JP4182784B2 - Light emitting device and manufacturing method thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a light-emitting device that emits light emitted from a light-emitting diode (hereinafter referred to as “LED”) in a predetermined direction and range via an optical system, and a method of manufacturing the same. The present invention relates to a light emitting device that can be made large and has excellent light collecting properties and a method for manufacturing the same.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, there is a light emitting device that uses an LED chip as a light source and reflects light emitted from the light source by an optical system provided close to the light source and emits the light in a predetermined direction (for example, Patent Document 1). reference.).
[0003]
FIG. 7 shows a light emitting device described in Patent Document 1. (A) is a longitudinal cross-sectional view centering on a light source, (b) is sectional drawing in CC section of (a).
[0004]
As shown in FIG. 7A, the light emitting device includes a light emitting element 60 that emits light, a light source 62 having a dome portion 61 and a base portion 61A provided integrally with the light emitting element 60, an incident surface 63, A lens element 72 comprising a first reflective region 64, a first reflective surface 64A, a direct conductive region 65, a second reflective region 66, an illumination surface 67, edges 68 and 69, posts 70 and 71, and a pillow lens 73A And an optical element 73 formed in an array, and the second reflective area 66 of the lens element 72 includes a pair of an extraction surface 66A and a step downs 66B around the first reflective area 64. It is formed at 360 degrees.
[0005]
As shown in FIG. 7B, the light source 62 combines the recesses 62A and 62B of the base portion 61A and the posts 70 and 71 of the lens element 72 to bring the dome portion 61 into the center of the first reflection region 64. Positioning is fixed.
[0006]
In such a configuration, when light is emitted from the light source 62, the light enters the lens element 72 from the incident surface 63. This light is reflected by the first reflecting surface 64A in the direction orthogonal to the central axis direction of the light source 62, further reflected by the extraction surface 66A in the central axis direction and emitted from the irradiation surface 67, and the light source 62. Directly enters the optical element 73 as light B that passes through the conductive region 65 and is emitted in the central axis direction. As a result, light with an enlarged irradiation range is incident on the optical element 73.
[0007]
[Patent Document 1]
WO99 / 09349 pamphlet (4th page, Fig. 2)
[0008]
[Problems to be solved by the invention]
However, according to the conventional light emitting device, since the dome portion 61 that condenses the radiated light from the light source 62 on the central axis is provided, there is a problem that the thickness is increased. In addition, since it is difficult to assemble the lens element 72 with the central axis of the light source 62 being completely coincident with each other, there is a problem that the positional deviation is likely to occur and the brightness in all directions is likely to be uneven. That is, since the light source 62 and the lens element 72 are formed separately and positioned, if the positional accuracy of the central axis of the light source 62 with respect to the first reflection region 64 of the lens element 72 is reduced, the first The amount of reflected light reflected in the total reflection direction by the reflection region 64 becomes non-uniform, and light and dark (brightness difference) occurs on the surface of the LED light. In particular, in the case of an optical system with a high degree of light collection in which most of the light emitted from the light source 62 is emitted upward, the light distribution variation of the light source 62 itself and the direction perpendicular to the central axis between the lens element 72 and the light source 62 described above. The difference in brightness due to the variation in optical characteristics due to the displacement of the position becomes remarkable.
Further, the side light that cannot be collected on the central axis by the dome 61 has a problem that the light use efficiency is reduced and the irradiation area cannot be increased. That is, light emitted from the light source 62 in the horizontal plane direction (X direction) is not reflected by the second reflection region 66, and light that is not reflected by either the first reflection region 64 or the second reflection region 66 Since there is no radiation in the Z direction, there is a disadvantage that the light efficiency is inferior.
In addition, in the light emitting device of FIG. 7A, since the light source 62 and the lens element 72 are separate, the light emitted from the light source 62 once enters the incident surface 63 of the lens element 72 after passing through the air layer. As a result, light loss may occur at the intervening air layer or interface, or dirt may accumulate at the interface between the light source 62 and the lens element 72 to impede translucency and promote light loss. Further, when a physical impact occurs, the position is likely to shift, and an optical system in which the light emitting element and the reflecting mirror are close to each other cannot be established. In addition, there are problems that the number of parts and the number of assembling processes are increased, and variation in assembling accuracy is increased.
