TW202146812A - Led light source module which can be cut into various shapes - Google Patents

Abstract

An LED light source module which can be cut into various shapes includes a substrate, a first continuous conductive layer, a second continuous conductive layer, a plurality of LED chips and an insulating layer. The first continuous conductive layer and the second continuous conductive layer are respectively disposed on two opposite surfaces of the substrate. The first continuous conductive layer has a plurality of chip mounting areas that are spaced apart from each other and uniformly distributed. The LED chips are respectively disposed in the chip mounting areas and are electrically connected to the first continuous conductive layer and the second continuous conductive layer. The insulating layer is disposed on the second continuous conductive layer. Therefore, the LED light source module can meet the shaping requirements of light source products.

Description

LED surface light source module that can be cut and shaped

The invention relates to an LED surface light source module, in particular to an LED surface light source module that can be cut and shaped, which can be applied to portable light sources, decorative/atmospheric light sources, various signboards/kanbans, indicator lights and the like after cutting.

Light-Emitting Diode (LED) at least has the advantages of small size, high luminous efficiency, low energy consumption, etc., and can emit light of different colors, so it has a good application prospect. In order to generate the luminous effect required by the application, the existing LED light source module will arrange a plurality of LEDs on a module substrate, and use the wires arranged on the module substrate to connect all the LEDs in electrical parallel. All LEDs can be controlled simultaneously. However, when the number of LEDs required by the module is increasing, or when the volume of the module needs to be smaller and smaller, the design of the wiring will tend to be complicated, and the overall manufacturing difficulty and manufacturing cost will also be relatively increased; What's more, once the trace is interrupted, there will be some LEDs that cannot be lit.

At present, the shape and size of such LED light source modules are generally fixed. If the LED light source modules with fixed shape and size cannot meet the actual application requirements, they can only be customized, and there are certain limitations in use. sex. In addition, such LED light source modules are generally made into an integrated structure, which is not convenient for cutting. Even if they can be cut, they cannot be cut into any shape, and they are not flexible and convenient to use.

In addition, since this type of LED light source module uses a fully parallel method to supply power to multiple LEDs, the on-resistance of the line will increase with the transmission distance and cause the current to drop. As a result, the closer it is to the power input end The higher the brightness of the LEDs, and the lower the brightness of the LEDs farther from the power input.

The technical problem to be solved by the present invention is to provide an LED surface light source module which can be cut and shaped in view of the deficiencies of the prior art.

In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a LED surface light source module that can be cut and shaped, which includes a substrate, a first continuous conductive layer, a plurality of LED chips, a first Two continuous conductive layers and an insulating layer. The substrate has a first surface and a second surface opposite to the first surface, wherein the substrate has a plurality of first through holes; the first continuous conductive layer is disposed on the surface of the substrate On the first surface, the first continuous conductive layer has a plurality of die-bonding regions, and each of the die-bonding regions is provided with a first contact pad connected to the first continuous conductive layer and an independent second contact pad; a plurality of the LED chips are respectively disposed in the plurality of the die-bonding regions, wherein each of the LED chips has a first contact pad connected to the corresponding first contact pad an electrode and a second electrode on the corresponding second contact pad; the second continuous conductive layer is disposed on the second surface of the substrate and passes through a plurality of the first conductive holes electrically connected with a plurality of the second contact pads; the insulating layer is disposed on the second continuous conductive layer.

Further, the substrate has an inner portion and an outer portion, and the inner portion has a plurality of the first via holes; the plurality of the die-bonding regions of the first continuous conductive layer are located in the above the inner side and in an array.

Further, the first continuous conductive layer has a plurality of first lead-out portions arranged at intervals, the second continuous conductive layer has a plurality of second lead-out portions arranged at intervals, and a plurality of the first lead-out portions The positions of the plurality of second lead-out portions correspond to the outer portion of the substrate.

