• M313317 基座ίο ~導線支架10a 金屬座10b 严 正負電極結構11 承載面12 導接體13 LED晶粒20 罩蓋透鏡30 φ模造玻璃透鏡31 、透光樹脂層32 内光學面33 外光學面34 注膠孔35 八、新型說明： 【新型所屬之技術領域】 本創作係有關一發光二極體組件（LED assembly ), 尤彳θ —種具有模造玻璃透鏡之發光二極體組件，其係在其 封裝結構中利用一模造玻璃透鏡作為罩蓋透鏡，藉以取代 習知完全由透光樹脂構成之罩蓋透鏡者。 【先前技術】 按，習知發光二極體組件（LED assembiy)具有各種 不同封裝結構，大體上是由一基座、一或數個LED晶粒及 一具透鏡功能之罩蓋（以下稱罩蓋透鏡 ，cover lens )封 裝組成一體’也可隨散熱需要而另增加散熱裝置如增加散 3 M313317 熱層/片之設計’其中，該基座之主要作用係用以承 _ LED晶粒，並使LED晶粒外接電源以驅使LED晶粒發 •而基座之結構型態及其材質不拘，一般係以絕緣材二例如 塑材來製作成型，其上並設有一正負電極結構例如引腳以 外接電源，例如與電路板之電子線路中之正負極連接，又 基座上面一般係利用一承載面供放置LED晶粒；該曰 粒可為一或數個，佈設在基座之承載面上並與基座之正日曰 電極結構構成電性導接，而電性導接方式具有各種不同設 •計，例如利用導線或導片分別連接在LED曰曰曰粒之正負極與 .$座之正負電極結構之間以驅使LED晶粒發光；該罩蓋^ 鏡（cover lens) 一般係利用透光樹脂構成，其設置在基 座之承载面上並疋全包覆住led晶粒’而形成一 led組件 (LED assembly )之封裝結構。 而一般LED組件之封裝製程係使LED晶粒與基座二者 先結合並電性導接成一體，再使罩蓋透鏡之成型模具位於 下方但成型模穴口朝向上方，再於罩蓋之成型模穴内注入 _液態透光樹脂，再將LED晶粒與基座之結合體對準對位安 置於成型模穴口處’使基座之承載面及其上之LED晶粒可 沉浸在液態透光樹脂中，也就是液態透光樹月旨完全包覆在 基f之承載面及LED晶粒外圍，再進行加熱烘烤過程以使 液您透光樹脂硬化而完成一 LED組件之封裝製程，·然，習 知LED組件之罩蓋透鏡係利用透光樹脂構成如環氧樹脂 (epoxy )、聚矽氧烷（siiic〇n、矽膠）等，致使該罩 盍透I兄之耐熱性、耐侯性、耐變色性（抗性低）及機械 強度（而十磨性）相對受到限制，無法達到模造玻璃透鏡 (Molding glass lens )之特性及程度，也相對影響[肋 4 -M313317 組件之應用範圍，如針對一高功率（high power )高亮度 、白光LED組件而言，其會產生較高溫度，而由透光樹脂構 成之罩蓋透鏡因耐熱性較差而使透鏡功能受到影響（一般 透光樹脂之軟化溫度無法達到模造玻璃材料之軟化溫度 450〜750°C )，致不但須額外加強散熱裝置之設計，也 使高功率高亮度白光LED組件之封裝結構相對複雜化；尤 其，透光樹脂透鏡之光折射率及光穿透率也比模造玻璃透 鏡低，相對影響LED組件之亮度及發光效率；故申請人乃 $針對習知發光二極體組件之結構精益求精加以改良。 【新型内容】 本創作主要目的乃在於提供一種具有模造玻璃透鏡之 發光二極體組件（LED ASSEMBLY HAVING MOLDING GLASS LENS )，主要係由一基座、一或數個LED晶粒及一^具透鏡 功能之罩蓋透鏡（cover 1 ens )組成一封裝結構；該基座 上設有一正負電極結構供與電源連接及一承載面供放置發 光二極體（LED )晶粒；該一或數個LED晶粒係佈設在基 馨座之承載面上並與基座之正負電極結構構成電性導接以驅 使LED晶粒發光；該罩蓋透鏡係由一模造玻璃透鏡 (molding glass lens )與一透光樹脂層結合構成，其係 利用一模造成型之模造玻璃透鏡，使其罩設在基座之承載 面上，再利用透光樹脂材料由預設之注膠孔注入並充滿模 造玻璃透鏡之内面與承載面之間的空隙中並完全包覆住 LED晶粒，使該透光樹脂在硬化後可與模造玻璃透鏡結合 成一體；藉上述封裝結構，可有效提昇LED組件之耐熱 性、耐侯性、耐變色性及機械強度，並增進其亮度及發光 5 M313317 效率。 义一 _】作再目的乃在於提供一種具有模造玻璃透鏡之 ，光一極體組件，其中該模造玻璃透鏡之外、内（或上、 :)二光學面之形狀及光學參數組可隨lED組件之發光型 態的需要而作不同之變化設計，包括一凸一凹形狀（外光 :面為凸面而内光學面為一凹面）、雙凸形狀（外、内 光學面皆為凸面）、或-凸-平形狀（外光學面為一凸面 而内光學面為一平面），藉以增進LED組件之發光型能的 變化性，相對增進LED組件之亮度及發光效率，並可^化 模造玻璃透鏡之光學設計。 、，本創作又一目的乃在於提供一種具有模造玻璃透鏡之 么光一極體組件，其中該模造玻璃透鏡可設計成具有圓形 外框或方形外框或多邊形外框或其他非軸對稱形狀之外 框，藉以增進LED組件之封裝結構之變化性，可有效減少 LED組件而相對降低lED組件之成本。 、本創作另一目的乃在於提供一種具有模造玻璃透鏡之 ^光二極體組件，其中該注膠孔可預設並直接模造成型於 模造玻璃透鏡之外框上，或預設於基座之承載面的上端邊 緣上，使透光樹脂材料可直接由該注膠孔注入並充滿模造 玻璃透鏡之内面與承載面之間的空隙中並完全包覆住led 曰曰粒藉以免開设習知罩蓋透鏡之透光樹脂成型模具，並 簡化LED組件之封裝作業。 八 本創作又另一目的乃在於提供一種具有模造玻璃透鏡 之發光二極體組件，其中該模造玻璃透鏡與基座之間可設 置相互對應之卡合結構，如模造玻璃透鏡在模造成型時在 其外框上預設一卡槽，且於基座之上端邊緣上預設一可對 6 M313317 1卡合=凸柱’使模造破璃透鏡罩設在基座之承載面上 Ί可藉_卡合結構而同時卡固在基座上，藉以增進發光 二極體^件在封裝前、後（注膠作業前、後）之結合強 度，亚簡化模造麵透鏡罩設在基座承載面上之定位操 【實施方式】• M313317 base ίο ~ wire holder 10a metal seat 10b strict positive electrode structure 11 bearing surface 12 lead body 13 LED die 20 cover lens 30 φ molded glass lens 31, transparent resin layer 32 optical surface 33 outer optical surface 34 Injection hole 35 VIII. New description: [New technical field] This creation is about a LED assembly, especially θ, a light-emitting diode assembly with a molded glass lens. A molded glass lens is used as a cover lens in its package structure, in place of the conventional cover lens which is entirely composed of a light-transmissive resin. [Prior Art] According to the prior art, the LED assembiy has various package structures, and is generally composed of a pedestal, one or several LED dies, and a lens function cover (hereinafter referred to as a hood). Cover lens, cover lens) package can also be integrated with the need for heat dissipation, such as