JP3140970U - Packaging of light sensing module - Google Patents

Abstract

Kind Code: A1 The present invention provides a packaging of a photosensitive module that simplifies the processing steps of the photosensitive module and shortens the packaging time.
A substrate 20, a light-sensitive chip 30, a translucent glass 40, and a packaging layer 50 are provided. Among them, the light sensing chip 30 is disposed on the substrate 20 and has an action section 32. The translucent glass 40 is affixed to the surface of the light sensing chip 30 so as to shield the action area 32. The packaging layer 50 covers the substrate 20, the outer peripheral portion of the light-sensitive chip 30, and the side edge portion of the light-transmitting glass 40 by a casting method, and exposes the working area 32.
[Selection] Figure 1

Description

  The present invention relates to a light sensing module, and more particularly to packaging of a light sensing module.

  As shown in FIG. 4, the conventional photosensitive module packaging 1 includes a substrate 2, a photosensitive chip 3, a packaging layer 4, and a light-transmissive glass 5. The photosensitive chip 3 is disposed on the top surface of the substrate 2 and is electrically connected to the substrate 2 by a number of gold wires 6. The packaging layer 4 covers parts other than the working area of the substrate 2 and the photosensitive chip 3 by molding, and the packaging layer 4 has perforations 8 corresponding to the working area 7 of the photosensitive chip 3. The translucent glass 5 is attached to the edge of the perforation 8. This makes it possible to package the light sensing module and achieve the purpose of protecting the light sensing chip 3.

However, in this method, in order to fix the translucent glass 5, it is necessary to first cut the edge of the hole 8 of the packaging layer 4 to widen the hole or apply an adhesive. In other words, the conventional packaging of the light-sensitive module has a drawback that it takes time since the processing steps are complicated.
As described above, the conventional light-sensitive module package has the above-described drawbacks, and thus has room for improvement.

  The main object of the present invention is to provide a packaging of a light-sensitive module that makes it possible to simplify the processing steps of the light-sensitive module and reduce the packaging time of the light-sensitive module.

  In order to achieve the above-described object, the packaging of the light-sensitive module according to the present invention includes a substrate, a light-sensitive chip, a light-transmitting glass, and a packaging layer. Of these, the light-sensing chip is disposed on the substrate and has an action zone. The translucent glass is attached to the surface of the light-sensitive chip so as to shield the working area. The packaging layer covers the substrate, the outer peripheral portion of the light-sensitive chip and the side edge portion of the light-transmitting glass by a casting method, and exposes the working area.

  Accordingly, the packaging of the light-sensitive module according to the present invention does not require a process of cutting the packaging layer to widen the hole or applying an adhesive, and the transparent glass is used in the process of manufacturing the packaging layer. By fixing, it is possible not only to achieve the purpose of simplifying the processing steps of the light sensing module, but also to shorten the processing time of the light sensing module compared to the conventional one.

Hereinafter, in order to explain the structure, features, and effects of the present invention, embodiments of the present invention will be described with reference to the drawings. First, the description of the drawings is as follows.
FIG. 1 is a schematic view illustrating packaging of a light sensing module according to a first embodiment of the present invention.
FIG. 2 is a schematic view illustrating packaging of a light sensing module according to a second embodiment of the present invention.
FIG. 3 is a schematic view illustrating packaging of a light sensing module according to a third embodiment of the present invention.

(First embodiment)
As shown in FIG. 1, the packaging 10 of the light sensing module according to the first embodiment of the present invention includes a substrate 20, a light sensing chip 30, a light transmissive glass 40, and a packaging layer 50.
The substrate 20 is a ceramic substrate, and the substrate 20 has a number of contacts 22 used for electrical connection with the light-sensitive chip 30 on the top. Since the board | substrate 20 is the same as the conventional one, detailed description is abbreviate | omitted.

  The light sensing chip 30 is disposed on the substrate 20 and has a working area 32 and a number of contacts 34 located on top of the light sensing chip 30. The substrate 20 and the photosensitive chip 30 are electrically connected by any one of a wire bonding method and a ball gate array (BGA) method. In the first embodiment, the contact point 22 of the substrate 20 and the contact point 34 of the light sensing chip 30 are electrically connected to each other between the substrate 20 and the light sensing chip 30 by wire bonding using a large number of gold wires 36. The light sensing chip 30 includes any one of a charge-coupled device (CCD), a complementary metal oxide semiconductor (CMOS), and a light-emitting diode (LED). In the first embodiment, the light sensing chip 30 uses a CCD as an example.

The translucent glass 40 is affixed to the surface of the light sensing chip 30 so as to shield the action area 32. The translucent glass 40 has a polarizing effect that makes it possible to give a specific optical effect.
The packaging layer 50 covers the substrate 20, the outer peripheral portion of the photosensitive chip 30 and the side edge portion of the light-transmitting glass 40 by a casting method so as to expose the active region 32. A perforation 52 corresponding to 32 is formed. The perforations 52 are gradually expanded from the side of the substrate 20 toward the outside in order to allow external rays to pass through and be projected onto the working area 32. The side edge portion of the translucent glass 40 has a fixing effect by the packaging layer 50. The packaging layer 50 is composed of one of packaging materials such as an epoxy resin, a thermosetting material, and a photocurable resin. In the first embodiment, the packaging layer 50 uses an epoxy resin as an example.

