CN109709654A - Optical module, the production method of optical module and terminal device - Google Patents
Optical module, the production method of optical module and terminal device Download PDFInfo
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- CN109709654A CN109709654A CN201910146395.9A CN201910146395A CN109709654A CN 109709654 A CN109709654 A CN 109709654A CN 201910146395 A CN201910146395 A CN 201910146395A CN 109709654 A CN109709654 A CN 109709654A
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- Prior art keywords
- padded
- optical device
- optical module
- optical
- face
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Abstract
The present invention provides the production method and terminal device of optical module, optical module, the optical module, comprising: padded part, optical device and glue layer；The optical device is fixed on the padded part, and the optical device is electrically connected with the padded part；The glue layer is located at the junction of the optical device and the padded part.The waterproof effect of optical module provided in an embodiment of the present invention is preferable.
Description
Technical field
The present invention relates to field of communication technology more particularly to optical modules, the production method of optical module and terminal device.
Background technique
With the development of science and technology being provided with optical module on most of terminal devices, terminal device passes through optical module
The functions such as position detection may be implemented.In practice, optical module includes optical device and is pasted on optical device four
The waterproof foam in week, and above-mentioned waterproof foam generally requires staff and is manually pasted surrounding in optical device, but manually
The waterproof effect of the waterproof foam of stickup is poor, it is seen then that the waterproof effect of current optical component is poor.
Summary of the invention
The embodiment of the present invention provides the production method and terminal device of optical module, optical module, to solve optical module
The poor problem of waterproof effect.
In order to solve the above-mentioned technical problem, the present invention is implemented as follows:
In a first aspect, the embodiment of the invention provides a kind of optical modules, comprising: padded part, optical device and glue layer；
The optical device is fixed on the padded part, and the optical device is electrically connected with the padded part；The glue layer is located at
The junction of the optical device and the padded part.
Second aspect, the embodiment of the present invention also provide a kind of terminal device, comprising: above-mentioned optical module.
The third aspect, the embodiment of the invention provides a kind of production methods of optical module, comprising:
A padded plate is provided, the padded plate includes the first face and the second face being disposed opposite to each other；
N number of optical device is mounted on first face, obtains padded board group part semi-finished product, wherein the N is greater than 0
Integer；
Dispensing processing is carried out to the padded boards half-finished product, so that in the connection along each optical device and first face
Place forms point glue-line, obtains padded board group part finished product；
The padded board group part finished product is cut, and obtains N number of optical module, wherein the corresponding optics of each optical module
Device.
In the embodiment of the present invention, due to being provided with glue layer in the junction of optical device and padded part, and glue layer can
It is directly obtained with carrying out dispensing processing by machine during making optical module, so that glue layer is more uniform,
So that the waterproof effect of optical module is preferable.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, needed in being described below to the embodiment of the present invention
Attached drawing to be used is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention,
For those of ordinary skill in the art, without any creative labor, it can also obtain according to these attached drawings
Obtain other attached drawings.
Fig. 1 is a kind of structural schematic diagram of optical module provided in an embodiment of the present invention；
Fig. 2 is a kind of structural schematic diagram of terminal device provided in an embodiment of the present invention；
Fig. 3 is a kind of flow chart of the production method of optical module provided in an embodiment of the present invention；
Fig. 4 is one of exemplary graph provided in an embodiment of the present invention；
Fig. 5 is the two of exemplary graph provided in an embodiment of the present invention；
Fig. 6 is the three of exemplary graph provided in an embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are some of the embodiments of the present invention, instead of all the embodiments.Based on this hair
Embodiment in bright, every other implementation obtained by those of ordinary skill in the art without making creative efforts
Example, shall fall within the protection scope of the present invention.
It is a kind of structural schematic diagram of optical module provided in an embodiment of the present invention referring to Fig. 1, Fig. 1, as shown in Figure 1, one
Kind optical module 100, comprising: padded part 101, optical device 102 and glue layer 103；The optical device 102 is fixed on described
On padded part 101, the optical device 102 is electrically connected with the padded part 101；The glue layer 103 is located at the optics device
The junction of part 102 and the padded part 101.
Wherein, optical device 102 can be optical chip.Certainly, optical device 102 can also be include infrared emission
The optical sensor of device and infrared receiving device.It should be noted that the concrete type of optical device 102 does not limit herein
It is fixed.
