200915627 九、發明說明： 【發明所屬之技術領域】200915627 IX. Description of the invention: [Technical field to which the invention belongs]
本發明係關於例如含有發光二極體等之發光元件之發光 裝置。 X 【先前技術】The present invention relates to a light-emitting device including a light-emitting element such as a light-emitting diode. X [Prior Art]
近年來，一直在進行著例如含有發光二極體等之發光元 件之發光裝置之開發。在發光元件之安裝構造中，有利用 覆晶連接之構造之安裝構造。在此種安裝構造巾，發光元 件係含有含第1電極及第2電極之安裝面。第!電極及第2電 極係介隔導電性接合材料電性連接於導體圖案。今後，發 光裝置例如在照明領域等，被要求有關發光特性之進一： ，改善。在被要求改善之發光特性中，例如包含 :揞：了提高光輸出’有必要改善在發光元件之安裝之位 罝稽度。 【發明内容】 ::發明之一態樣’發光裝置係包含發光元件， -圖案及第2導體圖案。發光元件係 2雷揣夕史壯 另3第1電極及第 、面。第1導體圖案係介隔第1導電性接人妯 電性連接於第具有第…成方向 ^材枓 包含於發光元件之安裝區域内。第導體圖案係 電性接合材料電性連接於第2電極，；案係介隔第2導 2形成方向係|第1.点太4第2形成方向。第 包含於發光元件之安裝區域内。 帛2導體圖案係 依據本發明之另-態樣，發《置係包含發光元件、第 132971.doc 200915627 1 第導二圖案：第2導體圖案。發光元件係含有含第1電極及 ^之安裝面。第1導體圖案係介隔第1導電性接合材 料電性連接於第丨雷搞 r ^ 丧°材 電極，具有第1形成方向。第1導體圖案 :匕3於發光兀件之安裝區域内。第2導體圖案係介隔第2 \電11接σ材料電性連接於第2電極，具有第2形成方向。 第2形成方向係與第1形成方向相交之方向。第2導體圖案 係包含於發光元件之安裝區域内。In recent years, development of a light-emitting device including a light-emitting element such as a light-emitting diode has been carried out. In the mounting structure of the light-emitting element, there is a mounting structure using a structure in which a flip chip is connected. In such a mounting structure, the light-emitting element includes a mounting surface including the first electrode and the second electrode. The first electrode and the second electrode are electrically connected to the conductor pattern via a conductive bonding material. In the future, light-emitting devices, for example, in the field of illumination, are required to improve on the light-emitting characteristics. Among the light-emitting characteristics that are required to be improved, for example, it is necessary to improve the light output, and it is necessary to improve the position of the light-emitting element. SUMMARY OF THE INVENTION A mode of the invention is that the light-emitting device includes a light-emitting element, a pattern, and a second conductor pattern. Light-emitting element system 2 Lei Xi Shi Zhuang Another 3 first electrode and the first and the surface. The first conductive pattern is electrically connected to the first conductive material, and is included in the mounting region of the light-emitting element. The first conductor pattern is electrically connected to the second electrode, and the case is formed by the second guide 2 forming direction system. The first point is 4 and the second forming direction. The first part is included in the mounting area of the light-emitting element.帛 2 Conductor pattern According to another aspect of the present invention, the system includes a light-emitting element, and the second conductor pattern is the first two-conductor pattern. The light-emitting element includes a mounting surface including the first electrode and the first electrode. The first conductor pattern is electrically connected to the first conductive bonding material via the first conductive bonding material, and has a first forming direction. The first conductor pattern: 匕3 is in the mounting area of the illuminating element. The second conductor pattern is electrically connected to the second electrode via the second electric gate σ material, and has a second forming direction. The second forming direction is a direction intersecting the first forming direction. The second conductor pattern is included in the mounting region of the light-emitting element.
藉由上述構造，發光裝置可改善在發光元件之安裝之位 置精度因此，發光裝置可改善例如光輸出等之發光 性。 【實施方式】 在下列中，說明若干例示性的實施型態。 如圖1及圖2所示，本發明之一實施型態之發光襄置1〇包 含發光元件no、基體120、及反射構件13〇。發光裝置ι〇 進一步包含封入層140及發光構件15〇。在圖2中，為表示 内部構造，發光裝置ίο係以局部省略之狀態表示。 發光70件1 ίο含有半導體材料。例示性的發光元件㈣係 發光二極體。發光元件丨1〇依照驅動電力放射第】次光。發 光元件110安裝於假想之xy平面。如圖3所示，發光元件 110包含基板111、η型半導體層112、半導體活性層n3&p 型半導體層114。發光元件ι10進一步包含透光性導電層 115、第1電極116及第2電極117。 基板111之例示性的材料為藍寶石。n型半導體層ιΐ2係 積層於基板111上。發光元件110之積層方向係圖3之上方 132971.doc 200915627 向。即，積層方向係假想之z軸之負方向。半導體活性層 113係積層型半導體層112上。p型半導體層114係積層 於半導體活性層113上。 透光性導電層U5係形成於P型半導體層114上。所謂導 ' 電層115之"透光性係指可穿透半導體活性層113所放射 之光之至少一部分。第1電極116係形成於透光性導電層 115上。第1電極116係發光元件11〇之陽極電極。第2電極 f U7係形成於11型半導體層112上。第2電極117係發光元件 110之陰極電極。 發光兀件110含有含第1電極116及第2電極117之安裝面 Π8。所謂”安裝面，，’係指與基體12〇對向之面。發光元件 110在圖3中，安裝於假想之”平面。 如圖4所示’基體12〇含有第1層ι21及第2層122。在圖4 中’為了表示内部構造，將基體12〇分解表示。第1層121 含有第1埋入圖案123及第2埋入圖案124。所謂埋入”，係 指圖案123及圖案124位於含第1層121及第2層122之基體 120之内部。 第2層122係積層於第1層121。如圖5所示，第2層122含 有發光元件110之安裝區域125。所謂”安裝區域”，係指位 . 於發光元件之正下方之區域。即，所謂安裝區域，在 平面視上’係指與發光元件11 0重疊之區域。所謂平面 視’在圖5中，係指符號ι6〇所示之視野。 第2層122含有第1導體圖案I%及第2導體圖案127。在圖 5中’為表示第1導體圖案126及第2導體圖案，將發光元件 132971.doc 200915627 110及基體120分解表示。 第1導體圖案126及第2導體圖案m電性連接於發光元件 11〇°第1導體圖案126電性連接於圖4所示之川里入圖案 123。 第2導體圖案127電性連接於圖4所示之第〗埋入 124。 ’、 第1導體圖案126電性連接於圖3所示之發光元件⑽之第 1電極116。