TWI389345B - Light emitting device - Google Patents

Description

Illuminating device

The present invention relates to a light-emitting device including a light-emitting element such as a light-emitting diode.

In recent years, development of a light-emitting device including a light-emitting element such as a light-emitting diode has been carried out. In the mounting structure of the light-emitting element, there is a mounting structure using a structure in which a flip chip is connected. In such an attachment structure, the light-emitting element includes a mounting surface including the first electrode and the second electrode. The first electrode and the second electrode are electrically connected to the conductor pattern via a conductive bonding material. In the future, the light-emitting device is required to further improve the light-emitting characteristics, for example, in the field of illumination. Among the light-emitting characteristics that are required to be improved, for example, a light output or the like is included. In order to increase the light output, it is necessary to improve the positional accuracy of mounting of the light-emitting element.

According to an aspect of the invention, a light-emitting device includes a light-emitting element, a first conductor pattern, and a second conductor pattern. The light-emitting element includes a mounting surface including the first electrode and the second electrode. The first conductive pattern is electrically connected to the first electrode via the first conductive bonding material, and has a first forming direction. The first conductor pattern is included in the mounting region of the light emitting element. The second conductor pattern is electrically connected to the second electrode via the second conductive bonding material, and has a second forming direction. The second forming direction is a direction opposite to the first forming direction. The second conductor pattern is included in the mounting region of the light emitting element.

According to another aspect of the present invention, a light emitting device includes a light emitting element, 1 conductor pattern and second conductor pattern. The light-emitting element includes a mounting surface including the first electrode and the second electrode. The first conductive pattern is electrically connected to the first electrode via the first conductive bonding material, and has a first forming direction. The first conductor pattern is included in the mounting region of the light emitting element. The second conductor pattern is electrically connected to the second electrode via the second conductive bonding material, and has a second forming direction. The second forming direction is a direction intersecting the first forming direction. The second conductor pattern is included in the mounting region of the light emitting element.

With the above configuration, the light-emitting device can improve the positional accuracy of mounting of the light-emitting element. Therefore, the light-emitting device can improve the light-emitting characteristics such as light output.

In the following, several illustrative embodiments are illustrated.

As shown in FIGS. 1 and 2, a light-emitting device 10 according to an embodiment of the present invention includes a light-emitting element 110, a substrate 120, and a reflection member 130. The light emitting device 10 further includes an encapsulation layer 140 and a light emitting member 150. In FIG. 2, the internal structure is shown, and the light-emitting device 10 is shown in a partially omitted state.

The light emitting element 110 contains a semiconductor material. An exemplary light emitting element 110 is a light emitting diode. The light-emitting element 110 emits the first light in accordance with the driving power. The light emitting element 110 is mounted on an imaginary xy plane. As shown in FIG. 3, the light-emitting element 110 includes a substrate 111, an n-type semiconductor layer 112, a semiconductor active layer 113, and a p-type semiconductor layer 114. The light emitting element 110 further includes a light-transmitting conductive layer 115, a first electrode 116, and a second electrode 117.

An exemplary material for the substrate 111 is sapphire. The n-type semiconductor layer 112 is laminated on the substrate 111. The lamination direction of the light-emitting element 110 is above the top of FIG. to. That is, the stacking direction is the negative direction of the imaginary z-axis. The semiconductor active layer 113 is laminated on the n-type semiconductor layer 112. The p-type semiconductor layer 114 is laminated on the semiconductor active layer 113.

The light-transmitting conductive layer 115 is formed on the p-type semiconductor layer 114. The "transparency" of the conductive layer 115 means at least a portion of the light that can be transmitted through the semiconductor active layer 113. The first electrode 116 is formed on the light-transmitting conductive layer 115. The first electrode 116 is an anode electrode of the light-emitting element 110. The second electrode 117 is formed on the n-type semiconductor layer 112. The second electrode 117 is a cathode electrode of the light-emitting element 110.

