JP5838304B2 - Wiring board - Google Patents

Description

  The present invention relates to a wiring board in which a terminal block is solder-connected to a wiring pattern.

2. Description of the Related Art Conventionally, there has been provided a wiring board in which a wiring pattern is provided and an electric circuit is configured by inserting and soldering legs of electronic components such as resistors and capacitors into through holes provided in the wiring pattern. This wiring board is manufactured so as to constitute various electric circuits according to electronic equipment.
In a slightly larger device, a plurality of wiring boards are provided and the wiring boards are connected by wiring or the like to form an electric circuit.

In this way, when connecting multiple wiring boards by wiring, if the wiring connecting the wiring boards handles a large current like a power line for power supply, the wiring becomes thicker, so A device is required to connect to the board. Specifically, the terminal block is provided on the wiring board and the wiring is connected to the terminal block.

On the other hand, various methods for soldering electronic components to a wiring board have been provided. In the method shown in Patent Document 1, an auxiliary through hole is provided in the vicinity of a through hole into which a leg of an electronic component is inserted. By doing so, the heat of the solder that has entered the auxiliary through hole when soldering the legs of the electronic component in the solder bath is transmitted to the solder in the through hole, and the solder rise can be improved.

JP 2010-219488 A

However, the soldering method described in Patent Document 1 is a technique for soldering legs of electronic components such as capacitors to a wiring board, and does not directly solder the electronic parts themselves to the wiring board. That is, only the legs of the electronic components are soldered to the wiring board. When such a technique is applied to the terminal block, since it is soldered only with the legs, the cross-sectional area of the path through which the current flows becomes small, causing heat generation. In addition, the terminal block is subjected to a load many times for the purpose of attaching and detaching the wiring in maintenance or the like, and there is a possibility that the strength becomes insufficient when soldering with only the feet.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a wiring board capable of improving the strength of a terminal block attached to the wiring board and suppressing heat generation in the terminal block.

In order to achieve the above object, a wiring board according to the present invention is arranged on a wiring pattern, a terminal block that is bent from a solderable plate member, and the wiring pattern and the wiring pattern. A wiring board comprising: a soldering portion for connecting to the terminal block; and a through hole provided in the soldering portion and into which the foot is inserted, wherein the foot is inserted into the through hole and soldered. In the soldering portion, a through hole is provided, and the terminal block is disposed on the soldering portion across a part of the through hole, and is soldered through the through hole and the through hole. The soldering part and the terminal block are connected by soldering with supplied solder.

According to the wiring board of the present invention, the soldered portion and the terminal block are soldered by soldering. Thereby, the intensity | strength of the terminal block attached to a wiring board improves. In addition, since the soldering portion and the terminal block are connected by soldering, a current path can be formed for the current to flow not only from the foot but also from the soldering portion to the terminal block via the solder, thereby increasing the cross-sectional area of the current path. it can. For this reason,
Heat generation at the terminal block can be suppressed.

Further, in the above-mentioned invention, a metal wire disposed across the through hole along the terminal block is provided on the soldering portion, and the terminal block, the soldering portion, and the metal are formed by the soldering. It is characterized by soldering the wire.

In the above-mentioned invention, the metal wire is arranged across the through hole.

In the above invention, the terminal block has a plurality of legs, the through holes are provided for the plurality of legs, and the through holes are provided between the plurality of through holes. It is characterized by that.

ADVANTAGE OF THE INVENTION According to this invention, while improving the intensity | strength of the terminal block attached to a wiring board, the heat_generation | fever in a terminal block can be suppressed.

It is a disassembled perspective view of the terminal block part of a wiring board. It is a perspective view of the terminal block part of the wiring board to which the terminal block was attached. It is a figure which shows the soldering part of a wiring board.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is an exploded perspective view of a terminal block portion of a wiring board. FIG. 2 is a perspective view of the terminal block portion of the wiring board to which the terminal block is attached. FIG. 3 is a diagram showing a soldering portion of the wiring board. The wiring board 10 includes a wiring pattern 11, a through hole 12, a terminal block 13, a soldering portion 14, a through hole 15, a jumper wire 17 (metal wire),
And electronic components (not shown).

The wiring board 10 is formed with, for example, a round through hole 12 in a portion where the electronic component, the terminal block 13 and the like are arranged, and by placing the electronic component and the terminal block 13 and soldering,
A wiring pattern 11 is printed so as to form a predetermined electric circuit. Further, a resist is applied to the wiring board 10 from above the wiring pattern 11 except for the periphery of the through hole 12, and the periphery of the through hole 12 constitutes a soldered portion 14 where the wiring pattern 11 is exposed. That is, the through hole 12 is provided in the soldered portion 14 in the wiring pattern 11. In FIG. 1 and FIG. 2, the wiring pattern 11 is indicated by a dotted line because it is hidden by the resist. The shape of the through hole is not limited to an elliptical shape or a polygonal shape, and may be any shape as long as a leg can be inserted with a gap. Also, through hole 1
The inner wall of the wiring board 10 forming 2 is coated with a solderable material similar to the wiring pattern.

