JP2007059492A - Structure of fresnel lens-equipped chip led - Google Patents

Structure of fresnel lens-equipped chip led Download PDF

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JP2007059492A
JP2007059492A JP2005240495A JP2005240495A JP2007059492A JP 2007059492 A JP2007059492 A JP 2007059492A JP 2005240495 A JP2005240495 A JP 2005240495A JP 2005240495 A JP2005240495 A JP 2005240495A JP 2007059492 A JP2007059492 A JP 2007059492A
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led
resin
chip
fresnel lens
lens
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JP4822503B2 (en
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Takeshi Miura
剛 三浦
Masahide Watanabe
将英 渡辺
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Citizen Electronics Co Ltd
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Citizen Electronics Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

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Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem that resin is likely to flow into a Fresnel-shaped fine groove when molding frame resin. <P>SOLUTION: A structure of a Fresnel lens-equipped chip LED comprises an LED mounting process of die bonding a plurality of LED chips 2 at a predetermined position on an integrated substrate 1, and wire bonding a metal fine line 3; a resin molding process of forming a resin molded body 4 with transparent resin so as to surround the LED chip 2; a half dicing process of forming a groove 7 of a depth reaching the upper surface of the substrate 1 from the surface of the resin molded product 4 at a predetermined position where the resin molded body becomes a frame member 5 surrounding an individual LED chip 2; a frame resin molding process of forming the frame member 5 by casting the resin into the groove 7 and hardening it; a lens sticking process of sticking a Fresnel lens 6 molded separately on the surface of the resin molded body 4; and a full dicing process of dividing the resin molded body 4 along a dicing line 8 into a single chip LED. The Fresnel lens 6 is stuck after the frame resin molding so that the resin is prevented from entering the Fresnel-shaped groove. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、携帯電話内の液晶バックライト光源用LED、カメラ補助光源用ＬＥＤなどに係わり、詳しくは、LEDの指向性を強く、フレネルレンズを用いることにより光を無駄なく有効利用するフレネルレンズ付チップＬＥＤの構造およびその製造方法に関する。   The present invention relates to an LED for a liquid crystal backlight source in a mobile phone, an LED for a camera auxiliary light source, and the like. Specifically, the LED has a strong directivity and effectively uses light without waste by using a Fresnel lens. The present invention relates to a structure of a chip LED and a manufacturing method thereof.

従来、軽薄短小を追求する電子機器向けに提供された表面実装型の発光ダイオードで、一般的に、携帯電話内の液晶バックライト光源用LED、カメラ補助光源用ＬＥＤなどに使用される発光ダイオードにおいては、指向性をもった製品が多く使用される。その際、ＬＥＤ素子において発光しているＬＥＤチップの光を樹脂成形体の上面から平行な光束として出射することができるように、その樹脂成形体の上面にフレネルカットを施す工夫が提案されている。（例えば、特許文献１参照）
特開２００４−１５８６３５号（第2〜５頁、図２~３） Conventionally, it is a surface mount type light emitting diode provided for electronic devices pursuing lightness and thinness. Generally, it is a light emitting diode used for liquid crystal backlight light source LEDs and camera auxiliary light source LEDs in mobile phones. Many products with directivity are used. At that time, a device has been proposed in which Fresnel cut is applied to the upper surface of the resin molded body so that the LED chip light emitted from the LED element can be emitted as a parallel light beam from the upper surface of the resin molded body. . (For example, see Patent Document 1)
Japanese Patent Application Laid-Open No. 2004-158635 (pages 2 to 5, FIGS. 2 to 3)

図７は、表面実装型チップＬＥＤを示すものであり、リードフレーム３１にＬＥＤチップ３２がダイボンドされ、金属細線よりなるボンディングワイヤー３３でワイヤボンディングされ、ＬＥＤチップ３２を取り囲むように透明樹脂で樹脂成形体３４を成形する。更に、樹脂成形体３４の表面に拡散シート３５を貼り付け、その上にフレネルレンズやアンキュレータレンズを構成したレンズシート３６を貼り付ける。   FIG. 7 shows a surface-mounted chip LED. An LED chip 32 is die-bonded to a lead frame 31, wire-bonded with a bonding wire 33 made of a fine metal wire, and molded with a transparent resin so as to surround the LED chip 32. The body 34 is molded. Further, a diffusion sheet 35 is attached to the surface of the resin molded body 34, and a lens sheet 36 constituting a Fresnel lens or an ancillator lens is attached thereon.

上記した表面実装型チップＬＥＤは、散シート３５や、フレネルレンズやアンキュレータレンズを構成したレンズシート３６を貼り付けるため、薄型化、小型化には対応が困難であった。そこで、図８に示す表面実装型チップＬＥＤは、樹脂モールド体４１の表面において、ＬＥＤチップ４２に対応する位置を中心として円領域にレンズ形状部４３が形成されている。上記した表面実装型チップＬＥＤの製造する際に、ＬＥＤチップ４２を配設部が開放された状態で樹脂モールドを行い、前記LEDチップ４２を蛍光体層４４で取り囲む。
前記蛍光体層４４の上面にレンズ形状部４３を備えた樹脂モールド表面部材が貼り付けられる。上記した表面実装型チップＬＥＤは、樹脂モールド体４１の表面高さ位置以下にレンズ形状部４３を形成することができるが、薄型化には満足できるものではない。 Since the surface mount type chip LED described above is attached with the scattering sheet 35 and the lens sheet 36 constituting a Fresnel lens or an ancillary lens, it is difficult to reduce the thickness and size. Therefore, in the surface-mounted chip LED shown in FIG. 8, a lens-shaped portion 43 is formed in a circular area around the position corresponding to the LED chip 42 on the surface of the resin mold body 41. When manufacturing the surface-mounted chip LED described above, resin molding is performed with the LED chip 42 in an open state, and the LED chip 42 is surrounded by the phosphor layer 44.
A resin mold surface member having a lens-shaped portion 43 is attached to the upper surface of the phosphor layer 44. The surface-mounted chip LED described above can form the lens-shaped portion 43 below the surface height position of the resin mold body 41, but it is not satisfactory for thinning.

