JP6321228B2 - Light emitting device - Google Patents

Description

  The present invention relates to a light emitting device.

  FIG. 55 is a perspective view showing an example of a conventional light emitting device (see, for example, Patent Document 1). 56 is a main-portion cross-sectional view of the light-emitting device shown in FIG. The light emitting device 9A shown in these drawings includes a substrate 91, a die bonding conductor pattern 92, a bonding wire bonding conductor pattern 93, a light emitting element 94, and a wire 95.

  On the surface 91a side of the substrate 91, a recess 911 and a recess 912 are formed. The recess 911 is formed on the bottom surface 912 a of the recess 912. Both the recess 911 and the recess 912 have an inverted truncated cone shape. The side surface 911 b of the recess 911 is a reflecting surface that reflects the light of the light emitting element 94. The conductor pattern 92 extends from the surface 91 a of the substrate 91 to the bottom surface 911 a of the recess 911. The conductor pattern 93 extends from the surface 91 a of the substrate 91 to the bottom surface 912 a of the recess 912. The light emitting element 94 is disposed on the bottom surface 911 a of the recess 911 and is electrically connected to one end of the conductor pattern 92. The wire 95 is connected to the light emitting element 94 and the conductor pattern 93.

  In recent years, there has been a demand for improving the front irradiation intensity of the light emitting device 9A and reducing the directivity angle. To that end, it is conceivable to increase the size in the direction z of the side surface 911b, which is a light reflecting surface. However, since the concave portion 911 is formed on the bottom surface 912a of the concave portion 912, the side surface 911b must be large enough to extend from the bottom surface 911a to the bottom surface 912a. For this reason, the side surface 911b cannot be made sufficiently large, and the light emitting device 9A cannot sufficiently satisfy the above-mentioned demand.

  An example of a conventional reflective LED module is disclosed in Patent Document 2. As shown in FIG. 57, this type of LED module X7 includes an LED element 781, a case 784 having a concave reflecting surface 785, and first and second leads 786 and 789 covering a part of the reflecting surface 785. With. The first lead 786 is provided with a die pad portion 787 that is bonded in a posture in which the LED element 781 faces the reflective surface 785. The second lead 789 is provided with a bonding pad portion 790 that is connected to the LED element 781 via a wire 792. The die pad portion 787 has a rectangular shape in plan view, and the LED elements 781 are bonded via a conductive adhesive in a posture in which all the corner portions 782 correspond to the corners 788 of the die pad portion 787. In general, a translucent resin 791 is provided between the first and second leads 786 and 789 and the reflecting surface 785. The light from the LED element 781 is reflected by the reflecting surface 785 of the case 784 and then passes through the surface of the translucent resin 791 and is irradiated to the outside of the case 784.

  When the LED element 781 is bonded to the die pad portion 787 via a conductive adhesive, the conductive adhesive protrudes more easily from the four sides 783 than the corner portion 782 of the LED element 781. For this reason, the die pad portion 787 has a relatively large dimension on one side in order to ensure a sufficient empty space around the entire LED element 781. On the other hand, when the area of the die pad portion 787 is increased, most of the light reflected by the reflecting surface 785 and traveling outward from the case 784 is blocked by the die pad portion 787. Therefore, in the conventional LED module X7, the area of the die pad portion 787 serving as a light shielding portion cannot be made too small, and the luminance of the entire chip cannot be increased so much.

For example, Patent Document 3 discloses a conventional reflective LED module. As shown in FIG. 58, this type of LED module X5 includes an LED element 581, a case 582 having a main surface 583, a first lead 586 to which the LED element 581 is bonded, and a wire 593 to the LED element 581. And a second lead 589 connected thereto. A concave portion 585 having a concave reflecting surface 584 is formed on the main surface 583. The inner lead portion 587 of the first lead 586 extends from one side of the case 582 to the vicinity of the center of the recess 585. An LED element 581 is bonded to the tip of the inner lead portion 587 in a posture facing the reflecting surface 584. The inner lead portion 590 of the second lead 589 extends from the other side of the case 582 to the vicinity of the inner lead portion 587 of the first lead 586. The recess 585 is filled with a translucent resin 592.

  When manufacturing the LED module X5, the first and second leads 586, 589 are formed by subjecting the lead frame to a forming process or the like. The inner lead portions 587 and 590 are fixed to the surface of the translucent resin 592 as the translucent resin 592 is cured. The remaining outer lead portions 588 and 591 are bent by forming so as to extend from the main surface 583 of the case 582 to the side surface and further to the bottom surface, and the portion along the bottom surface is used as an electrode terminal.

  The light emitted from the LED element 581 is reflected by the reflecting surface 584 of the recess 585, and then passes through the surface of the translucent resin 592 and is irradiated to the outside of the case 582. At that time, the inner lead portions 587 and 590 serve as a light shielding portion for the light traveling outward from the case 582. Therefore, it is desirable that the inner lead portions 587 and 590 have a sufficiently thin shape.

  However, the conventional LED module X5 has the following problems.

  That is, in the LED module X5, when the inner lead portions 587 and 590 are thinned, the surface area in contact with the translucent resin 592 is reduced, and the fixing force of the inner lead portions 587 and 590 on the surface of the translucent resin 592 is weakened. . In such a case, the elastic restoring force of the outer lead portions 588 and 591 bent by the forming process becomes relatively large, and the inner lead portions 587 and 590 are easily peeled off from the surface of the translucent resin 592. As a result, the conventional LED module X5 has a drawback that the first and second leads 586 and 589 are more likely to be peeled from the case 582 as the light shielding portion is reduced.

Japanese Patent No. 2914097 JP 2007-184377 A JP 2007-184377 A

  The present invention has been conceived under the above circumstances, and a first object is to provide a light-emitting device capable of improving at least the front irradiation intensity.

  The present invention has been conceived under the circumstances described above, and it is a first object of the present invention to provide a reflective LED module in which a light-shielding portion can be made relatively small, and thus high brightness can be easily achieved. Let it be the second issue.

  The present invention has been conceived under the circumstances described above, and a third problem is to provide an LED module that can reliably prevent peeling of a lead and can further reduce a light-shielding portion. To do.

  In order to solve the first problem, a light emitting device provided by the present invention includes a light emitting element, a wire connected to the light emitting element, a first bottom surface on which the light emitting element is disposed, and a first side surface. A first base having a first recess having a second base to which the wire is bonded, and a second recess having a second side surface formed on the surface, and the first and second recesses. At least a part of each of the openings reaches the surface, the second bottom surface is formed on the surface side of the first bottom surface, and reaches the surface of the first side surface. The second bottom surface and the first side surface are connected to each other through a portion that is not, and the second side surface and the first side surface are connected to each other through the portion of the first side surface that reaches the surface. The opening area of the first recess is Larger than the opening area of the second recess.

  In preferable embodiment of this invention, the said base material further has a back surface conductor layer which has a back surface on the opposite side to the said surface, and covers only a part of said back surface, The said back surface electroconductivity among the said base materials. The back side covering part covered with the body layer and the back side exposed part not covered with the back side conductor layer among the base materials on the back side are made of the same material.

  In a preferred embodiment of the present invention, a surface conductor layer that is electrically connected to the light emitting element and covers only a part of the surface is further provided, and is covered with the surface conductor layer of the base material. The surface-side covering portion and the surface-side exposed portion that is not covered by the surface electrode layer among the base materials on the surface side are made of the same material.

  In a preferred embodiment of the present invention, the surface conductor layer includes a first surface electrode at least partially formed on the first side surface, and the first surface electrode is formed of the first recess. A frame-like portion formed outside and connected to the edge of the first recess is included.

  In preferable embodiment of this invention, the outer edge of the said frame-shaped part is a shape in alignment with the said edge of a said 1st recessed part.

  In a preferred embodiment of the present invention, the surface has a first direction that is closer to the first recess than the second recess and is a direction in which the first recess and the second recess are aligned. One end has a first side edge extending along a second direction intersecting the first direction, and the first surface electrode is connected to the first side edge and extends in the second direction. Including a first strip extending along.

  In a preferred embodiment of the present invention, the distance between the edge of the first recess and the first side edge is smaller than the size of the first belt-like portion in the first direction.

  In a preferred embodiment of the present invention, the surface conductor layer includes a second surface electrode formed on at least the second bottom surface and insulated from the first surface electrode, and is exposed to the surface side. The portion is located at one end of the second bottom surface on the first recess side and includes a bottom surface exposed region sandwiched between the first surface electrode and the second surface electrode.

  In a preferred embodiment of the present invention, the base material has a side surface facing a second direction intersecting a first direction which is a direction in which the first concave portion and the second concave portion are arranged, and The back surface conductor layer has an end surface facing the same side as the side facing the side surface, and the end surface has a portion separated from the side surface.

In a preferred embodiment of the present invention, the end surface has a portion located at one end of the back surface in the first direction and flush with the side surface.

  In a preferred embodiment of the present invention, the second surface electrode is formed with a gap extending from the second recess to the side opposite to the first recess.

  In a preferred embodiment of the present invention, there is further provided a lens having a convex surface that swells in a direction in which the first concave portion opens and overlaps the first concave portion when viewed in the opening direction.

  In a preferred embodiment of the present invention, the lens includes a plate-like portion that is positioned between the first concave portion and the convex surface and covers the first concave portion.

  In a preferred embodiment of the present invention, the plate-like portion has a flat first surface facing the first recess.

  In a preferred embodiment of the present invention, the plate-like portion has a first surface that faces the first recess and swells toward the first recess.

  In a preferred embodiment of the present invention, the plate-like portion has a lens side surface that faces a first direction in which the first concave portion and the second concave portion are arranged and is a rough surface.

  In a preferred embodiment of the present invention, the plate-like portion has a second surface that faces the side opposite to the first surface and is a rough surface.

  In a preferred embodiment of the present invention, the lens has a tapered surface that is connected to the convex surface and surrounds the convex surface in the direction of the opening of the first concave portion.

  In a preferred embodiment of the present invention, the tapered surface is a mirror surface.

  In a preferred embodiment of the present invention, the base material includes a raised portion formed on the surface side and raised in a direction in which the first concave portion opens.

  In preferable embodiment of this invention, it is located between the said lens and the said base material, and is further provided with the contact bonding layer which fixes the said lens with respect to the said base material.

  In a preferred embodiment of the present invention, the adhesive layer is made of a bonding sheet.

  In a preferred embodiment of the present invention, the adhesive layer is made of a liquid adhesive.

  In preferable embodiment of this invention, the resin part which covers the said light emitting element is further provided.

  In a preferred embodiment of the present invention, the resin portion has a light emitting surface that swells in a direction in which the first concave portion opens and emits light from the light emitting element.

  In a preferred embodiment of the present invention, the edge of the first recess is circular when viewed in the depth direction of the first recess, and the center of the first recess is viewed when viewed in the depth direction. The distance between the first recess and the edge is greater than the distance between the center and the bottom exposed region.

In a preferred embodiment of the present invention, the boundary between the second bottom surface and the first side surface of the first recess is a C plane or an R plane.

  In a preferred embodiment of the present invention, the first recess has a parabolic shape.

