WO2022088590A1

WO2022088590A1 - Display device

Info

Publication number: WO2022088590A1
Application number: PCT/CN2021/081681
Authority: WO
Inventors: 李富琳; 张楠楠
Original assignee: 海信视像科技股份有限公司
Priority date: 2020-10-29
Filing date: 2021-03-19
Publication date: 2022-05-05

Abstract

A display device, comprising a display panel (200) and a backlight module (100), the backlight module (100) comprising a backplane (11), a plurality of lamp panels (12) and a plurality of reflector plates (13), wherein a first joining seam (S1) between two adjacent lamp panels (12) and a second joining seam (S2) between two adjacent reflector plates (13) are not overlapped with each other; and the second joining seams (S2) of the reflector plates (13) are arranged on reflective layers (123) on the upper surfaces of the lamp panels (12) and are staggered with the first joining seams (S1) between the lamp panels (12). The reflective layers (123) can reflect light, such that when light emitted by the lamp panels (12) passes through the second joining seams (S2) of the reflector plates (13), the light is reflected by the reflective layers (123) for reuse, so as to prevent the formation of shadows, improve the light-emitting efficiency of backlight, and improve the display effect of the display device.

Description

a display device

Cross-reference to related applications

This application is required to be submitted to the China Patent Office on November 30, 2020, with the application number of 202022825588.8, and the application name is "a display device" and submitted to the China Patent Office on October 29, 2020, with the application number of 202011182703.2 and the application name of " The priority of the Chinese patent application for a display device", the entire contents of which are incorporated herein by reference.

technical field

The present application relates to the field of display technology, and in particular, to a display device.

Background technique

As the current mainstream display, liquid crystal displays have the advantages of low power consumption, small size, and low radiation. The liquid crystal display panel is a non-self-luminous panel and needs to be used with a backlight module to form a display device.

The backlight module includes a light source. In the related art, the backlight source is usually in the form of a light bar. A plurality of LED lights are arranged on the light bar. A display device includes a plurality of light bars, and the light bars are arranged at intervals. With the continuous improvement of the requirements for display image quality of display devices and the continuous development of semiconductor technology, backlight sources are presented in the form of lamp panels, and how to assemble the lamp panels in the display device is a technical problem that needs to be solved.

SUMMARY OF THE INVENTION

In some embodiments of the present application, the display device includes a display panel and a backlight module, and the backlight module includes: a backplane, a plurality of lamp panels, and a plurality of reflective sheets, and a first splicing seam between two adjacent lamp panels is The second splicing seam between two adjacent reflective sheets does not overlap with each other, the second splicing seam of the reflective sheet falls on the reflective layer on the surface of the lamp panel, and is staggered from the first splicing seam between the lamp panels, reflecting light. The reflective layer has the property of reflecting light, so when the light emitted by the lamp board passes through the second seam of the reflective sheet, the light is reflected and reused by the reflective layer to avoid dark shadows, improve the light extraction efficiency of the backlight, and improve the display of the display device. Effect.

In some embodiments of the present application, the light board is a miniature light-emitting diode, and the miniature light-emitting diode light board includes: a circuit board, a miniature light-emitting diode, a reflective layer and an encapsulation layer; a reflective layer with reflective properties is coated on the surface of the circuit board, which reflects light. The layer is an insulating protective layer, which has the function of protecting the circuit board. The reflective layer exposes the positions of the pads used for soldering the miniature light-emitting diodes through etching and other processes to form openings for exposing the miniature light-emitting diodes.

In some embodiments of the present application, the material used for the reflective layer is white ink, and the reflectivity of the white ink is greater than or equal to 85%.

In some embodiments of the present application, the reflectivity of the reflective sheet is greater than or equal to 94%, and the light emitted by the miniature light-emitting diodes toward the backplane side, or the light reflected back to the backplane side by the components in the backlight module, can be highly reflective. The high-efficiency reflective sheet is re-reflected to the light-emitting side, thereby improving the utilization efficiency of the light source.

In some embodiments of the present application, the width of the reflective sheet in at least one of the first direction and the second direction is greater than the width of the miniature light-emitting diode lamp panel, which can ensure that the first seam and the second seam do not overlap each other , and reduce the number of second seams as much as possible, and set a smaller number of reflective sheets.

In some embodiments of the present application, the width of the reflective sheet in the first direction is greater than the width of the miniature LED lamp panel in the first direction, and the width of the reflective sheet in the second direction is equal to the width of the miniature LED lamp panel in the second direction In this way, the second seam of the reflective sheet arranged in the first direction can be staggered from the first seam of the micro LED light board arranged in the first direction. At this time, the light emitted by the miniature LED passes through the reflective sheet. When the second seam is formed, the light is reflected and reused by the reflective layer, so as to avoid dark shadows, improve the light output efficiency of the backlight, and improve the display effect of the display device.

In some embodiments of the present application, when applied to a small display device, the backlight module includes three miniature light-emitting diode lamp panels, and the three miniature light-emitting diode lamp panels are arranged along the first direction. Then, two reflective sheets may be provided, and the reflective sheet The width in the first direction is 1.5 times the width of the miniature light-emitting diode lamp board in the first direction, so that the size of the two reflective sheets is the same as the size of the three miniature light-emitting diode lamp boards.

In some embodiments of the present application, the width of the reflective sheet in the first direction is greater than the width of the miniature LED lamp panel in the first direction, and the width of the reflective sheet in the second direction is the same as the width of the miniature LED lamp panel in the second direction different widths. In this way, it can be ensured to the greatest extent that the first joints in the first direction and the second direction are completely blocked by the reflective sheet, and the second joints arranged in the first direction and the miniature light-emitting diode lamp board are in the first direction. The first stitching seams arranged are staggered, the second stitching seams arranged in the second direction of the reflective sheet are staggered with the first stitching seams arranged in the second direction of the miniature light-emitting diode lamp board, and the light emitted by the miniature light-emitting diodes at this time is staggered. When passing through the second seam of the reflective sheet, the light is reflected and reused by the reflective layer to avoid dark shadows, maximize the light output efficiency of the backlight, and improve the display effect of the display device.

In some embodiments of the present application, the number of reflective sheets is less than the number of miniature light-emitting diode lamp panels, and this arrangement can reduce the number of second seams, so that more light is reflected by the reflective sheets with high reflectivity, and the light output of the backlight is improved. efficiency, thereby improving the display effect of the display device.

