JP6028763B2 - Circuit structure and connecting bus bar - Google Patents

Description

  The present invention relates to a circuit structure and a connection bus bar.

  Conventionally, a circuit structure provided with a bus bar is known. Patent Document 1 describes a circuit structure including a circuit board and a plurality of bus bars arranged along the back surface of the circuit board. A plurality of terminal portions having a tab shape arranged in parallel are formed at the end of the bus bar. In the manufacture of this circuit structure, first, a connection bus bar is formed in which terminal portions of a plurality of bus bars are connected by tie bars. Then, the circuit structure is formed by cutting the tie bar.

JP 2012-235893 A

  By the way, in order to form a circuit structure, the structure for cutting the tie bars that connect the terminal portions must ensure a dimension that allows a mold for cutting the tie bars to enter between the terminal portions. There is a concern that it may be an obstacle to downsizing the structure.

  The present invention has been completed based on the above circumstances, and an object thereof is to reduce the size of a circuit structure.

  In the circuit structure of the present invention, a conductive path is formed in an insulating plate, and an insulating substrate in which a through hole is formed, a plurality of bus bars made of plate-like metal, and a tie bar that connects the plurality of bus bars are cut. And a bus bar substrate overlaid on the insulating substrate, and the cutting portion of the bus bar substrate is formed at a position continuous with the through hole of the insulating substrate.

  The connecting bus bar of the present invention includes a tie bar that connects a plurality of bus bars made of plate-like metal so as to be cut, and is overlapped on an insulating substrate in which a conductive path is formed on an insulating plate to cut the tie bar. A connecting bus bar serving as a bus bar substrate, wherein the tie bar is formed at a position continuous with a through hole formed in the insulating substrate.

  According to the above configuration, at the time of manufacturing the circuit structure, the cut portion can be formed by cutting the tie bar from the through hole of the insulating substrate by the mold. Therefore, it is not always necessary to connect the outer side of the insulating substrate with the tie bar for the bus bar in which the inner side of the insulating substrate is connected with the tie bar, so that the tie bar on the outer side of the insulating substrate can be reduced. Therefore, the bus bar substrate can be reduced in a portion that secures a dimension that allows the mold to enter in order to cut the tie bar outside the insulating substrate. Therefore, it is possible to reduce the size of the circuit structure.

As an embodiment of the above configuration, the following embodiment is preferable.
The bus bar in which the cut portion is formed has a terminal portion connectable to the outside, and the terminal portion is bent from the vicinity of the edge portion of the insulating substrate.
For example, in a configuration in which the terminal portions of a plurality of bus bars are connected with tie bars and the tie bars are cut when the circuit structure is manufactured, when the terminal portions are bent, the tie bars are cut and the terminal portions are bent simultaneously. Is efficient. However, when cutting the tie bar and bending the terminal portion at the same time, the terminal portion is bent to ensure that the mold for cutting the tie bar can enter the base end side of the terminal portion. It cannot be performed from the vicinity of the edge. In this case, there exists a problem that the length of a terminal part becomes long and a circuit structure cannot be reduced in size.
Since the cutting part is formed at a position continuous with the through hole of the insulating substrate, the terminal part can be bent from the vicinity of the edge of the insulating substrate, so the length of the terminal part can be shortened and the circuit configuration The body can be miniaturized.

An electronic component having a lead terminal connected to the bus bar is provided, and the lead terminal is connected through the through hole to the bus bar in which the cut portion is formed.
In this way, since the through hole of the insulating substrate for passing the mold or the like when cutting the tie bar can be used for the connection of the electronic component, it is possible to increase the density of the arrangement of the electronic component. . Therefore, it is possible to reduce the size of the circuit structure.

  According to the present invention, it is possible to reduce the size of the circuit structure.