  In a preferred embodiment of the present invention, the second recess has a quadrangular pyramid shape.

  In a preferred embodiment of the present invention, the light emitting device has a rectangular parallelepiped shape.

  In preferable embodiment of this invention, the area occupation rate of the said 1st and 2nd recessed part in the said surface side part of the said base material is 70 to 90%.

  In order to solve the second problem, a reflective LED module provided by the present invention covers a rectangular LED element in a plan view, a case having a concave reflective surface, and a part of the reflective surface. A first lead having a die pad portion having a rectangular shape in plan view that opposes the LED element with respect to a reflecting surface, wherein the LED element has all corners of the die pad portion It is characterized by being joined in a posture toward the side.

  In a preferred embodiment of the present invention, the first lead has an inner lead part that covers a part of the reflecting surface following the die pad part, and the side of the die pad part is formed by the inner lead part. It is crossed against.

  In a preferred embodiment of the present invention, the die pad portion includes a second lead that covers a part of the reflection surface and has a bonding pad portion connected to the LED element via a wire. Close to the bonding pad portion.

  In a preferred embodiment of the present invention, the first lead has an inner lead part that covers a part of the reflecting surface following the die pad part, and the side of the die pad part is formed by the inner lead part. Parallel or orthogonal to

  In a preferred embodiment of the present invention, a second lead having a bonding pad portion that covers a part of the reflective surface and is connected to the LED element via a wire is provided, and the die pad portion is arranged on one side thereof. The side is close to the bonding pad portion.

  In a preferred embodiment of the present invention, the second lead has an inner lead portion that covers a part of the reflecting surface following the bonding pad portion, and an inner lead of the first and second leads. A transparent resin is filled between the portion and the reflecting surface.

  In a preferred embodiment of the present invention, the inner lead portion of at least one of the first and second leads is inclined with respect to the surface of the translucent resin and is immersed in the translucent resin. An overhanging portion is formed.

  In a preferred embodiment of the present invention, the inner lead portion in at least one of the first and second leads is formed with a concave portion that immerses in the translucent resin.

  In a preferred embodiment of the present invention, the inner lead portion in at least one of the first and second leads is formed with a hole into which the translucent resin enters.

In a preferred embodiment of the present invention, the bonding pad portion is formed with an overhanging portion that is inclined with respect to the surface of the translucent resin and is immersed in the translucent resin.

  In a preferred embodiment of the present invention, at least one of the first and second leads includes an outer lead portion extending along the remaining surface of the reflective surface of the case following the inner lead portion. The outer lead portion has a bifurcated shape.

  In a preferred embodiment of the present invention, the case has a bottom surface on a side opposite to the reflecting surface, and a tip portion of the outer lead portion in at least one of the first and second leads is Along the bottom of the case.

  In a preferred embodiment of the present invention, the case has a side surface facing in a direction different from the direction in which the reflecting surface faces, and the tip of the outer lead portion in at least one of the first and second leads. The part is along the side surface of the case.

  In order to solve the third problem, an LED module provided by the present invention includes an LED element, a case having a main surface, and a first lead provided along the main surface to which the LED element is bonded. And a part of the main surface and a part of the first lead are engaged with each other.

  In a preferred embodiment of the present invention, a second lead is provided that is insulated from the first lead and is provided along the main surface and connected to the LED element via a wire. Part of the surface and part of the second lead are engaged with each other.

  In a preferred embodiment of the present invention, a hole into which a part of the main surface enters is formed in the engaging portion of the first and second leads.

  In a preferred embodiment of the present invention, the case has a bottom surface on the side opposite to the main surface, and passes from the bottom surface to the main surface to be electrically connected to the first and second leads. First and second electrode terminals having first and second through holes are provided on the bottom surface. The first and second electrode terminals are electrically connected to and insulated from the first and second through holes, respectively.

  In a preferred embodiment of the present invention, the case has a plurality of side surfaces facing in a direction different from a direction in which the main surface faces, and two side surfaces located on opposite sides of the plurality of side surfaces are First and second electrode terminals that are electrically connected to the first and second leads are provided.

  In a preferred embodiment of the present invention, a concave portion having a concave reflective surface is formed on the main surface, and the LED element is bonded to the first lead in a posture facing the reflective surface of the concave portion. The second lead has a bonding pad portion that is bonded to one end of the wire and covers a part of the reflective surface.

  In preferable embodiment of this invention, the said recessed part is filled with the translucent resin which seals the said LED element and the said wire.

  Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

1 is a perspective view of a light emitting device according to a first embodiment of the present invention. It is a top view of the light-emitting device shown in FIG. It is sectional drawing along the III-III line of FIG. 1, FIG. FIG. 4 is a cross-sectional view taken along line IV-IV in FIGS. 1 and 2. It is a bottom view of the light-emitting device shown in FIG. It is a principal part perspective view which shows 1 process of the manufacturing method of the light-emitting device concerning 1st Embodiment of this invention. It is sectional drawing which follows the VII-VII line of FIG. FIG. 7 is a diagram showing a step that follows the step shown in FIG. 6. It is sectional drawing which follows the IX-IX line of FIG. FIG. 9 is a diagram showing a step that follows the step shown in FIG. 8. It is sectional drawing which follows the XI-XI line of FIG. It is a top view of the light-emitting device concerning a 2nd embodiment of the present invention. It is a front view of the light-emitting device shown in FIG. It is a right view of the light-emitting device shown in FIG. It is a bottom view of the light-emitting device shown in FIG. It is sectional drawing along the XVI-XVI line of FIG. It is sectional drawing along the XVII-XVII line of FIG. It is a top view which abbreviate | omits a lens from the light-emitting device shown in FIG. It is principal part sectional drawing which shows 1 process of the manufacturing method of the light-emitting device concerning 2nd Embodiment of this invention. FIG. 20 is a diagram showing a step that follows the step shown in FIG. 19. It is a top view of the light-emitting device concerning the 1st modification of a 2nd embodiment of the present invention. It is a front view of the light-emitting device shown in FIG. It is a right view of the light-emitting device shown in FIG. It is a bottom view of the light-emitting device shown in FIG. FIG. 22 is a cross-sectional view taken along line XXV-XXV in FIG. 21. FIG. 22 is a sectional view taken along line XXVI-XXVI in FIG. 21. It is a top view which abbreviate | omits a lens from the light-emitting device shown in FIG. FIG. 26 is a partial enlarged cross-sectional view of a region XXVIII in FIG. 25. FIG. 27 is a partial enlarged cross-sectional view of a region XXIX in FIG. 26. It is sectional drawing of the light-emitting device concerning the 2nd modification of 2nd Embodiment of this invention. It is sectional drawing of the light-emitting device concerning the 3rd modification of 2nd Embodiment of this invention. It is sectional drawing of the light-emitting device concerning the 4th modification of 2nd Embodiment of this invention. It is a whole perspective view which shows the LED module based on 3rd Embodiment of this invention. FIG. 34 is a top view of the LED module shown in FIG. 33. It is sectional drawing which follows the XXXV-XXXV line | wire of FIG. It is sectional drawing which follows the XXXVI-XXXVI line | wire of FIG. It is a top view which shows the LED module based on 4th Embodiment of this invention. It is sectional drawing which shows the LED module based on 5th Embodiment of this invention. It is a top view which shows the LED module based on 6th Embodiment of this invention. It is sectional drawing which follows the XL-XL line | wire of FIG. It is sectional drawing which shows the LED module based on 7th Embodiment of this invention. It is a top view which shows the LED module based on 8th Embodiment of this invention. It is a whole perspective view which shows the LED module based on 9th Embodiment of this invention. FIG. 44 is a top view of the LED module shown in FIG. 43. It is sectional drawing which follows the XLV-XLV line | wire of FIG. FIG. 45 is a sectional view taken along line XLVI-XLVI in FIG. 44. It is sectional drawing which follows the XLVII-XLVII line | wire of FIG. It is a top view of the case which comprises the LED module of FIG. It is explanatory drawing for demonstrating the formation method of the principal part. It is a whole perspective view which shows the LED module based on 10th Embodiment of this invention. It is a top view of the case which comprises the LED module of FIG. It is sectional drawing which follows the LII-LII line | wire of FIG. It is sectional drawing which follows the LIII-LIII line of FIG. It is sectional drawing which shows the principal part of the LED module based on 11th Embodiment of this invention. It is a perspective view which shows an example of the conventional light-emitting device. FIG. 56 is a main part sectional view of the light-emitting device shown in FIG. 55. It is a top view which shows the conventional LED module. It is a perspective view which shows the conventional LED module.

  Hereinafter, embodiments of the present invention will be specifically described with reference to the drawings.

  1st Embodiment of this invention is described using FIGS. FIG. 1 is a perspective view of the light emitting device according to the first embodiment. FIG. 2 is a plan view of the light-emitting device shown in FIG. FIG. 3 is a cross-sectional view taken along the line III-III in FIGS. 1 and 2. 4 is a cross-sectional view taken along the line IV-IV in FIGS. FIG. 5 is a bottom view of the light-emitting device shown in FIG.

  The light emitting device A1 shown in FIGS. 1 to 5 is provided, for example, in a mobile phone and used as a light source that emits infrared light. The light emitting device A1 includes a base material 1, a surface conductor layer 2, a side conductor layer 3, a back conductor layer 4, a light emitting element 6, and a wire 7. For example, the light emitting device A1 has a size in the direction x of about 2.3 mm, a size in the direction y of about 2.1 mm, and a size in the direction z of about 0.95 mm.

  As shown in FIGS. 1-5, the base material 1 is a rectangular parallelepiped shape, for example, consists of insulating plating adhesive resin. Examples of the plating adhesive resin include liquid crystal polymers. 2 to 4, the base material 1 has a front surface 1a, a back surface 1b, and side surfaces 1c, 1d, 1e, and 1f. 1 to 5, the boundaries between the surface 1a and the side surfaces 1c, 1d, 1e, and 1f are side edges 1ac, 1ad, 1ae, and 1af, respectively.

  As shown in FIGS. 1 to 4, a first recess 11 and a second recess 12 are formed on the surface 1 a of the substrate 1. The first recess 11 has a parabolic shape. The first recess 11 is preferably a parabolic shape, but may be a quadrangular pyramid shape, for example. As shown in FIGS. 2 to 4, the first recess 11 has a bottom surface 111 and a side surface 112. The bottom surface 111 has a circular shape with a diameter of about 0.653 mm, for example. 3 and 4, the side surface 112 includes a portion extending from the bottom surface 111 to the surface 1 a of the base 1, and a portion having a relatively low height that does not reach the surface 1 a from the bottom surface 111. have. As shown in FIG. 2, the boundary between the side surface 112 and the surface 1 a is the edge 114 of the first recess 11. The edge 114 has a circular shape in the xy plan view. In the present embodiment, the area occupancy ratio of the first concave portion 11 and the second concave portion 12 in the surface 1a side portion of the substrate 1 is set to 70 to 90%.

  As shown in FIGS. 1 to 3, the second recess 12 is arranged so as to be aligned with the first recess 11 along the direction x. The second recess 12 has a quadrangular frustum shape. The second recess 12 is not limited to a quadrangular pyramid shape, and may be, for example, a conical shape. The second recess 12 has a bottom surface 121 and side surfaces 122, 123, 124.

