M340680 八、新型說明： 【新型所屬之技術領域】 本新型係為-種軟性印刷電路板以及 子元件與所述之軟性印路板的_種 ^至〉、—電 種能對和該電子元件相連接的—延伸構=純尤^ 利用熱傳導的方式完成該電子元件 ’而症M340680 VIII. New description: [New technical field] The new type is a kind of flexible printed circuit board and sub-components and the soft printed circuit board, the electric energy pair and the electronic component Connected-extended structure=purely ^ use heat conduction to complete the electronic component'
性印刷電路板以及電子裝置。 換處理的軟 【先前技術】 〜一丨上胆、wnmmg加也，簡稱為辽 =見的一種以半導體材料所製成的固態= 八有體知小、發熱度低、高照明性能、耗電量小、適合旦 長等性能’因此已普遍應用在各種照明裝置二： 查先讀上。目前技輯於發光二_(咖)的研發 =展出具有錄色光的絲’包括較早期的紅光、綠光、 2光，以及近年來有職破發展的藍光和自料，使得結 合了^、綠、藍三原色技術便可達到全彩發光之效果；同 時目前發光二極體(LED)的發光技術在亮度上也有所提 $ ’且除了可見光之外，不可見光的部份(例如紅外線)也 所，展，使得發光二極體元件之助係已日趨多元並且 存在著相當大的開發生產的市場與空間。 6Printed circuit boards and electronic devices. Soft processing [previous technique] ~ one 丨 丨, wnmmg plus, also referred to as Liao = see a solid state made of semiconductor material = eight small body knowledge, low heat, high lighting performance, power consumption Small amount, suitable for long-term performance, etc. 'So it has been widely used in various lighting devices 2: check first. At present, the technology is developed in the development of illuminating two _ (coffee) = exhibiting silk with recorded light 'including the earlier red light, green light, 2 light, and the blue light and self-material that have been developed in recent years, making it a combination ^ The green, blue and three primary color technologies can achieve the effect of full-color illuminating; at the same time, the illuminating technology of the light-emitting diode (LED) also has a brightness of $' and in addition to visible light, the part of invisible light (such as infrared) In addition, the exhibition has made the support of LED components increasingly diverse and there is considerable market and space for development and production. 6
M340680 而就目前發光二極體(led)元件之應用來說，因為其 體積小之特性，所以能夠設計以密集的陣列式之配置而應 用在需要產生發光的裝置上，例如交通號誌或大型電子看 板等，而可產生出特定之圖案或文字；另外，以背光源發 光之设计方式係亦能作多種應用，例如手機或個人數位助 理(PDA)之赏幕背光源、設備儀表板和各種電子裝置之指 示燈等，而目前對於汽車之方向燈、照明燈與各種指示燈 的設置也有逐漸採用發光二極體(LED)元件之趨勢。 以陣列式發光二極體(led)設置之應用為例，目前常 用之組裝技術係將多個發光二極體直接以銲接的方式設置 在軟性印刷電路板(Flexible Printed Circuit，簡稱為FPC)M340680 For the current application of LED components, because of its small size, it can be designed in a dense array configuration for devices that need to generate illumination, such as traffic signs or large Electronic kanbans, etc., can produce specific patterns or texts; in addition, the backlight illumination design can also be used for a variety of applications, such as mobile phone or personal digital assistant (PDA) curtain backlight, equipment dashboard and various Indicators for electronic devices, etc., and there is a trend toward the use of light-emitting diode (LED) components for the direction lights, illumination lamps and various indicator lights of automobiles. Taking the application of the array type LED (LED) as an example, the assembly technology currently used is to directly place a plurality of light-emitting diodes in a soldering manner on a flexible printed circuit (FPC).
