CN216956598U - Mini LED backlight module - Google Patents

Abstract

The utility model discloses a Mini LED backlight module, which comprises: a light emitting device; a conductive layer comprising: a substrate comprising a first surface and an oppositely disposed second surface; the substrate comprises a plurality of conductive circuits, wherein a groove is formed in one side of the first surface of the substrate, and a conductive material is arranged in the groove to form the conductive circuits; at least one conductive circuit is provided with at least one bevel, and the bevel is of a chamfer structure or an arc structure; wherein the light emitting device is electrically connected with the conductive layer. The utility model provides a routing structure of a conductive circuit, wherein corners or corners normally exist in the conductive circuit, and the corners or corners are arranged to be chamfer angles or arc-shaped structures, so that the groove-type conductive circuit is easier to demould when prepared, the yield is high, and the electrical performance is stable.

Description

Mini LED backlight module

Technical Field

The utility model relates to the technical field of Mini LED, in particular to a Mini LED backlight module.

Background

The Mini LED (sub-millimeter Light Emitting Diode) backlight Display technology is a new Display technology different from the conventional Liquid Crystal Display (LCD) and Organic Light-Emitting Diode (OLED) Display. Compared with the latter two, the Mini LED backlight panel has higher color contrast, brightness and color gamut, longer service life and thinner thickness, is a key field for the development of panel industry in recent years, and has wide prospect.

However, the current Mini LED backlight panel is limited to its own structural design, the line for driving the Mini LED may protrude above the substrate, and in the production and application processes, the line may be damaged by friction, collision, etc., resulting in line fracture, so that the Mini LED backlight panel has poor functions.

SUMMERY OF THE UTILITY MODEL

Accordingly, there is a need to provide a Mini LED backlight module to solve the above-mentioned problems.

The utility model adopts a technical scheme that:

a Mini LED backlight module comprises:

a light emitting device;

a conductive layer comprising: a substrate comprising a first surface and an oppositely disposed second surface; the substrate comprises a plurality of conductive circuits, wherein a groove is formed in one side of the first surface of the substrate, and a conductive material is arranged in the groove to form the conductive circuits; at least one conductive circuit is provided with at least one bevel, and the bevel is of a chamfer structure or an arc structure;

wherein the light emitting device is electrically connected with the conductive layer.

In one embodiment, the conductive circuit includes a bonding block, the conductive circuit is electrically connected to the bonding block, and a junction between the conductive circuit and the bonding block adopts a chamfer structure or an arc structure.

In one embodiment, the conductive trace is electrically connected to the landing pad, and an included angle formed at a connection position of the conductive trace and the landing pad is greater than 90 ° and less than or equal to 150 °.

In one embodiment, the inside of the landing pads is filled with a conductive grid, and the conductive grid is a raised structure or a recessed structure.

In one embodiment, the overlapping block is a groove structure, a conductive material is disposed in the groove, and the overlapping block and the conductive circuit are integrated.

In one embodiment, a polymer layer is disposed on the first surface of the substrate, a groove is disposed on a surface of the polymer layer away from the substrate, and a conductive material is disposed in the groove to form a conductive circuit.

In one embodiment, the groove comprises two side walls and a bottom surface, the included angle a between the side wall of the groove and the plane of the first surface of the substrate is more than or equal to 60 degrees and less than 90 degrees, and the groove is in an inverted trapezoid shape.

In one embodiment, the light emitting devices are connected in series and/or in parallel through the conductive lines.

In one embodiment, the substrate is a glass or flexible composite layer structure.

In one embodiment, a protective layer is further disposed on the surface of the conductive layer, and the protective layer at least covers a portion of the conductive line except for the connection portion of the light emitting device.

The utility model has the beneficial effects that: the utility model provides a routing structure of a conductive circuit, wherein corners or corners normally exist in the conductive circuit, and the corners or corners are arranged to be chamfer angles or arc-shaped structures, so that the groove-type conductive circuit is easier to demould when prepared, the yield is high, and the electrical performance is stable.