  The bottom surface 121 has, for example, a rectangular shape having a size in the direction x of about 0.32 mm and a size in the direction y of about 0.26 mm. The area of the bottom surface 121 is considerably smaller than that of the first bottom surface 111. Therefore, when the inclination of the side surface 112 and the side surfaces 122, 123, and 124 is substantially the same, the opening area of the first recess 11 is larger than the opening area of the second recess 12. As clearly shown in FIGS. 3 and 4, the bottom surface 121 is located on the surface 1 a side (upper side in the drawing) of the base material 1 with respect to the bottom surface 111. Further, the boundary between the bottom surface 121 and the side surface 112 shown in the region Bo in FIG. 3 is a C surface or an R surface. The boundary between the bottom surface 121 and the side surface 112 is not necessarily set to the C surface or the R surface.

  As shown in FIGS. 2 and 4, the side surfaces 122 and 123 face each other. The side surfaces 122 and 123 extend from the edge extending in the direction x of the bottom surface 121 to the surface 1a of the substrate 1. As shown in FIG. 4, the side surfaces 122 and 123 form an angle of, for example, 120 degrees with respect to the bottom surface 121. As shown in FIGS. 2 and 3, the side surface 124 extends from the edge extending in the direction y of the bottom surface 121 to the surface 1 a of the substrate 1. The side surface 124 is connected to the side surfaces 122 and 123. As shown in FIG. 3, the side surface 124 forms an angle of, for example, 100 degrees with respect to the bottom surface 121.

  As shown in FIGS. 2 to 4, the bottom surface 121 is connected to the first side surface 112 through a relatively low portion of the side surface 112 of the first recess 11 that does not reach the surface 1 a. Further, the side surfaces 122 and 123 are connected to a portion of the side surface 112 reaching the surface 1a. As a result, the second recess 12 is connected to the first recess 11.

  As shown in FIGS. 1 to 3 and FIG. 5, raised portions 13 a and 13 b are formed on the base material 1. The raised portion 13a is formed on the surface 1a side of the substrate 1 and has a shape raised in the direction z (the direction in which the first concave portion 11 opens). As shown in FIGS. 1 and 2, the raised portion 13 a has a semi-atypical circular shape in plan view. The protruding portion 13b is formed on the back surface 1b side of the base material 1 and has a shape protruding in the direction opposite to the direction z. The raised portion 13b has a shape extending along the direction y. The raised portions 13a and 13b are used as a base for appropriately attaching a sheet for dust-proofing the light emitting element 6, the wire 7, and the like, for example, in the manufacturing process of the light emitting device A1 described later.

  As shown in FIGS. 1 to 4, the surface conductor layer 2 is formed on the surface 1 a side of the substrate 1. The surface conductor layer 2 has a structure in which a Cu layer, a Ni layer, and an Au layer are sequentially laminated on the substrate 1. The surface conductor layer 2 includes a first surface electrode 21 and a second surface electrode 22. The first surface electrode 21 is disposed on the right side of FIG. 2, and the second surface electrode 22 is disposed on the left side of FIG. The first surface electrode 21 and the second surface electrode 22 are insulated from each other.

  The first surface electrode 21 includes a frame-shaped portion 211, a strip-shaped portion 212, an inner surface electrode 213, and a bottom electrode 214.

  As shown in FIGS. 3 and 4, the bottom electrode 214 is formed on the bottom surface 111 of the first recess 11. The inner surface electrode 213 is formed on the side surface 112 of the first recess 11. The inner surface electrode 213 is also formed on the bottom surface 121 of the second concave portion 12 and the portions near the first concave portion 11 among the side surfaces 122 and 123. As shown in FIG. 2, the frame-like portion 211 is formed so as to surround the edge 114 of the first recess 11. The frame portion 211 is formed outside the first recess 11 and is connected to the inner surface electrode 213. The frame-like portion 211 has a substantially ring shape surrounding the edge 114 of the first recess 11. An outer edge 211 a of the frame-like portion 211 has a shape along the edge 114 of the first recess 11.

  As shown in FIG. 2, the belt-like portion 212 is formed at one end on the side edge 1ac side in the direction x of the base material 1. The belt-like portion 212 has a shape extending along the direction y from the side edge 1af to the side edge 1ad. The strip portion 212 is connected to the inner surface electrode 213 and the frame portion 211. The width L1 (size in the direction x) of the belt-like portion 212 is larger than the distance L2 between the side edge 1ac and the edge 114 of the first recess 11. The width L1 is 0.29 mm, for example, and the distance L2 is 0.17 mm, for example.

  As shown in FIGS. 1 to 4, the second surface electrode 22 includes a band-shaped portion 222, an inner surface electrode 223, and a bottom electrode 224.

  As shown in FIGS. 2 and 3, the bottom electrode 224 is formed on the bottom surface 121 of the second recess 12. The bottom electrode 224 is formed up to the vicinity of the first recess 11 in the bottom surface 121. However, the bottom electrode 224 is separated from the inner surface electrode 213. The inner surface electrode 223 is formed on the side surfaces 122, 123, and 124 of the second recess 12. The inner surface electrode 223 covers the entire side surface 124. Further, the inner surface electrode 223 is formed up to the vicinity of the first recess 11 in the side surfaces 122 and 123. However, the inner surface electrode 223 is separated from the inner surface electrode 213. The inner surface electrode 223 is connected to the bottom surface electrode 224.

  As shown in FIG. 2, the belt-like portion 222 is formed at one end on the side edge 1ae side in the direction x of the base material 1. The belt-like portion 222 has a shape extending along the direction y from the side edge 1af to the side edge 1ad. The strip portion 222 is connected to the inner surface electrode 223.

  As shown in FIG. 2, the portion of the base material 1 covered with the surface conductor layer 2 is a surface side covering portion 16. Moreover, the part which is not covered with the surface conductor layer 2 among the base materials 1 on the surface 1a side is the surface side exposed part 18. By forming the surface side exposed portion 18, the first surface electrode 21 and the second surface electrode 22 are insulated. As will be described later, in order to form the surface conductor layer 2 in a desired region of the base material 1, a method of forming the base material 1 from a plating adhesive resin and a non-plating adhesive resin is not used. A patterning method is used. Therefore, the surface side exposed part 18 and the surface side coating | coated part 16 consist of plating adhesive resin of the same material. The surface-side exposed portion 18 includes a surface exposed region 181, an inner surface exposed region 182, and a bottom surface exposed region 183.

  The surface exposed region 181 is a region that is not covered with the surface conductor layer 2 on the surface 1 a of the substrate 1. The surface exposed regions 181 are located on both sides (upper side and lower side in FIG. 2) in the direction y of the first concave portion 11 and the second concave portion 12. The surface exposed region 181 is surrounded by the frame-like portion 211, the belt-like portion 212, the belt-like portion 222, and the side edge 1af or the side edge 1ad.

  The inner surface exposed region 182 is a region that is not covered with the surface conductor layer 2 on the side surfaces 122 and 123 of the second recess 12. The inner surface exposed region 182 is formed by the inner surface electrode 223 and the inner surface electrode 213 being separated from each other. The inner surface exposed region 182 has a shape along a portion where the first concave portion 11 and the second concave portion 12 are connected, and extends from the surface 1 a to the bottom surface 121 of the substrate 1.

  The bottom exposed region 183 is a region that is not covered with the surface conductor layer 2 on the bottom surface 121 of the second recess 12. The bottom exposed region 183 is located at one end of the bottom 121 on the first recess 11 side. The bottom exposed region 183 is formed by the bottom electrode 224 and the inner surface electrode 213 being separated from each other. Therefore, it can be said that the bottom exposed region 183 is a region sandwiched between the bottom electrode 224 and the inner surface electrode 213. The bottom exposed region 183 has a strip shape extending along the direction y. The bottom surface exposed region 183 is connected to the inner surface exposed region 182. In addition, as shown in FIG. 2, the distance L3 between the bottom exposed region 183 and the center P of the circle formed by the edge 114 of the first recess 11 in the xy plan view is equal to the edge 114 of the first recess 11. It is smaller than the distance L4 with the center P.

  As shown in FIGS. 1 and 3, the side conductor layer 3 includes a first side electrode 31 and a second side electrode 32. The first side electrode 31 is formed on the side surface 1 c of the substrate 1. As clearly shown in FIG. 1, the first side surface electrode 31 covers the entire side surface 1c. The first side electrode 31 is connected to the belt-like portion 212. Thereby, the first side electrode 31 is electrically connected to the first surface electrode 21.

  The second side electrode 32 is formed on the side surface 1 e of the substrate 1. The second side electrode 32 covers the entire side surface 1e. The second side electrode 32 is connected to the belt-like portion 222. As a result, the second side electrode 32 is electrically connected to the second surface electrode 22.

  As shown in FIGS. 1, 3, and 5, the back conductor layer 4 is formed on the back surface 1 b of the substrate 1. The back conductor layer 4 includes a first back electrode 41 and a second back electrode 42. As shown in FIG. 5, each of the first back electrode 41 and the second back electrode 42 has a shape extending in a band shape over the entire surface in the direction y of the back surface 1 b of the substrate 1. The widths of the first back electrode 41 and the second back electrode 42 are preferably thick, for example, about 0.5 mm. The first back electrode 41 is connected to the first side electrode 31. Thereby, the 1st back electrode 41, the 1st side surface electrode 31, and the 1st surface electrode 21 are electrically connected. On the other hand, the second back electrode 42 is connected to the second side electrode 32. Thereby, the 2nd back surface electrode 42, the 2nd side surface electrode 32, and the 2nd surface electrode 22 are electrically connected.

  Each of the side conductor layer 3 and the back conductor layer 4 has a structure in which a Cu layer, a Ni layer, and an Au layer are laminated, similar to the front conductor layer 2.

  As shown in FIG. 5, the portion of the base material 1 covered with the back conductor layer 4 is a back surface side covering portion 17. Moreover, the part which is not covered with the back surface conductor layer 4 among the base materials 1 by the side of the back surface 1b is the back surface side exposed part 19. FIG. As will be described later, in order to form the back conductor layer 4 in a desired region of the base material 1, a method of forming the base material 1 from a plating adhesive resin and a non-plating adhesive resin is not used. A patterning method is used. Therefore, the back surface side exposed portion 19 and the back surface side covering portion 17 are made of a plating adhesive resin of the same material.

  As shown in FIGS. 1 to 4, the light emitting element 6 is disposed on the bottom surface 111 of the first recess 11. The light emitting element 6 is an LED element that can emit infrared light, for example. Depending on the application, for example, a light emitting element 6 that can emit visible light or the like may be used. In the present embodiment, the cathode terminal of the light emitting element 6 is connected to the bottom electrode 214. Therefore, in this embodiment, the 1st surface electrode 21, the 1st side surface electrode 31, and the 1st back surface electrode 41 can be said to be a cathode electrode.

