TW202029164A - Conductive substrate for a display device - Google Patents
Conductive substrate for a display device Download PDFInfo
- Publication number
- TW202029164A TW202029164A TW108133141A TW108133141A TW202029164A TW 202029164 A TW202029164 A TW 202029164A TW 108133141 A TW108133141 A TW 108133141A TW 108133141 A TW108133141 A TW 108133141A TW 202029164 A TW202029164 A TW 202029164A
- Authority
- TW
- Taiwan
- Prior art keywords
- electrode connection
- connection area
- section
- electrically connected
- conductive lines
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
本申請關於一種顯示裝置,尤其是關於顯示裝置用的導電板。This application relates to a display device, in particular to a conductive plate for the display device.
發光二極體(Light emitting diode;LED)是一種以半導體材料作為發光材料的電子元件,相較于白熾燈和冷陰極螢光燈管(Cold cathode fluorescent lamp;CCFL)的優點為省電、環保、壽命長、體積小和響應快。由於以LED作為自發光源的顯示技術日趨成熟,因此,在顯示市場上為主流產品的LCD顯示器也逐漸被平面化、薄型化及輕量化的LED顯示器所取代。另一方面,LED顯示器也朝大尺寸演進,企圖成為多媒體資訊展示媒介的新寵。Light emitting diode (LED) is an electronic component that uses semiconductor materials as luminescent materials. Compared with incandescent lamps and cold cathode fluorescent lamps (CCFL), it has the advantages of energy saving and environmental protection. , Long life, small size and fast response. As the display technology that uses LEDs as the self-luminous source is becoming more mature, LCD displays, which are mainstream products in the display market, are gradually being replaced by flat, thin, and lightweight LED displays. On the other hand, LED displays are also evolving toward larger sizes, attempting to become the new favorite of multimedia information display media.
為了讓LED顯示器的LED晶片陣列中的每個LED晶片能夠被點亮,承載LED晶片陣列的基板與LED晶片陣列之間的導電性必須良好。另一方面,為了讓LED顯示器能夠呈現豐富的顯示畫面以因應各種場合的需要,LED晶片陣列中的LED晶片顆數必須夠多,導致承載LED晶片陣列的基板上的導電線路的數量增加,而減損了顯示器所需的透明度。因此,如何讓承載LED晶片的基板能夠符合各種場合所需的顯示畫面需求,且同時能符合高透明度是本發明所要解決的技術問題。In order for each LED chip in the LED chip array of the LED display to be lit, the conductivity between the substrate carrying the LED chip array and the LED chip array must be good. On the other hand, in order for the LED display to present a rich display screen to meet the needs of various occasions, the number of LED chips in the LED chip array must be large enough, resulting in an increase in the number of conductive circuits on the substrate carrying the LED chip array. The transparency required by the display is reduced. Therefore, how to make the substrate carrying the LED chip meet the display screen requirements required by various occasions and at the same time meet the high transparency is the technical problem to be solved by the present invention.
有鑑於上述問題,本申請發明人提出一種顯示裝置用的導電板。In view of the above problems, the inventor of the present application proposes a conductive plate for a display device.
本申請一實施例中,所提出的一種顯示裝置用的導電板包含一電絕緣基板、複數電極連接區列、複數第一導電線路、複數第二導電線路和複數第一透明絕緣層。這些電極連接區列彼此分離地位於電絕緣基板上,這些電極連接區列各自具有複數彼此電性隔離且間隔配置成列的電極連接區,這些電極連接區各自具有複數彼此電性隔離的電極接點,這些電極接點包含分別供一發光源的一共電極及複數單電極電連接用的第一電極接點及複數第二電極接點。各個電極連接區列分隔為複數區段,這些區段至少包含一第一區段及一第二區段。這些第一導電線路彼此分離地位於電絕緣基板上,各個第一導電線路沿鄰近的電極連接區列延伸且電連接至鄰近的電極連接區列的這些電極連接區中的這些第一電極接點。這些第二導電線路彼此分離地位於電絕緣基板上,位於相鄰的兩電極連接區列之間的這些第二導電線路各自的一端電連接至鄰近的電極連接區列的這些電極連接區其中之一的這些第二電極接點其中之一。這些第一透明電絕緣層彼此分離地位於電絕緣基板上,且各自位於電連接至同一電極連接區列的第一區段內的這些電極連接區的這些第二導電線路和電連接至同一電極連接區列的第二區段內的這些電極連接區的這些第二導電線路之間。此外,電連接至同一電極連接區列的第二區段內的這些電極連接區的這些第二導電線路和電連接至同一電極連接區列的第一區段內的這些電極連接區的這些第二導電線路至少有部份在顯示裝置的顯示方向上對應重疊。In an embodiment of the present application, a proposed conductive plate for a display device includes an electrically insulating substrate, a plurality of electrode connection region columns, a plurality of first conductive circuits, a plurality of second conductive circuits, and a plurality of first transparent insulating layers. These electrode connection area rows are separated from each other on the electrically insulating substrate. Each of these electrode connection area rows has a plurality of electrode connection areas that are electrically isolated from each other and are arranged in rows at intervals. Each of these electrode connection areas has a plurality of electrode connections that are electrically isolated from each other. These electrode contacts include a first electrode contact and a plurality of second electrode contacts for electrical connection of a common electrode and a plurality of single electrodes respectively for a light-emitting source. Each electrode connection area row is divided into a plurality of sections, and these sections at least include a first section and a second section. The first conductive lines are separated from each other on the electrically insulating substrate, and each first conductive line extends along the adjacent electrode connection area column and is electrically connected to the first electrode contacts in the electrode connection areas of the adjacent electrode connection area column . These second conductive lines are located on the electrically insulating substrate separately from each other, and one end of each of the second conductive lines located between two adjacent electrode connection area rows is electrically connected to one of the electrode connection areas of the adjacent electrode connection area rows. One of these second electrode contacts. The first transparent electrically insulating layers are separated from each other on the electrically insulating substrate, and the second conductive lines of the electrode connection areas in the first section electrically connected to the same electrode connection area column are electrically connected to the same electrode. Between the second conductive lines of the electrode connection areas in the second section of the connection area column. In addition, the second conductive lines electrically connected to the electrode connection areas in the second section of the same electrode connection area column and the second conductive lines electrically connected to the electrode connection areas in the first section of the same electrode connection area column At least part of the two conductive lines overlap in the display direction of the display device.
