TWM618817U - Light emitting display device - Google Patents

Abstract

The light-emitting display device has a substrate, a first patterned conductive layer, a patterned electrically insulating layer, and a second patterned conductive layer arranged in layers on the substrate, a plurality of pad regions electrically isolated from each other, and a plurality of corresponding pad regions connected Of light-emitting components. The minimum distance between the light-emitting components is 2 to 3 mm. The first patterned conductive layer has a plurality of grid-shaped first grid wires and at least one first extension connected from a grid node of the first grid wire, and the second patterned conductive layer has a plurality of grids The grid-shaped second grid wire and at least one second extension part connected from a grid node of the second grid wire. The patterned electrical insulating layer is used to isolate the electrical contact between the second grid wire and the first grid wire. The first grid wire is electrically connected to a bonding pad area through the first extension part, and the second grid wire is electrically connected to another bonding pad area through the second extension part.

Description

Light-emitting display device

This creation is about a display device, especially a light-emitting display device.

In response to the development of display screens that are larger in size, flattened, thinner, lighter, and flexible, passive point light sources and active point light sources are used as the light source of the display, and flexible substrates are used to configure these light sources. The development of light-emitting display technology for substrates has become increasingly important. The passive point light source is, for example, a light emitting diode (LED), and the active point light source is, for example, an organic light-emitting diode (OLED). In a branch of technological development, the follow-up development of large-screen light-emitting displays developed with LEDs as light sources for people to watch from a distance is worthy of attention.

In the production of this type of light-emitting display for people to watch from a distance, you can choose to install LED components containing LEDs and their driver chips (IC) on the substrate in the form of an array, and the distance between the LED components is not less than 2 mm ( mm), which is different from organic light-emitting diode (OLED) displays or micro-size light-emitting diode (Micro-LED) displays for people to watch at close range. In order for each LED component in the array to be lit and have a brightness that meets the requirements, the configuration substrates and configuration wires of these LED components must have good conductive power. In addition, in order to improve the contrast of viewing such light-emitting displays from a long distance, it is also necessary to reduce the visibility of the configuration substrates of these LED components and their configuration wires in the display screen. On the other hand, in order to meet the display effects required by various applications, the configuration of these LED components The production of wires must have good design changeability and be able to be completed quickly. In view of the above technical problems, this author hopes to propose solutions.

In view of the above-mentioned problems, the present creation provides a light-emitting display device.

In one embodiment, the light-emitting display device has a substrate, a first patterned conductive layer disposed on the substrate, a plurality of light-emitting components, and at least four bonding pad regions that are electrically isolated from each other. The substrate has a first surface and a second surface opposite to the first surface. The first patterned conductive layer is disposed above the first surface of the substrate, and has a first grid wire in a grid shape and at least one first extension connected from a grid node of the first grid wire . Each light-emitting component has a driving chip of a light-emitting diode, and all the light-emitting components are arranged in an array on the same side of the first surface of the substrate with a minimum distance of 2 to 3 mm. These pad areas are respectively electrically connected to the input voltage pin, the data signal input or output pin, the clock signal input or output pin, and the ground pin of the at least one light-emitting component. Wherein, the solder pad area that is electrically connected to the input voltage pin is electrically connected to the first grid wire via the first extension, and is electrically connected to the data signal input or output pin, and the clock signal input or output pin. The pad areas are respectively electrically connected with the first elongated wires.

In an embodiment, the first surface of the substrate of the light-emitting display device has a plurality of separated first configuration regions and a plurality of separated second configuration regions, and each second configuration region is between at least two first configuration regions, each The first configuration area has a first grid wire and a first extension, and each second configuration area has a bonding pad area and at least two linear first elongated wires that are parallel to each other and spaced at equal or unequal distances from each other. The extending direction of an elongated wire and the extending direction of the first extending portion intersect. In addition, the pad area that is electrically connected to the input voltage pin is electrically connected to the first extension and the first grid wire in one of the first configuration areas, and is electrically connected to the pad area that is electrically connected to the ground pin. The first extension part and the first grid wire to the other one of the first configuration area.

In another embodiment, the first grid wire of the first patterned conductive layer of the light-emitting display device occupies 80% of the area of the first surface of the substrate, and the first grid wire of the first patterned conductive layer of the light-emitting display device is The extension direction of the first extension portion is parallel to the configuration plane of the first grid wire.