the addition of 3 M313317 thermal layer / sheet design 'where the main role of the base is to _ LED die, and The LED die is externally connected to the power supply to drive the LED die. The structure and the material of the pedestal are not limited. Generally, the insulating material is formed by using an insulating material such as a plastic material, and a positive and negative electrode structure such as a pin is disposed thereon. Connect the power supply, for example, to the positive and negative poles in the electronic circuit of the circuit board, and generally use a bearing surface for placing the LED die on the pedestal; the granules may be one or several, disposed on the bearing surface of the pedestal And electrically connected with the positive electrode structure of the pedestal, and the electrical conduction mode has various different settings, for example, the wire or the guide piece is respectively connected to the positive and negative poles of the LED iridium and the . Positive and negative electrode junction Between the structures to drive the LED dies to emit light; the cover lens is generally made of a light-transmissive resin, which is disposed on the bearing surface of the pedestal and completely covers the led die' to form a led The package structure of the component (LED assembly). In general, the packaging process of the LED component is such that the LED die and the pedestal are first combined and electrically integrated into one body, and then the molding die of the cap lens is located below but the molding die hole faces upward, and then the cap is formed. Injecting _ liquid transparent resin into the cavity, and aligning the combination of LED die and pedestal in the position of the molding die hole, so that the bearing surface of the pedestal and the LED die thereon can be immersed in liquid light transmission. In the resin, that is, the liquid light-transmission tree is completely coated on the bearing surface of the base f and the periphery of the LED die, and then the heating and baking process is performed to harden the liquid transparent resin to complete the packaging process of the LED component. However, the cover lens of the conventional LED module is made of a light-transmissive resin such as epoxy resin, polysiloxane (siiic〇n, silicone), etc., so that the cover penetrates the heat resistance and weather resistance of the I brother. The discoloration resistance (low resistance) and the mechanical strength (and ten-grinding) are relatively limited, and the characteristics and extent of the Molding glass lens cannot be achieved, and the relative application range of the rib 4 - M313317 component is also affected. Such as for a high power (high Power) High-brightness, white LED components, which produce higher temperatures, and the cover lens made of light-transmissive resin is affected by poor heat resistance (the softening temperature of the transparent resin cannot reach the molded glass) The softening temperature of the material is 450~750 °C), which not only requires additional reinforcement of the design of the heat sink, but also makes the packaging structure of the high-power high-brightness white LED component relatively complicated; in particular, the light refractive index and light wear of the transparent resin lens The transmittance is also lower than that of the molded glass lens, which affects the brightness