TW201129262A - Extruded flexible circuit board, a manufacturing method - Google Patents

Extruded flexible circuit board, a manufacturing method Download PDF

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Publication number
TW201129262A
TW201129262A TW99104408A TW99104408A TW201129262A TW 201129262 A TW201129262 A TW 201129262A TW 99104408 A TW99104408 A TW 99104408A TW 99104408 A TW99104408 A TW 99104408A TW 201129262 A TW201129262 A TW 201129262A
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Taiwan
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circuit board
flexible circuit
conductive layer
long
slots
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TW99104408A
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Chinese (zh)
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TWI410186B (en
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Wen-Lung Lee
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Jess Link Products Co Ltd
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Abstract

The present invention relates to an extruded flexible circuit board including an electrical-conductive layer and an insulating layer covering upper and lower surfaces of the electrical-conductive layer by an extruder. The electrical-conductive layer is provided at intervals with a plurality of long troughs and two rows of short troughs. An H-shape circuit section is formed between the two adjacent long troughs and the two opposite short troughs. The present invention also relates to a manufacturing method of such an extruded flexible circuit board, and a light bar having such an extruded flexible circuit board. The present invention provides a flexible circuit board with a simple structure and circuit pattern, a reduced production cost, and a customized design.

Description

201129262 六、發明說明: ’ 【發明所屬之技術領域】 [0001] 本發明係有關於-種敕性電路板,尤指一種押出式軟性 電路板及其製作方法,而且本發明亦有關於—種具押出 式軟性電路板的條燈。 【先前技術】 [0002] 隨考電子科技的日新月異,已經開發出許多種電性連接 方式(例如’印刷電路板及倾電路㈣1刷電路板 〇 了㈣士仙boa·.)主要是由—絕緣基板 披覆於絕緣基板上的_鋼落電路層、及披覆於銅箱電 ^上的-隔離層所構成;印刷電路㈣流程係以絕緣 基板為起始材料’先製作㈣綠路,此步驟須經由前處 理’上光阻劑、曝光、顯影、餘刻及去光阻等步驟,形 成所需線路,並藉由以黑化#化製程減銅表面,增 加和絕緣樹脂的接著性,而後_片押出,内外層之間 的導通則使用機械或雷射鑽孔,再經電鍵製程形成基板 〇 間的導電通路,完成電路製程後的電路板外層,再塗佈 防焊油墨,以避免焊接電子元件時,銲錫溢流至相鄰線 路造成短路,此亦為隔絕基板和空氣中的水氣及氧化作 肖’塗佈完防焊油墨後的電路板,再依客戶要求,作表 面抗氧化處理,以加強表層抗氣化能力。因此,印刷電 路板的製程相當繁瑣。 _軟性電路板的基板是魏緣基材、接㈣及銅導體三者 所構成;當以微影技術製造出線路之後,為了防止軟性 電路板的銅線路氧化且保護線路免受環境溫濕度之影響 099104408 表單編號A0101 第3頁/共28頁 0992008284-0 201129262 ’必須在難電路板上面加上—層覆蓋膜保護 (Coverlayer),此覆蓋保護膜傳統是用非感光性材料, 在加上此覆蓋保護膜前必帛先利用機械鑽孔將軟性電路 板的接點、銲塾及導孔預留下來。因此,軟性電路板的 製程亦十分繁瑣。 [0004] 根據上述,印刷電路板或軟性電路板的結構均由絕緣基 板、電路層、及保護膜所組成,且製造過程涉及微影蝕 刻或曝光等诸多步驟,然而,在—些實際的廉用情形中 ’僅需要利用具有簡單電路的小型電路板就能夠達成電 子元件之間的電性連接’而不需要使用結構與製程均較 為複雜的印刷電路板或軟性電路板;因此,亟需一種具 有簡單結構與精簡電路設計的電路板,其製程簡易,因 而能夠降低製造成本與時間。 [0005] 因此,如何解決上述之問題點,即成為本發明人所改良 之目標。 ^ .; : :.... :::: …::.·:..: 【發明内容】 [0006] 本發明之一目的’在於提被一種押出式軟性電路板,其 結構簡單且具有精簡的電路設計。 [〇〇〇7] 本發明之另一目的’在於提供一種押出式軟性電路板製 作方法,其製蘀簡易’因而能夠降低製造成本與時間。 [0008] 本發明之又一目的’在於提供一種具押出式軟性電路板 的條燈,此條燈的結構簡單且易於製造。 [0009] 為了達成上述之目的’本發明係提供一種押出式軟性電 路板,包括:,導電層’間隔開設有複數長槽及在任二 099104408 表單編號A0101 第4頁/共28頁 0992008284-0 201129262 相鄰該長槽之間開設二並列短槽,於任二相鄰該長槽及 該二並列短槽間構成一「工」字狀電路;以及一絕緣層 ,以押出方式包覆於該導電層的上下表面。 [0010] 為了達成上述之目的,本發明係提供一種押出式軟性電 路板製作方法,其步驟包括:a)提供一金屬料帶;b)以 沖具對該金屬料帶沖設有複數長槽、複數並列短槽、及 形成於該等長槽及該等並列短槽外側的二料邊,以形成 一導電層;c)提供一押出機;d)提供一絕緣材料,以該 ◎ 押出機對該絕緣材料進行加溫熱熔;e)將該導電層通過 步驟d)的該押出機,而使該熔融狀的絕緣材料包覆於該 導電層的上下表面,而形成一絕緣層;以及f)以沖具移 除一部份該等料邊而於經該步驟e)的該導電層上分別形 成多個斷路點,且剩餘部份的該等料邊係構成一串聯線 路。 [0011] 為了達成上述之目的,本發明係提供一種具押出式軟性 雷政;66 备格,紅括:一抽;式缺料雷政ie,盆白冬: ,V·» · ,V «/|、^ '4 Uf -4 I , W , ,Λ-ν yC7 o 一導電層,間隔開設有複數長槽及在任二相鄰該長槽之 間開設二並列短槽,於任二相鄰該長槽及該二並列短槽 間構成一「工」字狀電路;及一絕緣層,以押出方式包 覆於該導電層的上下表面;以及複數個LED,間隔設置於 該押出式軟性電路板上,每一該LED分別跨設於該長槽上 且電性連接該導電層。 [0012] 相較於先前技術,本發明具有以下功效: [0013] 由於本發明的押出式軟性電路板僅具有一導電層及包覆 099104408 表單編號A0101 第5頁/共28頁 0992008284-0 201129262 於導電層上下表面的一絕緣層,所以其結構比起印刷電 路板或傳統軟性電路板更為簡化;另外,本發明的導電 層沖設出多個長槽與並列短槽’且任二相鄰長槽及二並 列短槽間構成一「工」字狀電路,所以其電路設計相當 精簡。另一方面,由於本發明的押出式軟性電路板的電 路精簡且模組化,所以製造商只需要依照客戶需要而裁 切出具有適當長度即可,完全不需要變更任何製造流程 與設備就能夠供應多種規格的客製化軟性電路板,這對 於製造商來說相當有利且符合經濟效益。 [0014] 由於本發明的製作方法主要是將金屬料帶沖.設出具有多 個長槽與並列短槽的一導電#,並將絕緣材料以押出機 包覆於此導電層的上下表面而形成絕緣層,最後沖設出 一「工」字狀電路,所以本發明的製作方法不需要利用 微影#刻或曝光等諸多步驟’製程相當簡易,可大幅降 低製造成本且縮短製造時間。 [0015] 由於本發明的條燈是直接將複數個LED間隔設置於上述押 出式軟性電路板上且電性連接該導電層,所以,此條燈 的結構簡單並符合薄型化需求,易於製造,因而可大幅 降低製造成本與時間。另一方面,本發明的條燈可依據 客戶需要而裁切成適當長度,完全不需要變更任何製造 流程與設備就能夠供應多種規格的客製化條燈,這對於 製造商來說相當有利且符合經濟效益。 【實施方式】 [0016] 有關本發明之詳細說明及技術内容,將配合圖式說明如 下’然而所附圖式僅作為說明用途’並非用於侷限本發 0992008284-0 099104408 表單編號A0101 第6頁/共28頁 201129262 ο [0017] [0018] [0019] Ο [0020] [0021] ❹ [0022] 明 -考第-ϋ至第七圖’第—圖為本發明的製作方法之流 圖而第一圖至第七圖分別顯示第一圖的製作方法中 各個步驟下的半成品’·首先,本發明提供—種押出式軟 性電路板製作方法,其步驟包括: a) 提供—金屬料帶; 如第二圖所示’提供由高導電性金屬材料所製成的一金 屬料帶10,特別是表面鍍錫的一鋼帶。 b) 以沖具對該金屬料♦沖S有複數長槽、複數並列短槽 及形成於該等長槽及該等並列短槽外侧的二料邊,以 形成一導電層; 如第二圖所不,以沖具(未顯示)在第二圖所示的金屬料 帶10内沖設有複數長槽⑴、1Γ、u” ..·),且在二相 鄰長槽(11、11、…)之間分別沖設有二並列短槽 ⑴另^在該等長槽⑴^广叫^^及該等並列 短槽12外侧則形成二料邊13,藉此形成—導電層ua ;料 邊13上間隔設置有孔洞13卜以便於輸送帶或其他運送裝 置固定此導電層l〇a的兩侧’而以導電層1〇a的長度方向 將導電層10a連續運送至一預定位置。 c)提供一押出機;本發明所用的押出機(未顯示)並未特 別侷限,只要適用於連續押出成型的押出機即可;特別 要說明的是’押出機的内部具有一眼模(未顯示),而此 眼模的外形對應於通過此眼模的導電層1〇a之外形。 099104408 表單編號A0101 第7頁/共28頁 0992008284-0 201129262 [0023] [0024] [0025] [0026] d) 提供—絕緣材料以該押出機對該絕緣材料進行加^ ‘、、、熔,本發明的絕緣材料可選用鐵氟塑膠或聚 P T ^ ( 、’但亦不限於此;特別要說明的是,押出機内具 有加熱機構(未顯示),絕緣材料被注入押出機的眼模内 然後經加熱而達到熔融狀態’以利後續的押出成型。 