JP4822503B2 - Structure of chip LED with Fresnel lens and manufacturing method thereof. - Google Patents

Structure of chip LED with Fresnel lens and manufacturing method thereof. Download PDF

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JP4822503B2
JP4822503B2 JP2005240495A JP2005240495A JP4822503B2 JP 4822503 B2 JP4822503 B2 JP 4822503B2 JP 2005240495 A JP2005240495 A JP 2005240495A JP 2005240495 A JP2005240495 A JP 2005240495A JP 4822503 B2 JP4822503 B2 JP 4822503B2
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led
fresnel lens
resin
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molded body
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JP2007059492A (en
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剛 三浦
将英 渡辺
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Citizen Electronics Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

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Description

本発明は、携帯電話内の液晶バックライト光源用LED、カメラ補助光源用ＬＥＤなどに係わり、詳しくは、LEDの指向性を強く、フレネルレンズを用いることにより光を無駄なく有効利用するフレネルレンズ付チップＬＥＤの構造およびその製造方法に関する。   The present invention relates to an LED for a liquid crystal backlight source in a mobile phone, an LED for a camera auxiliary light source, and the like. Specifically, the LED has a strong directivity and effectively uses light without waste by using a Fresnel lens. The present invention relates to a structure of a chip LED and a manufacturing method thereof.

従来、軽薄短小を追求する電子機器向けに提供された表面実装型の発光ダイオードで、一般的に、携帯電話内の液晶バックライト光源用LED、カメラ補助光源用ＬＥＤなどに使用される発光ダイオードにおいては、指向性をもった製品が多く使用される。その際、ＬＥＤ素子において発光しているＬＥＤチップの光を樹脂成形体の上面から平行な光束として出射することができるように、その樹脂成形体の上面にフレネルカットを施す工夫が提案されている。（例えば、特許文献１参照）
特開２００４−１５８６３５号（第2〜５頁、図２~３） Conventionally, it is a surface mount type light emitting diode provided for electronic devices pursuing lightness and thinness. Generally, it is a light emitting diode used for liquid crystal backlight light source LEDs and camera auxiliary light source LEDs in mobile phones. Many products with directivity are used. At that time, a device has been proposed in which Fresnel cut is applied to the upper surface of the resin molded body so that the LED chip light emitted from the LED element can be emitted as a parallel light beam from the upper surface of the resin molded body. . (For example, see Patent Document 1)
Japanese Patent Application Laid-Open No. 2004-158635 (pages 2 to 5, FIGS. 2 to 3)

図７は、表面実装型チップＬＥＤを示すものであり、リードフレーム３１にＬＥＤチップ３２がダイボンドされ、金属細線よりなるボンディングワイヤー３３でワイヤボンディングされ、ＬＥＤチップ３２を取り囲むように透明樹脂で樹脂成形体３４を成形する。更に、樹脂成形体３４の表面に拡散シート３５を貼り付け、その上にフレネルレンズやアンキュレータレンズを構成したレンズシート３６を貼り付ける。   FIG. 7 shows a surface-mounted chip LED. The LED chip 32 is die-bonded to a lead frame 31, wire-bonded with a bonding wire 33 made of a fine metal wire, and resin-molded with a transparent resin so as to surround the LED chip 32. The body 34 is molded. Further, a diffusion sheet 35 is attached to the surface of the resin molded body 34, and a lens sheet 36 constituting a Fresnel lens or an ancillator lens is attached thereon.

上記した表面実装型チップＬＥＤは、拡散シート３５や、フレネルレンズやアンキュレータレンズを構成したレンズシート３６を貼り付けるため、薄型化、小型化には対応が困難であった。そこで、図８に示す表面実装型チップＬＥＤは、樹脂モールド体４１の表面において、ＬＥＤチップ４２に対応する位置を中心として円領域にレンズ形状部４３が形成されている。上記した表面実装型チップＬＥＤを製造する際に、ＬＥＤチップ４２を配設部が開放された状態で樹脂モールドを行い、前記ＬＥＤチップ４２を蛍光体層４４で取り囲む。前記蛍光体層４４の上面にレンズ形状部４３を備えた樹脂モールド表面部材が貼り付けられる。上記した表面実装型チップＬＥＤは、樹脂モールド体４１の表面高さ位置以下にレンズ形状部４３を形成することができるが、薄型化には満足できるものではない。
Since the above-described surface-mount type chip LED is attached with the diffusion sheet 35 and the lens sheet 36 constituting a Fresnel lens or an ancillator lens, it is difficult to reduce the thickness and size. Therefore, in the surface-mounted chip LED shown in FIG. 8, a lens-shaped portion 43 is formed in a circular area around the position corresponding to the LED chip 42 on the surface of the resin mold body 41. When manufacturing a surface-mounted chip LED described above, it performs resin molding the LED chip 42 in a state where the arrangement portion is opened, surround the LED chip 42 in the phosphor layer 44. A resin mold surface member having a lens-shaped portion 43 is attached to the upper surface of the phosphor layer 44. The surface-mounted chip LED described above can form the lens-shaped portion 43 below the surface height position of the resin mold body 41, but it is not satisfactory for thinning.