Drawings

FIG. 1 is a schematic diagram of a sectional plane structure of a Mini LED backlight module according to the present invention;

FIG. 2 is a schematic view of a sectional and partially enlarged structure of a Mini LED backlight module according to the present invention;

FIG. 3 is a schematic cross-sectional view of a Mini LED backlight module according to the present invention;

FIG. 4 is another schematic cross-sectional view of a Mini LED backlight module according to the present invention;

FIG. 5 is another schematic cross-sectional view of a Mini LED backlight module according to the present invention;

FIG. 6 is another schematic cross-sectional view of a Mini LED backlight module according to the present invention;

FIG. 7 is a schematic diagram of a conductive circuit structure of a Mini LED backlight module according to the present invention;

FIG. 8 is another schematic structural diagram of a conductive trace of a Mini LED backlight module according to the present invention;

fig. 9 is another structural schematic diagram of a conductive circuit of a Mini LED backlight module according to the present invention.

Detailed Description

To facilitate an understanding of the utility model, the utility model will now be described more fully hereinafter with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. However, the present invention may be embodied in many different forms and is not limited to the embodiments described below. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

A backlight module can be used in the display field, for example miniLED, as the backlight module of demonstration, of course the backlight module also can use as the light source, provide the effect of illumination, wherein, backlight module includes:

a conductive layer, the conductive layer comprising: the substrate comprises a first surface and a second surface which is arranged oppositely, wherein the substrate is a hard substrate or a flexible substrate, the hard substrate is glass or other hard materials, the flexible substrate can be a composite substrate, PET, PMMA, PE, PC, glass fiber and other materials, the composite substrate can be the composite of PET and glass fiber, the composite of PC and glass fiber and the like, and therefore the substrate has certain toughness, can have a good supporting effect and has good mechanical properties; the conductive circuit comprises a conductive circuit, wherein a groove is formed in the first surface of the substrate, a conductive material is arranged in the groove to form the conductive circuit, the groove can be directly formed on the substrate, the depth-to-width ratio of the groove is not less than one third, the width of the groove is not more than 1 millimeter, for example, the depth of the groove is 100 micrometers, the width of the groove is 40 micrometers, the low resistance performance of the conductive circuit is ensured through the structure with the high depth-to-width ratio, the conductive circuit in the conductive layer is of a solid structure under the condition, and the conductive circuit can be of a groove type grid structure under the condition that the size of the resistance is not considered.

Wherein, the conducting layer includes a plurality of the conducting wire, there is one at least the conducting wire has a dog-ear, just the dog-ear is chamfer structure or arc structure, because the conducting wire is in the formation of turn can exist in the planar line of conducting layer, and is normal the corner or dog-ear that the turn of conducting wire formed are the right angle, will in this application corner or dog-ear redesign sets up it into chamfer or arc structure, and its line of walking that makes like this is more mild, and the phenomenon of doubling or having the cull can not appear in the preparation process, guarantees the outward appearance and the electrical property of conducting layer.

A light emitting device; the light emitting device is electrically connected with the conductive layer, and more specifically, the light emitting device is electrically connected with the conductive circuit in the conductive layer; the backlight module comprises a plurality of partition structures, each partition structure is provided with a conductive circuit, and the conductive circuits in the partitions are finally connected with a control chip of the backlight module; the light emitting device in each partition is electrically connected with the conductive circuit, the light emitting device can be in a series structure or a parallel structure, and the connection structure of the light emitting device can also be a mixed and matched combination of series and parallel connection; the light-emitting device can be a light-emitting component such as a lamp bead, an LED, a lamp strip and a lamp strip.

The conductive material arranged in the groove is at least one, the conductive material can be a mixture of several conductive materials, different conductive layers can also be formed in the groove, and the outermost layer of conductive material far away from the bottom of the groove in the groove is generally made of metal materials or oxide conductive materials which are not easy to oxidize, such as nickel materials, so that the oxidation of the conductive materials can be well prevented, the conductive performance of the conductive circuit is ensured, and the resistance value of the conductive circuit is stable; the metallic conductive material may normally be: metals such as gold, silver, copper, aluminum, and nickel may be alloy materials, conductive materials such as ITO that are oxides, and organic conductive materials such as PEDOT.

The composite substrate comprises a plurality of layers of materials which are superposed, and under normal conditions, when the composite substrate is used as a backlight module for display or illumination, the composite substrate needs to have certain mechanical properties or certain hardness so that the composite substrate can have good support smoothness like a glass substrate; therefore, the PET + glass fiber layer is generally adopted for the composite substrate, for example, the glass fiber layer is arranged between two PET layers, so that the composite substrate is formed, wherein the glass fiber layer is at least one layer, and can be two layers, three layers, four layers and the like, so that the toughness of the composite substrate is improved.