In some embodiments of the present application, the size of the miniature light-emitting diode is less than 500 μm, which is beneficial to control the dynamic light emission of the backlight module to a smaller partition, which can realize more refined dynamic control and improve the dynamic contrast of the display device.

Description of drawings

In order to illustrate the technical solutions of the embodiments of the present application more clearly, the following briefly introduces the drawings that need to be used in the embodiments of the present application. Obviously, the drawings introduced below are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained from these drawings without any creative effort.

1 is a schematic cross-sectional structure diagram of a display device provided by an embodiment of the present application;

2 is a schematic cross-sectional structure diagram of a backlight module provided by an embodiment of the present application;

3 is a schematic cross-sectional structure diagram of a backlight module in the prior art;

4 is a partial top view of a backlight module in the prior art;

5 is one of the partial top views of the backlight module provided by the embodiment of the present application;

FIG. 6 is the second partial top view of the backlight module provided by the embodiment of the present application;

FIG. 7 is a schematic structural diagram of a miniature light-emitting diode provided by an embodiment of the present application;

8 is one of the schematic cross-sectional structural diagrams of the backlight module provided by the embodiment of the present application;

9 is a schematic diagram of the relationship between the reflectivity and the thickness of the white ink provided by the embodiment of the application;

10 is a schematic diagram of light rays of a backlight module provided by an embodiment of the application;

FIG. 11 is a schematic top-view structure diagram of a miniature light-emitting diode lamp panel provided by an embodiment of the present application;

FIG. 12 is a partial enlarged view of the micro light-emitting diode part in FIG. 11 .

Among them, 100-backlight module, 200-display panel, 11-backplane, 12-miniature light-emitting diode lamp board, 13-reflector, 14-diffusion plate, 15-optical film, 16-diffusion plate bracket, 121- Circuit board, 122-miniature light-emitting diode, 123-reflective layer, 124-encapsulation layer, S1-first seam, S2-second seam.

Detailed ways

In order to make the above objects, features and advantages of the present application more clearly understood, the present application will be further described below with reference to the accompanying drawings and embodiments. Example embodiments, however, can be embodied in various forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this application will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their repeated descriptions will be omitted. The words expressing position and direction described in this application are all described by taking the accompanying drawings as an example, but changes can also be made according to needs, and the changes are all included in the protection scope of this application. The drawings in the present application are only used to illustrate the relative positional relationship and do not represent the actual scale.

The liquid crystal display device is mainly composed of a backlight module and a liquid crystal display panel. The liquid crystal display panel itself does not emit light, and needs to rely on the light source provided by the backlight module to achieve brightness display.

The imaging principle of the liquid crystal display device is to place the liquid crystal between two pieces of conductive glass, driven by the electric field between the two electrodes, to cause the electric field effect of the liquid crystal molecules to twist, so as to control the transmission or shielding function of the backlight source, so as to display the image. come out. If a color filter is added, color images can be displayed.

FIG. 1 is a schematic cross-sectional structure diagram of a display device provided by an embodiment of the present application.

Referring to FIG. 1 , the display device includes: a backlight module 100 and a display panel 200 .

The display panel 200 is located on the light-emitting side of the backlight module 100, and the shape and size of the display panel are usually matched with the backlight module. Usually, the display panel 200 can be set to a rectangle, including the sky side, the ground side, the left side and the right side, The sky side is opposite to the ground side, the left side is opposite to the right side, the sky side is connected to one end of the left side and one side of the right side respectively, and the ground side is connected to the other end of the left side and the other end of the right side respectively.

The display panel 200 is a transmissive display panel, which can modulate the transmittance of light, but does not emit light itself. The display panel 200 has a plurality of pixel units arranged in an array, and each pixel unit can independently control the light transmittance and color of the backlight module 100 incident on the pixel unit, so that the light transmitted by all the pixel units is composed of displayed image.

The backlight module 100 is usually located at the bottom of the display device, and its shape and size are adapted to the shape and size of the display device. When applied to fields such as televisions or mobile terminals, the backlight module usually adopts a rectangular shape.

The backlight module in the embodiment of the present application adopts a direct-type backlight module, which is used for uniformly emitting light in the entire light-emitting surface to provide the display panel with light with sufficient brightness and uniform distribution, so that the display panel can display images normally.

FIG. 2 is a schematic cross-sectional structure diagram of a backlight module provided by an embodiment of the present application.

Referring to FIG. 2 , the backlight module includes: a backplane 11 , a miniature light-emitting diode lamp board 12 , a reflection sheet 13 , a diffuser plate 14 , an optical film 15 and a diffuser plate bracket 16 .

In the embodiment of the present application, the light board is a miniature light emitting diode light board, but it is not limited thereto, and other light boards with similar structures and similar problems also fall into the protection scope of the present application.

Micro light-emitting diodes as backlights have become a current hot spot in liquid crystal display technology, and the size of chips used in micro light-emitting diodes is in the micrometer level.

The miniature light-emitting diode light board can be formed by POB and COB. POB is package on board, which means that after the LED chip is packaged (the size of the pad is large), it is attached to the circuit board; COB is chip on board, which means that the LED chip is directly attached to the circuit board.

Both of the above two patching methods are suitable for the miniature light emitting diode lamp board in this application.

The following is an introduction to the structure formed by the miniature light-emitting diode lamp board in the form of COB packaging.

In some example embodiments, the miniature light emitting diode light board 12 is embodied as a miniLED light board.

The back plate 11 is located at the bottom of the backlight module and has the function of supporting and bearing. The backplane 11 is usually a rectangular structure, and when applied to a special-shaped display device, its shape is adapted to the shape of the display device. The back panel 11 includes a sky side, a ground side, a left side and a right side. The sky side is opposite to the ground side, the left side is opposite to the right side, the sky side is connected to one end of the left side and one side of the right side respectively, and the ground side is connected to the other end of the left side and the other end of the right side respectively.

The material of the back plate 11 is aluminum, iron, aluminum alloy or iron alloy. The back plate 11 is used for fixing the micro LED light board 12 and supporting and fixing the edge positions of the reflective sheet 13 , the diffuser plate 14 and the optical film 15 and other components.

In the embodiment of the present application, the backlight module is a direct type backlight module, and a miniature light-emitting diode lamp board 12 is used as a backlight source. The miniature light-emitting diode light panel 12 is located on the back panel 11 .