図９から図１２は、従来の一般的な表面実装型チップＬＥＤの製造方法を示すものであり、図９は、樹脂成形体の上面にポッティングによりレンズ形状部を形成した断面図であり、図１０はその製造方法を示す断面図である。製造方法の概要について説明する。図１０（ａ）の樹脂成形工程では、集合基板５１の所定位置に、複数個のLEDチップ５２をダイボンドし、金属細線５３でワイヤーボンドするＬＥＤ実装工程を経た後、樹脂成形工程では、前記ＬＥＤチップ５２を取り囲むように透明樹脂で樹脂成形体５４を形成する。図１０（ｂ）のハーフダイシング工程では、前記複数個のＬＥＤチップ５２で枠部材となるべき所定の箇所で、前記樹脂成形体５４の表面から基板５１上面に達する深さの溝５５を形成する。図１０（ｃ）の枠樹脂成形工程では、前記ハーフダイシング工程で形成された溝５５に樹脂を流し込み硬化させて枠部材５６を形成する。図１０（ｄ）のポッティング工程では、個々のＬＥＤチップ５２に対応して樹脂成形体５４の表面にレンズとなるべき樹脂をポッティングしてレンズ形状部５７を形成する。図１０（e）のフルダイシング工程では、枠樹脂上をダイシングライン５８に沿って単個のレンズ付チップＬＥＤに分割することにより、図９に示す面実装型チップＬＥＤを製造することができる。   9 to 12 show a conventional method for manufacturing a general surface-mounted chip LED. FIG. 9 is a cross-sectional view in which a lens shape portion is formed by potting on the upper surface of a resin molded body. 10 is a sectional view showing the manufacturing method. An outline of the manufacturing method will be described. In the resin molding process of FIG. 10A, after the LED mounting process in which a plurality of LED chips 52 are die-bonded at predetermined positions on the collective substrate 51 and wire-bonded with the fine metal wires 53, the LED is processed in the resin molding process. A resin molded body 54 is formed of a transparent resin so as to surround the chip 52. In the half dicing process of FIG. 10B, a groove 55 having a depth reaching the upper surface of the substrate 51 from the surface of the resin molded body 54 is formed at a predetermined location to be a frame member of the plurality of LED chips 52. . In the frame resin molding step of FIG. 10C, the frame member 56 is formed by pouring resin into the groove 55 formed in the half dicing step and curing it. In the potting process of FIG. 10D, a lens-shaped portion 57 is formed by potting resin to be a lens on the surface of the resin molded body 54 corresponding to each LED chip 52. In the full dicing step of FIG. 10 (e), the surface-mount type chip LED shown in FIG. 9 can be manufactured by dividing the frame resin onto a single lens-mounted chip LED along the dicing line 58.

また、図１１は、脂成形体の上面にフレネルレンズを一体成形した断面図であり、図１２はその製造方法を示す断面図である。製造方法の概要について説明する。図１２（a）の樹脂成形工程では、集合基板５１の所定位置に、複数個のLEDチップ５２を実装するＬＥＤ実装工程を経た後、樹脂成形工程で前記ＬＥＤチップ５２を取り囲むように透明樹脂で樹脂成形体５４を形成する。その際に、成形型５９で型押し硬化してフレネルレンズ６０を一体に成形する。図１２（b）のハーフダイシング工程では、前記複数個のＬＥＤチップ５２で枠部材となるべき所定の箇所で、前記樹脂成形体５４の表面から基板５１上面に達する深さの溝５５を形成する。図１２（ｃ）の枠樹脂成形工程では、前記ハーフダイシング工程で形成された溝５５に樹脂を流し込み硬化させて枠部材５６を形成する。図１２（ｄ）のフルダイシング工程では、枠樹脂上をダイシングライン５８に沿って単個のレンズ付チップＬＥＤに分割することにより、図１１に示す面実装型チップＬＥＤを製造することができる。   Moreover, FIG. 11 is sectional drawing which integrally molded the Fresnel lens on the upper surface of the fat molded object, and FIG. 12 is sectional drawing which shows the manufacturing method. An outline of the manufacturing method will be described. In the resin molding process of FIG. 12A, after the LED mounting process of mounting a plurality of LED chips 52 on a predetermined position of the collective substrate 51, a transparent resin is used so as to surround the LED chips 52 in the resin molding process. A resin molded body 54 is formed. At that time, the Fresnel lens 60 is integrally molded by press-curing with the molding die 59. In the half dicing step of FIG. 12B, a groove 55 having a depth reaching the upper surface of the substrate 51 from the surface of the resin molded body 54 is formed at a predetermined location to be a frame member of the plurality of LED chips 52. . In the frame resin molding step of FIG. 12C, the frame member 56 is formed by pouring resin into the groove 55 formed in the half dicing step and curing it. In the full dicing step in FIG. 12D, the surface mount type chip LED shown in FIG. 11 can be manufactured by dividing the frame resin into single lens-attached chip LEDs along the dicing line 58.

解決しようとする問題点は、上記した図９、図１０に示すレンズ付チップＬＥＤは、レンズをポッティングで成形するので製品の厚みが厚くなる。図１１、図１２に示すフレネルレンズ付チップＬＥＤは、枠樹脂を流し込む時、毛細管現象により枠樹脂がフレネルの微細な溝に沿い入り込むという問題がある。また、枠樹脂部にフルネルが接しないようにすれば、これを解消させるが位置精度的に難しい。などの問題があった。   The problem to be solved is that the lens-mounted chip LED shown in FIGS. 9 and 10 has a thick product because the lens is molded by potting. The chip LED with Fresnel lens shown in FIGS. 11 and 12 has a problem that when the frame resin is poured, the frame resin enters along the fine groove of the Fresnel due to a capillary phenomenon. Further, if the full resin is not in contact with the frame resin portion, this can be eliminated, but it is difficult in terms of positional accuracy. There were problems such as.

