TWI533468B - Light emitting element and illumination device thereof - Google Patents

Description

Light-emitting element and light-emitting device thereof

The present invention relates to a light-emitting element and a light-emitting device using the same, and more particularly to a light-emitting element that emits light in multiple directions and a light-emitting device having the light-emitting element.

The light emitted by the light emitting diode (LED) itself is biased toward a directional light source. It is not a general-purpose light bulb as a divergent light source, and thus it is limited in application. For example, applications on general indoor and outdoor lighting fixtures do not achieve the desired light profile. In addition, the conventional light-emitting diode light-emitting device can emit light only on one side, and thus has low luminous efficiency.

It is an object of the present invention to provide a light-emitting element that emits light in at least a plurality of directions and a light-emitting device using the same to improve luminous efficiency, improve light quality, and save cost.

A preferred embodiment of the present invention provides a light emitting device including a transparent substrate and a plurality of light emitting diode chips. The transparent substrate has a bearing surface and a second main surface disposed opposite to each other. At least a portion of the light emitting diode chip is disposed on the carrying surface and forms a first main surface illuminable with a portion of the bearing surface on which the light emitting diode chip is not disposed. Each of the LED chips includes a first electrode and a second electrode. The direction of illumination of the at least one light emitting diode wafer includes passing through the transparent substrate and emitting light from the second major surface.

A preferred embodiment of the present invention provides a light emitting device including at least one light emitting element and a carrier. The light emitting element includes a transparent substrate and a plurality of light emitting diode chips. The transparent substrate has a bearing surface and a second main surface disposed opposite to each other. At least a portion of the light emitting diode chip is disposed on the carrying surface and forms a first main surface illuminable with a portion of the bearing surface on which the light emitting diode chip is not disposed. Each of the LED chips includes a first electrode and a second electrode. The direction of illumination of the at least one light emitting diode wafer includes passing through the transparent substrate and emitting light from the second major surface. The light-emitting component is disposed on the carrier and has a first angle with the carrier.

Another preferred embodiment of the present invention provides a light emitting device including a transparent substrate and at least one light emitting diode wafer. The transparent substrate has a bearing surface and a second main surface disposed opposite to each other. The light emitting diode chip is disposed on the bearing surface and forms a first main surface that can emit light with a portion of the bearing surface that is not covered by the light emitting diode chip. The LED chip includes a first electrode and a second electrode. One of the light-emitting diode chips has an exit angle of more than 180 degrees, and the transparent substrate allows a light from the light-emitting diode chip to penetrate.

Another preferred embodiment of the present invention provides a light emitting device including a transparent substrate and at least one light emitting diode wafer. The transparent substrate material includes sapphire and has a bearing surface. The light emitting diode chip is disposed on the carrying surface. The light exiting angle of the light emitting diode chip is greater than 180 degrees. At least part of the light emitted by the LED chip can penetrate the transparent substrate and emit light from one of the second main surfaces of the corresponding bearing surface.

Another preferred embodiment of the present invention provides a light emitting device including a transparent substrate, at least one light emitting diode wafer, and an energy conversion layer. The transparent substrate has a bearing surface. The light-emitting diode chip is disposed on the carrying surface and forms a first main surface that can emit light with a portion of the bearing surface that is not covered by the light-emitting diode wafer. One of the light-emitting diode chips has an exit angle of more than 180 degrees. Wherein at least part of the light emitted by the LED chip can penetrate the transparent substrate and be carried from the corresponding carrier One of the second major surfaces of the face emits light. The energy conversion layer is disposed on at least the light emitting diode chip or the second main surface, and the energy conversion layer at least partially absorbs the light emitted by the light emitting diode chip and converts the light into another wavelength range.

Another preferred embodiment of the present invention provides a light emitting device including a transparent substrate and a plurality of light emitting diode chips. The transparent substrate has a bearing surface. The light-emitting diode chip is disposed on the bearing surface, and a light-emitting surface of each of the light-emitting diode chips not shielded by the transparent substrate is formed together with a part of the bearing surface not covered by the light-emitting diode wafer to form one of the first light-emitting surface. The light exiting angle of one of the light emitting diode chips is greater than 180 degrees, and at least part of the light emitted by the light emitting diode chip can penetrate the transparent substrate and emit light from a second main surface of the corresponding bearing surface, wherein the first main The area of the surface or the second major surface is more than 5 times the total area of the light-emitting surface of the light-emitting diode chip.

Another preferred embodiment of the present invention provides a light emitting device including a transparent substrate, at least one type of drilled carbon film, and at least one light emitting diode wafer. The transparent substrate has a bearing surface. The diamond-like carbon film system is disposed on a transparent substrate. The light emitting diode chip is disposed on the carrying surface. a light-emitting surface of the light-emitting diode chip not shielded by the transparent substrate, and a part of the bearing surface not covered by the light-emitting diode chip together form a first main surface that can emit light, and one light-emitting angle of the light-emitting diode chip The system is greater than 180 degrees. At least part of the light emitted by the LED chip can penetrate the transparent substrate and emit light from one of the second main surfaces of the corresponding bearing surface.

Another preferred embodiment of the present invention provides a light emitting device including a transparent substrate, at least one light emitting diode chip, and a mirror. The transparent substrate has a bearing surface, and the mirror is disposed on the second main surface of the corresponding one of the corresponding bearing surfaces on the transparent substrate. The light emitting diode chip is disposed on the carrying surface. a light-emitting surface of the light-emitting diode chip not shielded by the transparent substrate, and a part of the bearing surface not covered by the light-emitting diode chip together form a first main surface that can emit light, and one light-emitting angle of the light-emitting diode chip More than 180 degrees.

Another preferred embodiment of the present invention provides a light emitting device including a transparent substrate, at least one light emitting diode chip, a first connecting electrode, and a second connecting electrode. The transparent substrate has a bearing surface. The light emitting diode chip is disposed on the bearing surface and forms a first main surface that can emit light with a portion of the bearing surface not covered by the LED chip, and one of the light emitting diodes has an exit angle greater than 180 degrees. . At least part of the light emitted by the LED chip can penetrate the transparent substrate and emit light from one of the second main surfaces of the corresponding bearing surface. The first connection electrode and the second connection electrode are respectively disposed on opposite ends of the transparent substrate, and the first connection electrode and the second connection electrode are electrically connected to the LED substrate.

Another preferred embodiment of the present invention provides a light emitting device including a light emitting element and a bracket. The light emitting device includes a transparent substrate, at least one light emitting diode chip, a first connecting electrode and a second connecting electrode. The transparent substrate has a bearing surface. The light emitting diode chip is disposed on the bearing surface and forms a first main surface that can emit light with a portion of the bearing surface not covered by the LED chip, and one of the light emitting diodes has an exit angle greater than 180 degrees. . At least part of the light emitted by the LED chip can penetrate the transparent substrate and emit light from one of the second main surfaces of the corresponding bearing surface. The first connection electrode and the second connection electrode are respectively disposed on opposite ends of the transparent substrate, and the first connection electrode and the second connection electrode are electrically connected to the LED substrate. The bracket includes at least one notch, and the light emitting element is disposed corresponding to the notch.