一實施例中,所提出的一種顯示裝置用的導電板更包含複數聯外電連接區,分別位於電絕緣基板的一側邊的鄰近表面上且和這些電極連接區列對應,這些聯外電連接區各自具有複數彼此分離且配置成複數行的電連接墊,這些第二導電線路的另一端分別電連接至這些電連接墊。In one embodiment, the proposed conductive plate for a display device further includes a plurality of external electrical connection regions, which are respectively located on the adjacent surface of one side of the electrically insulating substrate and correspond to the electrode connection regions. These external electrical connection regions Each has a plurality of electrical connection pads separated from each other and arranged in a plurality of rows, and the other ends of the second conductive lines are respectively electrically connected to the electrical connection pads.
一實施例中,所提出的一種顯示裝置用的導電板的各個聯外電連接區內的這些電連接墊的配置行數相等於對應的電極連接區列的這些區段個數。In one embodiment, the number of rows of the electrical connection pads in each external electrical connection area of the proposed conductive plate for a display device is equal to the number of these sections of the corresponding electrode connection area column.
一實施例中,所提出的一種顯示裝置用的導電板的同一電極連接區列的第一區段內的這些電極連接區和對應的聯外電連接區之間的距離大於同一電極連接區列的第二區段內的這些電極連接區和對應的聯外電連接區之間的距離,且電連接至同一電極連接區列的第一區段內的這些電極連接區的這些第二導電線路的每單位距離阻抗小於電連接至同一電極連接區列的第二區段內的這些電極連接區的這些第二導電線路的每單位距離阻抗。In one embodiment, the distance between the electrode connection areas and the corresponding external electrical connection areas in the first section of the same electrode connection area column of the conductive plate for a display device is greater than that of the same electrode connection area column. The distance between the electrode connection areas in the second section and the corresponding external electrical connection areas, and is electrically connected to each of the second conductive lines of the electrode connection areas in the first section of the same electrode connection area column The impedance per unit distance is smaller than the impedance per unit distance of the second conductive lines electrically connected to the electrode connection areas in the second section of the same electrode connection area column.
一實施例中,所提出的一種顯示裝置用的導電板的電連接至同一電極連接區列的第一區段內的這些電極連接區的這些第二導電線路的外表面具有一銅層。In one embodiment, a copper layer is provided on the outer surface of the second conductive lines of the conductive plate for the proposed display device electrically connected to the electrode connection areas in the first section of the same electrode connection area column.
一實施例中,所提出的一種顯示裝置用的導電板更包含複數第二透明電絕緣層,彼此分離地位於電絕緣基板上,其中,這些電極連接區列各自分隔的這些區段更包含一第三區段,這些第二透明電絕緣層各自位於電連接至同一電極連接區列的第三區段內的這些電極連接區的這些第二導電線路和電連接至同一電極連接區列的第二區段內的這些電極連接區的這些第二導電線路之間,且電連接至同一電極連接區列的第三區段內的這些電極連接區的這些第二導電線路和電連接至同一電極連接區列該第二區段內的這些電極連接區的這些第二導電線路至少有部份於顯示裝置的顯示方向上對應重疊。In one embodiment, the proposed conductive plate for a display device further includes a plurality of second transparent electrically insulating layers, which are separated from each other on the electrically insulating substrate, wherein the separate sections of the electrode connection regions further include one In the third section, the second transparent electrically insulating layers are respectively located in the second conductive lines of the electrode connection areas in the third section electrically connected to the same electrode connection area column and the second conductive lines electrically connected to the same electrode connection area column. Between the second conductive lines of the electrode connection areas in the two sections and electrically connected to the second conductive lines of the electrode connection areas in the third section of the same electrode connection area column are electrically connected to the same electrode At least part of the second conductive lines of the electrode connection areas in the second section of the connection area row overlaps correspondingly in the display direction of the display device.