図９から図１２は、従来の一般的な表面実装型チップＬＥＤの製造方法を示すものであり、図９は、樹脂成形体の上面にポッティングによりレンズ形状部を形成した断面図であり、図１０はその製造方法を示す断面図である。製造方法の概要について説明する。図１０（ａ）の樹脂成形工程では、集合基板５１の所定位置に、複数個のLEDチップ５２をダイボンドし、金属細線５３でワイヤーボンドするＬＥＤ実装工程を経た後、樹脂成形工程では、前記ＬＥＤチップ５２を取り囲むように透明樹脂で樹脂成形体５４を形成する。図１０（ｂ）のハーフダイシング工程では、前記複数個のＬＥＤチップ５２で枠部材となるべき所定の箇所で、前記樹脂成形体５４の表面から基板５１上面に達する深さの溝５５を形成する。図１０（ｃ）の枠樹脂成形工程では、前記ハーフダイシング工程で形成された溝５５に樹脂を流し込み硬化させて枠部材５６を形成する。図１０（ｄ）のポッティング工程では、個々のＬＥＤチップ５２に対応して樹脂成形体５４の表面にレンズとなるべき樹脂をポッティングしてレンズ形状部５７を形成する。図１０（e）のフルダイシング工程では、枠樹脂上をダイシングライン５８に沿って単個のレンズ付チップＬＥＤに分割することにより、図９に示す面実装型チップＬＥＤを製造することができる。   9 to 12 show a conventional method for manufacturing a general surface-mounted chip LED. FIG. 9 is a cross-sectional view in which a lens shape portion is formed by potting on the upper surface of a resin molded body. 10 is a sectional view showing the manufacturing method. An outline of the manufacturing method will be described. In the resin molding process of FIG. 10A, after the LED mounting process in which a plurality of LED chips 52 are die-bonded at predetermined positions on the collective substrate 51 and wire-bonded with the fine metal wires 53, the LED is processed in the resin molding process. A resin molded body 54 is formed of a transparent resin so as to surround the chip 52. In the half dicing process of FIG. 10B, a groove 55 having a depth reaching the upper surface of the substrate 51 from the surface of the resin molded body 54 is formed at a predetermined location to be a frame member of the plurality of LED chips 52. . In the frame resin molding step of FIG. 10C, the frame member 56 is formed by pouring resin into the groove 55 formed in the half dicing step and curing it. In the potting process of FIG. 10D, a lens-shaped portion 57 is formed by potting resin to be a lens on the surface of the resin molded body 54 corresponding to each LED chip 52. In the full dicing step of FIG. 10 (e), the surface-mount type chip LED shown in FIG. 9 can be manufactured by dividing the frame resin onto a single lens-mounted chip LED along the dicing line 58.

