CN110398857A - Micro-led lamp plate, its production method, backlight module and display device - Google Patents
Micro-led lamp plate, its production method, backlight module and display device Download PDFInfo
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- CN110398857A CN110398857A CN201910636337.4A CN201910636337A CN110398857A CN 110398857 A CN110398857 A CN 110398857A CN 201910636337 A CN201910636337 A CN 201910636337A CN 110398857 A CN110398857 A CN 110398857A
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- 229910052751 metal Inorganic materials 0.000 description 3
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133605—Direct backlight including specially adapted reflectors
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133614—Illuminating devices using photoluminescence, e.g. phosphors illuminated by UV or blue light
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a kind of micro-led lamp plate, its production method, backlight module and display devices, it include: transparent substrate circuit board, the micro-led chip being set on transparent substrate circuit board, and positioned at transparent substrate circuit board away from the first reflecting layer of micro-led chip-side.The first reflecting layer is set away from the side of micro-led chip in transparent substrate circuit board, can guarantee the first reflecting layer reflection efficiency with higher to avoid the destruction in micro-led chip bonding process to the first reflecting layer.Micro-led chip is incident on the first reflecting layer to the emergent light of the side of transparent substrate circuit board through transparent substrate circuit board, again it is emitted to micro-led chip away from the side of transparent substrate circuit board, thus it is utilized more emergent lights of light source, improves the utilization efficiency of light source.
Description
Technical field
The present invention relates to field of display technology more particularly to a kind of micro-led lamp plates, its production method, backlight
Mould group and display device.
Background technique
High dynamic range (High-Dynamic Range, abbreviation HDR) display technology compares traditional display technologies, Ke Yiti
For more dynamic performances and image details, it can preferably reflect the visual effect that object is own in true environment, and by
Generally believe the change next time that can cause in display field.Meanwhile HDR display technology to liquid crystal display terminal it is also proposed that higher
Requirement --- finer zonal control and higher picture contrast.
Micro-led (Mini-Light Emitting Diode, abbreviation Mini-LED) is as backlight in liquid crystal
Have become current research hotspot in display.The backlighting scheme for taking light guide plate side entering type is shown different from traditional liquid crystal,
It uses flood tide Mini-LED to be applied to field of backlights as backlight, and the lightening of backlight not only may be implemented, can also be real
The local dimming control now more refined, promotes the dynamic contrast of liquid crystal display.
However there are problems in application design by Mini-LED, emergent light a part of Mini-LED lamp plate can be direct
Project to display panel, can also some light can to lamp plate bottom outlet, cause light source using low.
Summary of the invention
The present invention provides a kind of micro-led lamp plate, its production method, backlight module and display device, to
Improve the utilization efficiency of light source.
In a first aspect, the present invention provides a kind of micro-led lamp plate, comprising: transparent substrate circuit board is set to
Micro-led chip on the transparent substrate circuit board, and it is located at the transparent substrate circuit board away from described micro-
First reflecting layer of type light-emitting diode chip for backlight unit side；
First reflecting layer is used to reflect incident ray to the micro-led chip-side.
In one possible implementation, in above-mentioned micro-led lamp plate provided by the invention, described
One reflecting layer is white ink layer or reflector plate.
In one possible implementation, described white in above-mentioned micro-led lamp plate provided by the invention
Color ink with a thickness of 10-50 μm.
In one possible implementation, described in above-mentioned micro-led lamp plate provided by the invention
Bright substrate circuit plate includes: transparent substrates, the line layer in the transparent substrates, and covers the transparent of the line layer
Insulating layer；
The transparent insulating layer includes: the one-to-one hollow-out parts of electrode with the micro-led chip.
In one possible implementation, described in above-mentioned micro-led lamp plate provided by the invention
Bright substrate circuit plate is printed circuit board or flexible circuit board.
In one possible implementation, in above-mentioned micro-led lamp plate provided by the invention, further includes:
Deviate from the second reflecting layer of one side surface of the first reflecting layer positioned at the transparent substrate circuit board；
The figure in second reflecting layer the transparent substrate circuit board orthographic projection with it is described micro-led
Chip is non-overlapping in the orthographic projection of the transparent substrate circuit board；The thickness in second reflecting layer is less than described miniature luminous
The height of diode chip for backlight unit.
In one possible implementation, in above-mentioned micro-led lamp plate provided by the invention, described
Two reflecting layer are white ink layer.
In one possible implementation, described white in above-mentioned micro-led lamp plate provided by the invention
The thickness of color ink layer is no more than 25 μm.