The light-emitting element 110 includes a mounting surface 118 including a first electrode 116 and a second electrode 117. The term "mounting surface" means the surface facing the base 120. In Fig. 3, the light-emitting element 110 is mounted on an imaginary xy plane.

As shown in FIG. 4, the base 120 includes a first layer 121 and a second layer 122. In FIG. 4, in order to show the internal structure, the base 120 is exploded. The first layer 121 includes a first embedding pattern 123 and a second embedding pattern 124. The term "buried" means that the pattern 123 and the pattern 124 are located inside the substrate 120 including the first layer 121 and the second layer 122.

The second layer 122 is laminated on the first layer 121. As shown in FIG. 5, the second layer 122 includes a mounting region 125 of the light emitting element 110. The term "mounting area" means an area directly under the light-emitting element 110. That is, the mounting region refers to a region overlapping the light-emitting element 110 in plan view. The term "planar view", in Fig. 5, refers to the field of view indicated by symbol 160.

The second layer 122 includes the first conductor pattern 126 and the second conductor pattern 127. In FIG. 5, the first conductor pattern 126 and the second conductor pattern are shown, and the light-emitting element is used. 110 and the substrate 120 are decomposed and represented.

The first conductor pattern 126 and the second conductor pattern 127 are electrically connected to the light emitting element 110. The first conductor pattern 126 is electrically connected to the first buried pattern 123 shown in FIG. 4 . The second conductor pattern 127 is electrically connected to the second buried pattern 124 shown in FIG. 4 .

The first conductor pattern 126 is electrically connected to the first electrode 116 of the light-emitting element 110 shown in FIG. The second conductor pattern 127 is electrically connected to the second electrode 117 of the light-emitting element 110 shown in FIG. The mounting structure of the light-emitting element 110 will be described with reference to Fig. 6 . The light-emitting element 110 is attached to the base 120 by the first conductive bonding material 176 and the second conductive bonding material 177. The light-emitting element 110 is attached to the base 120 by a flip chip connection. The first electrode 116 of the light-emitting element 110 is electrically connected to the first conductor pattern 126 of the substrate 120 by the conductive bonding material 176. The second electrode 117 is electrically connected to the second conductor pattern 127 by the conductive bonding material 177.

The arrangement of the first conductor pattern 126 and the second conductor pattern 127 will be described with reference to Fig. 7 . The first conductor pattern 126 and the second conductor pattern 127 are included in the mounting region 125 of the light emitting element 110.

The first conductor pattern 126 has a first forming direction 1260. The "forming direction" refers to a direction in which a conductor pattern is extended in a conductor pattern with a portion electrically connected to an electrode of a light-emitting element. This "forming direction" is not limited by the order of formation in the manufacturing process. The first forming direction 1260 is a direction in which the first conductor pattern 126 extends in accordance with the first portion 1262 electrically connected to the first electrode 116 of the light-emitting element 110. The term "electrically connected to the electrode" refers to the area where the electrical bonding material is attached. Part 1262 The inside of the side of the edge 1252 of the rectangular mounting area 125. In FIG. 7, the first forming direction 1260 is the positive direction of the imaginary x-axis.

The second conductor pattern 127 has a second forming direction 1270. The second forming direction 1270 is a direction in which the second conductor pattern 127 extends in accordance with the second portion 1272 electrically connected to the second electrode 117 of the light-emitting element 110. The portion 1272 is located inside the midpoint of the edge 1254 of the rectangular mounting region 125. In FIG. 7, the second forming direction 1270 is a negative direction of the imaginary x-axis. The second forming direction 1270 is a direction opposite to the first forming direction 1260.