また、図１１は、脂成形体の上面にフレネルレンズを一体成形した断面図であり、図１２はその製造方法を示す断面図である。製造方法の概要について説明する。図１２（a）の樹脂成形工程では、集合基板５１の所定位置に、複数個のLEDチップ５２を実装するＬＥＤ実装工程を経た後、樹脂成形工程で前記ＬＥＤチップ５２を取り囲むように透明樹脂で樹脂成形体５４を形成する。その際に、成形型５９で型押し硬化してフレネルレンズ６０を一体に成形する。図１２（b）のハーフダイシング工程では、前記複数個のＬＥＤチップ５２で枠部材となるべき所定の箇所で、前記樹脂成形体５４の表面から基板５１上面に達する深さの溝５５を形成する。図１２（ｃ）の枠樹脂成形工程では、前記ハーフダイシング工程で形成された溝５５に樹脂を流し込み硬化させて枠部材５６を形成する。図１２（ｄ）のフルダイシング工程では、枠樹脂上をダイシングライン５８に沿って単個のレンズ付チップＬＥＤに分割することにより、図１１に示す面実装型チップＬＥＤを製造することができる。   Moreover, FIG. 11 is sectional drawing which integrally molded the Fresnel lens on the upper surface of the fat molded object, and FIG. 12 is sectional drawing which shows the manufacturing method. An outline of the manufacturing method will be described. In the resin molding process of FIG. 12A, after the LED mounting process of mounting a plurality of LED chips 52 on a predetermined position of the collective substrate 51, a transparent resin is used so as to surround the LED chips 52 in the resin molding process. A resin molded body 54 is formed. At that time, the Fresnel lens 60 is integrally molded by press-curing with the molding die 59. In the half dicing process of FIG. 12B, a groove 55 having a depth reaching the upper surface of the substrate 51 from the surface of the resin molded body 54 is formed at a predetermined position to be a frame member of the plurality of LED chips 52. . In the frame resin molding step of FIG. 12C, the frame member 56 is formed by pouring resin into the groove 55 formed in the half dicing step and curing it. In the full dicing step of FIG. 12D, the surface mount type chip LED shown in FIG.

解決しようとする問題点は、上記した図９、図１０に示すレンズ付チップＬＥＤは、レンズをポッティングで成形するので製品の厚みが厚くなる。図１１、図１２に示すフレネルレンズ付チップＬＥＤは、枠樹脂を流し込む時、毛細管現象により枠樹脂がフレネルの微細な溝に沿い入り込むという問題がある。また、枠樹脂部にフルネルが接しないようにすれば、これを解消させるが位置精度的に難しい。などの問題があった。   The problem to be solved is that the lens-mounted chip LED shown in FIGS. 9 and 10 has a thick product because the lens is molded by potting. The chip LED with Fresnel lens shown in FIGS. 11 and 12 has a problem that when the frame resin is poured, the frame resin enters along the fine groove of the Fresnel due to a capillary phenomenon. Further, if the full resin is not in contact with the frame resin portion, this can be eliminated, but it is difficult in terms of positional accuracy. There were problems such as.

本発明は、上述の欠点を解消するもので、その目的は、枠樹脂成形工程における樹脂がフレネルレンズの微細な溝に流れ込むことがない、信頼性に優れたフレネルレンズ付チップＬＥＤの構造およびその製造方法を提供するものである。   The present invention eliminates the above-mentioned drawbacks, and its purpose is to provide a highly reliable Fresnel lens-provided chip LED structure in which resin in the frame resin molding process does not flow into the fine grooves of the Fresnel lens and its A manufacturing method is provided.

上記目的を達成するために、本発明におけるフレネルレンズ付チップＬＥＤの構造は、プリント基板にＬＥＤチップを実装し、該ＬＥＤチップを取り囲むように樹脂成形体の表面に、前記ＬＥＤチップの発光方向に指向性をもつレンズ形状部を有するフレネルレンズ付チップＬＥＤの構造において、樹脂成形時にフレネルレンズを逆向きに一体で成形し、前記逆向きに成形されたフレネルレンズの屈折率を前記樹脂成形体の屈折率よりもより１に近づけたことを特徴とするものである。
 To achieve the above object, the structure of the Fresnel lens with chip LED of the present invention, an LED chip mounted on a printed board, on the surface of the resin molded body so as to surround the LED chip, the light emitting direction of the LED chip In the structure of a chip LED with Fresnel lens having a lens shape portion having directivity, the Fresnel lens is integrally molded in the reverse direction during resin molding, and the refractive index of the Fresnel lens molded in the reverse direction is determined by the resin molded body. It is characterized by being closer to 1 than the refractive index .