本発明は、上述の欠点を解消するもので、その目的は、枠樹脂成形工程における樹脂がフレネルレンズの微細な溝に流れ込むことがない、信頼性に優れたフレネルレンズ付チップＬＥＤの構造およびその製造方法を提供するものである。   The present invention eliminates the above-mentioned drawbacks, and its purpose is to provide a highly reliable Fresnel lens-provided chip LED structure in which resin in the frame resin molding process does not flow into the fine grooves of the Fresnel lens and its A manufacturing method is provided.

上記目的を達成するために、本発明におけるフレネルレンズ付チップＬＥＤの構造は、プリント基板にLEDチップを実装し、該LEDチップを取り囲むように樹脂成形体の表面に、ＬＥＤチップの発光方向に指向性をもつレンズ形状部を有するフレネルレンズ付チップＬＥＤの構造において、別体で成形されたフレネルレンズを樹脂成形体の表面に貼り付けたことを特徴とするものである。   In order to achieve the above object, the structure of the chip LED with Fresnel lens in the present invention is such that the LED chip is mounted on a printed circuit board, and is directed to the surface of the resin molded body so as to surround the LED chip in the light emitting direction of the LED chip. In the structure of a chip LED with a Fresnel lens having a lens shape portion having a property, a Fresnel lens molded separately is attached to the surface of a resin molded body.

また、プリント基板にLEDチップを実装し、該LEDチップを取り囲むように樹脂成形体の表面に、ＬＥＤチップの発光方向に指向性をもつレンズ形状部を有するフレネルレンズ付チップＬＥＤの構造において、樹脂成形時にフルネルレンズを逆向きに一体で成形しことを特徴とするものである。   Further, in the structure of a chip LED with a Fresnel lens, in which a LED chip is mounted on a printed circuit board and a lens-shaped portion having directivity in the light emitting direction of the LED chip is formed on the surface of the resin molded body so as to surround the LED chip. It is characterized by integrally molding a fullnel lens in the opposite direction at the time of molding.

また、前記逆向きに成形されたフレネルレンズの屈折率をより１に近づけることを特徴とするものである。   Further, the refractive index of the Fresnel lens molded in the opposite direction is made closer to 1.

また、プリント基板にLEDチップを実装し、該LEDチップを取り囲むように樹脂成形体の表面に、ＬＥＤチップの発光方向に指向性をもつレンズ形状部を有するフレネルレンズ付チップＬＥＤの構造において、樹脂成形体の表面にレンズ部材をポッティングし、該ポッティング面を型押してフルネルレンズを成形しことを特徴とするものでわる。   Further, in the structure of a chip LED with a Fresnel lens, in which a LED chip is mounted on a printed circuit board and a lens-shaped portion having directivity in the light emitting direction of the LED chip is formed on the surface of the resin molded body so as to surround the LED chip. A lens member is potted on the surface of the molded body, and the full surface lens is molded by pressing the potting surface.

また、本発明におけるフレネルレンズ付チップＬＥＤの製造方法は、プリント基板にLEDチップを実装し、該LEDチップを取り囲むように樹脂成形体の表面に、ＬＥＤチップの発光方向に指向性をもつレンズ形状部を有するフレネルレンズ付チップＬＥＤの製造方法において、前記プリント基板は多数個取りする集合基板であって、該集合基板の所定位置に複数個のＬＥＤチップをダイボンドし、ワイヤーボンドするＬＥＤ実装工程と、前記ＬＥＤチップを取り囲むように透明樹脂で樹脂成形体を形成する樹脂成形工程と、前記個々のＬＥＤチップを取り囲む枠部材となるべき所定の箇所に、前記樹脂成形体の表面から基板上面に達する深さの溝を形成するハーフダイシング工程と、前記ハーフダイシング工程で形成された溝に樹脂を流し込み硬化させて枠部材を形成する枠樹脂成形工程と、前記樹脂成形体の表面に別体で成形されたフレネルレンズを貼り付けるフルネルレンズ貼り付け工程と、前記枠樹脂上をダイシングラインに沿って単個のフレネルレンズ付チップＬＥＤに分割するフルダイシング工程とよりなることを特徴とするものである。   Further, the manufacturing method of the chip LED with the Fresnel lens in the present invention is such that the LED chip is mounted on a printed circuit board, and the lens shape has directivity in the light emitting direction of the LED chip on the surface of the resin molded body so as to surround the LED chip. In the manufacturing method of the chip LED with Fresnel lens having a portion, the printed circuit board is a collective substrate to be taken in a large number, and an LED mounting step in which a plurality of LED chips are die-bonded to a predetermined position of the collective substrate and wire-bonded; A resin molding step of forming a resin molding with a transparent resin so as to surround the LED chip, and a predetermined portion to be a frame member that surrounds the individual LED chips from the surface of the resin molding to the upper surface of the substrate A half dicing process for forming a groove having a depth, and a resin is poured into the groove formed by the half dicing process to perform hardening. A frame resin molding step for forming a frame member, a Furnell lens affixing step for affixing a Fresnel lens molded separately on the surface of the resin molded body, and a simple process on the frame resin along a dicing line. And a full dicing process for dividing the chip LED with Fresnel lens.