Further, the outer portion of the substrate has a plurality of second via holes, the second surface of the substrate is provided with a plurality of conductive pads, and the plurality of conductive pads are continuous with the second The plurality of the second lead-out portions of the conductive layer are alternately arranged and electrically insulated from each other, and the plurality of the conductive pads pass through the plurality of the second through holes and the plurality of the first continuous conductive layer respectively. The first lead-out portion is electrically connected.

Furthermore, the plurality of conductive pads and the plurality of the second lead-out portions of the second continuous conductive layer are exposed from the insulating layer.

Furthermore, the LED surface light source module that can be cut and shaped further includes a protective layer, and the transparent layer covers a plurality of the LED chips.

Further, the protective layer is a transparent layer or a fluorescent layer.

Further, the protective layer contains a plurality of light diffusing particles uniformly distributed.

Furthermore, the light emission wavelength of each of the LED chips is 430 nm to 470 nm.

Further, the length and width of each of the LED chips are less than 500 microns.

Further, the area of the first continuous conductive layer accounts for more than 60% of the area of the first surface of the substrate, and the area of the second continuous conductive layer accounts for the second continuous conductive layer of the substrate. more than 60% of the surface area.

One of the beneficial effects of the present invention is that the LED surface light source module of the present invention can be cut into any shape, is flexible and convenient to use, and can meet the diverse modeling requirements of light source products. In addition, the LED surface light source module of the present invention has a simple structure, does not require complicated wiring/conducting structures, and has stable and reliable working performance.

For a further understanding of the features and technical content of the present invention, please refer to the following detailed descriptions and drawings of the present invention. However, the drawings provided are only for reference and description, and are not intended to limit the present invention.

The following are specific specific examples to illustrate the embodiments of the "cuttable LED surface light source module" disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to the actual size, and are stated in advance. The following embodiments will further describe the related technical contents of the present invention in detail, but the disclosed contents are not intended to limit the protection scope of the present invention. In addition, the term "or", as used herein, should include any one or a combination of more of the associated listed items, as the case may be.

1 to 8, a preferred embodiment of the present invention provides an LED surface light source module Z, which mainly includes a substrate 1, a first continuous conductive layer 2, a plurality of LED chips 3, and a second continuous Conductive layer 4 and an insulating layer 5 . The first continuous conductive layer 2 and the second continuous conductive layer 4 are respectively disposed on two opposite surfaces of the substrate 1, wherein the first continuous conductive layer 2 has a plurality of die-bonding regions 200 spaced apart from each other, a plurality of LED chips 3 They are respectively disposed in the plurality of die-bonding regions 200 and electrically connect the first continuous conductive layer 2 and the second continuous conductive layer 4 , and the insulating layer 5 is disposed on the second continuous conductive layer 4 . In this embodiment, the plurality of die-bonding regions 200 are formed by partially hollowing out the first continuous conductive layer 2 , and the method of partially hollowing out the first continuous conductive layer 2 may be lithography etching, but is not limited thereto.

In use, a plurality of LED chips 3 are evenly arranged on the substrate 1, the substrate 1 can provide a basis for physical support and electrical conduction for the plurality of LED chips 3, and the first continuous conductive layer 2 and the second continuous conductive layer 4 can be used. The electrical signals from the outside are transmitted to the plurality of LED chips 3 at the same time. In this way, a plurality of LED chips 3 can be driven to emit light without complicated wiring/conductive structure; and even the substrate 1 together with the first continuous conductive layer 2 and the second continuous conductive layer 4 are cut to have a special shape , the leaf shape shown in Figure 8 will not affect the normal light emission of the remaining LED chips 3. The LED surface light source module Z of the present invention can be applied to portable light sources, decorative/atmospheric light sources, various signboards/signboards, indicator lights, etc. after cutting, but is not limited thereto.