In the first conductor pattern 126, a portion 1262 electrically connected to the first electrode 116 is located at an end of the first conductor pattern 126. As shown in Fig. 8, the term "end" refers to the portion containing the design margin. In the exemplary configuration shown in FIG. 8, for the left side 1264 of FIG. 8, the end portion contains a margin 1265 associated with the distance contained in the range of 5 to 55 μm. In this exemplary configuration, for the side 1266 of the upper side of Figure 8, the end portion contains a margin 1267 associated with the distance contained in the range of 5 to 10 μm. In this exemplary configuration, the side 1268 of the lower side of Fig. 8 has a margin 1269 associated with the distance contained in the range of 5 to 10 μm. The length of one side of the mounting area 125 of the exemplary light-emitting element 110 is 0.35 mm. The so-called "end" is not limited to the part that contains the design margin, but also includes the structure without the design margin.

As shown in FIG. 9, in the second conductor pattern 127, a portion 1272 electrically connected to the second electrode 117 is located at an end portion of the second conductor pattern 127. In the exemplary configuration shown in FIG. 9, for the side 1274 on the right side of FIG. 9, the end portion contains a margin 1275 related to the distance included in the range of 5 to 55 μm. In this exemplary configuration, for the side 1276 of the upper side of Figure 9, the end contains 5 to 15 μm. The margin involved in the range is 1277. In this exemplary configuration, for the side 1278 of the lower side of Figure 9, the end contains a margin 1279 associated with the distance contained in the range of 5 to 55 μm. The so-called "end" is not limited to the part that contains the design margin, but also includes the structure without the design margin.

Referring again to FIG. 7, the first conductor pattern 126 includes a region where the conductive bonding material 176 is not adhered. The second conductor pattern 127 includes a region where the conductive bonding material 177 is not attached. With such a configuration, the divergence of the heat generated by the light-emitting element 110 is improved. Therefore, the light emitting device 10 can improve the related thermal control. In the first conductor pattern 126, the region where the conductive bonding material 176 is not adhered extends in the positive direction of the imaginary x-axis with reference to the portion 1262. In the second conductor pattern 127, the region where the conductive bonding material 177 is not adhered extends in the negative direction of the virtual x-axis based on the portion 1272.

The first conductor pattern 126 and the second conductor pattern 127 have directions in which they are opposite to each other. With such a configuration, the light-emitting element 110 can improve the positional accuracy with respect to the mounting step. In the mounting step of the light-emitting element 110, the conductive bonding material 176 in a molten state is intended to be diffused in the first forming direction 1260. In the mounting step of the light-emitting element 110, the conductive bonding material 177 in a molten state is intended to be diffused in the second forming direction 1270. As such, the directions in which the conductive bonding materials 176 and 177 are intended to diffuse are opposite directions. Light-emitting element 110 can reduce the movement associated with the mounting steps. Therefore, the light-emitting device 10 can improve, for example, light-emitting characteristics such as light output.

More specifically, the first forming direction 1260 is a positive direction of the imaginary x-axis. The second forming direction 1270 is a negative direction of the imaginary x-axis. Therefore, the light-emitting element 110 can reduce the positional shift in the x-axis direction. In addition, due to the first shape Since the direction 1260 and the second forming direction 1270 are the directions of the imaginary x-axis, the light-emitting element 110 can reduce the positional shift in the y-axis direction.

The first conductor pattern 126 and the second conductor pattern 127 are disposed at diagonal positions of the rectangular mounting region 125 as indicated by reference numeral 128 in FIG. With such a configuration, the portions 1256 and 1258 in which the conductor patterns are not formed in the opposite sides 1252 and 1254 of the rectangular mounting region 125 exist. Therefore, the light-emitting device 10 can reduce the attenuation of light emitted to the side or below of the light-emitting element 110. The illuminating device 10 can improve the illuminating intensity.

As shown in FIG. 10, portion 1262 and portion 1272 are disposed on a line 1291 that passes through a center point 1290 of the mounting area 125. With such a configuration, the light-emitting element 110 can improve the reliability of the mounting. The center point 1290 is the intersection of the diagonal lines 1292 and 1293 of the rectangular mounting area 125.