[0009]
Further, as shown in FIG. 8A, when the light emitted from the light emitting element 60 is condensed by the dome part (condensing optical system) 61, the light emitting area of the light emitting element 60 is small and can be regarded as a point light source. The light L is sufficiently condensed. On the other hand, as shown in FIG. 8 (b), if the light emitting area of the light emitting element 60 is large, the light cannot be considered as a point light source because the light cannot be sufficiently collected.
[0010]
Therefore, an object of the present invention is to effectively utilize without causing loss of light emitted from a light emitting source, to increase light intensity and to irradiate light condensed in a desired direction and range. It is an object to provide a light emitting device that can be manufactured and a method for manufacturing the same.
[0011]
[Means for Solving the Problems]
In order to achieve the above object, the present invention is arranged in a light emitting element, a power supply unit that supplies power to the light emitting element, and a region that makes a large angle with respect to the central axis of the light emitting element with the light emitting element as an origin. A second optical unit having a first optical unit, a reflective surface disposed opposite to the light emitting surface side of the light emitting element, and a radiation surface that externally radiates light emitted from the light emitting element and reflected by the reflective surface. The first optical unit refracts light emitted from the light emitting element in a direction perpendicular to the central axis, and is about 55 to 90 degrees with respect to the central axis. A convex curved surface that refracts light radiated in a direction perpendicular to the central axis, and the second optical unit has the light emitting element as an origin and is perpendicular to the central axis of the light emitting element. A part of a parabola with a symmetric axis as the axis of symmetry Radiation and the top surface reflecting surfaces forming a 360-degree circular reflector shape is rotated around the light totally reflected by the upper surface reflective surface laterally Formed parallel to the central axis A side radiation surface, and the height of the central axis direction is such that the bottom of the upper surface reflecting surface is higher than the upper end of the convex curved surface of the first optical unit and is perpendicular to the central axis. The second optical Part is , All light emitted from the light emitting element and emitted within 90 degrees with respect to the central axis reaches either the convex curved surface of the first optical unit or the upper surface reflecting surface of the second optical unit. , Larger than the dimension of the first optical part Formed, The first optical unit and the second optical unit provide a light emitting device that emits light emitted from the light emitting element as externally parallel light in a direction substantially perpendicular to a central axis of the light emitting element. To do.
[0012]
According to such a configuration, the emission direction is appropriately controlled according to the light distribution of the light emitted from the light emitting element.
[0013]
In order to achieve the above object, the present invention In manufacturing the light emitting device, A first step of forming a power supply unit, a second step of mounting a light emitting element on the power supply unit, and an element housing unit that covers and integrally houses the light emitting element are provided to collect light. And a light condensing surface for radiating in a direction perpendicular to the central axis of the light emitting element is formed. First optical part And a reflection surface that totally reflects the light and emits it in the direction. Second optical part And a third step of positioning the optical unit with respect to the power supply unit, and a fourth step of bonding and fixing the optical unit and the power supply unit so that the light emitting element is surrounded by the element housing unit. And a manufacturing method of a light-emitting device.
[0014]
According to such a configuration, the light emission direction according to the size of the light emitting element and the light distribution characteristic is selectively given based on the coupling with the lens.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
[0016]
FIG. 1 is a longitudinal sectional view of the light emitting device according to the first embodiment.
In the following description, a coordinate system is defined in which the central axis of the light emitting element is the Z axis, the upper surface position of the light emitting element on the Z axis is the origin, and the origin is provided with an X axis and a Y axis orthogonal to the Z axis. . However, the Z axis is also referred to as the optical axis Z.
[0017]
Condensation means condensing in a direction perpendicular to the Z axis, and condensing in a direction having a predetermined angle with respect to the Z axis, in addition to condensing light in a spot shape in the Z axis direction. Shall be included.
[0018]
The light-emitting device 1 includes an insulating layer 6A, a base material 6B made of a good heat conductor such as aluminum, a substrate 6 having wiring patterns 3A and 3B provided on the surface of the insulating layer 6A, and a wiring pattern 3A. The light emitting element 4 to be face-up bonded, the bonding wire 7 that electrically connects the electrode portion (not shown) of the light emitting element 4 and the wiring patterns 3A and 3B, and the light emitting element 4 and the bonding wire 7 are surrounded. The optical unit 5 is externally fixed to the substrate 6.