and luminous efficiency of the LED component. Therefore, the applicant has improved the structure of the conventional light-emitting diode component. [New content] The main purpose of this creation is to provide a LED ASSEMBLY HAVING MOLDING GLASS LENS with a molded glass lens, mainly consisting of a pedestal, one or several LED dies and a lens. The functional cover lens (cover 1 ens ) constitutes a package structure; the base is provided with a positive and negative electrode structure for connection with a power source and a bearing surface for placing a light emitting diode (LED) die; the one or several LEDs The die is disposed on the bearing surface of the base and electrically connected to the positive and negative electrode structures of the base to drive the LED die to emit light; the cover lens is formed by a molding glass lens and a through lens The photo-resin layer is combined and formed by using a mold-forming glass lens, which is covered on the bearing surface of the base, and then injected with a transparent resin material from a predetermined injection hole and filled with the inner surface of the molded glass lens. And the LED die is completely covered in the gap between the bearing surface, so that the light-transmissive resin can be integrated with the molded glass lens after being hardened; and the LED package can be effectively improved by the above package structure Heat resistance, weather resistance, discoloration resistance and mechanical strength, and to increase the brightness and luminous efficiency 5 M313317. Yiyi _] is intended to provide a light-polar body assembly having a molded glass lens, wherein the shape and optical parameter set of the outer (or upper) optical surface of the molded glass lens can be associated with the lED component The design of the illuminating pattern is differently changed, including a convex-concave shape (outer light: the surface is convex and the inner optical surface is a concave surface), the biconvex shape (the outer and inner optical surfaces are convex), or - convex-flat shape (the outer optical surface is a convex surface and the inner optical surface is a flat surface), thereby improving the variability of the light-emitting type of the LED component, relatively improving the brightness and luminous efficiency of the LED component, and enabling the molding of the glass lens Optical design. A further object of the present invention is to provide a light-emitting body assembly having a molded glass lens, wherein the molded glass lens can be designed to have a circular outer frame or a square outer frame or a polygonal outer frame or other non-axisymmetric shapes. The outer frame, in order to improve the variability of the packaging structure of the LED component, can effectively reduce the LED component and relatively reduce the cost of the lED component. Another object of the present invention is to provide a photodiode assembly having a molded glass lens, wherein the injection molding hole can be pre-set and directly molded on the outer frame of the molded glass lens, or preset to the bearing of the base. The upper end edge of the surface enables the light-transmissive resin material to be directly injected from the injection hole and filled in the gap between the inner surface of the molded glass lens and the bearing surface and completely covers the led particles so as not to open the