或〇可稱為可撓性線路板之上，亦即以銲錫來完成兩者間 的銲接；如第一圖⑻至⑷所示，為習用技術在其應用裝置 中的-軟性印刷電路板1G上銲接—發光二極體組i之放大 示意圖，其中第一圖⑷係為軟性印刷電路板10與發光二 極體組1之侧視圖，而第一圖(b)則為軟性印刷電路X 1一_中的橫、線从，上之俯視圖，且其中未將發光二 且、、且1杯接於其上，而是顯示出在軟性印刷電路板⑺ t有-連接墊組(PAD)12，包含有多個連接墊，以提供 ^第ιί體組1中的各發光二極體作對應地銲接設置，而 印其中的—發光二極體11在軟性 j电路板10上進行銲接設置之側視 二極體11的第一接胳Mn 4筮& /、千便疋將杳先 ~乐接腳ln和弟二接腳112， 應的第-連接墊121和^、紐· Μ 刀服接上對 1和弟一連接墊122，而其他的發光二 M340680 極體亦可同樣進行對應的銲接。 目前光二極體組1具有多個發光二極體，並且根據 其㈣份的發=二=設::= 積都很小’而且為了讓發光二極體組τ之整 耻在^出代表不同資訊内容之色 一 果’此-陣列式之設置係將各發 乂土的顯不效 設計成極為細小，使得要將右pj—極體之_相鄰空間 刷電路板10上移除時，择# ^、的發光二極體於軟性印 間隔空間中操作一銲搶穿::二?各發光二極體之狹小 銲或更換之處理工作。軸㈣發光二極體進行解 【新型内容】 一電魏以題含有至少 得當要將銲接於其軟:印置’使 鋒或更換之處理時，可藉〜子4進行解 伸構造進行加埶，而处 、A $子疋件相連接的一延 本新熱傳導的方式加以完成。 特徵中得到進」步^:優點可以從本新型所揭露的技術 型之-實施例係提部目的或是其他目的，本新 種叙性印刷電路板，提供—電子元 M340680 2坏接’該軟性印刷電路板包含有：一第一連接墊，提 ^亥電子元件之—第—接腳進行銲接，且該第—連接整因 ^弟—接腳之銲接_該電子元件軸之面積係大於未被 =之面積；以及-第-延伸構造，連接至該第—連接塾， 延伸構造係以熱導性材質所製成，使得該第一延伸 爻:f後能傳熱至該第一連接墊’進而使得銲接於該第 一連接墊上的該電子元件之該第-接職生解銲。 ^上所述’本新型之另—實施例係提出一種電子裝 、含有··至少-電子元件，該電子元件包含有一第一 第二接腳；以及一軟性印刷電路板，包含有至少 弟連接墊和至少一第二連接墊，提供該第一接腳和該 分別進行對應的銲接；其中，該軟性印刷電路板 有至少一第一延伸構造和至少一第 至該第一連接塾和該第二連接塾，該第-延伸構造 柚=一延神構造係以熱導性材質所製成，使得該第-延 該第二延伸構造受熱後能分別傳熱至該第一連接 口该弟一連接墊，進而使得銲接於該第—連接塾和該第 -連接墊上的該第-接腳和該第二接職生解輝。 2本新型之上述特徵和優點能更明顯易懂，下文特 舉較佳貫施例，並配合所附圖式，作詳細說明如下。 【實施方式】 用以例示本 下列各實施例的說明是參考附加的圖式， M340680 在可用以貫施之特定實施例。本新型所提_方向用 ;’例如「上」、「下」、「前」、「後」、「左」、「右」 =錢爹考附加圖式的方向。因此，使用的方向用語是 用來况明，而非用來限制本新型。 請參閱第二_)’係為本新型於第—較佳實施例中所 軟性印㈣路板2G之俯視放大示辆，並請同時 ^閱^_和⑷，係分別為將—發光：極體Μ在軟性 二路板2G上完成鮮接設置之側視和俯視放大示意 ^弟二圖⑻所示’其中在軟性印刷電路板％上係具 2二_!辦接設置的連接墊(PAD)，例如-第一連接墊 口弟一連接墊222，用以提供第二 光二極體21進行對庫祕俨拉 σ ^ 1 ； ^ 谓應物接’且在軟性印刷電路板20上 Γ的發光二極體21，並可對應鲜接在如第 ^ ^ 财，而成為如第二_所示之設置 後便能產二鋪完劾㈣之連接設計 葬*笛a 接卿使得發光二極體21便可 猎由弟一接腳2U和第二接腳212 用鋒錫來銲接至軟性印刷電路板2〇上。由;當占第= ^立it接腳212焊接在軟性印刷電路板2G上時，因為 近的發光二極體相近而呈現出狹小的間隔^ 接腳211 ^到上方體積所佔據空間的阻礙，而會讓第-腳和弟二接腳212所輝接的第—連接墊221和第二 M340680 連接墊222呈現出較為隱蔽而不利一加熱裝置(例如： 搶裝置)進人崎行觸之處理，_也會如第二剛和⑷ 所不’當銲接完成後’該等連接塾Μ卜Μ2提供該等接腳 2η、、2!2銲接而被發光二極體21所遮蔽之面積，係會大 於未被發光二極體21所輕之_，因而造成不利解鲜處 理的情形。 依據本新型一實施例，軟性印刷電路板2〇上設計具有 兩延伸構造，分別為一第一延伸構造231和一第二延伸構 造232，如第二圖⑻和⑷所示，第一延伸構造231和第二 延伸構造232係分別連接至第一連接墊221和第二連接墊 222上，同時，第一延伸構造231和第二延伸構造232係 採用熱導性之材質所製成，使得該等延伸構造在受熱後能 將熱能傳導至對應的連接墊上。 承上所述，在此例中如第二圖⑻和(c)所示，由於該等 延伸構造231、232各自還包含有呈現出面積較大的一第一 導熱面241和一第二導熱面242，以提供銲搶裝置進行接 觸與加熱，且該等延伸構造231、232(包括該等導熱面 241、242)於軟性印刷電路板20上，係位於和第一連接塾 221和第二連接墊222之相同的軟性印刷電路板2〇的表面 上，使得在軟性印刷電路板20上，發光二極體21所佔據 位置以外的其他空間能夠充分地被利用，而讓銲槍裝置進 入並進行解銲運作，並且該等延伸構造231、232(包括該 等導熱面241、242)係為具有熱導性，使得當銲槍裝置要 對所需移除或更換的發光二極體21進行解鮮時，便可於軟 11 M340680 性印刷電路板20上直接接觸該等導熱面24卜242，進而 能透過熱傳導而將熱能傳導至對應的第一連接塾221和第 接墊222上；而當加熱、受熱以及傳導之運作至—程 度時’該等接腳2U、212於之前所銲接的銲錫便會產生炫 化，而能讓該等接腳2U、212脫離該等連接墊22卜222， • 進而能使得發光二極體21之整體和軟性印刷電路板2〇之 間完成分離。 ^請參閱第三圖⑻，係為本新型於第二較佳實施例中所 提出^一軟性印刷電路板3〇之正面俯視放大示意圖，並請 同時参閱第三圖(b)和(c)，其中第三圖(b)係為軟性印刷電路 板30之背面俯視放大示意圖，而第三圖⑷則為將一發光 二極，31在軟性印刷電路板30上完成銲接設置之側視放 大不忍圖。此第二較佳實施例係和第一較佳實施例類似， P疋可將夕個發光一極體銲接設置在軟性印刷電路板 上；而不同處在於，在此第二較佳實施例中，係將一第一 K申構ie 331和-第二延伸構造332連接至對應的第一連 接塾321和第二連接墊322，並穿過軟性印刷電路板3〇， 使得第一延伸構造331和第二延伸構造332的至少一部分 位於軟性印刷電路板30的一表面上，以供加熱裝置接觸並 加以加熱。 即如第三圖(b)和(C)所示，其中第一延伸構造331和第 =延伸構造332係亦各自包含有呈現出面積較大的一第一 導熱面341和一第二導熱面342，以提供銲搶裝置進行接 觸與加熱’而如上所述’在此例中，該等導熱面341、342 12 M340680 係、位於軟性印刷電路板3〇之與第一連接塾32i和第二連接 塾322所處之位置為相對的軟性印刷電路板3〇的兩表面 上。於本實施例，軟性印刷電路板30具有兩個相對的表 2，將第-連接塾321和第二連接墊322所處之軟性印刷 电路板30的一表面稱為正面，則該等導熱面34ι、μ〕係 • =軟性印刷電路板30的背面。如此就能充分利用軟性印 刷電路板30的背面，而能有足夠的空間讓銲搶裝置進入並 . 進行解銲運作。而同樣的，該等延伸構造％卜叫包括 叆等導熱面341、342)係為具有熱導性，當要對發光二極 韙31進行更換之解銲時，便在確認發光二極體31所對應 之於軟性印刷電路板30之背面上的該等導熱面341、342 後’利用銲搶裝置對該等導熱面341、342進行接觸與加 熱’進而在透過熱傳導後完成對應接腳311、312的解銲處 理以使發光二極體31和軟性印刷電路板30分離。 在上述兩實施例中，該等延伸構造231、331、232、 丨 332與其中的導熱面241、341、242、342係為具有可導熱 之材質所製成，為便於製造，可以在設計及製造軟性印刷 電路板時，將該等延伸構造與其導熱面一併設計於軟性印 刷電路板的電路中，更詳言之，可以在製造連接墊時一併 採用和連接墊相同之材質來製造該等延伸構造與其導熱 面。