In the embodiment of the present invention, due to being provided with glue layer 103 in the junction of optical device 102 and padded part 101, and
Glue layer 103 can carry out dispensing processing by dispenser during making optical module 100 and directly obtain, so that
Glue layer 103 is more uniform, so that the waterproof effect of optical module 100 is preferable.In addition, in the prior art by artificial
The mode for pasting waterproof foam is compared, and the treatment effeciency for handling to obtain glue layer 103 by dispenser progress dispensing is higher, and can
With batch production, cost of labor has been saved.
Optionally, the edge of the optical device 102 is equipped with the glue layer 103.
Wherein, glue layer 103 can be bonded the edge setting of optical device 102, so that the waterproof of optical module is imitated
Fruit is more preferable.
In the embodiment of the present invention, since glue layer 103 has waterproof action, set in the edge ring of optical device 102
There is glue layer 103, in this way, it is possible to reduce water and dust are to generation the phenomenon that damage caused by optical device 102.
Optionally, referring to Fig. 1, there is gap, in the gap between the optical device 102 and the padded part 101
Elasticity layer 104 is set.
Wherein, elastic layer 104 can extend into gap formation, certainly, elastic layer for a part of glue layer 103
104 can also be rubber layer etc., and the concrete type of elastic layer 104 is it is not limited here.
In addition, elastic layer 104 can be to optical device when elastic layer 104 is that glue layer 103 extends into gap formation
Solder joint between 102 and padded part 101 forms protection, the thermal deformation stress resistivity of improving optical component 100 and anti-drop
Ability.
In the embodiment of the present invention, there is elastic layer 104, so as to reduce light between optical device 102 and padded part 101
The stress between device 102 and padded part 101 is learned, so as to the anti-drop ability of improving optical component 100.
Optionally, the padded part 101 is printed circuit board or flexible circuit board.
In the embodiment of the present invention, padded part 101 is printed circuit board or flexible circuit board, according to different applied fields
Scape, padded part 101 can select printed circuit board or flexible circuit board, thus improve the diversity of optical module 100 with
And the flexibility used.In addition, optical device can be made since padded part 101 is printed circuit board or flexible circuit board
Between 102 and padded part 101 to be electrically connected effect preferable.
Referring to fig. 2, the embodiment of the present invention also provides a kind of terminal device, including cover board 201, frame 202,203 and of mainboard
Above-mentioned optical module 100, the mainboard 203 are electrically connected with the padded part 101 in the optical module 100, set on cover board 201
It is equipped with through-hole 2011, and the optical device 102 in optical module 100 can be arranged towards the through-hole 2011.
Wherein, a holding tank can be set on frame 202, cover board 201, frame 202 and mainboard 203 can stack gradually
Setting, and cover board 201, frame 202 and mainboard 203 can be enclosed an accommodating chamber 204, for optical module 100 to be arranged,
And on frame 202 it is raised it is a part of can be pressed with glue layer 103, on the one hand can make the waterproof of terminal device and anti-
Dirt effect is preferable, on the other hand it is also possible that preferable to the fixed effect of optical module 100, so that terminal device is anti-
It is also preferable to fall ability.In addition, the structure of optical module 100 is referred to above-described embodiment, due in the present embodiment, using
Optical module 100 in above-described embodiment, thus terminal device provided in an embodiment of the present invention have in above-described embodiment
The identical beneficial effect of optical module 100.
It is a kind of flow chart of the production method of optical module provided in an embodiment of the present invention referring to Fig. 3, Fig. 3, such as Fig. 3 institute
Show, comprising the following steps:
Step 301 provides a padded plate, and the padded plate includes the first face and the second face being disposed opposite to each other.
Wherein, padded plate can be two-sided wiring board, i.e., the first face and the second face of padded plate can be set wired
Road, so that the first face and the second face of padded plate can be electrically connected with other components, such as: the first face of padded plate
It can be used for being electrically connected with optical device, the second face of padded plate can be used for being electrically connected with the mainboard of terminal device.
N number of optical device is mounted on first face by step 302, obtains padded board group part semi-finished product, wherein the N
For the integer greater than 0.
Wherein, in the production process, each optical device can be electrically connected with the first face of padded plate, and optics device
Part can be optical chip.Certainly, optical device can also be the optics for including infrared launcher and infrared receiving device
Sensor.It should be noted that the concrete type of optical device is it is not limited here.
Optionally, the N is the integer greater than 1, the optical device that any two are disposed adjacent in N number of optical device
Between there are spacing.
In this way, there are spacing between the optical device that arbitrary neighborhood is two when including multiple optical devices, on the one hand it is
It is on the other hand in order to facilitate being cut in step 304 in order to facilitate dispensing processing is carried out in step 303.