Another preferred embodiment of the present invention provides a light emitting device including a plurality of light emitting elements and a device base. Each of the light emitting elements includes a transparent substrate, at least one light emitting diode chip, a first connecting electrode and a second connecting electrode. The transparent substrate has a bearing surface. The light emitting diode chip is disposed on the bearing surface and forms a first main surface that can emit light with a portion of the bearing surface not covered by the LED chip, and one of the light emitting diodes has an exit angle greater than 180 degrees. . At least part of the light emitted by the LED chip can penetrate the transparent substrate and be from the corresponding bearing surface A second major surface emits light. The first connection electrode and the second connection electrode are respectively disposed on opposite ends of the transparent substrate, and the first connection electrode and the second connection electrode are electrically connected to the LED substrate. The base of the device includes a carrier and a plurality of brackets extending outward from the carrier. Each of the brackets includes at least one notch, and each of the light-emitting elements is disposed corresponding to at least a portion of the notch.

Another preferred embodiment of the present invention provides a light emitting device including a plurality of light emitting elements and a light bar. Each of the light emitting elements includes a transparent substrate, at least one light emitting diode chip, a first connecting electrode and a second connecting electrode. The transparent substrate has a bearing surface. The light emitting diode chip is disposed on the bearing surface and forms a first main surface that can emit light with a portion of the bearing surface not covered by the LED chip, and one of the light emitting diodes has an exit angle greater than 180 degrees. . At least part of the light emitted by the LED chip can penetrate the transparent substrate and emit light from one of the second main surfaces of the corresponding bearing surface. The first connection electrode and the second connection electrode are respectively disposed on opposite ends of the transparent substrate, and the first connection electrode and the second connection electrode are electrically connected to the LED substrate. The light bar includes a plurality of notches. The light bar has an extending direction, a plurality of notches are arranged along the extending direction, and each of the light emitting elements is disposed corresponding to at least a portion of the notch.

Another preferred embodiment of the present invention provides a light emitting device including a plurality of light emitting elements and a carrier. Each of the light emitting elements includes a transparent substrate, at least one light emitting diode chip, a first connecting electrode and a second connecting electrode. The transparent substrate has a bearing surface. The light emitting diode chip is disposed on the bearing surface and forms a first main surface that can emit light with a portion of the bearing surface not covered by the LED chip, and one of the light emitting diodes has an exit angle greater than 180 degrees. . At least part of the light emitted by the LED chip can penetrate the transparent substrate and emit light from one of the second main surfaces of the corresponding bearing surface. The first connection electrode and the second connection electrode are respectively disposed on opposite ends of the transparent substrate, and the first connection electrode and the second connection electrode are electrically connected to the LED substrate. The carrier includes a plurality of notches, and the plurality of notches are arranged in an array, and the light-emitting elements are disposed corresponding to at least a portion of the notches.

Another preferred embodiment of the present invention provides a device base for a light-emitting device, including a carrier and a plurality of brackets. Each of the brackets extends outwardly from the carrier, and each of the brackets includes at least one notch and a plurality of electrodes respectively disposed on both sides of the notch.

The illuminating device of the present invention fixes the illuminating diode chip on the transparent substrate, and the transparent substrate can allow the light emitted by the illuminating diode chip to penetrate. Therefore, the light-emitting device of the present invention can emit light at least in multiple directions or in all directions, improve luminous efficiency, and can improve the problem of poor light type of the conventional light-emitting diode.

1, 310‧‧‧Lighting elements

2‧‧‧Transparent substrate

3, 14‧‧‧Lighting diode chip

4‧‧‧ energy conversion layer

5, 26, 324‧‧‧ bearing seat

6‧‧‧ circuit board

7, 7'‧‧‧ lamp shell

8‧‧‧Mirror

9,25‧‧‧Drilling carbon film

10, 10', 11, 50, 301, 302, 303, 304‧‧‧ illuminating devices

12M‧‧‧ non-planar structure

16, 31A‧‧‧ first electrode

18, 31B‧‧‧ second electrode

20, 23A‧‧‧First connecting wire

21A‧‧‧ first major surface

21B‧‧‧Second major surface

22, 23B‧‧‧ second connecting wire

28‧‧‧ wafer bonding layer

28A‧‧‧First wafer bonding layer

28B‧‧‧Second wafer bonding layer

30, 32‧‧‧ electrodes

34‧‧‧Lighting surface

51‧‧‧ bracket

52‧‧‧Component junction

60‧‧‧Loading mechanism

61‧‧‧ slots

62‧‧‧ bracket

63‧‧‧Component junction

64‧‧‧Base

71‧‧‧ Cover

141‧‧‧Base

142‧‧‧N type semiconductor layer

143‧‧‧ active layer

144‧‧‧P type semiconductor layer

210‧‧‧ bearing surface

311A‧‧‧First connection electrode

311B‧‧‧Second connection electrode

321‧‧‧ bracket

322‧‧‧Device base

323‧‧‧Light strips

330‧‧‧ gap

342‧‧‧ Strip

350A‧‧‧First external electrode

350B‧‧‧Second external electrode

360‧‧‧ device framework

D‧‧‧Distance

G‧‧‧ gap

H‧‧‧ Hole

L‧‧‧Light

P‧‧‧ circuit pattern

S‧‧‧ Space

V+‧‧‧ drive voltage

V-‧‧‧ drive voltage

Θ1‧‧‧ first angle

X‧‧‧ extending direction

1A and 1B are schematic views showing the structure of a light-emitting element according to a preferred embodiment of the present invention.

2A, 2B, and 2C are schematic views showing the coupling of different forms of LED chips to a wire according to a preferred embodiment of the present invention.

3A and 3B are schematic views showing the arrangement of the energy conversion layer of a preferred embodiment of the present invention.

4A is a cross-sectional view showing a light-emitting element according to another preferred embodiment of the present invention.

FIG. 4B is a cross-sectional view showing a light emitting device according to another preferred embodiment of the present invention.

Fig. 5 is a schematic view showing a light-emitting element of another preferred embodiment of the present invention.

Figure 6A is a schematic view of a carrier of a preferred embodiment of the present invention.

FIG. 6B is a schematic view showing a circuit substrate according to a preferred embodiment of the present invention.

Figure 6C is a schematic view of a mirror of a preferred embodiment of the present invention.

Figure 6D is a schematic view showing a carbon-like carbon film according to a preferred embodiment of the present invention.

FIG. 7A is a schematic view of a light emitting device according to a preferred embodiment of the present invention.

FIG. 7B is a schematic diagram of a light emitting device according to another preferred embodiment of the present invention.

FIG. 8 is a schematic view showing the appearance of a light-emitting device according to another preferred embodiment of the present invention.

9A, 9B, and 9C are schematic views showing the transparent substrate being inserted or bonded to the carrier in a preferred embodiment of the present invention.

