施例中,發光顯示裝置具有基板、配置於基板上的第一圖案化導電層、第二圖案化導電層、彼此電性隔離的一第一銲墊區、一第二銲墊區、一第三銲墊區和一第四銲墊區及複數發光件。基板具有第一表面及背對第一表面的第二表面,基板上具有複數通孔。第一圖案化導電層配置於第一表面上,具有複數交織成網格狀的第一導線。第二圖案化導電層配置於第二表面上,具有至少三相互平行且彼此等距或不等距相隔的呈線狀的第二導線、自各個第二導線連接出的呈線狀的延伸部及至少一和第二導線相隔的島部,延伸部的配置方向和第二導線的配置方向呈交叉,島部經由通孔其中之一和第一導線的交接處電性連接。第一銲墊區配置於島部上,第二銲墊區、第三銲墊區和第四銲墊區分別配置於延伸部上。複數發光件依陣列形式配置於第二表面的同側,彼此間的最小相隔距離為2至3毫米,至少一發光件的四個不同接腳分別連接至第一銲墊區、第二銲墊區、第三銲墊區及第四銲墊區。 In one embodiment, the light-emitting display device has a substrate, a first patterned conductive layer, a second patterned conductive layer disposed on the substrate, a first pad area, a second pad area, and a second pad area electrically isolated from each other. The third pad area, a fourth pad area and a plurality of light-emitting elements. The substrate has a first surface and a second surface opposite to the first surface, and the substrate has a plurality of through holes. The first patterned conductive layer is disposed on the first surface and has a plurality of first conductive lines interwoven into a grid shape. The second patterned conductive layer is disposed on the second surface, and has at least three linear second wires that are parallel to each other and are equally or unequally spaced from each other, and linear extensions connected from each second wire And at least one island part separated from the second wire, the disposition direction of the extension part and the disposition direction of the second wire intersect, and the island part is electrically connected to the junction of the first wire through one of the through holes. The first solder pad area is disposed on the island portion, and the second solder pad area, the third solder pad area and the fourth solder pad area are respectively disposed on the extension portion. The plurality of light-emitting elements are arranged on the same side of the second surface in an array form, and the minimum distance between each other is 2 to 3 mm. The four different pins of at least one light-emitting element are respectively connected to the first bonding pad area and the second bonding pad. Area, third pad area and fourth pad area.
一實施例中,發光顯示裝置的第一圖案化導電層的各個第一導線的線寬為25微米至100微米且各個第二導線的線寬為25微米至100微米。 In an embodiment, the line width of each first wire of the first patterned conductive layer of the light-emitting display device is 25 μm to 100 μm, and the line width of each second wire is 25 μm to 100 μm.
一實施例中,發光顯示裝置的第一圖案化導電層的第一導線的網格形狀為矩形、六角形、橢圓形及圓形其中之一。 In an embodiment, the grid shape of the first conductive lines of the first patterned conductive layer of the light-emitting display device is one of a rectangle, a hexagon, an ellipse, and a circle.
一實施例中,發光顯示裝置還具有一第三圖案化導電層,配置於基板的第二表面上且與第二圖案化導電層電性隔離,具有至少三連接至各第二 導線的相互平行且彼此等距或不等距相隔的呈線狀的第三導線,第三導線的延伸方向和第二導線的延伸方向呈交叉,第三導線延伸連接至發光顯示裝置的點亮訊號輸入端。 In an embodiment, the light-emitting display device further has a third patterned conductive layer, which is disposed on the second surface of the substrate and is electrically isolated from the second patterned conductive layer, and has at least three patterns connected to each second The third wires that are parallel to each other and are equally or unequally spaced apart from each other in a linear shape, the extending direction of the third wire and the extending direction of the second wire intersect, and the third wire is extended and connected to the lighting of the light-emitting display device Signal input terminal.
一實施例中,發光顯示裝置還具有一第一圖案化電性絕緣層,其具有複數第一電性絕緣區塊,配置於第二圖案化導電層及第三圖案化導電層之間,第一電性絕緣區塊使得第三導線和第二導線電性隔離。 In one embodiment, the light-emitting display device further has a first patterned electrically insulating layer, which has a plurality of first electrically insulating regions, and is disposed between the second patterned conductive layer and the third patterned conductive layer. An electrically insulating block electrically isolates the third wire from the second wire.