In general, the miniature light-emitting diode light panel 12 can be square or rectangular as a whole. The miniature light-emitting diode light board 12 includes many miniature light-emitting diode light sources. Due to the limitation of the range of the die-bonding machine, and the size of the circuit board is too large, there will be many problems such as serious sheet expansion and shrinkage, and low pad accuracy. The size should not be too large. When applied to a large-sized display device, a plurality of miniature light-emitting diode lamp panels 12 are usually spliced with each other to provide backlight.

According to the size of the display device, a plurality of miniature light-emitting diode light boards 12 can be provided. For example, a 75-inch TV can use 2*8 miniature light-emitting diode light boards 12 to provide backlight together by splicing. The seam between the miniature light-emitting diode lamp boards 12 is the first seam S1.

Specifically, referring to FIG. 2 , the miniature light-emitting diode light board 12 specifically includes: a circuit board 121 , a miniature light-emitting diode 122 , a reflective layer 123 and an encapsulation layer 124 .

The circuit board 121 is located on the backplane 11 , and the shape of the circuit board 121 is the same as the overall shape of the miniature LED light board 12 . Under normal circumstances, the circuit board 121 is in the shape of a plate, and the whole is rectangular or square.

The circuit board 121 is used to provide driving electrical signals for the miniature light-emitting diodes 122 . The miniature light-emitting diode 122 and the circuit board 121 are separately fabricated. The surface of the circuit board 121 includes a plurality of pads for soldering the miniature light-emitting diode 122. The miniature light-emitting diode 122 is transferred to the pad after the fabrication is completed. The micro LED 122 is soldered on the circuit board 121 , so that the micro LED 122 can be driven to emit light through the input signal of the control circuit board 121 .

In the embodiment of the present application, the circuit board 121 may be a printed circuit board (Printed Circuit Board, PCB for short), the PCB includes a substrate and a conductive layer, the conductive layer is electroplated on the substrate with a conductive material, and then lines are etched to form circuits as required , the material of the conductive layer can be copper.

The substrate of the circuit board 121 may be made of materials such as FR4, aluminum-based or glass. Alternatively, the substrate or base substrate of the circuit board 121 may be made of a flexible material to form a flexible display device.

Micro LEDs 122 are located on the circuit board. The electrodes of the miniature light-emitting diodes 122 are soldered on the exposed pads of the circuit board 121 to realize electrical connection therebetween.

The micro light emitting diode 122 is different from the common light emitting diode, and specifically refers to a micro light emitting diode chip. Since the size of the micro light emitting diode 122 is small, it is beneficial to control the dynamic light emission of the backlight module to a smaller partition, which can realize more refined dynamic control and improve the dynamic contrast ratio of the display device. In the embodiment of the present application, the size of the micro light-emitting diode 122 is below 500 μm.

The micro LED light board 12 may only include micro LEDs 122 of one color, or may include micro LEDs 122 of multiple colors, which is not limited herein.

The reflective layer 123 is located on the surface of the circuit board 121 on the side close to the miniature light-emitting diodes 122 , and is an insulating protective layer, which has the function of protecting the circuit board. In the embodiment of the present application, the reflective layer 123 is coated on the surface of the circuit board 121 by using a material with reflective properties, and then the positions of the pads for soldering the miniature light-emitting diodes 122 are exposed through etching and other processes to form Openings for exposing the micro LEDs 122 .

In the embodiment of the present application, the material used for the reflective layer 123 is white ink with the property of reflecting light, and the reflectivity of the white ink is greater than or equal to 85%, which is not limited herein.

The encapsulation layer 124 is a protective glue covering the surface of the micro LED 122 on the side away from the circuit board 121 . The encapsulation layer 124 is used to encapsulate and protect the micro light emitting diode 122 , and prevent foreign matter from entering the interior of the micro light emitting diode 122 . In the embodiment of the present application, the encapsulation layer 124 may be made of a transparent colloidal material, such as silica gel, modified silica gel, or epoxy resin with better permeability.

In the embodiment of the present application, the encapsulation layer 124 can be fabricated by whole-layer coating, strip coating, and spot-coating, wherein the encapsulation layer 124 is fabricated by the whole-layer coating method, and the fabrication process is simple, because the encapsulation layer 124 is a transparent protective glue , the light can still pass through the encapsulation layer 124 to reach the reflective layer 123 when the whole layer is coated, and the reflective layer 123 reflects the light. The encapsulation layer 124 can also be fabricated by strip coating and spot coating, wherein the fabrication by spot coating can save packaging material and reduce costs.

The reflective sheet 13 is located on the miniature light-emitting diode lamp panel 12, and is usually set in a rectangular or square shape. The reflectivity of the reflection sheet 13 provided in the embodiment of the present application is greater than or equal to 94%. Since metal has a high reflection rate, the reflection sheet 13 can be made of a metal material. For example, it is made of one or any alloy of silver, magnesium, aluminum, platinum, and copper.

The reflective sheet 13 includes a plurality of openings for exposing the micro LEDs 122 . The reflective sheet 13 is arranged on the miniature light-emitting diode light plate 12, so that each miniature light-emitting diode can be exposed, so as to ensure that the miniature light-emitting diodes can emit light smoothly. The reflective sheet 13 has the property of reflecting light, so the light emitted by the micro light emitting diodes to the side of the back panel 11, or the light reflected back to the side of the back panel by the components in the backlight module, can be redirected by the reflective sheet 13 to the side of the back panel. One side is reflected, thereby improving the utilization efficiency of the light source.

Due to the large number of holes required for the reflective sheet, the process is more complicated than that of the ordinary LED backlight reflective sheet. Therefore, when it is applied to a large-size display device, it is not possible to use the method of attaching a whole reflective sheet. In the embodiment of the present application, the reflective sheet 13 The size is processed according to the size of the miniature light-emitting diode lamp board 12, and a plurality of reflective sheets 13 are arranged on the miniature light-emitting diode lamp board 12 by splicing, and the splicing seam between two adjacent reflective sheets 13 is the second Seam S2.

The diffuser plate 14 is located on the light-emitting side of the micro-LED light board 12 and has a certain distance from the reflector 13 . The shape of the diffuser plate 14 is the same as that of the micro-LED light board 12 . In general, the diffuser plate 14 can be arranged in a rectangular or square shape.