In another embodiment, the light-emitting display device further has a patterned electrically insulating layer and a second patterned conductive layer. The patterned electrical insulation layer is disposed above the first patterned conductive layer, and has a plurality of first electrical insulation blocks, a plurality of second electrical insulation blocks, and a plurality of third electrical insulation blocks. The second patterned conductive layer is disposed above the patterned electrically insulating layer, and has a plurality of grid-shaped second grid wires, and at least one second extension portion connected from a grid node of the second grid wires And at least two second elongated wires parallel to each other and spaced at equal or unequal distances from each other in a linear shape, and the extending direction of the second elongated wire and the extending direction of the second extending portion intersect. Wherein, each of the first electrically insulating regions covers a configuration area on the first patterned conductive layer corresponding to the second grid wire to isolate the electrical contact between the second grid wire and the first grid wire; Each of the second electrically insulating regions covers a configuration area of the first patterned conductive layer corresponding to the portion of the second extension portion adjacent to the second grid wire to isolate the second extension portion adjacent to the second grid wire Electrical contact between the part and the first grid wire; each third electrically insulating area covers a configuration area on the first patterned conductive layer corresponding to each second elongated wire excluding the connection part of the pad area, with To isolate the electrical contact between the part of the second elongated wire excluding the connection part of the pad area and the first grid wire; these pad areas are exposed from the patterned electrical insulating layer and correspond to the ground pins The electrically connected pad areas are electrically connected via the second extension part and the second grid wire; the pad areas electrically connected to the data signal input or output pins and the clock signal input or output pins are respectively connected to a second Slender wire.

In another embodiment, the pad area connection portion of each second elongated wire of the second patterned conductive layer of the light-emitting display device is disposed on the first surface of the substrate, and the second patterned conductive layer of the light-emitting display device is The part of the two extension parts connected to the bonding pad area electrically connected to the ground pin is disposed on the first surface of the substrate.

In still another embodiment, the first grid wire of the first patterned conductive layer of the light-emitting display device occupies 80% of the area of the first surface of the substrate, and the first grid wire of the first patterned conductive layer of the light-emitting display device is The extension direction of the first extension portion is perpendicular to the configuration plane of the first grid wire.

In another embodiment, the light-emitting display device further has a patterned electrically insulating layer and a second patterned conductive layer. The patterned electrical insulation layer is disposed above the first patterned conductive layer, and has a plurality of first electrical insulation blocks, a plurality of second electrical insulation blocks, and a plurality of third electrical insulation blocks. The second patterned conductive layer is disposed above the patterned electrically insulating layer, and has a plurality of grid-shaped second grid wires, and at least one second extension portion connected from a grid node of the second grid wires And at least two second elongated wires parallel to each other and spaced at equal or unequal distances from each other in a linear shape, and the extending direction of the second elongated wire and the extending direction of the second extending portion intersect. Wherein, each of the first electrically insulating regions covers a configuration area on the first patterned conductive layer corresponding to the second grid wire to isolate the electrical contact between the second grid wire and the first grid wire; Each of the second electrically insulating regions covers a configuration area on the first patterned conductive layer that is adjacent to the second extension portion and the portion of the bonding pad area that is electrically connected to the ground pin to isolate the second extension portion. The electrical contact between the portion of the pad area that is electrically connected to the ground pin and the first grid wire; each third electrically insulating area covers the first patterned conductive layer corresponding to each second elongated wire A configuration area of the connection part of the pad area is used to isolate the electrical contact between the second elongated wire and the first grid wire; The grid wires are electrically connected; the bonding pad areas corresponding to the data signal input or output pins and the clock signal input or output pins are respectively connected to a second slender wire.

In each embodiment, the light-emitting display device further includes a patterned conductive metal seed layer formed on the first surface of the substrate, having the same pattern as that of the first patterned conductive layer, and used as the first patterned conductive layer The formation preparation layer.

In the embodiment in which the light-emitting display device has the second patterned conductive layer, the line width of the second grid wires of the second patterned conductive layer of the light-emitting display device is 25 μm to 100 μm.

To sum up, according to the light-emitting display device described in the embodiments of the present invention, the connecting wires of the pad areas corresponding to the pins of the light-emitting components are arranged in sections or layers, so that the input voltage in the pad area is connected to the wires And the signal connection wires in the grounding wire and the bonding pad area can be staggered in sections or layers, so as to increase the plane configuration space of the input voltage connection wires and the ground wires. Therefore, the input voltage connection wire and the ground wire can be subdivided into multiple grid wires with smaller line widths in the enlarged planar configuration space to improve the transparency of the display screen.

In order to make the above-mentioned features and advantages of this creation more obvious and understandable, the following specific examples are given in conjunction with the accompanying drawings to describe in detail as follows.

1, 1a, 1b: luminous display device

10: substrate

101: first surface

102: second surface

103: The first configuration area

104: The second configuration area

20, 20a, 20b: the first patterned conductive layer

201, 201a, 201b: first grid wire

202, 202a, 202b: first extension

203: The first slender wire

30a, 30b: patterned electrical insulating layer

301a, 301b: the first electrical insulation block

302a, 302b: second electrical insulation block

303a, 303b: the third electrical insulation block

311~315: Electrical insulating layer

40a, 40b: second patterned conductive layer

401a, 401b: second grid wire

402a, 402b: second extension

403a, 403b: second slender wire

501, 501a, 501b: the first pad area

502, 502a, 502b: the second pad area

503, 503a, 503b: third pad area

504, 504a, 504b: fourth pad area

505, 505a, 505b: fifth pad area

506, 506a, 506b: sixth pad area

80: Electrical connection material

90, 90a, 90b: patterned conductive metal seed layer

901, 901a, 901b: pattern

100: Light-emitting components

FIG. 1 is a schematic plan view showing the configuration relationship between the first patterned conductive layer and the pad area of the light-emitting display device of the first embodiment of the invention.