conventional cover The light-transmissive resin molding mold that covers the lens and simplifies the packaging operation of the LED assembly. Another object of the present invention is to provide a light-emitting diode assembly having a molded glass lens, wherein a matching structure can be arranged between the molded glass lens and the base, such as when the molded glass lens is molded. A card slot is preset on the outer frame, and a pair of 6 M313317 1 snap = studs are arranged on the upper end edge of the base to make the molded glass lens cover on the bearing surface of the base. The clamping structure is simultaneously fixed on the base, so as to improve the bonding strength of the light-emitting diode components before and after the packaging (before and after the injection operation), and the sub-simplified molding lens cover is disposed on the base bearing surface. Positioning operation [implementation method]
為使本創作更加明確詳實，茲列舉諸較佳實施例並配 合下$圖示，將本創作之結構及其技術特徵詳述如後·· —清參照圖1至圖6所示，其分別係本創作LED組件-貫施例之立體圖、側視圖、模造玻璃透鏡立體圖、模造玻 璃透I兄侧面剖視圖、LED組件立體分解圖及LED組件侧面 剖=圖，士創作發光二極體組件（LED assemMy) i係針 對習知罩蓋透鏡由透光樹脂或塑質透鏡構成之結構而加以 改良设计者，主要係由一基座1〇、一或數個LED晶粒2〇及 一具有模造玻璃透鏡之罩蓋透鏡（c〇ver lens) 3〇組成， 其中该基座10主要係包含一或數組正負電極結構1丨供分別 與正負電源連接及一承載面12供放置發光二極體（LEj)) 晶粒20 ;該一或數個LED晶粒2〇係佈設在基座1〇之承載面 12上並與基座1〇之正負電極結構丨丨構成電性導接以驅使 LED晶粒20發光；而該基座1〇之主要作用係用以承載led 晶粒20並使LED晶粒20可外接電源以驅使LED晶粒20發 光，但基座10之結構型態包括正負電極結構丨丨及承載面12 的形狀設計等並不限制，可隨需要而作不同變化設計，以 圖5、6為例說明’該基座1 〇係一組合體結構，由一塑材 成型之導線支架l〇a及一金屬座l〇b組成，而外接電源用 7 •M313317 之正負電極結構11係形成引腳形狀而分別設在導線支架 ' 10a之一對應邊緣上，而承載面a係形成一凹坑形狀而設 在&線支架1 Oa之頂面上，而於封裝（組裝）製程時，可 藉導接體13連接在LED晶粒20與引腳形狀之正負電極結構 11之間以構成電性導接。 LED晶粒20與正負電極結構11之間之導接體13的結構 或電性導接方式不限制，可具有各種不同設計，如利用導 線（如圖6所示）或導片（圖未示）作為導接體13而分別 φ跨接在LED晶粒20之正負極與基座之正負電極結構1丨之間 以驅使LED晶粒20發光；又承載面丨2可為一凹坑面如圖5 所示或一平面（圖未示）。 LED晶粒20之數目、顏色（紅、綠、藍）及佈設方式 不限制，可同時利用一或數個LED晶粒20而佈設在承載面 12，以增加單色亮度或達成混光效果；又如圖所示引腳形 狀之正負電極結構U係由一正極一負極構成一組，其組數 不限制，可配合LED晶粒20之數目或佈設方式而對應設 馨置，如利用一組正負電極結構11以分別控制一 LED晶粒20 之發光如圖1、7、13所示之LED組件1、2、4，或利 用二組正負電極結構11以分別控制二個LED晶粒2〇之發光 如圖10所示之LED組件3，或利用三組正負電極結構1Ux 刀別控制三個LED晶粒20之發光如圖16所示之led组件 5 〇 ' 再參照圖1至圖6所示，本創作LED組件1之主要技 術特徵在於：該罩蓋透鏡30係由一模造玻璃透鏡31與一透 光樹脂層32結合構成，其中該模造玻璃透鏡31係指利用高 精確性壓製方法（high-precision pressing method)製 8 M313317 成之透鏡，也就是利用一成型模具而將一已加溫軟化之玻 、璃材料直接壓製成型之透鏡，而不須再研磨或拋光 (molding a glass material softened by heat with a forming mold having a shape identical or similar to that of a product to directly manufacture lens without grinding or polishing );而封裝時，先使該 模造玻璃透鏡31罩設在基座l〇之承載面12上，再利用液態 透光樹脂材料由預設之注膠孔35注入並充滿模造玻璃透鏡 _ 31之内光學面33與承載面12之間的空隙中，並且完全包覆 住LED晶粒20，使該透光樹脂在硬化後形成一透光樹脂層 32並與模造玻璃透鏡31與基座黏結成一體；藉上述led 組件1之封裝結構，因模造玻璃材料之軟化溫度為450〜 750 C ’故可有效提昇LED組件1之耐熱性、耐侯性、耐 變色性及機械強度；又模造玻璃透鏡31之光折射率及光穿 透率也比習知透光樹脂透鏡或塑質透鏡高，故可增進LED 組件1之亮度及發光效率。 φ 再參照圖1至圖18所示之本創作各實施例LED組件 1、2、3、4、5，其中，該模造玻璃透鏡31之外、内 (或上、下）二光學面34、33的形狀及光學參數組可隨 LED組件之發光型態或需要而作不同變化設計，如··設計 成一凸一凹形狀，也就是外光學面34為一凸面而内光學面 33為一凹面如圖4、15所示；或雙凸形狀，也就是外光學 面34為一凸面而内光學面33也為一凸面（圖中未示），·或 一凸一平形狀也就是外光學面34為一凸面而内光學面33為 一平面如圖9、12所示；或一薄形透鏡，也就是外光學面 34為一圓形凸紋面而内光學面33為一平面如圖18所示，·藉 9 M313317 以增進LED組件1之發光型態的變化性，並可簡化模造玻 -璃透鏡31之光學設計，也相對增進LED組件丨之亮度及發 光效率。 該模造玻璃透鏡31之外框36的形狀不限制，其可隨 LED、、且件之封裝結構或需要而作不同之變化設計，該外框 36係指模造玻璃透鏡31之外、内光學面34、犯的外緣部 分，又外框36與外、内二光學面34、33之間又可設計具有 一平面部凸緣37，如：設計具有一圓形之外框36a及一凸 φ緣37如圖3、4及圖7、9所示，或設計具有方形之外框 36b及凸緣37如圖10、12及圖16、18所示，或設計具有圓 形之外框36c但沒有凸緣37如圖13、15所示，或設計具有 多邊形外框或其他非軸對稱形狀之外框（圖未示）；而當 外框36或凸緣37設計成圓形、方形、多邊形或其他非軸二 稱之形狀時，基座10之外框形狀亦可相對應配合設計，藉 以增進LED組件之封裝結構之變化性，並可簡化模造玻璃 透鏡31之製程，例如圖10、12及圖16、18所示具有方形之 春外框36b及凸緣37之模造玻璃透鏡31，其製程中所使用之 預形體與具有圓形之外框36a及凸緣37之模造玻璃透鏡“ 所使用之預形體不同，可相對降低LED組件之成本。 