JP5635659B1 - Surface light emitter unit and unit connector - Google Patents

Abstract

Provided is a surface light emitter unit that increases the overall light amount while making the light amounts of a plurality of surface light emitters substantially uniform. An outer peripheral silk dam 11 having a substantially rectangular tube shape is formed on the surface of a single substrate 10 having an aluminum plate as a base layer, and light in a parallel direction is formed on the surface of the substrate 10 surrounded by the outer peripheral silk dam 11. The elliptical cylindrical surface light emitters 13 are also formed in a staggered arrangement. The hollow region surrounded by the outer peripheral silk dam 11 is filled with a light transmitting member 14 for scattering, and scatters light transmitted from the surface light emitter 13 at an angle of 0 ° or more over all directions. Since this scattered light is also transmitted to the surface light emitter 13, even when there is a defect in the amount of light emission, it is compensated. A pair of external connection terminal portions 15 a, 16 a, 15 b and 16 b are formed on the short side portion of the substrate 10. [Selection] Figure 1

Description

  The present invention relates to a surface light emitter unit in which a plurality of surface light emitters are formed on a substrate, and a unit connector used for connecting the surface light emitter units and the like. The “surface light emitter” refers to a light source having a light emission output to the outside in a planar shape.

In Patent Document 1, a pin layer is formed on a heat-resistant organic resin substrate, for example, a resin substrate containing a thermoconductive filler, a plurality of light-emitting elements are mounted, and a printed layer that increases the reflectance during light emission is further provided. A surface light emitter in which a light emitting element and the like are sealed with a sealing resin after being formed is disclosed. This surface light emitter is in a state in which the sealing resin has bitten into the pinholes remaining on the organic resin substrate. Therefore, it is said that the sealing resin has extremely high adhesiveness.
However, although this surface light emitter takes into account the thermal conductivity, the resin substrate is used as a base layer, so that the number of light emitting elements is increased in order to increase the light emission intensity, or the current flowing through the light emitting elements is increased. However, if energization is continued for a long time, there is a problem that heat dissipation is not sufficient. Further, it is difficult to prevent deformation during etching or curing of the sealing resin, and there is a problem that durability is not sufficient.

  As a technique for solving the problems of heat dissipation, deformation resistance, and durability, Patent Document 2 discloses a light-emitting diode light source unit having a base layer made of a metal substrate such as aluminum. In this light emitting diode light source unit, it is also shown that the back reflection surface is effectively used in order to increase the light emission amount (illuminance) of light emitted from the entire unit. That is, a ceramic layer is formed on the surface of a metal substrate by coating. Thereafter, surface mount pads for wiring lands and light emitting elements (light emitting diodes) are formed on the ceramic layer. Then, a resist is formed around the surface mounting pad so that the ceramic layer is exposed, leaving a blank area having a larger area than the surface mounting pad, so that the ceramic layer functions as a back reflecting surface of the light emitting diode element. To. Reflectors having reflecting surfaces are provided on both sides of the light emitting element.

JP 2001-230450 A JP 2004-265980 A

  The light-emitting diode light source unit disclosed in Patent Document 2 focuses on the point that the ceramic layer has higher reflection characteristics than a resist covered on the surface of a printed wiring board. That is, by making the ceramic layer function as a back reflecting surface of the light emitting element and further providing reflectors having reflecting surfaces on both sides of the light emitting element, the amount of emitted light is increased by a synergistic effect with the ceramic layer. It is necessary to select a ceramic material having excellent reflection characteristics, and the coating method must also be a method that can obtain a mirror-like surface. For this reason, it is difficult to reduce the manufacturing cost because a special jig is required.

Moreover, even if it is a surface light-emitting body disclosed by patent document 1, or it is a light emitting diode light source unit disclosed by patent document 2, several light sources are mounted in one board | substrate, and a large light emission area is whole. When a unit is used, uneven illumination due to each light source becomes a problem. In particular, when a reflective surface is provided around the light emitting element as in the light emitting diode light source unit disclosed in Patent Document 2, the reflection direction is fixed. Therefore, when unitizing with a large number of light sources to be mounted, if a light emission defect or the like occurs in such a light emitting element provided with a reflective surface, it cannot be supplemented with other light emitting elements. It appears as illuminance unevenness.
Thus, with this type of conventional technology, there is a risk that the yield rate decreases as the number of light sources mounted on a single substrate increases, so it is difficult to increase the area capable of surface light emission. It was.

The present invention provides a surface light emitter unit, a unit connector, and a method of manufacturing a surface light emitter unit that can solve the above problems.
The surface light emitting unit of the present invention is a surface light emitting device in which an electrode layer and a plurality of surface light emitters each emitting surface light when power is supplied through the electrode layer are formed on a surface portion of a substrate having a metal plate as a base layer. a body unit, wherein the plurality of surface light emitters are each composed of a mounted light emitting element phosphor is sealed in the translucent member for sealing was mixed, be a name has surface luminous body corners The surface of the electrode layer is formed so as to be able to scatter light between the individual surface light emitters and adjacent surface light emitters on the surface of the substrate. scattering can be dispersed abuse translucent member is filled with an angle of more than 0 degrees in all directions have been the light scattered from the surface to the surface portion of the substrate dissipated light the electrode layer towards their periphery It is characterized by being.

  In one embodiment, a cylindrical silk dam is formed at a site that is a predetermined distance inward from the outer peripheral edge of the surface portion of the substrate, and the plurality of surface light emitters are formed in a hollow region surrounded by the silk dam. The scattering light-transmitting member is formed by curing a light-transmitting resin blocked by the silk dam while in contact with all the surface light emitters. In addition, a first external connection terminal portion that is electrically connected to all the first electrode surfaces and a second external connection that is electrically connected to all the second electrode surfaces are provided on a surface portion of the substrate between the silk dam and the outer peripheral edge. Terminal portions are formed, and are configured to be electrically connectable on the same plane as the power supply mechanism or other surface light emitters through these external connection terminal portions.

