CN215932317U - Backlight module and display device - Google Patents
Backlight module and display device Download PDFInfo
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- CN215932317U CN215932317U CN202121709016.1U CN202121709016U CN215932317U CN 215932317 U CN215932317 U CN 215932317U CN 202121709016 U CN202121709016 U CN 202121709016U CN 215932317 U CN215932317 U CN 215932317U
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Abstract
The utility model relates to a backlight module and a display device, wherein the backlight module comprises: a substrate; the light-emitting chip is arranged on one side of the substrate; the packaging layer is arranged on one side of the substrate, the packaging layer is arranged along the periphery of the light-emitting chip in a bonding mode, and part of the packaging layer wraps the light-emitting chip; the light conversion layer is arranged on one side, far away from the light-emitting chip, of the packaging layer, a containing cavity is formed in the light conversion layer, and the containing cavity is used for containing the light-emitting chip and coating the packaging layer of the light-emitting chip. The space that the light conversion layer took in backlight unit has been reduced, the thickness of light conversion layer in backlight unit has been reduced, and then has reduced backlight unit's whole thickness, and simultaneously, the light conversion layer can fully absorb the light that each light emitting area of luminous chip sent, has improved the light utilization ratio, has avoided setting up the diffusion barrier alone, has improved display effect.
Description
Technical Field
The utility model relates to the technical field of semiconductor display, in particular to a backlight module and a display device.
Background
In the related art, a main trend of Mini Light Emitting Diode (Mini-LED) Display devices is to use a Mini-LED backlight module + a Liquid Crystal Display (LCD) glass layer. However, in the related art, the backlight module is prone to generate a phenomenon of uneven light emission (Mura) to affect the display effect, and the current solution to Mura is to cover a diffusion film on the light conversion layer and then leave a Gap between the diffusion film and the LCD screen, where the thickness Gap of the Gap between the light conversion layer and the LCD glass layer is called as the OD value, and the OD value is reserved to make the light emission more uniform, but this solution will increase the overall thickness of the backlight module and increase the diffusion film to increase the product cost.
Therefore, how to make the backlight module emit light uniformly and improve the display effect is a problem that needs to be solved urgently.
SUMMERY OF THE UTILITY MODEL
In view of the above deficiencies of the related art, an object of the present invention is to provide a backlight module and a display device, which aims to solve the problem that the backlight module is prone to generate uneven light emission and affect the display effect in the related art.
A backlight module includes: a substrate; the light-emitting chip is arranged on one side of the substrate; the packaging layer is arranged on one side of the substrate, the packaging layer is arranged along the periphery of the light-emitting chip in a bonding mode, and part of the packaging layer wraps the light-emitting chip; the light conversion layer is arranged on one side, far away from the light-emitting chip, of the packaging layer, a containing cavity is formed in the light conversion layer, and the containing cavity is used for containing the light-emitting chip and coating the packaging layer of the light-emitting chip.
Above-mentioned backlight unit, through setting up encapsulating layer laminating luminescence chip, set up the photoconversion layer and can hold luminescence chip and cladding the encapsulation layer of luminescence chip, and then reduce the space that the photoconversion layer occupy in backlight unit, compare with setting up the photoconversion layer alone, reduced the thickness of photoconversion layer in backlight unit, and then reduced backlight unit's whole thickness, simultaneously, the photoconversion layer can fully absorb the light that each light emitting area of luminescence chip sent, improved the light utilization ratio, promoted the display effect, avoided setting up the diffusion barrier alone, and then reduced the thickness between photoconversion layer and the glass layer, further reduced backlight unit's whole thickness.
Optionally, the backlight module further includes: a first reflective layer having a through hole disposed between the light conversion layer and the encapsulation layer; the light-emitting chip and the packaging layer covering the light-emitting chip penetrate through the through hole, and the packaging layer not covering the light-emitting chip is attached to the first reflecting layer.