[0019]
The wiring patterns 3A and 3B are obtained by etching a copper foil layer bonded to the base material 6B via the insulating layer 6A to form a predetermined circuit pattern. Moreover, the positioning recessed part for carrying out uneven | corrugated fitting with the convex part provided in the optical part 5 is formed based on the etching process.
[0020]
The light emitting element 4 is formed to emit light in a blue color of 450 nm to 480 nm using, for example, a gallium nitride compound semiconductor such as GaN, GaAlN, InGaN, InGaAlN, or ZnSe (zinc selenide). The light emitting element 4 has a chip size of 300 × 300 μm and emits light mainly from the electrode forming surface and side surfaces. Since the element structure of the blue LED is a well-known technique, a detailed description thereof is omitted.
[0021]
The optical unit 5 is formed by injection molding a light-transmitting resin having a relatively high refractive index, such as polycarbonate resin. The optical unit 5 is provided so as to surround the light-emitting element 4 and emits light in a substantially horizontal direction perpendicular to the Z axis. A first optical unit 51 that collects light in the X-axis direction, and a second optical unit that is provided integrally with the first optical unit 51 and that emits light in a substantially horizontal X-axis direction orthogonal to the Z-axis based on total reflection. The optical unit 52 and an element accommodating unit 50 that is formed in a recessed shape below the first optical unit 51 and surrounds the light emitting element 4 and the bonding wire 7. The element accommodating unit 50 is located between the light emitting element 4 and the element accommodating unit 50. The shape and size are as small as possible so that the gap 5B is formed as small as possible.
[0022]
The optical unit 5 is positioned and fixed at a predetermined position with respect to the substrate 6 on which the light emitting element 4 is mounted. Although not shown in the figure, this positioning is performed based on the concave-convex fitting between the concave portion formed on the substrate 6 and the convex portion formed on the optical unit 5. In addition, you may make it fix with sufficient position accuracy by another positioning method.
[0023]
The first optical unit 51 is provided so as to surround the light emitting element 4 and refracts light in a direction perpendicular to the optical axis Z. The direction from about 55 degrees to 90 degrees with respect to the Z axis. And a convex curved surface that refracts the light emitted in the direction perpendicular to the Z axis. That is, it has an axis of symmetry on the X axis, and the distance from the origin to the center of the ellipse is D ₁ , Diameter in the X-axis direction is n · D ₁ , The diameter in the Z-axis direction is √ (n ² -1) D ₁ The ellipse is rotated around the Z axis. Note that n is the refractive index of the lens material, and in the case of epoxy resin or polycarbonate resin, n≈1.5. D ₁ Is an arbitrary value that determines the similarity ratio.
[0024]
The second optical unit 52 has a circular reflection shape in which a part of a parabola with the X axis as a symmetry axis is rotated 360 degrees around the Z axis with the above-described origin of the light emitting element 4 as a focal point. Side surface emitting surface 5E that radiates the light totally reflected by the upper surface reflecting surface 5D formed within an angle range of 55 degrees or less with respect to the axis and the cylindrical upper surface reflecting surface 5D centering on the Z axis in the side surface direction. And have. Note that a flat surface for extracting light in the Z-axis direction may be provided at the center of the second optical unit 52 according to the application.
[0025]
As shown in FIG. 1, the position and size relationship between the first optical unit 51 and the second optical unit 52 are such that all the light emitted from the light emitting element 4 and emitted within 90 degrees with respect to the Z axis is the first. What reaches either the lens surface of the first optical unit 51 or the upper surface reflecting surface 5D of the second optical unit 52, and the light reflected by the upper surface reflecting surface 5D of the second optical unit 52 reaches the side radiation surface 5E (In the height in the Z-axis direction, the bottom of the upper surface reflection surface 5D is higher than the upper end of the lens surface of the first optical unit 51). For this reason, the diameter of the second optical unit 52 is larger than the diameter of the first optical unit 51.