FIG. 2A is a schematic cross-sectional view showing the A-A cross-section of the light-emitting display device of FIG. 1 in a manufacturing process.

FIG. 2B is a schematic cross-sectional view showing the A-A cross-section of the light-emitting display device of FIG. 1 in another manufacturing process.

3 is a schematic plan view showing the arrangement relationship of the first patterned conductive layer, the second patterned conductive layer and the pad area of the light-emitting display device of the second embodiment of the present invention.

4A is a schematic cross-sectional view showing the A-A cross-section of the light-emitting display device of FIG. 4 in a manufacturing process.

4B is a schematic cross-sectional view showing a B-B cross-section of the light-emitting display device of FIG. 4 in a manufacturing process.

4C is a schematic cross-sectional view showing the A-A cross-section of the light-emitting display device of FIG. 4 in another manufacturing process.

FIG. 4D is a schematic cross-sectional view showing a B-B cross-section of the light-emitting display device of FIG. 4 in another manufacturing process.

FIG. 5 is a schematic plan view showing the configuration relationship of the first patterned conductive layer, the second patterned conductive layer and the pad area of the light-emitting display device of the third embodiment of the present invention.

FIG. 6A is a schematic cross-sectional view showing the A-A cross-section of the light-emitting display device of FIG. 7 in a manufacturing process.

FIG. 6B is a schematic cross-sectional view showing a B-B cross-section of the light-emitting display device of FIG. 7 in a manufacturing process.

FIG. 6C is a schematic cross-sectional view showing the A-A cross-section of the light-emitting display device of FIG. 7 in another manufacturing process.

FIG. 6D is a schematic cross-sectional view showing a B-B cross-section of the light-emitting display device of FIG. 7 in another manufacturing process.

FIG. 7 is a schematic cross-sectional view showing the electrically insulating layer in the form of multilayer stacking of the light-emitting display device according to an embodiment of the present invention.

FIG. 8 is a schematic plan view showing the honeycomb-shaped grid wires of the light-emitting display device according to an embodiment of the invention.

This creation discloses a light-emitting display device. The following narratives are already understood by those of ordinary skill in the art and will not be fully described, such as the light-emitting principle of light-emitting diodes, and layers with specific conductive circuit patterns. A patterned conductive layer with a three-dimensional structure (the line patterns have a height difference between each other). In addition, if the meaning of the technical terms described in the following text is different from the meaning of the usual terms in the technical field, the meaning in the text shall prevail, and the accompanying drawings in the text are intended to express the meaning related to the creative feature , Not drawn completely according to the actual size, but also stated first.

Referring to FIGS. 1, 2A and 2B at the same time, in a first embodiment, the light-emitting display device 1 has a substrate 10, a first patterned conductive layer 20 disposed above the substrate 10, and a first patterned conductive layer 20 disposed on the At least four, for example, six of the first pad region 501 to the sixth pad region 506, and a plurality of light-emitting components 100 that are separated and electrically isolated from each other. Each light-emitting component 100 has more than one light-emitting diode (LED) capable of emitting red light (Red), green light (Green), and blue light (Blue) and its driving IC, and the input voltage of these light-emitting components 100 The pins, data signal input pins, clock signal input pins, grounded pins, clock signal output pins, and data signal output pins are respectively connected by electrical connection material 80 For example, the solder paste is fixed and electrically connected to the first pad area 501 to the sixth pad area 506 correspondingly. If the local area including these pad areas is regarded as a pad area unit, there are a plurality of pad area units arranged in an array on the substrate 10, and all the light-emitting components 100 will be fixed to the corresponding pads. The zone units are arranged on the substrate 10 in an array form. In this embodiment, the substrate 10 is preferably transparent and the material can be glass, ceramic, aluminum nitride ceramic, polycarbonate, polyethylene terephthalate, polyimide, polymethyl ester, BT resin, glass Fiber or cyclic olefin copolymer, the minimum distance between the light-emitting components 100 is not less than 2 mm, preferably 2 to 3 mm, which is different from organic light-emitting diode (OLED) displays or micro-size light-emitting diodes (Micro-LED) display. In other embodiments, the six pad areas can be integrated into only four pad areas, which are respectively used for the input voltage pins, data signal input and output pins, and clock signal input and output pins of the light emitting device 100. , The grounding pin corresponds to the electrical connection.