The function of the diffuser plate 14 is to scatter the incident light, so that the light passing through the diffuser plate 14 is more uniform. The diffuser plate 14 is provided with a scattering particle material, and the light incident on the scattering particle material will be continuously refracted and reflected, so as to achieve the effect of scattering the light and realize the effect of uniform light.

The diffuser plate 14 has higher haze and better uniformity effect, and can usually be processed by extrusion process. At least one of polypropylene PP.

The optical film 15 is located on the side of the diffuser plate 14 away from the reflection sheet 13 . The optical film 15 is arranged in a whole layer, and its shape is the same as that of the miniature light-emitting diode light board 12 , and can be generally set as a rectangle or a square.

The arrangement of the optical film 15 can make the backlight module adapt to various practical applications.

In the embodiment of the present application, the miniature light-emitting diodes in the miniature light-emitting diode light board 12 can be blue-light miniature light-emitting diodes, and the optical film 15 includes a color conversion layer such as a quantum dot layer or a fluorescent layer.

The quantum dot layer includes a red quantum dot material and a green quantum dot material, the red quantum dot material emits red light under the excitation of blue light, the green quantum dot material emits green light under the excitation of blue light, and the stimulated emission of red light, The green light and the transmitted blue light are mixed into white light and emitted.

The fluorescent layer includes fluorescent materials that stimulate emission of red light and stimulated emission of green light, and the stimulated emission of red light, green light and transmitted blue light is mixed into white light for output.

Besides, the optical film 15 may also include a prism sheet, and the prism sheet can change the exit angle of light, thereby changing the viewing angle of the display device.

The optical film 15 may also include a reflective polarizer. As a kind of brightening film, the reflective polarizer can improve the brightness of the backlight module, improve the utilization efficiency of light, and at the same time make the outgoing light have the property of polarization. Use of polarizers.

The diffuser plate 14 needs to cover all the areas where the micro LED light panels 12 are located, and its size is relatively large, which is prone to collapse and warping deformation, which deteriorates the optical characteristics of the backlight module and even damages the micro LEDs 122. A diffuser plate bracket 16 is disposed between the reflection sheet 13 and the diffuser plate 14 for supporting the diffuser plate 14 .

The material used for the diffuser plate bracket 16 is generally polycarbonate PC.

During specific implementation, the shape of the diffuser plate support 16 may be simple in shape, such as triangle, trapezoid, cone, etc., which is not limited herein.

FIG. 3 is a schematic cross-sectional structure diagram of a backlight module in the prior art. FIG. 4 is a partial top view of a backlight module in the prior art.

Referring to FIGS. 3 and 4 , in the prior art, the shape of the reflector 13 is the same as that of the miniature light-emitting diode lamp panel 12 , and the reflector 13 is disposed on the micro-LED lamp panel 12 by splicing. The first splicing seam S1 between the two adjacent miniature light-emitting diode lamp panels 12 overlaps with the second splicing seam S2 between the two adjacent reflective sheets 13. Such a design method will cause the backlight module The position of the second seam S2 of the reflective sheet 13 is also the position of the first seam S1 of the miniature light-emitting diode lamp panel 12. The light cannot be re-reflected and reused, and dark lines appear, resulting in uneven brightness in the display area of the backlight module. Thus, the display effect of the display device is affected.

In view of this, as shown in FIG. 2 , in the display device provided by the embodiment of the present application, in the direction perpendicular to the back plate 11 , the first splicing seam S1 and the second splicing seam S2 are arranged not to overlap each other. The second splicing seam S2 of the reflective sheet 13 falls on the reflective layer 123 on the upper surface of the miniature light-emitting diode lamp panel 12, and is staggered from the first splicing seam S1 between the miniature light-emitting diode lamp panels 12. Therefore, when the light emitted by the micro LEDs 122 passes through the second seam S2 of the reflective sheet 13, the light is reflected by the reflective layer 123 and reused to avoid dark shadows, improve the light extraction efficiency of the backlight, and improve the display of the display device. Effect.

FIG. 5 is one of partial top views of the backlight module provided by the embodiment of the present application.

Referring to FIG. 5 , in the backlight module provided by the embodiment of the present application, the miniature light-emitting diode lamp panel 12 and the reflective sheet 13 both include side edges extending along the first direction x and the second direction y, the first direction x and the second direction y In order to ensure that the first seam S1 and the second seam S2 do not overlap each other, and to reduce the number of the second seam S2 as much as possible (set a smaller number of reflective sheets 13), in the embodiment of the present application Among them, the width of the reflection sheet 13 in at least one of the first direction x and the second direction y is greater than the width of the miniature light emitting diode lamp panel 12 .

As shown in FIG. 5 , the width of the reflective sheet 13 in the first direction x is greater than the width of the micro LED lamp panel 12 in the first direction x, and the width of the reflective sheet 13 in the second direction y is equal to the width of the micro LED lamp panel The width of 12 in the second direction y, so as to ensure that the second seam S2 of the reflective sheet 13 arranged in the first direction x is staggered from the first seam S1 of the miniature light-emitting diode lamp board 12 arranged in the first direction x At this time, when the light emitted by the micro LEDs 122 passes through the second seam S2 of the reflective sheet 13, the light is reflected by the reflective layer 123 and reused to avoid dark shadows, improve the light extraction efficiency of the backlight, and improve the display effect of the display device.

Referring to FIG. 5 , the backlight module provided by the embodiment of the present application can be applied to a small display device. The backlight module includes three miniature light-emitting diode lamp panels 12 , and the three miniature light-emitting diode lamp panels 12 are arranged along the first direction x, then , two reflective sheets 13 can be provided. Specifically, the width of the reflective sheet 13 in the first direction x is 1.5 times the width of the miniature light-emitting diode lamp board 12 in the first direction x, so that the two reflective sheets 13 The size is the same as that of the three miniature LED light panels 12 .

FIG. 6 is the second partial top view of the backlight module provided by the embodiment of the present application.