一實施例中,所提出的一種顯示裝置用的導電板的同一電極連接區列的第二區段內的這些電極連接區和對應的聯外電連接區之間的距離大於同一電極連接區列的第三區段內的這些電極連接區和對應的聯外電連接區之間的距離,且電連接至同一電極連接區列的第二區段內的這些電極連接區的這些第二導電線路的每單位距離阻抗大於電連接至同一電極連接區列的第一區段內的這些電極連接區的這些第二導電線路的每單位距離阻抗但小於電連接至同一電極連接區列的第三區段內的這些電極連接區的這些第二導電線路的每單位距離阻抗。In an embodiment, the distance between the electrode connection areas and the corresponding external electrical connection areas in the second section of the same electrode connection area column of the conductive plate for a display device is greater than that of the same electrode connection area column. The distance between the electrode connection areas in the third section and the corresponding external electrical connection areas, and is electrically connected to each of the second conductive lines of the electrode connection areas in the second section of the same electrode connection area column The impedance per unit distance is greater than the impedance per unit distance of the second conductive lines electrically connected to the electrode connection areas in the first section of the same electrode connection area column but less than that of the third section electrically connected to the same electrode connection area column The impedance per unit distance of the second conductive lines of the electrode connection areas.
一實施例中,所提出的一種顯示裝置用的導電板的電連接至同一電極連接區列的第二區段內的這些電極連接區的這些第二導電線路的外表面具有形成一電隔離層的一第一部份及形成一銅層的一第二部份,電隔離層及銅層位於同一面上。In one embodiment, the outer surface of the second conductive lines of the conductive plate for the proposed display device electrically connected to the electrode connection areas in the second section of the same electrode connection area column has an electrical isolation layer formed A first part and a second part forming a copper layer, the electrical isolation layer and the copper layer are on the same surface.
一實施例中,所提出的一種顯示裝置用的導電板的第一導電線路及第二導電線路的材質為金屬,且電連接至同一電極連接區列的第一區段內的這些電極連接區的這些第二導電線路和電連接至同一電極連接區列的第一導電線路位於同一面上。In one embodiment, the material of the first conductive circuit and the second conductive circuit of the conductive plate used in the proposed display device is metal, and they are electrically connected to the electrode connection areas in the first section of the same electrode connection area column These second conductive lines and the first conductive lines electrically connected to the same electrode connection area column are located on the same surface.
一實施例中,所提出的一種顯示裝置用的導電板更具有一透明導電圖案層,其位於電絕緣基板上且和電絕緣基板的表面接觸,其中,這些電極接點位於透明導電圖案層上且接觸透明導電圖案層的表面。In one embodiment, the proposed conductive plate for a display device further has a transparent conductive pattern layer, which is located on the electrically insulating substrate and is in contact with the surface of the electrically insulating substrate, wherein the electrode contacts are located on the transparent conductive pattern layer And contact the surface of the transparent conductive pattern layer.
本發明各實施例所提出的顯示裝置用的導電板的電極連接區列、第一導電線路及第二導電線路具有高導電性。一方面,同一列的這些電極連接區的這些第一電極接點均與鄰近的第一導電線路電連接,因而簡化了發光源的共電極的導電線路的走線。另一方面,電連接至同一列的這些電極連接區的這些第二電極接點的這些第二導電線路以分區段位於不同層的方式實現了重疊走線,因而解決了大尺寸顯示裝置的發光源的單電極的導電線路增多的情況下所導致的透明度降低問題。總的來說,本申請提出的技術方案降低了所有自電極連接區列的電極接點連接至導電板外圍的導電線路在導電板上所佔據的區域比例,進一步提高了顯示裝置用的導電板的透明度,且透過圖案化製程簡化了顯示裝置的導電板的製作複雜度。The electrode connection area columns, the first conductive circuit and the second conductive circuit of the conductive plate used in the display device proposed by the embodiments of the present invention have high conductivity. On the one hand, the first electrode contacts of the electrode connection areas in the same column are all electrically connected to the adjacent first conductive lines, thus simplifying the routing of the conductive lines of the common electrode of the light-emitting source. On the other hand, the second conductive lines electrically connected to the second electrode contacts of the electrode connection areas in the same column realize overlapping wiring in a manner that the sections are located in different layers, thereby solving the problem of light emission of large-size display devices. The problem of reduced transparency caused by the increase in the number of conductive lines of the single electrode of the source. In general, the technical solution proposed in this application reduces the proportion of the area occupied by the conductive circuit on the conductive plate from the electrode contacts of the electrode connection area column to the periphery of the conductive plate, and further improves the conductive plate for the display device. The transparency is high, and the manufacturing complexity of the conductive plate of the display device is simplified through the patterning process.
本發明揭示一種顯示裝置用的導電板。以下文中說明所對照的圖示,意在表達與本發明有關的特徵及便於理解的含義,並未依據實際尺寸完整繪製,亦不對本發明構成限定,在先聲明。此外,以下文中所敘及的技術用語的意思如有與所屬技術領域的通常用語的意思不同時,以文中所敘及的技術用語的意思為準。The invention discloses a conductive plate for a display device. The illustrations to be compared in the following description are intended to express the features and easy-to-understand meanings related to the present invention, and are not drawn completely based on the actual size, nor do they limit the present invention, as stated earlier. In addition, if the meaning of the technical terms described in the following text is different from the meaning of the usual terms in the technical field, the meaning of the technical terms described in the text shall prevail.