Please continue to refer to FIGS. 1 to 2B. In this embodiment, the substrate 10 has a first surface 101 and a second surface 102 opposite to the first surface 101. All the light-emitting components 100 are arranged in an array on the first surface 101. On the same side. The first surface 101 of the substrate 10 has a plurality of separated first configuration regions 103, each of the first configuration regions 103 has a plurality of grid-shaped first grid wires 201 and a grid node from the first grid wires 201 The first extension 202 that is connected in a linear shape, the so-called grid node is the junction of the grid wires that make up the wires. The six pad areas are arranged between the two first arrangement areas 103; and The input voltage pin of the component 100 corresponds to the first extension 202 and the first mesh wire 201 of one of the first pad area 501 and the first configuration area 103 that are electrically connected, and is electrically connected to the ground of the light-emitting component 100 The first extension 202 and the first mesh wire 201 of the other one of the fourth bonding pad area 504 and the first configuration area 103 that are electrically connected to each other are electrically connected. On the other hand, the first surface 101 of the substrate 10 has a plurality of separated second configuration regions 104, each second configuration region 104 is between the two first configuration regions 103, and each second configuration region 104 has at least two mutual The first elongated wires 203 that are parallel and are equally spaced or unequally spaced apart in a linear shape. The extension direction of the first elongated wire 203 and the extension direction of the first extension portion 202 cross, for example, are perpendicular.

Please continue to refer to FIGS. 1 to 2B, the first patterned conductive layer 20 is disposed above the first surface 101 of the substrate 10 and has the aforementioned first grid wire 201, first extension 202 and first elongated wire 203. The first grid wire 201 is disposed in the first configuration area 103, and its grid shape is a polygon, for example, a hexagon as shown in FIG. 8 or other shapes such as a circle. The extension direction of the first extension portion 202 (for example, the vertical direction in FIG. 1) and the arrangement direction of the first arrangement area 103 (for example, the vertical direction in FIG. 1) are parallel. As shown in FIGS. 1 and 2A or 2B, the first pad area 501 is configured on the first patterned conductive layer 20 and connected to the first extension 202 of the first grid wire 201, and the fourth pad area 504 is configured On the first patterned conductive layer 20 and connected to the first extension 202 of another first grid wire 201, the second pad area 502, the third pad area 503, the fifth pad area 505, and the sixth pad area The pad region 506 is configured on the first patterned conductive layer 20 and is respectively connected to four first elongated conductive lines 203 located in the second configuration region 104 and adjacent to each other. In other words, the first grid wire 201 serves as a wire between the input voltage pin and the input voltage source of the light-emitting component 100 or between the ground pin and the ground terminal of the light-emitting component 100; the first extension 202 is As a wire connected to the first pad area 501 or the fourth pad area 504 and directly connected to the input voltage pin or ground pin of the light-emitting component 100; the first elongated wire 203 is used as the data signal input of the light-emitting component 100 /Output pin or the wire of the clock signal input/output pin. In other words, the first grid wire 201 is used to withstand the driving voltage and current of the light-emitting element 100, and the line width of the wires should be greater than or equal to the first elongated wire The line width of 203. In order to reduce the visibility of the first grid wire 201, the first extension 202, and the first elongated wire 203, the line width can be adjusted as required without affecting the required conductivity. In an embodiment, the line width of the constituent wires of the first grid wire 201, the first extension 202, and the first elongated wire 203 is 25 μm to 100 μm.

2A, in one embodiment, the light-emitting display device 1 further includes a patterned conductive metal seed layer 90, which is disposed on the first surface 101 of the substrate 10, and has a first mesh with the first patterned conductive layer 20 The pattern 901 with the same pattern of the grid wire 201, the first extension 202 and the first elongated wire 203 is used as a preparation layer for the formation of the first patterned conductive layer 20. In this case, the first grid wire 201, the first extension 202 and the first elongated wire 203 are arranged on the corresponding pattern 901 of the patterned conductive metal seed layer 90.

Referring to FIGS. 3 to 4D at the same time, in a second embodiment, the light-emitting display device 1a has the aforementioned substrate 10 and the light-emitting element 100, a first patterned conductive layer 20a disposed on the substrate 10, and a patterned electrically insulating layer 30a, the second patterned conductive layer 40a, and at least four, such as six, of the first patterned conductive layer 20a and the second patterned conductive layer 40a, which are separated from each other and electrically isolated first pad regions 501a To the sixth pad area 506a. In this embodiment, each pin of each light-emitting element 100 is electrically connected to the first pad area 501a to the sixth pad area 506a in the aforementioned manner. In other respects, the characteristics of the substrate 10 itself, the characteristics of the light-emitting component 100 itself, the arrangement relationship of the first pad region 501a to the sixth pad region 506a on the substrate 10, and the distance between the light-emitting components 100 are all the same as those described above. The descriptions of an embodiment are the same, and will not be repeated here, and only the differences between this embodiment and the previous embodiment will be described below.