10A and 10B are schematic views showing a transparent substrate adhered to a carrier having a holder according to a preferred embodiment of the present invention.

11 is a perspective view of a light emitting device according to another preferred embodiment of the present invention.

Figure 12 is a perspective view showing the base of the device of the light-emitting device according to another preferred embodiment of the present invention.

Figure 13 is a perspective view showing a light-emitting device according to another preferred embodiment of the present invention.

14A, 14B, 14C, and 14D illustrate a top view of a transparent substrate arranged in a point-symmetric or line-symmetric manner on a carrier mechanism in accordance with a preferred embodiment of the present invention.

Figure 15 is a schematic view showing a light-emitting device according to another preferred embodiment of the present invention.

16A and 16B are schematic views of a lamp housing in accordance with a preferred embodiment of the present invention.

Figure 16C is a schematic cross-sectional view showing an advertising kanban lamp housing in accordance with a preferred embodiment of the present invention.

16D, 16E, 16F and 16G are schematic views showing the implementation of a bulb lamp according to a preferred embodiment of the present invention.

Figure 17 is a schematic view showing a light bar of another preferred embodiment of the present invention.

Figure 18 is a perspective view showing a light-emitting device according to another preferred embodiment of the present invention.

Figure 19 is a schematic view showing a light-emitting device according to another preferred embodiment of the present invention.

Please refer to FIG. 1A and FIG. 1B. FIG. 1A and FIG. 1B are schematic diagrams showing the structure of a light-emitting element or a light-emitting panel according to a preferred embodiment of the present invention. As shown in FIG. 1A and FIG. 1B, the light-emitting element 1 includes: a transparent substrate 2; a bearing surface 210; a first main surface 21A; a second main surface 21B; and at least one multi-directional light-emitting diode. Wafer 3. The transparent substrate 2 having a flat sheet shape itself has two main faces, one of which is a bearing surface 210, and the light emitting diode chip 3 having a light emitting function is disposed on the carrying surface 210, and A light-emitting surface 34 of the light-emitting diode chip 3 that is not shielded by the transparent substrate 2 forms a first main surface 21A that can emit light together with at least a portion of the load-bearing surface 210 on which the light-emitting diode chip 3 is not disposed. The other main surface of the transparent substrate 2 on which the light-emitting diode wafer 3 is not provided is the second main surface 21B. The foregoing arrangement may be reversed, and the LED body 3 may be disposed on both sides of the substrate, and the LEDs 3 on the two sides may be staggered correspondingly to make the LEDs on each surface When the bulk wafer 3 emits light, the light can smoothly penetrate the transparent substrate 2 and emit light from the other surface without being shielded by the light-emitting diode chip on the other surface, thereby increasing the luminous intensity per unit area. The transparent substrate 2 may be made of alumina (Al ₂ O ₃ ), alumina-containing sapphire, tantalum carbide (SiC), glass, plastic or rubber. One of the preferred embodiments of the present invention uses a sapphire substrate. Since the material is substantially a single crystal structure, not only has a good light transmittance, but also has a good heat dissipation capability, and the life of the light-emitting element 1 can be prolonged; however, the use of a conventional sapphire substrate may cause fragility in the present invention. The invention has been experimentally verified that the transparent substrate 2 of the present invention is preferably a sapphire substrate having a thickness of 200 μm or more, which can achieve better reliability and better carrying and light transmitting functions. At the same time, in order to effectively achieve the bidirectional or multi-directional or even omnidirectional light-emitting of the illuminating element 1, the illuminating diode chip 3 of the present invention preferably has a light-emitting angle greater than 180 degrees. Therefore, when the present invention is in use, the light-emitting diode chip 3 disposed on the transparent substrate 2 emits light at least away from the substrate, and the light-emitting diode chip 3 also emits at least part of the light. The light of the transparent substrate 2, and the light entering the transparent substrate 2 may be emitted from the second main surface 21B of the transparent substrate 2 corresponding to the first main surface 21A, or the light emitting diode chip 3 of the transparent substrate 2 may not be disposed. The partial bearing surface 210 emits light with other surfaces, so that the light-emitting element 1 can emit light at least on both sides, emit light in multiple directions, or emit light in all directions. In the present invention, the area of the first main surface 21A or the second main surface 21B is five times or more the total area of the light-emitting surface 34, which is a preferable arrangement ratio in consideration of conditions such as luminous efficiency and heat dissipation.

In addition, another preferred embodiment of the present invention is that the color temperature difference between the first main surface 21A and the second main surface 21B of the light-emitting element 1 is equal to or less than 1500K, so that the light-emitting element 1 Have a more comprehensive and consistent lighting effect. In the light transmission characteristic of the transparent substrate 2, when the wavelength range of the light emitted from the LED chip 3 is greater than or equal to 420 nm, and/or when the wavelength range of the light is less than or equal to 470 nm, the transparent Under the condition of the thickness of the substrate 2, the light transmittance of the transparent substrate 2 is greater than or equal to 70%.

The present invention is not limited to the above embodiments. Other preferred embodiments of the present invention will be described in the following, and in order to facilitate the comparison of the various embodiments and the simplification of the description, the same elements are denoted by the same symbols in the following embodiments, and mainly for each implementation. The differences between the examples are explained, and the repeated parts are not described again.

Referring to FIGS. 2A, 2B, and 2C, in order to obtain power for illumination, the LED 3 itself includes a first electrode 31A and a second electrode 31B, and the first electrode 31A and the second electrode 31B is electrically connected to the first connecting wire 23A and the second connecting wire 23B on the transparent substrate 2, respectively. Among them, FIGS. 2A, 2B, and 2C respectively disclose different forms of the LED chip 3 and the manner of coupling with the wires. 2A is a horizontal light emitting diode chip, wherein the light emitting diode chip 3 is formed on the bearing surface 210 of the transparent substrate 2, and the first electrode 31A and the second electrode 31B are electrically coupled by wire bonding. The first connecting wire 23A and the second connecting wire 23B; the second drawing is a flip-chip light emitting diode chip, and the light emitting diode chip 3 is inverted and the first electrode 31A and the second electrode 31B and the transparent substrate 2 are borrowed. The first electrode 31A and the second electrode 31B are electrically coupled to the first connecting wire 23A and the second connecting wire 23B respectively by soldering or bonding; the 2Cth drawing is for the LED 3 The first electrode 31A and the second electrode 31B are disposed at both ends, and the first electrode 31A and the second electrode 31B are respectively disposed in an upright manner with the first connecting wire 23A and the second connecting wire 23B. Connected.