また、本発明におけるフレネルレンズ付チップＬＥＤの製造方法は、プリント基板にＬＥＤチップを実装し、該ＬＥＤチップを取り囲むように形成した樹脂成形体の表面に、前記ＬＥＤチップの発光方向に指向性をもつレンズ形状部を有するフレネルレンズ付チップＬＥＤの製造方法において、前記プリント基板は多数個取りする集合基板であって、該集合基板の所定位置に複数個の前記ＬＥＤチップをダイボンドし、ワイヤーボンドするＬＥＤ実装工程と、前記ＬＥＤチップを取り囲むように透明樹脂で前記樹脂成形体を形成すると同時に 前記フレネルレンズを逆向きに一体で成形して、前記フレネルレンズの屈折率を前記樹脂成形体の屈折率よりもより１に近づけるようにした樹脂成形工程と、前記個々のＬＥＤチップを取り囲む枠部材となるべき所定の箇所に、前記樹脂成形体の表面から前記プリント基板上面に達する深さの溝を形成するハーフダイシング工程と、前記ハーフダイシング工程で形成された前記溝に樹脂を流し込み硬化させて枠部材を形成する枠樹脂成形工程と、前記枠樹脂上をダイシングラインに沿って単個のフレネルレンズ付チップＬＥＤに分割するフルダイシング工程とよりなることを特徴とするものである。
A method of manufacturing a Fresnel lens with chip LED of the present invention, an LED chip mounted on a printed board, on the surface of the resin molded body formed so as to surround the LED chip, the directivity to the light emitting direction of the LED chip the method of manufacturing a Fresnel lens with a chip LED with a lens-shaped portion with the printed circuit board is a collection substrate of multi-cavity, die-bonded a plurality of the LED chip in a predetermined position of the collective substrate and wire bonds a LED mounting step, by molding integrally simultaneously the Fresnel lens when a transparent resin to surround the LED chip to form the resin molded body in the opposite direction, the refractive index of the resin molded body the refractive index of the Fresnel lens Resin molding step that is closer to 1 and a frame member that surrounds the individual LED chips A half dicing step in which a groove having a depth reaching the upper surface of the printed circuit board from the surface of the resin molded body is formed at a predetermined position, and a resin is poured into the groove formed in the half dicing step and cured. It comprises a frame resin molding step for forming a frame member, and a full dicing step for dividing the frame resin into a single LED with Fresnel lens along a dicing line.

本発明のフレネルレンズ付チップＬＥＤの構造およびその製造方法においては、 枠樹脂成形工程における樹脂がフレネルレンズの微細な溝に流れ込むことはない。小型、薄型の要求を満足することができ、信頼性に優れたフレネルレンズ付チップＬＥＤの構造およびその製造方法を提供することが可能である。   In the structure and manufacturing method of the chip LED with Fresnel lens of the present invention, the resin in the frame resin molding process does not flow into the fine groove of the Fresnel lens. It is possible to provide a structure and manufacturing method of a chip LED with a Fresnel lens that can satisfy the requirements for small size and thin thickness and is excellent in reliability.

本発明のチップ型ＬＥＤについて、図面に基づいて説明する。   The chip type LED of the present invention will be described with reference to the drawings.

図１、図２は、本発明の実施例１に係わり、図１は、フレネルレンズ付チップＬＥＤの構造を示す断面図、図2は、フレネルレンズ付チップLEDの製造方法を示す工程断面図である。   1 and 2 relate to Example 1 of the present invention, FIG. 1 is a cross-sectional view showing the structure of a chip LED with Fresnel lens, and FIG. 2 is a process cross-sectional view showing a method for manufacturing a chip LED with Fresnel lens. is there.

図１において、１はガラスエポキシ樹脂などよりなる絶縁性を有するプリント基板で、該プリント基板1上にLEDチップ２を透明接着剤で接着した後、ボンディングワイヤー（金属細線）３でワイヤボンディングし、前記LEDチップ２を囲むように透明樹脂で樹脂成形体４を形成する。該プリント基板１上に、枠樹脂成形された枠部材５が形成され、前記樹脂成形体４の上面に別体加工されたフレネルレンズ６が貼り付けられている。     In FIG. 1, reference numeral 1 denotes a printed circuit board made of glass epoxy resin or the like. After the LED chip 2 is bonded to the printed circuit board 1 with a transparent adhesive, wire bonding is performed with a bonding wire (metal fine wire) 3. A resin molded body 4 is formed of a transparent resin so as to surround the LED chip 2. A frame resin molded frame member 5 is formed on the printed circuit board 1, and a separately processed Fresnel lens 6 is attached to the upper surface of the resin molded body 4.