In one embodiment, the first external connection terminal portion and the second external connection terminal portion are respectively connected to the power supply mechanism or the other surface via the conductive portion of a predetermined connector having a conductive portion. It is joined to the light emitter unit and electrically connected. The connector is electrically connected to the first terminal portion connected to the first external connection terminal portion, the second terminal portion connected to the second external connection terminal portion in a conductive state, and the first terminal portion. And a third terminal portion that is electrically connected to the positive terminal of the power supply mechanism or other surface light emitter unit, and a negative terminal of the power supply mechanism or other surface light emitter unit that is electrically connected to the second terminal portion. a fourth terminal portion joining in conduction with the terminal, and has a support housing for supporting integrally these terminal portions.

The manufacturing method of the present invention includes an electrode layer in which a plurality of electrode surfaces are arranged on the same plane on a surface portion of a metal plate serving as a base layer, and a plurality of surfaces that emit surface light by being fed through the electrode layer. possess a mounting layer for mounting the light emitting element, the surface of the electrode layer and the step of producing a substrate that is scattered can form the light between each of the surface light emitters and adjacent surface light emitters, wherein made from an outer peripheral end of the mounting layer is sealed by a sealing transparent member in a portion which becomes the inside by a predetermined distance, thereby forming a meaningless first Shirukudamu corner, recess surrounded by the first Shirukudamu region in a step of forming a plurality in a predetermined sequence a second Shirukudamu Ru consists translucent member which allows transmission of each light, the recessed area surrounded by each of the second Shirukudamu, implemented using a member metallic color In addition to mounting the light emitting element, By sealing the region with a light-transmitting member for sealing, the step of manufacturing the surface light emitter and filling the light-transmitting resin with the first silk dam while being in contact with all the surface light emitters Then, by curing the filled translucent resin, the light diffused from each surface light emitter toward the periphery thereof and the light scattered from the surface of the electrode layer are applied to the surface portion of the mounting layer. a method and a step of forming a scattering possible dispersion abuse translucent member in an angle of more than 0 degrees in all directions against.

Since the surface light emitter unit of the present invention uses a substrate having a metal plate as a base layer, when the number of light emitting elements or surface light emitters constituted thereby is increased, or a large current is applied to each light emitting element. Even when flowing (including the case where energization is continued for a long time), heat dissipation is ensured, and sufficient deformation resistance and durability can be ensured.
Further, the surface light emitter formed on the surface portion of such a substrate has a cylindrical shape without corner portions, and the mounted light emitting element is sealed with a light transmitting member for sealing in which a phosphor is mixed. Therefore, the light emitted from the light-emitting element becomes a predetermined color due to the light combining action with the phosphor, and is scattered from the entire surface of the sealing light-transmitting member. The amount increases. The light whose light emission amount is increased in this way is diffused almost evenly to the surrounding light transmitting member for scattering.
Since the light transmitting member for scattering has a scattering surface capable of scattering light emitted from the light transmitting member for sealing of each surface light emitter at an angle of 0 degree or more with respect to the surface portion of the substrate, a certain surface light emitter The light diffused from the sealing translucent member is repeatedly collected and scattered on the scattering surface, and it appears as if it is emitting light itself. In addition, since the scattered light (scattered light) reaches the sealing light-transmitting member of other surface light emitters, for example, even when a shortage of light emission occurs in some surface light emitters, It is compensated by scattered light gathered from the surroundings, and the occurrence of uneven illumination is suppressed. Therefore, the risk of increasing the number of surface light emitters mounted on one substrate is reduced.
This facilitates securing a large light emitting area.

  In addition, according to the unit connector of the present invention, the number of cooperation of the surface light emitter units of the present invention can be appropriately adjusted according to the application, so that it is easy to provide a light source with a light emission amount according to the required light emission area. Can be provided.

FIG. 3 is a top view of the surface light emitter unit according to the first embodiment. It is a figure which shows the manufacturing process of a board | substrate, (a) is a fragmentary sectional view of the base layer vicinity of a board | substrate, (b) is a fragmentary sectional view of the aluminum substrate with a copper foil, (c) is the top view, (d) is a top view. (E) is a top view thereof, (f) is a partial cross-sectional view showing a conductive portion, (g) is a top view thereof, and (h) is near the edge of the substrate. (I) is a top view thereof, (j) is a partial cross-sectional view showing a state where gold plating is performed, (k) is a top view thereof, (l) is a partial cross-sectional view in the vicinity of the substrate end, m) is a top view thereof. (A) is explanatory drawing of the position marked, (b) is an enlarged view of each position. (A) is a fragmentary sectional view which shows the positional relationship of a potting silk dam, (b) is a fragmentary sectional view which shows the positional relationship of an outer periphery silk dam. Explanatory drawing which shows the structural example when the center part of a potting silk dam is cut | disconnected. The fragmentary sectional view which shows the state of die bonding, (b) is the principal part top view. The fragmentary sectional view which shows the state of wire bonding, (b) is the principal part top view. The fragmentary sectional view which shows the state of potting, (b) is the principal part top view. The figure which added the state where the translucent resin was filled in the fragmentary sectional view shown in FIG. FIG. 10 is a diagram in which a state where the translucent film is filled is added to the partial cross-sectional view illustrated in FIG. 9. The top view of the surface light emitter unit provided with the translucent film. The top view of the surface-emitting-body unit which concerns on 2nd Embodiment. The top view of the surface-emitting-body unit which concerns on 3rd Embodiment. The top view of the surface light emitter unit concerning a 4th embodiment. The top view of the other surface light emitter unit according to the fourth embodiment. FIG. 10 is a top view of a surface light emitter unit according to a fifth embodiment. It is a top view of the other surface light emitter unit according to the fifth embodiment, (a) shows an example of a single row arrangement, and (b) shows an example of a double row arrangement. (A) is a front view which shows an example of the structure of a unit connector, (b) is a top view, (c) is a side view. The top view which shows the use condition example of a unit connector. The top view which shows the other use condition example of a unit connector. It is a figure which shows the other structural example of a unit connector, (a) is an external appearance perspective view, (b) is a side view, (c) is a top view.