Second aspect, the present invention provide a kind of backlight module, comprising: backboard and be arranged on the backboard above-mentioned
One micro-led lamp plate.
The third aspect, the present invention provide a kind of display device, including any of the above-described backlight module and setting in the back
The display panel of optical mode group light emission side.
The present invention has the beneficial effect that:
Micro-led lamp plate, its production method, backlight module and display device provided by the invention, comprising: thoroughly
Bright substrate circuit plate, the micro-led chip being set on transparent substrate circuit board, and it is located at transparent substrate circuit
First reflecting layer of the backboard from micro-led chip-side；First reflecting layer be used for by incident ray to it is miniature shine two
The reflection of pole pipe chip-side.The first reflecting layer is set away from the side of micro-led chip in transparent substrate circuit board,
It is higher can to guarantee that the first reflecting layer has to avoid the destruction in micro-led chip bonding process to the first reflecting layer
Reflection efficiency.Most of light of micro-led chip is emitted to the side away from transparent substrate circuit board, but still
So there is fraction light that can be emitted to the side of transparent substrate circuit board, due to using transparent substrates, this some light can be with
It is incident on the first reflecting layer through transparent substrate circuit board, the first reflecting layer has reflex, can be by incident light
It is reflected, reflection light is emitted to micro-led chip away from the side of transparent substrate circuit board again, is thus made
More emergent lights of light source can be utilized, and improve the utilization efficiency of light source.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, will make below to required in the embodiment of the present invention
Attached drawing is briefly described, it should be apparent that, attached drawing described below is only some embodiments of the present invention, for
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other
Attached drawing.
Fig. 1 is one of the structural schematic diagram of micro-led lamp plate provided in an embodiment of the present invention；
Fig. 2 is one of the beam projecting path schematic diagram of micro-led chip provided in an embodiment of the present invention；
Fig. 3 is one of the beam projecting path schematic diagram of micro-led chip provided in an embodiment of the present invention；
Fig. 4 is the second structural representation of micro-led lamp plate provided in an embodiment of the present invention；
Fig. 5 is the overlooking structure diagram of transparent insulating layer provided in an embodiment of the present invention；
Fig. 6 is the third structural representation of micro-led lamp plate provided in an embodiment of the present invention；
Fig. 7 is the overlooking structure diagram in the second reflecting layer provided in an embodiment of the present invention；
Fig. 8 is one of the structural schematic diagram of backlight module provided in an embodiment of the present invention；
Fig. 9 is the second structural representation of backlight module provided in an embodiment of the present invention；
Figure 10 is the structural schematic diagram of display device provided in an embodiment of the present invention；
Figure 11 is the flow chart of the production method of micro-led lamp plate provided in an embodiment of the present invention.
Specific embodiment
To make the objectives, technical solutions, and advantages of the present invention clearer, below in conjunction with attached drawing to the present invention make into
It is described in detail to one step, it is clear that described embodiments are only a part of the embodiments of the present invention, rather than whole implementation
Example.Based on the embodiments of the present invention, obtained by those of ordinary skill in the art without making creative efforts
All other embodiment, shall fall within the protection scope of the present invention.
Micro-led lamp plate, its production side of specific embodiment of the invention offer are provided with reference to the accompanying drawing
Method, backlight module and display device.
The embodiment of the present invention in a first aspect, a kind of micro-led lamp plate is provided, as shown in Figure 1, the miniature hair
Optical diode lamp plate includes: transparent substrate circuit board 11, the micro-led core being set on transparent substrate circuit board 11
Piece 12, and positioned at transparent substrate circuit board 11 away from the first reflecting layer 13 of micro-led 12 side of chip；Wherein,
First reflecting layer 13 is for reflecting incident ray to micro-led chip-side.
Above-mentioned micro-led lamp plate provided in an embodiment of the present invention uses transparent substrate circuit board, i.e. circuit board
Substrate is made of transparent material, is formed on transparent glass substrate or transparent flexible substrate for controlling miniature shine
The route and then micro-led chip is welded on transparent substrate circuit board that diode chip for backlight unit shines.It is miniature
The technique of light-emitting diode chip for backlight unit welding can use reflow soldering process, and deviate from miniature light-emitting diodes in transparent substrate circuit board
The first reflecting layer is arranged in the side of tube chip, can guarantee that first is anti-to avoid the destruction in reflow soldering process to the first reflecting layer
Penetrate layer reflection efficiency with higher.