圖1是一平面示意圖,顯示依據本發明一實施例的顯示裝置用的導電板的電極連接區列。圖2是一平面示意圖,顯示依據本發明一實施例的顯示裝置用的導電板的各個電極連接區列的第一導電線路和第二導電線路。請參照圖1及圖2,一實施例中,顯示裝置用的導電板1具有一電絕緣基板10、多個電極連接區列11、多個第一導電線路12、多個第二導電線路13及多個第一透明電絕緣層141。本實施例中,這些電極連接區列11彼此分離地位於電絕緣基板10上,這些電極連接區列11各自具有多個彼此電性隔離且間隔配置成列的電極連接區111,這些電極連接區111各自具有多個彼此電性隔離的電極接點112a、112b、112c及112d,其中電極接點112a供一發光源的一共電極電連接用,電極接點112b、112c和112d分別供發光源的多個單電極電連接用。後文中,電極接點112a簡稱為第一電極接點,電極接點112b、112c和112d簡稱為第二電極接點。另一實施例中,顯示裝置用的導電板1的電絕緣基板10上還具有一透明導電圖案層101,透明導電圖案層101與電絕緣基板10的表面接觸,而電極接點112a、112b、112c及112d位於透明導電圖案層101上且接觸透明導電圖案層101的表面。透明導電圖案層101可用來提升這些電極接點的散熱效果,例如是一層以濺鍍或蒸鍍的方式所形成的氧化銦錫(ITO)膜、氟摻雜氧化錫(FTO)膜、氧化鋅(ZnO)膜或氧化鋁鋅(AZO)膜。所述的電絕緣基板10可以為透明的電絕緣基板,以構成透明的顯示裝置,電絕緣基板10的材質例如是玻璃、陶瓷、氮化鋁陶瓷、聚碳酸酯、聚對苯甲酸乙二酯、聚醯亞胺或環狀烯烴共聚物。所述的發光源例如是可發出紅光、藍光和綠光的LED燈珠,而所述的發光源的共電極例如是LED燈珠的電壓輸入電極,所述的發光源的單電極例如是LED燈珠的紅光、藍光及綠光的接地電極。FIG. 1 is a schematic plan view showing a row of electrode connection regions of a conductive plate used in a display device according to an embodiment of the present invention. 2 is a schematic plan view showing the first conductive circuit and the second conductive circuit of each electrode connection area column of the conductive plate for the display device according to an embodiment of the present invention. 1 and 2, in one embodiment, the
請繼續參照圖1及圖2,這些第一導電線路12彼此分離地位於電絕緣基板10上,這些第一導電線路12各自沿鄰近的電極連接區列11延伸且電連接至鄰近的電極連接區列11的這些電極連接區111中的這些第一電極接點112a。這些第二導電線路13彼此分離地設置於電絕緣基板10上,較佳地以各自平行於電極連接區列11的方式延伸。這些位於相鄰的兩電極連接區列11之間的第二導電線路13各自的一端電連接至鄰近的電極連接區列11的這些電極連接區111其中之一的第二電極接點112b、112c和112d其中之一。這些第一導電線路12及這些第二導電線路13可以是以網版印刷或噴印方式經圖案化處理後形成於同一導電層上或不同的導電層上。這些第一導電線路12及這些第二導電線路13的材質較佳為金屬。Please continue to refer to FIGS. 1 and 2. The first
圖3是一剖視圖,顯示圖2中的A-A剖面。圖4是一剖視圖,顯示圖2中的B-B剖面。請參照圖2、圖3及圖4,一實施例中,這些電極連接區列11各自分隔成多個區段,各個電極連接區列11的這些區段至少包含一第一區段A和一第二區段B,第一區段A和第二區段B屬於同一列上的不同區段。換言之,這些電極連接區列11各自至少包含第一區段A的電極連接區111和第二區段B的電極連接區111,且這些第二導電線路13至少包含電連接至同一電極連接區列111的第一區段A內的這些電極連接區111的這些第二導電線路13a和電連接至同一電極連接區列111的第二區段B內的這些電極連接區111的這些第二導電線路13b。此外,分別電連接至同一電極連接區列11的第一區段A內和第二區段B內的這些電極連接區111中的這些第二電極接點112b、112c和112d的所有第二導電線路13a和13b的另一端均被導引至位於電絕緣基板10的一側邊10a的鄰近表面上的和同一電極連接區列11對應的一聯外電連接區15中且分別和對應的聯外電連接區15中的多個配置成多個行的電連接墊151(示於圖6)構成電連接。這些聯外電連接區15各自具有的電連接墊151的配置行數相等於對應的電極連接區列11的分隔區段的個數。Fig. 3 is a cross-sectional view showing the A-A section in Fig. 2. Fig. 4 is a cross-sectional view showing the B-B section in Fig. 2. Referring to FIGS. 2, 3, and 4, in one embodiment, each of the electrode
請繼續參照圖2、圖3及圖4,一實施例中,顯示裝置用的導電板1所具有的多個第一透明電絕緣層141,彼此分離地位於電絕緣基板10上,這些第一透明電絕緣層141各自位於電連接至同一電極連接區列11的第一區段A內的這些電極連接區111的這些第二導電線路13a和電連接至同一電極連接區列11的第二區段B內的這些電極連接區111的這些第二導電線路13b之間,且電連接至同一電極連接區列11的第二區段B內的這些電極連接區111的這些第二導電線路13b和電連接至同一電極連接區列11的第一區段A內的這些電極連接區111的這些第二導電線路13a至少有部份於顯示裝置的顯示方向(如圖所示的紙面法線方向)上對應重疊。詳細地說,電連接至同一電極連接區列111的第一區段A內的這些電極連接區111的這些第二導電線路13a形成於第一導電層131中,而電連接至同一電極連接區列111的第二區段B內的這些電極連接區111的這些第二導電線路13b形成於第二導電層132中。第二導電層132和第一導電層131不在同一面。Please continue to refer to FIG. 2, FIG. 3, and FIG. 4. In one embodiment, the
請繼續參照圖2、圖3及圖4,另一實施例中,這些電極連接區列11各自的分隔區段除了前述的第一區段A、第二區段B外,還可以包含一第三區段C,第三區段C、第一區段A和第二區段B屬於同一列的不同區段。換言之,這些電極連接區列11各自至少包含第一區段A的電極連接區111、第二區段B的電極連接區111和第三區段C的電極連接區111,且這些第二導電線路13至少包含電連接至同一電極連接區列111的第一區段A內的這些電極連接區111的這些第二導電線路13a、電連接至同一電極連接區列111的第二區段B內的這些電極連接區111的這些第二導電線路13b和電連接至同一電極連接區列111的第三區段C內的這些電極連接區111的這些第二導電線路13c。此外,分別電連接至同一電極連接區列11的第一區段A內、第二區段B內和第三區段C內的這些電極連接區111中的這些第二電極接點112b、112c和112d的所有第二導電線路13a、13b和13c的另一端均被導引至位於電絕緣基板10的一側邊10a的鄰近表面上的和同一電極連接區列11對應的一聯外電連接區15中且分別和對應的聯外電連接區15中的多個配置成多個行的電連接墊151(示於圖6)構成電連接。這些聯外電連接區15各自具有的電連接墊151的配置行數相等於對應的電極連接區列11的分隔區段的個數。Please continue to refer to FIG. 2, FIG. 3 and FIG. 4. In another embodiment, in addition to the aforementioned first section A and second section B, the separate sections of the electrode