[0026]
In order to manufacture such a light emitting device 1, first, the wiring patterns 3A and 3B are formed by etching the substrate 6 having the copper foil layer on the surface. Next, the light emitting element 4 is face-up bonded to the surface of the wiring pattern 3A. Next, the electrode part (not shown) of the light emitting element 4 and the wiring patterns 3A and 3B are electrically connected by the bonding wire 7.
[0027]
The optical unit 5 is formed in a separate process. First, the optical part 5 having the element accommodating part 50 in the shape as shown in FIG. 1 is injection-molded by filling a light-transmitting resin into a mold according to the lens shape. In addition, the positioning convex portions are molded together during resin molding.
[0028]
Next, both are positioned and fixed so that the convex part of the optical part 5 and the concave part provided in the wiring patterns 3A and 3B are fitted. At this time, a transparent silicon resin is injected into the element housing portion 50. Next, the optical part 5 is put on the wiring patterns 3A and 3B to be bonded and fixed, and the light emitting element 4 is sealed with silicon.
[0029]
The operation of the light emitting device according to the first embodiment will be described below.
[0030]
A drive unit (not shown) applies a drive voltage to the wiring patterns 3A and 3B. The light emitting element 4 emits light based on the driving voltage and emits blue light. The blue light emitted from the light emitting element 4 is reflected in the range of about 60 degrees from the Z-axis to the upper surface reflecting surface 5D of the second optical unit 52 and is incident perpendicularly on the side emitting surface 5E. Radiated externally in a direction perpendicular to the axis. In addition, light in a range from about 60 degrees to 90 degrees with respect to the Z axis reaches the first optical unit 51, is condensed by the lens, and is emitted in a direction perpendicular to the Z axis. In this way, substantially all of the blue light emitted from the light emitting element 4 is externally emitted in the direction orthogonal to the Z axis based on total reflection and the lens.
[0031]
According to the first embodiment described above, the following effects are obtained.
(1) The thickness with respect to the diameter of the light source (the light emitting element 4 and the optical unit 5) can be formed thin.
(2) The side surface is affected by a deviation in the light distribution characteristics of the light source due to an axial deviation between the light source and the lens element and a positional deviation between the light emitting element 4 and the optical unit 5 (which becomes more conspicuous as the condensing degree of the condenser lens is higher). In principle, it is possible to prevent the light distribution characteristic of the light emitted in the direction from becoming unstable, and to obtain a stable light distribution characteristic.
(3) The radiation efficiency in the side surface direction can be improved. That is, the side light that cannot be collected on the central axis by the dome portion is based on the fact that the light use efficiency is reduced and it is difficult to increase the irradiation area, or that the light source and the lens element are formed separately. It is possible to optically control almost all of the light emitted from the light emitting element 4 without the occurrence of light loss at the interface of the air layer, the occurrence of light loss at the interface, and the loss of light due to dirt accumulation at the interface between the light source and the lens element. .
(4) The incident angle of light from the light emitting element 4 to the first optical unit 51 when radiated from the light emitting element 4 and externally radiated, reflected from the light emitting element 4 by the upper reflecting surface 5D, and reflected on the side radiation surface 5E The incident angle of the incident light is set to 35 degrees or less where the interface reflectivity is not increased with the material of n = 1.5 (excluding the top reflection surface using total reflection), and the interface reflection loss is small. can do. Further, since the basic optical system can optically control almost all the light emitted from the light emitting element 4, the radiation efficiency may not be reduced even if the diameter is reduced, or the radiation efficiency reduction rate may be low. it can.
(5) Since the first optical unit 51 and the second optical unit 52 for realizing side emission are integrally formed, the optical system is not displaced with respect to the light emitting element 4 due to physical impact or the like. In addition, there is no increase in the number of parts or the assembly process, or a large variation in assembly accuracy.
[0032]
The first optical unit is slightly affected by interface reflection, but θ = sin with respect to the Z axis. ^-1 (1 / n) can be formed, and when n = 1.5, it can be formed up to about 40 degrees. For this reason, in order to optically control substantially the total luminous flux emitted from the light emitting element, it is necessary to form a reflecting surface covering from the light emitting element 4 to about 40 degrees with respect to the Z axis. In general, the range of about 40 degrees with respect to the Z axis is a region where the radiation intensity from the light emitting element 4 is high.