  The wire 7 is connected to the light emitting element 6. In the present embodiment, the wire 7 is connected to the anode terminal of the light emitting element 6. The wire 7 is bonded to the bottom electrode 224. Thereby, the bottom electrode 224 and the anode terminal of the light emitting element 6 are electrically connected. Therefore, in the present embodiment, the second front electrode 22, the second side electrode 32, and the second back electrode 42 can be said to be anode electrodes.

  The first recess 11 and the second recess 12 are filled with a resin (not shown). Thereby, the light emitting element 6 and the wire 7 are protected and fixed.

  Next, a method for manufacturing the light-emitting device A1 according to the present embodiment will be described with reference to FIGS. In order to manufacture the light emitting device A1, a laser patterning method is used. This will be specifically described below.

  FIG. 6 is a perspective view of relevant parts showing one step of the method for manufacturing the light emitting device A1. 7 is a cross-sectional view taken along line VII-VII in FIG. First, as shown in FIGS. 6 and 7, a base material 1 'extending in the direction y is prepared. A plurality of first recesses 11 and second recesses 12 connected to each other are formed in the base 1 'along the direction y. Next, a metalizing process is performed. In this step, the conductor film 8 is formed on the entire surface of the substrate 1 ′ such as the front surface 1a ′, the back surface 1b ′, the side surfaces 1c ′ and 1e ′, the first recess 11 and the second recess 12 of the substrate 1 ′. Form. The conductor film 8 is made of Cu, for example.

  FIG. 8 is a perspective view of relevant parts showing a step that follows the step shown in FIG. 9 is a cross-sectional view taken along line IX-IX in FIG. As shown in FIGS. 8 and 9, a patterning process of irradiating the front surface 1 a ′ and the back surface 1 b ′ of the substrate 1 ′ with the laser R is performed. By irradiating the laser R, a part of the conductor film 8 is removed so as to follow the contours of the front surface conductor layer 2 and the back surface conductor layer 4 shown in FIGS. By removing a part of the conductor film 8, the conductor film 8 becomes a circuit portion that becomes the surface conductor layer 2, the back conductor layer 4, or the side conductor layer 3 shown in FIGS. 81 and a non-circuit portion 82 other than the circuit portion 81. Next, electrolytic Cu plating is performed to deposit Cu only on the circuit portion 81.

  FIG. 10 is a perspective view of relevant parts showing a step that follows the step shown in FIG. 11 is a cross-sectional view taken along line XI-XI in FIG. As shown in FIGS. 10 and 11, a soft etching process is performed to remove the non-circuit portion 82. Thereby, the front surface side exposed part 18 and the back surface side exposed part 19 are formed. Subsequently, Ni plating and Au plating are performed on the circuit portion 81, whereby the Ni layer and the Au layer are laminated on the circuit portion 81 made of Cu. Thereby, the front surface conductor layer 2, the side surface conductor layer 3, and the back surface conductor layer 4 shown in FIGS. 1 to 5 are formed. Next, the light emitting element 6 and the wire 7 shown in FIGS. 1 to 4 are formed (not shown). Next, the substrate 1 'is cut along the line Dc in FIG. Thereby, manufacture of light-emitting device A1 is completed.

  Next, the operation of the light emitting device A1 according to this embodiment will be described.

  In the light emitting device A <b> 1, the side surface 112 reaches the surface 1 a of the substrate 1 except for the portion connected to the second bottom surface 12. Therefore, according to the light emitting device A1, it can be said that the height of the side surface 112 other than the portion connected to the second bottom surface 12 can be increased. Thereby, the front irradiation intensity | strength of light-emitting device A1 can be improved. In addition, the directivity angle of the light emitting device A1 can be further narrowed.

  As described in the description of the method for manufacturing the light emitting device A1, the laser patterning method is used to form the conductor film 8 in a desired region of the base material 1 '. Therefore, in order to form the conductor film 8 in a desired region of the back surface 1b 'of the base material 1', the back surface 1b 'of the base material 1' does not need to be made of non-plating adhesive resin. Therefore, the space for forming the non-plating adhesive resin on the back surface 1b 'of the substrate 1' can be reduced, and the size of the substrate 1 in the direction z can be further reduced. Thereby, thickness reduction of light-emitting device A1 can be achieved.

  As shown in FIG. 2, the first surface electrode 21 includes a frame-like portion 211. The frame-like portion 211 is formed as a result of irradiating the laser R to the outside of the first recess 11 when irradiating the laser R as shown in FIG. Irradiating the laser R to the outside of the first recess 11 is suitable for avoiding a problem that the irradiation position of the laser R is shifted and the side surface 112 of the first recess 11 is erroneously irradiated with the laser.

  As shown in FIG. 2, the bottom exposed region 183 is located at one end of the bottom 121 on the first recess 11 side. This is suitable for increasing the size of the bottom electrode 224, which is a wire bonding area, in the direction x.

  Further, the distance L3 between the bottom exposed region 183 and the center P of the circle formed by the edge 114 of the first recess 11 is smaller than the distance between the edge 114 of the first recess 11 and the center P. Therefore, the length of the wire 7 that must be formed can be shortened while increasing the size of the side surface 112.

  The width L1 of the belt-like portion 212 is larger than the distance L2 between the side edge 1ac and the edge 114 of the first recess 11. This is suitable for bringing the first recess 11 closer to the side edge 1ac. Thereby, the magnitude | size of light-emitting device A1 in xy planar view can be made small.

  As shown in the region Bo in FIG. 3, the boundary between the bottom surface 121 of the second recess 12 and the side surface 112 of the first recess 11 is a C plane or an R plane. Thereby, the malfunction that the wire 7 contacts the inner surface electrode 213 can be avoided.

  Next, a second embodiment of the present invention will be described with reference to FIGS. In this embodiment and its modifications, the same or similar elements as those in the first embodiment are denoted by the same reference numerals as those in the first embodiment, and the description thereof is omitted as appropriate. FIG. 12 is a plan view of a light emitting device according to the second embodiment of the present invention. 13 is a front view of the light emitting device shown in FIG. FIG. 14 is a right side view of the light emitting device shown in FIG. 15 is a bottom view of the light emitting device shown in FIG. 16 is a cross-sectional view taken along line XVI-XVI in FIG. 17 is a cross-sectional view taken along line XVII-XVII in FIG.

  The light emitting device A2 shown in these drawings includes a base material 1, a surface conductor layer 2, a side conductor layer 3, a back conductor layer 4, a light emitting element 6, a wire 7, a lens 5, and an adhesive layer 85. 18 is a plan view in which a lens is omitted from the light emitting device shown in FIG. Since each structure of the base material 1, the surface conductor layer 2, the side conductor layer 3, the light emitting element 6, and the wire 7 in the light emitting device A2 is the same as that of the light emitting device A1, description thereof is omitted. However, the shape of the raised portion 13a formed on the base 1 in the light emitting device A2 is different from the shape of the raised portion 13a in the light emitting device A1.

  As shown in FIG. 15, in this embodiment, the 1st back surface electrode 41 and the 2nd back surface electrode 42 in the back surface conductor layer 4 are the shapes which protrude toward the center of the back surface 1b of the base material 1, respectively. Specifically, the first back electrode 41 has end faces 41a and 41b. The end surface 41a faces the same side as the side to which the side surface 1d of the base material 1 faces. The end surface 41a has a portion spaced from the side surface 1d and a portion that is flush with the side surface 1d. A portion of the end surface 41a that is flush with the side surface 1d is located at one end in the direction x of the back surface 1b.

  Similarly, the end surface 41b faces the same side as the side to which the side surface 1f of the base material 1 faces. The end surface 41b has a portion that is separated from the side surface 1f and a portion that is flush with the side surface 1f. Similarly, the second back electrode 42 has end faces 42a and 42b. The end surface 42 a faces the same side as the side 1 d of the substrate 1 faces. The end face 42a has a part spaced apart from the side face 1d and a part that is flush with the side face 1d. The end face 42b faces the same side as the side to which the side face 1f of the substrate 1 faces. The end face 42b has a part spaced from the side face 1f and a part that is flush with the side face 1f.

  As clearly shown in FIG. 16, the lens 5 is disposed on the surface 1 a side of the substrate 1. The lens 5 is for improving the front irradiation intensity of the light emitted from the light emitting element 6. The lens 5 is made of, for example, a thermosetting epoxy resin. The lens 5 is made of, for example, a black resin that blocks transmission of visible light. In the present embodiment, the light emitting element 6 emits infrared rays. The lens 5 can transmit light from the light emitting element 6 (infrared rays in the present embodiment). The lens 5 includes a convex portion 51 and a plate-like portion 53.

  The convex portion 51 has a convex surface 51a. The convex surface 51a swells in the direction z. As shown in FIG. 12, the convex surface 51a overlaps the first concave portion 11 in the direction z. In the present embodiment, the convex surface 51a has a circular shape in the direction z. Since the convex surface 51a is a surface from which light from the light emitting element 6 is emitted, it is a mirror surface. Since the convex surface 51a is a mirror surface, the irregular reflection or scattering of light on the convex surface 51a is suppressed. The curvature of the convex portion 51 is determined to a desired value according to the shape of the first concave portion 11.

  As shown in FIGS. 12 to 14, 16, and 17, the plate-like portion 53 is a plate-like portion that covers the first recess 11. The plate-like portion 53 is located between the first concave portion 11 and the convex surface 51a. The plate-like portion 53 has a first surface 53a, a second surface 53b, and lens side surfaces 53c, 53d, 53e, 53f.

  As shown in FIG. 16, the first surface 53 a faces the first recess 11. In the present embodiment, the first surface 53a is planar. Since the first surface 53a is a surface on which light from the light emitting element 6 is incident, it is a mirror surface. Since the first surface 53a is a mirror surface, it is possible to prevent light from being irregularly reflected or scattered by the convex surface 51a.

  The second surface 53b faces away from the first surface 53a. The lens side surface 53 c faces the same direction as the side surface 1 c of the substrate 1. The lens side surface 53 e faces the same direction as the side surface 1 e of the substrate 1. As shown in FIG. 14, the lens side surface 53 d faces the same direction as the side surface 1 d of the substrate 1. The lens side surface 53d is flush with the side surface 1d. The lens side surface 53f faces the same direction as the side surface 1f of the substrate 1. The lens side surface 53f is flush with the side surface 1f. Each of the second surface 53b and the lens side surfaces 53c and 53e is a rough surface (surface subjected to a satin finish or the like) on which a fine uneven shape is formed. The lens side surfaces 53c and 53e do not need to be rough surfaces, and may be mirror surfaces, for example. The reason why the second surface 53b and the lens side surfaces 53c and 53e are rough surfaces is that when the lens 5 ′ to be the lens 5 is molded (see FIGS. 19 and 20 described later), the lens 5 ′ is removed from the mold. This is to facilitate removal. The height difference (ten-point average roughness Rz) of the fine irregularities on each surface is, for example, 1 to 2 μm. The side surfaces 53d and 53f are cut surfaces formed when the lens 5 'is cut together with the base material 1' serving as the base material 1.