Fig. 2 shows the beam projecting path of above-mentioned micro-led lamp plate provided in an embodiment of the present invention, such as Fig. 2
Shown, most of light a of micro-led chip 12 is emitted to the side away from transparent substrate circuit board 11, but still
There is fraction light b that can be emitted to the side of transparent substrate circuit board 11, due to using transparent substrates, this some light b can
To be incident on the first reflecting layer 13 through transparent substrate circuit board 11, the first reflecting layer 13 has reflex, can will enter
The light b penetrated is reflected, and reflection light b ' is again to micro-led chip 12 away from transparent substrate circuit board 11
Side outgoing, is thus utilized more emergent lights of light source, improves the utilization efficiency of light source.
In practical applications, micro-led lamp plate as backlight in use, in micro-led chip
12 are also possible that diffuser plate and/or quanta point material layer away from the side of transparent substrate circuit board 11.Diffuser plate can homogenize
The emergent ray of micro-led lamp plate, and generally use the micro-led chip of blue in white backlight field and swash
It sends out quanta point material and generates red light and green light, to form the technical solution of three primary colours light.And above-mentioned diffuser plate and quantum
It generally include scattering particles in point material layer, light can be scattered after being incident on scattering particles to a place direction, therefore micro-
The optical diaphragm of type light-emitting diode lamp-plate light emission side will also result in the loss that a part of light is emitted to lamp plate bottom side.And it uses
When above-mentioned micro-led lamp plate provided in an embodiment of the present invention, as shown in figure 3, micro-led chip 12 is big
Some light a1 is emitted to the side away from transparent substrate circuit board 11, but still has fraction light b1 can be to transparent substrate electricity
The side of road plate 11 is emitted, and due to using transparent substrates, this some light b1 can be incident through transparent substrate circuit board 11
Onto the first reflecting layer 13, the first reflecting layer 13 has reflex, incident light b1 can be reflected, reflection light
B1 ' is emitted to micro-led chip 12 away from the side of transparent substrate circuit board 11 again；Similarly, optical diaphragm makes
The most of light a2 and a3 obtained in incident ray is still emitted to the side away from transparent substrate circuit board 11, but still has small portion
Light splitter b2 and b3 can be emitted to transparent substrate circuit board, this some light b2 and b3 can enter through transparent substrate circuit board 11
It is mapped in the first reflecting layer 13, incident light b2 and the b3 reflection in the first reflecting layer 13, reflection light b2 ' and b3 ' support or oppose again
Side outgoing from transparent substrate circuit board 11.Thus it is utilized more emergent lights of light source, improves the utilization of light source
Efficiency.
In the specific implementation, above-mentioned first reflecting layer 13 can be white ink layer or reflector plate.White ink can be adopted
It is formed in the bottom surface of transparent substrates with the mode for coating or just spraying, in addition to this, can also be formed using other reflectorized materials
In the bottom surface of transparent substrates, for the reflection to light, it is not limited here.Reflector plate can be arranged directly on transparent substrates
Bottom surface, can also be with transparent substrates distance away, and the reflecting surface of reflector plate should be towards transparent substrate circuit board.
White ink scumbling can away from the surface of micro-led 12 side of chip in transparent substrate circuit board 11
To play the role of light reflection, and reflection efficiency is improved with the increase of the coating thickness of white ink, in the specific implementation
The thickness setting of white ink layer can be reached into preferable reflectivity in the range of 10-50 μm, reflected compared to setting
Plate, the thickness of white ink layer are only the 25% of reflecting plate hereinafter, micro-led lamp plate therefore can be effectively reduced
Integral thickness is conducive to the lightening of device.
In the specific implementation, as shown in figure 4, transparent substrate circuit board includes: transparent substrates 111, it is located at transparent substrates 111
On line layer 112, and covering line layer 112 transparent insulating layer 113；Wherein, the plan structure of transparent insulating layer 113 is such as
Shown in Fig. 5, transparent insulating layer 113 includes: and the one-to-one hollow-out parts h of the electrode of micro-led chip, the hollow out
Portion h is used to expose for welding the leg of micro-led chip electrode in line layer 112, transparent insulating layer 113
Other regions avoid line layer 112 from being destroyed for covering line layer 112.
