JP5961818B2 - Wiring board - Google Patents

Description

  The present invention relates to a wiring board in which a terminal block is solder-connected to a wiring pattern.

2. Description of the Related Art Conventionally, there has been provided a wiring board in which a wiring pattern is provided and an electric circuit is configured by inserting and soldering legs of electronic components such as resistors and capacitors into through holes provided in the wiring pattern. This wiring board is manufactured so as to constitute various electric circuits according to electronic equipment. In a slightly larger device, a plurality of wiring boards are provided and the wiring boards are connected by wiring or the like to form an electric circuit.

In this way, when connecting multiple wiring boards by wiring, if the wiring connecting the wiring boards handles a large current like a power line for power supply, the wiring becomes thicker, so A device is required to connect to the board. Specifically, the terminal block is provided on the wiring board and the wiring is connected to the terminal block.

On the other hand, various methods for soldering electronic components to a wiring board have been provided. For example, in the method disclosed in Patent Document 1, a flat portion of an inner wall that forms a long hole-shaped through hole into which a leg of an electronic component is inserted is recessed, and solder is filled in the through hole to solder the electronic component foot. doing.
This increases the contact area between the solder flowing into the through-hole and the inner wall of the through-hole, improving the solder wet-up property and filling the through-hole with solder, so that the corresponding solder strength can be obtained. Can do.

JP 2010-3984 A

However, the soldering method described in Patent Document 1 is a technique for soldering the legs of an electronic component to a wiring board. When soldering a terminal block using such a technique, only soldering the legs is necessary. There is a problem that the cross-sectional area of the path through which the current flows becomes small and the amount of heat generation increases.

The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a wiring board that can suppress heat generation of a terminal block attached to the wiring board.

In order to achieve the above object, a wiring board according to the present invention is arranged on a wiring pattern, a terminal block that is bent from a solderable plate member, and the wiring pattern and the wiring pattern. In a wiring board comprising: a soldering part for connecting to the terminal block; and a through hole provided in the soldering part and into which the foot is inserted, wherein the leg is soldered in the through hole. The through hole is provided with a notch groove in which an inner wall forming the through hole is cut outward, and when the terminal block is arranged, the through hole is covered by the terminal block, and the arrangement of the terminal block A hole is formed in the surface by the terminal block and the notch groove, and when soldering, the soldered portion and the terminal block are soldered by solder supplied through the hole. And butterflies.

According to the wiring board of the present invention, the soldered portion and the terminal block are soldered, so that not only the foot of the terminal block but also the soldered portion to the terminal block, and the soldered portion to the terminal block via the solder. A path for current flow is created. For this reason, since the cross-sectional area of the path | route through which an electric current can be increased, heat_generation | fever can be suppressed.

In the above invention, the hole is formed by the through hole, the terminal block, and the cutout groove.

  In the above-mentioned invention, the foot is inserted into the notch groove.

  In the above-described invention, a metal wire straddling the hole is provided.

In the above-mentioned invention, the cutout groove is formed at two locations on the inner wall forming the through hole, and two holes are formed by sandwiching the terminal block by the two cutout grooves.

ADVANTAGE OF THE INVENTION According to this invention, the wiring board which can suppress the heat_generation | fever of the terminal block attached to a wiring board can be provided.

It is a disassembled perspective view of the terminal block part of a wiring board. It is a perspective view of the terminal block part of the wiring board to which the terminal block was attached. It is a figure which shows the soldering part of a wiring board.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is an exploded perspective view of a terminal block portion of a wiring board. FIG. 2 is a perspective view of the terminal block portion of the wiring board to which the terminal block is attached. FIG. 3 is a diagram showing a soldering portion of the wiring board. FIG. 3A is a diagram in which a jumper wire described later is removed, and FIG. 3B is a diagram in which the jumper wire is arranged. The wiring board 10 includes a wiring pattern 11, a through hole 12, a terminal block 13, a soldering portion 14, a notch groove 15, a jumper wire 17 (metal wire), and an electronic component (not shown).

A through hole 12 is formed in the wiring board 10 at a portion where the electronic component, the terminal block 13 and the like are arranged. By arranging the electronic component and the terminal block 13 and soldering, a predetermined electric circuit is obtained. The wiring pattern 11 is printed so as to be. Further, a resist is applied to the wiring board 10 from above the wiring pattern 11 except for the periphery of the through hole 12, and the periphery of the through hole 12 constitutes a soldered portion 14 where the wiring pattern 11 is exposed. That is,
The through hole 12 is provided in the soldered portion 14 in the wiring pattern 11. still,
In FIG. 1 and FIG. 2, since the wiring pattern 11 is hidden by the resist, it is indicated by a dotted line. Further, the inner wall of the wiring board 10 forming the through hole 12 is coated with the same material as the wiring pattern.