The terminal block 13 is made of a solderable metal material (for example, aluminum). Terminal block 13
The rectangular plate member has a U-shaped cross section in which two side surfaces 34 and an upper surface 33 are formed by bending both ends of a rectangular plate member. Two legs 31 protruding downward (in the direction of the wiring board) are provided below the side surfaces 34 of the terminal block 13. A screw hole 32 is formed on the upper surface of the terminal block 13.
For example, a wiring having a U-shaped terminal, a round terminal, or the like can be fixed by being sandwiched between the screw and the terminal block using a screw. In FIG. 2, the wiring 4 having the round terminal 41
2 is screwed through a ring washer 43.

Two soldering portions 14 are configured so that both side surfaces 34 of the terminal block 13 can be arranged respectively. The through holes 12 are opposed to the legs 31 provided on the side surfaces 34 of the terminal block 13 in the respective soldered portions 14, and are provided at positions where the legs 31 are fitted (the same number is provided). In the terminal block 13, the legs 31 are inserted into the through holes 12, and both side surfaces 34 are arranged on the soldering portions 14. Further, the diameter of the through hole 12 is longer than the thickness of the terminal block 13, and the side surface 34 of the terminal block 13 is disposed so as to straddle the central portion of the through hole 12.

Each of the soldered portions 14 is provided with a long through hole 15 between two through holes 12, and the side surface 34 of the terminal block 13 is formed only on a part (not all) of the through hole 15. Further, it is disposed on the soldering portion 14 (see FIG. 3). A dotted line in FIG. 3 indicates a side surface 34 of the terminal block 13 disposed in the soldering portion 14. Specifically, as shown in FIG. 3, the thickness of the terminal block 13 is shorter than the length in the longitudinal direction of the through hole 15, and the side surface of the terminal block 13 is disposed so as to straddle the central portion of the through hole 15. . Further, the inner wall of the wiring board 10 forming the through hole 15 is coated with a solderable material similar to the wiring pattern.

The jumper wire 17 is connected to the through hole 15 and the through hole 1 along the terminal block 13 on the soldering portion 14.
2 (see FIG. 3). Two jumper wires may be provided so as to straddle the two through holes. Two jumper wires 17 are provided at positions facing each other across the terminal block 13, and are arranged across both end portions of the through hole and both end portions of the through hole 15. The jumper wire 17 is fixed by inserting both ends into a hole 18 provided on the soldering portion 14.

The wiring board 10 is soldered after the terminal block 13 and the jumper wire 17 are disposed, and then the back surface opposite to the surface on which these components are disposed is attached to a molten solder bath. By this soldering, the solder 16 is filled into the through-hole 12 and the through-hole 15 from the back side, and the solder 16 passes through the through-hole 15 and the through-hole 12 through the through-hole 12 and part of the terminal block 13 instead of the whole. A gap A formed by straddling (terminal block 1 of through hole 15 and through hole 12
3 is supplied to the soldering portion 14 on the surface of the wiring board 10 from the gap A) not blocked by the wiring 3.
The terminal block 13, the soldered portion 14, and the jumper wire 17 are soldered to each other by the solder 16 (see FIG. 2).

At this time, if the molten solder 16 adheres to the jumper wire 17 across the gap A, the adhered molten solder 16 spreads along the jumper wire 17, so that more solder is transferred from the back surface to the soldered portion 14 on the surface. Can be supplied.

Further, since the jumper wire 17 of the wiring board 10 is arranged along the side surface 34 of the terminal block 13, the solder 16 can be supplied to the terminal block 13 without unevenness. Further, since the terminal block 34 straddles the vicinity of the center of the through hole 15 and the through hole 12 and both ends of the through hole 15 and the through hole 12 are straddled by jumper wires, the jumper wire 17 is disposed on the terminal block 13. Solder is supplied from both sides evenly.

As described above, since the structure for supplying the solder from the back surface to the surface or the structure for supplying a large amount of solder without any unevenness is required, it is necessary to perform additional soldering manually without supplying the solder to the surface. The situation can be avoided or reduced. As a result, the number of soldering steps can be reduced and the production efficiency can be improved.