於一實施例中，該等延伸構造與其導熱面可以為軟性 印刷電路板中的銅層。 而由於該等延伸構造或其導熱面係會設置於軟性印刷 電路板之一表面上，並顯露在外以供加熱裝置(例如：銲槍 13 M340680 裝置)作接觸，因此兔 路板時，多餘的光二極體銲接於軟性印刷電 其導熱面因為在外之部分的該等延伸構造或 部分的延_、發生&路的情形，可以在顯露於外的 ;::Γ=她上包覆著-隔絕材質則 便可對於心㈣，並能因應需求而取下膠帶，如此 晴路板上的發光二極體進纖。或者，Or 〇 can be called above the flexible circuit board, that is, soldering is used to complete the soldering between the two; as shown in the first figure (8) to (4), it is a conventional technology in the application device - the flexible printed circuit board 1G An enlarged view of the upper solder-light-emitting diode group i, wherein the first picture (4) is a side view of the flexible printed circuit board 10 and the light-emitting diode group 1, and the first figure (b) is a flexible printed circuit X 1 The horizontal and vertical lines of a _, the top view of the upper, and the light-emitting two and the one cup are not connected thereto, but are displayed on the flexible printed circuit board (7) t-connected pad set (PAD) 12 , comprising a plurality of connection pads for respectively providing the light-emitting diodes in the group 1 to be soldered correspondingly, and the light-emitting diodes 11 printed thereon are soldered on the flexible circuit board 10 The first connector Mn 4筮& / of the side view diode 11 will be used first, the first leg and the second pin 112, the first connection pad 121 and the ^, 纽 Μ knife The pair of pads 1 and 1 are connected to the pad 122, and the other LEDs of the M340680 can also be soldered correspondingly. At present, the photodiode group 1 has a plurality of light-emitting diodes, and according to the (four) copies of the hair = two = set:: = the product is very small 'and in order to make the light-emitting diode group τ the shame is different The color of the information content is a 'this-array type setting is designed to make the display of each bauxite extremely small, so that when the right pj-polar body is removed from the adjacent space brush circuit board 10, Select #^, the light-emitting diode in the soft printing space to operate a welding grab:: two? The narrow welding or replacement of each light-emitting diode processing work. Axis (four) light-emitting diodes to solve the problem [new content] An electric Wei-style problem contains at least the right to be welded to its soft: when printing the 'precision or replacement process, you can use the ~ 4 to untwist the structure for crowning , and the A$ sub-assembly is connected with a new heat transfer method. The feature is obtained in the following steps: the advantages can be derived from the technical type disclosed in the present invention - the embodiment is for the purpose of the purpose or other purposes, the new type of the printed circuit board provides - the electronic element M340680 2 bad connection 'the softness The printed circuit board comprises: a first connection pad, the first and second legs of the electronic component are soldered, and the first connection is connected to the soldering of the pin_the area of the electronic component axis is greater than And the first extension structure is connected to the first connection structure, and the extension structure is made of a thermally conductive material, so that