一實施例中,發光顯示裝置還具有第二圖案化電性絕緣層,其具有複數第二電性絕緣區塊,第二電性絕緣區塊分別沿著第一銲墊區、第二銲墊區、第三銲墊區和第四銲墊區的一第一配置方向配置於基板的第二表面上,用以隔離第一銲墊區、第二銲墊區、第三銲墊區和第四銲墊區於一第二配置方向上的電性接觸,第二配置方向和第一配置方向呈交叉。 In one embodiment, the light-emitting display device further has a second patterned electrically insulating layer, which has a plurality of second electrically insulating areas, and the second electrically insulating areas are respectively along the first pad area and the second pad area. Area, the third pad area, and the fourth pad area are arranged on the second surface of the substrate in a first arrangement direction to isolate the first pad area, the second pad area, the third pad area and the first pad area The four bonding pad regions are electrically contacted in a second arrangement direction, and the second arrangement direction crosses the first arrangement direction.
一實施例中,發光顯示裝置還具有第三圖案化電性絕緣層,其具有複數第三電性絕緣區塊,第三電性絕緣區塊分別沿著第一銲墊區、第二銲墊區、第三銲墊區和第四銲墊區的第二配置方向配置於連接第三銲墊區的第二導線的上方,用以隔離第一銲墊區、第二銲墊區、第三銲墊區和第四銲墊區於第一配置方向上的電性接觸。 In one embodiment, the light-emitting display device further has a third patterned electrical insulation layer, which has a plurality of third electrical insulation regions, and the third electrical insulation regions are respectively along the first pad area and the second pad area. The second arrangement direction of the third pad area, the third pad area, and the fourth pad area is arranged above the second wire connecting the third pad area to isolate the first pad area, the second pad area, and the third pad area. The solder pad area and the fourth solder pad area are in electrical contact in the first arrangement direction.
一實施例中,發光顯示裝置還具有第一圖案化導電金屬種子層,其形成於基板的第一表面上,具有和第一圖案化導電層的圖案相同的圖案,用以作為第一圖案化導電層的形成準備層。 In an embodiment, the light-emitting display device further has a first patterned conductive metal seed layer, which is formed on the first surface of the substrate, and has the same pattern as that of the first patterned conductive layer, which serves as the first patterned conductive layer. Preparation layer for formation of conductive layer.
一實施例中,發光顯示裝置還具有第二圖案化導電金屬種子層,其形成於基板的第二表面上,具有和第二圖案化導電層的圖案相同的圖案,用以作為第二圖案化導電層的形成準備層。 In one embodiment, the light-emitting display device further has a second patterned conductive metal seed layer, which is formed on the second surface of the substrate, and has the same pattern as that of the second patterned conductive layer, which serves as the second patterned conductive layer. Preparation layer for formation of conductive layer.
各實施例中,發光顯示裝置的發光件可以為發光二極體燈珠。 In each embodiment, the light-emitting element of the light-emitting display device may be a light-emitting diode lamp bead.
綜上所述,依照本創作各實施例所描述的發光顯示裝置將對應到發光件的接腳的銲墊區的連接導線分層配置,使得銲墊區中的電源連接導線和銲墊區中的訊號連接導線不共用同一平面配置空間,有利於加大電源連接導線的平面配置空間以及提升電源連接導線的導電率。由於基板的單一側表面上只配置電源連接導線,在加大的平面配置空間內,電源連接導線可被細分成複數線寬更小的等效導線,以提高顯示畫面的通透度。另一方面,訊號連接導線的引出線路(即實施例中的第三導線)可以進一步利用電性絕緣層來進行分層配置,讓這些引出線路可以和電源連接導線在電性隔離下重疊配置以弱化引出線路的可視性。此外,發光件亦可採用微小型發光二極體晶片以降低發光件本身在顯示畫面中的可視性。如此一來,在發光件的配置基板是透明的情況下,可大幅地降低位於基板上的導線和發光件在顯示畫面中的可視性,進而提升在一定距離外觀看這類發光顯示器的對比度和清晰度。此外,第一圖案化導電層及第二圖案化導電層的材質可依製程的不同來進行選擇,在製程設計上具有彈性。例如,第一圖案化導電層的第一導線的材質可以是摻有導電粉末的漿料並可進一步添加可化學鍍的材料,可以是具高透明度的氧化銦錫(ITO)膜、氟摻雜氧化錫(FTO)膜、氧化鋅(ZnO)膜或氧化鋁鋅(AZO)膜,也可以是銅、銀、鎳或鎳金。同理,第二圖案化導電層的第二導線、第二導線的延伸部及島部的材質可以是摻有導電粉末的漿料並可進一步添加可化學鍍的材料,可以是具高透明度的氧化銦錫(ITO)膜、氟摻雜氧化錫(FTO)膜、氧化鋅(ZnO)膜或氧化鋁鋅(AZO)膜,也可以是銅、銀、鎳或鎳金。本創作中,第一圖案化導電層或第二導電層的材料並不限於上述所提的材料,凡具有導電性的材料例如石墨烯、奈米碳管等材質亦可被使用。 In summary, according to the light-emitting display device described in each embodiment of the present creation, the connecting wires corresponding to the pad areas of the pins of the light-emitting element are arranged in layers, so that the power connection wires in the pad area and the pad area are The signal connection wires do not share the same plane configuration space, which is beneficial to increase the plane configuration space of the power connection wires and improve the conductivity of the power connection wires. Since only the power connection wires are arranged on a single side surface of the substrate, the power connection wires can be subdivided into plural equivalent wires with smaller line widths in the enlarged plane configuration space to improve the transparency of the display screen. On the other hand, the lead-out lines of the signal connection wires (that is, the third lead in the