Wherein, optionally, described that N number of optical device is mounted on first face when including multiple optical devices, it obtains
To padded board group part semi-finished product, comprising:
N number of optical device is mounted on first face in an array manner, obtains padded board group part semi-finished product.
Such as: when there are four when optical device, aforementioned four optical device can be in field for setting on the first face of padded plate
Glyph shape distribution.Certainly, aforementioned four optical device can also be along same lineal layout, and two light of arbitrary neighborhood
The spacing learned between device is equal.
In present embodiment, multiple optical devices can be mounted on by the first face by mounting machine in an array manner,
The degree of automation of attachment is improved, so that mounted efficiency is higher.
Step 303 carries out dispensing processing to the padded boards half-finished product, so that along each optical device and described first
The junction in face forms point glue-line, obtains padded board group part finished product.
Wherein it is possible to which glue-line is arranged around the edge of entire optical device, i.e. point glue-line can surround light
Learn device setting.It is of course also possible to which a part of the surface for glue-line fitting optical device is arranged.
It should be noted that in the present embodiment, dispensing can be carried out using spot gluing equipment, realize for dispensing glue automatic
Change, the precision and stability of production is more preferable, in the prior art in such a way that staff is manually pasted waterproof foam compared with,
Production efficiency is improved, and is reduced the production cost, and the dispensing effect of spot gluing equipment is preferable.
In addition, water and dust etc. can be prevented to the first face of optical device and padded plate due to the presence of glue-line
Between junction damage so that the waterproof of the junction between optical device and the first face of padded plate and anti-
Dirt effect is preferable.
In addition, the point glue-line on padded plate can connect as a monolith point glue-line, or individual muti-piece point glue-line.
Optionally, it is described dispensing processing is carried out to the padded boards half-finished product before, the method also includes:
Setting is located on the coaming plate of N number of optical device on the first face of the padded plate；
It is described dispensing processing is carried out to the padded boards half-finished product after, the method also includes:
The coaming plate is removed from the first face of the padded plate.
Wherein, the height of coaming plate can be greater than or equal to the height of optical device.Certainly, coaming plate can be removably arranged
In on the first face of padded plate.
In the embodiment of the present invention, since there is glue-line mobility to be arranged on padded plate before carrying out dispensing processing
Coaming plate removes coaming plate after carrying out dispensing processing, in this way, barrier effect is formed to glue-line by coaming plate, to reduce a little
Glue-line overflows the generation of the phenomenon that the first face of padded plate.
In addition, when optical module is applied in different terminals, according to the size of different terminals, adjustable glue-line
Height.Such as: when the first optical module is applied in first terminal, if first terminal is used to be arranged the appearance of the first optical module
Receive chamber height it is higher, then can realize that the first optical module is assemblied in the by selecting thicker padded plate in the prior art
In one terminal, and in the present embodiment, then it can increase the height of a glue-line to realize that the first optical module is assemblied in first terminal
In, to improve product design and generate the flexibility of management.
In addition, in the prior art, being needed special according to the different production of optical module when the type difference of optical module
Waterproof foam, and in the present embodiment, then only need to adjust the size of a glue-line, reduce difficulty of processing, improve plus
Work efficiency rate.Such as: an optical module is that optical chip needs in the prior art when another optical module is optical sensor
Waterproof foam needed for making optical chip and optical sensor respectively, and in the present embodiment, then it only needs according to optical core
The size adjusting of piece and optical sensor puts the size of glue-line accordingly.
Optionally, the graduation mark for measuring the dispensing layer height is provided on the coaming plate.
The graduation mark for measurement point glue-line height is provided in the embodiment of the present invention, on coaming plate, in this way, carrying out dispensing
When processing, the height that very convenient, quick can obtain point glue-line improves processing to facilitate the height of point of adjustment glue-line
Efficiency.
Step 304, the cutting padded board group part finished product, and obtain N number of optical module, wherein each optical module pair
Answer an optical device.
Wherein, each optical module may include having an optical device, padded part and glue layer, wherein padded part is
A part of padded plate being connect with optical device, and glue layer is and optical device adjacent portion or whole point glue-lines.
Such as: in the manufacturing process of the present embodiment, the specific structural schematic diagram of each step may refer to Fig. 4-6.
