CN102170747B - Extruded-type flexible circuit board, manufacturing method thereof and strip lamp with extruded-type flexible circuit board - Google Patents
Extruded-type flexible circuit board, manufacturing method thereof and strip lamp with extruded-type flexible circuit board Download PDFInfo
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- CN102170747B CN102170747B CN2010101221997A CN201010122199A CN102170747B CN 102170747 B CN102170747 B CN 102170747B CN 2010101221997 A CN2010101221997 A CN 2010101221997A CN 201010122199 A CN201010122199 A CN 201010122199A CN 102170747 B CN102170747 B CN 102170747B
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Abstract
The invention discloses an extruded-type flexible circuit board which comprises a conducting layer and an insulating layer. Two or more than two long grooves are spacingly arranged on the conducting layer and two short grooves are juxtaposedly arranged between any two adjacent long grooves. An I-shaped circuit is formed between any two adjacent long grooves and the two juxtaposed short grooves. The insulating layer is coated on the upper and lower surfaces of the conducting layer in an extruded manner. In addition, the invention also provides a manufacturing method of the extruded-type flexible circuit board and a strip lamp with the extruded-type flexible circuit board. The flexible circuit board provided by the invention is simple in structure and simplified in circuit design. The manufacturing method is simple, manufacturing cost is reduced and customized demands are satisfied.
Description
Technical field
The relevant a kind of flexible circuit board of the present invention, espespecially a kind of extrusion formula flexible circuit board and preparation method thereof, and also the present invention is also relevant for a kind of bar lamp with extrusion formula flexible circuit board.
Background technology
Along with making rapid progress of electronics technology, many kind electric connection modes (for example, printed circuit board (PCB) and flexible circuit board etc.) have been developed.Printed circuit board (PCB) (PCB, Printed Circuit Board) mainly is by insulated substrate, is coated in the copper foil circuit layer on the insulated substrate and the separator that is coated on the copper foil circuit layer is consisted of; The making flow process of printed circuit board (PCB) is as parent material take insulated substrate, make first internal layer circuit, this step must be via pre-treatment, upper photoresist, exposure, develop, the step such as etching and removing photoresistance, form required circuit, and by melanism or brown technique alligatoring copper surface, the then property of increase and insulating resin, then with the film extrusion, machinery or laser drill are then used in the conducting between the ectonexine, form conductive path between substrate through electroplating technology again, circuit board after the completing circuit technique is outer, is coated with anti-solder ink again, when avoiding welding electronic building brick, scolding tin overflow to adjacent lines causes short circuit, also can completely cut off substrate and airborne aqueous vapor and anti-oxidation, be coated with the circuit board behind the anti-solder ink, again according to customer requirement, do surperficial anti-oxidant treatment, to strengthen the top layer oxidation resistance.Therefore, the technique of printed circuit board (PCB) is quite loaded down with trivial details.
The substrate of flexible circuit board is made of insulating substrate, solid and copper conductor three; After producing circuit with photoetching technique; in order to prevent the copper wire oxidation of flexible circuit board; and protection circuit is avoided the impact of ambient temperature and humidity; must on flexible circuit board, add last layer coverlay (Cover layer) protection; this covered with protective film tradition adopts non-sensing optical activity material, must utilize first machine drilling that contact, weld pad and the guide hole of flexible circuit board are stayed in advance before adding this covered with protective film.Therefore, the technique of flexible circuit board is also very loaded down with trivial details.
In sum, the structure of printed circuit board (PCB) or flexible circuit board forms by insulated substrate, circuit layer and diaphragm, and manufacture process relates to all multi-steps such as photoetching etching or exposure; Yet, in some actual application scenarios, only need to utilize the minitype circuit board with ball bearing made using just can reach electric connection between the electronic building brick, and do not need to use all comparatively complicated printed circuit board (PCB) or flexible circuit boards of structure and technique; Therefore, be badly in need of a kind of have simple structure and the circuit board of simplifying circuit design, its technique is simple and easy, thereby can reduce manufacturing cost and time.
Therefore, how to solve the above problems a little, namely become the target that the present invention improves.
Summary of the invention
Main purpose of the present invention is to provide a kind of extrusion formula flexible circuit board, and it is simple in structure and have a circuit design of simplifying.