第2導體圖土 守回莱127電性連接於圖3所示之發光元 件110之第2電極117。灸an 參'七圖6，說明發光元件110之安裝 構造。發光元件110係被第1導電性接合材料m及第2導電 =材㈣安裝於基體12。。發光元件ιι〇係被覆晶連 女、於基體120。發光疋件11〇之第！電極⑴係被導電性 接合材料m電性連接於基體120之第！導體圖案126。第2 =。117係被導電性接合材料177電性連接於第2導體圖案 置明第1導體圖案126及第2導體圖案-之配 第1導體圖案126具有第1报忐士 ……Μ 有第1形成方向1260。所謂"形成方向'1， 係‘在導體®案巾，以電 Α其、.隹 史伐y、知忐兀件之電極之部分 為基準’而使導體圖案延伸之方向 造過程中之形成順序所限定。第u /成方向不受製 連接於發Μ件W^126G係以電性 而使第1導體二 第1部分1262為基準， 弟〗導體圖案⑶延伸之方向。所 之部分”’係指導電性接合材料附著 f接於電極 7言炙&域。部分1262位 132971.doc 200915627 於矩形狀之安裝區域125之邊1252之中點内側。在圖7中 第1形成方向1260係假想之X軸之正方向。 第2導體圖案127具有第2形成方向1270。第2形成方向 1270係以電性連接於發光元件i丨〇之第2電極i丨7之第2部分 1272為基準，而使第2導體圖案127延伸之方向。部分1272 位於矩形狀之安裝區域i 25之邊丨254之中點内側。在圖7With the above configuration, the light-emitting device can improve the positional accuracy of the mounting of the light-emitting element. Therefore, the light-emitting device can improve the light-emitting property such as light output. [Embodiment] In the following, several exemplary embodiments are described. As shown in Fig. 1 and Fig. 2, a light-emitting device 1 according to an embodiment of the present invention includes a light-emitting element no, a base 120, and a reflection member 13A. The light emitting device ι〇 further includes an encapsulation layer 140 and a light emitting member 15A. In Fig. 2, the internal structure is shown, and the light-emitting device ίο is shown in a partially omitted state. The light-emitting 70 piece 1 ίο contains a semiconductor material. An exemplary light-emitting element (4) is a light-emitting diode. The light-emitting element 丨1〇 emits the ninth light according to the driving power. The light emitting element 110 is mounted on an imaginary xy plane. As shown in Fig. 3, the light-emitting element 110 includes a substrate 111, an n-type semiconductor layer 112, a semiconductor active layer n3 & p-type semiconductor layer 114. The light-emitting element ι10 further includes a light-transmitting conductive layer 115, a first electrode 116, and a second electrode 117. An exemplary material for the substrate 111 is sapphire. The n-type semiconductor layer ι 2 is laminated on the substrate 111. The lamination direction of the light-emitting element 110 is above the figure of Fig. 3 132971.doc 200915627. That is, the stacking direction is the negative direction of the imaginary z-axis. The semiconductor active layer 113 is formed on the laminated semiconductor layer 112. The p-type semiconductor layer 114 is laminated on the semiconductor active layer 113. The light-transmitting conductive layer U5 is formed on the P-type semiconductor layer 114. The term "transparent" of the conductive layer 115 means at least a portion of the light that can be transmitted through the semiconductor active layer 113. The first electrode 116 is formed on the light-transmitting conductive layer 115. The first electrode 116 is an anode electrode of the light-emitting element 11A. The second electrode f U7 is formed on the 11-type semiconductor layer 112. The second electrode 117 is a cathode electrode of the light-emitting element 110. The light-emitting element 110 includes a mounting surface 8 including a first electrode 116 and a second electrode 117. The term "mounting surface" refers to the surface opposite to the base 12A. The light-emitting element 110 is attached to the imaginary plane in Fig. 3. As shown in Fig. 4, the substrate 12 includes a first layer ι 21 and a second layer 122. In Fig. 4, in order to show the internal structure, the base 12 is decomposed and represented. The first layer 121 includes a first buried pattern 123 and a second buried pattern 124. The term "buried" means that the pattern 123 and the pattern 124 are located inside the base 120 including the first layer 121 and the second layer 122. The second layer 122 is laminated on the first layer 121. As shown in Fig. 5, the second layer 122 includes a mounting region 125 of the light-emitting element 110. The so-called "mounting region" refers to a region directly under the light-emitting element. That is, the mounting region, in a plan view, refers to a region overlapping the light-emitting element 110. The term "planar view" is the field of view indicated by the symbol ι6 图 in Fig. 5. The second layer 122 includes the first conductor pattern I% and the second conductor pattern 127. In Fig. 5, 'the first conductor pattern 126' is shown. And the second conductor pattern, the light-emitting element 132971.doc 200915627 110 and the base body 120 are exploded. The first conductor pattern 126 and the second conductor pattern m are electrically connected to the light-emitting element 11 and the first conductor pattern 126 is electrically connected to the figure. The pattern 12 is shown in Fig. 4. The second conductor pattern 127 is electrically connected to the first buried portion 124 shown in Fig. 4. The first conductor pattern 126 is electrically connected to the light-emitting element (10) shown in Fig. 3. 