Please continue to refer to FIGS. 3 to 4D. In this embodiment, all the light-emitting components 100 are disposed on the same side of the first surface 101. The first patterned conductive layer 20a is disposed above the first surface 101 of the substrate 10, and has a plurality of grid-shaped first grid wires 201a and at least one grid node connected from the first grid wire 201a The first extension 202a. In this embodiment, the first grid wire 201a occupies 80% of the area of the first surface 101 of the substrate 10, and the grid shape is polygonal, for example, the hexagonal shape shown in FIG. 8. Or other shapes such as circles or rectangles. The first extension 202a is linear, and its extension direction is parallel to the configuration plane of the first grid wire 201a, that is, the first surface 101. The first extension 202a and the first grid wire 201a can be formed in one manufacturing process, or can be formed in different manufacturing processes.

As shown in FIGS. 3 to 4D, the second patterned conductive layer 40a is disposed above the first patterned conductive layer 20a, and has a plurality of grid-shaped second grid wires 401a, and at least one second grid wire A linear second extension 402a connected by a grid node of 401a and at least two second elongated wires 403a parallel to each other and spaced at equal or unequal distances from each other in linear form. The extension direction of the second extension portion 402a (for example, the vertical direction in FIG. 3) and the extension direction of the second elongated wire 403a (for example, the horizontal direction in FIG. 3) intersect, for example, are perpendicular. The extending direction of the second elongated wire 403a and the extending direction of the constituent wires of the first grid wire 201a are not parallel. The first grid wire 201a, the pad area connection portion of the first extension 202a of the first grid wire, the pad area connection portion of the second extension 402a of the second grid wire 401a, the second elongated wire 403a The connecting portions of the pad regions are all arranged on the first surface 101 of the substrate 10.

As shown in FIGS. 3 and 4A to 4D, the patterned electrically insulating layer 30a is disposed between the second patterned conductive layer 40a and the first patterned conductive layer 20a, and has a plurality of first electrically insulating regions 301a , A plurality of second electrically insulating blocks 302a and a plurality of third electrically insulating blocks 303a. Each first electrically insulating block 301a covers a configuration area on the first patterned conductive layer 20a corresponding to the second grid wire 401a, and is used to isolate the electrical power between the second grid wire 401a and the first grid wire 201a. Sexual contact; each second electrically insulating block 302a covers a configuration area on the first patterned conductive layer 20a corresponding to the portion of the second extension portion 402a adjacent to the second mesh wire 401a to isolate the second extension portion 402a The electrical contact between the portion adjacent to the second grid wire 401a and the first grid wire 201a; each third electrically insulating block 303a covers the first patterned conductive layer 20a corresponding to the second elongated wire 403a A configuration area outside the connecting portion of the pad area is used to isolate the electrical contact between the portion of the second elongated wire 403a excluding the connecting portion of the pad area and the first grid wire 201a. As shown in FIG. 4B or 4D, each second elongated wire 403a straddles the first grid The plurality of wires 201a constitute the upper part of the wires and are electrically isolated from the first grid wire 201a by the third electrically insulating block 303a.

As shown in FIGS. 3 to 4D, the six pad regions 501a to 506a are exposed from the patterned electrically insulating layer 30a, and the first pad region 501a is disposed on the first patterned conductive layer 20a and passes through the first mesh The first extension 202a of the grid wire 201a is electrically connected to the first grid wire 201a, and the fourth pad area 504a is disposed on the second patterned conductive layer 40a and passes through the second extension 402a and the second grid wire 401a of the second grid wire 401a. The second grid wire 401a is electrically connected. The second pad area 502a, the third pad area 503a, the fifth pad area 505a, and the sixth pad area 506a are disposed on the second patterned conductive layer 40a and are connected to four wires respectively. The second elongated wires 403a adjacent to each other. In other words, the first mesh wire 201a is used as a wire between the input voltage pin of the light-emitting component 100 and the input voltage source; the first extension 202a of the first mesh wire 201a is used as the first pad area 501a The connection is a wire directly connected to the input voltage pin of the light-emitting component 100; the second grid wire 401a serves as a wire between the ground pin and the ground terminal of the light-emitting component 100; the second grid wire 401a The second extension 402a is used as a wire connected to the fourth pad area 504a and directly connected to the ground pin of the light-emitting component 100; the second elongated wire 403a is used as a data signal input/output pin or clock pulse of the light-emitting component 100 Wires for signal input/output pins. In other words, the first mesh wire 201a and the second mesh wire 401a are used to withstand the power supply voltage and current, and the line width of the wires should be greater than or equal to the line width of the second elongated wire 403a. In order to reduce the visibility of the first mesh wire 201a, the first extension 202a, the second mesh wire 401a, the second extension 402a, and the second elongated wire 403a, it can be as required without affecting the required conductivity. Adjust its line width. In one embodiment, the wire widths of the first and second grid wires 201a and 401a, the first extension 202a and the second extension 402a, and the second elongated wire 403a are 25 to 100 microns. Optionally, the line widths of the constituent wires of the first grid wire 201a and the second grid wire 401a may be the same or different.