Referring to FIG. 6 , in the backlight module provided by the embodiment of the present application, the width of the reflection sheet 13 in the first direction x is greater than the width of the miniature light-emitting diode lamp board 12 in the first direction x, and the reflection sheet 13 in the second direction y The width of y is different from the width of the miniature light-emitting diode lamp panel 12 in the second direction y. In this way, it can be ensured to the greatest extent that the first seam S1 in the first direction x and the second direction y is completely blocked by the reflection sheet 13, and the second seam S2 of the reflection sheet 13 arranged in the first direction x and the micro-luminescence The first splicing seam S1 of the diode light board 12 arranged in the first direction x is staggered, the second splicing seam S2 of the reflective sheet 13 arranged in the second direction y and the second splicing seam S2 of the micro LED lamp board 12 arranged in the second direction y. The first seam S1 is staggered. At this time, when the light emitted by the micro LEDs 122 passes through the second seam S2 of the reflective sheet 13, the light is reflected by the reflective layer 123 and reused to avoid dark shadows and maximize the light output of the backlight. efficiency and improve the display effect of the display device.

Comparing FIG. 5 and FIG. 6 , the backlight module shown in FIG. 6 can be applied to a large-sized display device, and the miniature light-emitting diode lamp panels 12 are arranged in an array in the first direction x and the second direction y. Then the miniature light-emitting diode light board 12 will produce the first seam S1 in both the first direction x and the second direction y. As shown in FIG. 6 , the width of the reflective sheet 13 in the first direction x may be larger than the size of the micro LED light panel 12 , and the width of the reflective sheet in the second direction y is smaller than the width of the micro LED light panel 12 .

The number of the reflective sheets 13 provided in the embodiment of the present application is less than the number of the miniature light-emitting diode lamp boards 12, so the setting can reduce the number of the second splicing seams S2, so that more light is reflected by the reflective sheets 13 with high reflectivity, improving the The light extraction efficiency of the backlight is improved, thereby improving the display effect of the display device.

Among them, each reflecting sheet 13 has the same size and specification, and does not need to be processed by multiple molds, which can reduce the cost.

The structure of the miniature light-emitting diode lamp board in the form of POB packaging is introduced below.

The miniature LED light board includes a circuit board and miniature LEDs 122' on the circuit board. The miniature light-emitting diode 122 ′ is a device encapsulated with a miniature light-emitting diode chip 1221 ′, and the specific structure is shown in FIG. 7 .

As shown in FIG. 7 , the micro LED chip 122 ′ includes a micro LED chip 1221 ′ and a household packaging bracket 1222 ′, and the micro LED chip 1221 ′ is placed at the bottom of the packaging bracket 1222 ′.

In order to further reduce the OD value, the miniature light-emitting diode 122' further includes a top shielding layer 1223' on the light-emitting side of the miniature light-emitting diode chip 1221'.

Specifically, the top shielding layer 1223' is formed by mixing scattering particles such as titanium dioxide in the glue. The existence of the top shielding layer 1223' can increase the light emitting angle of the micro LED chip 1221'. Under the condition that the number and spacing of the micro light-emitting diodes 122' remain unchanged, the irradiation range of the micro-light-emitting diodes 122' can be increased, and the OD value can be further reduced.

In the above solution, since there is no reflective sheet at the opening position of the reflective sheet, the light reflected by the components in the backlight module back to the opening cannot be reflected well, so that the position of the reflective sheet and the position of the opening are not well reflected. The reflectivity of the backlight is inconsistent, resulting in a relatively low light output efficiency of the backlight module.

In this regard, the present application also provides a backlight module structure.

FIG. 8 is one of a schematic cross-sectional structure diagram of a backlight module provided by an embodiment of the present application.

8 , the backlight module includes: a backplane 21 , a miniature light-emitting diode lamp board 22 , a reflection sheet 23 , a first reflection layer 26 , a diffuser plate 24 and an optical film 25 .

The back plate 21 is located at the bottom of the backlight module and has the function of supporting and bearing. The back plate 21 is usually a rectangular structure, and when applied to a special-shaped display device, its shape is adapted to the shape of the display device. The back panel 21 includes a sky side, a ground side, a left side and a right side. The sky side is opposite to the ground side, the left side is opposite to the right side, the sky side is connected to one end of the left side and one side of the right side respectively, and the ground side is connected to the other end of the left side and the other end of the right side respectively.

The material of the back plate 21 is aluminum, iron, aluminum alloy or iron alloy. The back plate 21 is used to fix the micro LED light board 22 and support and fix the edge positions of the reflective sheet 23 , the diffuser plate 24 and the optical film 25 and other components.

In the embodiment of the present application, the backlight module is a direct type backlight module, and the miniature light-emitting diode lamp panel 22 is located on the back panel 21 . Generally, the miniature light-emitting diode light panel 22 can be square or rectangular as a whole, and when applied to a special-shaped display device, its shape and size are adapted to the shape and size of the display device.

According to the size of the display device, a plurality of miniature light-emitting diode lamp panels 22 can be provided, and the micro-LED lamp panels 22 are jointly provided with backlight by splicing. In order to avoid the optical problem caused by the splicing of the miniature light-emitting diode lamp panels 22, the seams between the adjacent miniature light-emitting diode lamp panels 22 should be as small as possible, and even seamless splicing can be achieved.

The miniature LEDs in the miniature LED light panel 22 are used as a backlight source, and have a smaller size than traditional LEDs, which can achieve more refined dynamic control and improve the dynamic contrast of the display device.

The reflective sheet 23 is located on the miniature light-emitting diode lamp board 22, and has the same shape as the miniature light-emitting diode lamp board 22, and is usually set in a rectangular or square shape. Since metal has a high reflectivity, in this embodiment of the present application, a metal material can be used to make the reflective sheet 23 . For example, it is made of one or any alloy of silver, magnesium, aluminum, platinum, and copper.

The reflection sheet 23 includes a plurality of first openings S10 for exposing the micro light emitting diodes 222 . The reflective sheet 23 is arranged on the miniature light-emitting diode light board 22, so that each miniature light-emitting diode can be exposed, so as to ensure that the miniature light-emitting diodes can emit light smoothly. The reflective sheet 23 has the property of reflecting light, so the light emitted by the miniature light-emitting diodes to the side of the backplane 21, or the light reflected back to the side of the backplane by the components in the backlight module, can be redirected by the reflective sheet 23 to the side of the backplane. One side is reflected, thereby improving the utilization efficiency of the light source.

The diffuser plate 24 is located on the light-emitting side of the miniature light-emitting diode lamp board 22 and has a certain distance from the reflection sheet 23 . In general, the diffuser plate 24 can be arranged in a rectangular or square shape.