Another object of the present invention is to provide a kind of extrusion formula flexible circuit board manufacturing method, and its technique is simple and easy, thereby can reduce manufacturing cost and time.
Another purpose of the present invention is to provide a kind of bar lamp with extrusion formula flexible circuit board, this lamp simple in structure and be easy to make.
In order to achieve the above object, the invention provides a kind of extrusion formula flexible circuit board, comprise: conductive layer, spaced apartly be provided with two or more elongated slots and between any two adjacent these elongated slots, offer two side by side short grooves, between any two adjacent these elongated slots and these two side by side short grooves, consist of I-shaped shape circuit; And insulating barrier, be coated on the upper and lower surface of this conductive layer in the extrusion mode.
In order to achieve the above object, the present invention also provides a kind of extrusion formula flexible circuit board manufacturing method, and its step comprises: metal material belt a) is provided; B) punching is provided with two or more elongated slots, two or more short grooves and be formed at this elongated slot and two material limits in this side by side short groove outside arranged side by side to this metal material belt to rush tool, to form conductive layer; C) provide extruder; D) provide insulating material, by this extruder to this insulating material hot melt of heating; E) this conductive layer is passed through steps d) this extruder, and make the insulating material of this molten be coated on the upper and lower surface of this conductive layer, and form insulating barrier; And f) to rush that tool removes a part this material limit and through this step e) this conductive layer on form respectively a plurality of trip points, and this material limit formation series circuit of remainder.
In order to achieve the above object, the present invention also provides a kind of bar lamp with extrusion formula flexible circuit board, comprise: extrusion formula flexible circuit board, this circuit board comprises: conductive layer, spaced apartly be provided with two or more elongated slots and between any two adjacent these elongated slots, offer two side by side short grooves, between any two adjacent these elongated slots and these two side by side short grooves, consist of I-shaped shape circuit; Reach insulating barrier, be coated on the upper and lower surface of this conductive layer in the extrusion mode; And two or more LED, being arranged at intervals on this extrusion formula flexible circuit board, each this LED is located at respectively on this elongated slot and is electrically connected this conductive layer.
Compared to prior art, the present invention has following effect:
Because extrusion formula flexible circuit board of the present invention only has conductive layer and is coated on the insulating barrier of conductive layer upper and lower surface, so its structure is more simplified compared with printed circuit board (PCB) or traditional flexible circuit board; In addition, conductive layer punching of the present invention sets out a plurality of elongated slots and side by side short groove, and consists of I-shaped shape circuit between any two adjacent elongated slots and two side by side short grooves, so its circuit design is quite simplified.On the other hand, because the circuit of extrusion formula flexible circuit board of the present invention is simplified and modularization, so manufacturer is as long as need to cut out suitable length according to the client, do not need to change any manufacturing process fully and equipment just can be supplied the customized flexible circuit board of plurality of specifications, this is quite favourable and meet economic benefit for manufacturer.
Because manufacture method of the present invention mainly is that the metal material belt punching is set out the conductive layer with a plurality of elongated slots and side by side short groove, and insulating material formed insulating barrier by the upper and lower surface that extruder is coated on this conductive layer, backlash sets out I-shaped shape circuit, so manufacture method of the present invention does not need to utilize all multi-steps such as photoetching etching or exposure, technique is quite simple and easy, can significantly reduce manufacturing cost and shorten manufacturing time.
Because of the present invention lamp is directly two or more LED to be arranged at intervals on the above-mentioned extrusion formula flexible circuit board and to be electrically connected this conductive layer, so, this lamp simple in structure also meets the slimming demand, is easy to make, thereby can significantly reduces manufacturing cost and time.On the other hand, of the present invention lamp can need and cut into suitable length according to the client, do not need to change any manufacturing process and equipment fully just can supply customized lamp of plurality of specifications, and this is quite favourable and meet economic benefit for manufacturer.
Description of drawings
Fig. 1 is manufacture method flow chart of the present invention;
Fig. 2 shows metal material belt of the present invention;
Fig. 3 shows metal material belt of the present invention, and its upper punch sets out two or more elongated slots, short groove and two material limits;
Fig. 4 shows that extrusion is coated with insulating barrier on the metal material belt of the present invention;
Fig. 5 shows and removes part material limit in the metal material belt of Fig. 4 to form a plurality of trip points;
Fig. 6 is the side cutaway view along A-A line among Fig. 5, and wherein the material limit of both sides is folded into the bottom surface;
Fig. 7 is the schematic perspective view of extrusion formula flexible circuit board of the present invention;
Fig. 8 is the schematic perspective view that LED is installed on the extrusion formula flexible circuit board of the present invention;
Fig. 9 is the side cutaway view with bar lamp of extrusion formula flexible circuit board of the present invention;
Figure 10 shows the current trend schematic diagram on the bar lamp with extrusion formula flexible circuit board of the present invention.