請繼續參照圖2、圖3及圖4,另一實施例中,顯示裝置用的導電板1還具有多個第二透明電絕緣層142,彼此分離地位於電絕緣基板10上,這些第二透明電絕緣層142各自位於電連接至同一電極連接區列11的第三區段C內的這些電極連接區111的這些第二導電線路13c和電連接至同一電極連接區列11的第二區段B內的這些電極連接區111的這些第二導電線路13b之間,且電連接至同一電極連接區列11的第三區段C內的這些電極連接區111的這些第二導電線路13c和電連接至同一電極連接區列11的第二區段B內的這些電極連接區111的這些第二導電線路13b至少有部份於顯示裝置的顯示方向(如圖所示的紙面法線方向)上對應重疊。詳細地說,電連接至同一電極連接區列111的第一區段A內的這些電極連接區111的這些第二導電線路13a形成於第一導電層131中,電連接至同一電極連接區列111的第二區段B內的這些電極連接區111的這些第二導電線路13b形成於第二導電層132中,而電連接至同一電極連接區列111的第三區段C內的這些電極連接區111的這些第三導電線路13c形成於第三導電層133中。第三導電層133、第二導電層132和第一導電層131分別在不同面。Please continue to refer to FIG. 2, FIG. 3 and FIG. 4. In another embodiment, the
請繼續參照圖3,一實施例中,電連接至同一電極連接區列11的第一區段A內的這些電極連接區111的這些第二導電線路13a和電連接至同一電極連接區列11的這些電極連接區111的第一導電線路12可形成於同一導電層中而位於同一面上。3, in one embodiment, the second
請繼續參照圖2,一實施例中,同一電極連接區列11的第一區段A內的這些電極連接區111和對應的聯外電連接區15之間的距離大於同一電極連接區列11的第二區段B內的這些電極連接區111和對應的聯外電連接區15之間的距離,且電連接至同一電極連接區列11的第一區段A內的這些電極連接區111的這些第二導電線路13a的每單位距離阻抗小於電連接至同一電極連接區列11的第二區段B內的這些電極連接區111的這些第二導電線路13b的每單位距離阻抗。另一實施例中,同一電極連接區列11的第二區段B內的這些電極連接區111和對應的聯外電連接區15之間的距離大於同一電極連接區列11的第三區段C內的這些電極連接區111和對應的聯外電連接區15之間的距離,且電連接至同一電極連接區列11的第二區段B內的這些電極連接區111的這些第二導電線路13b的每單位距離阻抗大於電連接至同一電極連接區列11的第一區段A內的這些電極連接區111的這些第二導電線路13a的每單位距離阻抗和小於電連接至同一電極連接區列11的第三區段C內的這些電極連接區111的這些第二導電線路13c的每單位距離阻抗,以使顯示裝置的整體亮度均勻。Please continue to refer to FIG. 2, in an embodiment, the distance between these
請繼續參照圖2,一實施例中,同一電極連接區列11中,電連接至第一區段A內的這些電極連接區111的這些第二導電線路13a的外表面具有一不同於其內部材質的高導電性金屬層,例如銅層,以提升導電性;電連接至第二區段B內的這些電極連接區111的這些第二導電線路13b的外表面僅一部份具有一不同於其內部材質的高導電金屬層,例如銅層,且在其他部份不具有此高導電金屬層;電連接至第三區段C內的這些電極連接區111的這些第二導電線路13c的外表面完全不具有不同於其內部材質的高導電性金屬層,藉此來實現電連接至第二區段B內的這些電極連接區111的這些第二導電線路13b的每單位距離阻抗大於電連接至第一區段A內的這些電極連接區111的這些第二導電線路13a的每單位距離阻抗和小於電連接至第三區段C內的這些電極連接區111的這些第二導電線路13c的每單位距離阻抗。Please continue to refer to FIG. 2, in one embodiment, in the same electrode
圖5是一平面示意圖,顯示依據本發明一實施例的顯示裝置用的導電板的第二導電線路的具有電隔離層的部份和具有金屬層的部分。如圖5所示,為了實現圖2中的電連接至同一電極連接區列11的第二區段B內的這些電極連接區111的這些第二導電線路13b的外表面僅一部份具有一不同於其內部材質的高導電金屬層且在其他部份不具有此高導電金屬層,可先將電性絕緣材料塗佈在第二導電線路13b的外表面的一第一部份40,以形成一電隔離層50,再將金屬材料,例如銅材料,鍍在第二導電線路13b的外表面的一第二部份60,以形成金屬層70,例如是銅層,電隔離層50及金屬層70位於同一面上。依此方式,可依實際需求調整第二導電線路13b的電阻值。所述電性絕緣材料的塗佈方式例如是網印,而所述金屬材料的鍍層方式例如是化學鍍或電鍍。5 is a schematic plan view showing a portion with an electrical isolation layer and a portion with a metal layer of the second conductive circuit of the conductive plate for a display device according to an embodiment of the present invention. As shown in FIG. 5, in order to achieve electrical connection to the
圖6是一平面示意圖,顯示依據本發明一實施例的顯示裝置用的導電板的聯外電連接區。請參照圖1、圖2及圖6,一實施例中,電連接至同一電極連接區列11的各個電極連接區111中的第二電極接點112b、112c和112d的所有第二導電線路13的另一端均被導引至位於電絕緣基板10的一側邊10a的鄰近表面上的和同一電極連接區列11對應的一聯外電連接區15中且分別和對應的聯外電連接區15中的多個配置成多個行的電連接墊151構成電連接。這些聯外電連接區15各自具有的電連接墊151的配置行數相等於對應的電極連接區列11的分隔區段的個數。如圖2及圖6所示,電連接墊151的配置行數為三,包含了右行的電連接墊1511、中行的電連接墊1512和左行的電連接墊1513,而對應的電極連接區列11的分隔區段的個數也為三,分別是第一區段A、第二區段B和第三區段C,但本發明不以此為限。同一行的電連接墊1511、1512或1513彼此對齊。FIG. 6 is a schematic plan view showing an external electrical connection area of a conductive plate used in a display device according to an embodiment of the present invention. Referring to FIGS. 1, 2 and 6, in one embodiment, all the second