1 electrode 116. The second conductor is shown in FIG. The second electrode 117 of the member 110. The mounting structure of the light-emitting element 110 will be described with reference to Fig. 6. The light-emitting element 110 is attached to the substrate 12 by the first conductive bonding material m and the second conductive material (four). The component ιι is coated with a crystallized female, and the base 120. The first electrode (1) of the light-emitting element 11 is electrically connected to the first conductor pattern 126 of the substrate 120 by the conductive bonding material m. The second = 117 is The conductive bonding material 177 is electrically connected to the second conductor pattern to illuminate the first conductor pattern 126 and the second conductor pattern. The first conductor pattern 126 has a first report direction. "Forming direction '1, is the order in which the conductor pattern extends in the direction of the conductor pattern, based on the part of the electrode of the conductor, the 隹 隹 y, the electrode of the 忐兀 ' It is to be defined that the u/forming direction is not connected to the hairpin W^126G, and the first conductor 2 first portion 1262 is electrically connected, and the conductor pattern (3) extends in the direction. The electrical bonding material is attached to the electrode 7 to be connected to the electrode. The portion 1262 is 132971.doc 200915627 inside the midpoint of the edge 1252 of the rectangular mounting area 125. In Fig. 7, the first forming direction 1260 is the positive direction of the imaginary X-axis. The second conductor pattern 127 has a second forming direction 1270. The second forming direction 1270 is a direction in which the second conductor pattern 127 is extended based on the second portion 1272 electrically connected to the second electrode i丨7 of the light-emitting element i. The portion 1272 is located inside the midpoint of the edge 254 of the rectangular mounting area i25. In Figure 7
中，第2形成方向1270係假想之父軸之負方向。第2形成方 向127〇係第1形成方向丨26〇之相反方向。 在第1導體圖案126中，電性連接於第i電極116之部分 1262位於第1導體圖案之端部。如圖8所示，所謂"端部”， 係私3认汁上之餘裕之部分。在圖8所示之例示性的構造 中，對圖8之左側之邊1264 ,端部含有與5至55 之範圍 斤έ之距離有關之餘裕12 6 5。在該例示性的構造中，對圖 8之上側之邊1266，該端部含有與5至1〇 之範圍所含之 距離有關之餘裕1267。在該例示性的構造中’對圖8之下 側之邊1268 ’其端部含有與5至1〇㈣之範圍所含之距離有 關之餘裕1269。有關例示性的發光元件110之安裝區域丨25 之一邊長度為0.35 mm。所謂"端部”，並不限於含設計上 之餘裕之部分，也包含不含設計上之餘裕之構造。 士圖9所不，在第2導體圖案127中，電性連接於第2電極 之部分1272位於第2導體圖案127之端部。在⑽所示之 例示性的構造中，對圖9之右側之邊1274，端部含有與5至 55广之範圍所含之距離有關之餘裕·。在該例示性的 構W中’對圖9之上側之邊1276，該端部含有與5至15 _ 13297l.d〇, 200915627 之範圍所含之距離有關之餘裕丨277。在該例示性的構造 中，對圖9之下側之邊1278 ,該端部含有與5至55 μηι之範 圍所含之距離有關之餘裕1279。所謂"端部"，並不限於含 6又计上之餘裕之部分，也包含不含設計上之餘裕之構造。 再參照圖7，第1導體圖案126含有未附著導電性接合材 料176之區域。第2導體圖案127含有未附著導電性接合材 料177之區域。藉由此種構造，改善有關發光元件u〇所產 生之熱之發散。因此，發光裝置丨〇可改善有關熱控制。在 第1導體圖案丨26中，未附著導電性接合材料176之區域係 以部分1262為基準，向假想之乂軸之正方向延伸。在第2導 體圖案127中，未附著導電性接合材料177之區域係以部分 1272為基準，向假想之x軸之負方向延伸。 第1導體圖案丨26及第2導體圖案127具有互相相反方向之 形成方向。藉由此種構造，發光元件11〇可改善有關安裝 步驟之位置精度。在發光元件11〇之安裝步驟中，熔融狀 態之導電性接合材料176會意圖向第丨形成方向126〇擴散。 在發光元件110之安裝步驟中，熔融狀態之導電性接合材 料177會意圖向第2形成方向127〇擴散。如此，導電性接合 材料176及177意圖擴散之方向為相反之方向。發光元件 no可減低有關安裝步驟之移動，，發光裝置1〇例如 可改善有關光輸出等發光特性。 更具體言之’第！形成方向126〇係假想之χ轴之正方向。 第2形成方向127〇係假想之父軸之負方向。因此，發光元件 110可減低有關在X軸方向之位置㈣。另夕卜由於請 132971.doc -10· 200915627 成方向1260及第2形成方向1270係假想之x轴之方向，故發 光元件110可減低有關在y軸方向之位置偏移。 第1導體圖案126及第2導體圖案127如圖7中符號128所 示，配置於矩形狀之安裝區域125之對角位置。藉由此種 構造，在矩形狀之安裝區域125之對向之邊1252及1254有 未形成導體圖案之部分1256及1258存在。因此，發光裝置 10可減低有關向發光元件110之側方或下方放射之光之衰 減。發光裝置10可改善有關發光強度。 如圖10所示，部分1262及部分1272係配置於通過在安裝 區域125之中心點1290之直線1291上。藉由此種構造，發 光元件11〇可改善有關安裝之可靠性。中心點129〇係矩形 狀之安裝區域125之對角線1292及1293之交點。 第1導體圖案126及第2導體圖案127係以中心點1290為中 〜具有點對稱之形狀。精由此種構造，可減低有關向發 光元件110之下方放射之光之衰減之不均。因此，發光裝 置10可改善有關發光強度分佈之不均。 再參照圖1及圖2，反射構件130設於基體！2〇之上，包圍 著發光元件110。封入層14〇設於基體12〇之上，並設於反 射構件130之内部空間。封入層14〇具有透光性。所謂透光 性，係指可穿透發光元件110所放射之第丨次光之至少一部 分。封入層140之例示性的材料係矽樹脂。 封入層140附著於發光元件11〇之上端及側面。封入層 mo進一步附著於發光元件110之下端。由於第1導體圖案 126及第2導體圖t 127具有互相相反之形《方向⑽及 132971.doc 200915627 1270，故容易使封入層14〇中發光元件11〇與基體i2〇間之 部分產生之應力分散至形成方向126〇及127〇。應力之分散 方向係圖7之假想之X軸之方向。 再參照圖1及圖2，發光構件i 5〇設於發光元件i丨〇之上 方，固定於反射構件13〇。發光構件15〇覆蓋著發光元件 110及封入層140。發光構件15〇依照發光元件11〇所放射之 第1次光放射第2次光。第2次光具有大於第丨次光之波長光 譜'^發光構件150含有矩陣材料及螢光材料。矩陣材料具 有透光性。所謂透光性，係指可穿透發光元件11〇所放射 之第1次光之至少一部分。例示性的矩陣材料係矽樹脂。 螢光材料被發光元件11 〇所放射之第i次光所激發。螢光材 料所放射之光穿透矩陣材料。 參照圖11說明另一例示性的導體圖案之形狀。第丨導體 圖案226具有第1形成方向226〇及第3形成方向2261。第1形 成方向2260係以電性連接於發光元件11〇之第i電極116之 部分2262為基準，而使第！·體圖案226延伸之方向。第！ 形成方向係假想之X軸之正方向。第3形成方向係指第i導 體圖案226中由第1形成方向2260之端部使第1導體圖案226 進一步延伸之方向。第3形成方向2261與第i形成方向226〇 相交。第3形成方向2261係假想之y軸之正方向。 第2導體圖案227具有第2形成方向2270及第4形成方向 2271。