Embodiments of the present invention will be described below with reference to the drawings.
[First Embodiment]
<Configuration of surface light emitter unit>
In this embodiment, an example of a surface light emitter unit configured using two types of silk dams will be described. The silk dam is like a cylindrical levee that is finely formed by silk printing. In the present embodiment, a substantially rectangular cylindrical silk dam is formed at a site that is a predetermined distance from the outer peripheral edge of the surface portion of the substrate. In addition, a plurality of silk dams for forming the surface light emitters are formed in the recessed regions surrounded by the silk dams. For convenience, the former silk dam is referred to as the “outer periphery silk dam” and the latter silk dam is referred to as the “potting silk dam”. Each silk dam is composed of a translucent member.

FIG. 1 is a top view of the surface light emitter unit according to the present embodiment. The surface light emitter unit 1 uses a single substrate 10 having a rectangular aluminum plate as a base layer. An outer peripheral silk dam 11 is formed near the outer peripheral end of the surface portion of the substrate 10. Further, a plurality of potting silk dams 12 each formed in an elliptic cylinder shape are formed on the surface of the substrate 10 surrounded by the outer peripheral silk dam 11 in a predetermined arrangement, for example, a staggered arrangement. The surface light emitter 13 is formed by mounting a light emitting element on the potting silk dam 12, filling with a sealing resin, and thermosetting. Between the adjacent surface light emitters, that is, between the potting silk dams 12, the light transmitting member for scattering 14 is filled. The exposed surfaces of the surface light emitter 13 and the light transmitting member for scattering 14 are coated with a light transmitting film.
Although FIG. 1 shows an example in which the surface light emitters 13 have the same direction in the major axis direction, the present invention is not limited to this example. This will be described later.

In the substrate 10, an electrode layer is formed on a base layer (aluminum plate) through an insulating film that is a light-transmitting film, and a mounting layer for mounting the surface light emitter 13 is further formed on the surface layer. The electrode layer is a layer of an electrode surface pattern that includes a plurality of first electrode surfaces to which a positive voltage is supplied and a plurality of second electrode surfaces to which a negative voltage is supplied. The electrode layer is hermetically formed between the upper layer of the base layer and the mounting layer, that is, in the lower layer of the mounting layer.
In the present embodiment, each electrode surface is formed of a copper foil according to the wiring pattern. The mounting layer is a light-transmitting protective film layer etched on the surface of the electrode layer. Therefore, the surface of the mounting layer has a metallic color and functions as a scattering surface for scattering light. The outer peripheral silk dam 11 and the potting silk dam 12 described above are formed on the surface of this mounting layer.

  Each surface light emitter 13 emits a light emitting element that emits a single color such as blue, a mounting mechanism for mounting the light emitting element in a recessed area surrounded by the potting silk dam 12, and a light emitting element that emits light from the mounted light emitting element. And a diffusion mechanism for diffusing the emitted light.

The mounting mechanism of the surface light emitter 13 includes a light-emitting element mounting portion and an electrode portion plated with gold. The light-emitting element is die-bonded to the light-emitting element mounting portion with a conductive adhesive having high light reflectivity and heat dissipation, and further wire-bonded to the electrode portion with a gold wire. The electrode part is composed of a positive electrode for applying a positive voltage and a negative electrode for applying a negative voltage. The positive electrode is electrically connected to the first electrode surface on the substrate 10 described above, and the negative electrode is electrically connected to the above-described two electrode surface.
As the conductive adhesive, an adhesive containing, as a component, a resin mixed with metal powder, in this example, an epoxy resin mixed with a predetermined amount of silver is used. Heat generated when the light emitting element is energized and emits light is transferred to the aluminum plate through the light emitting element mounting portion and the insulating film, and is radiated.

The diffusion mechanism of the surface light emitter 13 is realized mainly by sealing the periphery of the mounted light emitting element with a sealing light-transmitting member in which a phosphor of a predetermined color is mixed. The sealing member is obtained by curing a sealing resin mixed with a phosphor by heating or the like. As the phosphor, an inorganic phosphor, an organic phosphor, a fluorescent dye, a fluorescent pigment, or the like can be used. Moreover, the color of the phosphor differs depending on the color of light emitted from the surface light emitter 13. In this embodiment, a yellow phosphor is used. As described above, since the light emitting element emits blue light, high luminance white light can be obtained by the light combining action with the yellow phosphor.
As the sealing resin, a light-transmitting epoxy resin, a urea resin, an acrylic resin, or the like is selected according to the use of the surface light emitter 13, but it is bonded to a light-transmitting film laminated as an overcoat described later. In consideration of the properties, an epoxy resin is used in this embodiment. The epoxy resin is not yellowed, has a small light attenuation when transmitting light, and has sufficient adhesiveness with an epoxy resin that is overcoated after curing.