また、プリント基板にLEDチップを実装し、該LEDチップを取り囲むように樹脂成形体の表面に、ＬＥＤチップの発光方向に指向性をもつレンズ形状部を有するフレネルレンズ付チップＬＥＤの製造方法において、前記プリント基板は多数個取りする集合基板であって、該集合基板の所定位置に複数個のＬＥＤチップをダイボンドし、ワイヤーボンドするＬＥＤ実装工程と、前記ＬＥＤチップを取り囲むように透明樹脂で樹脂成形体を形成すると同時にフルネルレンズを逆向きに一体で成形する樹脂成形工程と、前記個々のＬＥＤチップを取り囲む枠部材となるべき所定の箇所に、前記樹脂成形体の表面から基板上面に達する深さの溝を形成するハーフダイシング工程と、前記ハーフダイシング工程で形成された溝に樹脂を流し込み硬化させて枠部材を形成する枠樹脂成形工程と、前記枠樹脂上をダイシングラインに沿って単個のフレネルレンズ付チップＬＥＤに分割するフルダイシング工程とよりなることを特徴とするものである。   In addition, in the method of manufacturing a LED with a Fresnel lens having an LED chip mounted on a printed circuit board and having a lens shape portion having directivity in the light emitting direction of the LED chip on the surface of the resin molded body so as to surround the LED chip, The printed circuit board is a collective board for taking a large number of pieces. An LED mounting process in which a plurality of LED chips are die-bonded to a predetermined position of the collective board and wire-bonded, and resin molding is performed with a transparent resin so as to surround the LED chips. A resin molding step of integrally forming a full-lens in the opposite direction at the same time as forming the body, and a depth reaching the upper surface of the substrate from the surface of the resin molded body at a predetermined position to be a frame member surrounding each LED chip. A half dicing step for forming the groove, and a resin is poured into the groove formed in the half dicing step and cured to form a frame. A frame molded to form a timber, is characterized in that the more full dicing step of dividing the frame on the resin to a single number of Fresnel lens with chip LED along dicing lines.

また、プリント基板にLEDチップを実装し、該LEDチップを取り囲むように樹脂成形体の表面に、ＬＥＤチップの発光方向に指向性をもつレンズ形状部を有するフレネルレンズ付チップＬＥＤの製造方法において、前記プリント基板は多数個取りする集合基板であって、該集合基板の所定位置に複数個のＬＥＤチップをダイボンドし、ワイヤーボンドするＬＥＤ実装工程と、前記ＬＥＤチップを取り囲むように透明樹脂で樹脂成形体を形成する樹脂成形工程と、前記複数個のＬＥＤチップで枠部材となるべき所定の箇所で、前記樹脂成形体の表面から基板上面に達する深さの溝を形成するハーフダイシング工程と、前記ハーフダイシング工程で形成された溝に樹脂を流し込み硬化させて枠部材を形成する枠樹脂成形工程と、前記個々のＬＥＤチップに対応して樹脂成形体の表面にフルネルレンズとなるべき樹脂をポッティングするポッティング工程と、前記ポッティング樹脂が硬化する前に型押してフレネルレンズを成形する型押し工程と、前記枠樹脂上をダイシングラインに沿って単個のフレネルレンズ付チップＬＥＤに分割するフルダイシング工程とよりなることを特徴とするものである。   In addition, in the method of manufacturing a LED with a Fresnel lens having an LED chip mounted on a printed circuit board and having a lens shape portion having directivity in the light emitting direction of the LED chip on the surface of the resin molded body so as to surround the LED chip, The printed circuit board is a collective board for taking a large number of pieces. An LED mounting process in which a plurality of LED chips are die-bonded to a predetermined position of the collective board and wire-bonded, and resin molding is performed with a transparent resin so as to surround the LED chips. A resin molding step of forming a body, a half dicing step of forming a groove having a depth reaching the upper surface of the substrate from the surface of the resin molded body at a predetermined position to be a frame member by the plurality of LED chips, A frame resin molding process in which a resin is poured into a groove formed in the half dicing process and cured to form a frame member; and the individual LED chips. In response to the potting process, a potting process for potting resin to be a full-lens lens on the surface of the resin molded body, a stamping process for molding a Fresnel lens before the potting resin is cured, and dicing on the frame resin And a full dicing process for dividing the chip LED with a single Fresnel lens along the line.

本発明のフレネルレンズ付チップＬＥＤの構造およびその製造方法においては、 枠樹脂成形工程における樹脂がフレネルレンズの微細な溝に流れ込むことはない。小型、薄型の要求を満足することができ、信頼性に優れたフレネルレンズ付チップＬＥＤの構造およびその製造方法を提供することが可能である。   In the structure and manufacturing method of the chip LED with Fresnel lens of the present invention, the resin in the frame resin molding process does not flow into the fine groove of the Fresnel lens. It is possible to provide a structure and manufacturing method of a chip LED with a Fresnel lens that can satisfy the requirements for small size and thin thickness and is excellent in reliability.

本発明のチップ型ＬＥＤについて、図面に基づいて説明する。   The chip type LED of the present invention will be described with reference to the drawings.

図１、図２は、本発明の実施例１に係わり、図１は、フレネルレンズ付チップＬＥＤの構造を示す断面図、図2は、フレネルレンズ付チップLEDの製造方法を示す工程断面図である。   1 and 2 relate to Example 1 of the present invention, FIG. 1 is a cross-sectional view showing the structure of a chip LED with Fresnel lens, and FIG. 2 is a process cross-sectional view showing a method for manufacturing a chip LED with Fresnel lens. is there.

図１において、１はガラスエポキシ樹脂などよりなる絶縁性を有するプリント基板で、該プリント基板1上にLEDチップ２を透明接着剤で接着した後、ボンディングワイヤー（金属細線）３でワイヤボンディングし、前記LEDチップ２を囲むように透明樹脂で樹脂成形体４を形成する。該プリント基板１上に、枠樹脂成形された枠部材５が形成され、前記樹脂成形体４の上面に別体加工されたフレネルレンズ６が貼り付けられている。     In FIG. 1, reference numeral 1 denotes a printed circuit board made of glass epoxy resin or the like. After the LED chip 2 is bonded to the printed circuit board 1 with a transparent adhesive, wire bonding is performed with a bonding wire (metal fine wire) 3. A resin molded body 4 is formed of a transparent resin so as to surround the LED chip 2. A frame resin molded frame member 5 is formed on the printed circuit board 1, and a separately processed Fresnel lens 6 is attached to the upper surface of the resin molded body 4.