本創作LED組件在封裝製程中係利用透光樹脂材料由 預e又之注膠孔注入並充滿模造玻璃透鏡31之内光學面犯與 承載面12之間的空隙中且完全包覆住LED晶粒2〇，其中該 注膠孔35之設立位置並不限制，可配對設於模造玻璃透鏡 31之凸緣37的二對應邊緣上及/或設於基座1〇之外框的二 對應邊緣上如圖1至圖6所示，或對應設於模造玻璃透鏡 31之外框36的二對應邊緣上如圖15所示，以能簡便成型該 •M313317 注膠孔35及能簡便由該注膠孔35注入透光樹脂材料為設計 原則，藉以簡化LED組件之封裝作業。In order to make the creation more clear and detailed, the preferred embodiment is illustrated with the following diagram, and the structure and technical features of the creation are described in detail later, as shown in FIG. 1 to FIG. This is a three-dimensional diagram, a side view, a stereoscopic view of a molded glass lens, a side view of a molded glass, a three-dimensional exploded view of an LED component, and a side view of an LED component. AssemMy) i is an improved design for a structure in which a conventional cover lens is made of a light-transmissive resin or a plastic lens. It is mainly composed of a susceptor, one or several LED dies, and a molded glass. The cover lens of the lens is composed of a stack of lenses, wherein the base 10 mainly comprises an array of positive and negative electrode structures 1 for respectively connecting with positive and negative power sources and a bearing surface 12 for placing light emitting diodes (LEj). )) the die 20; the one or more LED dies 2 are arranged on the carrying surface 12 of the pedestal 1 并 and electrically connected with the positive and negative electrode structures 基座 of the pedestal 1 驱 to drive the LED dies 20 illuminates; and the main function of the pedestal is used to The LED die 20 and the LED die 20 can be externally connected to drive the LED die 20 to emit light, but the structure of the susceptor 10 includes the positive and negative electrode structure 形状 and the shape design of the bearing surface 12 is not limited, and can be used as needed. For different design changes, take the example of FIG. 5 and FIG. 6 as an example. The base 1 is a composite structure, which is composed of a plastic wire guide l〇a and a metal seat l〇b, and is used for external power supply. 7: The positive and negative electrode structures 11 of M313317 are formed in a pin shape and respectively disposed on one corresponding edge of the wire holder '10a, and the bearing surface a is formed in a pit shape and is disposed on the top surface of the & wire holder 1 Oa In the package (assembly) process, the lead body 13 can be connected between the LED die 20 and the pin-shaped positive and negative electrode structures 11 to form an electrical conductive connection. The structure or electrical guiding manner of the guiding body 13 between the LED die 20 and the positive and negative electrode structures 11 is not limited, and may have various designs, such as using a wire (as shown in FIG. 6) or a guide piece (not shown). As the guiding body 13, respectively, φ is connected between the positive and negative electrodes of the LED die 20 and the positive and negative electrode structures 1丨 of the pedestal to drive the LED die 20 to emit light; and the bearing surface 2 can be a pit surface such as Figure 5 or a plane (not shown). The number, color (red, green, blue) and layout of the LED dies 20 are not limited, and may be disposed on the carrying surface 12 by using one or several LED dies 20 at the same time to increase the monochromatic brightness or achieve a light mixing effect; As shown in the