Referring to fig. 4, a padded plate 400 is provided, padded plate 400 includes the first face 401 and the second face 402 being disposed opposite to each other；
Three optical devices 500 are mounted on the first face 401, obtain padded board group part semi-finished product, and in above three optical device 500
There are spacing between the optical device 500 that any two are disposed adjacent；
Referring to Fig. 5, dispensing processing is carried out to padded boards half-finished product, so that along each optical device 500 and the first face 401
Junction formed point a glue-line 600, obtain padded board group part finished product；
Referring to Fig. 6, A and part B padded board group part finished product can be cut along Fig. 6, and obtain three optical modules,
In, the corresponding optical device 500 of each optical module.
It should be noted that the optical module finally obtained in the present embodiment may refer to optical module shown in Fig. 1
Structure, and optical device 102 shown in Fig. 1 can be the optical device 500 in the present embodiment, glue shown in Fig. 1
Layer 103 can be a part of the point glue-line 600 in the present embodiment, and padded part 101 shown in Fig. 1 can be the present embodiment
In padded plate 400 a part.
In the embodiment of the present invention, due to being provided with glue layer in the junction of optical device and padded part, and glue layer can
It is directly obtained with carrying out dispensing processing by machine during making optical module, so that glue layer is more uniform,
So that the waterproof effect of optical module is preferable.
In addition, the spacing between two adjacent optical devices can when being provided with multiple optical devices on padded plate
Point glue-line, after cutting, disposable available at least two optical module, to improve are formed to carry out dispensing processing
The producing efficiency of optical module.In addition, also to carry out being manually pasted waterproof foam again, reduce the dress of optical module
With process, the producing efficiency of optical module is further improved.
The embodiment of the present invention is described with above attached drawing, but the invention is not limited to above-mentioned specific
Embodiment, the above mentioned embodiment is only schematical, rather than restrictive, those skilled in the art
Under the inspiration of the present invention, without breaking away from the scope protected by the purposes and claims of the present invention, it can also make very much
Form belongs within protection of the invention.
Claims (10)
1. a kind of optical module characterized by comprising padded part, optical device and glue layer；The optical device is fixed on
On the padded part, the optical device is electrically connected with the padded part；The glue layer be located at the optical device with it is described
The junction of padded part.
2. optical module according to claim 1, which is characterized in that the edge of the optical device is equipped with described
Glue layer.
3. optical module according to claim 1, which is characterized in that have between the optical device and the padded part
Elasticity layer is arranged in the gap for gap.
4. optical module according to claim 1, which is characterized in that the padded part is printed circuit board or flexible electrical
Road plate.
5. a kind of terminal device, which is characterized in that including mainboard, and such as optics group of any of claims 1-4
Part.
6. a kind of production method of optical module characterized by comprising
A padded plate is provided, the padded plate includes the first face and the second face being disposed opposite to each other；
N number of optical device is mounted on first face, obtains padded board group part semi-finished product, wherein the N is whole greater than 0
Number；
Dispensing processing is carried out to the padded boards half-finished product, so that in the junction shape along each optical device and first face
At a glue-line, padded board group part finished product is obtained；
The padded board group part finished product is cut, and obtains N number of optical module, wherein the corresponding optical device of each optical module.
7. according to the method described in claim 6, it is characterized in that, the N is integer greater than 1, in N number of optical device
There are spacing between the optical device that any two are disposed adjacent.
8. being obtained the method according to the description of claim 7 is characterized in that described be mounted on first face for N number of optical device
To padded board group part semi-finished product, comprising:
N number of optical device is mounted on first face in an array manner, obtains padded board group part semi-finished product.
9. according to the method described in claim 6, it is characterized in that, described handle it to the padded boards half-finished product progress dispensing
Before, the method also includes:
Setting is located on the coaming plate of N number of optical device on the first face of the padded plate；
It is described dispensing processing is carried out to the padded boards half-finished product after, the method also includes:
The coaming plate is removed from the first face of the padded plate.