e) 將該導電層通過步驟d)的該押出機,而使該熔融狀的 絕緣材料包覆於該導電層的上下表面,而形成一絕緣層 9 導電層l〇a透過類似滾輪的輸送裝置(未顯示)連續地通過 押出機,更明確地說,導電層1〇a是通過押出機内的眼槿 ,此時,熔融狀的絕緣材料便受到押出機内的眼模之捽 壓效果而包覆於導電層l〇a的上下表面;此時,炫融狀的 絕緣材料填滿導電層10a上所沖設的長槽(11、1Γ , )與短槽12内;在以押出機實施押出成型之後,整個導 電層l〇a及包覆於其上下表面的絕緣材料,起經冷卻而使 炫融狀的絕緣材料產生硬化以完全包覆於導電層1〇a的上 下表面,藉此形成一絕緣層20。 要特別說明的是,當欲安裝或焊接LED時,在步驟6)之後 ’可以更包括一步驟e,)—移除掉該絕緣層2〇的_ ^ 〒間 ^位而在該導電層10a的上下表面分別形成裸露的—導接 部2丨與22(第六圖更為清楚),以便曰後可以將UD安裝 或焊接於該導接部21上。當然,步驟e)與步驟e,)也可 以合併成一個步驟,也就是透過押出機的眼模設計,而 使絕緣材料在導電層10a的上下表面中欲產生電氣絕緣之 部位上以押出方式直接形成該絕緣層20。 099104408 表單編號A0101 第8頁/共28頁 0992008284- 201129262 [_ 〇以沖具移除-部㈣⑽邊而於經該㈣e)的該導電 屬上分別形成多個斷路點,且剩餘部份的該等料邊係構 成—串聯線路。 [0028] Ο 如第五圖赫,以沖具㈣—部份該等料邊13,而分別 形成多個斷路點P_,且㈣特邊_餘部份作為— 串聯線路;更明確地說,斷路點p是位於料邊㈣絕緣層 2〇的外緣之間’此時可發現任二相鄰長槽⑴、、 H”)及二並列短槽12之間形成一「工」字狀電㈣(如 粗線所示);另外,斷路_是位於預定產生斷路的-「 工」字狀電路14上,例如,在第五圖所示的實施例中, 每隔三個長槽⑴、n’、u”)就產生一個斷路點Q, 具有斷路點⑽該「卫」字狀電路14與其中-料邊13則 保留連接’如此-來’二料邊13便可作為一串聯線路而 不需要裁切掉,以充分利用導電層1〇a的材料。201129262 VI. Description of the invention: 'Technical field to which the invention pertains. [0001] The present invention relates to a sturdy circuit board, and more particularly to an escaping flexible circuit board and a method of fabricating the same, and the present invention also relates to Strip lights with push-out flexible boards. [Prior Art] [0002] With the rapid development of electronic technology, many kinds of electrical connection methods have been developed (such as 'printed circuit board and tilt circuit (4) 1 brush circuit board ( (4) 士仙 boa·.) mainly by - insulation The substrate is coated on the insulating substrate and the insulating layer is formed on the copper box, and the printed circuit (four) is formed by using the insulating substrate as the starting material (four) green road. The steps must be carried out through the pre-treatment of the photoresist, exposure, development, residual and photoresist removal steps to form the desired line, and by adding a blackening surface to the copper surface to increase the adhesion of the insulating resin. Then, the _chip is extruded, and the conduction between the inner and outer layers is mechanically or laser-drilled, and then the conductive path between the substrates is formed by the key-bonding process, and the outer layer of the circuit board after the circuit process is completed, and then the solder resist ink is applied to avoid When soldering electronic components, the solder overflows to the adjacent lines to cause a short circuit. This is also used to isolate the water and gas in the substrate and the air, and the circuit board after the soldering ink is applied, and then the surface resistance is required according to the customer's requirements. Oxidation Treatment to enhance the surface resistance to gasification. Therefore, the process of printing a circuit board is rather cumbersome. _The board of the flexible circuit board is composed of the Wei edge substrate, the connection (4) and the copper conductor; after the circuit is fabricated by the lithography technology, in order to prevent the oxidation of the copper circuit of the flexible circuit board and protect the circuit from the ambient temperature and humidity Effect 099104408 Form No. A0101 Page 3 / Total 28 Page 0992008284-0 201129262 'Current layer must be added on the hard board. Covering the protective film is traditionally made of non-photosensitive material. Before the protective film is covered, the contact points, soldering holes and via holes of the flexible circuit board must be reserved by mechanical drilling. Therefore, the process of the flexible circuit board is also very cumbersome. [0004] According to the above, the structure of the printed circuit board or the flexible circuit board is composed of an insulating substrate, a circuit layer, and a protective film, and the manufacturing process involves many steps such as lithography etching or exposure, however, in some practical In the case of 'only need to use a small circuit board with a simple circuit to achieve electrical connection between electronic components' without the need for a printed circuit board or flexible circuit board that is more complicated in structure and process; therefore, there is a need for a A circuit board having a simple structure and a simplified circuit design has a simple process, thereby reducing manufacturing cost and time. Therefore, how to solve the above problems has become an improvement target of the inventors. ^ .; : :.... :::: ...::.::: [Invention] [0006] One object of the present invention is to provide an extruded soft circuit board which is simple in structure and has Streamlined circuit design. [Attachment 7] Another object of the present invention is to provide a method for manufacturing a push-type flexible circuit board which is easy to manufacture and thus can reduce manufacturing cost and time. Another object of the present invention is to provide a strip lamp having an extruded flexible circuit board which is simple in structure and easy to manufacture. [0009] In order to achieve the above object, the present invention