CN109976038B - Area light source device, preparation method thereof and display device - Google Patents
Area light source device, preparation method thereof and display device Download PDFInfo
- Publication number
- CN109976038B CN109976038B CN201910281844.0A CN201910281844A CN109976038B CN 109976038 B CN109976038 B CN 109976038B CN 201910281844 A CN201910281844 A CN 201910281844A CN 109976038 B CN109976038 B CN 109976038B
- Authority
- CN
- China
- Prior art keywords
- layer
- pcb
- light source
- reflecting
- source device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133605—Direct backlight including specially adapted reflectors
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133614—Illuminating devices using photoluminescence, e.g. phosphors illuminated by UV or blue light
Abstract
The invention relates to a surface light source device, a preparation method thereof and a display device. Wherein the surface light source device includes: the PCB comprises a substrate, a reflecting layer, a photoresist layer, a QD layer, an encapsulation layer and a PCB module. On one hand, through the coupling of the LED and the opening of the reflecting layer and the QD layer, the splicing seams between the PCB modules and the PCB are arranged at the positions corresponding to the reflecting layer, blue light emitted by the LED is converted into white light after passing through the QD, and the white light is reflected by the optical scattering material, does not pass through the PCB ink and the slit, but is directly reflected out through the reflecting layer. Therefore, the mosaic phenomenon of blocky uneven brightness caused by inconsistent ink reflectivity and color difference of the PCB can be avoided; on the other hand, the QD layer is packaged in the opening region of the reflecting layer, so that the thin white light area source with high color gamut is realized.
Description
Technical Field
The invention relates to the technical field of display, in particular to a surface light source device, a preparation method thereof and a display device.
Background
With the development of liquid crystal display technology, the application field of liquid crystal displays, especially color liquid crystal displays, is also widening. Pulled by the market of liquid crystal displays and the backlight industry, the liquid crystal display displays a splendid scene. Liquid crystal displays are passive light emitting elements and the display screen itself does not emit light but is illuminated by a backlight below it. The backlight source and the liquid crystal display screen are combined together to form the liquid crystal display module.
The so-called BackLight (BackLight) is a light source located behind a Liquid Crystal Display (LCD), and its lighting effect will directly affect the visual effect of the liquid crystal display module (LCM). The backlight source mainly comprises a light source, a light guide plate, an optical film, a plastic frame and the like. The backlight source has the characteristics of high brightness, long service life, uniform light emission and the like. The backlight source is divided into a direct type backlight source and an edge type backlight source according to the distribution position of the light source.
In the direct type backlight, a light source (an LED wafer array) and a printed circuit board are arranged at the bottom of the backlight, and light rays are emitted from the LEDs, pass through a reflector plate at the bottom and then uniformly emitted through a diffusion plate and a brightness enhancement film on the surface.
The edge-lit backlight is a backlight in which linear or point-like light sources are arranged on the side of a specially designed light guide plate. The light guide plate principle is to utilize the interference phenomenon that the distribution of the mesh points at the bottom of the light guide acrylic plate destroys light, and to uniformly convert a linear light source into a surface light source, and the light guide plate has the function of guiding the scattering direction of light, so that the light distribution is more uniform, the shadow of a reflection point cannot be seen from the front, the brightness of the panel is improved, the uniformity of the brightness of the panel is ensured, and the excellent light guide plate has great influence on backlight.
The liquid crystal backlight is a planar uniform lighting device, and cold cathode fluorescent lamps or LED light bars as light sources are arranged on two sides or one side (possibly a long side or a short side) of the whole backlight. The cold cathode lamp tube is a linear light source, the LED is a point light source, and a light guide plate is needed for converting the light source into a surface light source. The light guide plate is generally made of acrylic plastic with high light transmittance, and the surface is very smooth and flat, so that most of the internal light can be regularly and totally reflected on the flat surface of the light guide plate and can not be emitted out of the light guide plate. The bottom of the light guide plate of the liquid crystal display is printed with white dots. At the position where the light guide plate is printed with the mesh points, the light rays are not regularly reflected totally but emitted to the upper part of the light guide plate. Controlling the density of the dots at each position can control how much light is emitted from the light guide plate at that position. The precisely designed mesh points of the light guide plate can enable light rays incident from two sides to be uniformly spread on the whole plane. Optical films are placed above the light guide plate, and the films play a role in homogenizing light and converging large-angle light for front observation and the like.