Description of reference numerals
1 extrusion formula flexible circuit board, 2 LED
3 electric insulation glued membranes, 4 insulating heat-conductive glue
5 heat radiation copper foil layers, 10 metal material belts
10a conductive layer 11,11 ', 11 " elongated slot
12 short grooves, 13 material limits
131 holes, 14 I-shaped shape circuit
20 insulating barriers, 21 junctions
100 lamps of 22 junctions
Vin voltage Vout voltage
P trip point Q trip point
Embodiment
Relevant detailed description of the present invention and technology contents will cooperate description of drawings as follows, yet appended accompanying drawing purposes as an illustration only is not for limitation the present invention.
Referring to figs. 1 to Fig. 7, Fig. 1 is manufacture method flow chart of the present invention, and Fig. 2 to Fig. 7 shows respectively the semi-finished product under each step in the manufacture method of Fig. 1; At first, the invention provides a kind of extrusion formula flexible circuit board manufacturing method, its step comprises:
A) provide metal material belt;
As shown in Figure 2, provide copper strips by made metal material belt 10, particularly electroplating surfaces with tin of high-conductivity metal material.
B) punching is provided with two or more elongated slots, two or more short grooves and be formed at this elongated slot and two material limits in this side by side short groove outside arranged side by side to this metal material belt to rush tool, to form conductive layer;
As shown in Figure 3, be provided with two or more elongated slots 11,11 ', 11 to rush the tool (not shown) in metal material belt shown in Figure 2 10 interior punchings " ..., and at two adjacent elongated slots 11,11 ', 11 " ... between respectively punching be provided with two side by side short grooves 12; In addition, at this elongated slot 11,11 ', 11 " ... and should then form two material limits 13 in side by side short groove 12 outsides, form whereby conductive layer 10a; Material is arranged at intervals with hole 131 on the limit 13, so that conveyer belt or other conveyer are fixed the both sides of this conductive layer 10a, and with the length direction of conductive layer 10a conductive layer 10a is transported to the precalculated position continuously.
C) provide extruder; The used extruder (not shown) of the present invention is not limited to especially, as long as be applicable to the extruder of continuous extruding moulding; The inside that is noted that especially extruder has a mould (illustrating among the figure), and the profile of this mould is corresponding to the profile of the conductive layer 10a that passes through this mould.
D) provide insulating material, by this extruder to this insulating material hot melt of heating; Insulating material of the present invention can be selected iron fluoroplastics or pi (PI) film, but not as limit; Be noted that especially to have the heating arrangements (not shown) in the extruder, insulating material is injected in the eye mould of extruder, then reaches molten condition through heating, is beneficial to follow-up extrusion molding.
E) this conductive layer is passed through steps d) this extruder, and make the insulating material of this molten be coated on the upper and lower surface of this conductive layer, and form insulating barrier;
What specify is, when wish is installed or weld LED, at step e) afterwards, may further include step e '): remove the middle part of this insulating barrier 20 and form exposed junction 21 and 22, with the upper and lower surface (Fig. 6 is more clear) of this conductive layer 10a of exposed this metal material belt 10, in order to LED can be installed or be welded on this junction 21 in the future.Certainly, step e) with step e ') also can be merged into a step, the namely eye mould design by extruder directly forms this insulating barrier 20 and insulating material wish in the upper and lower surface of conductive layer 10a is produced on the position of electric insulation in the extrusion mode.
F) to rush that tool removes a part this material limit and through this step e) this conductive layer on form respectively a plurality of trip points, and this material limit formation series circuit of remainder.