詳言之,電連接至同一電極連接區列11的第一區段A內的各個電極連接區111中的第二電極接點112b、112c和112d的所有第二導電線路13a的另一端均被導引至和同一電極連接區列11對應的一聯外電連接區15中且分別和聯外電連接區15中的右行對齊的多個電連接墊1511構成電連接,右行的這些電連接墊1511的個數和第二導電線路13a的個數相同;電連接至同一電極連接區列11的第二區段B內的各個電極連接區111中的第二電極接點112b、112c和112d的所有第二導電線路13b的另一端均被導引至和同一電極連接區列11對應的聯外電連接區15中的中行對齊的多個電連接墊1512構成電連接,中行的這些電連接墊1512的個數和第二導電線路13b的個數相同;電連接至同一電極連接區列11的第三區段C內的各個電極連接區111中的第二電極接點112b、112c和112d的所有第二導電線路13c的另一端均被導引至和同一電極連接區列11對應的聯外電連接區15中的左行對齊的多個電連接墊1513構成電連接,左行的這些電連接墊1513的個數和第二導電線路13c的個數相同。如圖6所示,同一行的電連接墊1511、1512或1513的個數均為九,但不以此為限。In detail, the other ends of all the second conductive lines 13a electrically connected to the second electrode contacts 112b, 112c, and 112d in the respective electrode connection areas 111 in the first section A of the same electrode connection area column 11 are A plurality of electrical connection pads 1511 that are guided to an out-of-line electrical connection area 15 corresponding to the same electrode connection area column 11 and respectively aligned with the right row in the out-of-line electrical connection area 15 form electrical connections, and these electrical connection pads in the right row The number of 1511 is the same as the number of second conductive lines 13a; the number of second electrode contacts 112b, 112c, and 112d in each electrode connection area 111 in the second section B of the same electrode connection area column 11 is electrically connected The other ends of all the second conductive lines 13b are led to a plurality of electrical connection pads 1512 aligned with the middle row in the outer electrical connection area 15 corresponding to the same electrode connection area column 11 to form electrical connections, and these electrical connection pads 1512 in the middle row The number of is the same as the number of second conductive lines 13b; all of the second electrode contacts 112b, 112c, and 112d in each electrode connection area 111 in the third section C of the same electrode connection area column 11 are electrically connected The other end of the second conductive circuit 13c is all guided to a plurality of electrical connection pads 1513 aligned on the left row in the outer electrical connection area 15 corresponding to the same electrode connection area column 11 to form electrical connections, and these electrical connection pads in the left row The number of 1513 is the same as the number of second conductive lines 13c. As shown in FIG. 6, the number of
請參照圖4及圖6,一實施例中,所述的第一透明電絕緣層141露出電連接墊1511且將第二導電線路13a和第二導電線路13b及電連接墊1512電性隔離,所述的第二透明電絕緣層142露出電連接墊1512且將第二導電線路13b和第三導電線路13c及電連接墊1513電性隔離。此配置方式允許第二導電線路13a、第二導電線路13b和第二導電線路13c的走線區域及位置彼此重疊,且重疊的區域上不會發生電性接觸。因此,提高了顯示裝置用的導電板1的透明度。4 and FIG. 6, in one embodiment, the first transparent electrically
依本發明各實施例所提出的顯示裝置用的導電板,相較於傳統的LED顯示裝置用的導電板,其上配置的電極連接區列、第一導電線路及第二導電線路具有高導電性。一方面,同一列的這些電極連接區的這些第一電極接點均與鄰近的第一導電線路電連接,因而簡化了發光源的共電極的導電線路的走線。另一方面,電連接至同一列的這些電極連接區的這些第二電極接點的這些第二導電線路以分區段位於不同層的方式實現了重疊走線,因而解決了大尺寸顯示裝置的發光源的單電極的導電線路增多的情況下所導致的透明度降低問題。總的來說,本申請提出的技術方案降低了所有自電極連接區列的電極接點連接至導電板外圍的導電線路在導電板上所佔據的區域比例,進一步提高了顯示裝置用的導電板的透明度,且透過圖案化製程簡化了顯示裝置用的導電板的製作複雜度。Compared with the conductive plate used in the traditional LED display device, the conductive plate used in the display device proposed according to the embodiments of the present invention has high conductivity in the electrode connection area rows, the first conductive circuit, and the second conductive circuit. Sex. On the one hand, the first electrode contacts of the electrode connection areas in the same column are all electrically connected to the adjacent first conductive lines, thus simplifying the routing of the conductive lines of the common electrode of the light-emitting source. On the other hand, the second conductive lines electrically connected to the second electrode contacts of the electrode connection areas in the same column realize overlapping wiring in a manner that the sections are located in different layers, thereby solving the problem of light emission of large-size display devices. The problem of reduced transparency caused by the increase in the number of conductive lines of the single electrode of the source. In general, the technical solution proposed in this application reduces the proportion of the area occupied by the conductive circuit on the conductive plate from the electrode contacts of the electrode connection area column to the periphery of the conductive plate, and further improves the conductive plate for the display device. High transparency, and simplifies the manufacturing complexity of the conductive plate for the display device through the patterning process.