In one embodiment, for convenience of description, the conductive traces are further described in detail, that is, the conductive traces include a first conductive trace and a second conductive trace, the first conductive trace is disconnected from the second conductive trace at this time, a bonding block is arranged at one end of the first conductive trace, a bonding block is arranged at one end of the second conductive trace, and the two bonding blocks are arranged oppositely; the light-emitting device is erected between the two overlapping blocks and is electrically connected with the two overlapping blocks, namely the first conducting circuit and the second conducting circuit are conducted through the light-emitting device, and the wiring points of the light-emitting device are electrically connected with the overlapping blocks of the first conducting circuit and the second conducting circuit respectively.

In one embodiment, the conductive circuit includes a joint block, the conductive circuit is electrically connected to the joint block, a junction between the conductive circuit and the joint block adopts a chamfer structure or an arc structure, or the conductive circuit is electrically connected to the joint block, and an included angle formed at the junction between the conductive circuit and the joint block is greater than 90 degrees and less than or equal to 150 degrees; therefore, the connecting position of the conductive circuit and the lap joint block is mainly ensured to be an obtuse angle or an arc, so that the demolding is easier in the preparation process.

In one embodiment, the lapping block is filled with a conductive grid, the conductive grid is of a convex structure or a concave structure, the main use scene of the structure is that when the area of the lapping block is relatively large, the lapping block is arranged by using the grid, and the grid is made of a conductive material.

In one embodiment, the overlapping block is a groove structure, a conductive material is disposed in the groove, the overlapping block and the conductive circuit are integrated, when the area of the overlapping block is small, the overlapping block is a groove, the groove and the conductive circuit are integrated, and the groove is directly filled with the conductive material.

In one embodiment, the first surface of the substrate is provided with a polymer layer, a surface of the polymer layer away from the substrate is provided with a groove, the groove is provided with a conductive material inside the structure to form a conductive circuit, the groove of the conductive circuit is not directly formed on the surface of the substrate but formed on the surface of the polymer, and the polymer may be a photo-curing or thermal-curing material, such as UV glue.

In one embodiment, the groove comprises two side walls and a bottom surface, the included angle a between the side walls of the groove and the plane of the first surface of the substrate is more than or equal to 60 degrees and less than 90 degrees, the groove is in an inverted trapezoid shape, the groove in the embodiment is not straight, and the width of the opening of the groove is larger than the width of the bottom surface of the groove; in another embodiment, the cross-sectional shape of the groove may be a rectangular shape, and both side walls of the groove are at a right angle of 90 ° to the bottom surface; in another embodiment, the side walls of the groove may be curved and the bottom surface of the groove may also be curved.

In one embodiment, the surface of the conductive layer is further provided with a protective layer, the protective layer at least covers a part of the conductive line except for the connection position of the light emitting device, the part of the conductive line, which is used for connecting the light emitting device, is exposed, the rest part of the conductive line covers the protective layer, the protective layer can be made of an ink material such as white ink, the protective layer can directly cover the area of the conductive line, and certainly can also cover a blank area except the conductive line at the same time, and the protective layer can well block external water vapor and avoid or reduce oxidation of the conductive line.

Referring to fig. 1, a Mini LED backlight module 100 includes a plurality of partition structures 101 and a control chip 102, where each partition structure 101 is provided with a conductive circuit and a plurality of light emitting devices, the partition structure 101 is connected to the control chip 102, and the control chip 102 and the partition structure 101 in fig. 1 are located on the same carrying structure or substrate, although the control chip 102 may also be an external structure, and is not necessarily arranged between the partition structures 101, and may also be a structure in which lead wires of the partition structures 101 are concentrated in a certain area, and then connected to an external control chip through a connection circuit.

Referring to fig. 2, a light emitting device 200 and a conductive trace 30 are disposed in a partition structure 101 in fig. 1, where the conductive trace 30 may be referred to as a first conductive trace and a second conductive trace, and the first conductive trace and the second conductive trace are provided with a bridging block 40, although for convenience of description, the first conductive trace and the second conductive trace may be collectively referred to as a conductive trace, the light emitting device 200 is erected between the bridging blocks 40 to conduct the conductive trace, the bridging block is not necessarily provided, the conductive trace 30 may not be provided with a bridging block, and the light emitting device 200 may be directly electrically connected to the conductive trace 30; the conductive line 30 is a solid conductive line, and may have a grid structure (conductive grid structure), and the light emitting devices 200 may be connected in series or in parallel (not shown).