[0033]
Covering the aforementioned area widely with a reflecting surface is advantageous in terms of the external radiation efficiency of light. That is, the angle range in which the first optical unit 51 can be optically controlled is limited, and if the first optical unit 51 is made large, interface reflection loss is likely to occur at the end (a high position in the Z-axis direction).
[0034]
In addition, the 1st optical part 51 is not limited to what radiates | emits the light parallel to the direction orthogonal to a Z-axis outside, For example, you may radiate | emit condensed radiation with the extent of about 30 degree range. In this case, the first optical part 51 can be formed up to about 35 degrees with respect to the Z axis as a range in which the interface reflection does not become large.
[0035]
Moreover, if it has the influence of interface reflection, it can be formed up to about 20 degrees with respect to the Z axis. The reflection surfaces in the range to be formed at this time are about 35 degrees and about 20 degrees with respect to the Z axis, respectively. However, since it is difficult to form an edge on the molding at a location where the optical surface is discontinuous and molding accuracy may be lowered due to the occurrence of sink marks, the range where the radiation intensity from the light emitting element 4 is large is a reflective surface. It is desirable to cover widely with. Therefore, it is desirable that the reflecting mirror is formed up to a range of 40 degrees or more with respect to the Z axis.
[0036]
Further, the second optical unit 52 may also radiate and radiate light with a certain degree of spread, like the first optical unit 51.
[0037]
In the above-described first embodiment, the configuration using the light emitting element 4 that emits blue light has been described. However, the light emitting element 4 that emits red light, green light, or ultraviolet light other than blue light is used. The configuration may be acceptable. Further, as the light emitting element 4, a large chip of large output type (for example, 1000 × 1000 μm) can be used. Since the distance between the light emitting element 4 and the upper reflecting surface 5D is relatively long, about 1/2 or more of the radius of the optical part 5, it is excited by the large size light emitting element 4 or the blue light emitted from the light emitting element 4. A yellow phosphor that radiates yellow light is arranged around the light emitting element 4, and even when the light source size is increased, as in the case where white light is obtained by mixing blue light and yellow light, the total amount on the upper reflecting surface 5D is reduced. Reflection can be used.
[0038]
The optical unit 5 is not limited to a transparent one, and may be colored. In addition, although it has been described that the light is condensed and radiated as substantially parallel light in a direction orthogonal to the Z axis, it is effective as long as it effectively radiates externally to a predetermined annular range. The light may be radiated to the outside in the direction substantially perpendicular to the Z-axis at about 45 degrees or more as light that is not parallel light but spread.
[0039]
FIG. 2 is a longitudinal sectional view of the light emitting device according to the second embodiment.
This light-emitting device 1 has a structure in which a large chip of 1000 × 1000 μm is flip-chip bonded as a light-emitting element 4 via bumps 4A, and the light-emitting element 4 is surrounded by an element housing part 50 of the optical unit 5. The portion 50 is configured such that a phosphor layer 5A made of Ce: YAG (yttrium, aluminum, garnet) that emits yellow light by being excited by blue light emitted from the light emitting element 4 is thinly formed on the inner peripheral surface. This is different from the first embodiment. The element accommodating portion 50 is formed in a shape and size that make the gap formed between the light emitting element 4 as small as possible.
[0040]
According to the second embodiment described above, the element housing portion 50 is provided in the external optical portion 5, and the phosphor layer 5 </ b> A is thinly provided on the inner peripheral surface of the element housing portion 50 to integrally surround the light emitting element 4. As a result, white light can be obtained. Further, in addition to the preferable effect of the first embodiment, the phosphor layer 5A can be formed uniformly and thinly. Further, since the phosphor layer 5A having a uniform thickness can be formed, it is possible to prevent a decrease in luminous intensity due to light absorption. Further, even if the large-sized light emitting element 4 is used, the size expansion of the light source due to the thickness of the phosphor layer 5A can be minimized, so that the radiation efficiency to the outside can be increased and good light condensing performance can be obtained. Can be granted.
[0041]
FIG. 3 shows a light emitting device according to the third embodiment, wherein (a) is a longitudinal sectional view and (b) is a DD section of (a).