図２において、図２（ａ）の樹脂成形工程では、集合基板１の所定位置に、複数個のLEDチップ２をダイボンドし、金属細線３でワイヤーボンドするＬＥＤ実装工程を経た後、樹脂成形工程で前記ＬＥＤチップ２を取り囲むように透明樹脂で樹脂成形体４を形成する。図２（ｂ）のハーフダイシング工程では、前記複数個のＬＥＤチップ２で枠部材となるべき所定の箇所で、前記樹脂成形体４の表面から基板１の上面に達する深さの溝７を形成する。図２（ｃ）の枠樹脂成形工程では、前記ハーフダイシング工程で形成された溝７に樹脂を流し込み硬化させて枠部材５を形成する。図２（ｄ）のフレネルレンズ貼り付け工程では、前記樹脂成形体４の表面に別体で成形されたフレネルレンズ６を貼り付ける。図２（e）のフルダイシング工程では、前記枠樹脂成形体４の上をダイシングライン８に沿って単個のフレネルレンズ付チップＬＥＤに分割する。以上の工程で、図１に示すフレネルレンズ付チップＬＥDを製造することができる。   In FIG. 2A, in the resin molding process of FIG. 2A, after a LED mounting process in which a plurality of LED chips 2 are die-bonded to a predetermined position of the collective substrate 1 and wire-bonded with a thin metal wire 3, a resin molding process is performed. The resin molded body 4 is formed of a transparent resin so as to surround the LED chip 2. In the half dicing step of FIG. 2B, a groove 7 having a depth reaching the upper surface of the substrate 1 from the surface of the resin molded body 4 is formed at a predetermined position to be a frame member of the plurality of LED chips 2. To do. In the frame resin molding step of FIG. 2C, the frame member 5 is formed by pouring resin into the grooves 7 formed in the half dicing step and curing the resin. In the Fresnel lens affixing step in FIG. 2D, a Fresnel lens 6 molded separately is affixed to the surface of the resin molded body 4. In the full dicing process of FIG. 2 (e), the frame resin molded body 4 is divided along the dicing line 8 into a single LED with Fresnel lens. Through the above steps, the chip with Fresnel lens LED shown in FIG. 1 can be manufactured.

以上述べた構成のフレネルレンズ付チップＬＥＤは、枠樹脂成形体４を形成した後にフレネルレンズ６を貼付するので、フレネルレンズ６の微細な溝に樹脂が流れ込むことはない。   In the chip LED with the Fresnel lens having the above-described configuration, since the Fresnel lens 6 is pasted after the frame resin molded body 4 is formed, the resin does not flow into the minute groove of the Fresnel lens 6.

図３、図４は、本発明の実施例２に係わり、図３は、フレネルレンズ付チップＬＥＤの構造を示す断面図、図４は、フレネルレンズ付チップLEDの製造方法を示す工程断面図である。   3 and 4 relate to Example 2 of the present invention, FIG. 3 is a cross-sectional view showing the structure of a chip LED with Fresnel lens, and FIG. 4 is a process cross-sectional view showing a method for manufacturing a chip LED with Fresnel lens. is there.

図３（a）において、上記した実施例１と異なるところは、樹脂成形時にフルネルレンズ９を逆向きに一体で成形したことである。また、図３（b）に示す図３（a）のA部の拡大図において、一体成形した逆向きのフレネルレンズ９の屈折率をより１に近づけたものである。   In FIG. 3 (a), the difference from Example 1 described above is that the Furnell lens 9 is integrally molded in the reverse direction during resin molding. Also, in the enlarged view of part A of FIG. 3A shown in FIG. 3B, the refractive index of the integrally formed reverse-oriented Fresnel lens 9 is made closer to 1.

図４において、図４（ａ）の樹脂成形工程では、集合基板１の所定位置に、複数個のLEDチップ２を実装するＬＥＤ実装工程を経た後、樹脂成形工程で前記ＬＥＤチップ２を取り囲むように透明樹脂で樹脂成形体４を形成する時に、屈折率をより１に近づけたフレネルレンズ９を逆向きにして一体成形する。図４（ｂ）のハーフダイシング工程では、前記複数個のＬＥＤチップ２で枠部材となるべき所定の箇所で、前記樹脂成形体４の表面から基板１の上面に達する深さの溝７を形成する。図４（ｃ）の枠樹脂成形工程では、前記ハーフダイシング工程で形成された溝７に樹脂を流し込み硬化させて枠部材５を形成する。図４（ｄ）のフルダイシング工程では、前記枠樹脂成形体４の上をダイシングライン８に沿って単個のフレネルレンズ付チップＬＥＤに分割する。以上の工程で、図３に示すフレネルレンズ付チップＬＥDを製造することができる。   In FIG. 4A, in the resin molding process of FIG. 4A, after the LED mounting process of mounting a plurality of LED chips 2 on a predetermined position of the collective substrate 1, the LED chip 2 is surrounded by the resin molding process. When forming the resin molded body 4 with transparent resin, the Fresnel lens 9 having a refractive index closer to 1 is integrally molded in the reverse direction. In the half dicing step of FIG. 4B, a groove 7 having a depth reaching the upper surface of the substrate 1 from the surface of the resin molded body 4 is formed at a predetermined position to be a frame member of the plurality of LED chips 2. To do. In the frame resin molding step in FIG. 4C, the frame member 5 is formed by pouring resin into the grooves 7 formed in the half dicing step and curing the resin. In the full dicing step of FIG. 4D, the frame resin molded body 4 is divided along the dicing line 8 into a single LED with Fresnel lens. Through the above-described steps, the Fresnel lens-attached chip LED shown in FIG. 3 can be manufactured.