A perspective view showing a circuit composition object of Embodiment 1. The perspective view which shows that an adhesive sheet and an insulation board overlap with a bus bar The perspective view which shows the state by which the adhesive sheet and the insulated substrate were piled up on the bus-bar The top view which expanded the part by which the inner tie bar was distribute | arranged in the component penetration hole in FIG. The perspective view which shows the state which cut | disconnected the inner tie bar from the state of FIG. The top view which expanded the part by which the inner tie bar in the component penetration hole in FIG. 5 was cut | disconnected The perspective view which shows the state which soldered each electronic component from the state of FIG. The figure which expands and shows the state by which the bus bars of Embodiment 2 were connected by the tie bar. The figure which shows the state which bent the terminal part The figure which expands and shows the state where the terminal part was connected with the tie bar as a comparative example The figure which shows the state which bent the terminal part as a comparative example

<Embodiment 1>
The first embodiment will be described with reference to FIGS.
The circuit structure 10 is arranged in a power supply path between a power source such as a battery of a vehicle such as an electric vehicle and a load composed of an on-vehicle electrical component such as a lamp and a wiper, for example, a DC-DC converter, an inverter, or the like. Can be used as

(Circuit structure 10)
As shown in FIG. 1, the circuit structure 10 includes an insulating substrate 11 in which a conductive path is formed on an insulating plate, a bus bar substrate 13 made of a plate-like metal stacked on the insulating substrate 11, and the insulating substrate 11 and the bus bar. Electronic components 26 </ b> A to 26 </ b> D connected to the substrate 13 are provided.
The electronic components 26A to 26D are composed of a switching element 26A composed of FET (Field Effect Transistor), a shunt resistor 26B, a coil 26C, a capacitor 26D, and the like, and are connected to the conductive path of the insulating substrate 11 and the bus bar 14 by soldering. A terminal 27 is provided. The lead terminal 27 of the coil 26 </ b> C has an L shape and is arranged along the bottom and side surfaces of the rectangular parallelepiped main body.

(Insulating substrate 11)
The insulating substrate 11 has a conductive path made of a copper foil (not shown) printed on an insulating plate made of an insulating material, and is bonded to the bus bar substrate 13 by an adhesive sheet 24 as shown in FIG. A plurality of through holes 12 </ b> A and 12 </ b> B penetrating through the insulating substrate 11 are formed in the insulating substrate 11. The plurality of through holes 12A and 12B include a plurality of component insertion holes 12A through which the electronic components 26A to 26D are passed, and a plurality of terminal insertion holes 12B through which a plurality of terminals (not shown) of other circuits are passed. Have.

Each component insertion hole 12 </ b> A has a shape and size corresponding to the shape and size of the bottom surface side of the electronic components 26 </ b> A to 26 </ b> D, and has a rectangular shape through which one or a plurality of electronic components 26 </ b> A to 26 </ b> D are inserted. . The component insertion hole 12A through which the coil 26C and the capacitor 26D are inserted is formed to have a size that fits the outer periphery on the bottom side of the coil 26C and the capacitor 26D, and is cut out in accordance with the position of the lead terminal 27. Is formed. Inside the notch 18, a solder fillet for soldering the lead terminal 27 is formed.
The adhesive sheet 24 has substantially the same shape as the insulating substrate 11 and is coated with an insulating adhesive, and an insertion hole 25 is formed at a position corresponding to the through holes 12A and 12B.

(Bus bar substrate 13)
The bus bar substrate 13 is made of a metal such as copper or a copper alloy, and includes a plurality of plate-like bus bars 14 corresponding to the shape of the conductive path. In the plurality of bus bars 14, portions arranged outside the outer periphery of the insulating substrate 11 are bent in an L shape or a crank shape to form terminal portions 15. The terminal portion 15 is connected to an external terminal, and is formed with a width dimension and thickness according to electric power.

  The bus bar substrate 13 is formed by punching out a rectangular metal plate material before assembly of the circuit component 10, so that a plurality of bus bars 14, a frame 16 arranged around the plurality of bus bars 14, and a plurality of bus bars The connecting bus bar 21 includes an inner tie bar 20 </ b> A (an example of a “tie bar”) that connects the 14 and an outer tie bar 20 </ b> B that connects the bus bar 14 and the frame 16. In the four corners of the frame 16 of the connecting bus bar 21, holding holes 17 for penetrating the positions of the connecting bus bar 21 when assembling are formed.