Referring to FIGS. 3A and 3B, the light-emitting element 1 of the present invention may further include an energy. The conversion layer 4 is disposed on the first main surface 21A or/and the second main surface 21B, or is directly disposed on the LED 3, and is directly in contact with the LED 3, Or it is adjacent to the light-emitting diode chip 3 at a distance without direct contact. The energy conversion layer 4 contains at least one kind of phosphor powder, such as garnet, sulfate or citrate, inorganic or organic phosphor powder, for receiving and converting at least part of the LED chip 3 The wavelength of the light is another wavelength range. For example, when the light-emitting diode chip 3 emits blue light, the energy conversion layer 4 converts part of the blue light to yellow light, and causes the light-emitting element 1 to finally emit white light under the mixture of blue light and yellow light. In addition, since the light source of the first main surface 21A is mainly the light emitting surface of the light emitting diode chip 3, and the light source of the second main surface 21B is the light of the light emitting diode chip 3, the light emitted by the transparent substrate 2, two The light intensity of the surface of the light-emitting element 1 is correspondingly configured on the first main surface 21A and the second main surface 21B. The ratio of the proportion of the main surface 21A to the phosphor powder on the second main surface 21B (or the phosphor powder on the light-emitting diode wafer to the phosphor powder on the second main surface 21B) may preferably range from 1 to 0.5 to 1 to 3, the light intensity or light shape of the light-emitting element 1 can be adapted to the application requirements, and the difference in color temperature between the first main surface 21A and the second main surface 21B of the light-emitting element 1 is equal to or less than 1500K, and the light-emitting element is improved. 1 wavelength conversion efficiency and luminous effect.

Please refer to Figure 4A. Fig. 4A is a cross-sectional view showing a light-emitting element 1 according to another preferred embodiment of the present invention. As shown in FIG. 4A, the light-emitting element 10 of the present embodiment includes a transparent substrate 2 and at least one light-emitting diode wafer 14 that emits light in multiple directions. The transparent substrate 2 has a bearing surface 210 and a second main surface 21B disposed opposite to each other. The LED chip 14 is disposed on the bearing surface 210 of the transparent substrate 2, and the LED chip 14 includes a first electrode 16 and a second electrode 18 for external electrical connection. A light emitting surface 34 of the light emitting diode chip 14 that is not shielded by the transparent substrate 2 forms a first main surface 21A together with a portion of the bearing surface 210 that is not covered by the light emitting diode chip 14.

The LED wafer 14 can include a substrate 141, an N-type semiconductor layer 142, an active layer 143, and a P-type semiconductor layer 144. In the present embodiment, the substrate 141 of the LED wafer 14 can be adhered to the transparent substrate 2 by a die bonding layer 28. The wafer bonding layer 28 has a refractive index of the wafer bonding layer 28 preferably between the refractive index of the substrate 141 and the refractive index of the transparent substrate 2, in addition to the bonding of the LED wafer 14. Thereby, the amount of light can be increased. Additionally, the die attach layer 28 can be a clear adhesive or other suitable bonding material. The first electrode 16 and the second electrode 18 are disposed on the other side of the LED array 14 opposite to the wafer bonding layer 28, and are electrically connected to the P-type semiconductor layer 144 and the N-type semiconductor layer 142, respectively. The connection relationship between the electrode 18 and the N-type semiconductor layer 142). The upper surface of the first electrode 16 and the second electrode 18 are at the same horizontal position and may be metal electrodes, but not limited thereto. In addition, the light-emitting element 1 further includes a first connecting wire 20, a second connecting wire 22, and an energy conversion layer 4. The first connecting wire 20 and the second connecting wire 22 are disposed on the transparent substrate 2. The first connecting wire 20 and the second connecting wire 22 may be, for example, metal connecting wires or other conductive patterns, but not limited thereto. The first electrode 16 and the second electrode 18 are respectively electrically connected to the first connecting wire 20 and the second connecting wire 22, and the connection manner can be by wire bonding or welding, but not limited thereto. The energy conversion layer 4 is disposed on the transparent substrate 12 and can cover the LED array 14 . Further, the energy conversion layer 4 can be further disposed and covered the second main surface 21B of the transparent substrate 2.

In addition, in order to increase the amount of light emitted from the transparent substrate 2 and to distribute the light distribution uniformly, the first main surface 21A and the second main surface 21B of the transparent substrate 2 may selectively have a non-planar structure 12M, respectively. The non-planar structure 12M may be a variety of convex or concave geometric structures, such as pyramids, cones, hemispheres, or triangular columns, and the arrangement of the non-planar structures 12M may be a regular arrangement or a random arrangement. Furthermore, a first diamond-like carbon (DLC) film 25 is selectively disposed on the first main surface 21A and the second main surface 21B for increasing heat conduction and heat dissipation.

Please refer to Figure 4B. FIG. 4B is a cross-sectional view showing a light emitting device according to another preferred embodiment of the present invention. In the light-emitting element 1 of the present embodiment, the first electrode 16 and the second electrode 18 are disposed on the same surface of the LED array 14 as the first wafer bonding layer 28A. And electrically connected to the first connecting wire 20 and the second connecting wire 22 respectively by a flip chip. The first connecting wire 20 and the second connecting wire 22 may extend below the first electrode 16 and the second electrode 18, respectively, and the first electrode 16 and the second electrode 18 may be respectively connected by a second wafer bonding layer 28B. The first connecting wire 20 is electrically connected to the second connecting wire 22 . The second wafer bonding layer 28B may be a conductive bump such as a gold bump or a solder bump, a conductive glue such as a silver paste, or a eutectic layer. For example, a gold-tin (Au-Sn) alloy eutectic layer or an indium-bismuth-tin alloy (In-Bi-Sn alloy) eutectic layer, but not limited thereto. In the case where the second wafer bonding layer 28B is used, the first wafer bonding layer 28A under the LED array 14 such as a transparent paste may be omitted or replaced by the energy conversion layer 4.

Please refer to FIG. 5. FIG. 5 is a perspective view of a light-emitting element according to another preferred embodiment of the present invention. As shown in FIG. 5, the light-emitting element 310 of the present invention comprises a transparent substrate 2, at least one light-emitting diode chip 3, a first connection electrode 311A, a second connection electrode 311B and at least one energy conversion layer 4. The light-emitting diode chip 3 is disposed on the bearing surface 210 of the transparent substrate 2 to form one of the first main surfaces 21A. In this embodiment, one of the light-emitting diode chips 3 has a light-emitting angle greater than 180 degrees, and at least part of the light emitted by the light-emitting diode chip 3 is incident on the transparent substrate 2, and the incident light is at least partially corresponding. The second main surface 21B of one of the first main surfaces 21A emits light, and partially emits light from other surfaces of the transparent substrate 2, thereby achieving a luminous effect of six-sided illumination. The first connecting electrode 311A and the second connecting electrode 311B are respectively disposed on the two ends or the same side (not shown) of the transparent substrate 2, and are respectively a first connecting wire and a second connecting wire on the transparent substrate 2. Since the extended element is the outer electrode, the first connection electrode 311A and the second connection electrode 311B are electrically connected to the light-emitting diode wafer 3, respectively. The energy conversion layer 4 is at least covered with the light emitting diode The wafer 3 exposes at least a portion of the first connection electrode 311A and the second connection electrode 311B, wherein the energy conversion layer 4 at least partially absorbs the light emitted by the LED chip 3 and/or the transparent substrate 2 and converts it into another wavelength. The light of the range is then mixed with the unabsorbed light to increase the range of illumination wavelength and the illumination effect of the light-emitting element 310. Since the light-emitting element 310 of the present embodiment has the first connection electrode 311A and the second connection electrode 311B respectively disposed at opposite ends of the transparent substrate 2, the light-emitting element 310 can be fabricated by itself and then combined with a suitable carrier. Therefore, it is possible to improve the overall manufacturing yield, simplify the structure, and increase the design change of the mated seat.