the first extension 爻:f can transfer heat to the first connection pad 'In turn, the first-contact of the electronic component soldered to the first connection pad is unsoldered. The other embodiment of the present invention provides an electronic package containing at least an electronic component, the electronic component including a first second pin, and a flexible printed circuit board including at least a connection a pad and at least one second connection pad, the first pin and the corresponding soldering respectively; wherein the flexible printed circuit board has at least a first extension structure and at least one to the first port and the first The second connection structure, the first extension structure pomelo = a Yanshen structure is made of a thermally conductive material, so that the first extension of the second extension structure can be separately transferred to the first connection port after being heated Connecting the pads, so that the first pin and the second connector that are soldered to the first connection pad and the first connection pad are decoupled. The above features and advantages of the present invention will become more apparent and obvious. The following detailed description will be given in conjunction with the accompanying drawings, which are described in detail below. [Embodiment] The following description of the embodiments is provided with reference to the appended drawings, and the M340680 is a specific embodiment that can be used. The _direction used by the present invention; 'for example, 'upper', 'below', 'before', 'behind', 'left', 'right' = the direction of the additional drawing. Therefore, the directional terminology used is for the sake of clarity and is not intended to limit the present invention. Please refer to the second _)' for the above-mentioned preferred embodiment of the soft printing (four) road board 2G in the top view of the enlarged display, and please read ^_ and (4) at the same time, respectively - will be - luminous: pole The side view and the top view of the body 2 are completed on the soft two-way board 2G. The figure is shown in the figure (8). Among them, the connection pad (PAD) is set on the soft printed circuit board%. For example, the first connection pad is connected to the pad 222 for providing the second photodiode 21 to perform the σ ^ ^ ^ ^ ^ ^ ^ 接 接 ' and is Γ on the flexible printed circuit board 20 Light-emitting diode 21, and can be connected to the freshest in the first, as the second _ shown in the setting can be produced after the second shop (four) connection design funeral * flute a pick up the light makes the light pole The body 21 can be soldered to the flexible printed circuit board 2 by the front pin 2U and the second pin 212. When the soldering diodes 2G are soldered on the flexible printed circuit board 2G, since the close-emitting diodes are similar, the narrow spacing of the pins 211 ^ to the space occupied by the upper volume is hindered. The first connection pad 221 and the second M340680 connection pad 222 which are connected by the first leg and the second pin 212 are more concealed and are not facilitated by a heating device (for example, grabbing the device). , _ will also be as the second and (4) does not 'when the welding is completed', the connection 塾Μ 2 提供 2 provides the area covered by the pins 2η, 2! 