第2形成方向2270係以電性連接於發光元件11〇之第 2電極117之部分2272為基準，而使第2導體圖案227延伸之 方向。第2形成方向2270係第i形成方向226〇之相反方向。 132971.doc •12- 200915627 第2开> 成方向2270係傻想之父軸之負方向。第4形成方向 2271係指第2導體圖案227中由第2形成方向2270之端部使 第2導體圖案進一步延伸之方向。第4形成方向以了丨與第2 形成方向2270相交。第4形成方向2271係假想之乂軸之負方 向0 第1導體圖案226及第2導體圖案227具有互相相反之形成 方向2260及2270。藉由此種構造，發光元件110可改善有 關安裝步驟之位置精度。因此，發光裝置丨〇例如可改善有 關光輸出等發光特性。 第1導體圖案226及第2導體圖案227進一步具有第3形成 方向2261及第4形成方向2271。藉由此種構造，發光裝置 可改善有關發光元件110所產生之熱之發散。因此，發 光裝置10可改善有關熱控制。 部分2262及部分2272係配置於通過在安裝區域125之中 心點1290之直線1291上。藉由此種構造，發光元件ιι〇可 改善有關安裝之可事性。中心點129〇係矩形狀之安裝區域 125之對角線1292及1293之交點。 第1導體圖案226及第2導體圖案227係以中心點129〇為中 心’具有點對稱之形狀。藉由此種構造，可減低有關向發 光元件110之下方放射之光之衰減之不均。因此，發光裝 置10可改善有關發光強度分佈之不均。 參照圖12，說明另一例示性的導體圖案之形狀。第}導 體圖案326具有第丨形成方向3260。第丨形 電性連接於發光元件11〇之第】電極116之部分二 J3 13297I.doc 200915627 準’而使第1導體圖案326延伸之方向。第！形成方向326〇 係假想之X轴方向。 第2導體圖案327具有第2形成方向3270。第2形成方向 3270係以電性連接於發光元件u〇之第2電極117之部分 3272為基準，而使第2導體圖案327延伸之方向。第2形成 方向3270係與第1形成方向3260之相交之方向。第2形成方 向3270係與第1形成方向3260正交。第2形成方向3270係假 想之y軸之負方向。In the middle, the second forming direction 1270 is the negative direction of the imaginary parent axis. The second forming direction 127 is the opposite direction of the first forming direction 丨26〇. In the first conductor pattern 126, a portion 1262 electrically connected to the i-th electrode 116 is located at an end portion of the first conductor pattern. As shown in Fig. 8, the so-called "end" is the part of the private sector. In the exemplary structure shown in Fig. 8, the side of the left side of Figure 8 is 1264, and the end contains 5 In the exemplary configuration, the edge 1266 of the upper side of Fig. 8 contains a margin associated with the distance contained in the range of 5 to 1 〇. 1267. In this exemplary configuration, 'the side 1268' on the lower side of Fig. 8 has a margin 1269 associated with the distance contained in the range of 5 to 1 〇 (4). Installation of an exemplary illuminating element 110 The length of one side of the area 丨25 is 0.35 mm. The so-called "end" is not limited to the part containing the design margin, but also includes the structure without the design margin. In the second conductor pattern 127, the portion 1272 electrically connected to the second electrode is located at the end of the second conductor pattern 127. In the exemplary configuration shown in (10), for the side 1274 on the right side of Fig. 9, the end portion contains a margin relating to the distance included in the range of 5 to 55 wide. In the exemplary configuration W, the side 1276 of the upper side of Fig. 9 contains a margin 277 associated with the distance contained in the range of 5 to 15 _ 13297l.d, 200915627. In this exemplary configuration, for the side 1278 of the lower side of Figure 9, the end contains a margin 1279 associated with the distance contained in the range of 5 to 55 μη. The so-called "end" is not limited to the part that contains the remaining margins, but also contains the structure that does not contain the design margin. Referring again to Fig. 7, the first conductor pattern 126 includes a region where the conductive bonding material 176 is not adhered. The second conductor pattern 127 contains a region where the conductive bonding material 177 is not adhered. With such a configuration, the divergence of heat generated by the light-emitting element u is improved. Therefore, the light-emitting device can improve the related thermal control. In the first conductor pattern 丨26, the region where the conductive bonding material 176 is not adhered extends in the positive direction of the imaginary 乂 axis based on the portion 1262. In the second conductor pattern 127, the region where the conductive bonding material 177 is not adhered extends in the negative direction of the virtual x-axis based on the portion 1272. The first conductor pattern 丨26 and the second conductor pattern 127 have directions in which they are opposite to each other. With this configuration, the light-emitting element 11 can improve the positional accuracy of the mounting step. In the mounting step of the light-emitting element 11, the molten conductive bonding material 176 is intended to diffuse in the second formation direction 126. In the mounting step of the light-emitting element 110, the conductive bonding material 177 in a molten state is intended to be diffused in the second forming direction 127. Thus, the directions in which the conductive bonding materials 176 and 177 are intended to diffuse are opposite directions. The light-emitting element no can reduce the movement of the mounting step, and the light-emitting device 1 can improve the light-emitting characteristics such as light output, for example. More specifically, the first! The forming direction 126 is the