KR101729957B1 - Busbar insertion type inlay circuit board and manufacturing method thereof - Google Patents

Abstract

1. In a technical field, the present invention relates to a circuit board and a manufacturing method thereof, and more particularly, to a bus bar insertion type inlay circuit board into which a bus bar is inserted and a manufacturing method thereof. 2. In a configuration and an effect, the present invention provides the inlay circuit board formed by forming a hole pattern for inserting the bus bar into a bus bar insertion region of an inner layer board and inserting and combining an independently manufactured bus bar in the inside thereof, thereby fundamentally preventing a fire due to the disconnection or a short circuit (short) of a lead line generated in an electrically connected structure through the lead line by independently separating the bus bar from the circuit board like a circuit board according to an existing technique.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bus bar insertion type inlay circuit board,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board and a manufacturing method thereof, and more particularly, to a bus bar insertion type inlay circuit board having a bus bar inserted therein and a method of manufacturing the same.

Generally, a printed circuit board (PCB) refers to a circuit board on which various electronic components are mounted on an insulating plate, and circuits for connecting the components are formed. Such a printed circuit board is classified into a single-sided board, a double-sided board, and a multi-layer board depending on the number of circuit surfaces, and the higher the number of layers, the better the mounting force of the component.

Since the printed circuit board functions as a simple conductor that electrically connects the mounted component and the external component, it is preferable that the printed circuit board has a wide and thick circuit pattern as much as possible at a given condition. In particular, when a pulsed large current flows, the circuit board must be designed so that the path of the large current is made as wide and thick as possible to minimize the inductance and the voltage drop.

However, in the case of most electronic circuits requiring the use of a large current, a bus bar is used instead of a printed circuit board due to the limit of the current capacity. For example, a mold made of plastic is injection-molded on the outside of a bus bar made of pure copper to form a sealing molded body in which a bus bar is inserted into a mold. Both ends of the bus bar are connected to a lead wire , A cable, etc.).

However, there is a problem that the lead wire connecting the bus bar and the printed circuit board is easily disconnected or short-circuited to cause a fire. In particular, in a vehicle using a battery, a circuit board on which a battery, a bus bar and a switching part for supplying power to the main board are formed is connected by a lead wire to supply power of the battery to the main board, Or a short circuit (short-circuit) is caused, there is a problem that a fire occurs in the vehicle.

KR 10-1216345 B1, Dec. 20, 2012. KR 10-2012-0028750 A, 2012. 03. 23. KR 10-0952773 B1, 2010. 04. 06.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide an in-line circuit board in which a bus bar is inserted into a circuit board, The purpose is to provide.

According to one aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising the steps of: (a) forming a hole pattern for inserting a bus bar in a bus bar insertion region of an innerlayer substrate; And (b) inserting an independently manufactured bus bar into the hole pattern for inserting the bus bar, and inserting the insulated bus bar into the hole pattern for inserting the bus bar.

Preferably, the step (a) includes the steps of: (a-1) preparing the inner-layer substrate; (a-2) forming a circuit pattern in a circuit region of the innerlayer substrate; (a-3) forming a hole pattern for inserting the bus bar into a bus bar inserting region of the innerlayer board using a router; And (a-4) forming an oxide film on both surfaces of the innerlayer substrate.

Preferably, after the step (b), (c) a layup process for sequentially forming prepregs and copper foils on the both surfaces of the inner layer board to which the bus bars are coupled, ; (d) forming a hole in the inner layer substrate at a predetermined design diameter for realizing the necessary circuitry between layers or mounting parts of the assembly company; (e) forming a circuit pattern on the surface of the innerlayer substrate including the hole; (f) depositing an electronic component or the like on the upper layer substrate to form a resist pattern by applying, exposing, and developing the resist to prevent solder adhesion at an unnecessary portion; (g) cutting the outer periphery of the inner layer substrate into dimensions and shapes required by the ordering company; And (h) performing electroless gold plating and product inspection on the upper layer of the innerlayer substrate.

Preferably, the bus bar is formed of copper and includes first and second terminals separated from each other independently of each other.

According to another aspect of the present invention, there is provided a bus bar insertion type inlay circuit board manufactured by the method of manufacturing the bus bar insertion type inlay circuit board.