The function of the diffuser plate 24 is to scatter the incident light, so that the light passing through the diffuser plate 24 is more uniform. The diffuser plate 24 is provided with a scattering particle material, and the light incident on the scattering particle material will be continuously refracted and reflected, so as to achieve the effect of dispersing the light and realize the effect of uniform light.

The thickness of the diffuser plate 24 is 1.5mm-3mm, which has higher haze and better uniformity. Usually, it can be processed by extrusion process. The material used for the diffuser plate 24 is generally selected from polymethyl methacrylate PMMA, polycarbonate PC , at least one of polystyrene materials PS and polypropylene PP.

The optical film 25 is located on the side of the diffuser plate 24 away from the reflection sheet 23 . The optical film 25 is arranged in a whole layer, and its shape is the same as that of the miniature light-emitting diode light board 22 , which can be generally rectangular or square.

The arrangement of the optical film 25 can make the backlight module adapt to various practical applications.

In the embodiment of the present application, the micro light emitting diodes in the micro light emitting diode light board 22 are blue light micro light emitting diodes, and the optical film 25 includes a quantum dot layer or a fluorescent layer.

Besides, the optical film 25 may also include a prism sheet, and the prism sheet can change the exit angle of light, thereby changing the viewing angle of the display device.

The optical film 25 may also include a reflective polarizer. As a kind of brightening film, the reflective polarizer can improve the brightness of the backlight module, improve the utilization efficiency of light, and at the same time make the outgoing light have the property of polarization. Use of polarizers.

In the currently used backlight module, in order to improve the light output rate, a reflective sheet 23 with a first opening S10 is provided in the backlight module. In order to avoid assembly errors and the expansion and contraction of the reflective sheet 23, generally The position of the hole is larger. For example, if the maximum size of the light source and its related components is 1 mm, the opening of the reflection sheet 23 needs to be opened by 3-4 mm. Then, the reflectivity in the first opening S1 of the reflection sheet 23 is low. In addition, when the micro LED light board 22 is used as the backlight source, due to the large number of micro LEDs, the area of the first opening S10 of the reflection sheet 23 is relatively large.

In addition to the above functions, the diffuser plate 24 and the optical film 25 will inevitably reflect part of the light emitted by the micro LEDs back to the side of the micro LED light plate 22, and the reflectivity of the reflector and the opening position is different. If it is larger, the efficiency of re-reflection of the light reflected by the diffuser plate and the optical film at the position of the opening S1 of the reflection sheet 23 is low, resulting in a relatively low light extraction efficiency of the mini LED light board.

In view of this, as shown in FIG. 8 , in the display device provided by the embodiment of the present application, a first reflective layer 26 is provided on the micro-LED light plate 22 in the first opening S10 to surround the micro-LEDs. The first light-reflecting layer 26 has a strong reflection effect. When the first light-reflecting layer 26 is disposed on the micro LED lamp board 22 , its reflectivity is equal to that of the reflecting sheet 23 . Therefore, even if the light is reflected to the area within the first opening S10 of the reflective sheet 23, it can be reflected again by the first reflective layer 26 to the light-emitting side, thereby greatly improving the light-emitting efficiency of the Mini LED light board.

In the specific implementation, the material used for the first reflective layer 26 is white ink (hereinafter referred to as white oil) that has the property of reflecting light, so the light emitted from the micro LED lamp board 22 to the back board 21 side, or the diffuser plate The light reflected by the 24 and the optical film 25 back to the first opening S1 can be re-reflected by the first reflective layer 26 to the light-emitting side, thereby improving the utilization efficiency of the light source.

The thickness of the white oil used for the first reflective layer 26 may be 20-30 μm, which is not limited herein.

8 , the miniature light-emitting diode light board 22 specifically includes: a circuit board 221 , a miniature light-emitting diode 222 , a second reflective layer 223 and an encapsulation layer 224 .

The circuit board 221 is located on the backplane 21 , and the shape of the circuit board 221 is the same as the overall shape of the miniature LED light board 22 . Under normal circumstances, the circuit board 221 is in the shape of a plate, and the whole is rectangular or square.

The circuit board 221 is used to provide driving electrical signals for the miniature light-emitting diodes 222 . The micro LEDs 222 and the circuit board 221 are separately fabricated. The surface of the circuit board 221 includes a plurality of pads for soldering the micro LEDs 222. After the micro LEDs 222 are fabricated, they are transferred to the top of the pads. The micro LEDs 222 are soldered on the circuit board 221 , so that the micro LEDs 222 can be driven to emit light through the input signal of the control circuit board 221 .

In the embodiment of the present application, the circuit board 221 may be a printed circuit board (Printed Circuit Board, PCB for short), the PCB includes a substrate 2211 and a conductive layer 2212, and the conductive layer 2212 is electroplated on the substrate 2211 with conductive material, and then etched as needed The etched circuit is formed, and the material used for the conductive material is copper. As shown in FIG. 8 , the conductive material is etched with a fracture S for separating the anode and cathode of the micro light-emitting diode 222 .

The substrate of the circuit board 221 can be made of materials such as FR4, aluminum-based or glass. Alternatively, the substrate or base substrate of the circuit board 221 may be made of a flexible material to form a flexible display device.

Micro LEDs 222 are located on the circuit board. The electrodes of the miniature light-emitting diodes 222 are soldered on the exposed pads of the circuit board 221 to realize electrical connection therebetween.

The micro light emitting diode 222 is different from the common light emitting diode, and specifically refers to a micro light emitting diode chip. Due to the small size of the miniature light-emitting diodes 222, it is beneficial to control the dynamic light emission of the backlight module to smaller partitions, which is beneficial to improve the contrast of the picture. In the embodiment of the present application, the micro LEDs 222 may have various sizes, for example, the size of the micro LEDs 222 is less than 200 μm, the size of the micro LEDs 222 is less than 300 μm, or the size of the micro LEDs 222 is less than 500 μm. The miniature light-emitting diodes can be manufactured in corresponding sizes according to practical applications, which are not limited here.

The micro-LED light board 22 may only include micro-LEDs 222 of one color, or may include micro-LEDs 222 of multiple colors, which is not limited herein.