Referring now to FIG. 2 to FIG. 6 , the substrate 1 may be formed of a resin substrate containing a reinforcing material (such as glass fiber). The substrate 1 has a first surface 101 (such as an upper surface) and a second surface 102 ( The following surface), and the substrate 1 has a plurality of first via holes 11a. The first continuous conductive layer 2 is disposed on the first surface 101 of the substrate 1 . The first continuous conductive layer 2 may be a patterned copper foil layer, and occupies more than 60% of the area of the first surface 101 of the substrate 1 ; A plurality of die-bonding regions 200 of the first continuous conductive layer 2 are arranged in an array, and each die-bonding region 200 is provided with a first contact pad P1 and a second contact pad P2, wherein the first contact pad P1 and The first continuous conductive layer 2 is connected, and the second contact pad P2 exists in an independent form; the first contact pad P1, the second contact pad P2 and the first continuous conductive layer 2 can be formed in the same process, but not limited here. In this embodiment, the substrate 1 has an inner portion 1a and an outer portion 1b, the outer portion 1b is located outside the inner portion 1a, and preferably surrounds the inner portion 1a; and a plurality of first conductive holes 11a are formed in the inner portion 1a, and the plurality of die-bonding regions 200 are located above the inner portion 1a. However, the above descriptions are only feasible embodiments, and are not intended to limit the present invention.

In addition, the second continuous conductive layer 4 is disposed on the second surface 102 of the substrate 1, and is electrically connected to the plurality of second contact pads P2 through the plurality of first via holes 11a. The second continuous conductive layer 4 may also be It is a patterned copper foil layer, and occupies more than 60% of the area of the second surface 102 of the substrate 1 . A plurality of LED chips 3 are respectively disposed in the plurality of die-bonding regions 200 of the first continuous conductive layer 2 , and each LED chip 3 is a flip-chip LED chip having a first electrode 31 and a second electrode 32 , wherein the first electrode 31 is connected to the first contact pad P1 to be electrically connected to the first continuous conductive layer 2 , and the second electrode 32 is connected to the second contact pad P2 to be connected to the second continuous conductive layer 4 Electrical connection. In this embodiment, each LED chip 3 is used for emitting blue light, and its emission wavelength is preferably 430 nm to 470 nm, and the length and width of each LED chip 3 are both less than 500 μm. The insulating layer 5 is disposed on the second continuous conductive layer 4 to avoid short circuit, and the insulating layer 5 can be formed by an insulating ink. However, the above descriptions are only feasible embodiments, and are not intended to limit the present invention.

According to actual needs, a plurality of transverse cutting lines L1 and a plurality of longitudinal cutting lines L2 can be drawn on the insulating layer 5 by using colored ink, and the plurality of transverse cutting lines L1 can be arranged at intervals along the row direction of the array in which the die-bonding regions 200 are arranged. , and the plurality of longitudinal cutting lines L2 may be spaced along the column direction in which the die-bonding regions 200 are arranged in an array, and the plurality of die-bonding regions 200 may be located between the plurality of transverse cutting lines L1 and the plurality of longitudinal cutting lines L2. In this way, each cutting action can be along a horizontal cutting line L1 or a vertical cutting line L2, avoiding errors caused by manual cutting, improving accuracy, and ensuring that the finished product has the desired shape.

In practical application, the LED surface light source module Z of the present invention may include a plurality of electrical connection interfaces for receiving electrical signals from the outside; further, as shown in FIG. 1 to FIG. 4 , the first continuous conductive layer 2. There are a plurality of first lead-out parts 21 arranged at intervals, any one of the first lead-out parts 21 can introduce electrical signals to the first electrodes 31 of the plurality of LED chips 3, and the second continuous conductive layer 4 has a plurality of intervals For the second lead-out portions 41 arranged, any one of the second lead-out portions 41 can introduce electrical signals to the second electrodes 32 of the plurality of LED chips 3 . In this embodiment, the positions of the plurality of first lead-out portions 21 and the plurality of second lead-out portions 41 correspond to the outer portion 1 b of the substrate 1 .