[0042]
The light-emitting device 1 includes leads 2A and 2B made of a conductive material such as a copper alloy as a power supply unit for mounting a large-sized light-emitting element 4, and wiring patterns 3A on the surface provided on the element mounting side of the leads 2A and 2B. And 3B, and a light emitting element 4 that is flip-chip bonded to the wiring patterns 3A and 3B via bumps 4A.
[0043]
The submount 3 is formed of a high thermal conductivity material such as AlN, and the light emitting element 4 is flip-chip bonded to the wiring patterns 3A and 3B of copper foil formed on the surface via bumps 4A. The wiring pattern 3A is electrically connected to the lead 2A, and the wiring pattern 3B is electrically connected to the lead 2B via a via hole (not shown).
[0044]
The optical unit 5 is positioned and fixed at a predetermined position with respect to the leads 2A and 2B on which the light emitting element 4 is mounted based on the concave / convex fitting. In addition, a thin phosphor layer 5 </ b> A is provided on the inner peripheral surface of the element housing portion 50. As shown in FIG. 3B, the element housing portion 50 is formed with a size that makes the gap 5 </ b> B formed between the light-emitting element 4 as small as possible.
[0045]
In order to manufacture such a light emitting device 1, first, leads 2A and 2B are formed by punching a metal material. Further, indentations are formed for positioning convex portions during punching of the leads 2A and 2B. Next, the submount 3 is formed of a high thermal conductivity material on the element mounting side of the leads 2A and 2B. Next, predetermined wiring patterns 3A and 3B made of copper foil are formed on the surface of the submount 3. Next, the light emitting element 4 is flip-chip bonded to the predetermined positions of the wiring patterns 3A and 3B via the bumps 4A.
[0046]
The optical unit 5 is formed in a separate process. First, the optical part 5 having the first optical part 51, the second optical part 52 (not shown), and the element housing part 50 is injection-molded by filling a mold corresponding to the lens shape with a light transmitting resin. . Further, the positioning concave portion is molded together with resin molding. Next, the phosphor layer 5A is formed by thinly applying a phosphor to the element housing portion 50.
[0047]
Next, they are positioned and fixed so that the concave portion provided in the optical unit 5 and the convex portion provided in the leads 2A and 2B are fitted. At this time, a transparent silicon resin is injected into the element housing portion 50. Next, the optical part 5 is placed on the leads 2A and 2B to be bonded and fixed, and the light emitting element 4 is sealed with silicon.
[0048]
According to the third embodiment described above, since the large-sized light-emitting element 4 is mounted on the wiring patterns 3A and 3B on the submount 3, the heat generated due to the lighting of the light-emitting element 4 can be generated quickly and efficiently in the leads 2A and 2B. It is possible to transfer heat to the element, and it is possible to cope with an increase in output with a margin, and it is possible to suppress heat shrinkage in the element housing portion 50 and to provide stable operability and to improve reliability. . Note that the light-emitting element 4 may have a chip size of 300 × 300 μm described in the first embodiment. In this case, the light condensing property is improved by reducing the light source size. The light intensity in the irradiation range can be increased.
[0049]
FIG. 4 shows an element housing portion of the lens according to the fourth embodiment. In the optical unit 5, an element housing portion 50 that surrounds the light emitting element 4 is formed in a rectangular shape that is substantially the same as the outer shape of the light emitting element 4.
[0050]
According to the fourth embodiment described above, since the gap 5B between the light emitting element 4 and the phosphor layer 5A can be made smaller, the increase in the light source size can be more effectively suppressed, and the light is thereby emitted. The light condensing property can be further enhanced.
[0051]
5A and 5B show a light emitting device according to the fifth embodiment. FIG. 5A is a longitudinal sectional view, and FIG. 5B is an EE cross section of FIG.
[0052]
The light emitting device 1 is configured by flip chip bonding a red light emitting element 40 and a plurality of blue light emitting elements 41 to wiring patterns 3A, 3B, and 3C on a submount 3.
[0053]
As shown in FIG. 5B, eight blue light emitting elements 41 are arranged around the red light emitting element 40. Each of the red light emitting element 40 and the blue light emitting element 41 has a chip size of 300 × 300 μm.