2 welded by the LED 21 It will be larger than that which is not lighted by the light-emitting diode 21, thus causing an unfavorable freshening treatment. According to an embodiment of the present invention, the flexible printed circuit board 2 is designed to have two extending structures, respectively a first extending structure 231 and a second extending structure 232. As shown in the second figures (8) and (4), the first extending structure The second extension structure 231 and the second extension structure 232 are respectively connected to the first connection pad 221 and the second connection pad 222, and the first extension structure 231 and the second extension structure 232 are made of a material of thermal conductivity, so that the The extended structure can conduct thermal energy to the corresponding connection pad after being heated. As described above, in this example, as shown in the second figures (8) and (c), each of the extension structures 231, 232 further includes a first heat conduction surface 241 and a second heat conduction which exhibit a large area. The surface 242 is provided to provide contact and heating by the soldering device, and the extended structures 231, 232 (including the heat conducting surfaces 241, 242) are disposed on the flexible printed circuit board 20, and are located at the first connection port 221 and the second The surface of the same flexible printed circuit board 2b of the connection pad 222 is such that on the flexible printed circuit board 20, the space other than the position occupied by the light-emitting diode 21 can be fully utilized, and the torch device is allowed to enter and proceed. De-soldering operation, and the extension structures 231, 232 (including the heat-conducting surfaces 241, 242) are thermally conductive so that the torch device is required to re-discharge the LEDs 21 that need to be removed or replaced. The heat conducting surface 24 242 can be directly contacted on the soft 11 M340680 printed circuit board 20, thereby transferring thermal energy to the corresponding first connecting port 221 and the first pad 222 through heat conduction; , heat and conduction to At the same time, the solders soldered to the pins 2U and 212 will be dazzled, and the pins 2U and 212 can be separated from the connecting pads 22, 222, and the light-emitting diodes 21 can be made. The separation between the bulk and the flexible printed circuit board 2 is completed. Please refer to the third figure (8) for the front view of the flexible printed circuit board 3〇 proposed in the second preferred embodiment, and please refer to the third figure (b) and (c). The third figure (b) is a schematic enlarged view of the back side of the flexible printed circuit board 30, and the third figure (4) is a side view enlargement of the welding arrangement of a light-emitting diode 31 on the flexible printed circuit board 30. Can't bear the picture. The second preferred embodiment is similar to the first preferred embodiment in that P 疋 can be soldered on a flexible printed circuit board; the difference is that in the second preferred embodiment A first K application 331 and a second extension structure 332 are connected