  The adhesive layer 85 is located between the lens 5 and the substrate 1. The adhesive layer 85 is for fixing the lens 5 to the substrate 1. More specifically, the adhesive layer 85 bonds the lens 5 to the surface conductor layer 2 or the raised portion 13a. The adhesive layer 85 is made of, for example, a bonding sheet or a liquid adhesive. An example of the bonding sheet is an epoxy type. The bonding sheet may be a thermosetting type or a thermoplastic type. Examples of the liquid adhesive include a UV-based adhesive and an acrylic-based adhesive.

  As shown in FIGS. 16 and 17, in the present embodiment, the first recess 11 and the second recess 12 are not filled with resin and are hollow. The light emitting element 6 and the wire 7 are not covered with resin. The first recess 11 and the second recess 12 are substantially sealed by the lens 5. Therefore, in the present embodiment, the light emitting element 6 is not easily deteriorated (for example, oxidized or sulfided) even if it is not covered with resin. In order to further suppress the deterioration of the light emitting element 6, an inert gas such as argon or nitrogen may be sealed in the first recess 11 and the second recess 12.

  In order to manufacture the light emitting device A2, as shown in FIG. 19, a product similar to the product shown in FIG. 10 is manufactured through the same steps as in manufacturing the light emitting device A1. Next, as shown in FIG. 20, the light emitting element 6 and the wire 7 are formed. Next, the lens 5 ′ is fixed to the base material 1 ′. The lens 5 ′ will later become a plurality of lenses 5. The lens 5 ′ includes a plurality of convex portions 51 ′ and a plate-like portion 53 ′. The plate-like portion 53 ′ has a plate shape extending along the direction y. A plurality of convex portions 51 ′ are formed on the plate-like portion 53 ′ along the direction y. Next, the substrate 1 ′ and the lens 5 ′ are collectively cut along the line Dc <b> 2 shown in FIG. 20. Thereby, manufacture of light-emitting device A2 is completed. By cutting the substrate 1 ′ and the lens 5 ′, the side surfaces 1 d and 1 f of the substrate 1 and the lens side surfaces 53 d and 53 f of the plate-like portion 53 are formed.

  Next, the operation of the light emitting device A2 according to the present embodiment will be described.

  The light emitting device A2 includes a lens 5 having a convex surface 51a. Therefore, the amount of light from the light emitting element 6 traveling in the direction z can be increased by refracting the light from the light emitting element 6 at the convex surface 51a. Such a light emitting device A2 is suitable for improving the front irradiation intensity.

  In the light emitting device A2, the first surface 53a of the plate-like portion 53 is planar. If the first surface 53 a is a convex surface, the first surface 53 a may come into contact with the wire 7. When the first surface 53a comes into contact with the wire 7, there may occur a problem that the posture of the light emitting element 6 is shifted. However, in the present embodiment, since the first surface 53a is planar, the first surface 53a is unlikely to contact the wire 7. For this reason, in this embodiment, it is difficult to cause a problem that the posture of the light emitting element 6 is shifted.

  If the inner surface electrode 213 is covered with the adhesive layer 85, the front irradiation intensity of the light emitting device A2 may be reduced. In the case where the adhesive layer 85 is made of a bonding sheet, the bonding sheet has a certain shape, so that the adhesive layer 85 covers a part of the inner surface electrode 213 by dripping the liquid adhesive on the inner surface electrode 213. Is unlikely to occur. Therefore, when the adhesive layer 85 is made of a bonding sheet, the lens 5 can be disposed on the substrate 1 while suppressing a decrease in the front irradiation intensity of the light emitting device A2.

  After completion, the light emitting device A2 is subjected to a reflow process for mounting on a wiring board or the like. The reflow process is performed in a high temperature environment of about 260 degrees. When the bonding sheet is of a thermosetting type, the adhesive force of the adhesive layer 85 is not easily weakened in the reflow process performed in a high temperature environment. Therefore, when the bonding sheet is of a thermosetting type, it is possible to suppress a problem that the lens 5 is separated from the base material 1 in the reflow process.

  In the case where the adhesive layer 85 is made of a liquid adhesive, the surface conductor layer 2 or the raised portion 13a and the lens 5 can be adhered to each other more closely due to the anchor effect.

  In the light emitting device A2, the side surface 1d is a cut surface when the substrate 1 'is cut (see FIG. 20). Further, the end surface 41a has a portion spaced from the side surface 1d. When the substrate 1 is cut, the dicing blade used for cutting the substrate 1 does not come into contact with the portion of the end surface 41a that is separated from the side surface 1d. For this reason, a burr | flash does not generate | occur | produce in the site | part spaced apart from the side surface 1d among the end surfaces 41a. Therefore, the light emitting device A2 is suitable for suppressing the generation of burrs on the end face 41a. For the same reason, the light emitting device A2 is suitable for suppressing the generation of burrs on the end faces 41b, 42a, and 42b.

  In the light emitting device A2, the end surface 41a is located at one end in the direction x of the back surface 1b and has a portion that is flush with the side surface 1d. In order to form the first back surface electrode 41 (back surface conductor layer 4) having such an end surface 41a, it is sufficient to irradiate the laser only to the back surface 1b 'of the base material 1', and the side surface 1c 'of the base material 1'. There is no need to irradiate a laser. Therefore, the light emitting device A2 is suitable for simplifying the manufacturing process.

  You may apply the structure provided with the lens 5 shown by this embodiment to the above-mentioned light-emitting device A1.

  Next, a first modification of the present embodiment will be described with reference to FIGS. FIG. 21 is a plan view of a light emitting device according to a first modification of the second embodiment of the present invention. FIG. 22 is a front view of the light-emitting device shown in FIG. FIG. 23 is a right side view of the light-emitting device shown in FIG. 24 is a bottom view of the light-emitting device shown in FIG. 25 is a cross-sectional view taken along line XXV-XXV in FIG. 26 is a cross-sectional view taken along line XXVI-XXVI in FIG. FIG. 27 is a plan view in which a lens is omitted from the light emitting device shown in FIG. FIG. 28 is a partially enlarged sectional view of region XXVIII in FIG. FIG. 29 is a partially enlarged sectional view of a region XXIX in FIG.

  The light-emitting device A21 shown in these drawings is the above-described light-emitting device in that the lens 5 has a taper portion 52 and the gap portion 29 is formed in the belt-like portion 222 (that is, the surface conductor layer 2). Different from A2.

  As shown in FIGS. 22 to 25, the tapered portion 52 is a portion connected to the convex portion 51 and the plate-like portion 53 in the lens 5. The tapered portion 52 is formed so that the lens 5 ′ can be easily removed from the mold when the lens 5 ′ to be the lens 5 is molded. The tapered portion 52 has a tapered surface 52a. The tapered surface 52a is connected to the convex surface 51a. As shown in FIG. 21, the tapered surface 52a has a shape surrounding the convex surface 51a when viewed in the direction z. That is, in this embodiment, the taper surface 52a has a shape that increases in diameter as it goes downward in FIG. The tapered surface 52a is, for example, a mirror surface. When the tapered surface 52a is a mirror surface, it is easy to design a mold for molding the lens 5 '. The tapered surface 52a is, for example, a rough surface having a fine concavo-convex shape formed in the same manner as the second surface 53b and the lens side surfaces 53c and 53e. When the tapered surface 52a is a rough surface, the lens 5 'is easily removed from the mold when the lens 5' (not shown in the present modification, for example, see FIGS. 19 and 20) is molded.

  The gap 29 shown in FIGS. 25 to 29 extends from the second recess 12 toward the side opposite to the first recess 11. The gap 29 is for communicating the first recess 11 and the second recess 12 with the space outside the light emitting device A21. Gas can flow between the first recess 11 and the second recess 12 and the outside of the light emitting device A21 through the gap 29.

  According to such a configuration, even if the gas inside the first recess 11 and the second recess 12 is thermally expanded in a process performed in a high-temperature environment such as a reflow process, the thermally expanded gas is And flows outside the light emitting device A21. Therefore, according to the light emitting device A21, the pressure inside the first concave portion 11 and the second concave portion 12 is hardly increased. Therefore, the light emitting device A2 is suitable for suppressing a problem that the lens 5 is separated from the base material 1 due to an increase in pressure inside the first concave portion 11 and the second concave portion 12.

  Although this modification is shown as a modification of the light emitting device A2, it may be applied to the light emitting device A1.

  Next, a second modification of the present embodiment will be described using FIG.

  The light-emitting device A22 shown in the figure is different from the above-described light-emitting device A2 in that the first light-emitting device A22 includes a resin portion 87 filled in the first concave portion 11 and the second concave portion 12. The resin part 87 is made of, for example, a transparent epoxy or silicone material. The resin part 87 covers the light emitting element 6 and the wire 7. The resin portion 87 is for protecting the light emitting element 6 and the wire 7. In the present embodiment, the resin portion 87 fills substantially the entire first recess 11 and the second recess 12, and is in contact with the first surface 53 a of the lens 5.

  Next, a third modification of the present embodiment will be described using FIG.

  In the light emitting device A23 shown in the figure, the resin portion 87 does not fill the entire first recess 11 and the second recess 12, and the space between the resin portion 87 and the first surface 53a is hollow. Is different from the light emitting device A22 described above. The resin portion 87 is filled only in the first recess 11. The resin portion 87 has a light emitting surface 87a. In the present embodiment, the light emitting surface 87a has a shape that swells in the direction z.

  According to the light emitting device A23, the amount of light from the light emitting element 6 traveling in the direction z is increased by refracting the light emitted from the light emitting element 6 at the light emitting surface 87a that swells in the direction z. be able to. Such a light emitting device A23 is suitable for improving the front irradiation intensity.

  The configuration according to this modification may be applied to the light emitting device A21 described above. In particular, the configuration according to this modification is preferably applied to a configuration in which the gap portion 29 is formed in the belt-like portion 222 (that is, the surface conductor layer 2). In this case, the gas outside the light emitting device enters the first recess 11 and the second recess 12. However, since the light emitting element 6 is covered with the resin portion 87, the gas outside the light emitting device does not directly contact the light emitting element 6. Such a light-emitting device is suitable for improving the front irradiation intensity while suppressing deterioration of the light-emitting element.

  Next, a fourth modification of the present embodiment will be described using FIG. The light emitting device A24 shown in the figure is different from the above light emitting device A2 in that the first surface 53a is a convex surface that swells toward the opposite side to the direction z (the first concave portion 11 side). According to the light emitting device A24, the amount of light from the light emitting element 6 traveling in the direction z can be increased by refracting the light emitted from the light emitting element 6 by the first surface 53a which is a convex surface. . Such a light emitting device A24 is suitable for improving the front irradiation intensity.

  The configuration according to this modification can be applied to each of the light emitting devices A21 to A23 described above.

  33 to 36 show an LED module according to a third embodiment of the present invention. The LED module A71 of this embodiment is a reflective LED module that reflects the light of the LED element 701 and guides it outward. The LED module A71 includes an LED element 701, a case 702, a first lead 703, a second lead 704, and a translucent resin 705.

  The LED element 701 has an active layer that emits infrared light between, for example, an n-type and a p-type semiconductor layer. The LED element 701 is a semiconductor element having a rectangular shape in plan view when viewed from above. The LED element 701 emits a lot of light from the side surface and the top surface. One side of the LED element 701 is about 0.3 mm, for example. On the upper surface of the LED element 701, a partial electrode is formed that electrically connects one end of the wire 6. On the bottom surface of the LED element 701, a full-surface electrode that is conductively connected to the first lead 703 is formed (not shown).