figure, the positive and negative electrode structure U of the pin shape is composed of a positive electrode and a negative electrode. The number of groups is not limited, and the number of LED dies 20 or the arrangement of the LED dies 20 can be set correspondingly, such as using a group. The positive and negative electrode structures 11 respectively control the illumination of an LED die 20 as shown in Figures 1, 7, and 13 of the LED assemblies 1, 2, 4, or by using two sets of positive and negative electrode structures 11 to respectively control two LED dies 2 〇 The LED assembly 3 shown in FIG. 10, or the LEDs of the three LED dies 20 are controlled by three sets of positive and negative electrode structures 1Ux knives. The LED assembly 5 shown in FIG. 16 is further referred to FIG. 1 to FIG. The main technical feature of the present LED module 1 is that the cover lens 30 is composed of a molded glass lens 31 combined with a light transmissive resin layer 32, wherein the molded glass lens 31 refers to a high precision pressing method ( High-precision pressing method) made 8 M313317 lens, Is a lens that directly presses a glass material that has been softened and softened by a molding die, without grinding or polishing (molding a glass material softened by heat with a forming mold having a shape identical or similar to that For packaging, the mold glass lens 31 is first placed on the bearing surface 12 of the susceptor, and the liquid-transparent resin material is used to pre-fill the glue. The hole 35 is injected and filled in the gap between the optical surface 33 of the molded glass lens _ 31 and the bearing surface 12, and completely covers the LED die 20, so that the light-transmissive resin forms a light-transmissive resin layer 32 after hardening. And the molded glass lens 31 and the base are bonded together; by the package structure of the LED assembly 1, the softening temperature of the molded glass material is 450~750 C′, thereby effectively improving the heat resistance, weather resistance and resistance of the LED assembly 1. The discoloration and mechanical strength; and the refractive index and light transmittance of the molded glass lens 31 are also higher than those of the conventional light-transmissive resin lens or plastic lens, so that the LED component 1 can be improved. And the degree of luminous efficiency. φ Referring again to the LED components 1, 2, 3, 4, and 5 of the present embodiment shown in FIGS. 1 to 18, wherein the outer (or upper, lower) optical surfaces 34 of the molded glass lens 31, The shape and optical parameter set of 33 can be designed differently depending on the illumination type or needs of the LED component, such as a convex shape, that is, the outer optical surface 34 is a convex surface and the inner optical surface 33 is a concave surface. As shown in FIGS. 4 and 15; or a biconvex shape, that is, the outer optical surface 34 is a convex surface and the inner optical surface 33 is also a convex surface (not shown), or a convex-flat shape, that is, the outer optical surface 34. For a convex surface, the inner optical surface 33 is a plane as shown in FIGS. 9 and 12; or a thin lens, that is, the outer optical surface 34 is a circular relief surface and the inner optical surface 33 is a plane as shown in FIG. 9 M313317 is used to improve the variability of the illumination pattern of the LED assembly 1, and the optical design of the molded glass lens 31 can be simplified, and the brightness and luminous efficiency of the LED assembly can be relatively improved. The shape of the outer frame 36 of the molded glass lens 31 is not limited, and may be designed differently depending on the LED, and the package structure or the need of the component. The outer frame 36 refers to the outer optical surface of the molded glass lens 31. 