Please continue to refer to FIGS. 4A and 4B. In one embodiment, the light-emitting display device 1a further includes a patterned conductive metal seed layer 90a, which is disposed on the first surface 101 of the substrate 10 and has a first pattern The pattern 901a with the same pattern of the first grid wire 201a and the first extension portion 202a of the conductive layer 20a is used as a preparation layer for the formation of the first patterned conductive layer 20a. In this case, the first mesh wire 201a and the first extension 202a are disposed on the corresponding pattern 901a of the patterned conductive metal seed layer 90a.

Referring to FIGS. 5 to 6D at the same time, in a third embodiment, a light-emitting display device 1b has the aforementioned substrate 10 and light-emitting element 100, a first patterned conductive layer 20b and a patterned electrically insulating layer disposed on the substrate 10 30b, the second patterned conductive layer 40b, and at least four, for example, six of the first patterned conductive layer 20b and the second patterned conductive layer 40b, are separated from each other and electrically isolated first pad regions 501b To the sixth pad area 506b. The parts of this embodiment that are the same as those of the second embodiment will not be repeated, and only the differences between this embodiment and the second embodiment will be described below.

Please continue to refer to FIGS. 5 to 6D. In this embodiment, each pin of each light-emitting element 100 is electrically connected to the first pad area 501b to the sixth pad area 506b in the aforementioned manner. All the light-emitting components 100 are arranged on the same side of the first surface 101 of the substrate 10. The first patterned conductive layer 20b is disposed above the first surface 101 of the substrate 10, and has a plurality of grid-shaped first grid wires 201b and at least one grid node connected from the first grid wire 201b The first extension 202b. In this embodiment, the first grid wire 201b occupies 80% of the area of the first surface 101 of the substrate 10, and the grid shape is the same as described above. The first extension portion 202b is columnar, and its extension direction is perpendicular to the configuration plane of the first grid wire 201b, that is, the first surface 101. The first extension 202b and the first grid wire 201b may be formed in one process, or may be formed in different processes.

As shown in FIGS. 5 to 6D, the second patterned conductive layer 40b is disposed above the first patterned conductive layer 20b, and has a plurality of grid-shaped second grid wires 401b, and at least one second grid wire A linear second extension 402b connected by a grid node of the 401b and at least two second elongated wires 403b parallel to each other and spaced at equal or unequal distances from each other in a linear shape. The extension direction of the second extension portion 402b (for example, the vertical direction in FIG. 5) and the extension direction of the second elongated wire 403b (for example, the horizontal direction in FIG. 5) intersect, for example, are perpendicular. The extension direction of the second elongated wire 403b and the first grid wire 201b The extension directions of the constituent wires are not parallel. The bonding pad area connecting portion of the second extension 402b of the second grid wire 401b and the bonding pad area connecting portion of the second elongated wire 403b are both arranged on a patterned electrical insulation located above the first surface 101 of the substrate 10. On layer 30b.

As shown in FIGS. 5 and 6A to 6D, the patterned electrically insulating layer 30b is disposed between the second patterned conductive layer 40b and the first patterned conductive layer 20b, and has a plurality of first electrically insulating regions 301b , A plurality of second electrically insulating blocks 302b and a plurality of third electrically insulating blocks 303b. Each first electrically insulating block 301b covers a configuration area on the first patterned conductive layer 20b corresponding to the second grid wire 401b, and is used to isolate the electrical power between the second grid wire 401b and the first grid wire 201b. Sexual contact; each second electrically insulating block 302b covers the portion of the first patterned conductive layer 20b that is adjacent to the second extension 402b and the ground pin of the light-emitting component 100 is electrically connected to the fourth pad area 504b A configuration area for isolating the electrical contact between the adjacent portion of the second extension 402b and the ground pin of the light-emitting assembly 100 corresponding to the electrical connection between the portion of the fourth pad area 504b and the first mesh wire 201b; The three-electric insulating block 303b covers a configuration area on the first patterned conductive layer 20b corresponding to the second elongated wire 403b including the connection part of the pad area, and is used to isolate the second elongated wire 403b and the first grid wire 201b Electrical contact between. As shown in FIG. 8B or 8D, each second elongated wire 403b straddles the top of the plurality of constituent wires of the first grid wire 201b and is electrically connected to the first grid wire 201b by a third electrically insulating block 303b. isolation.

As shown in FIGS. 5 to 6D, except for the first pad area 501b, the other pad areas are all located on the patterned electrically insulating layer 30b, and the first pad area 501b is arranged on the first patterned conductive layer 20b And through the first extension 202b of the first grid wire 201b and the first grid wire 201b are electrically connected, the fourth pad area 504b is disposed on the second patterned conductive layer 40b and through the second grid wire 401b The two extension portions 402b are electrically connected to the second grid wire 401b, and the second pad area 502b, the third pad area 503b, the fifth pad area 505b, and the sixth pad area 506b are disposed on the second patterned conductive layer 40b Four second elongated wires 403b adjacent to each other are respectively connected to the upper side. In other aspects, the first mesh wire 201b, the first extension 202b, The connection relationship between the second mesh wire 401b, the second extension portion 402b, and the second elongated wire 403b and the respective pad areas, as well as their technical functions and line width design, are the same as those described in the second embodiment. Go into details again.