embodiment) can be further arranged in layers with an electrical insulating layer, so that these lead-out lines can be overlapped with the power connection wires under electrical isolation. Weaken the visibility of lead-out lines. In addition, the light-emitting element can also use a miniature light-emitting diode chip to reduce the visibility of the light-emitting element itself in the display screen. In this way, in the case where the substrate for the light-emitting element is transparent, the visibility of the wires and the light-emitting element on the substrate in the display screen can be greatly reduced, thereby improving the contrast and contrast of viewing this type of light-emitting display from a certain distance. Clarity. In addition, the materials of the first patterned conductive layer and the second patterned conductive layer can be selected according to different manufacturing processes, which has flexibility in manufacturing process design. For example, the material of the first wire of the first patterned conductive layer can be a slurry doped with conductive powder and can be further added with an electroless plating material, which can be an indium tin oxide (ITO) film with high transparency, fluorine doping The tin oxide (FTO) film, zinc oxide (ZnO) film or aluminum oxide zinc (AZO) film may also be copper, silver, nickel or nickel gold. In the same way, the material of the second wire of the second patterned conductive layer, the extension of the second wire, and the island can be a slurry mixed with conductive powder and can be further added with an electroless plating material, which can be highly transparent The indium tin oxide (ITO) film, the fluorine-doped tin oxide (FTO) film, the zinc oxide (ZnO) film or the aluminum oxide zinc (AZO) film may also be copper, silver, nickel or nickel gold. In this creation, the material of the first patterned conductive layer or the second conductive layer is not limited to the materials mentioned above, and any conductive material such as graphene, carbon nanotube, etc. can also be used.
為讓本創作的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。 In order to make the above-mentioned features and advantages of this creation more obvious and understandable, the following specific examples are given in conjunction with the accompanying drawings to describe in detail as follows.
1:發光顯示裝置 1: Light-emitting display device
100:基板 100: substrate
1001:第一表面 1001: first surface
1002:第二表面 1002: second surface
1003:通孔 1003: Through hole
900:第一圖案化導電金屬種子層 900: The first patterned conductive metal seed layer
10:第一圖案化導電層 10: The first patterned conductive layer
101:第一導線 101: first wire
1011:第一延伸方向的第一導線 1011: The first wire in the first extension direction
1012:第二延伸方向的第一導線 1012: The first wire in the second extension direction
102:交接處 102: Junction
103:網格 103: Grid
20:第二圖案化導電層 20: second patterned conductive layer
200:第二圖案化導電金屬種子層 200: second patterned conductive metal seed layer
201:第二導線 201: second wire
202:延伸部 202: Extension
203:島部 203: Island
30:第三圖案化導電層 30: The third patterned conductive layer
301:第三導線 301: third wire
40:第一圖案化電性絕緣層 40: The first patterned electrical insulating layer
401:第一電性絕緣區塊 401: The first electrical insulation block
501:第一銲墊區 501: The first pad area
502:第二銲墊區 502: second pad area
503:第三銲墊區 503: third pad area
504:第四銲墊區 504: The fourth pad area
60:第二圖案化電性絕緣層 60: second patterned electrical insulating layer
601:第二電性絕緣區塊 601: The second electrical insulation block
70:第三圖案化電性絕緣層 70: The third patterned electrical insulating layer
701:第三電性絕緣區塊 701: Third Electrical Insulation Block
80:電性連接材料 80: Electrical connection material
1000:發光件 1000: luminous parts
圖1A係平面示意圖,顯示本創作一實施例的發光顯示裝置的第一圖案化導電層及其導線。 FIG. 1A is a schematic plan view showing the first patterned conductive layer and its wires of a light-emitting display device according to an embodiment of the invention.
圖1B係平面示意圖,顯示本創作一實施例的發光顯示裝置的其他圖案化導電層及其導線。 FIG. 1B is a schematic plan view showing other patterned conductive layers and wires of the light-emitting display device according to an embodiment of the invention.
圖2A係一剖面示意圖,顯示圖1A的發光顯示裝置於一製程中的的A-A剖面。 2A is a schematic cross-sectional view showing the A-A cross-section of the light-emitting display device of FIG. 1A in a manufacturing process.