The scattering light-transmitting member 14 filled in the region excluding the surface light emitters 13 in the hollow region surrounded by the outer peripheral silk dam 11 is, for example, a light-transmitting scattering resin having a refractive index of 1.1 or more. This can be realized by thermosetting a material containing a light reflecting agent.
As the scattering resin, an acrylic resin, an epoxy resin, or the like can be used. In the present embodiment, an epoxy resin is used for the reason described above.
Examples of the light reflector include titanium oxide, alumina, barium sulfate, magnesia, aluminum nitride, boron nitride, barium titanate, kaolin, talc, calcium carbonate, zinc oxide, silica, mica powder, powdered glass, powdered nickel and At least one of powdered aluminum or a combination thereof. Thereby, although it is resin, it can be excellent in the discoloration resistance with respect to a heat | fever and light. The scattering light-transmitting member 14 eventually has a scattering surface that can scatter light emitted from each surface light emitter 13 at an angle of 0 degrees or more with respect to the surface portion of the mounting layer (substrate 10) in all directions. It will have. Of course, if there are no obstacles for light propagation, light will be scattered over the entire angular range.

  A pair of external connection terminal portions 15 a, 16 a, 15 b, and 16 b plated with gold are formed on a pair of short sides of the substrate 10 and outside the outer peripheral silk dam 11. The first electrode of the electrode layer described above is electrically connected to the external connection terminal portions 15b and 16b. The second electrode is electrically connected to the external connection terminal portions 15a and 16a. The external connection terminal portions 15a, 16a, 15b, and 16b can be electrically connected to an external power supply mechanism or another surface light emitter unit via a unit connector (not shown).

  In the surface light emitter unit 1 configured as described above, an electrode layer (electrode pattern) for supplying power to the plurality of surface light emitters 13 is hermetically formed on the same plane in the substrate 10, and the external connection terminal portion 15a. , 16a, it is possible to supply power to all surface light emitters 13 simply by applying a DC voltage. Therefore, the manufacturing process of the surface light emitter unit 1, particularly the wiring process when the number of surface light emitters 13 is large, is extremely simplified.

Further, since the potting silk dam 12 is translucent with no corners, the light emitted from the individual surface light emitters 13 is transmitted not only to the surface light emitter 13 but also to the surrounding light transmitting member 14 for scattering. Dissipated almost evenly toward. The scattering translucent member 14 diffuses the light diffused from each surface light emitter 13 while being scattered in various directions on the scattering surface. Therefore, it looks as if light is emitted from the scattering translucent member 14. Moreover, since the surface light emitters 13 are arranged in a staggered arrangement in the example of FIG. 1, a substantially equal amount of light is diffused from the plurality of surface light emitters 13 to the light transmitting member for scattering 14. Since the diffused light also circulates to other surface light emitters 13, even if a light emission amount defect occurs in some surface light emitters 13, the diffused light circulates to the light transmitting member 14 for scattering. The shortage of light emission is compensated. The diffused light is also scattered from the surface of the substrate 10 in an angle direction of 0 degree or more in all directions.
By adopting such a structure, the risk caused by increasing the number of surface light emitters 13 mounted on the substrate 10 can be eliminated.

  Since the surface light emitter unit 1 is composed of a substrate 10 having an aluminum plate as a base layer, the surface light emitter unit 1 has higher strength than that made of a resin, and is less likely to be deformed when the resin is heated and cured. In addition, current flows through the light emitting elements of each surface light emitter 13, and heat generated when light is emitted is efficiently radiated through the light emitting element mounting portion, the electrode portion, and the aluminum plate. Therefore, more surface light emitters 13 can be mounted than when a surface light emitter unit is configured using a resin substrate, and a large current can flow through each surface light emitter 13 over a long period of time. Also from this point, the amount of light emitted from the entire surface light emitter unit 1 can be increased.

Further, the silk dams 11 and 12 are thin enough to be formed by silk printing, and the exposed surfaces of the surface light emitter 13 and the light transmitting member for scattering 14 are coated (overcoated) with a light transmitting film, so that it is waterproof. In addition to excellent fading, the fading of each translucent member is suppressed, and heat storage in the substrate 10 is also suppressed. Thereby, generation | occurrence | production of dew condensation etc. is suppressed also in the environment where a temperature change is large.

[Method for manufacturing surface light emitter unit]
Next, an example of a method for manufacturing the surface light emitter unit 1 will be described.
(1) Production of Aluminum Substrate with Copper Foil FIG. 2 (a) shows a partial sectional view of the vicinity of the base layer of the substrate 10. FIG. Hereinafter, unless otherwise specified, the “partial sectional view” is a partial sectional view of a corresponding part of the substrate 10.
In the present embodiment, a substrate 10 is prepared in which a rectangular aluminum plate 101 having a long side of 200 [mm], a short side of 35 [mm], and a thickness of 1000 [μm] is used as a base layer. An insulating film 102 of 80 [μm] is formed on the surface of the aluminum plate 101, and a copper foil 103 of 35 [μm] is further formed thereon to obtain an aluminum substrate with copper foil.

(2) Electrode layer formation As shown in the partial sectional view of the aluminum substrate with copper foil in FIG. 2 (b) and the top view of FIG. 2 (c), the portion of the copper foil 103 is mounted on the aluminum substrate with copper foil. Etching is performed to form an electrode surface pattern corresponding to the arrangement of the surface light emitters 13 to be formed. Etching separates adjacent copper foils 103, that is, copper foil 103 serving as the first electrode surface, and copper foil 103 serving as the second electrode surface, by gap 104. The insulating film 102 is exposed from the gap 104. FIG. 2C shows an example in which the copper foil 103 is divided into four (two electrode pairs are formed) by three gaps 104.

(3) Protection Film Formation As shown in the partial cross-sectional view of FIG. 2D and the top view of FIG. 2E, a resist is applied to the surface of the etched aluminum substrate with copper foil, and then cured. Thereby, the protective film 105 is formed. The resist (protective film 105) is formed of a translucent color material. As a result of the resist entering the gaps 104 between the copper foils 103, the protective film 105 becomes a flat layer without a step. The thickness of the protective film 105 from the surface of the copper foil 103 is about 20 [μm].