Please continue to refer to FIGS. 6A and 6B. In one embodiment, the light-emitting display device 1b further includes a patterned conductive metal seed layer 90b, which is disposed on the first surface 101 of the substrate 10 and has the same thickness as the first patterned conductive layer 20b. The pattern 901b with the same pattern of the first grid wire 201b and the first extension 202b is used as a preparation layer for the formation of the first patterned conductive layer 20b. In this case, the first grid wire 201b and the first extension 202b are disposed on the corresponding pattern 901b of the patterned conductive metal seed layer 90b.

FIG. 7 is a schematic cross-sectional view showing the electrically insulating layer in the form of multilayer stacking of the light-emitting display device according to an embodiment of the present invention. In the foregoing embodiments, the first, second, or third electrically insulating blocks of the patterned electrically insulating layer 30a or 30b may be composed of a plurality of electrically insulating layers 311 to The 315 is stacked and the sides are stepped, thereby increasing the flexibility of each electrically insulating block. On the other hand, FIG. 8 is a schematic plan view showing the honeycomb-shaped grid wires of the light-emitting display device according to an embodiment of the invention. In the foregoing embodiments, the first grid wire 201 in FIG. 1, the first grid wire 201a and the second grid wire 401a in FIG. 3, and the first grid wire 201b and the second grid wire in FIG. The grid shape of 401b can be hexagonal like a honeycomb shape, thereby improving its conductivity.

To sum up, according to the light-emitting display device described in the embodiments of the present invention, the connecting wires of the pad areas corresponding to the pins of the light-emitting components are arranged in sections or layers, so that the input voltage in the pad area is connected to the wires And the signal connection wires in the grounding wire and the bonding pad area can be staggered in sections or layers, so as to increase the plane configuration space of the input voltage connection wires and the ground wires. Therefore, the input voltage connection wire and the ground wire can be subdivided into multiple grid wires with smaller line widths in the enlarged planar configuration space to improve the transparency of the display screen. In this way, when the configuration substrate of the light-emitting component is transparent, the visibility of the configuration wires on the substrate in the display screen can be greatly reduced, thereby improving the contrast and clarity of viewing this type of light-emitting display from a certain distance. . this In addition, in terms of manufacturing process design, the material of each patterned conductive layer can be selected according to the manufacturing process and has flexibility. As long as it has conductive properties, this creation is not limited here. For example, the materials of the first grid wires and the first extensions of the first patterned conductive layer, the second grid wires and the second extensions of the second patterned conductive layer in each embodiment may be doped with conductive powder The paste can be further added with electroless plating materials, which can be high-transparency indium tin oxide (ITO) film, fluorine-doped tin oxide (FTO) film, zinc oxide (ZnO) film or aluminum zinc (AZO) The film can be made of copper, silver, nickel or nickel gold, or it can be made of graphene, carbon nanotubes and other materials.

The above description should be understood and implemented by ordinary knowledgeable persons in the technical field to which this creation belongs. Some embodiments of this creation are disclosed above, but they are not used to limit this creation. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of this creation. In other words, other equivalent embodiments completed without departing from the spirit disclosed in this creation should be included in this creation, and the scope of protection of this creation shall be subject to the scope of the patent application attached hereafter.

1a: Light-emitting display device

10: substrate

20a: The first patterned conductive layer

201a: first grid wire

202a: first extension

30a: Patterned electrical insulating layer

301a: The first electrical insulation block

302a: The second electrical insulation block

303a: The third electrical insulation block

40a: second patterned conductive layer

401a: second grid wire

402a: second extension

403a: second slender wire

501a: the first pad area

502a: The second pad area

503a: third pad area

504a: The fourth pad area

505a: Fifth pad area

506a: The sixth pad area

Claims (10)