以上述べた構成のフレネルレンズ付チップＬＥＤは、枠樹脂成形体４を形成する時にフレネルレンズ９を逆向きに成形するので、フルネルの微細な溝がないので、枠樹脂成形の際の樹脂が流れ込むことはない。   Since the Fresnel lens-attached chip LED having the above-described configuration forms the Fresnel lens 9 in the reverse direction when the frame resin molded body 4 is formed, there is no fine groove of the Fresnel, so that the resin flows during the frame resin molding. There is nothing.

図５、図６は、本発明の実施例３に係わり、図５は、フレネルレンズ付チップＬＥＤの構造を示す断面図、図６は、フレネルレンズ付チップLEDの製造方法を示す工程断面図である。   5 and 6 relate to Example 3 of the present invention, FIG. 5 is a cross-sectional view showing the structure of a chip LED with Fresnel lens, and FIG. 6 is a process cross-sectional view showing a method for manufacturing a chip LED with Fresnel lens. is there.

図５において、上記した実施例１および実施例２と異なるところは、枠樹脂成形後にフルネルレンズ６を型押しして成形したことである。   In FIG. 5, the difference from Example 1 and Example 2 described above is that the Fresnel lens 6 is molded by pressing after frame resin molding.

図６において、図６（ａ）の樹脂成形工程では、集合基板１の所定位置に、複数個のLEDチップ２を実装するＬＥＤ実装工程を経た後、樹脂成形工程で前記ＬＥＤチップ２を取り囲むように透明樹脂で樹脂成形体４を形成する。図６（ｂ）のハーフダイシング工程では、前記複数個のＬＥＤチップ２で枠部材となるべき所定の箇所で、前記樹脂成形体４の表面から基板１の上面に達する深さの溝７を形成する。図６（ｃ）の枠樹脂成形工程では、前記ハーフダイシング工程で形成された溝７に樹脂を流し込み硬化させて枠部材５を形成する。図６（ｄ）のポッティング工程では、個々のＬＥＤチップ２に対応して樹脂成形体４の表面にフルネルレンズ６となるべき樹脂をポッティングしてレンズ形状部１０を形成する。図６（e）の型押し工程では、前記レンズ形状部１０のポッティング樹脂が硬化する前に、成形型１１で型押して、UV硬化または熱硬化することによりフレネルレンズ６を成形する。図６（f）のフルダイシング工程では、前記枠樹脂上のダイシングライン８に沿って単個のフレネルレンズ付チップＬＥＤに分割する。以上の工程で、図５に示すフレネルレンズ付チップＬＥDを製造することができる。   6A, in the resin molding process of FIG. 6A, after the LED mounting process of mounting a plurality of LED chips 2 on a predetermined position of the collective substrate 1, the LED chips 2 are surrounded by the resin molding process. The resin molded body 4 is formed of a transparent resin. In the half dicing process of FIG. 6B, grooves 7 having a depth reaching the upper surface of the substrate 1 from the surface of the resin molded body 4 are formed at predetermined locations to be frame members of the plurality of LED chips 2. To do. In the frame resin molding step in FIG. 6C, the frame member 5 is formed by pouring resin into the grooves 7 formed in the half dicing step and curing the resin. In the potting process of FIG. 6D, the lens-shaped portion 10 is formed by potting resin to be the Furnell lens 6 on the surface of the resin molded body 4 corresponding to each LED chip 2. 6E, before the potting resin of the lens shape portion 10 is cured, the Fresnel lens 6 is molded by pressing with the molding die 11 and UV curing or thermosetting. In the full dicing process of FIG. 6F, the chip LED with a Fresnel lens is divided along the dicing line 8 on the frame resin. Through the above steps, the chip with Fresnel lens LED shown in FIG. 5 can be manufactured.