Transparent substrates 111 can be made of materials such as glass, acrylics, can also use polyimides or polyester
The flexible materials such as film are made.The conductive metal layer of flood is formed on transparent substrates, such as can use metallic copper,
Route and the leg for welding micro-led chip are then formed by etching, covered on the route of formation
Transparent insulating layer 113 for protection circuit.Transparent substrate used by transparent substrate circuit board 11 is different, can be by transparent base
Material circuit board is divided into printed circuit board and flexible circuit board, in practical applications, can select according to demand rigid base material or
Flexible parent metal makes foregoing circuit plate, it is not limited here.
As shown in figure 5, also being wrapped other than the leg for welding micro-led chip 12 in line layer 112
The route being made of conducting wire interconnected is included, in order to enhance the resistance that heat dissipation reduces route itself, the width of conducting wire can be added
Width processing, and metal used by line layer does not have translucency, and light can be hindered to reach first instead through transparent substrate circuit board
Layer is penetrated, the first reflecting layer can not effectively reflect the emergent light of micro-led chip at this time.In view of this,
As shown in fig. 6, micro-led lamp plate provided in an embodiment of the present invention can also include: positioned at transparent substrate circuit board 11
Away from the second reflecting layer 14 of 13 1 side surface of the first reflecting layer；The top view in the second reflecting layer as shown in Figure 7, the second reflection
Layer 14 figure transparent substrate circuit board orthographic projection and micro-led chip 12 transparent substrate circuit board just
It projects non-overlapping.
Micro-led chip 12 and the second reflecting layer 14 are arranged at the surface of transparent substrate circuit board 11, miniature
Light-emitting diode chip for backlight unit 12 compared to light emitting diode for, no matter on encapsulating structure or size have large area.It passes
The size of the light emitting diode of system is larger, and is packaged again by that the structures such as lens can be arranged again in the outside of luminescence chip.
And it is micro-led, it is that chip is formed and then is transferred on circuit board to weld, size is generally less than 200
μm.Therefore it is required to rationally be arranged in the film layer of the ipsilateral setting of micro-led chip 12, in order to avoid cause to miniature hair
12 emergent light of luminous diode chip blocks.The embodiment of the present invention by the figure in the second reflecting layer 14 be arranged with it is miniature shine two
Pole pipe chip 12 does not overlap, and the thickness in the second reflecting layer 14 is less than the height of micro-led chip 12, avoids the
Micro-led 12 emergent light of chip is blocked in two reflecting layer 14, while can also be by micro-led 12 the bottom of to
The light of portion's outgoing is again to the lateral reflection for deviating from transparent substrate circuit board 11, to improve the utilization efficiency of light.
In the specific implementation, white ink layer can be used in above-mentioned second reflecting layer 14.It can be in transparent substrate circuit board 11
Upper setting mask plate, region of the hollow out figure alignment of mask plate in addition to micro-led chip 12, then mask plate
White ink is sprayed under exposure mask, to form the second reflecting layer 14 on transparent substrate circuit board 11.In order to avoid white ink
Layer blocking to micro-led chip 12, while can receive the emergent ray of micro-led chip again, it is white
The thickness of color ink layer is usually no more than 25 μm.The size of micro-led chip 12, therefore will be white in hundred micron dimensions
The setting of color ink layer will not influence micro-led chip 12 at 25 μm or less to away from 11 side of transparent substrate circuit board
Go out light, the outgoing in the larger range that micro-led chip 12 is emitted to transparent substrate circuit board 11 can also be received
Light, and by this dichroic reflection to improve light utilization efficiency.
The second aspect of the embodiment of the present invention provides a kind of backlight module, and as described in Figure 8, which includes: backboard
200 and any of the above-described micro-led lamp plate 100 for being arranged on backboard 200.The backlight module includes any of the above-described
Micro-led lamp plate, the principle solved the problems, such as is similar to above-mentioned micro-led lamp plate, the backlight module
Implementation may refer to the implementation of above-mentioned micro-led lamp plate, and overlaps will not be repeated.
In the specific implementation, blue light core can be used in the micro-led chip in above-mentioned micro-led lamp plate
Piece, the emergent light of micro-led chip are blue light；At this point, as shown in figure 9, backlight module further include: be located at miniature
The quantum dot layer 300 of 100 light emission side of light-emitting diode lamp-plate.It may include red quantum dot material and green in quantum dot layer 300
Color quanta point material, red quantum dot material generate red light under the excitation of blue light, and green quanta point material is in blue light
Excitation under generate green light, thus generate red, green, blue three primary colours light so that the emergent light of backlight module be white light.Miniature hair
The part of the emergent light of luminous diode chip and the oriented lamp plate bottom side outgoing of the emergent light of quanta point material, at lamp plate bottom
The first reflecting layer is arranged in portion, this some light can be emitted upwards again, thus improves the utilization efficiency of light source.