positive direction of the imaginary axis. The second forming direction 127 is the negative direction of the imaginary parent axis. Therefore, the light-emitting element 110 can reduce the position (4) in the X-axis direction. In addition, since the direction of the x-axis of the imaginary direction 1260 and the second forming direction 1270 is the 132601.doc -10.200915627, the light-emitting element 110 can reduce the positional shift in the y-axis direction. The first conductor pattern 126 and the second conductor pattern 127 are arranged at diagonal positions of the rectangular mounting region 125 as indicated by reference numeral 128 in Fig. 7 . With such a configuration, the opposite sides 1252 and 1254 of the rectangular mounting region 125 have portions 1256 and 1258 in which the conductor pattern is not formed. Therefore, the light-emitting device 10 can reduce the attenuation of light emitted to the side or below of the light-emitting element 110. The illuminating device 10 can improve the illuminating intensity. As shown in Fig. 10, portion 1262 and portion 1272 are disposed on a straight line 1291 passing through a center point 1290 of the mounting area 125. With this configuration, the light-emitting element 11 can improve the reliability of the mounting. The center point 129 is the intersection of the diagonal lines 1292 and 1293 of the rectangular mounting area 125. The first conductor pattern 126 and the second conductor pattern 127 have a shape in which the center point 1290 has a point symmetry. With this configuration, the unevenness of the attenuation of the light radiated to the lower side of the light-emitting element 110 can be reduced. Therefore, the illuminating device 10 can improve the unevenness in the distribution of the illuminance intensity. Referring again to Figures 1 and 2, the reflective member 130 is disposed on the substrate! Above the 〇, the light-emitting element 110 is surrounded. The encapsulation layer 14 is disposed on the substrate 12A and is disposed in the internal space of the reflection member 130. The enclosed layer 14 is light transmissive. The term "transparency" means at least a portion of the second order light that is transmitted through the light-emitting element 110. An exemplary material encapsulating layer 140 is a resin. The encapsulation layer 140 is attached to the upper end and the side surface of the light-emitting element 11A. The encapsulation layer mo is further attached to the lower end of the light-emitting element 110. Since the first conductor pattern 126 and the second conductor pattern t 127 have mutually opposite shapes "direction (10) and 132971.doc 200915627 1270, it is easy to cause stress in the portion between the light-emitting element 11A and the substrate i2 in the sealing layer 14". Dispersed into the forming direction of 126 〇 and 127 〇. The direction of stress dispersion is the direction of the hypothetical X-axis of Figure 7. Referring again to Figs. 1 and 2, the light-emitting member i 5 is disposed above the light-emitting element i丨〇 and fixed to the reflection member 13A. The light emitting member 15 is covered with the light emitting element 110 and the encapsulating layer 140. The light-emitting member 15 emits the second light in accordance with the first light emitted from the light-emitting element 11A. The second light has a wavelength spectrum larger than that of the second light. The light-emitting member 150 includes a matrix material and a fluorescent material. The matrix material is translucent. The term "transparency" means at least a part of the first light that can be transmitted through the light-emitting element 11A. An exemplary matrix material is an anthracene resin. The fluorescent material is excited by the i-th light emitted by the light-emitting element 11 . The light emitted by the fluorescent material penetrates the matrix material. Another exemplary conductor pattern shape will be described with reference to FIG. The second conductor pattern 226 has a first forming direction 226A and a third forming direction 2261. The first forming direction 2260 is based on the portion 2262 electrically connected to the i-th electrode 116 of the light-emitting element 11A, and the first! The direction in which the body pattern 226 extends. The first! The formation direction is the positive direction of the imaginary X-axis. The third forming direction is a direction in which the first conductor pattern 226 is further extended from the end portion of the i-th conductor pattern 226 in the first forming direction 2260. The third forming direction 2261 intersects the i-th forming direction 226A. The third forming