以上述べた構成のフレネルレンズ付チップＬＥＤは、枠樹脂成形体４を形成した後にフレネルレンズを型押し成形するので、上記した実施例１と同様にフレネルレンズの微細な溝に樹脂が流れ込むことはない。   Since the chip LED with the Fresnel lens having the above-described configuration is formed by stamping the Fresnel lens after the frame resin molded body 4 is formed, the resin does not flow into the fine grooves of the Fresnel lens as in the first embodiment. Absent.

上述したように、実施例１では、単個の製品にフルダイシングする前にフレネルレンズを貼り付ける。実施例２では、単個の製品にフルダイシングする前に逆向きのフレネルレンズを一体成形する。また、実施例３では、単個の製品にフルダイシングする前に型押してフレネルレンズを成形する。当然ながら、実施例１〜３の製造方法は、ともに外周枠（枠部材）を使用しないチップLEDにも有効である。従来の課題であった枠樹脂を流し込む時、毛細管現象により枠樹脂がフレネルの微細な溝に沿い入り込みことはない。小型、薄型の要求を満足し、様々なアプリケーションに適応できる。本製造方法は多数個取り生産が容易であり、製作された信頼性に優れたフレネルレンズ付チップＬＥＤは、携帯電話内の液晶バックライト光源用LED、カメラ補助光源用LEDに使用される。   As described above, in Example 1, a Fresnel lens is pasted before full dicing into a single product. In Example 2, a reverse Fresnel lens is integrally molded before full dicing into a single product. Further, in Example 3, the Fresnel lens is molded by embossing before full dicing into a single product. Naturally, the manufacturing methods of Examples 1 to 3 are both effective for chip LEDs that do not use an outer peripheral frame (frame member). When pouring the frame resin, which has been a conventional problem, the frame resin does not enter along the fine groove of the Fresnel due to the capillary phenomenon. It meets the requirements for small size and thinness, and can be applied to various applications. This manufacturing method is easy to produce in large numbers, and the manufactured chip LED with Fresnel lens having excellent reliability is used for a liquid crystal backlight light source LED and a camera auxiliary light source LED in a mobile phone.

本発明の実施例１に係わり、図１は、フレネルレンズ付チップＬＥＤの構造を示す断面図である。FIG. 1 is a cross-sectional view illustrating the structure of a chip LED with a Fresnel lens according to Example 1 of the present invention. 図１のフレネルレンズ付チップLEDの製造方法を示す工程断面図である。It is process sectional drawing which shows the manufacturing method of chip LED with a Fresnel lens of FIG. 本発明の実施例２に係わり、図３は、フレネルレンズ付チップＬＥＤの構造を示す断面図である。FIG. 3 is a cross-sectional view showing the structure of a chip LED with a Fresnel lens according to Example 2 of the present invention. 図３のフレネルレンズ付チップLEDの製造方法を示す工程断面図である。It is process sectional drawing which shows the manufacturing method of chip | tip LED with a Fresnel lens of FIG. 本発明の実施例３に係わり、図５は、フレネルレンズ付チップＬＥＤの構造を示す断面図である。FIG. 5 is a cross-sectional view showing the structure of a chip LED with a Fresnel lens according to Example 3 of the present invention. 図５のフレネルレンズ付チップLEDの製造方法を示す工程断面図である。It is process sectional drawing which shows the manufacturing method of chip | tip LED with a Fresnel lens of FIG. 従来のレンズシートを貼付した表面実装型チップＬＥＤの断面図である。It is sectional drawing of surface mount type chip LED which affixed the conventional lens sheet. 他の従来のレンズ形状部を備えた表面実装型チップＬＥＤの断面図である。It is sectional drawing of surface mount type chip LED provided with the other conventional lens shape part. 従来の一般的な表面実装型チップＬＥＤで、樹脂成形体の上面にポッティングによりレンズ形状部を形成した断面図である。It is sectional drawing which formed the lens-shaped part by the potting on the upper surface of the resin molding in the conventional general surface mounted chip LED. 図９の表面実装型チップＬＥＤの製造方法を示す断面図である。It is sectional drawing which shows the manufacturing method of surface mount type chip LED of FIG. 従来の一般的な表面実装型チップＬＥＤで、樹脂成形体の上面にフレネルレンズを一体成形した断面図である。It is sectional drawing which integrally molded the Fresnel lens on the upper surface of the resin molding in the conventional general surface mounted chip LED. 図１１の表面実装型チップＬＥＤの製造方法を示す断面図である。It is sectional drawing which shows the manufacturing method of surface mount type chip LED of FIG.