The third aspect of the embodiment of the present invention provides a kind of display device, and as shown in Figure 10, which includes above-mentioned
Any backlight module and the display panel 400 that backlight module light emission side is set.The display device can be liquid crystal display panel, liquid
Crystal display, LCD TV etc. show equipment, or the mobile terminals such as mobile phone, tablet computer, mobile photograph album.The display surface
Plate 400 can include: opposite and the array substrate 41 and opposite substrate 42 set, and be located at array substrate 41 and opposite substrate 42 it
Between liquid crystal layer 43.Backlight module light utilization ratio with higher can provide efficient backlight for display panel.Since this is aobvious
The principle that showing device solves the problems, such as is similar to above-mentioned backlight module, therefore the implementation of the display device may refer to above-mentioned display surface
The implementation of plate, overlaps will not be repeated.
The fourth aspect of the embodiment of the present invention provides a kind of production method of micro-led lamp plate, such as Figure 11 institute
Show, which may include:
S10, transparent substrate circuit board is formed；
S20, micro-led chip is welded on transparent substrate circuit board；
S30, the first reflecting layer is formed away from the side of micro-led chip in transparent substrate circuit board.
Micro-led chip generallys use reflow soldering process and is welded on circuit board, specifically, in transparent base
Tin cream is coated on the leg of material circuit board, then micro-led chip is transferred to the corresponding position on circuit board, it will be micro-
Type light-emitting diode chip for backlight unit and circuit board carry out high temperature reflux, so that tin cream melts, it can be by miniature hair after being reduced to temperature
Luminous diode chip is welded on circuit board.Above-mentioned production method provided in an embodiment of the present invention, in welding light-emitting diodes tube core
Re-form the first reflecting layer after piece, in this way can destruction to avoid Reflow Soldering hot environment to the first reflecting layer, guarantee first
Reflecting layer reflection efficiency with higher.Circuit board is formed using transparent substrates simultaneously, so that transparent substrate circuit board has thoroughly
Light property.Most of light of micro-led chip is emitted to the side away from transparent substrate circuit board, but still is had
Fraction light can be emitted to the side of transparent substrate circuit board, and due to using transparent substrates, this some light can be penetrated
Transparent substrate circuit board is incident on the first reflecting layer, and the first reflecting layer has reflex, incident light can be carried out
Reflection, reflection light are emitted to micro-led chip away from the side of transparent substrate circuit board again, thus make light source
More emergent lights can be utilized, improve the utilization efficiency of light source.
In the specific implementation, above-mentioned first reflecting layer can be using white ink layer or using reflector plate.Work as use
When white ink layer, above-mentioned step S30 be can specifically include:
White ink is coated away from the surface of the side of micro-led chip in transparent substrate circuit board.
When the first reflecting layer uses reflector plate, above-mentioned step S30 be can specifically include:
Reflector plate is set away from the side of micro-led chip in transparent substrate circuit board.
In practical applications, it can according to need and the first reflecting layer formed using above two either type, do not do herein
It limits.When require lamp plate integral thickness it is smaller when, can preferentially select in transparent substrate circuit board away from micro-led
The embodiment that the surface of chip-side forms white ink layer.
Lead to line layer overlay area in transparent substrate circuit board when the route in transparent substrate circuit board is complex
When larger, the light transmittance of transparent substrate circuit board can be reduced, then the light of each bottom outlet micro-led at this time is not
The first reflecting layer can be effectively reached, this problem is faced, above-mentioned production method provided in an embodiment of the present invention can also include:
The second reflecting layer is formed away from the surface of the first reflecting layer side in transparent substrate circuit board.
Wherein, the figure in the second reflecting layer transparent substrate circuit board orthographic projection with micro-led chip saturating
The orthographic projection of bright baseboard is non-overlapping；The thickness in the second reflecting layer is less than the height of micro-led chip.
The figure in the second reflecting layer is arranged not overlapping with micro-led chip, and the thickness in the second reflecting layer
It, can be transparent to deviating to micro-led chip to avoid the second reflecting layer less than the height of micro-led chip
Substrate circuit plate side emergent light blocks, while the micro-led light to bottom outlet can also be supported or opposed again
A lateral reflection from transparent substrate circuit board, to improve the utilization efficiency of light.