The first conductor pattern 126 and the second conductor pattern 127 have a point symmetrical shape centering on the center point 1290. With such a configuration, the unevenness of the attenuation of the light radiated to the lower side of the light-emitting element 110 can be reduced. Therefore, the light-emitting device 10 can improve the unevenness in the distribution of the luminous intensity.

Referring again to FIGS. 1 and 2, the reflective member 130 is disposed on the base 120 and surrounds the light-emitting element 110. The encapsulation layer 140 is disposed on the base 120 and disposed in the inner space of the reflective member 130. The encapsulation layer 140 has light transmissivity. The term "transparency" refers to at least a portion of the first light that can be transmitted through the light-emitting element 110. An exemplary material encapsulating layer 140 is a resin.

The encapsulation layer 140 is attached to the upper end and the side surface of the light-emitting element 110. The encapsulation layer 140 is further attached to the lower end of the light emitting element 110. The first conductor pattern 126 and the second conductor pattern 127 have mutually opposite forming directions 1260 and 1270, it is easy to disperse the stress generated in the portion between the light-emitting element 110 and the substrate 120 in the encapsulation layer 140 to the forming directions 1260 and 1270. The direction of dispersion of the stress is the direction of the imaginary x-axis of Figure 7.

Referring to FIGS. 1 and 2 , the light-emitting member 150 is disposed above the light-emitting element 110 and is fixed to the reflective member 130 . The light emitting member 150 covers the light emitting element 110 and the encapsulating layer 140. The light-emitting member 150 emits the second light in accordance with the first light emitted from the light-emitting element 110. The second light has a wavelength spectrum larger than that of the first light. The light emitting member 150 includes a matrix material and a fluorescent material. The matrix material is light transmissive. The term "transparency" refers to at least a portion of the first light that can be transmitted through the light-emitting element 110. An exemplary matrix material is an anthracene resin. The fluorescent material is excited by the first light emitted by the light-emitting element 110. The light emitted by the fluorescent material penetrates the matrix material.

Another exemplary conductor pattern shape will be described with reference to FIG. The first conductor pattern 226 has a first forming direction 2260 and a third forming direction 2261. The first forming direction 2260 is a direction in which the first conductor pattern 226 extends in accordance with a portion 2262 electrically connected to the first electrode 116 of the light-emitting element 110. The first forming direction is the positive direction of the imaginary x-axis. The third forming direction is a direction in which the first conductor pattern 226 is further extended from the end portion of the first forming direction 2260 in the first conductor pattern 226. The third forming direction 2261 intersects the first forming direction 2260. The third forming direction 2261 is the positive direction of the imaginary y-axis.

The second conductor pattern 227 has a second forming direction 2270 and a fourth forming direction 2271. The second forming direction 2270 is a direction in which the second conductor pattern 227 is extended based on the portion 2272 electrically connected to the second electrode 117 of the light-emitting element 110. The second forming direction 2270 is a direction opposite to the first forming direction 2260. The second forming direction 2270 is a negative direction of the imaginary x-axis. The fourth forming direction 2271 refers to a direction in which the second conductor pattern is further extended from the end portion of the second forming direction 2270 in the second conductor pattern 227. The fourth forming direction 2271 intersects the second forming direction 2270. The fourth forming direction 2271 is a negative direction of the imaginary y-axis.

The first conductor pattern 226 and the second conductor pattern 227 have mutually opposite forming directions 2260 and 2270. With such a configuration, the light-emitting element 110 can improve the positional accuracy with respect to the mounting step. Therefore, the light-emitting device 10 can improve, for example, light-emitting characteristics such as light output.

The first conductor pattern 226 and the second conductor pattern 227 further have a third forming direction 2261 and a fourth forming direction 2271. With such a configuration, the light-emitting device 10 can improve the divergence of heat generated by the light-emitting element 110. Therefore, the light emitting device 10 can improve the related thermal control.