As shown in Figure 5, remove this material limit 13 of a part to rush tool, and form respectively a plurality of trip point P and Q, and with the remainder on this material limit 13 as series circuit; More particularly, trip point P is between the outer rim of material limit 13 and insulating barrier 20, can find any two adjacent elongated slots 11,11 ', 11 this moment " and two form side by side I-shaped shape circuit 14 between the short grooves 12, namely this conductive layer 10a has two or more I-shaped shape circuit 14; In addition, trip point Q is positioned at predetermined the generation on the I-shaped shape circuit 14 that opens circuit, for example, in the embodiment shown in fig. 5, every three elongated slots 11,11 ', 11 " just produce a trip point Q, 13 reservations of this I-shaped shape circuit 14 and one of them material limit with trip point Q are connected, thus; two material limits 13 just can be used as series circuit and do not need to cut, to take full advantage of the material of conductive layer 10a.Namely this series circuit is to extend and be in series each other from any one this I-shaped shape circuit 14.
Preferably, as shown in Figure 6, at this step f) afterwards, may further include step f '): will be through above-mentioned steps f) material limit 13 be folded into the back side of whole conductive layer 10a, reduce whereby its overall width, and form extrusion formula flexible circuit board 1 as shown in Figure 7.
Compared to prior art, because manufacture method of the present invention mainly is metal material belt 10 punchings to be set out have a plurality of elongated slots 11,11 ', 11 " with the conductive layer 10a of arranged side by side short groove 12 after; and insulating material is coated on the upper and lower surface of this conductive layer 10a and forms insulating barrier 20 with extruder; backlash sets out I-shaped shape circuit 14 and relevant trip point P and Q; and the remainder that utilizes material limit 13 is as series circuit; so manufacture method of the present invention does not need to utilize all multi-steps such as photoetching etching or exposure; technique is quite simple and easy, can significantly reduce manufacturing cost and shorten manufacturing time.
Refer again to Fig. 7, the present invention also provides a kind of extrusion formula flexible circuit board 1 that adopts said method to make, and it comprises conductive layer 10a and insulating barrier 20; Spaced apart two or more elongated slots 11,11 ', 11 that is provided with of conductive layer 10a " and at any two adjacent these elongated slots 11,11 ', 11 " between offer two side by side short grooves 12, and at any two these adjacent elongated slots 11,11 ', 11 " and these two side by side short grooves 12 between consist of I-shaped shape circuit 14; Insulating barrier 20 is coated on the upper and lower surface of this conductive layer 10a in the extrusion mode.
This conductive layer 10a is made of copper.
Because extrusion formula flexible circuit board 1 of the present invention only has conductive layer 10a and is coated on the insulating barrier 20 of conductive layer 10a upper and lower surface, so its structure is more simplified compared with printed circuit board (PCB) or traditional flexible circuit board; In addition, the present invention utilizes any two adjacent elongated slots 11,11 ', 11 " and two consist of side by side I-shaped shape circuit 14 between the short grooves 12 as conducting channel, so its circuit design is quite simplified.
On the other hand, because the circuit of extrusion formula flexible circuit board 1 of the present invention is simplified and modularization, so manufacturer only need to cut out suitable length according to client's needs and get final product, do not need to change any manufacturing process fully and equipment just can be supplied the customized flexible circuit board of plurality of specifications, this is quite favourable and meet economic benefit for manufacturer.
To Figure 10, the present invention also provides a kind of bar lamp 100 with extrusion formula flexible circuit board, comprising with reference to figure 8: above-mentioned extrusion formula flexible circuit board 1 and be arranged at intervals at two or more LED 2 on this extrusion formula flexible circuit board 1.
Before LED 2 being arranged on this extrusion formula flexible circuit board 1, must should offer exposed junction 21 and 22 in I-shaped shape circuit 14 positions 20 pairs of insulating barriers, namely must implement above-mentioned steps e '), whereby, each LED 2 is located at respectively this elongated slot 11,11 ', 11 " upward and by this exposed junction 21 be electrically connected this conductive layer 10a.
With reference to figure 9, according to the present invention, has the bar lamp 100 of extrusion formula flexible circuit board when practical application, can under the material limit 13 that is folded into the conductive layer 10a back side, lay electric insulation glued membrane 3 (for example PET films), and under the I-shaped shape circuit 14 that is welded with LED 2, smear insulating heat-conductive glue 4, so that the heat that LED 2 is produced conducts out down; At last, lay heat radiation copper foil layer 5 in the bottom surface, and whole lamp 100 is resisted against on the radiating module (not shown) by this heat radiation copper foil layer 5, so that the heat dissipation that whole lamp 100 produced is gone out.