以上所述僅為本發明的較佳實施例,並非用以限定本發明。所述的電極連接區列、電極連接區、第一導電線路、第二導電線路和電極接點的個數僅為例示,這些元件的實際個數可依顯示裝置用的導電板的尺寸而定,本發明不在此限制。文中所敘及的透明導電圖案層或導電層可以是在一基板上所形成的具有特定導電圖案的層狀結構,形成導電圖案的方式包括但不限於網版印刷、噴印、貼膜、噴塗、濺鍍成膜或蒸鍍成膜後雷射蝕刻。同時,以上的描述對於本發明所屬技術領域中具有通常知識者,應可明瞭而據以實施。只要不脫離本發明的精神和後附申請專利範圍,任何依據上述實施例所作的等效變更與調整,均視為包含於本發明的申請專利範圍中。The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. The number of electrode connection area columns, electrode connection areas, first conductive lines, second conductive lines, and electrode contacts are only examples, and the actual number of these elements can be determined by the size of the conductive plate used in the display device , The present invention is not limited here. The transparent conductive pattern layer or conductive layer mentioned in the text can be a layered structure with a specific conductive pattern formed on a substrate. The method of forming the conductive pattern includes but not limited to screen printing, spray printing, filming, spraying, Laser etching after sputtering film formation or evaporation film formation. At the same time, the above description should be clear to those with ordinary knowledge in the technical field of the present invention and implemented accordingly. As long as it does not deviate from the spirit of the present invention and the scope of the attached patent application, any equivalent changes and adjustments made according to the above-mentioned embodiments are deemed to be included in the scope of the present invention.
1:顯示裝置用的導電板
10:電絕緣基板
10a:側邊
101:透明導電圖案層
11:電極連接區列
111:電極連接區
112a:電極接點
112b:電極接點
112c:電極接點
112d:電極接點
12:第一導電線路
13:第二導電線路
13a:電連接至第一區段的電極連接區的第二導電線路
13b:電連接至第二區段的電極連接區的第二導電線路
13c:電連接至第三區段的電極連接區的第二導電線路
131:第一導電層
132:第二導電層
133:第三導電層
141:第一透明電絕緣層
142:第二透明電絕緣層
15:聯外電連接區
151:電連接墊
1511:右行的電連接墊
1512:中行的電連接墊
1513:左行的電連接墊
40:第一部份
50:電隔離層
60:第二部份
70:金屬層
A:第一區段
B:第二區段
C:第三區段1: Conductive plate for display device
10: Electrically insulating
圖1是一平面示意圖,顯示依據本發明一實施例的顯示裝置用的導電板的電極連接區列。 圖2是一平面示意圖,顯示依據本發明一實施例的顯示裝置用的導電板的各個電極連接區列的第一導電線路和第二導電線路。 圖3是一剖視圖,顯示圖2中的A-A剖面。 圖4是一剖視圖,顯示圖2中的B-B剖面。 圖5是一平面示意圖,顯示依據本發明一實施例的顯示裝置用的導電板的第二導電線路的具有電隔離層的部份和具有金屬層的部分。 圖6是一平面示意圖,顯示依據本發明一實施例的顯示裝置用的導電板的聯外電連接區。FIG. 1 is a schematic plan view showing a row of electrode connection regions of a conductive plate used in a display device according to an embodiment of the present invention. 2 is a schematic plan view showing the first conductive circuit and the second conductive circuit of each electrode connection area column of the conductive plate for the display device according to an embodiment of the present invention. Fig. 3 is a cross-sectional view showing the A-A section in Fig. 2. Fig. 4 is a cross-sectional view showing the B-B section in Fig. 2. 5 is a schematic plan view showing a portion with an electrical isolation layer and a portion with a metal layer of the second conductive circuit of the conductive plate for a display device according to an embodiment of the present invention. FIG. 6 is a schematic plan view showing an external electrical connection area of a conductive plate used in a display device according to an embodiment of the present invention.