  The inner tie bar 20A is arranged on the inner side of the outer periphery of the insulating substrate 11 to connect the plurality of bus bars 14, and as shown in FIGS. 3 and 4, a component through which the coil 26C in the insulating substrate 11 is inserted. It is arranged below the insertion hole 12A (position connected to the through hole). The inner tie bar 20A is cut before the electronic components 26A to 26D are mounted, thereby forming a cut portion 22 that is a cut end surface of the inner tie bar 20A as shown in FIGS. That is, in a state where the bus bar substrate 13 is assembled to the circuit structure 10, the bus bar substrate 13 includes a cutting portion 22 formed by cutting the inner tie bar 20A. The cutting part 22 is a cut end face when the inner tie bar 20A is cut by a mold, and the side surface of the bus bar 14 is cut out in a stepped shape with a constant dimension.

  The outer tie bar 20B is arranged outside the outer periphery of the insulating substrate 11 to connect the bus bar 14 and the frame body 16, and is cut after mounting the electronic components 26A to 26D. When the outer tie bar 20B is cut with a mold, the terminal portion 15 of the bus bar 14 is bent at the same time. The cut end surface of the outer tie bar 20 </ b> B is smoothly formed along the outer periphery of the bus bar 14 and the terminal portion 15.

A method for manufacturing the circuit structure 10 will be described.
As shown in FIG. 2, a metal plate material is punched to form a connection bus bar 21, and an adhesive sheet 24 and an insulating substrate 11 are stacked on a predetermined position of the connection bus bar 21 to fix the insulating substrate 11 to the connection bus bar 21 (FIG. 2). 3). In this state, the inner tie bar 20 </ b> A connecting the adjacent bus bars 14 is exposed in the component insertion hole 12 </ b> A of the insulating substrate 11.

  Next, the inner tie bar 20A is cut with a mold to form the cut portion 22. (FIG. 5). Next, the lead terminals 27 of the electronic components 26A to 26D are connected to the insulating substrate 11 and the bus bar 14 by, for example, reflow soldering (FIG. 7).

Then, by cutting the outer tie bar 20B with a mold and simultaneously bending the terminal portion 15, the frame body 16 is separated to form the circuit structure 10 (FIG. 1).
In the circuit component 10, for example, a heat radiating member made of a metal material having high thermal conductivity such as an aluminum alloy is overlapped on the lower surface of the bus bar 14 with an insulating adhesive. And the circuit structure 10 is accommodated in the case made from a synthetic resin, and is mounted in a vehicle as an electrical connection box.

According to the said embodiment, there exist the following effects | actions and effects.
According to this embodiment, at the time of manufacturing the circuit component 10, the inner tie bar 20A (tie bar) can be cut from the component insertion hole 12A (through hole) of the insulating substrate 11 by the mold to form the cut portion 22. . Therefore, as compared with the case where the cut portion is formed only on the outside of the insulating substrate 11, the bus bar 14 in which the cut portion 22 is formed on the inner side of the insulating substrate 11 is necessarily formed on the outer side of the insulating substrate 11. There is no. Therefore, since the number of outer tie bars 20B can be reduced, the bus bar substrate 13 can reduce the portion that secures a dimension that allows the mold to enter in order to cut the tie bars outside the insulating substrate 11. Become. Therefore, it is possible to reduce the size of the circuit structure 10.

Moreover, the electronic component 26A-26D which has the lead terminal 27 connected to the bus bar 14 is provided, and the lead terminal 27 is connected to the bus bar 14 in which the cutting part 22 is formed through the component insertion hole 12A (through hole). Yes.
In this way, since the through hole of the insulating substrate 11 for passing the mold when the inner tie bar 20A is cut can be used for the connection of the electronic component 26C, the density of the arrangement of the electronic components 26A to 26D can be reduced. It becomes possible to increase. Therefore, it is possible to reduce the size of the circuit structure 10.