10. according to the method described in claim 9, it is characterized in that, being provided on the coaming plate for measuring described glue-line
The graduation mark of height.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910146395.9A CN109709654A (en) | 2019-02-27 | 2019-02-27 | Optical module, the production method of optical module and terminal device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910146395.9A CN109709654A (en) | 2019-02-27 | 2019-02-27 | Optical module, the production method of optical module and terminal device |
Publications (1)
| Publication Number | Publication Date |
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| CN109709654A true CN109709654A (en) | 2019-05-03 |
Family
ID=66265343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910146395.9A Pending CN109709654A (en) | 2019-02-27 | 2019-02-27 | Optical module, the production method of optical module and terminal device |
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Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0439955A (en) * | 1990-06-05 | 1992-02-10 | Mitsubishi Electric Corp | Semiconductor device |
| US6906397B2 (en) * | 2003-07-16 | 2005-06-14 | Kingpak Technology Inc. | Image sensor having an improved transparent layer |
| JP2005340352A (en) * | 2004-05-25 | 2005-12-08 | Sumitomo Bakelite Co Ltd | Semiconductor module and manufacturing method thereof |
| CN1735973A (en) * | 2003-01-20 | 2006-02-15 | 夏普株式会社 | Transparent resin composition for optical sensor filter, optical sensor and production method therefor |
| CN1819166A (en) * | 2005-01-07 | 2006-08-16 | 台湾积体电路制造股份有限公司 | Package structure |
| TWM336536U (en) * | 2008-01-11 | 2008-07-11 | Lingsen Precision Ind Ltd | Package structure of light sensing module |
| CN201266267Y (en) * | 2008-09-10 | 2009-07-01 | 李东 | Encapsulation structure of digital image taking module |
| CN101950751A (en) * | 2009-07-10 | 2011-01-19 | 菱光科技股份有限公司 | Image sensor and encapsulating method thereof |
| CN101989580A (en) * | 2009-07-29 | 2011-03-23 | 胜开科技股份有限公司 | Image sensor package structure with large air cavity |
| CN206225406U (en) * | 2016-12-07 | 2017-06-06 | 鸿利智汇集团股份有限公司 | A kind of double-side COB |
| CN107275460A (en) * | 2017-07-12 | 2017-10-20 | 惠州市聚飞光电有限公司 | A kind of luminous LED component of one side and method for packing |
| CN207097856U (en) * | 2017-06-16 | 2018-03-13 | 深圳市科艺星光电科技有限公司 | Potted element, circuit board and lighting device |
| CN207753046U (en) * | 2018-01-08 | 2018-08-21 | 广东晶科电子股份有限公司 | A kind of LED packagings |
| CN108810333A (en) * | 2017-04-28 | 2018-11-13 | 南昌欧菲光电技术有限公司 | Camera module and its assemble method, sunk type photosensory assembly |
-
2019
- 2019-02-27 CN CN201910146395.9A patent/CN109709654A/en active Pending
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0439955A (en) * | 1990-06-05 | 1992-02-10 | Mitsubishi Electric Corp | Semiconductor device |
| CN1735973A (en) * | 2003-01-20 | 2006-02-15 | 夏普株式会社 | Transparent resin composition for optical sensor filter, optical sensor and production method therefor |
| US6906397B2 (en) * | 2003-07-16 | 2005-06-14 | Kingpak Technology Inc. | Image sensor having an improved transparent layer |
| JP2005340352A (en) * | 2004-05-25 | 2005-12-08 | Sumitomo Bakelite Co Ltd | Semiconductor module and manufacturing method thereof |
| CN1819166A (en) * | 2005-01-07 | 2006-08-16 | 台湾积体电路制造股份有限公司 | Package structure |
| TWM336536U (en) * | 2008-01-11 | 2008-07-11 | Lingsen Precision Ind Ltd | Package structure of light sensing module |
| CN201266267Y (en) * | 2008-09-10 | 2009-07-01 | 李东 | Encapsulation structure of digital image taking module |
| CN101950751A (en) * | 2009-07-10 | 2011-01-19 | 菱光科技股份有限公司 | Image sensor and encapsulating method thereof |
| CN101989580A (en) * | 2009-07-29 | 2011-03-23 | 胜开科技股份有限公司 | Image sensor package structure with large air cavity |
| CN206225406U (en) * | 2016-12-07 | 2017-06-06 | 鸿利智汇集团股份有限公司 | A kind of double-side COB |
| CN108810333A (en) * | 2017-04-28 | 2018-11-13 | 南昌欧菲光电技术有限公司 | Camera module and its assemble method, sunk type photosensory assembly |
| CN207097856U (en) * | 2017-06-16 | 2018-03-13 | 深圳市科艺星光电科技有限公司 | Potted element, circuit board and lighting device |
| CN107275460A (en) * | 2017-07-12 | 2017-10-20 | 惠州市聚飞光电有限公司 | A kind of luminous LED component of one side and method for packing |
| CN207753046U (en) * | 2018-01-08 | 2018-08-21 | 广东晶科电子股份有限公司 | A kind of LED packagings |
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Application publication date: 20190503 |