Since above-mentioned second reflecting layer requires thickness smaller, the conduct of white ink layer can be used in the specific implementation
Above-mentioned second reflecting layer.Then above-mentioned step specifically includes: deviating from the surface of the first reflecting layer side in transparent substrate circuit board
Spray white ink layer.And the thickness of white ink layer can be less than 25 μm.
Micro-led lamp plate, its production method, backlight module and display device provided in an embodiment of the present invention, packet
It includes: transparent substrate circuit board, the micro-led chip being set on transparent substrate circuit board, and it is located at transparent substrate
Circuit board deviates from the first reflecting layer of micro-led chip-side；First reflecting layer is used for incident ray to miniature hair
One lateral reflection of luminous diode chip.In transparent substrate circuit board away from the first reflection of the side of micro-led chip setting
Layer can guarantee that the first reflecting layer has to avoid the destruction in micro-led chip bonding process to the first reflecting layer
Higher reflection efficiency.Most of light of micro-led chip is emitted to the side away from transparent substrate circuit board,
But still have fraction light that can be emitted to the side of transparent substrate circuit board, due to using transparent substrates, this some light
It can be incident on the first reflecting layer through transparent substrate circuit board, the first reflecting layer has reflex, can be by incidence
Light is reflected, and reflection light is emitted to micro-led chip away from the side of transparent substrate circuit board again, by
This is utilized more emergent lights of light source, improves the utilization efficiency of light source.
Although preferred embodiments of the present invention have been described, it is created once a person skilled in the art knows basic
Property concept, then additional changes and modifications may be made to these embodiments.So it includes excellent that the following claims are intended to be interpreted as
It selects embodiment and falls into all change and modification of the scope of the invention.
Obviously, various changes and modifications can be made to the invention without departing from essence of the invention by those skilled in the art
Mind and range.In this way, if these modifications and changes of the present invention belongs to the range of the claims in the present invention and its equivalent technologies
Within, then the present invention is also intended to include these modifications and variations.
Claims (10)
1. a kind of micro-led lamp plate characterized by comprising transparent substrate circuit board is set to the transparent base
Micro-led chip on material circuit board, and be located at the transparent substrate circuit board and deviate from the miniature light-emitting diodes
First reflecting layer of tube chip side；
First reflecting layer is used to reflect incident ray to the micro-led chip-side.
2. micro-led lamp plate as described in claim 1, which is characterized in that first reflecting layer is white ink
Layer or reflector plate.
3. micro-led lamp plate as claimed in claim 2, which is characterized in that the white ink with a thickness of 10-
50μm。
4. micro-led lamp plate as described in claim 1, which is characterized in that the transparent substrate circuit board includes:
Transparent substrates, the line layer in the transparent substrates, and the transparent insulating layer of the covering line layer；
The transparent insulating layer includes: the one-to-one hollow-out parts of electrode with the micro-led chip.
5. micro-led lamp plate as claimed in claim 4, which is characterized in that the transparent substrate circuit board is printing
Circuit board or flexible circuit board.
6. micro-led lamp plate as described in any one in claim 1-5, which is characterized in that further include: it is located at described
Transparent substrate circuit board deviates from the second reflecting layer of one side surface of the first reflecting layer；
Orthographic projection and the micro-led chip of the figure in second reflecting layer in the transparent substrate circuit board
It is non-overlapping in the orthographic projection of the transparent substrate circuit board；The thickness in second reflecting layer is less than the miniature light-emitting diodes
The height of tube chip.
7. micro-led lamp plate as claimed in claim 6, which is characterized in that second reflecting layer is white ink
Layer.
8. micro-led lamp plate as claimed in claim 7, which is characterized in that the thickness of the white ink layer does not surpass
Cross 25 μm.
9. a kind of backlight module characterized by comprising backboard and be arranged on the backboard as claim 1-8 appoint
Micro-led lamp plate described in one.
10. a kind of display device, which is characterized in that including backlight module as claimed in claim 9 and be arranged in the back
The display panel of optical mode group light emission side.
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| CN201910636337.4A CN110398857A (en) | 2019-07-15 | 2019-07-15 | Micro-led lamp plate, its production method, backlight module and display device |
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| CN201910636337.4A CN110398857A (en) | 2019-07-15 | 2019-07-15 | Micro-led lamp plate, its production method, backlight module and display device |
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| CN201910636337.4A Pending CN110398857A (en) | 2019-07-15 | 2019-07-15 | Micro-led lamp plate, its production method, backlight module and display device |
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