<Embodiment 2>
Next, Embodiment 2 will be described with reference to FIGS.
In the second embodiment, as shown in FIG. 8, with respect to the connecting bus bar 21 in which the bus bars 14 are connected by the inner tie bars 37, the terminal portions are not connected by the outer tie bars, and the cut portions are not formed in the terminal portions. It is what I did. The description of the same configuration as that of the above embodiment is omitted.

  As shown in the comparative examples of FIGS. 10 and 11, the terminal portions 31 of the plurality of bus bars 32 are connected by the outer tie bars 30, the outer tie bars 30 are cut when the circuit component 10 is manufactured, and the terminal portions 31 are bent. In this case, it is efficient to simultaneously cut the outer tie bar 30 and bend the terminal portion 31. However, when the cutting of the outer tie bar 30 and the bending of the terminal portion 31 are performed simultaneously, the terminal portion is secured in order to ensure a dimension A that allows the mold for cutting the outer tie bar 30 to enter the base end side of the terminal portion 31. The bending of 31 cannot be performed from the vicinity of the edge of the insulating substrate 11, and the bending of the terminal portion 31 is performed at a position away from the edge of the insulating substrate 11 by the dimension A. In this case, since the dimension A is required, the length of the terminal portion 31 becomes long, and there is a problem that the circuit structure cannot be reduced in size.

  In the present embodiment, as shown in FIGS. 8 and 9, a plurality of adjacent bus bars 36 are connected by an inner tie bar 37, and the bus bars 36 connected by the inner tie bar 37 are not connected by the outer tie bar 20B. ) A terminal portion 35 is formed. Since the inner tie bar 20 is disposed below the component insertion hole 12A (a position continuous with the through hole), the cut portion 40 obtained by cutting the inner tie bar 20A is also disposed below the component insertion hole 12A. Since it is not necessary to cut the outer tie bar in order to form the terminal portion 38, it is not necessary to secure a dimension for the mold for cutting the outer tie bar to enter from the edge of the insulating substrate 11. Therefore, the terminal portion 38 can be bent from the vicinity of the edge portion of the insulating substrate 11, and it is not necessary to increase the length of the terminal portion 38 for bending the terminal portion 38. Therefore, it is possible to reduce the size of the circuit structure.

<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.
(1) The position and number of the inner tie bars 20A are not limited to the positions and numbers in the above embodiment. Also, the cutting part 22 can be formed at an arbitrary position and number according to the inner tie bar 20A.
(2) The cutting parts 22 and 40 may not have a shape in which the side surface of the bus bar is cut out. For example, the cut portion may be formed flush with the side surface of the bus bar.
(3) You may form the through-hole for cut | disconnecting the cutting parts 22 and 40 with a metal mold | die separately from 12 A of component insertion holes in an insulated substrate.

10: Circuit component 11: Insulating substrate 12A: Component insertion hole (through hole)
13: Bus bar substrates 14, 32, 36: Bus bars 15, 31, 38: Terminal portions 20A, 37: Inner tie bars (tie bars)
20B: Outer tie bar 21: Connection bus bar 22, 40: Cutting part 26: Electronic component 27: Lead terminal

Claims (4)

An insulating substrate in which a conductive path is formed in an insulating plate and a through hole is formed;
A bus bar substrate having a plurality of bus bars made of plate-like metal and a cut portion formed by cutting a tie bar connecting the plurality of bus bars and overlaid on the insulating substrate,
The circuit structure body in which the cutting portion of the bus bar substrate is formed at a position continuous with the through hole of the insulating substrate. The circuit structure according to claim 1, wherein the bus bar in which the cut portion is formed has a terminal portion connectable to the outside, and the terminal portion is bent from the vicinity of an edge portion of the insulating substrate. An electronic component having a lead terminal connected to the bus bar;
The circuit structure according to claim 1, wherein the lead terminal is connected through the through hole to the bus bar in which the cutting portion is formed. A tie bar that severably connects a plurality of bus bars made of plate-shaped metal, and is connected to an insulating substrate in which a conductive path is formed on an insulating plate, and the tie bar is cut to form a bus bar substrate. There,
The tie bar is a connecting bus bar formed at a position continuous with a through hole formed in the insulating substrate.

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