The terminal block 13 is made of a solderable metal material (for example, aluminum). Terminal block 13
Is formed in a U-shaped cross section in which two side surfaces 34 and an upper surface 33 are formed by bending both ends of a rectangular plate member. Two legs 31 protruding downward (in the direction of the wiring board) are provided on the lower sides of both side surfaces of the terminal block 13. A screw hole 32 is provided on the upper surface of the terminal block 13. For example, a wiring having a U-shaped terminal, a round terminal, or the like can be fixed by being sandwiched between the screw and the terminal block using a screw. . In FIG. 2, the wiring 42 having the round terminal 41 is
It is screwed through a ring washer 43.

Two soldering portions 14 are configured so that both side surfaces 34 of the terminal block 13 can be arranged respectively. The through holes 12 are opposed to the legs 31 provided on the side surfaces 34 of the terminal block 13 in the respective soldered portions 14, and are provided at positions where the legs 31 are fitted (the same number is provided).

The through hole 12 has a long hole shape, and is provided with a notch groove 15 in which the inner wall of the through hole 12 is notched outward. This notch groove 15 is formed in each of two inner walls that form the longitudinal direction of the long hole shape.

In the terminal block 13, the legs 31 are inserted into the through holes 12, and both side surfaces 34 are arranged on the soldering portions 14. As shown in FIG. 3A, when the terminal block 13 is arranged, the through hole 12 is covered by the side surface 34 of the terminal block 13, and the terminal block 13 has a terminal on the arrangement surface of the wiring board 10. A hole A is formed by the base 13 and the cutout groove 15. In this embodiment, the terminal block 13
Since the foot 31 of the terminal block 13 is not inserted into the notch groove 15 and the width of the foot 31 of the terminal block 13 is the same as the width of the side surface 34, the hole 31 is precisely formed by the through hole 12, the terminal block 13, and the notch groove 15. A is formed (indicated by a dotted line in FIG. 3A). Each through hole 12 has two notches A
Thus, two holes A are formed across the side surface 34 of the terminal block 13. 3 indicates the side surface 34 of the terminal block 13 disposed on the soldering portion 14.

The jumper wire 17 is disposed on the soldered portion 14 along the side surface 34 of the terminal block 13 across the hole A (see FIG. 3B). Two jumper wires 17 are arranged with the terminal block 13 in between. The jumper wire 17 is fixed by inserting both ends into a jumper wire insertion hole 18 provided on the soldering portion 14.

The wiring board 10 is soldered after the terminal block 13 and the jumper wire 17 are disposed, and then the back surface opposite to the surface on which these components are disposed is attached to a molten solder bath. By this soldering, the solder 16 is filled into the through hole 12 and the notch groove 15 from the back side. Also, the solder 16 filled from the back side is supplied from the hole A to the soldering portion 14 on the surface of the wiring board 10. The terminal block 13, the soldered portion 14, and the jumper wire 17 are soldered to each other by the solder 16 (see FIG. 2).

At this time, if the molten solder 16 adheres to the jumper wire 17 straddling the hole A, the attached molten solder 16 spreads along the jumper wire 17, so that more solder 16 is transferred from the back surface to the soldered portion 14 on the surface. Can be supplied to.

Also, the solder 16 passes through the two holes formed with the side surface 34 of the terminal block 13 in between, respectively.
3 is supplied. Thereby, since the solder 16 can be supplied from both sides of the terminal block 13, the solder 16 can be supplied without unevenness.

Further, since the jumper wire 17 of the wiring board 10 is arranged along the side surface 34 of the terminal block 13, the solder 16 can be supplied to the terminal block 13 without unevenness. Further, since the two jumper wires 17 are arranged across the terminal block 13, the solder 16 is supplied from both sides of the terminal block 13 without unevenness.

As described above, since the structure for supplying the solder from the back surface to the surface or the structure for supplying a large amount of solder without any unevenness is required, it is necessary to perform additional soldering manually without supplying the solder to the surface. The situation can be avoided or reduced. As a result, the number of soldering steps can be reduced and the production efficiency can be improved.

In this way, the same soldered portion 14 has through holes 12, holes A, and jumper wires 17
The terminal block 13 is disposed on the soldering portion 14 and soldering is performed. From this, the soldering part 14 and the terminal block 13 are connected by the solder 16 supplied through the through hole 12.
And the jumper wire 17 are soldered together. Then, the wiring pattern 11 and the terminal block 13 are connected, and the terminal block 1 is similarly connected to another wiring substrate 10 to which the terminal block 13 is soldered.
Three are connected to form an electric circuit of one device. The wiring board 10 can be used for a system interconnection device having a power line such as a booster circuit and an inverter circuit, a motor driving device, and the like.