Referring to fig. 3, a conductive layer of a Mini LED backlight module includes a substrate 10, a conductive line 30 and a polymer layer 50, where the substrate 10 includes a first surface and an opposite second surface, the first surface of the substrate 10 is provided with the polymer layer 50, a surface of the polymer layer 50 away from the substrate 10 is provided with a groove, a conductive material is provided in the groove to form the conductive line 30, the conductive material provided in the groove may be a multilayer structure, the conductive materials of each layer may be the same or different, or the conductive material is formed by mixing at least two conductive materials, the cross section of the groove is a rectangular structure, the aspect ratio of the groove is not less than one third, and the width of the groove is not more than 1 mm, for example, the depth of the groove is 80 micrometers, and the width of the groove is 40 micrometers; the substrate 10 may be made of PET, PMMA, PC, or the like, although the substrate 10 in fig. 1 may be made of glass, and is a hard substrate, and the light emitting device (not shown) may be connected to the conductive circuit 30, so that the light emitting device is electrically connected to the conductive circuit.

Referring to fig. 4, a conductive layer of a Mini LED backlight module includes a composite substrate, a conductive circuit 30 and a polymer layer 50, the composite substrate includes a first flexible substrate 20, a second flexible substrate 21 and a third flexible substrate 22, in fact, the composite substrate includes at least two layers of flexible substrates, the first flexible substrate 20 and the third flexible substrate 22 may be the same, for example, both flexible substrates are PET, PC, PMMA, etc., of course, the two layers of flexible substrate may be of different materials, such as any two of the above materials, wherein, the second flexible substrate 21 is preferably made of glass fiber material with glass-like property, and can adopt multi-layer glass fiber material, in this way, it is possible to achieve properties similar to those of glass, so that the composite substrate is formed in the form of an interlayer, of course, the composite substrate may be formed by alternately or alternately stacking flexible substrates of different materials.

Referring to fig. 5, a conductive layer of a Mini LED backlight module includes a composite substrate, a first conductive trace 30, a first polymer layer 50, a second conductive trace 30, and a second polymer layer 51, where the composite substrate includes a first flexible substrate 20, a second flexible substrate 21, and a third flexible substrate 22, the first polymer layer 50 is disposed on one side of the third flexible substrate 22 away from the second flexible substrate 21, and a groove is disposed on one side of the first polymer layer 50 away from the third flexible substrate 22, and a conductive material is disposed in the groove to form the first conductive trace 30; the second polymer layer 51 is disposed on one side of the first flexible substrate 20 away from the second flexible substrate 21, a groove is disposed on one side of the second polymer layer 51 away from the first flexible substrate 20, a conductive material is disposed in the groove to form a second conductive circuit 31, and thus, conductive circuits are disposed on two surfaces of the composite substrate, so that the conductive circuits on the two surfaces of the composite substrate can be electrically connected through a through hole structure in order to meet the requirement of complexity of the conductive layers, and the conductive circuits on the two surfaces of the composite substrate can be provided with light emitting devices, so as to increase the brightness of the backlight module.

Referring to fig. 6, a conductive layer of a Mini LED backlight module includes a substrate 10, a conductive trace 33, and a polymer layer 50, where the substrate 10 includes a first surface and a second surface opposite to the first surface, the polymer layer 50 is disposed on the first surface of the substrate 10, a groove is disposed on a surface of the polymer layer 50 away from the substrate 10, and a conductive material is disposed in the groove to form the conductive trace 33; the groove comprises two side walls and a bottom surface, an included angle a between each side wall and the horizontal direction is 60 degrees or more and is less than 90 degrees, further, the included angle a is 80 degrees or more and is less than 90 degrees, the conductive performance of the conductive circuit 33 can be improved by adopting the inverted trapezoid arrangement, the resistance value of the conductive circuit 33 is reduced, and the distance between the bottom surface of the groove and the first surface of the substrate 10 is not less than 2 microns.