Above-mentioned backlight unit, first reflection stratum can reflect the light of emitting chip towards the direction of first reflection stratum to the direction of light conversion layer, and then more by the light conversion layer absorption of the light that emitting chip sent, collect the unnecessary light that emitting chip sent and utilize, and then improve the utilization ratio of light.
Optionally, the backlight module further includes: and the atomization coating is arranged between the accommodating cavity and the packaging layer for coating the light-emitting chip and covers the surface of the packaging layer for coating the light-emitting chip.
Above-mentioned backlight unit breaks up the light that sends the luminescence chip through the atomizing coating for the light that sends the luminescence chip side is more absorbed by the light conversion layer, and then makes whole backlight unit luminous more even, has improved the light utilization ratio.
Optionally, the atomized coating is any one of: anti-reflection atomization coating and anti-glare atomization coating.
Optionally, the atomized coating has a thickness of between 10 microns and 30 microns.
Optionally, the light conversion layer comprises: a cellulose triacetate substrate; the quantum dot layer is arranged on one side of the cellulose triacetate substrate, and the quantum dot layer is far away from one side of the cellulose triacetate substrate to form the accommodating cavity
Optionally, the backlight module further includes: and the diffusion particles are uniformly distributed on the side, away from the quantum dot layer, of the cellulose triacetate substrate.
The surface of one side of the substrate is far away from the light conversion layer, the diffusion particles are arranged on the surface of one side of the substrate, emergent light emitted after the light conversion layer is converted can be scattered, backlight uniformity is improved, a diffusion film is prevented from being arranged independently, cost of the backlight module is saved, and meanwhile emitted light is scattered through the diffusion particles, and uniformity of the backlight module is improved.
Optionally, the substrate comprises a transparent substrate; the backlight module further comprises: a second reflective layer disposed on the other side of the substrate.
Optionally, the backlight module further includes: and the frame sealing glue is arranged on the side surface of the backlight module.
Based on the same concept, the present application also provides a display device, including: a backlight module as described in any of the above; and the liquid crystal display module is arranged on the light emergent side of the backlight module.
Above-mentioned display device, backlight unit wherein sets to the light conversion layer through setting up encapsulating layer laminating luminescence chip and holding luminescence chip and cladding the encapsulation layer of luminescence chip, and then dwindles the space that the light conversion layer occupy in backlight unit, compare with setting up the light conversion layer alone, has reduced the thickness of light conversion layer in backlight unit, and then has reduced backlight unit's whole thickness, and simultaneously, the light conversion layer can fully absorb the light that each light emitting face of luminescence chip sent, has improved the light utilization ratio, has avoided setting up the diffusion barrier alone, and then has reduced the thickness between light conversion layer and the glass layer, further reduce backlight unit's whole thickness, has promoted whole display effect.
Drawings
Fig. 1 is a schematic diagram of a basic structure of a backlight module according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a basic structure of a substrate provided with a light emitting chip according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a basic structure of disposing a package adhesive on a substrate according to an embodiment of the present invention;
fig. 4 is a schematic diagram of a basic structure of disposing an encapsulation layer on a substrate according to an embodiment of the present invention;
fig. 5 is a schematic diagram of a basic structure of another backlight module according to an embodiment of the present invention;
fig. 6 is a schematic diagram of a basic structure of disposing a first reflective layer on an encapsulation layer according to an embodiment of the present invention;
FIG. 7 is a schematic diagram of a basic structure of a backlight module according to another embodiment of the present invention;
FIG. 8 is a schematic diagram of a basic structure for providing an atomized coating according to an embodiment of the present invention;
FIG. 9 is a schematic view of a basic structure of another backlight module according to an embodiment of the present invention;
fig. 10 is a schematic diagram of a basic structure of a backlight module according to an embodiment of the present invention;
fig. 11 is a schematic diagram of a basic structure of a display device according to an embodiment of the present invention;
description of reference numerals:
the liquid crystal display panel comprises a substrate 1, a light-emitting chip 2, a packaging layer 3, a light conversion layer 4, a cellulose triacetate base material 41, a quantum dot layer 42, a first reflecting layer 5, an atomized coating 6, diffusion particles 7, frame sealing glue 8, a second reflecting layer 9 and a liquid crystal display module 10.