The second light-reflecting layer 223 is located on the surface of the circuit board 221 on the side close to the miniature light-emitting diodes 222 , and is an insulating protective layer, which has the function of protecting the circuit board. In the embodiment of the present application, the second light-reflecting layer 223 is coated on the surface of the circuit board 221 with a material with a light-reflecting property, and then the positions of the pads used for soldering the miniature light-emitting diodes 222 are exposed through processes such as etching. to form a second opening S20 for exposing the micro light emitting diodes 222 .

The material used for the second reflective layer 223 is white ink (hereinafter referred to as white oil) with the property of reflecting light, and the thickness of the white oil is 20-30 μm, which is not limited herein.

The encapsulation layer 224 is a protective glue covering the surface of the micro LED 222 on the side facing away from the circuit board 221 . The encapsulation layer 224 is used to encapsulate and protect the miniature light-emitting diode 222 , and prevent foreign matter from entering the interior of the miniature light-emitting diode 222 . In the embodiment of the present application, the encapsulation layer 224 may be made of a transparent colloidal material, such as silica gel, modified silica gel, or epoxy resin with better permeability. Since the reflective sheet 23 is disposed on the miniature light-emitting diode lamp board 22 in the embodiment of the present application, the encapsulation layer 224 can be fabricated by spot coating. The first opening S10 of the reflective sheet 23 can expose the encapsulation layer 224 encapsulating the micro light-emitting diodes 222 .

The reflectivity of the white ink (the second reflective layer 223 ) provided on the surface of the circuit board 221 is related to the thickness. FIG. 9 is a graph showing the relationship between the thickness of the white ink and the reflectivity according to the embodiment of the present application. As shown in FIG. 9 , the reflectivity of the white ink is positively correlated with the thickness. The greater the thickness of the white ink, the higher the reflectivity, and the smaller the thickness of the white ink, the lower the reflectivity. If the reflectivity of the white ink layer is required to be above 95%, the thickness of the white ink must be above 50 μm-55 μm.

Considering the cost problem and the processing problem of opening the pad window, the thickness of the second reflective layer 223 made of white oil is generally 20-30 μm, and the reflectivity is relatively low. Therefore, in the embodiment of the present application, as shown in FIG. 8 , in the first opening S10 of the reflective sheet 23 , a first reflective layer 26 is superimposed on the exposed second reflective layer 223 . FIG. 10 is a schematic diagram of light rays of a backlight module provided by an embodiment of the present application.

As shown in FIG. 10 , when the light emitted by the micro LEDs 222 is irradiated on the diffuser plate 24 , a part of the light will be scattered or refracted back to the direction of the micro LED light board 22 . Therefore, it can be reflected back to the direction of the diffuser plate with a higher reflectivity, so that the light is emitted in the forward direction. Since the first reflective layer 26 is provided on the micro LED lamp board 22 in the first opening S10, the first reflective layer 26 and the The second reflective layer 223 is superimposed with two layers of white oil, which can achieve a high reflectivity of more than 90%, thereby improving the light emitting efficiency of the mini LED light board at the opening of the reflective sheet.

The first reflective layer 26 completely covers the second reflective layer 223 exposed by the first opening S10, thereby ensuring that the second reflective layer 223 exposed by the first opening S10 covers the first reflective layer 26 to the greatest extent, and further All the regions above the second light-reflecting layer 223 exposed by the first opening S10 satisfy the high reflectivity of the first light-reflecting layer 26 and the second light-reflecting layer 223 superimposed with two layers of white oil to reach a high reflectivity of more than 90%.

FIG. 11 is a schematic top-view structural diagram of a miniature light-emitting diode lamp board provided by an embodiment of the present application. FIG. 12 is a partial enlarged view of the micro light-emitting diode part in FIG. 11 .

Referring to FIG. 11 , the backlight micro-LEDs in the backlight module provided by the embodiment of the present application are arranged in an array, so that the emitted light is more uniform. The circuit board is rectangular as a whole, the long side of the circuit board is parallel to the y direction, and the short side is parallel to the x direction.

Referring to FIG. 11 and FIG. 12 , in the embodiment of the present application, the shapes of the miniature light emitting diodes 222 and the second opening S20 are both rectangular. The long side of the micro LED 222 is parallel to the x direction, and the short side of the micro LED 222 is parallel to the y direction; the short side L1 of the second opening S20 is parallel to the x direction, and the long side L2 of the second opening S20 is parallel to y direction, so that the short side L1 of the second opening S20 is parallel to the long side of the micro LED 222 , and the long side L2 of the second opening S20 is parallel to the short side of the micro LED 222 .

The expansion and contraction of the circuit board in the long-side direction y is relatively large, so the offset of the second opening S20 with the circuit board is relatively large, and the long side L2 of the second opening S20 is parallel to the miniature light-emitting diode. Therefore, the length of the side of the second opening S20 parallel to the short side of the micro LED 222 is set to be 1.3-1.7 times the length of the short side of the micro LED 222, which can ensure the welding process of the micro LED 222. The center falls within the range of the second opening S20 in the short side direction.

The amount of expansion and contraction of the circuit board in the short side direction x is relatively small, so the offset of the second opening S20 with the circuit board is also relatively small, and the short side L1 of the second opening S20 is parallel to the micro light emitting Therefore, the length of the second opening S20 parallel to the long side of the micro LED 222 is set to be 1.1-1.4 times the length of the long side of the micro LED 222, which can ensure the welding of the micro LED 222. During the process, the longitudinal direction falls within the range of the second opening S20.

When encapsulating the miniature light-emitting diode 222 with encapsulation glue, the form of dispensing encapsulation can be adopted. The method of dispensing and packaging can save packaging materials and reduce costs.

8 , 11 and 12 , in the embodiment of the present application, the encapsulation layer 224 only covers the surface of the micro LED 222 away from the circuit board 221 , and the packaging layer 224 has a dot pattern covering the micro LED 222 .

The shape of the encapsulation layer 224 is naturally formed by spreading and curing after dispensing glue on the surface of the miniature light-emitting diode 222, and its outer contour is generally circular. Therefore, the diameter L3 of the circular encapsulation layer is 2-5 times the maximum size of the micro LED 222 . However, there is no need to set an excessive size. In order to save the encapsulation material and reduce the cost, the edge of the encapsulation layer 224 can be located within the outline of the first opening S10, or the edge of the encapsulation layer 224 and the first opening S10 The edges coincide, that is, the diameter L3 of the circular encapsulation layer is smaller than or equal to the diameter L4 of the first opening S10 .