provides an extruded flexible circuit board comprising: a conductive layer 'separated with a plurality of long slots and at any two 099104408 Form No. A0101 Page 4 / Total 28 Pages 0992008284-0 201129262 Two parallel short slots are formed between the adjacent long slots, and a "work" word circuit is formed between the adjacent two long slots and the two parallel short slots; and an insulating layer is wrapped in the conductive manner The upper and lower surfaces of the layer. [0010] In order to achieve the above object, the present invention provides a method for manufacturing an extruded flexible circuit board, the steps comprising: a) providing a metal strip; b) punching the metal strip with a plurality of long grooves. And a plurality of parallel short grooves, and two sides formed on the outer sides of the long grooves and the parallel short grooves to form a conductive layer; c) providing an extruder; d) providing an insulating material to the ◎ extruder Warming and melting the insulating material; e) passing the conductive layer through the extruder of step d), and coating the molten insulating material on the upper and lower surfaces of the conductive layer to form an insulating layer; f) removing a portion of the edges by the punch to form a plurality of break points on the conductive layer via the step e), and the remaining portions of the edges form a series line. [0011] In order to achieve the above object, the present invention provides an escaping soft leizheng; 66 备格, 红: a pumping; lack of material Lei Zhengie, basin white winter: , V·» · , V « /|,^ '4 Uf -4 I , W , ,Λ-ν yC7 o A conductive layer, which is provided with a plurality of long grooves and two parallel short grooves between any two adjacent long grooves. The long slot and the two parallel short slots form a "work" word circuit; and an insulating layer is wrapped on the upper and lower surfaces of the conductive layer in an extrusion manner; and a plurality of LEDs are spaced apart from the push-out flexible circuit Each of the LEDs is disposed on the long slot and electrically connected to the conductive layer. [0012] Compared with the prior art, the present invention has the following effects: [0013] Since the push-type flexible circuit board of the present invention has only one conductive layer and cladding 099104408 Form No. A0101 Page 5 / Total 28 Pages 0992008284-0 201129262 An insulating layer on the upper and lower surfaces of the conductive layer, so the structure is more simplified than that of a printed circuit board or a conventional flexible circuit board; in addition, the conductive layer of the present invention is provided with a plurality of long grooves and parallel short grooves and any two phases The adjacent long slot and the second parallel short slot form a "work" word circuit, so the circuit design is quite simple. On the other hand, since the circuit of the extruding flexible circuit board of the present invention is simple and modular, the manufacturer only needs to cut the appropriate length according to the customer's needs, and can completely change any manufacturing process and equipment. It is very advantageous and economical for manufacturers to supply a wide range of custom flexible boards. [0014] Since the manufacturing method of the present invention is mainly to punch a metal strip, a conductive # having a plurality of long grooves and parallel short grooves is provided, and the insulating material is coated on the upper and lower surfaces of the conductive layer by an extruder. The insulating layer is formed, and a "work" word circuit is finally formed. Therefore, the manufacturing method of the present invention does not require a plurality of steps such as lithography or exposure, and the process is relatively simple, and the manufacturing cost can be greatly reduced and the manufacturing time can be shortened. [0015] Since the strip lamp of the present invention directly sets a plurality of LEDs on the above-mentioned extruded flexible circuit board and electrically connects the conductive layer, the lamp has a simple structure and meets the requirements of thinning, and is easy to manufacture. Therefore, the manufacturing cost and time can be greatly reduced. On the other hand, the strip lamp of the present invention can be cut to an appropriate length according to the needs of the customer, and it is possible to supply a variety of customized strip lights without changing any manufacturing process and equipment, which is quite advantageous for the manufacturer. It is economical. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [0016] The detailed description and technical contents of the present invention will be described with reference to the drawings. However, the drawings are only for illustrative purposes. It is not intended to limit the present invention. 0992008284-0 099104408 Form No. A0101 Page 6 。 [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ The first to seventh figures respectively show the semi-finished products under the respective steps in the manufacturing method of the first figure. First, the present invention provides a method for manufacturing a squeezing flexible circuit board, the steps of which include: a) providing a metal strip; As shown in the second figure, 'a metal strip 10 made of a highly conductive metal material is provided, in particular a steel strip which is tin-plated on the surface. b) the metal material ♦ S has a plurality of long grooves, a plurality of parallel short grooves, and two sides formed on the outer sides of the long grooves and the parallel short grooves to form a conductive layer; No, a punch (not shown) is punched with a plurality of long grooves (1), 1Γ, u"..) in the metal strip 10 shown in the second figure, and in two adjacent long grooves (11, 11) And ...) are respectively provided with two parallel short slots (1) and another two sides 13 are formed on the outer sides of the long slots (1) and the parallel short slots 12, thereby forming a conductive layer ua; The material edges 13 are spaced apart from each other to facilitate the transport of the conductive layer 10a to a predetermined position in the longitudinal direction of the conductive layer 1A by spacing the holes 13 so as to be fixed by the conveyor belt or other transport means to fix the two sides of the conductive layer 10a. c) providing an extruder; the extruder (not shown) used in the present invention is not particularly limited as long as it is suitable for a continuous extrusion molding extruder; in particular, the inside of the extruder has an eye mold (not shown) And the shape of the eye mold corresponds to the shape of the conductive layer 1〇a passing through the eye mold. 099104408 A0101 Page 7 / 28 pages 0992008284-0 201129262 [0023] [0024] [0026] d) providing - an insulating material to the insulating material by adding, ', melting, the invention The insulating material may be iron fluoride plastic or poly PT ^ (, 'but not limited to this; in particular, the extruder has a heating mechanism (not shown), the insulating material is injected into the eye mold of the extruder and then heated The molten state is reached to facilitate the subsequent extrusion molding. e) The conductive layer is passed through the extruder of step d), and the molten insulating material is coated on the upper and lower surfaces of the conductive layer to form an insulating layer 9 The conductive layer 10a is continuously passed through an extruder (not shown) through a roller-like conveying device (not shown), more specifically, the conductive layer 1〇a is passed through the eyelids in the extruder, and at this time, the molten insulating material is pushed out. The pressing effect of the eye mold in the machine is coated on the upper and lower surfaces of the conductive layer 10a; at this time, the dazzling insulating material fills the long groove (11, 1Γ, ) which is punched on the conductive layer 10a and is short In the tank 12; in the extrusion machine to perform extrusion molding After that, the entire conductive layer 10a and the insulating material coated on the upper and lower surfaces thereof are cooled to harden the dazzling insulating material to completely cover the upper and lower surfaces of the conductive layer 1a, thereby forming a Insulating layer 20. It is particularly noted that when the LED is to be mounted or soldered, it may include a step e after the step 6), removing the _ ^ ^ ^ of the insulating layer 2 而The upper and lower surfaces of the conductive layer 10a are respectively formed with bare-conducting portions 2A and 22 (more clearly in the sixth figure) so that the UD can be mounted or soldered to the guiding portion 21 afterwards. Of course, step e) And the step e,) may also be combined into one step, that is, through the eye mold design of the extruder, the insulating material is directly formed on the upper and lower surfaces of the conductive layer 10a to be electrically insulated by extrusion. . 099104408 Form No. A0101 Page 8 of 28 0992008284- 201129262 [_ 冲 冲 冲 - - 部 部 部 部 部 部 部 部 部 部 部 部 冲 冲 冲 冲 冲 冲 冲 冲 冲 冲 冲 冲 冲 冲 冲 冲 冲 冲 冲 冲 冲 冲 冲 冲 冲 冲 冲 冲 冲 冲 冲 冲 冲 冲The material side is composed of a series line. [0028] 第五 such as the fifth map, with the punch (four) - part of the material edge 13, and respectively form a plurality of break points P_, and (four) the special side - the remaining part as - series line; more specifically, The breaking point p is located between the outer edge of the insulating layer (4) of the material side (4), and then a "work" type electric current is formed between any two adjacent long grooves (1), H") and the second parallel short groove 12. (d) (as indicated by the thick line); in addition, the open circuit_ is located on the "work" word circuit 14 which is intended to generate an open circuit. For example, in the embodiment shown in the fifth figure, every third long slot (1), n', u") produces a breaking point Q, with a breaking point (10), the "wei" word circuit 14 and the material side 13 remain connected 'so-to' the two sides 13 can be used as a series line It is not necessary to cut off to make full use of the material of the conductive layer 1〇a.