Detailed Description
To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are given in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
The present application is intended to provide a solution to the above technical problem, the details of which will be explained in the following embodiments.
Examples of the utility model
In order to solve the problem that the backlight module in the related art is prone to generate uneven light emission and affect the display effect, an embodiment of the utility model provides a backlight module, please refer to fig. 1, which includes but is not limited to: a substrate 1; the light emitting chip 2 is arranged on one side of the substrate 1; the packaging layer 3 is arranged on one side of the substrate 1, the packaging layer 3 is arranged along the periphery of the light-emitting chip 2 in a bonding mode, and part of the packaging layer 3 covers the light-emitting chip 2; the light conversion layer 4 is arranged on one side, far away from the light-emitting chip 2, of the packaging layer 3, and an accommodating cavity is formed in the light conversion layer 4 and is used for accommodating the light-emitting chip 2 and the packaging layer 3 covering the light-emitting chip 2; as shown in fig. 1, the encapsulation layer 3 forms a groove between the light emitting chips 2, and the groove matches with the sidewall of the accommodating cavity formed by the light conversion layer 4, so that the sidewall of the accommodating cavity can be placed in the groove, and the encapsulation layer 3 is attached to the light conversion layer 4.
The backlight module that this embodiment provided, through the luminous chip 2 setting of laminating with encapsulated layer 3, set light conversion layer 4 to holding luminous chip 2 and cladding the encapsulated layer 3 of luminous chip 2, and then reduce the space that light conversion layer 4 took in backlight module, compare with setting up light conversion layer 4 alone, reduced the thickness of light conversion layer 4 in backlight module, and then reduced backlight module's whole thickness, simultaneously, light conversion layer 4 can fully absorb the light that each light emitting face of luminous chip 2 sent, improved the light utilization ratio, avoid setting up the diffusion barrier alone, and then reduced the thickness between light conversion layer 4 and the glass layer, further reduced backlight module's whole thickness.
It should be understood that, among others, the substrate 1 includes, but is not limited to: a Printed Circuit Board (PCB), a Flexible Circuit Board (FPC), or the like; by performing the die bonding of the light emitting chips 2 on the substrate 1, and further disposing the light emitting chips 2 on one side of the substrate 1, as shown in fig. 2, it should be understood that the substrate 1 may be insulating, such as a ceramic substrate, a glass substrate, etc., the substrate 1 is disposed with circuits, and each light emitting chip 2 is connected with the circuits on the substrate 1, so as to provide the electric signals to each light emitting chip 2 through the circuits externally; in some examples, the substrate 1 is provided with a conductive pattern, a plurality of bonding areas are reserved on the conductive pattern, a connection structure for placing the light emitting chips 2 is arranged in the bonding areas, and the light emitting chips 2 are directly attached to the bonding areas and are connected with the outside through the conductive pattern, so as to provide electric signals to the light emitting chips 2 from the outside.
It should be understood that, among others, the light emitting chip 2 includes but is not limited to: at least one of the red light emitting chip 2, the green light emitting chip 2 and the blue light emitting chip 2; or, the light emitting chip 2 includes: at least one of the red light emitting chip 2, the green light emitting chip 2, the blue light emitting chip 2 and the yellow light emitting chip 2. The kinds of the light emitting chip 2 include, but are not limited to, any of the following: Mini-LED chips, Micro Light Emitting diodes (Micro LED), and the like; in some examples of the present embodiment, the light emitting chip 2 is a blue Mini-LED chip.