圖2B係一剖面示意圖,顯示圖1A的發光顯示裝置於一製程中的B-B剖面。 FIG. 2B is a schematic cross-sectional view showing a B-B cross-section of the light-emitting display device of FIG. 1A in a manufacturing process.
圖2C係一剖面示意圖,顯示圖1A的發光顯示裝置於一製程中的C-C剖面。 2C is a schematic cross-sectional view showing the C-C cross-section of the light-emitting display device of FIG. 1A in a manufacturing process.
圖2D係一剖面示意圖,顯示圖1A的發光顯示裝置於一製程中的D-D剖面。 FIG. 2D is a schematic cross-sectional view showing the D-D cross-section of the light-emitting display device of FIG. 1A in a manufacturing process.
圖3A係一剖面示意圖,顯示圖1A的發光顯示裝置於另一製程中的的A-A剖面。 FIG. 3A is a schematic cross-sectional view showing the A-A cross-section of the light-emitting display device of FIG. 1A in another manufacturing process.
圖3B係一剖面示意圖,顯示圖1A的發光顯示裝置於另一製程中的B-B剖面。 FIG. 3B is a schematic cross-sectional view showing a B-B cross-section of the light-emitting display device of FIG. 1A in another manufacturing process.
圖3C係一剖面示意圖,顯示圖1A的發光顯示裝置於另一製程中的C-C剖面。 FIG. 3C is a schematic cross-sectional view showing the C-C cross-section of the light-emitting display device of FIG. 1A in another manufacturing process.
圖3D係一剖面示意圖,顯示圖1A的發光顯示裝置於另一製程中的D-D剖面。 FIG. 3D is a schematic cross-sectional view showing the D-D cross-section of the light-emitting display device of FIG. 1A in another manufacturing process.
圖4係一平面示意圖,顯示本創作一實施例的發光顯示裝置的具蜂巢狀的網格導線。。 FIG. 4 is a schematic plan view showing the honeycomb-shaped grid wires of the light-emitting display device according to an embodiment of the invention. .
本創作揭示一種發光顯示裝置,以下文中所敘及的已為本領域普通技術人員所能明瞭者,將不再作完整描述,例如發光二極體的發光原理、具有特定導電線路圖案而呈層狀立體結構(線路圖案彼此間具有高低差)的圖案化導電層等。另外,以下文中所敘及的技術用語的意思如有與所屬技術領域的通常用語的意思不同時,以文中的意思為準,而文中所對照的附圖意在表達與本創作特徵有關的含義,並未依據實際尺寸完整繪製,亦先行敘明。 This creation discloses a light-emitting display device. The following narratives are already understood by those of ordinary skill in the art and will not be fully described, such as the light-emitting principle of light-emitting diodes, and layers with specific conductive circuit patterns. A patterned conductive layer with a three-dimensional structure (the line patterns have a height difference between each other). In addition, if the meaning of the technical terms described in the following text is different from the meaning of the usual terms in the technical field, the meaning in the text shall prevail, and the accompanying drawings in the text are intended to express the meaning related to the creative feature , Not drawn completely according to the actual size, but also stated first.
圖1A係平面示意圖,顯示本創作一實施例的發光顯示裝置的第一圖案化導電層及其導線。圖1B係平面示意圖,顯示本創作一實施例的發光顯示裝置的其他圖案化導電層及其導線。圖2A係一剖面示意圖,顯示圖1A的發光顯示裝置於一製程中的A-A剖面。圖2B係一剖面示意圖,顯示圖1A的發光顯示裝置於一製程中的B-B剖面。圖2C係一剖面示意圖,顯示圖1A的發光顯示裝置於一製程中的C-C剖面。圖2D係一剖面示意圖,顯示圖1A的發光顯示裝置於一製程中的D-D剖面。 FIG. 1A is a schematic plan view showing the first patterned conductive layer and its wires of a light-emitting display device according to an embodiment of the invention. FIG. 1B is a schematic plan view showing other patterned conductive layers and wires of the light-emitting display device according to an embodiment of the invention. FIG. 2A is a schematic cross-sectional view showing the A-A cross-section of the light-emitting display device of FIG. 1A in a manufacturing process. FIG. 2B is a schematic cross-sectional view showing a B-B cross-section of the light-emitting display device of FIG. 1A in a manufacturing process. 2C is a schematic cross-sectional view showing the C-C cross-section of the light-emitting display device of FIG. 1A in a manufacturing process. FIG. 2D is a schematic cross-sectional view showing the D-D cross-section of the light-emitting display device of FIG. 1A in a manufacturing process.