direction 2261 is the positive direction of the imaginary y-axis. The second conductor pattern 227 has a second forming direction 2270 and a fourth forming direction 2271. The second forming direction 2270 is a direction in which the second conductor pattern 227 extends in accordance with a portion 2272 electrically connected to the second electrode 117 of the light-emitting element 11A. The second forming direction 2270 is an opposite direction to the i-th forming direction 226〇. 132971.doc •12- 200915627 2nd opening> The direction of the 2270 is the negative direction of the father's axis. The fourth forming direction 2271 is a direction in which the second conductor pattern is further extended from the end portion of the second forming direction 2270 in the second conductor pattern 227. The fourth forming direction intersects the second forming direction 2270. The fourth forming direction 2271 is the negative direction of the imaginary 乂 axis. The first conductor pattern 226 and the second conductor pattern 227 have mutually opposite forming directions 2260 and 2270. With this configuration, the light-emitting element 110 can improve the positional accuracy of the mounting step. Therefore, the light-emitting device 丨〇 can improve, for example, light-emitting characteristics such as light output. The first conductor pattern 226 and the second conductor pattern 227 further have a third forming direction 2261 and a fourth forming direction 2271. With such a configuration, the light-emitting device can improve the divergence of heat generated by the light-emitting element 110. Therefore, the light-emitting device 10 can improve the related thermal control. Portion 2262 and portion 2272 are disposed on a line 1291 passing through a center point 1290 of the mounting area 125. With this configuration, the illuminating element ιι can improve the operability of the mounting. The center point 129 is the intersection of the diagonal lines 1292 and 1293 of the rectangular mounting area 125. The first conductor pattern 226 and the second conductor pattern 227 have a point symmetry in which the center point 129 is centered. With such a configuration, the unevenness of the attenuation of the light radiated to the lower side of the light-emitting element 110 can be reduced. Therefore, the illuminating device 10 can improve the unevenness in the distribution of the illuminance intensity. Referring to Figure 12, the shape of another exemplary conductor pattern is illustrated. The first conductor pattern 326 has a third turn forming direction 3260. The first turn is electrically connected to the second portion of the first electrode 116 of the light-emitting element 11 J J3 13297I.doc 200915627 and the direction in which the first conductive pattern 326 extends. The first! The forming direction 326 is the imaginary X-axis direction. The second conductor pattern 327 has a second forming direction 3270. The second forming direction 3270 is a direction in which the second conductor pattern 327 is extended based on a portion 3272 electrically connected to the second electrode 117 of the light-emitting element u. The second forming direction 3270 is a direction intersecting the first forming direction 3260. The second forming direction 3270 is orthogonal to the first forming direction 3260. The second forming direction 3270 is a negative direction of the y-axis.
第1導體圖案326及第2導體圖案327具有互相相交方向之 形成方向。藉由此種構造，發光元件11〇可改善有關安裝 步驟之位置精度。因此，發光裝置1〇例如可改善有關光輸 出等發光特性。 部分3262及部分3272係配置於通過在安裴區域125之中 心點1290之直線1291上。藉由此種構造，發光元件ιι〇可 改善有關安裝之可靠性。中心、點129G係矩形狀之安裝區域 125之對角線1292及1293之交點。 第1導體圖案326及第2導體圖牵总i、i a 布守菔Ε]系j27係以中心點129〇為基 準’具有點對稱之形狀。获出+德4技 一 错由此種構造，可減低有關向發 光元件110之下方放射之光之衰滅夕尤仏 兀*心衣构*之不均。因此，發光裝 置10可改善有關發光強度分佈之不均。 參照圖13及圖14，說明本發明之另 ^ +赏3义另一實施型態之發光裝 置1〇。另一實施型態之發 在11〇係含有圖13所示之發光 元件410，以取代圖3所示之發光元件ιι〇 元件410係發光二極體。 例示性的發光 132971.doc -14· 200915627 發光元件410包含基板411、η型半導體層412、半導體活 性層413及ρ型半導體層414。發光元件410進一步包含透光 性導電層415、第1電極416及第2電極417。 基板411之例示性的材料為藍寶石。η型半導體層412係 積層於基板411上。發光元件41〇之積層方向係圖η之上方 • 向。即’積層方向係假想之ζ軸之負方向。半導體活性層 413係積層於η型半導體層412上。ρ型半導體層414係積層 於半導體活性層41 3上。 f ： ^ 透光性導電層41 5係形成於ρ型半導體層114上。所謂導 電層415之”透光性"，係指可穿透半導體活性層413所放射 之光之至少一部分。第丨電極416係形成於透光性導電層 415上。第丨電極416係發光元件41〇之陽極電極。第2電極 417係形成於„型半導體層412上。第2電極417係發光元件 410之陰極電極。 發光元件410含有含第1電極416及第2電極417之安裝面 Ο 418第1電極416及第2電極417設於矩形狀之安裝面418之 對角位置。 如圖14所示，第1導體圖案426及第2導體圖案427係包含 * 於發光元件410之安裝區域425。 帛1導體圖案426具有第1形成方向4260。第1形成方向 4260係以電性連接於發光元件之第1電極416之部分 '、準而使第1導體圖案426延伸之方向。第1形成 "〇係假想之X軸之正方向。部分4262位於第1導體圖 案426之端部。端部包含設計上之餘裕之部分。所謂端 I32971.doc -15- 200915627 部，並不限於含設計上之餘裕之部分，也包含不含設計上 之餘裕之構造。 第2導體圖案427具有第2形成方向427〇。第2形成方向 4270係以電性連接於發光元件41〇之第2電極417之部分 4272為基準’而使第2導體圖案427延伸之方向。第2形成 方向4270係假想之乂軸之負方向。