In some examples of the embodiment, the packaging adhesive is hot-pressed in a vacuum hot-pressing manner to fix the light-emitting chip 2, and the material of the packaging adhesive is transparent epoxy resin or organic silicon resin, wherein the thickness of the packaging adhesive exceeds the surface of the light-emitting chip 2, so that the design can protect the chip, and the OD value is not increased too much, and the influence on the thickness of the product is small; for example, the thickness of the packaging adhesive is preferably such that the surface of the packaging adhesive covers 1/3 the thickness of the chip on the surface of the light emitting chip 2, as shown in fig. 3; then, processing the packaging adhesive to obtain a packaging layer 3 which is arranged on the substrate 1 and covers the light-emitting chip 2, as shown in fig. 4; for example, a steel mesh corresponding to the arrangement of the light emitting chips 2 is manufactured, and the packaging adhesive Pattern is patterned in a Plasma Etch (Plasma etching) manner, so that the periphery of the light emitting chips 2 is wrapped by the packaging adhesive to achieve a protective effect, and the packaging adhesive in the gaps between the light emitting chips 2 is removed to embed the light conversion layer 4 matched with the packaging adhesive.
In some examples of this embodiment, as shown in fig. 5, the backlight module further includes: a first reflective layer 5, the first reflective layer 5 having a through hole, disposed between the light conversion layer 4 and the encapsulation layer 3; the light-emitting chip 2 and the packaging layer 3 coating the light-emitting chip 2 penetrate through the through hole, and the packaging layer 3 not coating the light-emitting chip 2 is attached to the first reflecting layer 5; for example, the first reflective layer 5 may be formed by silver plating at the bottom of a groove formed in the encapsulation layer 3, as shown in fig. 6, where the first reflective layer 5 can reflect light of the light emitting chip 2 toward the first reflective layer 5 to the direction of the light conversion layer 4, and further the light emitted by the light emitting chip 2 is absorbed by the light conversion layer 4 more, so that the redundant light emitted by the light emitting chip 2 is collected and utilized, and further the utilization rate of the light is improved; it should be understood that the present embodiment is not limited to the material and the manufacturing process of the reflective layer, and those skilled in the art can select the material and the manufacturing process flexibly.
In some examples of the present embodiment, the thickness of the first reflective layer 5 is between 2 micrometers and 8 micrometers, and preferably, the thickness of the first reflective layer 5 is 5 micrometers.
In some examples of this embodiment, as shown in fig. 7, the backlight module further includes: the atomization coating 6 is arranged between the accommodating cavity and the packaging layer 3 for coating the light-emitting chip 2, and covers the surface of the packaging layer 3 for coating the light-emitting chip 2; the atomized coating 6 is formed on the packaging layer 3 covering the light-emitting chip 2, and can diffuse light emitted by the light-emitting chip 2. The present embodiment does not limit the manufacturing method of the atomization coating 6, for example, the atomization coating 6 may be formed by a stamping method, specifically, the encapsulation layer 3 covering the light emitting chip 2 is stamped to obtain the atomization coating 6, as shown in fig. 8, wherein the light emitted by the light emitting chip 2 is scattered by the atomization coating 6, so that more light emitted by the side surface of the light emitting chip 2 is absorbed by the light conversion layer 4, and further, the light emission of the whole backlight module is more uniform, and the light utilization rate is improved.
In some examples of the present embodiment, the atomized coating 6 includes, but is not limited to, one of: an anti-reflection (AR) atomization coating 6, an anti-glare (AG) atomization coating 6; specifically, the material of the atomization layer may be made of colloidal particles such as polymethyl methacrylate (PMMA), epoxy resin, silicone resin, and the like, that is, the atomization coating 6 is substantially particles covering the encapsulation layer 3 at the position where the light emitting chip 2 is coated, so that when the diameter of the colloidal particles is between 10 micrometers and 30 micrometers, the thickness of the atomization coating 6 is also substantially 10 micrometers to 30 micrometers, preferably, the diameter of the colloidal particles forming the atomization coating 6 is 15 micrometers, and the thickness of the atomization coating 6 is 15 micrometers.