  The case 702 is obtained by curing a non-translucent epoxy resin or liquid crystal polymer, for example. The case 702 has a reflective surface 720. The reflective surface 720 is formed with a gloss film for efficiently reflecting light by, for example, gold plating. The reflection surface 720 has a circular shape in a plan view and a concave shape at the center of the upper surface 721. That is, the case 702 has a recess on the upper surface 721. The concave portion of the case 702 is filled with a translucent resin 705. The case 702 has a bottom surface 722 on the side opposite to the concave portion. The case 702 has a first side surface 723 a and a second side surface 723 b that are continuous with the upper surface 721 and the bottom surface 722.

The first lead 703 is made of a metal such as an Fe—Ni alloy or a Cu alloy. The first lead 703 extends from the end of the bottom surface 722 along the first side surface 723a.
1 and further extends to the upper part of the center of the reflecting surface 720. The first lead 703 includes a die pad portion 730, an inner lead portion 731, an overhang portion 732, and an outer lead portion 733.

  The die pad portion 730 is generally located above the central portion of the reflective surface 720. As well shown in FIG. 34, the die pad portion 730 has a rectangular shape in plan view, and the maximum dimension S along the diagonal is, for example, about 0.71 mm. All the sides 730A of the die pad portion 730 are oblique to the direction in which the inner lead portion 731 extends in the longitudinal direction. One corner of the die pad portion 730 is close to a bonding pad portion 740 of a second lead 704 described later. The LED element 701 is bonded to the die pad portion 730 so as to face the reflective surface 720. The LED element 701 has a posture in which all the corner portions 710 are directed toward the side 730A of the die pad portion 730. The bottom surface of the LED element 701 is bonded to the die pad portion 730 via a conductive adhesive. Therefore, a relatively wide empty space 730 </ b> B is formed on the corner side of the die pad portion 730.

  The inner lead portion 731 is a portion that extends from the die pad portion 730 toward the upper surface 721 above the reflective surface 720. The inner lead portion 731 has a width smaller than the maximum dimension S of the die pad portion 730. As shown well in FIG. 36, the inner lead portion 731 is formed with an overhang portion 732. The overhanging portion 732 has a shape that is inclined from the surface of the translucent resin 705 toward the reflecting surface 720 and is immersed in the translucent resin 705 on both sides.

The outer lead portion 733 extends from the inner lead portion 731 to the upper end of the first side surface 723a. The outer lead portion 733 extends to the lower end along the first side surface 723a. Further, the outer lead portion 733 has its tip end turned around to the end portion of the bottom surface 722. The distal end portion of the outer lead portion 733 is bonded to a substrate (not shown) as an electrode terminal portion 734. The outer lead portion 733 is divided into two forks at a portion along the upper surface 721. Thus, two electrode terminal portions 734 are paired. The width dimension W of the outer lead portion 733 divided into two forks is, for example, about 0.35 mm. These full width dimensions (2 × W) are smaller than the maximum dimension S of the die pad portion 730.

The second lead 704 is made of a metal such as an Fe—Ni alloy or a Cu alloy, for example, like the first lead 703. The second lead 704 goes from the end of the bottom surface 722 to the top surface 721 along the second side surface 723b. The second lead 704 further has a reflective surface 7.
It extends to a position close to the die pad portion 730 above 20. The second lead 704 has a bonding pad portion 740, an overhang portion 741, an inner lead portion 742, and an outer lead portion 743.

  The bonding pad part 740 is a part connected to a partial electrode formed on the upper surface of the LED element 701 via a bonding wire 706. The bonding pad part 740 is close to a corner of the die pad part 730 with a predetermined interval. As well shown in FIG. 35, one end of a bonding wire 706 is bonded to the bonding pad portion 740. The other end of the bonding wire 706 is bonded to a partial electrode formed on the upper surface of the LED element 701. As well shown in FIG. 34, the bonding pad portion 740 has an overhang portion 741. The overhanging portion 741 has a shape that is inclined from the surface of the translucent resin 705 toward the reflective surface 720 and is immersed in the translucent resin 705 on both sides.

  The inner lead portion 742 is a portion extending from the bonding pad portion 740 to the upper surface 721 on the opposite side to the first lead 703 above the reflecting surface 720. The inner lead part 742 has the same width as the inner lead part 731 of the first lead 703.

The outer lead portion 743 extends from the inner lead portion 742 to the upper end of the second side surface 723b. The outer lead portion 743 extends to the lower end along the first side surface 723b. Further, the outer lead portion 743 has its distal end portion wraps around the end portion of the bottom surface 722. The distal end portion of the outer lead portion 743 is bonded to a substrate (not shown) as an electrode terminal portion 744. The outer lead portion 743 is also divided into two forks along the upper surface 721. Two electrode terminal portions 744 form a pair.

  The translucent resin 705 is obtained by, for example, filling a concave portion of the case 702 with an epoxy resin or a silicone resin and curing the resin. The translucent resin 705 is preferably formed to be transparent in order to efficiently guide the light from the LED element 701. A part of the first and second leads 703 and 704 (the die pad portion 730, the inner lead portion 731, the bonding pad portion 740, and the inner lead portion 742) is fixed to the surface of the translucent resin 705. The light emitted from the LED element 701 is reflected by the reflecting surface 720 through the translucent resin 705. The light reflected by the reflecting surface 720 passes through the translucent resin 705 again and is emitted from the surface of the translucent resin 705. Therefore, portions such as the die pad portion 730, the inner lead portion 731, the bonding pad portion 740, and the inner lead portion 742 cover a part above the reflecting surface 720 and become a light shielding portion.

  Next, the operation of the LED module A71 will be described.

  When the LED element 701 is bonded to the die pad part 730, the surplus of the conductive adhesive protrudes more from the four sides than the corner part 710 of the LED element 701. Thereby, the surplus of the conductive adhesive flows out to the empty space 730B widely secured on the corner side of the die pad portion 730, and is reliably received by the empty space 730B. Thereby, the die pad portion 730 can be reduced to the extent that the side 730 </ b> A coincides with the corner portion 710 of the LED element 701.

  When the concave portion of the case 702 is filled with the translucent resin 705 and cured, the overhang portions 732 and 741 are immersed in the translucent resin 705 in a posture inclined with respect to the surface of the translucent resin 705. When the translucent resin 705 is cured, the projecting portions 732 and 741 cannot be pulled out from the translucent resin 705 because the translucent resin 705 is fixed around them. As a result, the inner lead portion 731 and the bonding pad portion 740, and the die pad portion 730 and the inner lead portion 742 continuous with the inner lead portion 731 and the bonding pad portion 740 are securely fixed to the surface of the translucent resin 705 by the anchor effect, and peeling from the surface is prevented. Is prevented.

  When the LED module A71 is mounted on a substrate (not shown), solder for electrode bonding enters and adheres between the two electrode terminal portions 734 and 744, so that a stable bonding state is achieved at the time of mounting. be able to.

  In the LED module A71, a lot of light is emitted from the upper surface and side surfaces of the LED element 701. Most of these lights pass through the translucent resin 705 to reach the reflection surface 720 and are efficiently reflected by the reflection surface 720. The reflected light passes through the surface of the translucent resin 705 and is irradiated to the outside of the case 702.

  At that time, part of the light traveling outward is blocked by light shielding portions such as the die pad portion 730, the inner lead portion 731, the bonding pad portion 740, and the inner lead portion 742, or is reflected again toward the reflecting surface 720. It is done. These light shielding portions are formed to be relatively small because peeling is prevented by the anchor effect of the overhang portions 732 and 741.

  In particular, the die pad portion 730 is formed to be even smaller in accordance with the size of the LED element 701 after sufficiently securing an empty space 730 </ b> B necessary for bonding the LED element 701. As a result, the light traveling outward from the case 702 passes through the exposed surface of the transparent resin 705 except for the light shielding portion, and more light is guided outward.

  Therefore, according to the LED module A71 of the present embodiment, the exposed portion of the surface of the translucent resin 705 that is not blocked by light can be formed relatively large, so that it is sufficiently outward through this exposed portion. It is possible to irradiate a large amount of light, and it is possible to easily increase the brightness of the entire chip.

  About a light-shielding part, peeling can be reliably prevented by an anchor effect, making the area smaller.

  37 to 42 show LED modules based on the fourth to eighth embodiments. Note that the same or similar components as those according to the third embodiment are denoted by the same reference numerals and description thereof is omitted.

  FIG. 37 shows an LED module A72 according to the fourth embodiment. The LED module A72 shown in the figure has an inclined protruding portion 741 provided on both sides of the inner lead portion 742 of the second lead 704. Also with this LED module A72, the inner lead portion 742 can be fixed to the surface of the translucent resin 705 by the anchor effect of the overhang portion 741, and peeling from the surface can be reliably prevented.

  FIG. 38 shows an LED module A73 based on the fifth embodiment. The LED module A73 shown in the figure has a concave portion 735 that is inserted into the translucent resin 705 in a part of the inner lead portion 731. The concave portion 735 is completely immersed in the translucent resin 705 when the concave portion of the case 702 is filled with the translucent resin 705 and cured. When the translucent resin 705 is cured, the concave portion 735 cannot be pulled out from the translucent resin 705 because the translucent resin 705 is fixed to the outer surface thereof. Therefore, also by the LED module A73, the die pad portion 730 and the inner lead portion 731 can be fixed to the surface of the translucent resin 705 by the anchor effect of the concave portion 735, and peeling from the surface can be reliably prevented. .

  39 and 40 show an LED module A74 based on the sixth embodiment. The LED module A74 shown in the figure has holes 736 and 746 into which the translucent resin 705 enters in a part of the inner lead portions 731 and 742. When the concave portion of the case 702 is filled with the translucent resin 705 and cured, the translucent resin 705 is in a state in which the translucent resin 705 enters the inside of the holes 736 and 746 or to the outside of the holes 736 and 746. Is overflowing. When the translucent resin 705 is cured, the holes 736 and 746 are locked to the translucent resin 705 because the translucent resin 705 is fixed to the inner wall surface. Therefore, also with the LED module A74, the inner lead portions 731 and 742 can be fixed to the surface of the translucent resin 705 by the anchor effect of the holes 736 and 746, and peeling from the surface can be reliably prevented. .

FIG. 41 shows an LED module A75 based on the seventh embodiment. In the LED module A75 shown in the same drawing, the outer lead portions 733 and 743 are arranged at the tip end portion of the first side surface 723a.
The outer lead portions 733 and 743 along the first side surface 723a and the second side surface 723b are formed as electrode terminal portions 734 and 744 so as to coincide with the lower end of the second side surface 723b. The electrode terminal portions 734 and 744 are used as side electrodes, and are bonded to a substrate (not shown) by attaching solder for electrode bonding from the side of the case 702. Also with this LED module A75, the solder for electrode joining enters between the electrode terminal portions 734 and 744 that are paired in two, and is fixed, so that a stable joined state can be obtained at the time of mounting.