_]較佳地,如第六圖所示,在該步驟以後可以更包括 一步驟f’)—將經上述步驟f)的料邊13彎折到整個導電 層l〇a的背面,藉此縮減其整體寬度,而形成如第七圖所 示的一押出式軟性電路板1。 [0030] 相較於先前技術,由於本發明的製作方法主要是將金屬 料帶10沖設出具有多個長槽(11、u, 、u”)與並列短 槽12的一導電層i〇a之後,並將絕緣材料以押出機包覆於 此導電層l〇a的上下表面而形成一絕緣層2〇,最後沖設出 工」子狀電路14及相關斷路點p與q,並利用料邊i 3 的剩餘部份作為一串聯線路,所以本發明的製作方法不 099104408 需要利用微影姓刻或曝光等諸多步驟,製程相當簡易 表單編號A0101 第9頁/共28頁 0992008284-0 201129262 可大幅降低製造成本且縮短製造時間。 [0031] 再次參考第七圖,本發明亦提供一種押出式軟性電路板1 ,其包括一導電層l〇a及一絕緣層20 ;導電層10a間隔開 設有複數長槽(11、11’ 、11”)及在任二相鄰該長槽 (11、11’ 、11”)之間開設二並列短槽12,且於任二相 鄰該長槽(11、11’ 、1Γ )及該二並列短槽12間構成一 「工」字狀電路14 ;絕緣層20係以押出方式包覆於該導 電層10a的上下表面。 [0032] 由於本發明的押出式軟性電路板1僅具有一導電層10a及 包覆於導電層l〇a上下表面的一絕緣層20,所以其結構比 起印刷電路板或傳統軟性電路板更為簡化;另外,本發 明利用任二相鄰長槽(11、11’ 、11”)及二並列短槽12 間構成一「工」字狀電路14作為導電電路,所以其電路 設計相當精簡。 [0033] 另一方面,由於本發明的押出式軟性電路板1的電路精簡 且模組化,所以製造商只需要依照客戶需要而裁切出具 有適當長度即可,完全不需要變更任何製造流程與設備 就能夠供應多種規格的客製化軟性電路板,這對於製造 商來說相當有利且符合經濟效益。 [0034] 參考第八圖至第十圖,本發明亦提供一種具押出式軟性 電路板的條燈100,包括:上述押出式軟性電路板1、及 間隔設置於該押出式軟性電路板1上的複數個LED 2。 [0035] 在將LED 2設置於該押出式軟性電路板1上之前,必須在 絕緣層20對應該「工」字狀電路14位置開設有裸露導接 099104408 表單編號A0101 第10頁/共28頁 0992008284-0 201129262 部21與22,也就是必須實施上述步驟e,),藉此,每一 LED分別跨設於该長槽(11、1丨’ 、11”)上且透過裸露’ 的該導接部21而電性連接該導電層i〇a。 [0036] 參考第九圖,根據本發明,具押出式軟性電路板的條燈 100在實際應用時,可以在彎折到導電層1 背面的料邊 13底下鋪設一電氣絕緣膠膜3(例如PET膜且在焊接有 LED 2的「工」字狀電路14的正下方塗抹一絕緣導熱膠4 ,以便將LED 2所產生的熱量朝下傳導出來;最後,在底 面鋪設一散熱銅箔層5,並將整個條燈1 〇 〇以此散熱銅箔 層5抵靠於一散熱模組(未顯示)上,以便將整個條燈100 所產生的熱量散逸出去。 [0037] 參考第十圖,將說明條燈1 〇 〇上的多個LED 2之間的電性 連接《在第十圖所示的實施例中,顯示出安裝有六個LED 2,左邊三個LED 2串聯成第一組’而古三個LED 2串 聯成第二組,而這二組LED 2分別利用上下料邊13而形成 一並聯配置。Preferably, as shown in the sixth figure, after the step, a step f') may be further included - the edge 13 of the step f) is bent to the back surface of the entire conductive layer 10a, thereby The overall width is reduced to form an extruded flexible circuit board 1 as shown in the seventh figure. [0030] Compared with the prior art, the manufacturing method of the present invention mainly applies the metal strip 10 to a conductive layer having a plurality of long grooves (11, u, u") and parallel short grooves 12. After a, the insulating material is coated on the upper and lower surfaces of the conductive layer 10a with an extruder to form an insulating layer 2, and finally the sub-circuit 14 and the associated breaking points p and q are punched out and utilized. The remaining part of the material edge i 3 is used as a series circuit, so the manufacturing method of the present invention is not 099104408. It is necessary to use a number of steps such as lithography or exposure, and the process is quite simple. Form number A0101 Page 9 / Total 28 pages 0992008284-0 201129262 It can greatly reduce manufacturing costs and shorten manufacturing time. [0031] Referring again to the seventh figure, the present invention also provides an extruded flexible circuit board 1 including a conductive layer 10a and an insulating layer 20; the conductive layer 10a is spaced apart by a plurality of long slots (11, 11', 11") and between two adjacent slots (11, 11', 11"), two parallel short slots 12 are defined, and any two adjacent slots (11, 11', 1Γ) and the two are juxtaposed The short slots 12 form a "work" word circuit 14; the insulating layer 20 is applied to the upper and lower surfaces of the conductive layer 10a in an extruded manner. [0032] Since the extruding flexible circuit board 1 of the present invention has only one conductive layer 10a and an insulating layer 20 covering the upper and lower surfaces of the conductive layer 10a, the structure is more than that of a printed circuit board or a conventional flexible circuit board. In addition, the present invention utilizes any two adjacent long slots (11, 11', 11") and two parallel short slots 12 to form a "work" word circuit 14 as a conductive circuit, so that the circuit design is quite simplified. [0033] On the other hand, since the circuit of the extruding flexible circuit board 1 of the present invention is simplified and modular, the manufacturer only needs to cut the appropriate length according to the customer's needs, and does not need to change any manufacturing process at all. It is possible to supply a wide range of custom flexible boards with equipment, which is quite advantageous and economical for manufacturers. [0034] Referring to the eighth to tenth drawings, the present invention also provides a strip lamp 100 having an extruded flexible circuit board, comprising: the above-mentioned extruded flexible circuit board 1, and spaced apart from the push-type flexible circuit board 1 Multiple LEDs 2. [0035] Before the LED 2 is placed on the push-type flexible circuit board 1, the bare conductor must be opened at the position of the insulating layer 20 corresponding to the "work" type circuit 14 099104408 Form No. A0101 Page 10 of 28 0992008284-0 201129262 Parts 21 and 22, that is, the above steps e,) must be implemented, whereby each LED is spanned over the long groove (11, 1丨', 11") and transmitted through the bare ' The conductive layer i〇a is electrically connected to the connecting portion 21. [0036] Referring to the ninth figure, according to the present invention, the strip lamp 100 with the extruded flexible circuit board can be bent to the back of the conductive layer 1 in practical application. An electrical insulating film 3 (for example, a PET film is disposed under the material edge 13 and an insulating thermal conductive adhesive 4 is applied directly under the "work" word circuit 14 to which the LED 2 is soldered, so that the heat generated by the LED 2 faces downward. Conducted out; finally, a heat-dissipating copper foil layer 5 is laid on the bottom surface, and the entire strip lamp 1 is pressed against the heat-dissipating copper foil layer 5 against a heat-dissipating module (not shown), so that the entire strip light 100 The generated heat is dissipated. [0037] Referring to the tenth figure, the strip light 1 will be explained. Electrical connection between the plurality of LEDs 2 on the crucible "In the embodiment shown in the tenth figure, it is shown that six LEDs 2 are mounted, and the three LEDs 2 on the left are connected in series to the first group" and the ancient three The LEDs 2 are connected in series to form a second group, and the two sets of LEDs 2 are respectively formed into a parallel configuration by the upper and lower sides 13 .