For optimization purposes, the outer portion 1b of the substrate 1 can have a plurality of second via holes 11b, and the second surface 102 of the substrate 1 can be provided with a plurality of conductive pads P3; the conductive pads P3 and the second continuous conductive layer 4 can be formed in the same process, but not limited thereto. In addition, the plurality of conductive pads P3 and the plurality of second lead-out portions 41 of the second continuous conductive layer 4 are alternately arranged on the same plane and are electrically insulated from each other, and the plurality of conductive pads P3 respectively pass through the plurality of second via holes 11b is electrically connected to the plurality of first lead-out portions 21 of the first continuous conductive layer 2; in addition, the plurality of conductive pads P3 and the plurality of second lead-out portions 41 of the second continuous conductive layer 4 are exposed from the insulating layer 5, To form an electrical conduction loop with external electronic devices or functional elements. Thereby, the LED surface light source module Z of the present invention can be more easily combined with external electronic devices or functional elements.

Referring now to FIGS. 6 and 7 , the LED surface light source module Z of the present invention may further include a protective layer 6 for covering the first continuous conductive layer 2 and the plurality of LED chips 3 . The protective layer 6 can resist the impact of external force and prevent the invasion of water and oxygen, so as to ensure the normal operation of the plurality of LED chips 3; the protective layer 6 can be formed of epoxy resin or silicone resin. In this embodiment, the protective layer 6 can be formed by a stamping method, and the protective layer 6 can be a transparent layer (as shown in FIG. 6 ) or a fluorescent layer (as shown in FIG. 7 ). The layer 6 may contain a plurality of light diffusing particles 61 evenly distributed, and the plurality of light diffusing particles 61 may be silicon dioxide particles or titanium dioxide particles, so as to uniformly disperse the light emitted by the plurality of LED chips 3 . However, the above descriptions are only feasible embodiments, and are not intended to limit the present invention.

One of the beneficial effects of the present invention is that in the LED surface light source module of the present invention, the first continuous conductive layer and the second continuous conductive layer are respectively disposed on two opposite surfaces of the substrate, wherein the first continuous conductive layer The layer has a plurality of mutually spaced die-bonding regions, a plurality of LED chips are respectively arranged in the plurality of die-bonding regions, and are electrically connected to the first continuous conductive layer and the second continuous conductive layer, and the insulating layer is arranged on the second continuous conductive layer. It can be cut into any shape, flexible and convenient to use, and can meet the diverse modeling needs of light source products. In addition, the LED surface light source module of the present invention has a simple structure, does not require complicated wiring/conducting structures, and has stable and reliable working performance.

Furthermore, the area of the first continuous conductive layer and the area of the second continuous conductive layer each account for more than 60% of the corresponding surface area of the substrate, so the LED surface light source module of the present invention does not have on-resistance variation. The problem of increasing the transmission distance of the line.

The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the scope of the present invention. Therefore, any equivalent technical changes made by using the contents of the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

Z: LED surface light source module 1: Substrate 1a: inner side 1b: Outer part 11a: first via hole 11b: second via hole 101: First Surface 102: Second Surface 2: The first continuous conductive layer 21: The first lead-out part 200: solid crystal area 3: LED chip 31: The first electrode 32: Second electrode 4: The second continuous conductive layer 41: Second lead-out 5: Insulation layer 6: Protective layer 61: Light Diffusion Particles P1: first contact pad P2: Second Contact Pad P3: Conductive pad L1: Transverse cutting line L2: Transverse cutting line

FIG. 1 is a schematic top view of the LED surface light source module that can be cut and shaped according to the present invention.

FIG. 2 is a partial three-dimensional schematic diagram of the LED surface light source module capable of cutting and modeling according to the present invention.

FIG. 3 is a partial top plan view of the LED surface light source module that can be cut and shaped according to the present invention.

4 is a schematic bottom view of a part of the LED surface light source module that can be cut and shaped according to the present invention.