  In the first embodiment, the process of cutting the packaging layer 50 to widen the holes or applying an adhesive is not required, and the side edge of the transparent glass 40 is directly formed in the process of manufacturing the packaging layer 50. By fixing the portions, it is possible not only to achieve the purpose of simplifying the processing steps of the light sensing module, but also to reduce the processing time of the light sensing module compared to the conventional one. Moreover, since the translucent glass 40 is affixed directly on the action area 32 of the light sensing chip 30, it is possible to provide a relatively good translucency. In the test results of the first embodiment, the transmissivity reached 94% or more.

(Second Embodiment)
FIG. 2 is a schematic view of the packaging of the light sensing module according to the second embodiment of the present invention. The photosensitive module packaging 12 is substantially the same as that of the first embodiment, and includes a substrate 60, a photosensitive chip 70, a transparent glass 80, and a packaging layer 90. Differences from the first embodiment are as follows. The substrate 60 and the light sensing chip 70 are electrically connected to the contact 62 of the substrate 60 and the contact 74 of the light sensing chip 70 by a ball gate array method using a number of solder balls 72. Since the substrate 60 has a perforation 64 corresponding to the action area 76 of the light sensing chip 70 in order to expose the action area 76, it is possible to project an external light beam from the hole 64 to the action area. The purpose of the second embodiment is to explain the case where the present invention electrically connects the substrate 60 and the light sensing chip 70 by the ball gate array method. Thereby, the second embodiment can not only achieve the same effect as the first embodiment but also provide another embodiment.

(Third embodiment)
FIG. 3 is a schematic view of the packaging of the light sensing module according to the third embodiment of the present invention. The packaging structure 14 of the photosensitive module is substantially the same as that of the first embodiment, and includes a substrate 100, a photosensitive chip 110, a translucent glass 120, and a packaging layer 130. The difference from the first embodiment is that the substrate 100 is composed of a lead frame. The purpose of the third embodiment is to explain the case where the present invention mounts the light sensing chip 110 by a lead frame. Thereby, the third embodiment can not only achieve the same effect as the first embodiment, but also provide another embodiment.

  The unit presented by the embodiment of the present invention is only an example for explanation, and does not limit the claim of the present invention. Therefore, the change that replaces the unit with the same effect is included in the claim of the present invention. Should belong.

1 is a schematic diagram illustrating packaging of a light sensing module according to a first embodiment of the present invention. FIG. 6 is a schematic diagram illustrating packaging of a light sensing module according to a second embodiment of the present invention. FIG. 6 is a schematic diagram illustrating packaging of a light sensing module according to a third embodiment of the present invention. It is a schematic diagram which shows the packaging of the conventional optical sensing module.

Explanation of symbols

  10: Packaging, 20: Substrate, 22: Contact, 30: Photosensitive chip, 32: Action zone, 34: Contact, 36: Gold wire, 40: Translucent glass, 50: Packaging layer, 52: Perforation, 12 : Packaging, 60: substrate, 62: contact point, 64: perforation, 70: light sensing chip, 71: solder ball, 74: contact point, 76: working area, 80: translucent glass, 90: packaging layer, 14: Packaging, 100: substrate, 110: light-sensitive chip, 120: translucent glass, 130: packaging layer

Claims (8)

A substrate,
A light-sensitive chip disposed on the substrate and having a working zone;
A translucent glass attached to the surface of the light-sensitive chip so as to shield the action zone;
A packaging layer that covers the substrate, the outer peripheral portion of the light-sensitive chip and the side edge portion of the light-transmitting glass by a mold method, and exposes the working area;
A light-sensitive module packaging comprising:   2. The packaging of a light-sensitive module according to claim 1, wherein the substrate and the light-sensitive chip are electrically connected by any one of a wire bonding method and a ball gate array method.   The packaging of a light sensing module according to claim 1, wherein the light sensing chip comprises one of a CCD, a CMOS, and an LED.   The light-sensitive module packaging according to claim 1, wherein the translucent glass has a polarization effect.   The light-sensitive module packaging according to claim 1, wherein the packaging layer is formed of one of an epoxy resin, a thermosetting material, and a photo-curable resin packaging material.   The light sensing according to claim 1, wherein the packaging layer has a perforation corresponding to the working area, and the perforation can project an external light beam to the working area. Module packaging.   The light-sensitive module packaging according to claim 6, wherein the perforations are gradually expanded from the substrate side toward the outside.   The photosensitive module according to claim 1, wherein the substrate has a perforation corresponding to the working area, and the perforation is capable of passing an external light beam to be projected onto the working area. Packaging.

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