  FIG. 42 shows an LED module A76 according to the eighth embodiment. In the LED module A76 shown in the drawing, the pair of side sides 730A facing each other of the die pad portion 730 are parallel to the direction in which the inner lead portion 731 extends in the longitudinal direction, and the other set of side sides 730A are orthogonal to each other. It is a thing. One side 730 </ b> A of the die pad portion 730 is close to the bonding pad portion 740 of the second lead 704. Also in this LED module A76, the LED elements 701 are joined in a posture in which all the corner portions 710 are directed to the side 730A of the die pad portion 730. Therefore, a relatively wide empty space 730 </ b> B is formed on the corner side of the die pad portion 730. Even with such a configuration, the die pad portion 730 can be formed even smaller, and more light can be guided outward.

  The specific configuration of each part of the LED module can be varied in design in various ways. For example, a portion such as an overhang portion or a hole that provides an anchor effect may be provided only in one of the first and second leads.

  43 to 47 show an LED module according to the ninth embodiment of the present invention, and FIG. 48 shows a case constituting the LED module. The LED module A51 of this embodiment is a reflective LED module that reflects the light of the LED element 501 and guides it outward. The LED module A51 includes an LED element 501, a case 502, a first lead 503, a second lead 504, a translucent resin 505, and first and second electrode terminals 506A and 506B (see FIG. 45).

  The LED element 501 is a semiconductor element having an active layer between n-type and p-type semiconductor layers. The active layer emits infrared rays, for example. The LED element 501 emits a lot of light from the outer surface. On one surface of the LED element 501, a partial electrode that electrically connects one end of the wire 507 is formed. On the bottom surface of the LED element 501, a full-surface electrode that is conductively connected to the first lead 503 is formed (not shown).

  As shown in FIG. 48, the case 502 is formed by curing, for example, a non-translucent epoxy resin or a liquid crystal polymer. The case 502 has a main surface 521 that emits light. The vertical and horizontal dimensions of the main surface 521 are, for example, about 2 × 2 mm. A concave portion 523 having a circular shape in plan view is formed in the central portion of the main surface 521. The recess 523 has a concave reflecting surface 522 (see FIG. 45). On the reflection surface 522, a glossy film that efficiently reflects light by, for example, gold plating is formed. The recess 523 is filled with a translucent resin 505.

  Engaging protrusions 521A for the first and second leads 503 and 504 and a plating layer 521B are formed on the remaining portion of the main surface 521. The engagement protrusion 521A has a mushroom shape (see FIGS. 46 and 47). The plating layer 521B has a laminated structure of metals such as Cu, Ni, and Au. The plating layer 521B is a layer that is considerably thinner than the thicknesses of the first and second leads 503 and 504. The plated layer 521 </ b> B is formed in two regions corresponding to the first and second leads 503 and 504 and is in contact with the first and second leads 503 and 504, respectively. The case 502 has a bottom surface 524 on the side opposite to the main surface 521 and four side surfaces 525 that are substantially perpendicular to the main surface 521 and the bottom surface 524.

  The case 502 is formed with first and second through holes 526A and 526B. Each of the through holes 526A and 526B penetrates from the main surface 521 to the bottom surface 524 in the thickness direction. A conductive layer 527 is formed on the inner peripheral wall and the opening peripheral edge of the through holes 526A and 526B. The conductive layer 527 has a shape following the plated layer 521B. Conductive layer 527 has a laminated structure of the same metal as plating layer 521B, for example. The conductive layer 527 is a layer that is considerably thinner than the thicknesses of the first and second leads 503 and 504. Accordingly, the first through hole 526A is electrically connected to the first lead 503 through the plating layer 521B and the conductive layer 527, and the second through hole 526B is connected to the second through the plating layer 521B and the conductive layer 527. The lead 504 is electrically connected. The through hole may be one in which the entire interior is filled with a conductive member.

  The first lead 503 is made of a metal such as an Fe—Ni alloy or a Cu alloy. The first lead 503 is formed by processing a lead frame into a predetermined size that is about half of the main surface 521. The first lead 503 has an overall flake shape. The first lead 503 is disposed facing substantially half of the main surface 521. The first lead 503 has an inner lead portion 531 and an outer lead portion 532.

  The inner lead portion 531 extends from the periphery of the opening of the recess 523 to the vicinity of the central portion thereof and covers a part of the reflection surface 522. The tip of the inner lead portion 531 located near the center of the recess 523 is used as the die pad portion 531A. The LED element 501 is bonded to the lower surface of the die pad portion 531A in a posture facing the reflecting surface 522.

  The outer lead portion 532 faces a substantially half portion on one side of the main surface 521 excluding the concave portion 523. The outer lead portion 532 is in contact with the plating layer 521B that occupies substantially half of one side thereof. Thereby, the outer lead portion 532 is electrically connected to the first through hole 526A. A plurality of holes 533 are provided in appropriate portions of the outer lead portion 532 corresponding to the engaging protrusion 521A. An engagement protrusion 521A is engaged with the hole 533 by heat caulking. Thereby, the outer lead portion 532 is fixed to the main surface 521.

  Similarly to the first lead 503, the second lead 504 is formed by processing a lead frame into a predetermined size that is about half of the main surface 521. The second lead 504 has an overall flake shape. The second lead 504 is insulated from the first lead 503 and is disposed so as to face substantially half of the main surface 521. The second lead 504 has an inner lead part 541 and an outer lead part 542.

  The inner lead portion 541 extends from the opening periphery of the recess 523 in a direction approaching the die pad portion 531A of the first lead 503, and covers a part of the reflection surface 522. A tip portion of the inner lead portion 541 adjacent to the die pad portion 531A is used as a bonding pad portion 541A. The other end of the wire 507 connected to the LED element 501 is joined to the lower surface of the bonding pad portion 541A.

  The outer lead portion 542 faces the other half of the main surface 521 excluding the portion facing the first lead 503 and the recess 523. The outer lead portion 542 is in contact with the plating layer 521B that occupies approximately half of the other side. As a result, the outer lead portion 542 is electrically connected to the second through hole 526B. A plurality of holes 543 are provided at appropriate portions of the outer lead portion 542 corresponding to the engaging protrusion 521A. Engaging protrusions 521A are engaged with these holes 543 by heat caulking. Thereby, the outer lead part 542 is fixed to the main surface 521.

  When the first and second leads 503 and 504 are fixed to the main surface 521, the engaging protrusion 521A on the main surface 521 initially has a simple columnar shape as shown in FIG. Yes. The holes 533 and 543 of the outer lead portions 532 and 542 are fitted into a simple columnar engagement protrusion 521A.

  Thereafter, as shown in FIG. 49B, the head of the engaging protrusion 521 </ b> A is crushed by the pressing member 508. At this time, the pressing member 508 is heated by a heater (not shown). As a result, the engagement protrusion 521A is deformed by heat caulking until it expands outward from the peripheral edge of the opening of the holes 533 and 543, and its head becomes a mushroom shape and is engaged with the holes 533 and 543. Thereby, the outer lead parts 532 and 542 are securely fixed to the main surface 521.

  The translucent resin 505 is obtained by, for example, filling the recess 523 with an epoxy resin or a silicone resin and curing it. The translucent resin 505 is preferably formed to be transparent in order to efficiently guide light from the LED element 501. Inner lead portions 531 and 541 are fixed to the surface of the translucent resin 505. Light emitted from the LED element 501 passes through the translucent resin 505 and is reflected by the reflecting surface 522. The light reflected by the reflective surface 522 passes through the translucent resin 505 again and is emitted from the surface of the translucent resin 505. In other words, the inner lead portions 531 and 541 serve as light shielding portions for light traveling outward from the reflection surface 522.

  The first and second electrode terminals 506A and 506B are conductive connection portions when the LED module A51 is mounted on a substrate (not shown). The first and second electrode terminals 506A and 506B have a laminated structure of the same metal as the plating layer 521B and the conductive layer 527, for example. The first electrode terminal 506A is electrically connected to the first through hole 526A at both ends of the bottom surface 524. Accordingly, the first electrode terminal 506A is electrically connected to the first lead 503. The second electrode terminal 506B is electrically connected to the second through hole 526B at both ends of the bottom surface 524. Accordingly, the second electrode terminal 506B is electrically connected to the second lead 504.

  Next, the operation of the LED module A51 will be described.

  The engagement protrusion 521A is engaged with the holes 533 and 543 by heat caulking, and the outer lead portions 532 and 542 are fixed to the main surface 521, and then the concave portion 523 is filled with the translucent resin 505. When the translucent resin 505 is cured, the inner lead parts 531 and 541 are fixed to the surface of the translucent resin 505. At this time, the inner lead portions 531 and 541 are in the same plane as the outer lead portions 532 and 542 that are continuous therewith. Therefore, the inner lead parts 531 and 541 are firmly fixed to the surface of the translucent resin 505 without receiving an elastic force from the outer lead parts 532 and 542 that hinders fixation.

  In the LED module A51 manufactured as described above, the first and second leads 503 and 504 are connected to the first and second electrode terminals 506A and 506B through the through holes 526A and 526B. That is, in the manufacturing process of the LED module A51, the forming process of bending the first and second leads 503 and 504 along the bottom surface 524 and the side surface 525 of the case 502 is unnecessary. As a result, more leads can be removed from the lead frame serving as the original shape member, and the LED module A51 can be easily manufactured.

In the LED module A 51, most of the light emitted from the LED element 501 passes through the translucent resin 505 and reaches the reflection surface 522, and is efficiently reflected by the reflection surface 522. The reflected light passes through the surface of the translucent resin 505 and is irradiated to the outside of the case 502.

  At this time, part of the light traveling outward is blocked by the inner lead portions 531 and 541 or reflected again toward the reflecting surface 522. Since the inner lead portions 531 and 541 are in the same plane as the outer lead portions 532 and 542 as described above and are not easily peeled off, they can be formed relatively easily.

  Therefore, according to the LED module A51 of the present embodiment, the first and second leads 503 and 504 fixed to the main surface 521 have no bent portions and no elastic restoring force can be generated. Is reliably prevented. As a result, the inner lead portions 531 and 541 serving as light shielding portions can be formed to be thinner, and as a result, a sufficient amount of light can be irradiated to the outside of the case 502.

  50, 52, and 53 show an LED module according to the tenth embodiment of the present invention, and FIG. 51 shows a case that constitutes the LED module. Note that the same or similar components as those according to the ninth embodiment described above are denoted by the same reference numerals and description thereof is omitted.

  As well shown in FIGS. 50 and 52, the LED module A52 of the tenth embodiment is continuous with the first and second electrode terminals 506A and 506B on the two side surfaces 525 located on opposite sides of the case 502. A plating layer 528 is provided. The plating layer 528 is made of the same metal plating layer as the first and second electrode terminals 506A and 506B, and is used as a part of the first and second electrode terminals 506A and 506B. The plating layer 528 is continuous with the plating layer 521B on the main surface 521 side. Accordingly, the first and second electrode terminals 506A and 506B are electrically connected to the first and second leads 503 and 504.