部分4272位於第2導體圖 案427之端部。 第1導體圖案426及第2導體圖案427配置於與第1形成方 向4260及第2形成方向4270相交之方向。第}導體圖案426 及第2導體圖案427配置於假想之y軸方向。部分“Μ及部 刀4272 0又於矩形狀之安裝區域425之對角位置。 第1導體圖案426及第2導體圖案427具有互相相反之形成 方向。藉由此種構造，發光元件41〇可改善有關安裝步驟 之位置精度。因此，發光裝置1〇例如可改善有關光輸出等 發光特性。 部分4262及部分4272係配置於通過在安裝區域4乃之中 心點4290之直線4291上。藉由此種構造，發光元件41〇可 改善有關安裝之可靠性。中心點429〇係矩形狀之安裝區域 125之對角線4292及4293之交點。 第1導體圖案426及第2導體圖案427係以中心點429〇為中 ^具有點對稱之形狀。藉由此種構造，可減低有關向發 光元件410之下方放射之光之衰減之不均。因此，發光裝 置10可改善有關發光強度分佈之不均。第！導體圖案426及 第2導體圖案427係以中心點4290為中心之線對稱之形狀。 132971.doc • 16 - 200915627 本發明可在不脫離其精神或主要特徵之情況下，以其他 各種型態實施。因此，前述之實施型態在所有點中僅不過 疋單純之例不而已，本發明之範圍揭示於申請專利範圍， 不受專利說明書本文任何拘束。再者，申請專利範圍所屬 之變形及變更均在本發明之範圍内。 【圖式簡單說明】 本發明之目的、特色及優點將可由下列之詳細說明與圖 式獲得更明確之瞭解。 圖1係表示本發明之一實施型態之發光裝置丨0。 圖2係表示圖1所示之發光裝置〖〇之内部構造。 圖3係表示圖2所示之發光元件11 〇。 圖4係表示圖1及圖2所示之基體12〇。 圖5係在圖4中符號V所示之部分之放大圖。 圖6係表示發光元件丨丨〇之安裝構造之剖面圖。 圖7係表示第1導體圖案ι26及第2導體圖案127之配置。 圖8係表示第1導體圖案126。 圊9係表示第2導體圖案127。 圖1〇係表示第1導體圖案126及第2導體圖案127之配置。 圖U係表示另一例示性的導體圖案226及227。 圖12係表示另一例示性的導體圖案326及327。 圖13係表示本發明之另一實施型態之發光裝置丨〇之發光 元件4 1 〇。 圖1 4係表示本發明之另一實施型態之發光裝置1 〇之第1 導體圖案426及第2導體圖案427。 132971.doc -17- 200915627 【主要元件符號說明】 10 發光裝置 110、410 發光元件 116、416 第1電極 117、417 第2電極 118、418 安裝面 120 基體 126、326、426 第1導體圖案 127、327、427 第2導體圖案 130 反射構件 140 封入層 150 發光構件 1260、3260、4260 第1形成方向 1270、3270、4270 第2形成方向 132971.doc - 18-The first conductor pattern 326 and the second conductor pattern 327 have a direction in which the mutually intersecting directions are formed. With this configuration, the light-emitting element 11 can improve the positional accuracy of the mounting step. Therefore, the light-emitting device 1 can improve, for example, light-emitting characteristics such as light output. Portion 3262 and portion 3272 are disposed on a line 1291 passing through a center point 1290 of the ampoule region 125. With this configuration, the light-emitting element ιι can improve the reliability of the mounting. The center and the point 129G are the intersections of the diagonal lines 1292 and 1293 of the rectangular mounting area 125. The first conductor pattern 326 and the second conductor pattern are i, i a 菔Ε 菔Ε 系 系 系 系 系 系 系 系 27 27 27 27 27 ’ ’ ’ ’ ’ ’ ’ ’ ’ 。 。 。 。 。 。 。 。 By the fact that the structure is obtained, the unevenness of the light emitted to the lower side of the light-emitting element 110 can be reduced, and the unevenness of the heart-shaped structure can be reduced. Therefore, the illuminating device 10 can improve the unevenness in the distribution of the illuminance intensity. Referring to Fig. 13 and Fig. 14, a light-emitting device 1 of another embodiment of the present invention will be described. Another embodiment of the present invention includes the light-emitting element 410 shown in Fig. 13 in place of the light-emitting element ιι member 410 shown in Fig. 3 as a light-emitting diode. Exemplary Light Emitting 132971.doc -14· 200915627 The light emitting element 410 includes a substrate 411, an n-type semiconductor layer 412, a semiconductor active layer 413, and a p-type semiconductor layer 414. The light-emitting element 410 further includes a light-transmitting conductive layer 415, a first electrode 416, and a second electrode 417. An exemplary material of the substrate 411 is sapphire. The n-type semiconductor layer 412 is laminated on the substrate 411. The stacking direction of the light-emitting element 41 is above the pattern η. That is, the 'stacking direction is the negative direction of the imaginary axis. The semiconductor active layer 413 is laminated on the n-type semiconductor layer 412. The p-type semiconductor layer 414 is laminated on the semiconductor active layer 41 3 . f : ^ The light-transmitting conductive layer 41 5 is formed on the p-type semiconductor layer 114. The "transparency" of the conductive layer 415 means at least a part of the light that can be transmitted through the semiconductor active layer 413. The second electrode 416 is formed on the light-transmitting conductive layer 415. The second electrode 416 is light-emitting. The anode electrode of the element 41. The second electrode 417 is formed on the „type semiconductor layer 412. The second electrode 417 is a cathode electrode of the light-emitting element 410. The light-emitting element 410 includes a mounting surface 含 418 including the first electrode 416 and the second electrode 417. The first electrode 416 and the second electrode 417 are disposed at diagonal positions of the rectangular mounting surface 418. As shown in FIG. 14, the first conductor pattern 426 and the second conductor pattern 427 include * mounting regions 425 of the light-emitting elements 410. The 帛1 conductor pattern 426 has a first forming direction 4260. The first forming direction 4260 is a direction in