符号の説明Explanation of symbols

１ 基板
２ LEDチップ
３ ボンディングワイヤー
４ 樹脂成形体
５ 枠部材
６、９ フレネルレンズ
７ 溝
８ ダンシングライン
１０ レンズ形状部
DESCRIPTION OF SYMBOLS 1 Board | substrate 2 LED chip 3 Bonding wire 4 Resin molded object 5 Frame member 6, 9 Fresnel lens 7 Groove 8 Dancing line 10 Lens shape part

Claims (2)

プリント基板にＬＥＤチップを実装し、該ＬＥＤチップを取り囲むように樹脂成形体の表面に、前記ＬＥＤチップの発光方向に指向性をもつレンズ形状部を有するフレネルレンズ付チップＬＥＤの構造において、樹脂成形時にフレネルレンズを逆向きに一体で成形し、前記逆向きに成形されたフレネルレンズの屈折率を前記樹脂成形体の屈折率よりもより１に近づけたことを特徴とするフレネルレンズ付チップＬＥＤの構造。 The LED chip mounted on a printed board, on the surface of the resin molded body so as to surround the LED chip, in the structure of the Fresnel lens with a chip LED with a lens-shaped portion having a directivity in the emission direction of the LED chip, a resin molding The Fresnel lens chip LED is characterized in that the Fresnel lens is sometimes integrally molded in the opposite direction, and the refractive index of the Fresnel lens molded in the opposite direction is closer to 1 than the refractive index of the resin molding . Construction. プリント基板にＬＥＤチップを実装し、該ＬＥＤチップを取り囲むように形成した樹脂成形体の表面に、前記ＬＥＤチップの発光方向に指向性をもつレンズ形状部を有するフレネルレンズ付チップＬＥＤの製造方法において、
前記プリント基板は多数個取りする集合基板であって、該集合基板の所定位置に複数個の前記ＬＥＤチップをダイボンドし、ワイヤーボンドするＬＥＤ実装工程と、前記ＬＥＤチップを取り囲むように透明樹脂で前記樹脂成形体を形成すると同時に前記フレネルレンズを逆向きに一体で成形して、前記フレネルレンズの屈折率を前記樹脂成形体の屈折率よりもより１に近づけるようにした樹脂成形工程と、前記個々のＬＥＤチップを取り囲む枠部材となるべき所定の箇所に、前記樹脂成形体の表面から前記プリント基板上面に達する深さの溝を形成するハーフダイシング工程と、前記ハーフダイシング工程で形成された前記溝に樹脂を流し込み硬化させて枠部材を形成する枠樹脂成形工程と、前記枠樹脂上をダイシングラインに沿って単個のフレネルレンズ付チップＬＥＤに分割するフルダイシング工程とよりなることを特徴とするフレネルレンズ付チップＬＥＤの製造方法。
The LED chip mounted on a printed board, on the surface of the resin molded body formed so as to surround the LED chip, the manufacturing method of the Fresnel lens with a chip LED with a lens-shaped portion having a directivity in the emission direction of the LED chip ,
The printed circuit board is a collection substrate of multi-cavity, die-bonded a plurality of the LED chip in a predetermined position of the aggregate substrate, the an LED mounting step of wire bonding, a transparent resin to surround the LED chip A resin molding step in which the Fresnel lens is integrally molded in the opposite direction at the same time as forming the resin molded body so that the refractive index of the Fresnel lens is closer to 1 than the refractive index of the resin molded body; a predetermined portion to be the frame member surrounding the LED chip, the half-dicing step of forming a groove having a depth from the surface of the resin molded body reaches the printed circuit board top surface, the groove formed by half-dicing step A frame resin molding step in which a resin is poured and cured to form a frame member, and a single piece is formed on the frame resin along a dicing line. Method for manufacturing a Fresnel lens with a chip LED, characterized in that the more full dicing step of dividing the Renerurenzu with chip LED.
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