In this way, the same soldered portion 14 has through holes 12, holes A, and jumper wires 17
The terminal block 13 is disposed on the soldering portion 14 and soldering is performed. From this, the soldering part 14 and the terminal block 13 are connected by the solder 16 supplied through the through hole 12.
And the jumper wire 17 are soldered together. Then, the wiring pattern 11 and the terminal block 13 are connected. Similarly, the terminal blocks 13 are connected to each other by wiring with the other wiring substrate 10 to which the terminal blocks 13 are soldered to form an electric circuit of one device. The wiring board 10 can be used for a system interconnection device having a power line such as a booster circuit and an inverter circuit, a motor driving device, and the like.

As described above, according to the present embodiment, the through hole 12 and the through hole 1 are formed by soldering.
5, the solder 16 is supplied to the terminal block 13 side, and the soldering portion 14 and the terminal block 13
Can be soldered together. At this time, the solder wire 17 straddling the through hole 12 and the through hole 15 pulls up the solder from the through hole 12 and the through hole 15, so that the terminal block substantially faces the upper surface 33 side of the terminal block 13 on the soldering portion 14. The solder is deposited along 13. Thereby, the soldering strength of the terminal block 13 to be soldered to the wiring board 10 is improved. Also,
Since the soldering portion 14 and the terminal block 13 are solder-connected, a current path that flows not only to the foot 31 but also directly to the terminal block 13 is formed, so that the cross-sectional area of the current path can be increased. For this reason, the heat_generation | fever of the terminal block 13 can be suppressed.

In addition, since the current flows through the solder filled in the through hole 15 in addition to the solder filled in the through hole 12, the cross-sectional area of the current path can be increased, and the resistance of the terminal block 13 is reduced. The heat generation at 13 can be suppressed.

In addition, according to the present embodiment, since the through hole 15 is provided between the two through holes 12, even if there is a distance between the through holes 12, the solder that has passed through the through hole 15 from the solder bath. 16 and the solder that has risen from the solder bath through the through hole 12 are connected to each other, and the soldered portion 14 and the terminal block 13 can be soldered without any unevenness.

As mentioned above, although one Embodiment of this invention was described, the above description is for making an understanding of this invention easy, and does not limit this invention. It goes without saying that the present invention can be changed and improved without departing from the gist thereof, and that the present invention includes equivalents thereof.

For example, in the present embodiment, the through hole 15 is formed in a long hole shape, but is not limited to this, and various shapes of through holes such as a round shape, a square shape, and a star shape can be used. . Also,
The number of through holes is not limited to one, and a plurality of through holes may be provided. In this case, the terminal block 13 may straddle a part of the plurality of through holes, and the jumper wire may straddle the other part of the through holes.

Further, for example, the terminal block 13 is placed over the through hole 12 and / or the through hole 15.
The solder paste may be disposed along the position of the side surface 34 and the terminal block 13 may be disposed and soldered. Thereby, when soldering is performed in the solder bath, the disposed solder paste is melted, and the solder 16 rising from the solder bath is pulled up by the melted solder paste. Further, since this solder paste itself is also used for soldering between the terminal block 13 and the soldering portion 14, more solder can be supplied to the terminal block 13 without unevenness. It should be noted that the solder 16 is sufficiently supplied to the soldering portion 14 and the terminal block 13 even when soldering is performed in the solder bath after the solder paste is disposed, or when soldering is performed in the solder bath without disposing the solder paste. In this case, the jumper line 17 need not be arranged.

DESCRIPTION OF SYMBOLS 10 Wiring board 11 Wiring pattern 12 Through hole 13 Terminal block 14 Soldering part 15 Through hole 16 Solder 17 Jumper wire 18 Hole 31 Leg 32 Screw hole 33 Upper surface of terminal block 34 Side surface A of terminal block

Claims (4)

A wiring pattern;
A terminal block configured to bend from a solderable plate member having legs;
A soldered portion for connecting the wiring pattern and the terminal block disposed on the wiring pattern;
A through-hole provided in the soldering portion and into which the foot is inserted, and a wiring board for soldering by inserting the foot into the through-hole,
The soldering part is provided with a through hole,
The terminal block is disposed in the soldered portion across a part of the through hole,
A wiring board, wherein the soldering portion and the terminal block are soldered by soldering through the through holes and the through holes by soldering. Comprising a metal wire disposed across the through hole along the terminal block on the soldered portion;
The wiring board according to claim 1, wherein the terminal block, the soldering portion, and the metal wire are solder-connected by the soldering. The wiring board according to claim 2, wherein the metal wire is disposed across the through hole. The terminal block has a plurality of legs,
The through hole is provided for each of the plurality of legs,
The wiring substrate according to claim 1, wherein the through hole is provided between the plurality of through holes.

Images