to the corresponding first connection 321 and second connection pad 322 and pass through the flexible printed circuit board 3 〇 such that the first extension structure 331 At least a portion of the second extension 332 is located on a surface of the flexible printed circuit board 30 for the heating device to contact and heat. That is, as shown in the third FIGS. (b) and (C), wherein the first extension structure 331 and the extension structure 332 each also include a first heat conduction surface 341 and a second heat conduction surface that exhibit a larger area. 342, in order to provide a soldering device for contact and heating' as described above. In this example, the heat conducting surfaces 341, 342 12 M340680 are located on the flexible printed circuit board 3〇 and the first port 32i and the second The ports 322 are located on opposite surfaces of the opposite flexible printed circuit board 3'''''''' In the present embodiment, the flexible printed circuit board 30 has two opposite tables 2, and a surface of the flexible printed circuit board 30 on which the first connection port 321 and the second connection pad 322 are located is referred to as a front surface. 34ι, μ] is the back of the flexible printed circuit board 30. In this way, the back surface of the flexible printed circuit board 30 can be fully utilized, and there is sufficient space for the soldering device to enter and perform the desoldering operation. Similarly, the extension structures include heat conduction surfaces 341 and 342, such as tantalum, which are thermally conductive. When the soldering of the light-emitting diodes 31 is to be performed, the light-emitting diodes 31 are confirmed. Corresponding to the heat-conducting surfaces 341 and 342 on the back surface of the flexible printed circuit board 30, the contact and heating of the heat-conducting surfaces 341 and 342 are performed by the soldering device, and the corresponding pins 311 are completed after the heat conduction. The desoldering process of 312 separates the light emitting diode 31 from the flexible printed circuit board 30. In the above two embodiments, the extension structures 231, 331, 232, 丨 332 and the heat conduction surfaces 241, 341, 242, 342 therein are made of a material that can conduct heat, and can be designed and manufactured for convenience of manufacture. When manufacturing a flexible printed circuit board, the extended structures are designed together with the heat transfer surface of the circuit of the flexible printed circuit board. More specifically, the same material as the connection pads can be used to manufacture the connection pads. The extension structure and its heat transfer surface. In one embodiment, the extended structures and their thermally conductive faces may be copper layers in a flexible printed circuit board. And because the extension structure or the heat conduction surface thereof is disposed on one surface of the flexible printed circuit board and exposed to the outside for heating (for example, the welding torch 13 M340680 device), the excess light is used when the rabbit road plate is used. The polar body is soldered to the flexible printed surface, and the heat conducting surface may be exposed to the outside due to the extension structure or part of the extension structure or part of the outer portion of the structure;::Γ=she is covered-isolated The material can be used for the heart (four), and the tape can be removed according to the demand, so that the light-emitting diode on the clear road board is fed. or,