図２において、図２（ａ）の樹脂成形工程では、集合基板１の所定位置に、複数個のLEDチップ２をダイボンドし、金属細線３でワイヤーボンドするＬＥＤ実装工程を経た後、樹脂成形工程で前記ＬＥＤチップ２を取り囲むように透明樹脂で樹脂成形体４を形成する。図２（ｂ）のハーフダイシング工程では、前記複数個のＬＥＤチップ２で枠部材となるべき所定の箇所で、前記樹脂成形体４の表面から基板１の上面に達する深さの溝７を形成する。図２（ｃ）の枠樹脂成形工程では、前記ハーフダイシング工程で形成された溝７に樹脂を流し込み硬化させて枠部材５を形成する。図２（ｄ）のフレネルレンズ貼り付け工程では、前記樹脂成形体４の表面に別体で成形されたフレネルレンズ６を貼り付ける。図２（e）のフルダイシング工程では、前記枠樹脂成形体４の上をダイシングライン８に沿って単個のフレネルレンズ付チップＬＥＤに分割する。以上の工程で、図１に示すフレネルレンズ付チップＬＥDを製造することができる。   In FIG. 2A, in the resin molding process of FIG. 2A, after a LED mounting process in which a plurality of LED chips 2 are die-bonded to a predetermined position of the collective substrate 1 and wire-bonded with a thin metal wire 3, a resin molding process is performed. The resin molded body 4 is formed of a transparent resin so as to surround the LED chip 2. In the half dicing step of FIG. 2B, a groove 7 having a depth reaching the upper surface of the substrate 1 from the surface of the resin molded body 4 is formed at a predetermined position to be a frame member of the plurality of LED chips 2. To do. In the frame resin molding step of FIG. 2C, the frame member 5 is formed by pouring resin into the grooves 7 formed in the half dicing step and curing the resin. In the Fresnel lens affixing step in FIG. 2D, a Fresnel lens 6 molded separately is affixed to the surface of the resin molded body 4. In the full dicing process of FIG. 2 (e), the frame resin molded body 4 is divided along the dicing line 8 into a single LED with Fresnel lens. Through the above steps, the chip with Fresnel lens LED shown in FIG. 1 can be manufactured.

以上述べた構成のフレネルレンズ付チップＬＥＤは、枠樹脂成形体４を形成した後にフレネルレンズ６を貼付するので、フレネルレンズ６の微細な溝に樹脂が流れ込むことはない。   In the chip LED with the Fresnel lens having the above-described configuration, since the Fresnel lens 6 is pasted after the frame resin molded body 4 is formed, the resin does not flow into the minute groove of the Fresnel lens 6.

図３、図４は、本発明の実施例２に係わり、図３は、フレネルレンズ付チップＬＥＤの構造を示す断面図、図４は、フレネルレンズ付チップLEDの製造方法を示す工程断面図である。   3 and 4 relate to Example 2 of the present invention, FIG. 3 is a cross-sectional view showing the structure of a chip LED with Fresnel lens, and FIG. 4 is a process cross-sectional view showing a method for manufacturing a chip LED with Fresnel lens. is there.

図３（a）において、上記した実施例１と異なるところは、樹脂成形時にフルネルレンズ９を逆向きに一体で成形したことである。また、図３（b）に示す図３（a）のA部の拡大図において、一体成形した逆向きのフレネルレンズ９の屈折率をより１に近づけたものである。   In FIG. 3 (a), the difference from Example 1 described above is that the Furnell lens 9 is integrally molded in the reverse direction during resin molding. Also, in the enlarged view of part A of FIG. 3A shown in FIG. 3B, the refractive index of the integrally formed reverse-oriented Fresnel lens 9 is made closer to 1.

図４において、図４（ａ）の樹脂成形工程では、集合基板１の所定位置に、複数個のLEDチップ２を実装するＬＥＤ実装工程を経た後、樹脂成形工程で前記ＬＥＤチップ２を取り囲むように透明樹脂で樹脂成形体４を形成する時に、屈折率をより１に近づけたフレネルレンズ９を逆向きにして一体成形する。図４（ｂ）のハーフダイシング工程では、前記複数個のＬＥＤチップ２で枠部材となるべき所定の箇所で、前記樹脂成形体４の表面から基板１の上面に達する深さの溝７を形成する。図４（ｃ）の枠樹脂成形工程では、前記ハーフダイシング工程で形成された溝７に樹脂を流し込み硬化させて枠部材５を形成する。図４（ｄ）のフルダイシング工程では、前記枠樹脂成形体４の上をダイシングライン８に沿って単個のフレネルレンズ付チップＬＥＤに分割する。以上の工程で、図３に示すフレネルレンズ付チップＬＥDを製造することができる。   In FIG. 4A, in the resin molding process of FIG. 4A, after the LED mounting process of mounting a plurality of LED chips 2 on a predetermined position of the collective substrate 1, the LED chip 2 is surrounded by the resin molding process. When forming the resin molded body 4 with transparent resin, the Fresnel lens 9 having a refractive index closer to 1 is integrally molded in the reverse direction. In the half dicing step of FIG. 4B, a groove 7 having a depth reaching the upper surface of the substrate 1 from the surface of the resin molded body 4 is formed at a predetermined position to be a frame member of the plurality of LED chips 2. To do. In the frame resin molding step in FIG. 4C, the frame member 5 is formed by pouring resin into the grooves 7 formed in the half dicing step and curing the resin. In the full dicing step of FIG. 4D, the frame resin molded body 4 is divided along the dicing line 8 into a single LED with Fresnel lens. Through the above-described steps, the Fresnel lens-attached chip LED shown in FIG. 3 can be manufactured.