  Also in the LED module A52, the outer lead portions 532 and 542 are securely fixed to the main surface 521 by engaging the holes 533 and 543 with the engaging protrusion 521A. The outer lead portions 532 and 542 are in the same plane as the inner lead portions 531 and 541, face only the main surface 521, and do not have a bent portion. Therefore, more leads can be removed from the lead frame serving as the original shape member, and the first and second leads 503 and 504 are reliably prevented from being peeled off from the case 502. Therefore, the inner lead portions 531 and 541 serving as light-shielding portions can also be formed thinner by the LED module A52 of the present embodiment, and as a result, a sufficient amount of light can be emitted to the outside of the case 502.

  As shown in FIG. 54, the engaging protrusion 521A may be crushed until its head coincides with the opening surface of the holes 533 and 543. When crushing the engaging protrusion 521A, the inner peripheral surface of the holes 533 and 543 and the engaging protrusion 521A are fixed by heat. As a result, the outer lead portions 532 and 542 are reliably fixed to the main surface 521 by the engagement protrusions 521A being engaged with the holes 533 and 543.

  The LED module may be one in which an LED element is mounted on the upper surface of a lead facing outward, and the light from the LED element is irradiated directly outward without reflecting light.

As a summary of the third to eleventh embodiments, configurations and variations thereof according to these embodiments are listed as appendices below.
(Appendix 1)
A rectangular LED element in plan view;
A case having a concave reflecting surface;
A first lead having a rectangular die pad portion that covers a part of the reflective surface and faces the LED element to the reflective surface;
An LED module comprising:
The LED module, wherein all the corners are joined in a posture facing a side of the die pad part.
(Appendix 2)
The first lead has an inner lead portion that covers a part of the reflecting surface following the die pad portion, and a side of the die pad portion is oblique to the inner lead portion. The LED module according to 1.
(Appendix 3)
A second lead that covers a part of the reflective surface and has a bonding pad portion connected to the LED element via a wire; and the die pad portion has a corner close to the bonding pad portion; The LED module according to attachment 2.
(Appendix 4)
The first lead has an inner lead part that covers a part of the reflective surface following the die pad part, and a side of the die pad part is parallel or orthogonal to the inner lead part. The LED module according to attachment 1.
(Appendix 5)
The die pad portion includes a second lead having a bonding pad portion that covers a part of the reflective surface and is connected to the LED element through a wire. The die pad portion has one side adjacent to the bonding pad portion. The LED module according to appendix 4.
(Appendix 6)
The second lead has an inner lead portion that covers a part of the reflective surface following the bonding pad portion, and is disposed between the inner lead portion of the first and second leads and the reflective surface. The LED module according to appendix 3 or 5, which is filled with a translucent resin.
(Appendix 7)
The inner lead portion in at least one of the first and second leads is formed with an overhanging portion that is inclined with respect to the surface of the translucent resin and that is immersed in the translucent resin. 6. The LED module according to 6.
(Appendix 8)
The LED module according to appendix 6, wherein the inner lead portion of at least one of the first and second leads is formed with a recess that is immersed in the translucent resin. (Appendix 9)
The LED module according to appendix 6, wherein the inner lead portion of at least one of the first and second leads is formed with a hole into which the translucent resin enters.
(Appendix 10)
The LED module according to any one of appendices 6 to 9, wherein the bonding pad portion is formed with an overhanging portion that is inclined with respect to the surface of the translucent resin and is immersed in the translucent resin.
(Appendix 11)
At least one of the first and second leads has an outer lead portion extending along the remaining surface of the reflective surface of the case following the inner lead portion, and the outer lead portion is bifurcated. The LED module according to any one of appendices 6 to 10, which is formed in a shape.
(Appendix 12)
The case has a bottom surface on the side opposite to the reflection surface, and a tip portion of the outer lead portion in at least one of the first and second leads is along the bottom surface of the case. LED module according to 1.
(Appendix 13)
The case has a side surface facing in a direction different from a direction in which the reflecting surface faces, and a tip portion of the outer lead portion in at least one of the first and second leads is along the side surface of the case. The LED module according to appendix 11.
(Appendix 14)
An LED element;
A case having a main surface;
A first lead provided along the main surface to which the LED element is bonded;
An LED module comprising:
The LED module according to claim 1, wherein a part of the main surface and a part of the first lead are engaged with each other.
(Appendix 15)
Insulated from the first lead, provided along the main surface, and provided with a second lead connected to the LED element via a wire,
15. The LED module according to appendix 14, wherein a part of the main surface and a part of the second lead are engaged with each other.
(Appendix 16)
16. The LED module according to appendix 15, wherein a hole into which a part of the main surface enters is formed in the engaging portion of the first and second leads.
(Appendix 17)
The case has a bottom surface on the side opposite to the main surface, and has first and second through holes that pass from the bottom surface to the main surface and are electrically connected to the first and second leads, respectively. And
17. The LED module according to appendix 16, wherein the bottom surface is provided with first and second electrode terminals that are electrically connected to and insulated from the first and second through holes, respectively. (Appendix 18)
The case has a plurality of side surfaces facing a direction different from a direction facing the main surface,
The first and second electrode terminals that are electrically connected to the first and second leads, respectively, are provided on two side surfaces that are opposite to each other among the plurality of side surfaces, according to appendix 16. LED module.
(Appendix 19)
The main surface is formed with a concave portion having a concave reflecting surface,
The first lead has a die pad portion to which the LED element is bonded in a posture facing the reflecting surface of the recess,
19. The LED module according to any one of appendices 15 to 18, wherein the second lead has a bonding pad portion to which one end of the wire is bonded and covers a part of the reflecting surface.
(Appendix 20)
The LED module according to appendix 19, wherein the concave portion is filled with a translucent resin that seals the LED element and the wire.

A1, A2, A21 to A24 Light-emitting device 1 Base material 1a Surface 1ac (First) Side edge 1ac, 1ad, 1af Side edge 1b Back surface 1c, 1d, 1e, 1f Side surface 11 First recess 111 (First) Bottom surface 112 Side surface 114 Edge 12 Second recess 121 (Second) bottom surface 122, 123, 124 Side surface 13 a, 13 b Raised portion 16 Surface side covering portion 17 Back surface side covering portion 18 Surface side exposed portion 181 Surface exposed region 182 Inside surface exposed Region 183 Bottom exposed region 19 Back side exposed portion 2 Surface conductor layer 21 First surface electrode 211 Frame portion 211a Edge 212 Strip portion 213 Inner surface electrode 214 Bottom electrode 22 Second surface electrode 222 Strip portion 223 Inner surface electrode 224 Bottom electrode 29 void portion 3 side conductor layer 31 first side electrode 32 second side electrode 4 back conductor layer 41 first back electrodes 41a, 41b end face 42 first Back electrode 42a, 41b End surface 5 Lens 51 Convex part 51a Convex surface 52 Tapered part 52a Tapered part 53 Plate-like part 53a First surface 53b Second surface 53c, 53d, 53e, 53f Lens side surface 6 Light emitting element 7 Wire 8 Conductor film 81 Circuit part 82 Non-circuit part 85 Adhesive layer 87 Resin part 87a Light exit surface x (first) direction y (second) direction z direction

A71 to A76 LED module 701 LED element 710 Corner portion 702 Case 720 Reflecting surface 721 Upper surface 722 Bottom surface 723a First side surface 723b Second side surface 703 First lead 730 Die pad portion 730A Side side 731 Inner lead portion 732 Overhang portion 733 Outer lead portion 735 Concave portion 736 Hole 704 Second lead 740 Bonding pad portion 741 Overhang portion 742 Inner lead portion 743 Outer lead portion 746 Hole 705 Translucent resin 706 Bonding wire

A51, A52 LED module 501 LED element 502 Case 521 Main surface 521A Engaging projection 522 Reflecting surface 523 Recess 524 Bottom surface 525 Side surface 526A First through hole 526B Second through hole 503 First lead 531 Inner lead portion 531A Die pad Portion 532 Outer lead portion 533 Hole 504 Second lead 541 Inner lead portion 541A Bonding pad portion 542 Outer lead portion 543 Hole 505 Translucent resin 506A First electrode terminal 506B Second electrode terminal 507 Wire

Claims (18)

Light emitting element,
A substrate on which the light emitting element is disposed;
A lens positioned in front of the light emitting element,
The lens includes a lens portion that refracts light from the light emitting element, and a frame portion that is positioned around the lens portion,
It has an adhesive layer that adheres and fixes the frame part and the base material,
A space is provided between the lens unit and the base material and the light emitting element, and the space is between the flat part of the surface of the frame part and the flat part of the surface of the base material. Communicating with the outside through the adhesive layer gap formed by the area where the adhesive layer is not provided,
The lens portion has a convex surface formed of a curved surface that swells on the opposite side to the light emitting element.
The lens has a tapered portion connected to the lens portion and the frame portion,
The said taper part is a light-emitting device which has a taper surface which is a shape which encloses the said convex surface in planar view, and is diameter-expanded as it approaches the said light emitting element.   The light emitting device according to claim 1, wherein the tapered surface is a rough surface on which fine unevenness is formed.   The light emitting device according to claim 2, wherein the fine uneven shape has a height difference of 1 to 2 μm.   The light emitting device according to claim 1, wherein the light emitting element emits infrared light.   The light emitting device according to any one of claims 1 to 4, wherein a center of the light emitting element and a center of the lens portion coincide in plan view.   The light-emitting device according to claim 1, further comprising a resin portion that covers the light-emitting element.   The light emitting device according to claim 6, wherein the space is interposed between the lens and the resin portion.   8. The light emitting device according to claim 1, wherein a width of the adhesive layer gap in a plan view is smaller than a width of the light emitting element in a plan view. The base material includes a first electrode on which the light emitting element is mounted, and a second electrode electrically separated from the first electrode and electrically connected to the light emitting element,
The light emitting device according to claim 1, further comprising a wire connecting the light emitting element and the second electrode.   The light emitting device according to claim 9, wherein the adhesive layer gap is provided on a side opposite to the light emitting element with respect to a bonding portion of the wire to the second electrode.   The light emitting device according to claim 10, wherein the light emitting element and the wire are exposed in the space.   The light emitting device according to claim 9, wherein the first electrode, the second electrode, and the adhesive layer gap are arranged in a straight line. The first electrode is disposed in the center of the substrate in plan view,
The light emitting device according to claim 9, wherein the second electrode is disposed between the first electrode and the adhesive layer gap.   The light emitting device according to any one of claims 9 to 13, wherein a width of the adhesive layer space in plan view is larger than a diameter of the wire.   The light-emitting device according to claim 1, wherein the lens unit has a curved surface located on a side opposite to the convex surface. The frame portion is formed so as to surround the lens portion in an annular shape,
The light emitting device according to claim 1, wherein the frame portion is bonded and fixed to the base material at a portion excluding the adhesive layer gap.   The light-emitting device according to any one of claims 1 to 16, wherein at least a part of the edge in plan view of the lens and at least a part of the edge in plan view of the substrate coincide with each other. The first electrode, the second electrode, and the adhesive layer gap are arranged in a straight line,
11. The light emitting device according to claim 10, wherein the lens and the substrate each have side surfaces that are parallel to a direction in which the first electrode, the second electrode, and the adhesive layer gap are arranged and are flush with each other. apparatus.

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