As described above, according to the present invention, there is provided an inlay circuit board for inserting a bus bar into a bus bar inserting region of an innerlayer board and inserting independently manufactured bus bars therein to provide an inlay circuit board. It is possible to prevent fire due to disconnection or short-circuit of the lead wire generated in a structure in which the bus bar is separated from the circuit board and electrically connected through the lead wire.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a flow chart showing a process of forming a hole pattern for inserting a bus bar in an inner layer substrate in order to describe a method of manufacturing a bus bar insertion type inlay circuit board according to an embodiment of the present invention; FIG.
FIG. 2 is a flow chart showing steps of each step of the manufacturing method shown in FIG. 1; FIG.
3 is a flow chart showing a process of forming a bus bar according to an embodiment of the present invention;
FIG. 4 is a view illustrating a bus bar manufactured by the manufacturing method shown in FIG. 3. FIG.
5 is a flow diagram illustrating a method of manufacturing an inlay substrate in accordance with an embodiment of the present invention.
FIG. 6 is a view illustrating a process of coupling a bus bar to the innerlayer substrate shown in FIG. 5. FIG.
FIG. 7 is a flow chart showing steps of each step of the manufacturing method shown in FIG. 5; FIG.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and how to accomplish them, will become apparent by reference to the embodiments described in detail below with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described below, but may be embodied in various other forms.

The present embodiments are provided so that the disclosure of the present invention is thoroughly disclosed and that those skilled in the art will fully understand the scope of the present invention. And the present invention is only defined by the scope of the claims. Thus, in some embodiments, well known components, well known operations, and well-known techniques are not specifically described to avoid an undesirable interpretation of the present invention.

In addition, like reference numerals refer to like elements throughout the specification. Moreover, terms used herein (to be referred to) are intended to illustrate the embodiments and are not intended to limit the invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. Also, components and acts referred to as " comprising (or comprising) " do not exclude the presence or addition of one or more other components and operations.

Unless defined otherwise, all terms (including technical and scientific terms) used herein may be used in a sense commonly understood by one of ordinary skill in the art to which this invention belongs. Also, commonly used predefined terms are not ideally or excessively interpreted unless they are defined.

Hereinafter, the technical features of the present invention will be described in detail with reference to the accompanying drawings.

1 is a flowchart showing a process of forming a hole pattern for inserting a bus bar in an inner layer substrate in order to describe a method of manufacturing a bus bar insertion type inlay circuit board according to an embodiment of the present invention. These are the process drawings showing the steps of each step of the manufacturing method.

As shown in Figs. 1 and 2A, an inner layer substrate 11 is prepared (ST11). At this time, the innerlayer substrate 11 may be a CCL (Copper Clad Laminated) substrate, and may have a laminated structure of a copper layer / a core layer / a copper layer.

Thereafter, as shown in Figs. 1 and 2B, a circuit pattern 11a is formed in the circuit region of the inner layer substrate 11 (ST12).

Thereafter, as shown in Figs. 1 and 2 (c), a bus bar insertion hole pattern 11b is formed in the bus bar insertion region of the innerlayer substrate 11 by using a router (ST13). At this time, the hole pattern 11b for inserting the bus bar may have a shape corresponding to the shape of the bus bar 20 so that the bus bar 20 (see FIG. 4) is inserted. For example, the hole pattern 11b for inserting the bus bar may be formed into a 'C' shape and a straight bar shape corresponding to the first terminal 21 and the second terminal 22, respectively.

Thereafter, as shown in Figs. 1 and 2 (d), an oxide film 12 is formed on the inner layer substrate 11 (ST14).

FIG. 3 is a flow chart showing a process of forming a bus bar according to an embodiment of the present invention, and FIG. 4 is a view illustrating a bus bar manufactured through the manufacturing process shown in FIG.

3 and 4, a bus bar 20 to be inserted into a hole pattern 11b for inserting a bus bar of the inner layer substrate 11 manufactured through FIGS. 1 and 2 is manufactured (ST21). The bus bars 20 are separated from each other by the first and second terminals 21 and 22, and are manufactured independently using copper.

As shown in FIG. 4, the bus bar 20 may include a first terminal 21 having a U-shaped structure and a second terminal 22 having a bar-shaped structure. Of course, the first and second terminals 21 and 22 are not limited to the shapes shown in FIG. 4, and may have various structures. For example, it may have various structures such as a 'T' shape or a 'ㅗ' shape.

3, an oxide film (not shown) is formed on the bus bar 20 (ST22).