以上述べた構成のフレネルレンズ付チップＬＥＤは、枠樹脂成形体４を形成する時にフレネルレンズ９を逆向きに成形するので、フルネルの微細な溝がないので、枠樹脂成形の際の樹脂が流れ込むことはない。   Since the Fresnel lens-attached chip LED having the above-described configuration forms the Fresnel lens 9 in the reverse direction when the frame resin molded body 4 is formed, there is no fine groove of the Fresnel, so that the resin flows during the frame resin molding. There is nothing.

図５、図６は、本発明の実施例３に係わり、図５は、フレネルレンズ付チップＬＥＤの構造を示す断面図、図６は、フレネルレンズ付チップLEDの製造方法を示す工程断面図である。   5 and 6 relate to Example 3 of the present invention, FIG. 5 is a cross-sectional view showing the structure of a chip LED with Fresnel lens, and FIG. 6 is a process cross-sectional view showing a method for manufacturing a chip LED with Fresnel lens. is there.

図５において、上記した実施例１および実施例２と異なるところは、枠樹脂成形後にフルネルレンズ６を型押しして成形したことである。   In FIG. 5, the difference from Example 1 and Example 2 described above is that the Fresnel lens 6 is molded by pressing after frame resin molding.

図６において、図６（ａ）の樹脂成形工程では、集合基板１の所定位置に、複数個のLEDチップ２を実装するＬＥＤ実装工程を経た後、樹脂成形工程で前記ＬＥＤチップ２を取り囲むように透明樹脂で樹脂成形体４を形成する。図６（ｂ）のハーフダイシング工程では、前記複数個のＬＥＤチップ２で枠部材となるべき所定の箇所で、前記樹脂成形体４の表面から基板１の上面に達する深さの溝７を形成する。図６（ｃ）の枠樹脂成形工程では、前記ハーフダイシング工程で形成された溝７に樹脂を流し込み硬化させて枠部材５を形成する。図６（ｄ）のポッティング工程では、個々のＬＥＤチップ２に対応して樹脂成形体４の表面にフルネルレンズ６となるべき樹脂をポッティングしてレンズ形状部１０を形成する。図６（e）の型押し工程では、前記レンズ形状部１０のポッティング樹脂が硬化する前に、成形型１１で型押して、UV硬化または熱硬化することによりフレネルレンズ６を成形する。図６（f）のフルダイシング工程では、前記枠樹脂上のダイシングライン８に沿って単個のフレネルレンズ付チップＬＥＤに分割する。以上の工程で、図５に示すフレネルレンズ付チップＬＥDを製造することができる。   6A, in the resin molding process of FIG. 6A, after the LED mounting process of mounting a plurality of LED chips 2 on a predetermined position of the collective substrate 1, the LED chips 2 are surrounded by the resin molding process. The resin molded body 4 is formed of a transparent resin. In the half dicing process of FIG. 6B, grooves 7 having a depth reaching the upper surface of the substrate 1 from the surface of the resin molded body 4 are formed at predetermined locations to be frame members of the plurality of LED chips 2. To do. In the frame resin molding step in FIG. 6C, the frame member 5 is formed by pouring resin into the grooves 7 formed in the half dicing step and curing the resin. In the potting process of FIG. 6D, the lens-shaped portion 10 is formed by potting resin to be the Furnell lens 6 on the surface of the resin molded body 4 corresponding to each LED chip 2. 6E, before the potting resin of the lens shape portion 10 is cured, the Fresnel lens 6 is molded by pressing with the molding die 11 and UV curing or thermosetting. In the full dicing process of FIG. 6F, the chip LED with a Fresnel lens is divided along the dicing line 8 on the frame resin. Through the above steps, the chip with Fresnel lens LED shown in FIG. 5 can be manufactured.

以上述べた構成のフレネルレンズ付チップＬＥＤは、枠樹脂成形体４を形成した後にフレネルレンズを型押し成形するので、上記した実施例１と同様にフレネルレンズの微細な溝に樹脂が流れ込むことはない。   Since the chip LED with the Fresnel lens having the above-described configuration is formed by stamping the Fresnel lens after the frame resin molded body 4 is formed, the resin does not flow into the fine grooves of the Fresnel lens as in the first embodiment. Absent.

上述したように、実施例１では、単個の製品にフルダイシングする前にフレネルレンズを貼り付ける。実施例２では、単個の製品にフルダイシングする前に逆向きのフレネルレンズを一体成形する。また、実施例３では、単個の製品にフルダイシングする前に型押してフレネルレンズを成形する。当然ながら、実施例１〜３の製造方法は、ともに外周枠（枠部材）を使用しないチップLEDにも有効である。従来の課題であった枠樹脂を流し込む時、毛細管現象により枠樹脂がフレネルの微細な溝に沿い入り込みことはない。小型、薄型の要求を満足し、様々なアプリケーションに適応できる。本製造方法は多数個取り生産が容易であり、製作された信頼性に優れたフレネルレンズ付チップＬＥＤは、携帯電話内の液晶バックライト光源用LED、カメラ補助光源用LEDに使用される。   As described above, in Example 1, a Fresnel lens is pasted before full dicing into a single product. In Example 2, a reverse Fresnel lens is integrally molded before full dicing into a single product. Further, in Example 3, the Fresnel lens is molded by embossing before full dicing into a single product. Naturally, the manufacturing methods of Examples 1 to 3 are both effective for chip LEDs that do not use an outer peripheral frame (frame member). When pouring the frame resin, which has been a conventional problem, the frame resin does not enter along the fine groove of the Fresnel due to the capillary phenomenon. It meets the requirements for small size and thinness, and can be applied to various applications. This manufacturing method is easy to produce in large numbers, and the manufactured chip LED with Fresnel lens having excellent reliability is used for a liquid crystal backlight light source LED and a camera auxiliary light source LED in a mobile phone.