Referring to fig. 7, a connecting block 40 is disposed at one end of the conductive trace 30, a corner or a corner exists in the conductive trace 30, the corner or the corner adopts an arc-shaped structure 70, an included angle exists between the conductive trace 30 and the connecting block 40, the included angle adopts an arc-shaped structure 60, and the arc-shaped structure 60 and the arc-shaped structure 70 may be the same or the two arcs have different curvature radii.

Referring to fig. 8 and 9, a lapping block 40 is disposed at one end of the conductive trace 30, the conductive trace 30 has a corner or a corner, the corner or the corner adopts an arc-shaped structure 70, an included angle exists between the conductive trace 30 and the lapping block 40, and the included angle adopts a chamfer structure 61; or the corner adopts a chamfer structure 71, and the included angle adopts a chamfer structure 61.

The conductive circuit structure is a trench, a conductive material is disposed in the trench to form a conductive circuit, where a thickness of the conductive material in the trench may be smaller than a depth of the trench, or the thickness of the conductive material in the trench is equal to the depth of the trench, or the thickness of the conductive material in the trench is greater than the depth of the trench, that is, the conductive material in the trench is higher than a surface of the polymer layer, and a width of a portion of the conductive material higher than the surface of the polymer layer may be equal to a width of the trench, or greater than the width of the trench, or less than the width of the trench. The ratio of the area occupied by the conductive circuit to the area of the whole surface of the backlight module is not less than 10 percent; certainly, in order to meet the requirement of the backlight module for higher brightness, the ratio of the area occupied by the conductive circuit to the area of the whole surface of the backlight module is not less than 20%, or the ratio of the area occupied by the conductive circuit to the area of the whole surface of the backlight module is not less than 30%, or the ratio of the area occupied by the conductive circuit to the area of the whole surface of the backlight module is not less than 45%.

For the definition of the first and second conductive traces for better description, the parameters or structures of the first and second conductive traces can be referred to or referred to.

The utility model provides a routing structure of a conductive circuit, wherein corners or corners normally exist in the conductive circuit, and the corners or corners are arranged to be chamfer angles or arc-shaped structures, so that the groove-type conductive circuit is easier to demould when prepared, the yield is high, and the electrical performance is stable.

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail. In the above description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Moreover, the technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. A Mini LED backlight module is characterized by comprising:

a light emitting device;

a conductive layer comprising: a substrate comprising a first surface and an oppositely disposed second surface; the substrate comprises a plurality of conductive circuits, wherein a groove is formed in one side of the first surface of the substrate, and a conductive material is arranged in the groove to form the conductive circuits; at least one conductive circuit is provided with at least one bevel, and the bevel is of a chamfer structure or an arc structure;

wherein the light emitting device is electrically connected with the conductive layer.

2. The Mini LED backlight module according to claim 1, wherein the conductive traces comprise a bump, the conductive traces are electrically connected to the bump, and the joint of the conductive traces and the bump is of a chamfer structure or an arc structure.

3. The Mini LED backlight module of claim 1, wherein the conductive traces comprise a bump, the conductive traces are electrically connected to the bump, and an included angle formed at a connection between the conductive traces and the bump is greater than 90 ° and less than or equal to 150 °.

4. The Mini LED backlight module set according to claim 2, wherein the inside of the landing pads is filled with conductive grids, and the conductive grids are raised structures or recessed structures.

5. The Mini LED backlight module of claim 2, wherein the overlapping blocks are in a groove structure, the grooves are filled with conductive materials, and the overlapping blocks and the conductive traces are in an integral structure.

6. The Mini LED backlight module of claim 1, wherein the first surface of the substrate is provided with a polymer layer, a surface of the polymer layer away from the substrate is provided with grooves, and the grooves are provided with conductive materials to form conductive traces.

7. The Mini LED backlight module of claim 1 or 5, wherein the groove comprises two sidewalls and a bottom surface, the sidewall of the groove has an angle a with the plane of the first surface of the substrate in the range of 60 ° or more and less than 90 °, and the groove is in an inverted trapezoid shape.

8. The Mini LED backlight module according to claim 1, wherein the light emitting devices are connected in series and/or in parallel by the conductive traces.

9. The Mini LED backlight module set forth in claim 1, wherein the substrate is a glass or flexible composite substrate.

10. The Mini LED backlight module according to any one of claims 1 to 9, wherein a protective layer is further disposed on the surface of the conductive layer, and the protective layer at least covers a portion of the conductive line except for the connection of the light emitting devices.

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