[0054]
The phosphor layer 5A is made of Ce: YAG that is excited based on the blue light emitted from the blue light emitting element 41 and emits yellow light.
[0055]
According to the fifth embodiment described above, in addition to the preferable effects of the first embodiment, blue light emitted from the blue light emitting element 41 and yellow emitted from the phosphor layer 5A excited by the blue light. White light is obtained by mixing with light, and white light with high color rendering properties can be obtained by adding red light emitted from the red light emitting element 40.
[0056]
As another configuration in which a plurality of light emitting elements are provided, for example, a fluorescent light in which an ultraviolet light emitting element 41 is disposed around a red light emitting element 40 instead of the blue light emitting element 41 and red, blue, and green phosphors are mixed. White light may be obtained based on passing ultraviolet light through the body layer 5A. Further, instead of providing the red light emitting element 40, nine ultraviolet light emitting elements 41 may be provided.
[0057]
FIG. 6 is a longitudinal sectional view of a light emitting device according to a sixth embodiment.
In the light emitting device 1, the step-shaped portion 5 </ b> F is provided in the second optical portion 52 of the optical portion 5 described in the first embodiment.
[0058]
According to the sixth embodiment described above, since the resin layer of the optical part 5 can be made substantially uniform, the moldability is improved, and the distortion of the optical surface shape due to sink marks or the like can be kept low. Moreover, the cooling time for the thick part can be eliminated, so that the mass productivity is improved. In addition, the amount of necessary resin can be reduced, and the cost can be reduced. The staircase shape portion 5F is not limited to the illustrated shape and the number of steps. Further, the present invention can be applied to a configuration having the light emitting element 4 that is flip-chip bonded to the wiring patterns 3A and 3B. Further, by using the large size light emitting element 4, the luminous intensity can be increased.
[0059]
【The invention's effect】
As described above, according to the light emitting device and the method for manufacturing the same of the present invention, the first optical system disposed in a region that forms a large angle with respect to the central axis of the light emitting element, the reflective surface, and the radiation surface. Since the light emitted from the light emitting element in the second optical system is externally radiated in a direction substantially perpendicular to the central axis of the light emitting element, it is effectively utilized without causing loss of light emitted from the light emitting source. In addition, the luminous intensity can be increased and the light condensed in a desired direction and range can be irradiated.
[Brief description of the drawings]
FIG. 1 is a longitudinal sectional view of a central portion of a light emitting device according to a first embodiment of the present invention.
FIG. 2 is a longitudinal sectional view of a central portion of a light emitting device according to a second embodiment.
FIGS. 3A and 3B show a part of a light-emitting device according to a third embodiment (around the first optical unit), where FIG. 3A is a longitudinal sectional view of the central portion, and FIG. 3B is a DD section of FIG. FIG.
FIG. 4 is a partial cross-sectional view of an element housing portion of a light emitting device according to a fourth embodiment.
FIGS. 5A and 5B show a part of the light-emitting device according to the fifth embodiment (around the first optical unit), where FIG. 5A is a longitudinal sectional view of the central portion, and FIG. 5B is an EE portion of FIG. FIG.
FIG. 6 is a longitudinal sectional view of a central portion of a light emitting device according to a sixth embodiment.
FIG. 7A is a longitudinal sectional view showing a conventional light emitting device.
(B) is a fragmentary sectional view in CC section of (a).
FIG. 8A is a diagram showing the light collecting property when the light source size is small.
(B) is a figure which shows the condensing property in case a light source size is large.