請同時參照圖1A至圖2C,一實施例中,發光顯示裝置1具有一基板100、配置於基板100上的第一圖案化導電層10、第二圖案化導電層20及第三圖案化導電層30、彼此電性隔離的第一銲墊區501、第二銲墊區502、第三銲墊區503、第四銲墊區504及多個電連接至銲墊區的發光件1000。各個發光件1000的分別對應於銲墊區501至504的各個接腳通過電性連接材料80例如錫膏固定且電性連接至對應的銲墊區501至504,其中銲墊區501和發光件1000的電源接腳構成電性連接而其他銲墊區502、503、504分別和發光件1000的發光訊號接腳構成
電性連接。發光件1000可以是單一的發光二極體元件、一個以上的發光二極體組合的發光二極體組件或者發光二極體晶片,但不包含驅動晶片(IC)。當發光件1000為單一的發光二極體時,和其對應連接的銲墊區可以只有二個。
1A to 2C, in one embodiment, the light-emitting
請繼續參照圖1A至圖2C,本實施例中,基板100具有一第一表面1001、背對第一表面1001的第二表面1002及多個貫通第一表面1001及第二表面1002的通孔1003,通孔1003用於電性連接位於基板100的第一表面1001一側的圖案化導電層及位於基板100的第二表面1002一側的圖案化導電層。基板100較佳為透明,其材質可以是玻璃、陶瓷、氮化鋁陶瓷、聚碳酸酯、聚對苯甲酸乙二酯、聚醯亞胺、聚酸甲酯、BT樹脂、玻璃纖維或環狀烯烴共聚物。完成電性連接的發光件1000依陣列形式配置於基板100的第二表面1002的同側,發光件彼此間的最小相隔距離不小於2毫米,較佳為2至3毫米,以有別於有機發光二極體(OLED)顯示器或微尺寸發光二極體(Micro-LED)顯示器。
Please continue to refer to FIGS. 1A to 2C. In this embodiment, the
如圖1B及圖2A至圖2D所示,第一圖案化導電層10配置於基板100的第一表面1001上,具有複數交織成網格狀的第一導線101,第一導線101包含第一延伸方向的第一導線1011及第二延伸方向的第一導線1012,第一延伸方向和第二延伸方向互相交叉。本實施例中,不同延伸方向的第一導線101交織出的網格形狀例如是矩形、六角形、橢圓形或圓形。第一導線101的線寬為25至100微米,相較於傳統導線具有更細小的線寬,藉以降低其在顯示畫面中的可視性。如圖1A及圖2A至圖2D所示,第二圖案化導電層20配置於基板100的第二表面1002上,具有至少三相互平行且彼此等距或不等距相隔的呈線狀的第二導線201、自各個第二導線201連接出的呈線狀的延伸部202、至少一和第二導線201相隔的島部203。第三圖案化導電層30配置於基板100的第二表面1002上但與第二圖案化導電層20係以一第一圖案化電性絕緣層40電性隔離。第三圖案化導電層30具有至少三連接至各個第二導線201的相互平行且彼此等距或不等距相隔
的呈線狀的第三導線301。第三導線301的延伸方向和第二導線201的延伸方向呈交叉,例如呈垂直。第二導線201經由延伸部202各自連接一個銲墊區,第三導線301延伸連接至發光顯示裝置的點亮訊號輸入端。一實施例中,延伸部202的延伸方向和第二導線201的延伸方向呈交叉,例如呈垂直,但和第三導線301的延伸方向呈平行。島部203和第二導線201相隔一距離而獨立配置的塊體,島部203的延伸方向和基板100的第二表面1002垂直,其可以與第二導線201於同一道製程中形成,也可以於另外製程中形成。如圖2B所示,島部203經由基板100的通孔1003其中之一和第一導線101的交接處102電性連接。交接處102即第一導線101的網格節點處。第二導線201的配置方向和第一導線101的配置方向呈交叉。第二導線201及第二導線201的延伸部202的線寬為25微米至100微米。可選地,第二導線201及第二導線201的延伸部202的線寬相同或不同於第一導線101的線寬。
As shown in FIGS. 1B and 2A to 2D, the first patterned
如圖1A、圖2B及圖2C所示,第一銲墊區501配置於基板100的第二表面1002的上方的第二圖案化導電層20的島部203上,第二銲墊區502、第三銲墊區503和第四銲墊區504分別配置於基板100的第二表面1002的上方的第二圖案化導電層20的三條彼此相鄰的第二導線201的延伸部202上。
As shown in FIGS. 1A, 2B, and 2C, the
請參照圖1A及圖2D,一實施例中,發光顯示裝置1還包含第一圖案化電性絕緣層40,配置於第二圖案化導電層20的上方,具有複數第一電性絕緣區塊401,使得第三導線301的部分區段位於第一電性絕緣區塊401上而與第二導線201電性隔離且分層配置,藉此增加第二導線201在第二圖案化導電層20中的配置空間以及將第三導線301的佈線空間和第一導線101的佈線空間重疊藉以弱化第三導線301在顯示畫面中的可視性。
1A and 2D, in one embodiment, the light-emitting
請繼續參照圖1A,一實施例中,發光顯示裝置1還具有第二圖案化電性絕緣層60,具有多個第二電性絕緣區塊601,這些第二電性絕緣區塊601分
別沿著銲墊區501、502、503、504的第一配置方向例如水平方向配置於基板100的第二表面1002上,用以隔離銲墊區501、502、503、504於銲墊區501、502、503、504的第二配置方向例如垂直方向上的電性接觸。另一實施例中,發光顯示裝置1還具有第三圖案化電性絕緣層70,具有多個第三電性絕緣區塊701,這些第三電性絕緣區塊701分別沿著銲墊區501、502、503、504的第二配置方向例如垂直方向配置於連接第三銲墊區503的第二導線201的上方,用以隔離銲墊區501、502、503、504於第一配置方向例如水平方向上的電性接觸。其他實施例中,第三圖案化電性絕緣層70也可和第二圖案化電性絕緣層60在同一道製程中形成,使第三電性絕緣區塊701配置於連接第三銲墊區503的第二導線201的下方且配置於基板100的第二表面1002上。上述的第二配置方向和第一配置方向呈互相交叉,例如呈互相垂直。實施例中,第一配置方向例如是和第二導線201的配置方向(圖1A所示的水平方向)平行,而第二配置方向例如是和第二導線201的配置方向垂直。
Please continue to refer to FIG. 1A. In one embodiment, the light-emitting