As described above, according to the present embodiment, the solder 16 is supplied to the terminal block 13 through the hole A by soldering, and the soldering portion 14, the terminal block 13, and the jumper 17 wires are integrated. Can be soldered to. At this time, since the solder wire 17 straddling the hole A pulls up the solder from the hole A, the solder is substantially piled up along the terminal block 13 toward the upper surface 33 side of the terminal block 13 on the soldering portion 14. The soldering strength of the terminal block 13 to be soldered to the wiring board 10 is improved. Further, there is a path through which a current flows from the soldering portion 14 to the terminal block 13 and from the soldering portion 14 to the terminal block 13 via the solder 16 (this accumulated solder does not go through the foot 31 but the terminal block 1).
3 is a path for sending current to 3). For this reason, the cross-sectional area of the path | route through which an electric current flows can be increased, and the heat_generation | fever in the terminal block 13 can be suppressed.

Further, according to the present embodiment, not only the legs 31 of the terminal block 13 but also the soldering portion 14 and the terminal block 13 are connected by soldering. Thereby, the intensity | strength of the terminal block 13 attached to the wiring board 10 improves.

Further, according to the present embodiment, the hole A has the through hole 12, the terminal block 13, and the notch groove 15.
It is formed by. As a result, a portion where solder is supplied along the terminal block 13 of the through hole 12 is increased. Thereby, solder can be supplied to the terminal block 13 without unevenness.

As mentioned above, although one Embodiment of this invention was described, the above description is for making an understanding of this invention easy, and does not limit this invention. It goes without saying that the present invention can be changed and improved without departing from the gist thereof, and that the present invention includes equivalents thereof.

For example, in this embodiment, the foot 31 of the terminal block 13 is inserted into the through hole 12 and the notch groove 1
5, the foot 31 of the terminal block 13 is not inserted, but the thickness of the side surface 34 of the terminal block 13 may be increased so that the foot 31 is inserted into the notch groove 15. By doing in this way, since the area of the leg 31 of the terminal block 13 can be enlarged, the cross-sectional area of the path | route through which an electric current flows increases, and the heat_generation | fever of the terminal block 13 can be suppressed more.

For example, in the present embodiment, the notch groove 15 is provided in the long hole-shaped through hole 12, but other shapes such as a round hole shape and a square hole shape may be used.

Further, for example, the solder paste may be disposed along the position of the side surface 34 of the terminal block 13 so as to cover the hole A, and then the terminal block 13 may be disposed and soldered. This
When soldering is performed in the solder bath, the disposed solder paste is melted, and the solder rising from the solder bath is pulled up by the melted solder paste. Further, since this solder paste itself is also used for soldering between the terminal block 13 and the soldering portion 14, more solder can be supplied to the terminal block 13 without unevenness. It should be noted that the solder 16 is sufficiently supplied to the soldering portion 14 and the terminal block 13 even when soldering is performed in the solder bath after the solder paste is disposed, or when soldering is performed in the solder bath without disposing the solder paste. In this case, the jumper line 17 need not be arranged.

DESCRIPTION OF SYMBOLS 10 Wiring board 11 Wiring pattern 12 Through hole 13 Terminal block 14 Soldering part 15 Through-hole 16 Solder 17 Jumper wire (metal wire)
18 Jumper wire insertion hole 31 Leg 32 Screw hole 33 Upper surface of terminal block 34 Side surface A of terminal block

Claims (4)

A wiring pattern;
A terminal block configured to be bent from a plate member having legs and solderable;
A soldered portion for connecting the wiring pattern and the terminal block disposed on the wiring pattern;
A through-hole provided in the soldering portion and into which the foot is inserted, and a wiring board for solder-connecting the foot in the through-hole,
The through hole is provided with a notch groove in which the inner wall forming the through hole is notched outward.
When the terminal block is arranged, the through hole is covered by the terminal block, and a hole is formed in the arrangement surface of the terminal block by the terminal block and the notch groove,
A wiring board, wherein the soldering portion and the terminal block are solder-connected by solder and provided with a metal wire straddling the hole. The wiring board according to claim 1, wherein the hole is formed by the through hole, the terminal block, and the cutout groove.   The wiring board according to claim 1, wherein the foot is inserted into the notch groove. The notch groove is formed in two places on the inner wall forming the through hole,
The wiring board according to claim 1, wherein two holes are formed by sandwiching the terminal block by the two notched grooves.

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