Portion 2262 and portion 2272 are disposed on a line 1291 that passes through a center point 1290 of the mounting area 125. With such a configuration, the light-emitting element 110 can improve the reliability of the mounting. The center point 1290 is the intersection of the diagonal lines 1292 and 1293 of the rectangular mounting area 125.

The first conductor pattern 226 and the second conductor pattern 227 have a point symmetrical shape centering on the center point 1290. With such a configuration, the unevenness of the attenuation of the light radiated to the lower side of the light-emitting element 110 can be reduced. Therefore, the light-emitting device 10 can improve the unevenness in the distribution of the luminous intensity.

Referring to Figure 12, the shape of another exemplary conductor pattern is illustrated. The first conductor pattern 326 has a first forming direction 3260. The first forming direction 3260 is based on a portion 3262 electrically connected to the first electrode 116 of the light emitting element 110. The direction in which the first conductor pattern 326 extends is normal. The first forming direction 3260 is an imaginary x-axis direction.

The second conductor pattern 327 has a second forming direction 3270. The second forming direction 3270 is a direction in which the second conductor pattern 327 extends in accordance with a portion 3272 electrically connected to the second electrode 117 of the light-emitting element 110. The second forming direction 3270 is a direction intersecting the first forming direction 3260. The second forming direction 3270 is orthogonal to the first forming direction 3260. The second forming direction 3270 is a negative direction of the imaginary y-axis.

The first conductor pattern 326 and the second conductor pattern 327 have a direction in which the mutually intersecting directions are formed. With such a configuration, the light-emitting element 110 can improve the positional accuracy with respect to the mounting step. Therefore, the light-emitting device 10 can improve, for example, light-emitting characteristics such as light output.

Portion 3262 and portion 3272 are disposed on a line 1291 passing through a center point 1290 of the mounting area 125. With such a configuration, the light-emitting element 110 can improve the reliability of the mounting. The center point 1290 is the intersection of the diagonal lines 1292 and 1293 of the rectangular mounting area 125.

The first conductor pattern 326 and the second conductor pattern 327 have a point symmetrical shape with respect to the center point 1290. With such a configuration, the unevenness of the attenuation of the light radiated to the lower side of the light-emitting element 110 can be reduced. Therefore, the light-emitting device 10 can improve the unevenness in the distribution of the luminous intensity.

A light-emitting device 10 according to another embodiment of the present invention will be described with reference to Figs. 13 and 14 . Another embodiment of the light-emitting device 10 includes the light-emitting element 410 shown in FIG. 13 instead of the light-emitting element 110 shown in FIG. An exemplary light-emitting element 410 is a light-emitting diode.

The light emitting element 410 includes a substrate 411, an n-type semiconductor layer 412, a semiconductor active layer 413, and a p-type semiconductor layer 414. The light-emitting element 410 further includes a light-transmitting conductive layer 415, a first electrode 416, and a second electrode 417.

An exemplary material of the substrate 411 is sapphire. The n-type semiconductor layer 412 is laminated on the substrate 411. The lamination direction of the light-emitting element 410 is in the upward direction of FIG. That is, the stacking direction is the negative direction of the imaginary z-axis. The semiconductor active layer 413 is laminated on the n-type semiconductor layer 412. The p-type semiconductor layer 414 is laminated on the semiconductor active layer 413.

The light-transmitting conductive layer 415 is formed on the p-type semiconductor layer 114. The "transparency" of the conductive layer 415 means at least a portion of the light that can be transmitted through the semiconductor active layer 413. The first electrode 416 is formed on the light-transmitting conductive layer 415. The first electrode 416 is an anode electrode of the light-emitting element 410. The second electrode 417 is formed on the n-type semiconductor layer 412. The second electrode 417 is a cathode electrode of the light-emitting element 410.