請繼續參照圖2A至圖2C,一實施例中,發光顯示裝置1還包含一第一圖案化導電金屬種子層900,配置於基板100的第一表面1001上,具有和第一圖案化導電層10的第一導線101的圖案相同的圖案,用以作為第一圖案化導電層10的形成準備層。在此情況下,第一導線101配置在第一圖案化導電金屬種子層900上。此外,發光顯示裝置1還包含一第二圖案化導電金屬種子層200,配置於基板100的第二表面1002上,具有和第二圖案化導電層20的第二導線201、延伸部202及島部203的圖案相同的圖案,用以作為第二圖案化導電層20的形成準備層。在此情況下,第二導線201、延伸部202及島部203配置在第二圖案化導電金屬種子層200上。
Please continue to refer to FIGS. 2A to 2C. In one embodiment, the light-emitting
圖3A係一剖面示意圖,顯示圖1A的發光顯示裝置於另一製程中的A-A剖面。圖3B係一剖面示意圖,顯示圖1A的發光顯示裝置於另一製程中的B-B 剖面。圖3C係一剖面示意圖,顯示圖1A的發光顯示裝置於另一製程中的C-C剖面。圖3D係一剖面示意圖,顯示圖1A的發光顯示裝置於另一製程中的D-D剖面。 FIG. 3A is a schematic cross-sectional view showing the A-A cross-section of the light-emitting display device of FIG. 1A in another manufacturing process. 3B is a schematic cross-sectional view showing the B-B of the light-emitting display device of FIG. 1A in another manufacturing process profile. FIG. 3C is a schematic cross-sectional view showing the C-C cross-section of the light-emitting display device of FIG. 1A in another manufacturing process. FIG. 3D is a schematic cross-sectional view showing the D-D cross-section of the light-emitting display device of FIG. 1A in another manufacturing process.
請同時參照圖1A、圖1B、圖3A至圖3D,另一製程中,不同於上述實施例的是,發光顯示裝置1雖具有第一圖案化導電金屬種子層900,但不具有第二圖案化導電金屬種子層200。其他元件均與前述實施例同。
Please refer to FIGS. 1A, 1B, and 3A to 3D at the same time. In another manufacturing process, the difference from the above-mentioned embodiment is that although the light-emitting
圖4係一平面示意圖,顯示本創作一實施例的發光顯示裝置的具蜂巢狀的網格導線。在前述實施例中,呈網狀的第一圖案化導電層10的第一導線101所構成的網格103的形狀可以是六角形而如蜂巢狀,藉此提升第一導線的導電效率。
FIG. 4 is a schematic plan view showing the honeycomb-shaped grid wires of the light-emitting display device according to an embodiment of the invention. In the foregoing embodiment, the shape of the
上述實施例中,儘管第三圖案化導電層30係和第二圖案化導電層20配置於基板100的第二表面1002上,但本創作不以此為限,其他實施例中,第三圖案化導電層30也可配置基板100的第一表面1001上而和第一圖案化導電層10彼此間電性隔離。換言之,只要第一圖案化導電層10、第二圖案化導電層20及第三圖案化導電層30彼此間可以電性隔離,其於基板100上的分層配置順序可以依情況變更,以滿足最佳的配置關係及最小的可視性要求。此外,各個圖案化導電層上的導線或延伸部或島部也可分層設置,只要滿足第一導線連接到發光件的電源接腳的銲墊區、第二導線的延伸部連接到發光件的其他接腳的銲墊區且第二導線各自連接至第三導線的電連接關係,本創作不對分層設置的配置態樣設限。
In the foregoing embodiment, although the third patterned
綜上所述,依照本創作各實施例所描述的發光顯示裝置將對應到發光件的接腳的銲墊區的連接導線分層配置,使得銲墊區中的電源連接導線和銲墊區中的訊號連接導線不共用同一平面配置空間,有利於加大電源連接導線的平面配置空間以及提升電源連接導線的導電率。由於基板的單一側表面上只配置電源連接導線,在加大的平面配置空間內,電源連接導線可被細分成複數 線寬更小的等效導線,以提高顯示畫面的通透度。另一方面,訊號連接導線的引出線路(即實施例中的第三導線)可以進一步利用電性絕緣層來進行分層配置,讓這些引出線路可以和電源連接導線在電性隔離下重疊配置以弱化引出線路的可視性。此外,發光件亦可採用微小型發光二極體晶片以降低發光件本身在顯示畫面中的可視性。如此一來,在發光件的配置基板是透明的情況下,可大幅地降低位於基板上的導線和發光件在顯示畫面中的可視性,進而提升在一定距離外觀看這類發光顯示器的對比度和清晰度。此外,第一圖案化導電層及第二圖案化導電層的材質可依製程的不同來進行選擇,在製程設計上具有彈性。例如,第一圖案化導電層的第一導線的材質可以是摻有導電粉末的漿料並可進一步添加可化學鍍的材料,可以是具高透明度的氧化銦錫(ITO)膜、氟摻雜氧化錫(FTO)膜、氧化鋅(ZnO)膜或氧化鋁鋅(AZO)膜,也可以是銅、銀、鎳或鎳金。同理,第二圖案化導電層的第二導線、第二導線的延伸部及島部的材質可以是摻有導電粉末的漿料並可進一步添加可化學鍍的材料,可以是具高透明度的氧化銦錫(ITO)膜、氟摻雜氧化錫(FTO)膜、氧化鋅(ZnO)膜或氧化鋁鋅(AZO)膜,也可以是銅、銀、鎳或鎳金。本創作中,第一圖案化導電層或第二導電層的材料並不限於上述所提的材料,凡具有導電性的材料例如石墨烯、奈米碳管等材質亦可被使用。 