電的二:質S==;:rr嫌 延伸構造兩者係為不==== =:==::一熱能 _ ί Hi，兩實施例中，係對兩個導熱面皆進行加 當然也可==解銲溶化效果加以說明，於其他實施例中 牛來飞W Μ二僅對其中一者進行加熱與解銲即可；進- 軟性印刷一 ^ 半脫_㉟Μ 性印刷電路板之間聽能產生出一 2雜恶，而會形成出適#的分離 :力的方式將發光二極體卸下，或者是於所:離= 7銲搶裝輯仍騎餘態的另 π=熱’而不需等待熱傳導之過== ，體和1 人性印刷電路板之間完成脫離之運作。 h 2=料’彻本㈣錄佳實施例之紐印刷電路 上制制，可更進—步地利用本新 支之ω另-域實施例帽所述之.軟性印刷電路板和 14 M340680 所述之夕個电子兀件或發光二極體設計成整體 置，即該電子裝置包含有至少一上述之電子元件或t 極體以及該軟性印刷電路板，使得以此概念所設計出^ 體的電子裝置便能夠很輕易地完成其中單個電子元件或^ 先解銲處理，使得當該電子裝置上所採用的電； 70牛h光—極體產生單—個體的損壞時，便可有效且 費時地利用銲槍裝置進行解銲之作業過程。 而本新型之概念亦可有效地應用在其他電子元件上， 例如積體電路、電阻或電容等；在上述 哺光二極體作代表以進行說明，當本新型概 他可作銲接之電子元件上時 枝在其 用的印刷電路板或線路板上進行緊=二= ，戈解銲作業的方便性。因此，本新型除了 :實丁 = 則技術所提出之發光二極體不易更換或解 於相關電子元件之應用亦提供了 一良好f 故，能成功地達成本案發展之主要目的。柑必疋 上列實施例的說明是參考附加的圖式 =用以實紅特定實補。輕本 二例 揭露如上’然其並非用以限定本新 =:洲 申具有通常知識者，在不脫離太 。斤屬技術領域 可作些許之更動與』神和範圍内，當 所附之申請專利範圍所界定者為準。另^護^圍當視如後 實施例或申請專利範圍不須達成本新型所揭露 15 M340680Electric two: quality S ==;: rr suspected extension structure is not ==== =:==:: a thermal energy _ ί Hi, in the two embodiments, the two heat conduction surfaces are added It can also be explained that the solution melting effect is explained. In other embodiments, Niu Laifei W Μ 2 can only heat and desold one of them; in-soft printing one half-off _35 Μ printed circuit board Inter-listening can produce one or two miscellaneous, but will form a separation of the appropriate: the force of the way to remove the light-emitting diode, or in the: = = 7 welding grabs the series still riding the remaining state π = The heat 'does not wait for the heat conduction to pass ==, and the separation operation between the body and the 1 human printed circuit board is completed. h 2 = material 'Ten Ben (four) recorded on the new printed circuit of the preferred embodiment, can further use the new ω 另 域 domain embodiment cap described. Flexible printed circuit board and 14 M340680 The electronic component or the light-emitting diode is designed to be integrated, that is, the electronic device comprises at least one of the above-mentioned electronic components or t-poles and the flexible printed circuit board, so that the concept is designed. The electronic device can easily perform a single electronic component or a first desoldering process, so that when the electric power used on the electronic device; 70 cattle h light-polar body produces single-individual damage, it can be effective and time-consuming The welding torch device is used for the process of desoldering. The concept of the present invention can also be effectively applied to other electronic components, such as integrated circuits, resistors or capacitors, etc.; the above-mentioned light-receiving diodes are representative for explanation, and the present invention can be used for soldering electronic components. When the branch is used on the printed circuit board or circuit board used for it, it is convenient to use the tight=two=, geode-soldering operation. Therefore, in addition to the fact that the new type of light-emitting diodes proposed by the technology are not easy to replace or solve the related electronic components, the