(4) Marking (positioning)
While marking (positioning) the conductive portion where gold plating is planned, the marked position is subjected to resist etching (protection film removal). FIG. 3A is an explanatory diagram of a marked position, and FIG. 3B is an enlarged view of the marked position. In the illustrated example, the marking is performed so as to form a staggered arrangement. That is, positioning is performed so that the central portion of one surface light emitter 13 in one row is an intermediate portion between two closest surface light emitters 13 in adjacent rows. The interval between the surface light emitters 13 is determined in consideration of the sizes of the outer peripheral silk dam 11 and the potting silk dam 12. In each marking position, a circular portion corresponding to the light emitting element mounting portion and two rectangular portions corresponding to the light emitting element electrode portions on both sides thereof are marked as one set. However, these shapes are arbitrary.

(5) Formation of conductive portion at marked position When marked, resist etching is performed accordingly. Resist etching is performed in the manner shown in FIGS. 2 (f) is a partial cross-sectional view showing a mounting portion of the surface light emitter 13, FIG. 2 (g) is a top view thereof, and FIG. 2 (h) is an end of the substrate to be an external connection terminal portion (15a, 15b, 16a, 16b). (I) is the top view.
In the mounting portion of the light emitting element, the circular portion 106a corresponding to the light emitting element mounting portion, the portion 106b that conducts to the first electrode of the electrode layer, the portion 106c that also conducts to the second electrode, and the external connection terminal portions (15a, 15b, 16a). , 16b). The copper foil 103 is exposed by etching.

  Gold plating is performed on the exposed portion of the copper foil 103. FIG. 2 (j) corresponds to FIG. 2 (f). The same (k) corresponds to the same (g). The same (l) corresponds to the same (h). The same (m) corresponds to the same (i). As shown in these drawings, the light emitting element mounting portion 107a, the electrode portions 107b and 107c, and the external connection terminal portion 107d (15a, 15b, 16a, and 16b) are formed by gold plating.

(6) Silk Dam Formation Next, the outer peripheral silk dam 11 and the potting silk dam 12 are formed using a silk printing apparatus. The outer peripheral silk dam 11 is formed in a substantially rectangular shape from the outer peripheral end of the substrate 10 to a portion slightly from the center. A plurality of potting silk dams 12 are formed in an elliptic cylinder so as to surround the light emitting element mounting portion 107a and the electrode portions 107b and 107c. The potting silk dam 12 has, for example, a length in the long axis direction of 8 [mm], a length in the short axis direction of 4 [mm], and a height of about 100 [μm]. The height of the outer silk dam 11 is the same as or slightly higher than the height of the potting silk dam 12.

  FIG. 4A is a partial cross-sectional view showing the positional relationship of the potting silk dam 12, and FIG. 4B is a partial cross-sectional view showing the positional relationship of the outer periphery silk dam 11. FIG. 5 is a view showing a structural example when the central portion of the potting sill dam 12 is cut. Referring to FIG. 5, the hollow region surrounded by the potting silk dam 12 is electrically separated into two regions by the gap 104. In one region, the light emitting element mounting portion 107a and the electrode portion 107b are disposed so as to be electrically conductive with the copper foil 103 (first electrode) of the electrode layer, and in the other region, the electrode portion 107b is provided with another copper foil. 103 (second electrode).

(7) Mounting of light emitting element 1
First, die bonding and thermosetting of the light emitting element are performed. That is, as shown in the partial cross-sectional view of FIG. 6A and the main part top view of FIG. 6B, the light emitting element 130 is adhered to the light emitting element mounting portion 107a by the paste-like conductive adhesive 140. The components of the conductive adhesive are as described above. Thereafter, the conductive adhesive is cured by heating in a constant temperature furnace.

(8) Mounting of light emitting element 2
Next, wire bonding of the light emitting element is performed. That is, as shown in the partial cross-sectional view of FIG. 7A and the main part top view of FIG. 7B, the positive terminal of the light-emitting element 130 and the electrode part 107b are bonded with the gold wire 131 and the negative electrode of the light-emitting element 130 is bonded. The terminal and the electrode portion 107 c are wire-bonded with a gold wire 132. In this state, a DC voltage is applied to check the light emission state. If there is a light emitting failure element, it is replaced at this point.

(9) Potting As shown in the partial cross-sectional view of FIG. 8A and the main part top view of FIG. 8B, the filling dam including the light-emitting element 130 that has been subjected to the light emission inspection is surrounded by the potting silk dam 12. A sealing resin 108 is filled to seal the light emitting element 130 and the like. As described above, the sealing resin 108 is an epoxy resin, but has a viscosity, so that the sealing resin 108 is slightly swollen more than the height of the potting silk dam 12 due to surface tension. In this state, the sealing resin 108 is cured in a constant temperature furnace and fixed as a sealing light-transmitting member. At this time, a DC voltage is applied again, and the light emission state, color temperature, light quantity, etc. are inspected. If there is a light emission failure, replace it at this point.

(10) Formation of light-transmitting member for scattering After all the surface light emitters 13 are completed, the filling dam surrounded by the outer peripheral silk dam 11 is filled with the scattering resin 109 and cured in a constant temperature furnace. Thus, the scattering light-transmitting member 14 is formed. FIG. 9 shows a state where the scattering resin 109 is filled in the partial cross-sectional view shown in FIG. As described above, epoxy resin is used for the scattering resin 109. The height of the light transmitting member 14 for scattering is the same as that of each potting silk dam 12 or slightly higher than that.