A light-emitting display device includes: A substrate having a first surface and a second surface opposite to the first surface; A first patterned conductive layer is disposed above the first surface of the substrate, and has a first grid wire in a grid shape and at least one grid node connected from the first grid wire的 first extension; A plurality of light-emitting elements, each having a driving chip of a light-emitting diode, the light-emitting elements are arranged in an array on the same side of the first surface of the substrate with a minimum distance of 2 to 3 mm; and At least four solder pad areas that are electrically isolated from each other are electrically connected to at least one of the input voltage pins, data signal input or output pins, clock signal input or output pins, and ground pins of at least one of the light-emitting components; Wherein, the pad area electrically connected to the input voltage pin is electrically connected to the first grid wire via the first extension portion, and is connected to the data signal input or output pin and the clock signal input or output pin. The pad areas corresponding to the electrical connections of the feet are electrically connected to the first elongated wires, respectively. For example, the light-emitting display device of claim 1, wherein the first surface of the substrate has a plurality of separated first configuration regions and a plurality of separated second configuration regions, and each of the second configuration regions is between at least two of the first Between the configuration areas, each of the first configuration areas has the first grid wire and the first extension, and each of the second configuration areas has the pad areas and at least two parallel and equidistant from each other or not. The first elongated wires are equidistantly spaced in a linear shape, and the extending direction of the first elongated wires and the extending direction of the first extending portion intersect; and are electrically connected to the pad area that is electrically connected to the input voltage pin The first extension portion and the first mesh wire to one of the first configuration regions, and the pad region that is electrically connected to the ground pin is electrically connected to the other one of the first configuration regions The first extension part and the first grid wire. The light-emitting display device of claim 1, wherein the first grid wire occupies 80% of the area of the first surface of the substrate. Such as the light-emitting display device of claim 3, wherein the extension direction of the first extension portion is parallel to the arrangement plane of the first grid wires. For example, the light-emitting display device of claim 4, further comprising: A patterned electrical insulation layer, which is disposed above the first patterned conductive layer, and has a plurality of first electrical insulation blocks, a plurality of second electrical insulation blocks, and a plurality of third electrical insulation blocks; and A second patterned conductive layer is disposed above the patterned electrically insulating layer, and has a plurality of grid-shaped second grid wires, and at least one grid node connected from the second grid wire The second extension portion and at least two second elongated wires parallel to each other and spaced equally or unequally apart from each other in a linear shape, the extension direction of the second elongated wires and the extension direction of the second extension portion intersect; Wherein, each of the first electrically insulating regions covers a configuration area on the first patterned conductive layer corresponding to the second grid wire to isolate the second grid wire from the first grid wire Each of the second electrically insulating regions covers a configuration area of the first patterned conductive layer corresponding to the portion of the second extension portion adjacent to the second grid wire to isolate the The electrical contact between the portion of the second extension that is adjacent to the second grid wire and the first grid wire; each of the third electrically insulating regions covers the first patterned conductive layer corresponding to each of the A configuration area of the second elongated wires excluding the connecting portion of the pad area is used to isolate the electrical contact between the portion of the second elongated wires excluding the connecting portion of the pad area and the first grid wire The bonding pad regions are exposed from the patterned electrical insulating layer, and the bonding pad regions that are electrically connected to the ground pins are electrically connected through the second extension and the second grid wire; and The data signal input or output pins and the clock signal input or output pins are respectively connected to the plurality of second elongated wires. For example, the light-emitting display device of claim 5, wherein the bonding pad area connection portion of each of the second elongated wires is disposed on the first surface of the substrate, and the second extension portion is connected to the ground pin corresponding to The connected part of the pad area is disposed on the first surface of the substrate. Such as the light-emitting display device of claim 3, wherein the extension direction of the first extension portion is perpendicular to the arrangement plane of the first grid wires. For example, the light-emitting display device of claim 7 further includes: A patterned electrical insulation layer, which is disposed above the first patterned conductive layer, and has a plurality of first electrical insulation blocks, a plurality of second electrical insulation blocks, and a plurality of third electrical insulation blocks; and A second patterned conductive layer is disposed above the patterned electrically insulating layer, and has a plurality of grid-shaped second grid wires, and at least one grid node connected from the second grid wire The second extension portion and at least two second elongated wires parallel to each other and spaced equally or unequally apart from each other in a linear shape, the extension direction of the second elongated wires and the extension direction of the second extension portion intersect; Wherein, each of the first electrically insulating regions covers a configuration area on the first patterned conductive layer corresponding to the second grid wire to isolate the second grid wire from the first grid wire Each of the second electrically insulating regions covers a portion of the pad area corresponding to the second extension on the first patterned conductive layer and the portion of the pad area that is electrically connected to the ground pin The configuration area is used to isolate the electrical contact between the portion of the bonding pad area adjacent to the second extension portion and the corresponding electrical connection of the ground pin and the first grid wire; each of the third electrical insulation areas The block covers a configuration area on the first patterned conductive layer corresponding to each of the second elongated wires including the connection portion of the bonding pad area to isolate the second elongated wires from the first grid wires Electrical contact; the pad area that is electrically connected to the ground pin is electrically connected to the second grid wires via the second extension portion; and the data signal input or output pin, the clock signal input Or the solder pad areas corresponding to the output pins are electrically connected to the second elongated wires. For example, the light-emitting display device of any one of claims 1 to 8, further comprising: A patterned conductive metal seed layer is formed on the first surface of the substrate and has the same pattern as the pattern of the first patterned conductive layer to serve as a preparation layer for the formation of the first patterned conductive layer. According to the light-emitting display device of claim 5 or 8, wherein the line width of the conductive lines of the second grid line is 25 micrometers to 100 micrometers.

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