FIG. 5 is a flowchart illustrating a method of manufacturing an inlay substrate according to an embodiment of the present invention, FIG. 6 is a view illustrating a process of coupling a bus bar to the innerlayer substrate shown in FIG. 5, and FIG. And the process steps of the respective steps of the illustrated manufacturing method.

5, 6, and 7A, the inlaying bus bar 20 is inserted into the bus bar inserting hole pattern 11b of the innerlayer board 11 to form the bus bar 20, (ST31).

5 and 7 (b), prepregs Pre-Preg are formed on both surfaces of the inner layer substrate 11 to which the first and second terminals 21 and 22 of the bus bar 20 are coupled, (13) and a copper copper foil (14) are sequentially formed to perform a layup process (ST32). At this time, a prepreg (Pre-Preg) and a copper copper foil are sequentially formed on both sides of the bus bar as shown in FIG. 7 (b). Then, the prepreg 13 is melted and cured by pressing and heating using a press (not shown) to adhere the copper foil 14 and the inner layer substrate 11 to produce a multilayer substrate.

As shown in FIGS. 5 and 7 (c), the necessary circuitry between the layers can be realized on the inner layer substrate 11 laminated on both sides or in multiple layers by using a CNC drill and a laser drill, The hole 15 is formed with a design designated diameter (ST33).

Thereafter, the copper layer 16 is formed by electrolytic copper plating along the surface of the inner layer substrate 11 including the holes 15 as shown in FIGS. 5, 7 (d) and 7 (e) (ST34).

5 and 7 (f), in order to protect the surface circuit of the wiring board from the external environment by mounting electronic parts or the like on the upper portion of the inner layer substrate 11 to prevent solder adhesion at unnecessary portions, Coating, exposure and development to form a resist pattern 18 (ST35).

Thereafter, as shown in Fig. 5, the outer edge of the product is cut into dimensions and shapes required by the ordering company (ST36).

Thereafter, as shown in FIG. 5, the electroless gold plating ENIG is carried out, and product inspection (confirmation of abnormality, product short-circuit by electric signal, and disconnection confirmation) is performed to complete the manufacturing process of the inlay substrate (ST37, ST38) .

As described above, in the present invention, the bus bar insertion hole pattern 11b is formed in the bus bar insertion area of the inner layer board 11, and the bus bar 20, which is manufactured independently, is inserted into the hole pattern 11b, It is possible to prevent fire due to disconnection or short circuit of the lead wire generated in a structure in which the bus bar is separated from the circuit board and electrically connected through the lead wire as in the conventional circuit board .

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

11: Inner layer substrate (CCL substrate)
11a: circuit pattern
11b: hole pattern for inserting bus bar
12: oxide film
13: Pre-Preg
14: Copper foil
15: Hall
16: copper layer
17: Circuit pattern
18: Resist pattern
20: bus bar
21: First terminal
22: second terminal

Claims (5)

(a) forming a hole pattern for inserting a bus bar in a bus bar inserting region of an innerlayer substrate;
(b) inserting an independently manufactured bus bar into the hole pattern for inserting the bus bar;
(c) a layup step of sequentially forming prepregs and copper foils on both sides of the inner layer board to which the bus bars are coupled, (Pre-Preg) and a copper copper foil (Copper Foil) sequentially;
(d) forming a hole in the inner layer substrate to implement the necessary circuitry between layers or to mount parts of an assembly company;
(e) forming a circuit pattern on a surface of the innerlayer substrate including the hole;
(f) forming a resist pattern by applying, exposing, and developing a resist to prevent solder adhesion at an unnecessary portion by mounting an electronic component on an upper portion of the innerlayer substrate;
(g) cutting the outer periphery of the inner layer substrate into dimensions and shapes required by the ordering company; And
(h) performing electroless gold plating and product inspection on the upper portion of the inner layer substrate.
The method according to claim 1,
The step (a)
(a-1) preparing the inner-layer substrate;
(a-2) forming a circuit pattern in a circuit region of the innerlayer substrate;
(a-3) forming a hole pattern for inserting the bus bar into a bus bar inserting region of the innerlayer board using a router; And
(a-4) forming an oxide film on both surfaces of the innerlayer substrate;
Wherein the inserting step includes the step of inserting the bus bar.
delete The method according to claim 1,
Wherein the bus bars are formed of copper and include first and second terminals that are independently separated from each other.
A bus bar insertion type inlay circuit board manufactured by the method of manufacturing the bus bar insertion type inlay circuit board according to any one of claims 1, 2, and 4.

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