Referring to FIG. 6A, an embodiment of the present invention uses a light-emitting device 11 of the foregoing light-emitting element, wherein the light-emitting device 11 further includes a carrier 5 on which the transparent substrate 2 of the light-emitting element can be erected and coupled. There is a first angle θ1 between the transparent substrate 2 and the carrier 5, and the angle of the first angle θ1 can be fixed or mobilized according to the light shape of the light-emitting device, wherein the first embodiment of the preferred embodiment The angle θ1 angle range is between 30 degrees and 150 degrees.

Referring to FIG. 6B, the carrier 5 of the illuminating device 11 of the present invention may further include a circuit substrate 6 coupled to an external power source, and electrically coupled to the first connecting wire and the second connecting wire on the transparent substrate 2. (not shown), and electrically connected to the light-emitting diode chip 3, the external power source supplies the power source required for the light-emitting diode chip 3 to emit light through the circuit substrate. If the circuit board 6 is not provided, the LED chip 3 can be directly connected to the carrier 5 through the first connecting wire and the second connecting wire (not shown), so that the external power source can be connected via the carrier 5 The light emitting diode chip 3 is powered.

Referring to FIG. 6C, the illuminating device 11 of the present invention may further include a mirror 8 disposed on the second main surface 21B, the mirror 8 reflecting the at least partial penetration of the illuminating diode 3 through the transparent substrate. The light of 2 causes the light to be at least partially emitted by the first major surface 21A. The mirror 8 may include at least one metal layer or a Bragg reflector. But not limited to this. The Bragg mirror may be formed by stacking a plurality of dielectric films having different refractive indices, or by stacking a plurality of dielectric films having different refractive indices and a plurality of metal oxides.

Referring to FIG. 6D, the transparent substrate 2 of the light-emitting device 11 of the present invention may further include a diamond-like carbon (DLC) film 9 disposed on the bearing surface 210 of the transparent substrate 2. And / or the second main surface 21B to increase heat conduction and heat dissipation.

Please refer to Figure 7A. FIG. 7A is a schematic view of a light emitting device according to a preferred embodiment of the present invention. As shown in FIG. 7A, the light-emitting device 10 of the present embodiment includes a light-emitting element and a carrier 26 as described in the previous embodiments, wherein the light-emitting element includes a transparent substrate 2 and at least one light-emitting diode wafer 14. The light-emitting elements are embedded in the carrier 26, and are electrically connected to the electrodes 30 and 32 of the carrier through the connecting wires 20 and 22 respectively, so that a power source can drive the driving voltages V+, V- through the electrodes 30 and 32 to drive. The light emitting diode chip 14 emits light L. The light-emitting diode chip 14 includes a first electrode 16 and a second electrode 18 electrically connected to the first connecting wire 20 and the second connecting wire 22 by wire bonding, but is not limited thereto. In addition, the light beam L emitted by the LED chip 14 has an exit angle greater than 180 degrees or has a plurality of light emitting surfaces, so that the light emitting direction of the light emitting element includes light from the first main surface 21A and the second main surface 21B, and part of the light is emitted. It is also emitted from the four side walls of the light-emitting diode wafer 14 and/or the transparent substrate 2, so that the light-emitting diode wafer 10 has six-sided light emission or omnidirectional light-emitting characteristics.

The light emitting element may further include an energy conversion layer 4 disposed on the light emitting diode wafer 14, the first main surface 21A or the second main surface 21B. The energy conversion layer 4 can convert the light emitted by at least part of the LEDs 14 into light of another wavelength range, so that the LEDs 10 emit light of a specific light color or a wide wavelength range, such as a light emitting diode. Part of the blue light generated by the bulk wafer 14 can be converted into yellow light after being irradiated to the energy conversion layer 4, and the light emitting diode wafer 10 can be emitted. White light mixed with blue light and yellow light. In addition, the transparent substrate 2 can be directly or indirectly fixed to the carrier 26 in a non-parallel manner and/or in a parallel manner. For example, the side wall of the transparent substrate 2 is fixed on the carrier 26 in a vertical manner, or the transparent substrate 2 is placed on the carrier 26, but not limited thereto. Since the transparent substrate 2 selects a material having good heat conduction characteristics, the heat energy generated by the LED chip 14 can be quickly transmitted to the carrier 26 through the transparent substrate 12 for heat dissipation, so that the light-emitting device of the present invention can use high power. The light-emitting diode chip, but the light-emitting device of the preferred embodiment is disposed on the substrate 12 under the same power condition, and a plurality of smaller-power LED chips are used to fully utilize the heat conduction characteristics of the substrate 12, such as The power of the LED chip of this embodiment may be less than, for example, 0.2 watts, but is not limited thereto.

Please refer to Figure 7B. FIG. 7B is a schematic diagram showing the appearance of a light-emitting device according to another preferred embodiment of the present invention. In contrast to Fig. 7A, the light emitting device 10' includes a plurality of light emitting diode chips 14, and at least a portion of the light emitting diode chips 14 are electrically connected to each other in series. Each of the LED chips 14 includes a first electrode 16 and a second electrode 18, and the first electrode 16 of the LED chip 14 at the head end of the series is electrically connected to the first connecting wire 20, and the tail The second electrode 18 of the other LED chip 14 is electrically connected to the second connecting wire 22, but not limited thereto. The LED chip 14 can also be electrically connected in parallel or in series and parallel. The LED array 14 of the present embodiment may be selected from a light emitting diode wafer emitting the same color light, such as a blue light emitting diode wafer, or a light emitting diode chip combining different color lights according to application requirements. The use of the energy conversion layer 4 in this case further increases the elasticity of the various light colors emitted by the light-emitting device 10'.

Please refer to Figure 8. FIG. 8 is a schematic view showing the appearance of a light-emitting device according to another preferred embodiment of the present invention. The light-emitting device 50 of the present embodiment further includes a bracket 51 for connecting the light-emitting element and the carrier 26, wherein the transparent substrate 2 of the light-emitting component is fixed to the bracket 51 by a component bonding layer 52. One side, and the other side of the bracket 51 can be embedded on the carrier 26. In addition, the bracket 51 is elastically adjustable to make the angle between the LED wafer 10 and the carrier 26 Between 30 degrees and 150 degrees. The material of the bracket 51 may include a composite metal material, a copper wire, a wire, or other suitable material.