34. The outer edge portion of the sin, and the outer frame 36 and the outer and inner optical surfaces 34, 33 may be designed to have a flat flange 37, such as: a circular outer frame 36a and a convex φ. The rim 37 is as shown in Figs. 3, 4 and Figs. 7 and 9, or has a square outer frame 36b and a flange 37 as shown in Figs. 10, 12 and Figs. 16, 18 or a circular outer frame 36c. There is no flange 37 as shown in Figures 13 and 15, or a frame having a polygonal outer frame or other non-axisymmetric shape (not shown); and when the outer frame 36 or flange 37 is designed to be circular, square, or polygonal When the shape of the non-axial two-symbol is used, the outer frame shape of the base 10 can also be designed correspondingly, so as to improve the variability of the packaging structure of the LED assembly, and the process of molding the glass lens 31 can be simplified, for example, FIG. 10 and FIG. And a molded glass lens 31 having a square spring frame 36b and a flange 37 as shown in Figs. The pre-form used is different from the pre-shaped body of the molded glass lens having the circular outer frame 36a and the flange 37. The cost of the LED assembly can be relatively reduced. The LED assembly of the present invention utilizes a light-transmissive resin material in the packaging process. Injecting and filling the optical surface of the molded glass lens 31 into the gap between the bearing surface 12 and completely covering the LED die 2〇, wherein the injection hole 35 is positioned and Without limitation, the pairing may be provided on the two corresponding edges of the flange 37 of the molded glass lens 31 and/or on the two corresponding edges of the outer frame of the base 1 如图 as shown in FIG. 1 to FIG. 6 or correspondingly The two corresponding edges of the outer frame 36 of the molded glass lens 31 are as shown in FIG. 15, so that the M313317 injection hole 35 can be easily formed and the light transmissive resin material can be easily injected from the injection hole 35, thereby simplifying the design principle. Packaging of LED components.
參照圖5所示，模造玻璃透鏡31與基座1〇之間可設置 相互對應之卡合結構，如在模造玻璃透鏡31之外框36上設 一卡槽38，而於基座1〇之上端邊緣上設一可對應卡合之凸 柱39，使模造玻璃透鏡31罩設在基座1〇之承載面12上時， 可藉卡槽38與凸柱39之間的卡合作用而同時卡固在基座1〇 上，藉以避免注膠作業時因注膠壓力而造成模造玻璃透鏡 31與基座10脫離，並可使模造玻璃透鏡31可簡易對位而罩 設^基座10之承載面12上，藉以增進發光二極體組件在封 I刖、後（或注膠作業前、後）之結合強度。Referring to FIG. 5, a matching structure may be disposed between the molded glass lens 31 and the pedestal 1 ,. For example, a card slot 38 is disposed on the frame 36 of the molded glass lens 31, and the pedestal 1 is disposed on the pedestal 1 The upper end edge is provided with a corresponding engaging post 39, so that when the molded glass lens 31 is disposed on the bearing surface 12 of the base 1 , the card can be engaged with the latch 39 by the card slot 38 The card is fixed on the base 1 to avoid the mold glass lens 31 from being separated from the base 10 due to the glue injection pressure during the glue injection operation, and the mold glass lens 31 can be easily aligned and the base 10 can be covered. The bearing surface 12 is used to enhance the bonding strength of the LED assembly after sealing, after (or before and after the injection operation).