本発明の実施例１に係わり、図１は、フレネルレンズ付チップＬＥＤの構造を示す断面図である。FIG. 1 is a cross-sectional view illustrating the structure of a chip LED with a Fresnel lens according to Example 1 of the present invention. 図１のフレネルレンズ付チップLEDの製造方法を示す工程断面図である。It is process sectional drawing which shows the manufacturing method of chip LED with a Fresnel lens of FIG. 本発明の実施例２に係わり、図３は、フレネルレンズ付チップＬＥＤの構造を示す断面図である。FIG. 3 is a cross-sectional view showing the structure of a chip LED with a Fresnel lens according to Example 2 of the present invention. 図３のフレネルレンズ付チップLEDの製造方法を示す工程断面図である。It is process sectional drawing which shows the manufacturing method of chip | tip LED with a Fresnel lens of FIG. 本発明の実施例３に係わり、図５は、フレネルレンズ付チップＬＥＤの構造を示す断面図である。FIG. 5 is a cross-sectional view showing the structure of a chip LED with a Fresnel lens according to Example 3 of the present invention. 図５のフレネルレンズ付チップLEDの製造方法を示す工程断面図である。It is process sectional drawing which shows the manufacturing method of chip | tip LED with a Fresnel lens of FIG. 従来のレンズシートを貼付した表面実装型チップＬＥＤの断面図である。It is sectional drawing of surface mount type chip LED which affixed the conventional lens sheet. 他の従来のレンズ形状部を備えた表面実装型チップＬＥＤの断面図である。It is sectional drawing of surface mount type chip LED provided with the other conventional lens shape part. 従来の一般的な表面実装型チップＬＥＤで、樹脂成形体の上面にポッティングによりレンズ形状部を形成した断面図である。It is sectional drawing which formed the lens-shaped part by the potting on the upper surface of the resin molding in the conventional general surface mounted chip LED. 図９の表面実装型チップＬＥＤの製造方法を示す断面図である。It is sectional drawing which shows the manufacturing method of surface mount type chip LED of FIG. 従来の一般的な表面実装型チップＬＥＤで、樹脂成形体の上面にフレネルレンズを一体成形した断面図である。It is sectional drawing which integrally molded the Fresnel lens on the upper surface of the resin molding in the conventional general surface mounted chip LED. 図１１の表面実装型チップＬＥＤの製造方法を示す断面図である。It is sectional drawing which shows the manufacturing method of surface mount type chip LED of FIG.

符号の説明Explanation of symbols

１ 基板
２ LEDチップ
３ ボンディングワイヤー
４ 樹脂成形体
５ 枠部材
６、９ フレネルレンズ
７ 溝
８ ダンシングライン
１０ レンズ形状部
DESCRIPTION OF SYMBOLS 1 Board | substrate 2 LED chip 3 Bonding wire 4 Resin molded object 5 Frame member 6, 9 Fresnel lens 7 Groove 8 Dancing line 10 Lens shape part

Claims (7)