Referring to FIG. 9A, FIG. 9B and FIG. 9C, when the transparent substrate 2 of the present invention is disposed on the carrier 5, one of the preferred embodiments can be achieved by plugging or bonding. The joint of the two.

As shown in FIG. 9A, when the transparent substrate 2 is disposed on the carrier 5, it is inserted into the single-hole slot 61 of the carrier 5, and the LED component is transmitted through the connecting wire and the slot. 61 electrical coupling. At this time, the light-emitting diode chip (not shown) on the transparent substrate 2 is coupled to the power supply of the carrier 5, so that the circuit pattern or the connecting wire is concentrated to the edge of the transparent substrate 2 and integrated into a plurality of conductive contacts. The gold finger structure of the sheet or the connection electrodes 311A and 311B, that is, the electrical connection port. The slot 61 allows the transparent substrate 2 to be inserted, so that the light-emitting diode chip (not shown) is also provided with the power supply of the carrier 5, and the transparent substrate 2 is also fixed to the slot 61 of the carrier 5.

Next, please refer to FIG. 9B , which is a schematic structural view of the porous slot on the carrier 5 through the transparent substrate 2 . At this time, the transparent substrate 2 has at least one double pin structure, one of which is a positive electrode of the element, and the other is a negative electrode of the element, and both have a conductive contact as a connection port. Correspondingly, the carrier 5 has at least two slots 61 corresponding to the size of the pin insertion surface, so that the transparent substrate 2 can be smoothly engaged with the carrier 5 and the light-emitting diode wafer can be powered.

Referring to FIG. 9C, the component bonding layer bonds the transparent substrate 2 to the carrier 5 in an adhesive manner. In the process of bonding, it can be joined by soldering with gold, tin, indium, antimony, silver, etc., or by using a conductive silicone or epoxy resin to fix the transparent substrate 2, so that the light-emitting element is The conductive pattern or the connecting wire is electrically connected to the electrode on the carrier by the component bonding layer Pick up.

Referring to FIG. 10A and FIG. 10B , the main assembly of the illuminating device 11 of the present embodiment is the same as that of the previous embodiment, wherein the carrier 5 is a metal substrate such as a bendable composite aluminum-containing material, copper wire or wire. . The surface or side of the carrier 5 has at least one bracket 62 which is a mechanical member that is separate or integrated with the carrier 5. The light-emitting component is coupled to the bracket 62 by means of bonding, that is, the transparent substrate 2 is fixed to the carrier 5 by the component bonding layer 63, and is maintained first with the surface of the portion of the carrier 5 without the bracket. The angle θ1 and the surface of the portion of the carrier 5 without the bracket may also be provided with the light emitting effect of the light emitting diode wafer to enhance the light emitting device 11; in addition, the light emitting element may also be connected to the bracket 62 by means of plugging (not shown). That is, the transparent substrate 2 is fixed to the carrier 5 by the connector bonding component and the bracket and/or the bracket and the carrier. Since the carrier 5 and the bracket 62 are bendable, the flexibility in application is increased, and since a plurality of light-emitting elements can be used, the light-emitting device 11 can be colored by the combination of light-emitting elements of different light colors. Sex to meet different needs.

Please refer to Figure 11. As shown in FIG. 11 , the light-emitting device of the present embodiment includes at least one light-emitting element 1 and a carrier 5 , wherein the carrier 5 includes at least one bracket 62 and at least one circuit pattern P. The main component of the light-emitting element 1 is as described in the previous embodiment, and is coupled to the bracket 62 at one end of the transparent substrate to avoid or reduce the shielding effect of the bracket 62 on the light emitted from the light-emitting element 1. The carrier 5 is composed of a composite aluminum metal substrate, a copper wire or a wire, and the bracket 62 is formed by cutting and bending one portion of the carrier 5 (such as the first angle θ1 of the above 10A and 10B). . The circuit pattern P is disposed on the carrier 5 and has at least one set of electrical terminals electrically connected to a power source, and a portion extending to the bracket 62 to be electrically connected to the light emitting element 1 to enable the light emitting element 1 to be permeable. The circuit pattern P of the socket 5 is electrically connected to the power source. In addition, the carrier 5 can further include at least one hole H or at least one notch G, so that a fixing member such as a screw, a nail or a pin can pass through the hole H or the notch G to make the carrier 5 and other components according to the application of the illuminating device. Further construction or safety At the same time, the hole H or the gap G also increases the heat dissipation area of the carrier 5, thereby improving the heat dissipation effect of the light-emitting device.

Please refer to Figure 12. Figure 12 is a perspective view showing the base of the device of the light-emitting device according to another preferred embodiment of the present invention. As shown in FIG. 12, the device base 322 of the present embodiment includes a carrier 5 and at least one bracket 62. Compared with the embodiment of FIG. 11, the bracket 62 of the embodiment further includes at least one strip 342 and A notch 330, wherein the electrodes 30, 32 are respectively disposed on both sides of the notch 330, and the strip portion 342 constitutes at least one side wall of the notch 330. A light-emitting component is coupled to the bracket 62 corresponding to the notch 330, and the connecting wire of the light-emitting component is electrically connected to the electrodes 30 and 32, so that the light-emitting component can pass through the bracket 62 and the circuit pattern on the carrier and a power source. Electrically coupled to be driven. The size of the notch 330 needs to be not less than one of the main light-emitting surfaces of the light-emitting element, so that the light emitted from the light-emitting element in the direction of the bracket 62 is not blocked by the bracket 62. The connection between the bracket 62 and the carrier 5 can be a movable design so that the angle between the bracket 62 and the carrier 5 can be adjusted as needed.

Please refer to Figure 12 and Figure 13. Figure 13 is a perspective view showing a light-emitting device according to another preferred embodiment of the present invention. The light-emitting device 302 shown in FIG. 13 further includes at least one bracket 62 having a plurality of notches 330, wherein the plurality of notches 330 are respectively disposed on corresponding sides of the bracket 62 to make strips. The portion 342 at least simultaneously forms a side wall of the plurality of notches 330. A plurality of light-emitting elements 310 are disposed corresponding to the plurality of notches 330, and a circuit pattern or a connection electrode (not shown) of each of the light-emitting elements 310 is electrically connected to the electrodes 30 and 32, respectively. The illuminating device 302 of the present embodiment may further include a plurality of brackets 62. The angle between the brackets 62 each provided with the illuminating elements 310 and the carrier 5 may be adjusted separately, in other words, at least a portion of the bracket 62 and the carrier. The angles between 5 can be different from each other to achieve the desired illuminating effect, but are not limited thereto. In addition, the combination of the light-emitting elements of different illumination wavelength ranges can be set in the same bracket or different brackets, so that the color effect of the illumination device is more abundant.