With reference to Figure 10, with the electric connection between a plurality of LED 2 on the explanation bar lamp 100.In the embodiment shown in fig. 10, demonstrate six LED 2 are installed, three LED 2 in the left side are connected into first group, and three LED 2 in the right are connected into second group, and these two groups of LED 2 utilize respectively loading and unloading limit 13 and formation configuration in parallel.
Each LED 2 is located at respectively elongated slot 11,11 ', 11 " upper and electric connection I-shaped shape circuit 14; more particularly; among three LED 2 of on the left side; each LED 2 is laid in elongated slot 11,11 ', 11 with the series system that its both positive and negative polarity links to each other respectively " on, then utilize I-shaped shape circuit 14 between the two adjacent LEDs 2 and be electrically conducted, thus, when the 13 left end input voltage vin of the material limit of Figure 10 below, one part of current directly enters first group of LED 2, and another part then flows in second group of LED 2 towards right along lower square stock limit 13; In flowing into the electric current of first group of LED 2, because being removed, the part material limit 13 of insulating barrier 20 outer rims forms a plurality of trip point P, so electric current can only flow through towards the right side each LED 2 inside and each I-shaped shape circuit 14; On the other hand, the left side calculates the I-shaped shape circuit 14 between the 3rd LED 2 and the 4th LED 2 to be set as trip point Q by punching, so electric current can't flow to the 4th LED 2, and the left end on square stock limit 13 on Figure 10 be returned in 13 junctions, material limit that only can reserve from the 3rd LED 2 sides, and produces voltage Vout.
The sense of current of second group of LED 2 and first group of LED 2 are identical and its both end voltage is poor also identical, and therefore, first group of LED 2 and second group of LED 2 are configuration in parallel; In other words, two these LED 2 connecting of each these I-shaped shape circuit 14 both sides are electrical configured in series.Therefore, during mounting bar lamp 100, only need to connect respectively positive voltage and negative voltage on the loading and unloading limit 13 of bar lamp 100 1 sides, can form and be electrically conducted, make each LED 2 normal operation and luminous.Because each LED 2 connects each other, so all identical by the electric current of LED 2, the luminous power that produces is also identical.
Although be to get up as one group take three LED, 2 series windings among the shown embodiment of the present invention, obviously the series connection quantity of LED 2 can be selected arbitrarily, as long as relevant trip point P cooperates with Q.
Because of the present invention lamp 100 is directly to be arranged at intervals at two or more LED 2 on the extrusion formula flexible circuit board 1 and to be electrically connected this conductive layer 10a, so, this lamp 100 simple in structure also meets the slimming demand, work simplification, thereby can significantly reduce manufacturing cost and time.On the other hand, of the present invention lamp 100 can need and cut into suitable length according to the client, do not need to change any manufacturing process and equipment fully just can supply customized lamp of plurality of specifications, and this is quite favourable and meet economic benefit for manufacturer.
Above-mentioned is preferred embodiment of the present invention only, is not to limit scope of the invention process.Be that all equalizations of doing according to claims of the present invention change and modification, be claim of the present invention and contain.
Claims (12)
1. an extrusion formula flexible circuit board is characterized in that, comprising:
Conductive layer, be provided with two or more elongated slots and between any two adjacent these elongated slots, offer two side by side short grooves in that metal material belt is spaced apart, this elongated slot is perpendicular to this metal material belt length direction and arranges, this weak point groove is to be parallel to this metal material belt length direction and to arrange, and consists of I-shaped shape circuit between any two adjacent these elongated slots and these two side by side short grooves; And
Insulating barrier is covered in the part upper and lower surface of this conductive layer in the extrusion mode.
2. extrusion formula flexible circuit board as claimed in claim 1 is characterized in that described conductive layer is to be made of copper.
3. extrusion formula flexible circuit board as claimed in claim 1 is characterized in that, described insulating barrier is to be made by the iron fluoroplastics.
4. extrusion formula flexible circuit board as claimed in claim 1 is characterized in that, described insulating barrier is to be made by the pi film.
5. extrusion formula flexible circuit board as claimed in claim 1 is characterized in that, also comprises series circuit, and this series circuit is to extend and be electrically connected to each other from any one this I-shaped shape circuit.