[Explanation of symbols]
1. Light emitting device 2A, lead 2B, lead 3, submount
3A, wiring pattern 3B, wiring pattern 4A, bump
4, light emitting element 5, optical part 5A, phosphor layer 5B, gap
5D, top reflective surface 5E, side radiation surface 5F, staircase shape part
6, substrate 6A, insulating layer 6B, base material 7, bonding wire
40, red light emitting element 41, blue light emitting element
50, element housing part 51, first optical part 52, second optical part
60, light emitting element 61, dome part 61A, base part 62, light source
63, incident surface 64, reflection region 64A, reflection surface 65, direct conduction region
66, reflection area 66A, extraction surface 67, irradiation surface 68, edge
70, post 72, lens element 73, optical element 73A, pillow lens

Claims (11)

A light emitting element;
A power supply for supplying power to the light emitting element;
A first optical unit disposed in a region having the light emitting element as an origin and a large angle with respect to a central axis of the light emitting element;
A second optical unit having a reflecting surface disposed opposite to the light emitting surface side of the light emitting element, and a radiation surface for radiating light emitted from the light emitting element and reflected by the reflecting surface to the outside,
The first optical unit refracts light emitted from the light emitting element in a direction orthogonal to the central axis, and is radiated in a direction from about 55 degrees to 90 degrees with respect to the central axis. A convex curved surface that refracts light and emits it in a direction perpendicular to the central axis;
The second optical unit has a circular reflection shape obtained by rotating a part of a parabola with the light emitting element as an origin and an axis perpendicular to the central axis of the light emitting element as a symmetry axis, 360 degrees around the central axis. An upper surface reflecting surface, and a side surface emitting surface that radiates light totally reflected by the upper surface reflecting surface in a side surface direction and is formed in parallel with the central axis ,
Regarding the height in the central axis direction, the bottom of the upper surface reflecting surface is a height equal to or higher than the upper end of the convex curved surface of the first optical unit,
With respect to the direction perpendicular to the central axis, the second optical unit is configured such that all light emitted from the light emitting element and emitted within 90 degrees with respect to the central axis is the convex curved surface of the first optical unit or the It is formed larger than the dimension of the first optical part so as to reach any one of the upper surface reflection surfaces of the second optical part ,
The light emitting device, wherein the first optical unit and the second optical unit radiate light emitted from the light emitting element as substantially parallel light in a direction substantially perpendicular to a central axis of the light emitting element.   2. The light emitting device according to claim 1, wherein the upper surface reflecting surface is formed up to a range of 40 degrees or more with respect to a central axis of the light emitting element with the light emitting element as an origin. The convex curved surface of the first optical unit is an ellipse having a symmetry axis on an axis orthogonal to the central axis and having a distance from the origin to the ellipse center of D ₁ (where D ₁ > 0). The light-emitting device according to claim 2, wherein the light-emitting device has a shape rotated around an axis. When the refractive index of the lens part is n,
The convex curved surface of the first optical unit is an ellipse having a diameter in the axial direction orthogonal to the central axis of n · D ₁ and a diameter in the central axis direction of √ (n ² −1) · D _1. The light-emitting device according to claim 3, wherein the light-emitting device has a shape rotated around a central axis.   The light emitting device according to claim 4, wherein the first optical unit includes an element housing portion that is provided close to the outer shape of the light emitting element.   6. The light emitting device according to claim 5, further comprising a silicon resin that is injected into the element housing portion and seals the light emitting element.   The light emitting device according to claim 6, wherein the light emitting element is formed by regularly arranging a plurality of light emitting elements.   The light emitting device according to claim 7, wherein the light emitting element is formed by regularly arranging a plurality of light emitting elements having different emission wavelengths. In manufacturing the light emitting device according to any one of claims 5 to 8,
A first step of forming a power supply;
A second step of mounting a light emitting element on the power supply unit;
A first optical unit provided with an element housing part that covers and integrally houses the light emitting element, and that has a condensing surface that collects light and emits it in a direction perpendicular to the central axis of the light emitting element; A third step of positioning an optical unit with respect to the power supply unit, the second optical unit including a second optical unit formed with a reflection surface that totally reflects the light and emits the light in the direction;
A method of manufacturing a light emitting device, comprising: a fourth step of bonding and fixing the optical unit and the power supply unit so that the light emitting element is surrounded by the element housing unit.   The fourth step is characterized in that the optical unit in which the phosphor layer is formed in a thin layer is bonded and fixed to the power supply unit by spraying a phosphor material on the inner peripheral surface of the element housing unit. The manufacturing method of the light-emitting device of Claim 9.   11. The method of manufacturing a light emitting device according to claim 10, wherein in the fourth step, a transparent sealing resin is injected into the element housing portion to bond and fix the optical portion and the power supply portion.

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