11:電極連接區列 11: Electrode connection area column
111:電極連接區 111: Electrode connection area
112a:電極接點 112a: Electrode contact
112b:電極接點 112b: Electrode contact
112c:電極接點 112c: Electrode contact
112d:電極接點 112d: Electrode contact
12:第一導電線路 12: The first conductive line
13a:電連接至第一區段的電極連接區的第二導電線路 13a: The second conductive circuit electrically connected to the electrode connection area of the first section
13b:電連接至第二區段的電極連接區的第二導電線路 13b: The second conductive circuit electrically connected to the electrode connection area of the second section
13c:電連接至第三區段的電極連接區的第二導電線路 13c: The second conductive circuit electrically connected to the electrode connection area of the third section
141:第一透明電絕緣層 141: The first transparent electrical insulating layer
142:第二透明電絕緣層 142: second transparent electrical insulating layer
15:聯外電連接區 15: Unilateral electrical connection area
A:第一區段 A: The first section
B:第二區段 B: Second section
C:第三區段 C: Third section
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/713,879 US11276808B2 (en) | 2019-01-15 | 2019-12-13 | Conductive substrate for a display device |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201962792575P | 2019-01-15 | 2019-01-15 | |
US62/792,575 | 2019-01-15 | ||
TW108115689 | 2019-05-07 | ||
TW108115689 | 2019-05-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202029164A true TW202029164A (en) | 2020-08-01 |
TWI811451B TWI811451B (en) | 2023-08-11 |
Family
ID=71580232
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108133141A TWI811451B (en) | 2019-01-15 | 2019-09-13 | Conductive substrate for a display device |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN111435696A (en) |
TW (1) | TWI811451B (en) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6380559B1 (en) * | 1999-06-03 | 2002-04-30 | Samsung Electronics Co., Ltd. | Thin film transistor array substrate for a liquid crystal display |
KR100795344B1 (en) * | 2001-05-29 | 2008-01-17 | 엘지.필립스 엘시디 주식회사 | Array Panel used for a Liquid Crystal Display Device and Method of Fabricating the same |
TWI407870B (en) * | 2006-04-25 | 2013-09-01 | Ngk Spark Plug Co | Method for manufacturing wiring board |
US8115380B2 (en) * | 2008-08-14 | 2012-02-14 | Global Oled Technology Llc | Display device with chiplets |
US7830002B2 (en) * | 2008-11-04 | 2010-11-09 | Global Oled Technology Llc | Device with chiplets and adaptable interconnections |
JP2013026510A (en) * | 2011-07-22 | 2013-02-04 | Rohm Co Ltd | Led module and mounting structure of the same |
-
2019
- 2019-09-13 TW TW108133141A patent/TWI811451B/en active
- 2019-11-04 CN CN201911064787.7A patent/CN111435696A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
TWI811451B (en) | 2023-08-11 |
CN111435696A (en) | 2020-07-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6431969B1 (en) | LED display device | |
WO2021190378A1 (en) | Light emitting substrate, backlight source and display device | |
CN110632795B (en) | Backlight source, back plate thereof and manufacturing method | |
WO2021184810A1 (en) | Led lamp bead and led display structure | |
US11387387B2 (en) | Micro light emitting device display apparatus | |
TWI425858B (en) | Organic emitting device, illumination device and liquid crystal display device | |
WO2024066607A1 (en) | Display backplane and display device | |
TWI811451B (en) | Conductive substrate for a display device | |
US11681182B2 (en) | Circuit board for light-emitting diode assembly, backlight unit including the same and image display device including the same | |
TWI764471B (en) | Light-emitting board, circuit board and display device | |
US11276808B2 (en) | Conductive substrate for a display device | |
TWI801648B (en) | Conductive substrate of a display device | |
US20240036687A1 (en) | Display panel and touch component | |
TWI722734B (en) | Pixel structure | |
US10978663B2 (en) | Electroluminance lighting device | |
TW202224176A (en) | Light emitting display device having high aperture ratio and method of manufacturing the same | |
WO2022262047A1 (en) | Touch display panel | |
CN112563384A (en) | Conductive plate for display device | |
TWI711352B (en) | Conductive board for a display device | |
US20230317704A1 (en) | Display panel and display device | |
TWI817771B (en) | Display device | |
US11835816B2 (en) | Circuit board for light-emitting diode assembly, backlight unit including the same and image display device including the same | |
TWI461104B (en) | Organic electroluminescent device | |
WO2022133669A1 (en) | Display panel and method for manufacturing same, and display device | |
US20200411631A1 (en) | Array substrate and manufacturing method thereof, display panel and display device |