In some examples of the present embodiment, as shown in fig. 9, the light conversion layer 4 includes: the light conversion layer 4 includes: a cellulose triacetate substrate 41; a quantum dot layer 42, wherein the quantum dot layer 42 is arranged on one side of the cellulose triacetate substrate 41, and the quantum dot layer 42 is far away from one side of the cellulose triacetate substrate 41 to form the accommodating cavity; specifically, the light conversion layer 4 may be formed by disposing the patterned quantum dot layer 42 on the side of the cellulose triacetate substrate 41, and forming the receiving cavity on the side of the quantum dot layer 42 away from the cellulose triacetate substrate 41; in some examples, when the light emitting chip 2 is a blue LED, the quantum dots contained in the quantum dot layer 42 are a mixture of QD-R material and QD-G material, and the whole backlight module can emit white light after being excited by the blue light emitted from the light emitting chip 2; in some examples, when the light emitting chip 2 is a blue LED, the quantum dot layer 42 includes a layered combination of a QD-R quantum dot layer and a QD-G quantum dot layer, and the whole backlight module can emit white light after being excited by the blue light emitted from the light emitting chip 2.
It should be understood that, in some examples, when the light emitting chip 2 is a violet LED or an ultraviolet LED, the light conversion layer 4 may be implemented by mixing quantum dot materials including three different quantum dot light emitting media of RGB, thereby implementing conversion of light emitted by the light emitting chip 2 into white light. It is understood that in some examples, the light conversion layer 4 may also be implemented by a phosphor layer composed of phosphor; for example, when the light emitting chip 2 is a blue LED, the light conversion layer 4 may be a phosphor layer composed of yellow phosphor, so that the glue layers of the yellow phosphor excited by the blue LED are mixed to form white light. It can be understood that the light emitting chip 2 of the present application can be a micro-led chip or a miniature chip, and the size of the type is not limited herein.
In some examples of this embodiment, as shown in fig. 9, the backlight module further includes: the diffusion particles 7 are uniformly distributed on the side, away from the substrate 1, of the light conversion layer 4; diffusion particle 7 impression is carried out through the surface of keeping away from base plate 1 one side at light conversion layer 4, sets up diffusion particle 7, can break up the emergent light that sends after light conversion layer 4 conversion, improves the degree of consistency in a poor light, and then has avoided setting up the diffusion barrier alone, has practiced thrift backlight unit's cost, simultaneously, breaks up the transmission light through diffusion particle 7, has improved backlight unit's degree of consistency.
In some examples of the present embodiment, the substrate 1 is a transparent substrate 1, for example, a glass substrate 1; the backlight module further comprises: the second reflective layer 9 is provided on the other side of the substrate 1, and as shown in fig. 10, by providing the second reflective layer 9 on the other side of the transparent substrate 1, light transmitted through the transparent substrate 1 can be reflected back, and light emitted from the redundant light-emitting chips 2 can be collected and utilized, thereby improving the light utilization rate.
It should be understood that at least one of the diffusion particles 7, the first reflective layer 5, the second reflective layer 9, and the atomization coating 6 may be disposed in the backlight module, and those skilled in the art may flexibly combine the diffusion particles 7, the first reflective layer 5, the second reflective layer 9, and the atomization coating 6 in the backlight module.
In some examples of this embodiment, the backlight module further includes: the frame sealing glue 8 is arranged on the side face of the backlight module, as shown in fig. 10, the frame sealing glue 8 is arranged on the side face of the backlight module, and the frame sealing glue 8 completely covers each layer between the substrate 1 and the light conversion layer 4, so that the whole backlight module can achieve a sealing effect, water and oxygen can be prevented from entering, and the service life of the backlight module is prolonged.
Based on the same concept, the present invention also provides a display device, as shown in fig. 11, including: the backlight module as described above; and the liquid crystal display module 10 is arranged on the light emergent side of the backlight module.
Above-mentioned display device, backlight unit wherein sets up light conversion layer 4 through the luminous chip 2 setting of laminating with encapsulated layer 3 and can hold luminous chip 2 and cladding the encapsulated layer 3 of luminous chip 2, and then reduce the space that light conversion layer 4 took in backlight unit, compare with setting up light conversion layer 4 alone, reduced the thickness of light conversion layer 4 in backlight unit, and then reduced backlight unit's whole thickness, simultaneously, light conversion layer 4 can fully absorb the light that each light emitting area of luminous chip 2 sent, improved the light utilization ratio, avoided setting up the diffusion barrier alone, and then reduced the thickness between light conversion layer 4 and the glass layer, further reduced backlight unit's whole thickness, whole display effect has been promoted.