According to the first concept, a first light-reflecting layer is arranged on the micro-LED lamp board in the first opening, and is arranged around the micro-LEDs. The first reflective layer has a strong reflective effect, and after the first reflective layer is arranged on the miniature light-emitting diode lamp board, its reflectivity is equivalent to that of the reflective sheet. Therefore, even if the light is reflected to the area within the first opening of the reflective sheet, it can be reflected again to the light-emitting side by the first reflective layer, thereby greatly improving the light-emitting efficiency of the Mini LED light board.

According to the second concept, the material used for the first reflective layer is white ink with the property of reflecting light, so the light emitted from the micro LED light panel to the back panel may be reflected back to the first opening by the diffuser panel and the optical film. The light at the hole can be re-reflected to the light-emitting side by the first light-reflecting layer, thereby improving the utilization efficiency of the light source.

According to the third concept, the size of the micro LED is very small, for example, the size of the micro LED is less than 200 μm, less than 300 μm or less than 500 μm, which is conducive to controlling the dynamic light emission of the backlight module to a smaller partition, which is conducive to improving the contrast of the picture .

According to the fourth concept, the second light-reflecting layer is an insulating protective layer, which has the function of protecting the circuit board.

According to the fifth concept, the encapsulation layer is used for encapsulating and protecting the micro light emitting diode, and preventing foreign matter from entering the inside of the micro light emitting diode.

According to the sixth concept, in the first opening of the reflective sheet, a first reflective layer is superimposed on the exposed second reflective layer. The thickness of the second reflective layer 223 made of white oil is 20-30 μm, the first reflective layer also uses white ink, and the thickness can also be set at 20-30 μm, so that the thickness of the first reflective layer and the second reflective layer can be When it reaches more than 40 μm, a high reflectivity of more than 90% can be achieved, thereby solving the problem of relatively low light-emitting efficiency of the micro LED lamp board caused by the low reflectivity in the first opening of the reflector.

According to the seventh concept, the first reflective layer completely covers the second reflective layer exposed by the first opening, so as to ensure that the second reflective layer exposed by the first opening covers the first reflective layer to the greatest extent, thereby making the All the regions above the second light-reflecting layer exposed by the first openings all satisfy the high reflectivity of the first light-reflecting layer and the second light-reflecting layer being superimposed with two layers of white oil to reach a high reflectivity of more than 90%.

According to the eighth concept, the backlight micro-LEDs in the backlight module are arranged in an array, so that the emitted light is more uniform.

According to the ninth concept, the side length of the second opening parallel to the short side direction of the micro light emitting diode is set to be 1.3-1.7 times the short side length of the micro light emitting diode, so as to ensure that the micro light emitting diode falls in the short side direction during the welding process of the micro light emitting diode. within the range of the second opening.

According to the tenth concept, the length of the side of the second opening parallel to the long side of the micro LED is set to be 1.1-1.4 times the length of the long side of the micro LED, so as to ensure that the micro LED falls in the long side direction during the welding process of the micro LED. within the range of the second opening.

According to the eleventh concept, the miniature light-emitting diode is packaged in the form of dispensing package, which can save packaging materials and reduce costs.

According to the twelfth concept, the diameter of the circular encapsulation layer is 2-5 times the maximum size of the micro light emitting diode for protecting the micro light emitting diode.

According to the twenty-first concept, the diameter of the circular encapsulation layer is smaller than or equal to the diameter of the first opening, which can save encapsulation materials and reduce costs.

While the preferred embodiments of the present application have been described, additional changes and modifications to these embodiments may occur to those skilled in the art once the basic inventive concepts are known. Therefore, the appended claims are intended to be construed to include the preferred embodiment and all changes and modifications that fall within the scope of this application.

Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

A display device, comprising:

Display panel for image display;

a backlight module, located on the light incident side of the display panel, for providing backlight;

The backlight module includes:

The back plate has the function of supporting and bearing;

a plurality of lamp panels, located on one side of the back panel; the lamp panels are spliced with each other, and the splicing seam between two adjacent lamp panels is the first splicing seam;

a plurality of reflective sheets, located on the side of the lamp board away from the back plate; the reflective sheets are spliced with each other, and the splicing seam between two adjacent reflective sheets is the second splicing seam;

The first seam and the second seam do not overlap each other.
The display device according to claim 1, wherein,

The light board is a miniature light emitting diode light board, and the miniature light emitting diode light board includes:

a circuit board, located on the backplane, for providing driving signals;

miniature light-emitting diodes on the circuit board;

a reflective layer, located on the side of the circuit board close to the micro light emitting diode; the reflective layer includes an opening for exposing the micro light emitting diode;

an encapsulation layer, located on the surface of the miniature light-emitting diodes, for encapsulating and protecting the miniature light-emitting diodes; the encapsulation layer has a lattice pattern corresponding to the miniature light-emitting diodes one-to-one;

The reflective sheet is located on a side of the reflective layer away from the back plate, and the reflective sheet includes an opening for exposing the micro light emitting diodes.
The display device according to claim 2, wherein the material used for the reflective layer is white ink;

The reflectivity of the white ink is greater than or equal to 85%.
The display device according to claim 3, wherein the reflectivity of the reflection sheet is greater than or equal to 94%.
The display device according to claim 1, wherein the shape of the lamp board and the reflection sheet is a square or a rectangle, and both the lamp board and the reflection sheet include extending along the first direction and the second direction. The first direction and the second direction intersect; the width of the reflective sheet in at least one of the first direction and the second direction is greater than the width of the miniature light-emitting diode lamp board.
The display device according to claim 5, wherein the width of the reflection sheet in the first direction is greater than the width of the lamp board in the first direction, and the reflection sheet is in the first direction. The width in the two directions is equal to the width of the light panel in the second direction.
The display device according to claim 6, wherein the width of the reflection sheet in the first direction is 1.5 times the width of the lamp panel in the first direction.
The display device according to claim 5, wherein the width of the reflection sheet in the first direction is greater than the width of the lamp board in the first direction, and the reflection sheet is in the first direction. The width in the two directions is different from the width of the light board in the second direction.
The display device according to claim 5, wherein the number of the reflection sheets is smaller than the number of the miniature light-emitting diode lamp panels.
The display device according to claim 2, wherein the size of the micro light-emitting diode is less than 500 μm.