The light-emitting element 410 includes a mounting surface 418 including a first electrode 416 and a second electrode 417. The first electrode 416 and the second electrode 417 are provided at diagonal positions of the rectangular mounting surface 418.

As shown in FIG. 14, the first conductor pattern 426 and the second conductor pattern 427 are included in the mounting region 425 of the light-emitting element 410.

The first conductor pattern 426 has a first forming direction 4260. The first forming direction 4260 is a direction in which the first conductor pattern 426 extends in accordance with a portion 4262 electrically connected to the first electrode 416 of the light-emitting element 410. The first forming direction 4260 is a positive direction of the imaginary x-axis. The portion 4262 is located at an end of the first conductor pattern 426. The end contains a portion of the design. So-called The department is not limited to the part that contains the design margin, but also contains the structure that does not contain the design margin.

The second conductor pattern 427 has a second forming direction 4270. The second forming direction 4270 is a direction in which the second conductor pattern 427 extends in accordance with a portion 4272 electrically connected to the second electrode 417 of the light-emitting element 410. The second forming direction 4270 is a negative direction of the imaginary x-axis. The portion 4272 is located at an end of the second conductor pattern 427.

The first conductor pattern 426 and the second conductor pattern 427 are arranged in a direction intersecting the first forming direction 4260 and the second forming direction 4270. The first conductor pattern 426 and the second conductor pattern 427 are arranged in a virtual y-axis direction. The portion 4262 and the portion 4272 are disposed at diagonal positions of the rectangular mounting region 425.

The first conductor pattern 426 and the second conductor pattern 427 have mutually opposite forming directions. With such a configuration, the light-emitting element 410 can improve the positional accuracy with respect to the mounting step. Therefore, the light-emitting device 10 can improve, for example, light-emitting characteristics such as light output.

Portion 4262 and portion 4272 are disposed on a line 4291 that passes through a center point 290 of the mounting area 425. With such a configuration, the light-emitting element 410 can improve the reliability of the mounting. The center point 4290 is the intersection of the diagonal lines 4292 and 4293 of the rectangular mounting area 125.

The first conductor pattern 426 and the second conductor pattern 427 have a point symmetrical shape centering on the center point 4290. With such a configuration, the unevenness of the attenuation of the light radiated to the lower side of the light-emitting element 410 can be reduced. Therefore, the light-emitting device 10 can improve the unevenness in the distribution of the luminous intensity. The first conductor pattern 426 and the second conductor pattern 427 have a line symmetry centered on the center point 4290.

The present invention may be embodied in other various forms without departing from the spirit or essential characteristics thereof. Therefore, the foregoing embodiments are merely illustrative of the scope of the invention, and the scope of the invention is disclosed in the scope of the claims. Further, variations and modifications belonging to the scope of the patent application are all within the scope of the invention.

10‧‧‧Lighting device

110,410‧‧‧Lighting elements

116, 416‧‧‧1st electrode

117, 417‧‧‧ second electrode

118, 418‧‧‧ mounting surface

120‧‧‧ base

126, 326, 426‧‧‧1st conductor pattern

127, 327, 427‧‧‧ second conductor pattern

130‧‧‧reflecting members

140‧‧‧Enclosure

150‧‧‧Lighting components

1260, 3260, 4260‧‧‧1st direction of formation

1270, 3270, 4270‧‧‧2nd direction of formation

The objects, features, and advantages of the invention will be apparent from the description and appended claims.

Fig. 1 is a view showing a light-emitting device 10 according to an embodiment of the present invention.

Fig. 2 is a view showing the internal structure of the light-emitting device 10 shown in Fig. 1.

Fig. 3 shows the light-emitting element 110 shown in Fig. 2.

4 shows the base 120 shown in FIGS. 1 and 2.

Fig. 5 is an enlarged view of a portion indicated by a symbol V in Fig. 4.

Fig. 6 is a cross-sectional view showing a mounting structure of the light-emitting element 110.