綜上所述，本創作「具有模造玻璃透鏡之發光二極體 組件」，的確能藉由上述所揭露之構造，達到所述之功 效，且本創作申請前未見於刊物亦未公開使用，誠已 新型專利之新穎、進步等要件。 σ 以上所述僅為本新型的較佳實施例，對本新型而古 是說明性的，而非限制性的。本專業技術人員理 : 新型權利要求躲定的精神㈣圍内可對其進行許多^本 ::修改，甚至等效變更，但都將落入本新型的保護範圍 【圖式簡單說明】 圖1 圖2 圖3 圖4 係本創作LED組件第一實施例之外觀立體圖 係圖1之LED組件之侧視圖。 係圖1之LED組件中模造破璃透鏡之立體圖 係圖3之模造玻璃透鏡之側面剖視圖。 M313317 圖5 :係圖1之LED組件之立體分解圖。 圖6 :係圖1之LED組件之側面剖视圖。 圖7 本細D組件第二實施例之外觀立體圖。 圖8 ·係圖7之LED組件之側視圖。 圖9 :係圖7中模造玻璃透鏡之侧面剖視圖。 圖1〇:係本創作LED組件第三實施例之外觀立體圖。 圖11 :係圖10之LED組件之侧視圖。 0圖12 :係圖1 〇中模造玻璃透鏡之侧面剖視圖。 圖13 ·係本創作LED組件第四實施例之外觀立體圖。 圖14 :係圖13之LED組件之侧視圖。 圖15 ·•係圖13中模造玻璃透鏡之侧面剖視圖。 圖16 :係本創作LED組件第五實施例之外觀立體圖。 圖Π ··係圖16之侧視圖。 圖18:係圖16中模造玻璃透鏡之立體圖。 【主要元件符號說明】 咖發光二極體（LED )組件1、2、3、4、5 基座10 導線支架10a 金屬座10b 正負電極結構11 承載面12 導接體13 LED晶粒20 罩蓋透鏡30 12 M313317 模造玻璃透鏡31 ，透光樹脂層32 内光學面33 外光學面34 注膠孔35 外框 36、36a、36b 凸緣37 卡槽38 $凸柱39 13In summary, the present invention "light-emitting diode assembly with molded glass lens" can achieve the above-mentioned effects by the above-disclosed structure, and has not been disclosed in the publication before the application for creation. The novelty, progress and other requirements of the new patent. The above is only a preferred embodiment of the present invention, and is illustrative and not restrictive. The professional and technical personnel: The spirit of the new claims can be ridiculed (4). It can be carried out in many ways: modification, even equivalent changes, but will fall into the scope of protection of this new type [simple description of the diagram] Figure 1 2 is a side view of the LED assembly of the first embodiment of the present invention. Fig. 1 is a perspective view of a molded glass lens in the LED assembly of Fig. 1. Fig. 3 is a side cross-sectional view of the molded glass lens. M313317 Figure 5: An exploded perspective view of the LED assembly of Figure 1. Figure 6 is a side cross-sectional view of the LED assembly of Figure 1. Figure 7 is a perspective view showing the appearance of a second embodiment of the present detailed D assembly. Figure 8 is a side view of the LED assembly of Figure 7. Figure 9 is a side cross-sectional view showing the molded glass lens of Figure 7. Fig. 1 is a perspective view showing the appearance of a third embodiment of the present LED assembly. Figure 11 is a side view of the LED assembly of Figure 10. 0 Figure 12: is a side cross-sectional view of the molded glass lens of Figure 1. Figure 13 is an external perspective view of a fourth embodiment of the present LED assembly. Figure 14 is a side view of the LED assembly of Figure 13. Figure 15 is a side cross-sectional view of the molded glass lens of Figure 13. Figure 16 is a perspective view showing the appearance of a fifth embodiment of the present LED assembly. Figure Π · · Figure 7 is a side view. Figure 18 is a perspective view of the molded glass lens of Figure 16. [Main component symbol description] Coffee light-emitting diode (LED) components 1, 2, 3, 4, 5 Base 10 Wire holder 10a Metal seat 10b Positive and negative electrode structure 11 Bearing surface 12 Lead body 13 LED die 20 Cover Lens 30 12 M313317 Molded glass lens 31, optically transparent layer 32, optical surface 33, outer optical surface 34, glue hole 35, outer frame 36, 36a, 36b, flange 37, slot 38, stud 39 13