6. extrusion formula flexible circuit board manufacturing method is characterized in that its step comprises:
A) provide metal material belt;
B) punching is provided with two or more elongated slots, two or more short grooves and be formed at this elongated slot and two material limits in this side by side short groove outside arranged side by side to this metal material belt to rush tool, this elongated slot is perpendicular to this metal material belt length direction and arranges, this weak point groove is to be parallel to this metal material belt length direction and to arrange, to form conductive layer;
C) provide extruder;
D) provide insulating material, by this extruder to this insulating material hot melt of heating;
E) this conductive layer is passed through steps d) this extruder, and make the insulating material of this molten be covered in the part upper and lower surface of this conductive layer, and form insulating barrier; And
F) to rush that tool removes a part this material limit and through this step e) this conductive layer on form respectively a plurality of trip points, and this material limit formation series circuit of remainder.
7. extrusion formula flexible circuit board manufacturing method as claimed in claim 6 is characterized in that described step f) in this conductive layer have two or more I-shaped shape circuit.
8. extrusion formula flexible circuit board manufacturing method as claimed in claim 6, it is characterized in that, described step e) afterwards, also comprise step e '): remove the middle part of this insulating barrier and form exposed junction, with the upper and lower surface of this conductive layer of exposed this metal material belt.
9. extrusion formula flexible circuit board manufacturing method as claimed in claim 6 is characterized in that described step f) afterwards, also comprise step f '): will be through this step f) this material spring fold on this insulating barrier of whole this conductive layer lower surface.
10. the bar lamp with extrusion formula flexible circuit board is characterized in that, comprising:
Extrusion formula flexible circuit board, this circuit board comprises:
Conductive layer, be provided with two or more elongated slots and between any two adjacent these elongated slots, offer two side by side short grooves in that metal material belt is spaced apart, this elongated slot is perpendicular to this metal material belt length direction and arranges, this weak point groove is to be parallel to this metal material belt length direction and to arrange, and consists of I-shaped shape circuit between any two adjacent these elongated slots and these two side by side short grooves; And
Insulating barrier is covered in the part upper and lower surface of this conductive layer in the extrusion mode; And
Two or more LED are arranged at intervals on this extrusion formula flexible circuit board, and each this LED is located at respectively on this elongated slot and is electrically connected this conductive layer.
11. the bar lamp with extrusion formula flexible circuit board as claimed in claim 10 is characterized in that, described insulating barrier offers junction to upper surface position that should I-shaped shape circuit, and this LED is electrically conducted by this junction and this conductive layer.
12. the bar lamp with extrusion formula flexible circuit board as claimed in claim 10 is characterized in that, two these LED that described each I-shaped shape circuit both sides connect are electrical configured in series.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101221997A CN102170747B (en) | 2010-02-26 | 2010-02-26 | Extruded-type flexible circuit board, manufacturing method thereof and strip lamp with extruded-type flexible circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010101221997A CN102170747B (en) | 2010-02-26 | 2010-02-26 | Extruded-type flexible circuit board, manufacturing method thereof and strip lamp with extruded-type flexible circuit board |
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| CN102170747A CN102170747A (en) | 2011-08-31 |
| CN102170747B true CN102170747B (en) | 2013-04-03 |
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| CN102509760B (en) * | 2011-11-21 | 2014-04-02 | 上海大溥实业有限公司 | Linear LED and manufacturing method and application thereof |
| CN106340512B (en) * | 2016-11-08 | 2019-01-15 | 佛山市国星光电股份有限公司 | A kind of LED light strip and its manufacturing method and its back lighting device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002368285A (en) * | 2001-06-11 | 2002-12-20 | Omron Corp | Light emitter, light-emitting module and method of manufacturing the same |
| CN101611262A (en) * | 2007-02-16 | 2009-12-23 | 夏普株式会社 | The flat display apparatus of back lighting device and this back lighting device of use |
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| TWM345341U (en) * | 2008-05-30 | 2008-11-21 | Unity Opto Technology Co Ltd | Light-emitting structure |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002368285A (en) * | 2001-06-11 | 2002-12-20 | Omron Corp | Light emitter, light-emitting module and method of manufacturing the same |
| CN101611262A (en) * | 2007-02-16 | 2009-12-23 | 夏普株式会社 | The flat display apparatus of back lighting device and this back lighting device of use |
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