which the first conductor pattern 426 extends in a portion that is electrically connected to the portion of the first electrode 416 of the light-emitting element. The first formation " the positive direction of the X-axis of the imaginary. The portion 4262 is located at the end of the first conductor pattern 426. The end contains a portion of the design. The so-called end I32971.doc -15- 200915627 is not limited to the design with the margin, but also contains no design margin. The second conductor pattern 427 has a second forming direction 427 〇. The second forming direction 4270 is a direction in which the second conductor pattern 427 is extended based on a portion 4272 electrically connected to the second electrode 417 of the light-emitting element 41A. The second formation direction 4270 is the negative direction of the imaginary 乂 axis. The portion 4272 is located at the end of the second conductor pattern 427. The first conductor pattern 426 and the second conductor pattern 427 are arranged in a direction intersecting the first forming direction 4260 and the second forming direction 4270. The first conductor pattern 426 and the second conductor pattern 427 are arranged in a virtual y-axis direction. The portion "the knives and the knives 4272 0 are in a diagonal position of the rectangular mounting region 425. The first conductor pattern 426 and the second conductor pattern 427 have mutually opposite forming directions. With this configuration, the light-emitting element 41 can be used. The positional accuracy of the mounting step is improved. Therefore, the light-emitting device 1 can improve, for example, light-emitting characteristics such as light output. The portion 4262 and the portion 4272 are disposed on a straight line 4291 passing through the center point 4290 of the mounting region 4, thereby The light-emitting element 41 〇 can improve the reliability of the mounting. The center point 429 is the intersection of the diagonal lines 4292 and 4293 of the rectangular mounting area 125. The first conductor pattern 426 and the second conductor pattern 427 are centered. The point 429 is a shape having a point symmetry. With this configuration, the unevenness of the attenuation of the light radiated to the lower side of the light-emitting element 410 can be reduced. Therefore, the light-emitting device 10 can improve the uneven distribution of the luminous intensity. The first conductor pattern 426 and the second conductor pattern 427 are in line symmetry centered on the center point 4290. 132971.doc • 16 - 200915627 The present invention can be carried out without departing from the spirit or the main In the case of the features, the various embodiments are implemented. Therefore, the foregoing embodiments are merely examples of all the points, and the scope of the present invention is disclosed in the patent application, and is not limited by the patent specification. The scope of the present invention is to be construed as being limited by the following detailed description and drawings. Fig. 2 is a view showing the internal structure of the light-emitting device shown in Fig. 1. Fig. 2 is a view showing the internal structure of the light-emitting device shown in Fig. 2. Fig. 3 is a view showing the light-emitting element 11 shown in Fig. 2. Fig. 5 is an enlarged view of a portion indicated by a symbol V in Fig. 4. Fig. 6 is a cross-sectional view showing a mounting structure of a light-emitting element 。. The arrangement of the first conductor pattern 126 and the second conductor pattern 127. Fig. 8 shows the first conductor pattern 126. The 圊9 series shows the second conductor pattern 127. Fig. 1 shows the first conductor pattern 126 and the second conductor pattern 127. Configuration. Figure U is a table Another exemplary conductor pattern 226 and 227 is shown in Fig. 12. Fig. 12 shows another exemplary conductor pattern 326 and 327. Fig. 13 is a view showing a light-emitting element 4 1 of a light-emitting device according to another embodiment of the present invention. Fig. 1 is a view showing a first conductor pattern 426 and a second conductor pattern 427 of a light-emitting device 1 according to another embodiment of the present invention. 132971.doc -17- 200915627 [Description of main components] 10 illuminating device 110, 410 light-emitting elements 116, 416 first electrodes 117, 417 second electrodes 118, 418 mounting surface 120 bases 126, 326, 426 first conductor patterns 127, 327, 427 second conductor pattern 130 reflective member 140 encapsulation layer 150 light-emitting member 1260 , 3260, 4260 1st forming direction 1270, 3270, 4270 2nd forming direction 132971.doc - 18-