[0038] 每一LED 2分別跨設於一長槽(H、11’ 、U”)上且電 性連接「工」字狀電路14,更明確地說,在左邊的三個 LED 2中,每一LED 2分別分別以其正負極相連的串聯方 式佈設於長槽(11、11, 、11”)上,相鄰二LED 2之間 則利用「工」字狀電路14而電性導接,如此一來,當第 十圖下方的料邊13左端輸入一電壓Vin時,一部份電流直 接進入.第一組LED 2,而另一部份則沿著下方料邊13朝右 流向第二組LED 2内;在流入第〆組LED 2的電流中,由 099104408 於絕緣層20外緣的一部份料邊13已被移除而形成多個斷 表單編號 AG101 第 11 頁/共 28 S 0992008284-0 201129262 路點P,所以電流只能朝右流過每一 LED 2内部及各個「 工」字狀電路14 ;另一方面,左邊算來第三個LED 2與第 四個LED 2之間的「工」字狀電路14被沖設成一斷路點Q ,所以電流無法流到第四個LED 2,而僅能從第三個LED 2旁所預留的料邊13連接處,最後返回第十圖上方料邊13 的左端,而產生一電壓Vout。 [0039] 第二組LED 2的電流方向與第一組LED 2相同且其兩端電 壓差也相同,因此,第一組LED 2及第二組LED 2為並聯 配置;換句話說,每一該「工j字狀電路14兩側所連接 的該二LED 2呈電性串聯配置。因此,安裝條燈100時, 只需要在條燈100 —側的上下料邊13分別接上正電壓與負 電壓,即可形成電性導接,使每一LED 2正常運作而發光 。由於每一 LED 2彼此相互串聯,所以通過LED 2的電流 均相同,所產生的發光功率也相同。 [0040] 雖然本發明所顯示的實施例中是以三個LED 2串連起來為 一組,但顯然LED 2的串聯數量可以任意選擇,只要相關 的斷路點P與Q配合即可。 [0041] 由於本發明的條燈100是直接將複數個LED 2間隔設置於 押出式軟性電路板1上且電性連接該導電層1 0a,所以, 此條燈100的結構簡單並符合薄型化需求,製程簡化,因 而可大幅降低製造成本與時間。另一方面,本發明的條 燈100可依據客戶需要而裁切成適當長度,完全不需要變 更任何製造流程與設備就能夠供應多種規格的客製化條 燈,這對於製造商來說相當有利且符合經濟效益。 099104408 表單編號A0101 第12頁/共28頁 0992008284-0 201129262 [0042] 綜上所述,當知本發明確實已具有產業利用性、新穎性 與進步性,又本發明之構造亦未曾見於同類產品及公開 使用,完全符合發明專利申請要件,爰依專利法提出申 請。 【圖式簡單說明】 [0043] 第一圖係本發明的製作方法之流程圖。 [0044] 第二圖顯示本發明的金屬料帶。 [0045] 第三圖顯示本發明的金屬料帶,其上沖設出複數長槽、 〇 短槽、及二料邊。 [0046] 第四圖顯示本發明的金屬料帶上押出包覆有絕緣層。 [0047] 第五圖顯示第四圖的金屬料帶中移除掉一部份料邊以形 成多個斷路點。 [0048] 第六圖係沿著第五圖的直線5-5所作之侧視剖面圖,其中 兩側的料邊被彎折到底面。 ^ [0049] 第七圖係本發明押出式軟性電路板之立體示意圖。 〇 [0050] 第八圖係本發明具押出式軟性電路板上安裝有LED之立體 示意圖。 [0051] 第九圖係本發明具押出式軟性電路板的條燈之側視剖面 圖。 [0052] 第十圖係顯示本發明具押出式軟性電路板的條燈上的電 流走向之示意圖。 【主要元件符號說明】 099104408 表單編號A0101 第13頁/共28頁 0992008284-0 201129262 [0053] 1押出式軟性電路板 [0054] 2 LED [0055] 3電氣絕緣膠膜 [0056] 4絕緣導熱膠 [0057] 5散熱銅箔層 [0058] 10金屬料帶 [0059] 10a導電層 [0060] 11、11’ 、11” 長槽 [0061] 12短槽 [0062] 13料邊 [0063] 1 31孔洞 [0064] 14 「工」字狀電路 [0065] 20絕緣層 [0066] 21導接部 [0067] 22導接部 [0068] 100條燈 [0069] Vin電壓 [0070] Vout電壓 [0071] P斷路點 099104408 表單編號A0101 第14頁/共28頁 0992008284-0 201129262[0072] Q斷路點[0038] Each of the LEDs 2 is respectively disposed on a long slot (H, 11', U") and electrically connected to the "work" word circuit 14, and more specifically, in the three LEDs 2 on the left side, Each LED 2 is respectively arranged on the long slot (11, 11, 11, 11" in a series connection with its positive and negative poles, and electrically connected by the "work" word circuit 14 between the adjacent two LEDs 2 respectively. In this way, when a voltage Vin is input to the left end of the material edge 13 at the bottom of the tenth figure, a part of the current directly enters the first group of LEDs 2, and the other part flows to the right along the lower material edge 13 In the two groups of LEDs 2; in the current flowing into the second group of LEDs 2, a portion of the edge 13 of the outer edge of the insulating layer 20 by 099104408 has been removed to form a plurality of broken form numbers AG101 Page 11 of 28 S 0992008284-0 201129262 waypoint P, so the current can only flow to the right through each LED 2 and each "work" word circuit 14; on the other hand, the third LED 2 and the fourth LED 2 are counted on the left side. The "work" word circuit 14 is flushed to a trip point Q, so current cannot flow to the fourth LED 2, but only from the third LED 2 Leaving the material 13 is connected at the edges, and finally return to the upper left side of the tenth FIG feed 13, to generate a voltage Vout. [0039] The current direction of the second group of LEDs 2 is the same as that of the first group of LEDs 2 and the voltage difference between them is also the same. Therefore, the first group of LEDs 2 and the second group of LEDs 2 are arranged in parallel; in other words, each The two LEDs 2 connected to both sides of the "j-shaped circuit 14" are electrically connected in series. Therefore, when the strip lamp 100 is installed, only the upper and lower sides 13 of the strip lamp 100 side need to be connected with a positive voltage and Negative voltage can form an electrical conduction, so that each LED 2 operates normally and emits light. Since each LED 2 is connected to each other in series, the current through the LED 2 is the same, and the generated luminous power is also the same. Although the embodiment shown in the present invention is a series of three LEDs 2 connected in series, it is obvious that the number of series of LEDs 2 can be arbitrarily selected as long as the relevant breaking point P is matched with Q. [0041] The strip lamp 100 of the invention directly lays the plurality of LEDs 2 on the push-type flexible circuit board 1 and electrically connects the conductive layer 10a. Therefore, the strip lamp 100 has a simple structure and meets the