It is to be understood that the utility model is not limited to the examples described above, but that modifications and variations may be effected thereto by those of ordinary skill in the art in light of the foregoing description, and that all such modifications and variations are intended to be within the scope of the utility model as defined by the appended claims.
Claims (10)
1. A backlight module, comprising:
a substrate;
a light emitting chip disposed at one side of the substrate;
the packaging layer is arranged on one side of the substrate, the packaging layer is arranged along the periphery of the light-emitting chip in a bonding mode, and part of the packaging layer wraps the light-emitting chip;
the light conversion layer is arranged on one side, far away from the light-emitting chip, of the packaging layer, a containing cavity is formed in the light conversion layer, and the containing cavity is used for containing the light-emitting chip and coating the packaging layer of the light-emitting chip.
2. The backlight module of claim 1, wherein the backlight module further comprises:
a first reflective layer having a through hole disposed between the light conversion layer and the encapsulation layer;
the light-emitting chip and the packaging layer covering the light-emitting chip penetrate through the through hole, and the packaging layer not covering the light-emitting chip is attached to the first reflecting layer.
3. The backlight module of claim 1, wherein the backlight module further comprises: and the atomization coating is arranged between the accommodating cavity and the packaging layer for coating the light-emitting chip and covers the surface of the packaging layer for coating the light-emitting chip.
4. The backlight module of claim 3, wherein the atomized coating is any one of: anti-reflection atomization coating and anti-glare atomization coating.
5. The backlight module of claim 4, wherein the thickness of the atomized coating is between 10 microns and 30 microns.
6. The backlight module of claim 1, wherein the light conversion layer comprises:
a cellulose triacetate substrate;
the quantum dot layer is arranged on one side of the cellulose triacetate substrate, and the quantum dot layer is far away from one side of the cellulose triacetate substrate to form the accommodating cavity.
7. The backlight module of claim 6, wherein the backlight module further comprises: and the diffusion particles are uniformly distributed on the side, away from the quantum dot layer, of the cellulose triacetate substrate.
8. The backlight module according to any of claims 1-7, wherein the substrate comprises a transparent substrate; the backlight module further comprises: a second reflective layer disposed on the other side of the substrate.
9. The backlight module of claim 8, wherein the backlight module further comprises: and the frame sealing glue is arranged on the side surface of the backlight module.
10. A display device, comprising:
a backlight module according to any one of claims 1-9;
and the liquid crystal display module is arranged on the light emergent side of the backlight module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121709016.1U CN215932317U (en) | 2021-07-26 | 2021-07-26 | Backlight module and display device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202121709016.1U CN215932317U (en) | 2021-07-26 | 2021-07-26 | Backlight module and display device |
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| CN215932317U true CN215932317U (en) | 2022-03-01 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114639757A (en) * | 2022-03-22 | 2022-06-17 | 东莞市中麒光电技术有限公司 | Display module manufacturing method and display module |
| CN115437180A (en) * | 2022-09-02 | 2022-12-06 | 深圳市云密芯显示技术有限公司 | LED lamp panel and preparation method thereof |
-
2021
- 2021-07-26 CN CN202121709016.1U patent/CN215932317U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114639757A (en) * | 2022-03-22 | 2022-06-17 | 东莞市中麒光电技术有限公司 | Display module manufacturing method and display module |
| CN114639757B (en) * | 2022-03-22 | 2023-06-09 | 东莞市中麒光电技术有限公司 | Display module manufacturing method and display module |
| CN115437180A (en) * | 2022-09-02 | 2022-12-06 | 深圳市云密芯显示技术有限公司 | LED lamp panel and preparation method thereof |
| CN115437180B (en) * | 2022-09-02 | 2024-04-30 | 深圳市云密芯显示技术有限公司 | LED lamp panel and preparation method thereof |
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