(11) Overcoat The manufacturing process may be terminated when the scattering light-transmitting member 14 is formed, but in this embodiment, the sealing light-transmitting member 108 and the scattering light-transmitting member are strengthened while enhancing the waterproofness. From the viewpoint of suppressing 14 fading, the entire surface of the substrate 10 is coated with a translucent film 110. FIG. 10 shows a state where the translucent film 110 is coated on the partial cross-sectional view shown in FIG.
For the translucent film 110, for example, an acrylic resin or an epoxy resin can be used. In consideration of the adhesive durability between the sealing resin 108 and the scattering resin 109, an epoxy resin is used in this embodiment. .
Finally, a direct current voltage is applied to each surface light emitter 13 (direct current is passed) to check the light emission state.

  FIG. 11 is a top view of the surface light emitter unit 1 manufactured through the above steps, which is the same as that shown in FIG. In this surface light emitter unit 1, each surface light emitter 13 is sealed with a sealing light-transmitting member 108 mixed with a yellow phosphor, and thus has a yellowish color. The scattering translucent member 14 is milky white, but when energized, white light with high brightness and no unevenness in the amount of light is emitted from the area surrounded by the outer silk dam 11.

[Second Embodiment]
FIG. 12 is a top view of the surface light emitter unit according to the second embodiment of the present invention. The same components as those of the surface light emitter unit 1 of the first embodiment are denoted by the same reference numerals, and description thereof is omitted. The surface light emitter unit 2 of the second embodiment is a set of two substrates 10. The number of surface light emitters 13 mounted on a single substrate 10 is the same as that of the surface light emitter unit 1, but the surface light can be emitted in an area wider than that shown in FIG. Therefore, it is suitable when used for illumination in a wide range. Even in the case of the two substrates 10, the external connection terminal portions 15 a can be obtained by electrically connecting the copper foils 103 corresponding to the first electrodes of the electrode layers and the copper foils 103 corresponding to the second electrodes. , 15b, 16a, 16b can be reduced by one set.
FIG. 12 shows an example in which two substrates 10 are joined horizontally, but they can be joined vertically. In this way, it can be applied to a vertically long illumination lamp or the like.

[Third Embodiment]
A third embodiment of the present invention will be described. In the third embodiment, a surface light emitter that emits a plurality of types of light emission colors is provided on a single substrate according to the application.
FIG. 13 is a top view of the surface light emitter unit according to the third embodiment.
The surface light emitter unit 3 is for plant growth. The surface light emitters that emit red light, green light, and blue light, which are lights necessary for plant growth, are arranged on a single substrate, and are arranged in a first substrate. According to the manufacturing process described in the embodiment, a waterproof and thin surface light emitter unit is obtained. The surface light emitters that emit light of each color are determined by the materials of the light emitting element and the light-transmitting sealing member, and are themselves well-known matters, so the description of the manufacturing process of each surface light emitter is omitted here. .

In the example of FIG. 13, the first row is a surface light emitter 13a that emits red light, the second row is a surface light emitter 13b that emits blue light, the third row is a surface light emitter 13c that emits green light, and the fourth row. The eyes are surface light emitters 13d that emit red light. However, the combination of emission colors can be changed depending on the type of plant to be grown. That is, some or all of the plurality of surface light emitters emit surface light with red light, green light, blue light, or a combination thereof selected for each plant to be grown.
For example, in the example of FIG. 13, by using a surface light emitter that emits white light for only one row, the wavelength becomes wide, and plant growth can be further promoted.
Because it is waterproof and thin, it can be used in humid rooms.

[Fourth Embodiment]
A fourth embodiment of the present invention will be described. In the fourth embodiment, an example of a surface light emitter unit in which a plurality of surface light emitters are arranged differently from the first embodiment will be described. 14 and 15 are top views of the surface light emitter unit according to the fourth embodiment.
The surface light emitter unit 4 shown in FIG. 14 has a surface light emitter 13e in which the long axis direction is arranged in the horizontal direction with respect to the drawing in the first row, and the surface light emission in which the second row is arranged in the vertical direction with respect to the drawing. The body 13f, the third row is a surface light emitter 13g arranged in the horizontal direction, and the fourth row is a surface light emitter 13h arranged in the vertical direction.
In the example of the surface light emitter unit 5 of FIG. 15, the surface light emitters 13 i arranged in the horizontal direction in the first row, the surface light emitters 13 j arranged in the vertical direction in the second row, and the surfaces arranged in the vertical direction also in the third row. The light emitters 13k and the fourth row are the surface light emitters 13l arranged in the horizontal direction. In the elliptical cylindrical surface light emitter, the light emission amount (illuminance) in the short axis direction is relatively stronger than in the long axis direction, but the surface light emitter is provided by arranging as shown in FIG. It is possible to appropriately adjust the amount of light diffused to the part that is not.

[Fifth Embodiment]
A fifth embodiment of the present invention will be described. In the fifth embodiment, an example of a surface light emitter unit that facilitates joining with another surface light emitter unit will be described.
FIG. 16 is a top view of the surface light emitter unit 6 according to the fifth embodiment. The description of the same components as those of the surface light emitter unit 1 described in the first embodiment is omitted.
In the surface light emitter unit 6, external connection terminal portions 65 a, 65 b, 66 a, 66 b are also provided at the long side end portions of the substrate 10. The external connection terminal portions 65a and 66a are electrically connected to the first electrode surface described above, and the external connection terminal portions 65b and 66b are electrically connected to the second electrode surface. Since the surface light emitter unit 6 having such a configuration can be connected in various directions by, for example, a unit connector, which will be described later, an advantage of expanding the application range to a proof device or the like can be obtained. .

  16 shows an example in which each surface light emitter 13 is arranged in a staggered arrangement of four rows as shown in FIG. 1, the number of surface light emitters 13 is not limited to this example. For example, one row of surface light emitter units 7 may be used as shown in FIG. 17A, or two rows of surface light emitter units 8 may be used as shown in FIG. 17B. In the case of the two rows of surface light emitter units 8, as described above, the surface light emitters in one row are arranged in the middle of the centers of the two closest surface light emitters in adjacent rows.