present invention also provides a good result, which can successfully achieve the main purpose of the development of the present case. The description of the above examples is based on the additional schema = specific red compensation for real red. The lighter case of the second case reveals the above, but it is not intended to limit the new == Zhou Shen has the usual knowledge, and does not leave too much. The technical field of the genus can be modified and sacred, and the scope of the attached patent application shall prevail. In addition, it is not necessary to achieve the disclosure of the present invention or the scope of the patent application. 15 M340680
或優點或特點。此外，摘要A 文件搜尋之用，if E +要口P刀和才示題僅是用來辅助專利 文件H亚非用來限制本新型之權利範圍。 【圖式簡單說明】 ^本案得藉由下列圖式及說明，俾得一更深入之了解： 在軟性印刷電路板1G上銲接發光二極體 組1之侧視放大示意圖。 ^-圖⑻，係為軟性印路板1G之俯視圖。 第-圖⑹’係為在軟性印刷電路板1G上銲接發光二極體 、、且1之侧視放大示意圖。 第二圖⑻’係為在第—較佳實施财陳性印刷電路板20 之俯視放大示意圖。 f二圖(b) ’係為將發光二極體21在軟性印刷電路板2〇上 完成銲接設置之側視放大示意圖。 f二圖(c) ’係為將發光二極體21在敕性印刷電路板2〇上 完成銲接設置之俯視放大示意圖。 第三圖(a) ’係為在第二較佳實施例中的軟性印刷電路板3〇 之正面俯視放大示意圖。 第三圖(b)，係為軟性印刷電路板30之背面俯視放大示意 圖。 弟一圖（c) ’係為將發光二極體31在敕性印刷電路板⑽上 70成銲接設置之側視放大示意圖。 16 M340680 β 【主要元件符號說明】 本案圖式中所包含之各元件列示如下： 發光二極體組1 軟性印刷電路板10、20、30 發光二極體11、21、31 第一接腳m、21卜311 ' 第二接腳 112、212、312 ® 連接墊組12 第一連接墊121、221、321 第二連接墊122、222、322 ， 第一延伸構造231、331 第二延伸構造232、332 第一導熱面241、341 第二導熱面242、342 17Or advantages or features. In addition, the abstract A file search, if E + key P knife and only the title is only used to assist the patent document H Asia and Africa to limit the scope of this new type of rights. [Simple description of the drawing] ^ This case has to be further understood by the following drawings and descriptions: A side view enlarged view of the light-emitting diode group 1 is soldered on the flexible printed circuit board 1G. ^-图(8) is a top view of the flexible printed circuit board 1G. Fig. 6(6) is a side elevational view showing the welding of the light-emitting diode on the flexible printed circuit board 1G. The second figure (8)' is an enlarged schematic plan view of the first preferred embodiment of the printed circuit board 20. fFig. 2(b) is a side elevational view showing the welding arrangement of the light-emitting diode 21 on the flexible printed circuit board 2A. f (Fig. 2) is a schematic enlarged plan view showing the welding arrangement of the light-emitting diode 21 on the flexible printed circuit board 2'. The third drawing (a)' is an enlarged plan view showing the front side of the flexible printed circuit board 3A in the second preferred embodiment. The third figure (b) is an enlarged plan view of the back side of the flexible printed circuit board 30. Figure 1 (c) is a side elevational view showing the arrangement of the LEDs 31 on the flexible printed circuit board (10). 16 M340680 β [Description of main component symbols] The components included in the diagram of this case are listed as follows: Light-emitting diode group 1 Flexible printed circuit board 10, 20, 30 Light-emitting diodes 11, 21, 31 First pin m, 21b 311 'Second pins 112, 212, 312 ® connection pad set 12 first connection pads 121, 221, 321 second connection pads 122, 222, 322, first extension structures 231, 331 second extension structure 232, 332 first heat conduction surface 241, 341 second heat conduction surface 242, 342 17