プリント基板にLEDチップを実装し、該LEDチップを取り囲むように樹脂成形体の表面に、ＬＥＤチップの発光方向に指向性をもつレンズ形状部を有するフレネルレンズ付チップＬＥＤの構造において、別体で成形されたフレネルレンズを樹脂成形体の表面に貼り付けたことを特徴とするフレネルレンズ付チップＬＥＤの構造。   In the structure of a chip LED with a Fresnel lens, in which a LED chip is mounted on a printed circuit board and a lens-shaped portion having directivity in the light emitting direction of the LED chip is formed on the surface of the resin molded body so as to surround the LED chip. A structure of a chip LED with a Fresnel lens, wherein the molded Fresnel lens is attached to the surface of a resin molded body. プリント基板にLEDチップを実装し、該LEDチップを取り囲むように樹脂成形体の表面に、ＬＥＤチップの発光方向に指向性をもつレンズ形状部を有するフレネルレンズ付チップＬＥＤの構造において、樹脂成形時にフルネルレンズを逆向きに一体で成形しことを特徴とするフレネルレンズ付チップＬＥＤの構造。   In the structure of a chip LED with a Fresnel lens that has an LED chip mounted on a printed circuit board and has a lens-shaped portion having directivity in the light emitting direction of the LED chip on the surface of the resin molded body so as to surround the LED chip. A structure of a chip LED with a Fresnel lens, wherein a Fresnel lens is integrally molded in the opposite direction. 前記逆向きに成形されたフレネルレンズの屈折率をより１に近づけることを特徴とする請求項２記載のフレネルレンズ付チップＬＥＤの構造。   3. The structure of a Fresnel lens-attached chip LED according to claim 2, wherein a refractive index of the Fresnel lens molded in the opposite direction is made closer to 1. プリント基板にLEDチップを実装し、該LEDチップを取り囲むように樹脂成形体の表面に、ＬＥＤチップの発光方向に指向性をもつレンズ形状部を有するフレネルレンズ付チップＬＥＤの構造において、樹脂成形体の表面にレンズ部材をポッティングし、該ポッティング面を型押してフルネルレンズを成形しことを特徴とするフレネルレンズ付チップＬＥＤの構造。   In the structure of a chip LED with a Fresnel lens having an LED chip mounted on a printed circuit board and having a lens-shaped portion having directivity in the light emitting direction of the LED chip on the surface of the resin molded body so as to surround the LED chip. A structure of a chip LED with a Fresnel lens, wherein a lens member is potted on the surface of the lens, and a fullel lens is formed by embossing the potting surface. プリント基板にLEDチップを実装し、該LEDチップを取り囲むように樹脂成形体の表面に、ＬＥＤチップの発光方向に指向性をもつレンズ形状部を有するフレネルレンズ付チップＬＥＤの製造方法において、前記プリント基板は多数個取りする集合基板であって、該集合基板の所定位置に複数個のＬＥＤチップをダイボンドし、ワイヤーボンドするＬＥＤ実装工程と、前記ＬＥＤチップを取り囲むように透明樹脂で樹脂成形体を形成する樹脂成形工程と、前記個々のＬＥＤチップを取り囲む枠部材となるべき所定の箇所に、前記樹脂成形体の表面から基板上面に達する深さの溝を形成するハーフダイシング工程と、前記ハーフダイシング工程で形成された溝に樹脂を流し込み硬化させて枠部材を形成する枠樹脂成形工程と、前記樹脂成形体の表面に別体で成形されたフレネルレンズを貼り付けるフルネルレンズ貼り付け工程と、前記枠樹脂上をダイシングラインに沿って単個のフレネルレンズ付チップＬＥＤに分割するフルダイシング工程とよりなることを特徴とするフレネルレンズ付チップＬＥＤの製造方法。   In the method of manufacturing a chip LED with a Fresnel lens having an LED chip mounted on a printed circuit board and having a lens shape portion having directivity in the light emitting direction of the LED chip on the surface of the resin molded body so as to surround the LED chip. The substrate is a collective substrate for taking a large number of pieces, and an LED mounting step in which a plurality of LED chips are die-bonded to a predetermined position of the collective substrate and wire-bonded, and a resin molded body is formed with a transparent resin so as to surround the LED chips. A resin molding step to be formed, a half dicing step of forming a groove having a depth reaching the upper surface of the substrate from the surface of the resin molded body at a predetermined position to be a frame member surrounding each of the LED chips, and the half dicing A frame resin molding step of forming a frame member by pouring resin into the grooves formed in the process and curing the surface, and the surface of the resin molded body It is characterized by comprising a Fresnel lens affixing step for adhering a Fresnel lens molded separately and a full dicing step for dividing the frame resin into a single LED with a Fresnel lens along a dicing line. Manufacturing method of chip LED with Fresnel lens. プリント基板にLEDチップを実装し、該LEDチップを取り囲むように樹脂成形体の表面に、ＬＥＤチップの発光方向に指向性をもつレンズ形状部を有するフレネルレンズ付チップＬＥＤの製造方法において、前記プリント基板は多数個取りする集合基板であって、該集合基板の所定位置に複数個のＬＥＤチップをダイボンドし、ワイヤーボンドするＬＥＤ実装工程と、前記ＬＥＤチップを取り囲むように透明樹脂で樹脂成形体を形成すると同時にフルネルレンズを逆向きに一体で成形する樹脂成形工程と、前記個々のＬＥＤチップを取り囲む枠部材となるべき所定の箇所に、前記樹脂成形体の表面から基板上面に達する深さの溝を形成するハーフダイシング工程と、前記ハーフダイシング工程で形成された溝に樹脂を流し込み硬化させて枠部材を形成する枠樹脂成形工程と、前記枠樹脂上をダイシングラインに沿って単個のフレネルレンズ付チップＬＥＤに分割するフルダイシング工程とよりなることを特徴とするフレネルレンズ付チップＬＥＤの製造方法。   In the method of manufacturing a chip LED with a Fresnel lens having an LED chip mounted on a printed circuit board and having a lens shape portion having directivity in the light emitting direction of the LED chip on the surface of the resin molded body so as to surround the LED chip. The substrate is a collective substrate for taking a large number of pieces, and an LED mounting step in which a plurality of LED chips are die-bonded to a predetermined position of the collective substrate and wire-bonded, and a resin molded body is formed with a transparent resin so as to surround the LED chips. At the same time as forming, a resin molding step of integrally molding the full-lens lens in the opposite direction, and a depth reaching the upper surface of the substrate from the surface of the resin molded body at a predetermined position to be a frame member surrounding each LED chip A half dicing step for forming grooves, and a resin is poured into the grooves formed in the half dicing step and cured to form a frame member. A frame resin molding process for forming, manufacturing method of the Fresnel lens with a chip LED, characterized in that the more full dicing step of dividing the frame on the resin to a single number of Fresnel lens with chip LED along dicing lines. プリント基板にLEDチップを実装し、該LEDチップを取り囲むように樹脂成形体の表面に、ＬＥＤチップの発光方向に指向性をもつレンズ形状部を有するフレネルレンズ付チップＬＥＤの製造方法において、前記プリント基板は多数個取りする集合基板であって、該集合基板の所定位置に複数個のＬＥＤチップをダイボンドし、ワイヤーボンドするＬＥＤ実装工程と、前記ＬＥＤチップを取り囲むように透明樹脂で樹脂成形体を形成する樹脂成形工程と、前記複数個のＬＥＤチップで枠部材となるべき所定の箇所で、前記樹脂成形体の表面から基板上面に達する深さの溝を形成するハーフダイシング工程と、前記ハーフダイシング工程で形成された溝に樹脂を流し込み硬化させて枠部材を形成する枠樹脂成形工程と、前記個々のＬＥＤチップに対応して樹脂成形体の表面にフルネルレンズとなるべき樹脂をポッティングするポッティング工程と、前記ポッティング樹脂が硬化する前に型押してフレネルレンズを成形する型押し工程と、前記枠樹脂上をダイシングラインに沿って単個のフレネルレンズ付チップＬＥＤに分割するフルダイシング工程とよりなることを特徴とするフレネルレンズ付チップＬＥＤの製造方法。

In the method of manufacturing a chip LED with a Fresnel lens having an LED chip mounted on a printed circuit board and having a lens shape portion having directivity in the light emitting direction of the LED chip on the surface of the resin molded body so as to surround the LED chip. The substrate is a collective substrate to be taken in a large number, and an LED mounting step in which a plurality of LED chips are die-bonded to a predetermined position of the collective substrate and wire-bonded, and a resin molded body is formed with a transparent resin so as to surround the LED chips A resin molding step to be formed, a half dicing step of forming a groove having a depth reaching the upper surface of the substrate from the surface of the resin molded body at a predetermined position to be a frame member by the plurality of LED chips, and the half dicing A frame resin molding process in which resin is poured into the grooves formed in the process and cured to form a frame member; A potting step of potting resin to be a full-nel lens on the surface of the resin molded body, a stamping step of molding a Fresnel lens before the potting resin is cured, and a dicing line on the frame resin And a full dicing process for dividing the chip LED with a single Fresnel lens along the line.

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