FIG. 5 is another partial bottom schematic view of the LED surface light source module that can be cut and shaped according to the present invention.

FIG. 6 is a schematic cross-sectional view of the LED surface light source module that can be cut and shaped according to the present invention.

7 is another schematic cross-sectional view of the LED surface light source module capable of cutting and modeling according to the present invention.

FIG. 8 is a schematic diagram of the use state of the LED surface light source module capable of cutting and modeling according to the present invention.

Z: LED surface light source module

1a: inner side

1b: Outer part

11a: first via hole

11b: second via hole

101: First Surface

102: Second Surface

2: The first continuous conductive layer

21: The first lead-out part

3: LED chip

31: The first electrode

32: Second electrode

4: The second continuous conductive layer

5: Insulation layer

6: Protective layer

P1: first contact pad

P2: Second Contact Pad

P3: Conductive pad

Claims (11)

An LED surface light source module that can be cut and shaped, comprising: a substrate having a first surface and a second surface opposite to the first surface, wherein the substrate has a plurality of first vias; a first continuous conductive layer disposed on the first surface of the substrate, wherein the first continuous conductive layer has a plurality of die-bonding regions, and each of the die-bonding regions is provided with the a first contact pad connected to the first continuous conductive layer and a second contact pad independently existing; A plurality of LED chips are respectively disposed in a plurality of the die-bonding regions, wherein each of the LED chips has a first electrode connected to the corresponding first contact pad and a first electrode connected to the corresponding first contact pad. a second electrode on the two contact pads; a second continuous conductive layer disposed on the second surface of the substrate and electrically connected to the second contact pads through the first vias; and An insulating layer is disposed on the second continuous conductive layer. The LED surface light source module that can be cut and shaped according to claim 1, wherein the substrate has an inner part and an outer part, and the inner part has a plurality of the first conducting holes; A plurality of the die-bonding regions of a continuous conductive layer are located above the inner portion and arranged in an array. The LED surface light source module that can be cut and shaped according to claim 2, wherein the first continuous conductive layer has a plurality of first lead-out portions arranged at intervals, and the second continuous conductive layer has a plurality of In the second lead-out portions arranged at intervals, the positions of the plurality of the first lead-out portions and the plurality of the second lead-out portions correspond to the outer portion of the substrate. The LED surface light source module that can be cut and shaped according to claim 3, wherein the outer portion of the substrate has a plurality of second through holes, and the second surface of the substrate is provided with a plurality of second through holes. Conductive pads, a plurality of the conductive pads and the plurality of the second lead-out portions of the second continuous conductive layer are alternately arranged and electrically insulated from each other, and the plurality of the conductive pads pass through the plurality of the second lead-out portions respectively The via hole is electrically connected to the plurality of first lead-out portions of the first continuous conductive layer. The LED surface light source module that can be cut and shaped according to claim 4, wherein the plurality of conductive pads and the plurality of the second lead-out portions of the second continuous conductive layer are exposed from the insulating layer. The LED surface light source module that can be cut and shaped according to claim 1, further comprising a protective layer, and the transparent layer covers a plurality of the LED chips. The LED surface light source module that can be cut and shaped according to claim 6, wherein the protective layer is a transparent layer or a fluorescent layer. The LED surface light source module that can be cut and shaped according to claim 7, wherein the protective layer contains a plurality of light diffusing particles evenly distributed. The LED surface light source module that can be cut and shaped according to claim 1, wherein the emission wavelength of each of the LED chips is 430 nm to 470 nm. The LED surface light source module that can be cut and shaped according to claim 1, wherein the length and width of each of the LED chips are less than 500 microns. The LED surface light source module that can be cut and shaped according to claim 1, wherein the area of the first continuous conductive layer accounts for more than 60% of the area of the first surface of the substrate, and the first continuous conductive layer accounts for more than 60% of the area of the first surface of the substrate. The area of the two continuous conductive layers accounts for more than 60% of the area of the second surface of the substrate.

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