[Embodiment of unit connector]
Next, an example embodiment of a unit connector for enabling bonding of the surface light emitter units or between the surface light emitter units and the power supply mechanism will be described.
18A is a side view in the short side direction of the unit connector according to this embodiment, FIG. 18B is a top view, and FIG. 18C is a side view in the long side direction. The unit connector 600 has a support housing 601 having a cross section “work” shape having the long side openings of the two engaging grooves in opposite directions. The length (groove width) in the long side direction of the engagement grooves 601a and 601b of the support housing 601 is the same as the short side size (of the substrate 10) of the surface light emitter units 1 and 16 described above. The length in the short side direction (depth of the groove) of the engaging grooves 601a and 601b is equal to or shorter than the length from the short side end of the surface light emitter units 1 and 16 to the nearest outer peripheral silk dam 11. An interval (height of the groove) between the upper wall and the lower wall of the engagement grooves 601 a and 601 b is equal to or greater than the thickness of the substrate 10 of the surface light emitter units 1 and 16.

A first terminal portion 602, a second terminal portion 603, a third terminal portion 605, and a fourth terminal portion 606, each of which is formed of a leaf spring whose surface is gold-plated, are formed on the upper walls of the engagement grooves 601a and 601b. The support housing 601 is integrally supported. Support leaf springs 604 and 607 are provided on the lower walls of the engagement grooves 601a and 601b.
The distance between the central portions of the first terminal portion 602 and the second terminal portion 603 and the central portion distance between the third terminal portion 605 and the fourth terminal portion 606 are, for example, the external connection terminal portions 15a, It is almost the same as the central portion interval of 15b.

The material of the support housing 601 may be any material such as metal, carbon, ceramic, hard resin, and wood. However, in any case, the first terminal portion 602 and the third terminal portion 605, and the second terminal portion 603 and the fourth terminal portion 606 are electrically connected inside the support housing 601. That is, they are joined in a conductive state.
Such a unit connector 600 can be electrically connected, for example, by joining the short sides of the surface light emitter unit 1 shown in FIG. 1 on the same plane. In other words, any number of the surface light emitter units 1 can be connected in the long side direction on the same plane. Therefore, the application range of the surface light emitter unit 1 can be expanded. For example, it is possible to easily realize a lighting device having the same size as a fluorescent light of a specified size, or a flexible lighting device that can determine an arbitrary installation location according to a floor plan of a room to be illuminated.

  Further, using the surface light emitter unit 1 shown in FIG. 1 and the surface light emitter unit 6 shown in FIG. 16, as shown in FIG. It is also possible to connect to another surface light emitter unit 16 by changing. Thereby, the lighting fixture of arbitrary shapes, such as a rectangular cylinder shape, can be implement | achieved easily.

  Furthermore, the unit connector 600 can also be used as a connecting means for a portion of the surface light emitter unit 1 where the first electrode or the second electrode of the electrode layer is not provided. For example, as shown in FIG. 20, one of the unit connectors 600 is used to connect the external connection terminal portions 65 a, 65 b, 66 a, 66 b at one end of the long side of the surface light emitter unit 16. Another unit connector 600 is used to connect the other ends of the long side portions of the surface light emitter unit 16 (end portions where no external connection terminal portion exists). Thereby, even if it does not comprise the surface emitting body unit of the 2 board | substrate shown in FIG. 12, the surface emitting illuminance of an equivalent width | variety can be obtained.

FIG. 21 (a) is an external perspective view showing another embodiment of the unit connector, FIG. 21 (b) is a side view thereof, and FIG. 21 (c) is a front view thereof.
This unit connector 700 corresponds to a base when a plurality of surface light emitter units 1 of this embodiment are connected to realize a cylindrical lighting fixture compatible with an existing fluorescent lamp. That is, an engagement groove 701a having the same shape, structure and size as the engagement groove 601a shown in FIG. 17 is provided at one end of the cylindrical support housing 701. A first terminal portion 702 and a second terminal portion 703 are provided on the upper wall of the engagement groove 701a, and a supporting leaf spring 704 is provided on the lower wall. A pair of electrode pins 705 and 706 are provided at the other end of the support housing 701. The thickness of the electrode pins 705 and 706 and the interval between them are the same as those provided in the base of the existing fluorescent tube.
The first terminal portion 702 and the electrode pin 705, and the second terminal portion 703 and the electrode pin 706 may be electrically connected by directly wiring them. Further, the first terminal portion 702 and the second terminal portion 703 may be supplied with power through a converter that converts electric power supplied from the electrode pins 705 and 706 into a DC voltage. By using such a unit connector 700, a lighting fixture having a size compatible with a fluorescent tube can be easily realized by using the surface light emitter unit of the present invention.

  In these unit couplers 600 and 700, the first terminal portions 602 and 702, the second terminal portions 603 and 703, the third terminal portion 605, and the fourth terminal portion 606 are not necessarily gold-plated leaf springs. good. For example, a spring contact or other elastic conductor may be used. Alternatively, the biasing by elasticity is left to the supporting leaf springs 603, 607, and 704, and each terminal portion 602, 702, 603, 703, 605, and 606 corresponds to a thick metal foil or the external connection terminal portion 15a. A conductive point may be provided only at the site.