In order to improve the brightness and improve the illuminating effect, the illuminating device of another embodiment of the present invention simultaneously arranges the illuminating elements formed by the plurality of transparent substrates on the carrier or other supporting mechanism such as the foregoing embodiment. Arranged in a symmetrical or asymmetrical arrangement, the preferred symmetrical arrangement is to arrange the light-emitting elements formed by the plurality of transparent substrates on the support mechanism in a point symmetrical or line symmetrical manner. Referring to FIG. 14A, FIG. 14B, FIG. 14C and FIG. 14D, the illuminating device of each embodiment is provided with a plurality of illuminating elements on various different shapes of the supporting mechanism 60, and is arranged in point symmetry or line symmetry. The light emitted from the overall light-emitting device 11 can be uniform (the light-emitting diode wafer is omitted), and the light-emitting effect of the light-emitting devices 11 can be further adjusted and improved by changing the size of the first angle. As shown in Fig. 14A, the light-emitting elements are angled at a 90-degree angle in a point-symmetric manner. At this time, at least two light-emitting elements are viewed from the light-emitting device on either side of the light-emitting device; the light-emitting device shown in Fig. 14B The angle between the light-emitting elements of the device is less than 90 degrees; the angle between the light-emitting elements of the light-emitting device shown in Fig. 14D is greater than 90 degrees. In another embodiment, the plurality of light emitting elements are at least partially concentrated or dispersed in an asymmetric arrangement to achieve a light shape requirement (not shown) of the light emitting device in different applications.

Please refer to Figure 15. Figure 15 is a cross-sectional view showing a light-emitting device according to another preferred embodiment of the present invention. As shown in FIG. 15, the light-emitting device 301 includes a light-emitting element 310 and a bracket 321. The bracket 321 includes a notch 330, and the light-emitting element 310 is disposed corresponding to the notch 330. The lower portion of the bracket 321 of the embodiment can also be used as a pin or bent into a pad for surface soldering for fixing or/and electrically connecting to other required components such as a carrier. Since one of the light-emitting elements 310 is disposed in the notch 330, the light-emitting device 301 can maintain the luminous effect of the six-sided illumination regardless of whether the holder 321 is a light-transmitting material.

Please refer to FIG. 16A, which is a light-emitting device according to one embodiment of the present invention. The light-emitting device includes a long tubular lamp housing 7, at least one light-emitting element 1 and a supporting mechanism 60 thereof. The light element 1 is disposed on the carrier mechanism 60 and at least partially located in the space formed by the long tubular lamp housing 7. Referring to FIG. 16B, when two or more light-emitting elements 1 are disposed in the lamp housing 7, the first main surfaces 21A of the light-emitting elements 1 are arranged in a manner that is not parallel to each other. In addition, the light-emitting element 1 is at least partially disposed in the space formed by the lamp housing 7 and does not abut against the inner wall of the lamp housing 7. In a preferred embodiment, the light-emitting element 1 and the lamp housing 7 are larger than 500 micrometers (μm). The distance D; however, it is also possible to form the lamp envelope 7 by means of potting, and to at least partially cover the lamp envelope 7 and directly contact the light-emitting element 1.

Referring to FIG. 16C, a light emitting device according to another embodiment of the present invention, wherein the lamp housing 7 of the light emitting device has at least one cover 71, which may be a printed surface or other backlight. The display device further forms a backlight of the cover 71 by the illumination provided by the first main surface 21A and the second main surface 21B of the light-emitting element 1 of the present invention, wherein the second angle formed between the light-emitting element 1 and the cover 71 The angular range is between 0 and 45 degrees (the second angle is 0 degrees in the figure, so it is not shown). In order to ensure that the light generated by the light-emitting element or the light-emitting plate/light-emitting sheet combined by the transparent substrate and the multi-directional light-emitting diode chip can penetrate the lamp housing 7 more uniformly, the light-emitting element 1 is at least partially placed in the lamp housing 7 In the space formed, and substantially not close to the inner wall of the lamp housing 7, a preferred embodiment has a distance D between the light-emitting element 1 and the lamp housing 7 of more than 500 micrometers; The lamp housing 7 is formed in a manner such that the lamp housing 7 is at least partially covered and directly in contact with the transparent substrate 2.

Please refer to FIG. 16D, FIG. 16E, FIG. 16F and FIG. 16G, which are another series of specific embodiments of the present invention. The light-emitting device further includes a spherical lamp housing 7 and a base 64. In the 16D, the light-emitting device of the present embodiment further includes a spherical lamp housing 7 and a carrier 5 further disposed on a base 64. The base 64 can be a conventional bulb base. The lamp housing 7 can be coupled to the base 64 to cover the light-emitting component and the carrier 5 , and the lamp housing 7 can be directly coupled to the carrier 5 to cover the light-emitting component. The base 64 can be in the form of a flat The table or another bearing protrusion, as shown in Figure 16E. In Fig. 16F, the inner side of the lamp envelope 7 is coated with an energy conversion layer 4, so that at least part of the light generated by the light-emitting diode wafer 3 is converted into light of another wavelength range before leaving the lamp envelope 7. . In Fig. 16G, the design of the double-layered lamp housing 7 and the lamp housing 7' is disclosed, and a space S is formed between the lamp housing 7 and the lamp housing 7', using the lamp housing 7, the lamp housing 7', and The space S between the two allows the illuminating device to make further changes in the pattern and color.

Please refer to FIG. 17 and FIG. 18, FIG. 17 is a schematic diagram of a light bar according to another preferred embodiment of the present invention, and FIG. 18 is a view showing a light-emitting device according to another preferred embodiment of the present invention. Stereoscopic view. As shown in FIG. 17, the light bar 323 of the present embodiment includes a plurality of notches 330. The light bar 323 has an extending direction X, and the notches 330 are arranged in the extending direction X. A plurality of multi-directional light-emitting elements are disposed corresponding to the notches 330 of the light bar 323 to form a light-emitting strip, but are not limited thereto. In addition, the light bar 323 may further include a plurality of electrodes 30 of different electrical properties, electrodes 32, a first outer electrode 350A, and a second outer electrode 350B. The electrode 30 and the electrode 32 are respectively disposed on both sides of each of the notches 330. The first outer electrode 350A and the second outer electrode 350B are electrically connected to the respective electrodes 30 and the electrodes 32 and disposed on both sides of the light bar 323. As shown in Fig. 18, the light-emitting device 303 may include the light bar 323 of the foregoing embodiment and a device frame 360. The light bar 323 provided with the light-emitting element 310 can be disposed in the device frame 360 in a vertical, horizontal or oblique manner as needed. The light bar 323 can be connected to the first outer electrode 350A and the second outer side on both sides. The electrode 350B is electrically connected to a power source through the device frame 360, but is not limited thereto. In addition, the light-emitting device 303 can also be equipped with a suitable optical film such as a diffusion film to adjust the light-emitting effect formed by the light-emitting elements 310 in the device frame 360.