requirements of thinning, and the process is simplified. Therefore, the manufacturing cost and time can be greatly reduced. In the face, the strip lamp 100 of the present invention can be cut to an appropriate length according to the needs of the customer, and can supply a variety of customized strip lights without changing any manufacturing process and equipment, which is quite advantageous and conforms to the manufacturer. Economic Benefits 099104408 Form No. A0101 Page 12 / Total 28 Pages 0992008284-0 201129262 [0042] In summary, it is known that the present invention has industrial applicability, novelty and advancement, and the structure of the present invention has not been Seen in the same kind of products and public use, fully meet the requirements of the invention patent application, and apply according to the patent law. [Simplified illustration] [0043] The first figure is a flow chart of the manufacturing method of the present invention. [0044] The second figure shows The metal strip of the present invention [0045] The third figure shows the metal strip of the present invention, which is provided with a plurality of long grooves, a short groove, and two sides. [0046] The fourth figure shows the metal of the present invention. The strip is overcoated with an insulating layer. [0047] The fifth figure shows that a portion of the edge of the metal strip of the fourth figure is removed to form a plurality of break points. [0048] The sixth figure is along the Straight of five figures A side cross-sectional view taken on line 5-5, wherein the sides of the material are bent to the bottom surface. ^ [0049] The seventh drawing is a perspective view of the extruded flexible circuit board of the present invention. [0050] A perspective view of an LED having an extruded flexible circuit board mounted thereon. [0051] FIG. 9 is a side cross-sectional view of a strip lamp of the present invention having an extruded flexible circuit board. [0052] FIG. Schematic diagram of the current direction on the strip lamp with the extruded flexible circuit board. [Main component symbol description] 099104408 Form No. A0101 Page 13 / Total 28 Page 0992008284-0 201129262 [0053] 1 Extrusion type flexible circuit board [0054] 2 LED [0055] 3 electrical insulating film [0056] 4 insulating thermal adhesive [0057] 5 heat-dissipating copper foil layer [0058] 10 metal strip [0059] 10a conductive layer [0060] 11, 11', 11" long slot [ 0061] 12 short groove [0062] 13 material edge [0063] 1 31 hole [0064] 14 "work" word circuit [0065] 20 insulation layer [0066] 21 guide portion [0067] 22 guide portion [0068] 100 lights [0069] Vin voltage [0070] Vout voltage [0071] P break point 099104408 Form No. A0101 No. 14 / Total 28 0992008284-0 201129262 [0072] Q trip point

099104408 表單編號A0101 第15頁/共28頁 0992008284-0099104408 Form No. A0101 Page 15 of 28 0992008284-0

Claims (1)

201129262 七、申請專利範圍: 1 . 一種押出式軟性電路板,包括: 一導電層,間隔開設有複數長槽及在任二相鄰該長槽之間 開設二並列短槽,於任二相鄰該長槽及該二並列短槽間構 成一「工」字狀電路;以及 一絕緣層,以押出方式包覆於該導電層的上下表面。 2 .如請求項第1項所述之押出式軟性電路板,其中該導電層 是由銅製成。201129262 VII. Patent application scope: 1. An extruding flexible circuit board, comprising: a conductive layer, which is provided with a plurality of long slots and two parallel short slots between any two adjacent long slots, adjacent to the two adjacent The long groove and the two parallel short grooves constitute a "work" word circuit; and an insulating layer is wrapped on the upper and lower surfaces of the conductive layer in an extrusion manner. 2. The squeezing flexible circuit board of claim 1, wherein the conductive layer is made of copper. 3 .如請求項第1項所述之押出式軟性電路板,其中該絕緣層 是由鐵氟塑膠製成。 4 .如請求項第1項所述之押出式軟性電路板,其中該絕緣層 是由聚亞醯胺(PI )膜製成。 5 .如請求項第1項所述之貼合式軟性電路板,其更包括一串 聯線路,該串聯線路是從任一該「工」字狀電路延伸出並 彼此相互串聯而成。 6 . —種押出式軟性電路板製作方法,其步驟包括:3. The squeezing flexible circuit board of claim 1, wherein the insulating layer is made of ferrofluid plastic. 4. The extruding flexible circuit board of claim 1, wherein the insulating layer is made of a polyimide film. 5. The conformable flexible circuit board of claim 1, further comprising a series of lines extending from any of the "work" word circuits and connected in series with one another. 6. A method for making an extruded flexible circuit board, the steps of which include: a) 提供一金屬料帶; b) 以沖具對該金屬料帶沖設有複數長槽、複數並列短槽、 及形成於該等長槽及該等並列短槽外側的二料邊,以形成 一導電層; c) 提供一押出機; d) 提供一絕緣材料,以該押出機對該絕緣材料進行加溫熱 熔; e) 將該導電層通過步驟d)的該押出機,而使該熔融狀的 絕緣材料包覆於該導電層的上下表面,而形成一絕緣層; 099104408 表單編號A0101 第16頁/共28頁 0992008284-0 201129262 以及 f)以沖具移除一部份該等料邊而於經該步驟e)的該導電 層上分別形成多個斷路點,且剩餘部份的該等料邊係構成 一串聯線路。 如請求項第6項所述之押出式軟性電路板製作方法,其中 該步驟f)中的該導電層具有複數「工」字狀電路。 ❹ 如請求項第6項所述之押出式軟性電路板製作方法,其中 在該步驟e)之後,可以更包括一步驟e’)移除掉該絕緣 層的一中間部份而在該金屬料帶的上下表面分別形成裸露 的一導接部。 如請求項第6項所述之押出式軟性電路板製作方法,其中 在該步驟f)之後,可以更包括一步驟f’)將經該步驟f) 的該料邊彎折到整個該導電層的背面。 ίο . 一種具押出式軟性電路板的條燈.,包括: 一押出式軟性電路板,其包含: ❹ 一導電層,間隔開設有複數長槽及在任二相鄰該長槽之間 開設二並列短槽,於任二相鄰該長槽及該二並列短槽間構 成一「工」字狀電路;及 一絕緣層,以押出方式包覆於該導電層的上下表面;以及 複數個LED,間隔設置於該押出式軟性電路板上,每一該 LED分別跨設於該長槽上且電性連接該導電層。 11 . 如請求項第10項所述之具押出式軟性電路板的條燈,其中 在該絕緣層對應該「工」字狀電路位置開設有一導接部, 該LED透過該導接部與該導電層電性導接。 如請求項第10項所述之具押出式軟性電路板的條燈,其中 每一該「工」字狀電路兩側所連接的該二LED呈電性串聯 099104408 表單編號A0101 第17頁/共28頁 0992008284-0 12 . 201129262 配置。 099104408 表單編號A0101 第18頁/共28頁 0992008284-0a) providing a metal strip; b) punching the metal strip with a plurality of long grooves, a plurality of juxtaposed short grooves, and two sides formed on the outer sides of the long grooves and the parallel short grooves, Forming a conductive layer; c) providing an extruder; d) providing an insulating material to heat the insulating material by the extruder; e) passing the conductive layer through the extruder of step d) The molten insulating material is coated on the upper and lower surfaces of the conductive layer to form an insulating layer; 099104408 Form No. A0101 Page 16 of 28 0992008284-0 201129262 and f) removing a part of the punch A plurality of circuit breaking points are respectively formed on the conductive layer via the step e), and the remaining portions of the material sides form a series circuit. The method for fabricating an extruded flexible circuit board according to claim 6, wherein the conductive layer in the step f) has a plurality of "work" word circuits. The method for fabricating an extruded flexible circuit board according to claim 6, wherein after the step e), the method further includes a step e') removing an intermediate portion of the insulating layer in the metal material The upper and lower surfaces of the belt respectively form a bare guide. The method for manufacturing an extruded flexible circuit board according to claim 6, wherein after the step f), the step f') may further include bending the edge of the step f) to the entire conductive layer. The back. Ίο. A strip lamp having a squeezing flexible circuit board, comprising: a squeezing flexible circuit board comprising: ❹ a conductive layer spaced apart from the plurality of long slots and two juxtaposed between any two adjacent slots a short slot, forming a "work" word circuit between the adjacent two long slots and the two parallel short slots; and an insulating layer covering the upper and lower surfaces of the conductive layer in an extrusion manner; and a plurality of LEDs, The LEDs are disposed on the extruded flexible circuit board, and each of the LEDs is disposed on the long slot and electrically connected to the conductive layer. 11. The strip lamp of the squeezing flexible circuit board according to claim 10, wherein a guiding portion is formed at a position corresponding to the "working" word circuit of the insulating layer, and the LED passes through the guiding portion and the The conductive layer is electrically connected. The strip lamp of the push-type flexible circuit board according to claim 10, wherein the two LEDs connected to both sides of the "work" word circuit are electrically connected in series. 099104408 Form No. A0101 Page 17 / Total 28 pages 0992008284-0 12 . 201129262 configuration. 099104408 Form No. A0101 Page 18 of 28 0992008284-0
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Cited By (2)

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CN110073490A (en) * 2016-12-21 2019-07-30 亮锐控股有限公司 The alignment of LED is arranged
TWI746002B (en) * 2020-06-10 2021-11-11 宏齊科技股份有限公司 Led light source module which can be cut into various shapes

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TW520624B (en) * 2001-08-06 2003-02-11 Hung Co Ltd I Method for manufacturing flexible printed board
TWI230029B (en) * 2002-02-20 2005-03-21 Mektec Corp Process for massively producing tape type flexible printed circuits
TWM340680U (en) * 2008-03-12 2008-09-11 Coretronic Corp Flexible printed circuit board and electronic device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110073490A (en) * 2016-12-21 2019-07-30 亮锐控股有限公司 The alignment of LED is arranged
TWI745510B (en) * 2016-12-21 2021-11-11 荷蘭商露明控股公司 Lighting arrangement and method of manufacturing the same and vehicle headlight
CN110073490B (en) * 2016-12-21 2023-01-03 亮锐控股有限公司 Alignment arrangement for LEDs
TWI746002B (en) * 2020-06-10 2021-11-11 宏齊科技股份有限公司 Led light source module which can be cut into various shapes

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