Embodiments of the present invention are as described above, but the scope of the present invention is not limited to the above embodiments. For example, in the first embodiment, light is easily transmitted to and from the scattering light-transmitting member 14 around the surface light emitter 13 and mainly for the convenience of forming the sealing light-transmitting member. The example which forms the potting silk dam 12 which consists of an optical member was demonstrated. However, the sealing translucent member 108 may be formed by a mold instead of the potting silk dam 12, and then the mold may be removed.
Further, the shape of the surface light emitter 13 is not limited to an elliptical cylindrical shape, and may be a substantially elliptical cylindrical shape or another cylindrical shape having no corners. Moreover, although the example at the time of forming an electrode etc. by gold plating was shown, you may form them with cheap metals, such as copper.
Furthermore, the distance between adjacent surface light emitters 13 only needs to be substantially equal, so that the staggered arrangement is not necessarily required.

DESCRIPTION OF SYMBOLS 1-8 ... Surface light emitter unit, 10 ... Board | substrate, 11 ... Outer periphery silk dam, 12 ... Potting silk dam, 13 ... Surface light emitter , 14 ... Light-transmitting member for scattering, 15a, 15b, 16a, 16b, 65a, 65b, 66a, 66b (107d) ... external connection terminal portion. 108 ... sealing resin, 109 ... scattering resin, 110 ... translucent film. 130... Light emitting element, 140... Conductive adhesive. 600, 700... Unit connector, 601, 701... Support housing, 601a, 601b, 701a.

Claims (10)

A surface light emitter unit in which an electrode layer and a plurality of surface light emitters each emitting surface light when fed through the electrode layer are formed on a surface portion of a substrate having a metal plate as a base layer,
Each of the plurality of surface light emitters is a surface light emitter without a corner portion formed by sealing a mounted light emitting element with a light-transmitting sealing material mixed with a phosphor.
The surface of the electrode layer is formed so as to be able to scatter light between the individual surface light emitters and the adjacent surface light emitters on the surface of the substrate. A light-transmitting member for scattering capable of scattering light diffused toward the periphery of the substrate and light scattered from the surface of the electrode layer in all directions with respect to the surface portion of the substrate at an angle of 0 degrees or more is filled. It is characterized by
Surface emitter unit. The plurality of surface light emitters are arranged in one or a plurality of rows at equal intervals, respectively.
When arranged in a plurality of rows, the center portion of one surface light emitter in one row is positioned so as to be an intermediate portion between two nearest surface light emitters in adjacent rows. And
The surface light emitter unit according to claim 1. The electrode layer has an electrode surface pattern including a plurality of first electrode surfaces to which a positive voltage is supplied and a plurality of second electrode surfaces to which a negative voltage is supplied, respectively, in an upper layer of the base layer of the substrate. And is hermetically formed in a lower layer of the plurality of surface light emitters,
The light emitting element of the surface light emitter and its positive terminal are electrically connected to any one of the first electrode surfaces, and the negative terminal of the light emitting element is electrically connected to the second electrode surface,
The surface light emitter unit according to claim 1 or 2. A cylindrical silk dam is formed at a site that is a predetermined distance from the outer peripheral edge of the surface portion of the substrate,
The plurality of surface light emitters are formed in a hollow region surrounded by the silk dam,
The scattering translucent member is obtained by curing a translucent resin dammed by the silk dam while in contact with all surface light emitters,
The surface light emitter unit according to claim 1, 2 or 3. The exposed surfaces of the plurality of surface light emitters and the light transmitting member for scattering are coated with a light transmitting film,
The surface light emitter unit according to claim 4. A part or all of the plurality of surface light emitters emits light, which is selected for each plant to be cultivated, light of any of red light, green light, blue light, or a combination thereof,
The surface light emitter unit according to claim 5. A first external connection terminal portion that is electrically connected to the first electrode surface and a second external connection terminal portion that is electrically connected to the second electrode surface are formed on a surface portion of the substrate between the silk dam and the outer peripheral end. And through these external connection terminal portions, it is configured to be electrically connectable to a power supply mechanism or another surface light emitting unit of the same configuration,
The surface light emitter unit according to any one of claims 4 to 6. The first external connection terminal portion and the second external connection terminal portion are joined to the power supply mechanism or the other surface light emitter unit via the conductive portion of a predetermined connector having a conductive portion, respectively. And electrically connected,
The surface light emitter unit according to claim 7. The connector is
A first terminal portion joined in conduction with the first external connection terminal portion;
A second terminal portion joined in a conductive state with the second external connection terminal portion;
A third terminal portion that is electrically connected to the first terminal portion and joined in a conductive state to a positive terminal of the power supply mechanism or another surface light emitter unit;
A fourth terminal portion that is electrically connected to the second terminal portion and joined in a conductive state to a negative terminal of the power supply mechanism or another surface light emitter unit;
A support housing that integrally supports these terminal portions;
It is characterized by having
The surface light emitter unit according to claim 8. To mount an electrode layer having a plurality of electrode surfaces arranged on the same plane and a plurality of surface light emitters that emit surface light by being fed through the electrode layer on the surface portion of the metal plate serving as a base layer A surface layer of the electrode layer, and manufacturing a substrate that can scatter light between the individual surface light emitters and adjacent surface light emitters;
A first silk dam without a corner is formed by sealing with a light-transmitting member for sealing at a predetermined distance from the outer peripheral edge of the mounting layer, and a hollow region surrounded by the first silk dam And a step of forming a plurality of second silk dams made of translucent members each allowing light transmission in a predetermined arrangement;
The surface light emission is achieved by mounting a light emitting element mounted using a metal-colored member in a hollow area surrounded by the second silk dam, and sealing the hollow area with a translucent member for sealing. Manufacturing the body,
Fill the translucent resin until it is blocked by the first silk dam while in contact with all the surface light emitters, and cure the filled translucent resin so that each surface light emitter is directed to their surroundings. Forming a light-transmitting member for scattering capable of scattering light scattered from the surface of the electrode layer and light scattered from the surface of the electrode layer at an angle of 0 degrees or more in all directions with respect to the surface portion of the mounting layer; It is characterized by having
Manufacturing method of surface light emitter unit.