Please refer to FIG. 19, which shows a schematic diagram of a light emitting device according to another preferred embodiment of the present invention. As shown in FIG. 19, the light-emitting device 304 includes a plurality of light-emitting elements 310 and a carrier 324. The carrier 324 includes a plurality of notches 330, and the notches 330 are arranged in an array. The columns are arranged, and each of the light-emitting elements 310 is disposed corresponding to the notch 330. The connection manner of each of the light-emitting elements 310 of the present embodiment in the notch 330 is similar to that of the above embodiment, and thus will not be described herein. It should be noted that the carrier 324 may further include a first external electrode 350A and a second external electrode 350B for electrically connecting with other external components. In addition, the illuminating device 304 of the present embodiment can be used for an advertising kanban or a direct type backlight module, and the carrier 324 preferably has a light transmitting property, but is not limited thereto.

In summary, the light-emitting element of the present invention uses a transparent substrate and a light-emitting diode wafer having an exit angle of more than 180 degrees, thereby having the effect of six-sided illumination or omnidirectional illumination, and improving luminous efficiency and improving conventional illumination. The problem of poor light quality of the light-emitting elements of the polar body. In addition, the transparent substrate selects a material having good heat conduction characteristics, whereby the thermal energy generated by the light-emitting diode wafer can be quickly dissipated through the transparent substrate.

In addition, in the structure of the light-emitting element disclosed in the present invention, the light-emitting element or the light-emitting board/light-emitting sheet formed by disposing the light-emitting diode wafer on the transparent substrate can be effectively and fully utilized; and The main surface direction can be lighted out, so that the maximum light output efficiency can be obtained under the minimum power supply, and the light output effect is uniform, and the light can be exhibited in the fields of bulbs, lamps, billboards, and the like. The effect of good effect, low power consumption and uniform light output is an economical and practical value of light-emitting components.

2‧‧‧Transparent substrate

4‧‧‧ energy conversion layer

10‧‧‧Lighting device

14‧‧‧Light Emitting Diode Wafer

16‧‧‧First electrode

18‧‧‧second electrode

20‧‧‧First connecting wire

21A‧‧‧ first major surface

21B‧‧‧Second major surface

22‧‧‧Second connecting wire

26‧‧‧Hosting

30‧‧‧Electrode

32‧‧‧ electrodes

210‧‧‧ bearing surface

L‧‧‧Light

V+‧‧‧ drive voltage

V-‧‧‧ drive voltage

Claims (30)

A light-emitting element comprising: a transparent substrate having a bearing surface and a second main surface disposed opposite to each other; and a plurality of light-emitting diode chips, at least part of the light-emitting diode chips being disposed on the bearing surface And the portion of the carrier surface that is not provided with the light-emitting diode chip forms a first main surface that can emit light, wherein each of the light-emitting diode chips includes a first electrode and a second electrode; wherein the light-emitting The direction of illumination of at least one of the light emitting diode chips in the diode wafer includes passing through the transparent substrate and emitting light from the second major surface. The light-emitting element of claim 1, further comprising at least one energy conversion layer disposed on the light-emitting diode wafer, the first main surface or the second main surface, the energy conversion layer being at least partially absorbed The light emitted by the light-emitting diode wafers is converted into light of different wavelength ranges. The light-emitting element according to claim 2, wherein the energy conversion layer is disposed on the first main surface and the second main surface, and the ratio of the phosphor powder contained in the energy conversion layer at the different positions is 1 ratio 0.5 to 1 to 3. The light-emitting element of claim 1, wherein the power of each of the light-emitting diode chips is less than 0.2 watts. The light-emitting element according to claim 1, wherein the material of the transparent substrate is selected from the group consisting of alumina (Al ₂ O ₃ ), alumina-containing sapphire, tantalum carbide (SiC), glass, plastic or rubber. One of the groups. The illuminating element of claim 1, wherein the second major surface has a non-planar structure. The light-emitting element of claim 1, further comprising a diamond-like carbon film disposed on the bearing surface or the second major surface. The illuminating element of claim 7, further comprising an optical film disposed between the transparent substrate and the diamond-like carbon film. The light-emitting element according to claim 1, wherein at least one of the light-emitting diode chips has an exit angle of more than 180 degrees. The light-emitting element of claim 1, wherein the transparent substrate material is sapphire and the thickness is greater than or equal to 200 micrometers. The illuminating device of claim 1, wherein the first electrode and the second electrode are electrically connected to a first connecting wire and a second connecting wire on the transparent substrate, respectively. The illuminating element of claim 1, wherein a difference in color temperature of light emitted by the first major surface and the second major surface is equal to or less than 1500K. The light-emitting element of claim 1, wherein the transparent substrate has a light transmittance of greater than or equal to 70% for light having a wavelength range greater than or equal to 420 nm or less than or equal to 470 nm. The illuminating device of claim 1, wherein each of the illuminating diode chips has a illuminating surface, and the area of the first main surface or the second main surface is the illuminating of the illuminating diode chips. The total area of the noodles is more than 5 times. The illuminating element of claim 2, wherein the energy conversion layer is disposed on the illuminating diode The ratio of the phosphor powder contained in the energy conversion layer at the different positions of the wafer and the second main surface is 1 to 0.5 to 1 to 3. The illuminating element of claim 1, further comprising a mirror disposed on the second major surface. The illuminating element of claim 1, wherein at least a portion of the illuminating diode chips are disposed on the second main surface, and the carrying surface and the illuminating diode chips on the second main surface are Corresponding to staggered arrangement. A light-emitting device comprising at least one light-emitting element according to claim 1, and a carrier; wherein the light-emitting element is disposed on the carrier. The illuminating device of claim 18, wherein the illuminating element has a first angle with the carrier, and the first included angle ranges from 30 degrees to 150 degrees. The illuminating device of claim 18, further comprising a bracket coupled to the carrier, wherein the illuminating component is fixed to the bracket and electrically coupled to a power source through the bracket. The illuminating device of claim 20, wherein the bracket is bendable such that the first angle is between the illuminating element and the cradle. The illuminating device of claim 18, further comprising a plurality of the illuminating elements, and at least some of the illuminating elements are disposed on the carrier in a point symmetrical or line symmetrical manner. The illuminating device of claim 22, further comprising a plurality of brackets, and at least some of the illuminating elements are respectively disposed on the brackets. The illuminating device of claim 23, wherein an angle of the angle between at least a portion of the brackets and the carrier is different. The illuminating device of claim 20, wherein the bracket has at least one notch, and the illuminating member is fixed to the bracket corresponding to the notch. The illuminating device of claim 20, wherein the bracket is integral with the carrier. The illuminating device of claim 20, wherein the material of the bracket is selected from the group consisting of a composite metal material, a copper wire or a wire. The light-emitting device of claim 18, wherein the carrier comprises at least one notch or hole. The illuminating device of claim 18, further comprising a plurality of the illuminating elements and a bracket, the bracket being coupled to the cradle, wherein the bracket comprises a plurality of notch staggered arrangements, and at least some of the illuminating elements are paired The gaps are fixed to the bracket and electrically coupled to a power source through the bracket. A illuminating device comprising at least one illuminating element as claimed in claim 1 and a bracket; wherein the illuminating element is disposed on the bracket and electrically coupled to a power source through the bracket.