In summary, according to the light-emitting display device described in each embodiment of the present creation, the connecting wires corresponding to the pad areas of the pins of the light-emitting element are arranged in layers, so that the power connection wires in the pad area and the pad area are The signal connection wires do not share the same plane configuration space, which is beneficial to increase the plane configuration space of the power connection wires and improve the conductivity of the power connection wires. Since only the power connection wires are arranged on a single side surface of the substrate, the power connection wires can be subdivided into plural numbers in the enlarged plane configuration space Equivalent wire with a smaller line width to improve the transparency of the display screen. On the other hand, the lead-out lines of the signal connection wires (that is, the third lead in the embodiment) can be further arranged in layers with an electrical insulating layer, so that these lead-out lines can be overlapped with the power connection wires under electrical isolation. Weaken the visibility of lead-out lines. In addition, the light-emitting element can also use a miniature light-emitting diode chip to reduce the visibility of the light-emitting element itself in the display screen. In this way, in the case where the substrate for the light-emitting element is transparent, the visibility of the wires and the light-emitting element on the substrate in the display screen can be greatly reduced, thereby improving the contrast and contrast of viewing this type of light-emitting display from a certain distance. Clarity. In addition, the materials of the first patterned conductive layer and the second patterned conductive layer can be selected according to different manufacturing processes, which has flexibility in manufacturing process design. For example, the material of the first wire of the first patterned conductive layer can be a slurry doped with conductive powder and can be further added with an electroless plating material, which can be an indium tin oxide (ITO) film with high transparency, fluorine doping The tin oxide (FTO) film, zinc oxide (ZnO) film or aluminum oxide zinc (AZO) film may also be copper, silver, nickel or nickel gold. In the same way, the material of the second wire of the second patterned conductive layer, the extension of the second wire, and the island can be a slurry mixed with conductive powder and can be further added with an electroless plating material, which can be highly transparent The indium tin oxide (ITO) film, the fluorine-doped tin oxide (FTO) film, the zinc oxide (ZnO) film or the aluminum oxide zinc (AZO) film may also be copper, silver, nickel or nickel gold. In this creation, the material of the first patterned conductive layer or the second conductive layer is not limited to the materials mentioned above, and any conductive material such as graphene, carbon nanotube, etc. can also be used.