FIG. 7 shows the arrangement of the first conductor pattern 126 and the second conductor pattern 127.

FIG. 8 shows the first conductor pattern 126.

FIG. 9 shows the second conductor pattern 127.

FIG. 10 shows the arrangement of the first conductor pattern 126 and the second conductor pattern 127.

Figure 11 shows another exemplary conductor pattern 226 and 227.

Figure 12 shows another exemplary conductor pattern 326 and 327.

Fig. 13 is a view showing a light-emitting element 410 of a light-emitting device 10 according to another embodiment of the present invention.

Fig. 14 is a view showing a first conductor pattern 426 and a second conductor pattern 427 of a light-emitting device 10 according to another embodiment of the present invention.

10‧‧‧Lighting device

120‧‧‧ base

130‧‧‧reflecting members

150‧‧‧Lighting components

Claims (13)

A light-emitting device comprising: a light-emitting element comprising a mounting surface including a first electrode and a second electrode; and a substrate including a mounting region overlapping the light-emitting element; and a first conductor pattern The first conductive bonding material is electrically connected to the first electrode, and is included in the mounting region, and the conductor pattern extends in the first forming direction with respect to a portion connected to the first electrode; and the second conductive pattern The second conductive bonding material is electrically connected to the second electrode, and is included in the mounting region, and the conductor pattern extends in the second forming direction with respect to a portion connected to the second electrode. The second forming direction is a direction opposite to the first forming direction. The light-emitting device of claim 1, wherein the first conductor pattern and the second conductor pattern are disposed at diagonal positions in the rectangular mounting region. The illuminating device according to claim 2, wherein the first portion of the first conductor pattern electrically connected to the first electrode and the second conductor pattern are electrically connected to the second portion of the second electrode On the straight line passing through the center point of the aforementioned mounting area. The light-emitting device of claim 3, wherein the first conductor pattern and the second conductor pattern have a point-symmetric shape with respect to the center point. The illuminating device of claim 2, wherein the first conductor pattern is further The third formation direction intersects with the first formation direction, and the second conductor pattern further includes a fourth formation direction that intersects the second formation direction. The illuminating device according to claim 5, wherein the portion of the first conductor pattern electrically connected to the first electrode and the portion of the second conductor pattern electrically connected to the second electrode are disposed by the mounting The line of the center of the area is on the line. The light-emitting device of claim 6, wherein the first conductor pattern and the second conductor pattern have a point-symmetric shape with respect to the center point. The light-emitting device according to claim 1, wherein the first portion of the first conductor pattern electrically connected to the first electrode and the second portion of the second conductor pattern are electrically connected to the second portion of the second electrode In the diagonal position of the aforementioned installation area. The light-emitting device according to claim 8, wherein the first conductor pattern and the second conductor pattern have a point-symmetric shape with respect to a center point of the mounting region. The light-emitting device according to claim 8, wherein the first conductor pattern and the second conductor pattern have a line symmetrical shape with respect to a center point of the mounting region. A light-emitting device comprising: a light-emitting element comprising a mounting surface including a first electrode and a second electrode; and a substrate including a mounting region overlapping the light-emitting element; and a first conductor pattern Electrically connected to the first conductive bonding material The first electrode is included in the mounting region, and the conductor pattern extends in the first forming direction with respect to a portion connected to the first electrode; and the second conductive pattern is separated by a second conductive bonding The material is electrically connected to the second electrode, and is included in the mounting region, and the conductor pattern extends in the second forming direction based on the portion connected to the second electrode, and the second forming direction is the first Form the direction in which the directions intersect. The light-emitting device of claim 11, wherein the portion of the first conductor pattern electrically connected to the first electrode and the portion of the second conductor pattern electrically connected to the second electrode are disposed by the mounting The line of the center of the area is on the line. The illuminating device of claim 12, wherein the straight line is parallel to the second forming direction.