以上描述,對於本創作所屬技術領域的通常知識者而言,應可明瞭與實施。本創作的些許實施例揭露如上,然其並非用以限定本創作,任何所屬技術領域中具有通常知識者,在不脫離本創作的精神和範圍內,當可做些許的更動和潤飾。換言之,其它未脫離本創作所揭示的精神下所完成的等效實施例,均應包含於本創作,而本創作的保護範圍當以後附的申請專利範圍所界定者為準。 The above description should be understood and implemented for ordinary knowledgeable persons in the technical field to which this creation belongs. Some embodiments of this creation are disclosed above, but they are not used to limit this creation. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of this creation. In other words, other equivalent embodiments completed without departing from the spirit of this creation should be included in this creation, and the scope of protection of this creation shall be subject to the scope of the patent application attached hereafter.
1:發光顯示裝置 1: Light-emitting display device
100:基板 100: substrate
1001:第一表面 1001: first surface
1002:第二表面 1002: second surface
1003:通孔 1003: Through hole
900:第一圖案化導電金屬種子層 900: The first patterned conductive metal seed layer
101:第一導線 101: first wire
102:交接處 102: Junction
200:第二圖案化導電金屬種子層 200: second patterned conductive metal seed layer
202:延伸部 202: Extension
203:島部 203: Island
501:第一銲墊區 501: The first pad area
502:第二銲墊區 502: second pad area
80:電性連接材料 80: Electrical connection material
1000:發光件 1000: luminous parts
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US202063119269P | 2020-11-30 | 2020-11-30 | |
US63/119269 | 2020-11-30 |
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TW109147012A TW202224173A (en) | 2020-11-30 | 2020-12-31 | Light emitting display device and method of manufacturing the same |
TW110102902A TW202224174A (en) | 2020-11-30 | 2021-01-26 | Light emitting display device and method of manufacturing the same |
TW110200975U TWM618817U (en) | 2020-11-30 | 2021-01-26 | Light emitting display device |
TW110102899A TW202224230A (en) | 2020-11-30 | 2021-01-26 | Light emitting display device and method of manufacturing the same |
TW110200974U TWM617169U (en) | 2020-11-30 | 2021-01-26 | Light emitting display device |
TW110107196A TW202224175A (en) | 2020-11-30 | 2021-02-27 | Light emitting display device and method of manufacturing the same |
TW110202187U TWM615450U (en) | 2020-11-30 | 2021-02-27 | Light emitting display device |
TW110205210U TWM616945U (en) | 2020-11-30 | 2021-05-08 | Transparent light emitting display device |
TW110116665A TW202224176A (en) | 2020-11-30 | 2021-05-08 | Light emitting display device having high aperture ratio and method of manufacturing the same |
TW110205211U TWM616496U (en) | 2020-11-30 | 2021-05-08 | Light emitting display device having high aperture ratio |
TW110121564A TW202224035A (en) | 2020-11-30 | 2021-06-13 | Method of packaging light emitting display device and light emitting display device packaging structure |
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TW109147012A TW202224173A (en) | 2020-11-30 | 2020-12-31 | Light emitting display device and method of manufacturing the same |
TW110102902A TW202224174A (en) | 2020-11-30 | 2021-01-26 | Light emitting display device and method of manufacturing the same |
TW110200975U TWM618817U (en) | 2020-11-30 | 2021-01-26 | Light emitting display device |
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TW110205210U TWM616945U (en) | 2020-11-30 | 2021-05-08 | Transparent light emitting display device |
TW110116665A TW202224176A (en) | 2020-11-30 | 2021-05-08 | Light emitting display device having high aperture ratio and method of manufacturing the same |
TW110205211U TWM616496U (en) | 2020-11-30 | 2021-05-08 | Light emitting display device having high aperture ratio |
TW110121564A TW202224035A (en) | 2020-11-30 | 2021-06-13 | Method of packaging light emitting display device and light emitting display device packaging structure |
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TWI783724B (en) * | 2021-10-12 | 2022-11-11 | 友達光電股份有限公司 | Display panel |
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TWI783724B (en) * | 2021-10-12 | 2022-11-11 | 友達光電股份有限公司 | Display panel |
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CN214541404U (en) | 2021-10-29 |
TW202224173A (en) | 2022-06-16 |
TW202224175A (en) | 2022-06-16 |
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TWM614583U (en) | 2021-07-21 |
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CN114582248A (en) | 2022-06-03 |
CN214504847U (en) | 2021-10-26 |
TWM618817U (en) | 2021-11-01 |
TW202224035A (en) | 2022-06-16 |
TWM615450U (en) | 2021-08-11 |
CN218214521U (en) | 2023-01-03 |
TW202224174A (en) | 2022-06-16 |
CN114582249A (en) | 2022-06-03 |
CN214336198U (en) | 2021-10-01 |
CN114639315A (en) | 2022-06-17 |
TWM616945U (en) | 2021-09-11 |
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