Currently, Mini-LEDs are used in TV backlight, and a common solution is to mount a blue Mini-LED on a PCB to form an LED array, and then place an optical diffusion film and a wavelength conversion material film over the LEDs to generate a uniform white light area source. Due to the limitation of the LED component printing machine table, the size of the PCB cannot be very large, and therefore a plurality of PCBs are required to be spliced into a large light-emitting area light source. Therefore, two problems are caused, namely, the slit at the joint of the PCB can bring the taste problems of dark lines and the like, and the inconsistent ink reflectivity and color difference of each PCB can cause the mosaic phenomenon of blocky uneven brightness. The wavelength conversion material membrane above the LED also has the problems of thick thickness and high cost, and is not beneficial to the design requirement of thinning. Therefore, a new type of surface light source device is sought to solve the above problems. The invention sets out a solution and also provides a thinning design of the QD scheme.
Disclosure of Invention
An object of the present invention is to provide a surface light source device, a method of manufacturing the same, and a display apparatus, which can solve the problems of optical quality such as mosaic phenomenon caused by differences in PCB ink and dark lines caused by a stitching slit in the current surface light source device.
In order to solve the above problems, an embodiment of the present invention provides a surface light source device including: the PCB comprises a substrate, a reflecting layer, a photoresist layer, a QD layer, an encapsulation layer and a PCB module. The reflecting layers are arranged on the substrate at intervals, and a first opening is formed between every two adjacent reflecting layers; the photoresist layers are correspondingly arranged on the reflecting layer, a second opening is formed between every two adjacent photoresist layers, and the second opening is arranged corresponding to the first opening; the QD layer is disposed in the first opening between the reflective layers; the packaging layer is arranged in the photoresist layer and the second opening; the PCB module includes: the PCB is arranged on the packaging layer, the LEDs are arranged on the surface, facing the packaging layer, of the PCB at intervals, and the arrangement position of each LED downwards corresponds to the position of the QD layer.
Further, the reflective layer is a metal reflective layer.
Further, the composition material of the metal reflecting layer comprises one or more of aluminum, silver and titanium.
Further wherein the PCB modules comprise a number of 2 or more than 2.
Further, the position of the splicing seam between two adjacent PCB modules is arranged corresponding to the position of the reflecting layer.
Another embodiment of the present invention also provides a method for manufacturing the surface light source device according to the present invention, which comprises the steps of:
s1, providing a substrate, and forming a reflecting layer on the substrate;
s2, patterning the reflecting layers by using a photomask and an etching process, and forming a first opening between two adjacent reflecting layers to obtain the reflecting layers arranged on the substrate at intervals;
s3, coating photoresist on the reflecting layer and the first openings, carrying out UV exposure on the photoresist from the back side of the substrate, and forming second openings corresponding to the first openings between two adjacent photoresist layers so as to form photoresist layers corresponding to the reflecting layer;
s4, spraying a QD solution in the first openings among the reflecting layers, and curing to obtain a QD layer;
s5, coating glue on the second opening and the photoresist layer to form an encapsulation layer;
s6, disposing an LED on a surface of the PCB facing the encapsulation layer at a position corresponding to the QD layer, and then disposing a PCB module with the LED on the encapsulation layer.
Further, wherein the method of manufacturing the surface light source device further comprises: and S7, dipping the LED into the packaging layer and lighting, and detecting and adjusting the position of the LED to correspond to the position of the QD layer through a CCD camera.
Further wherein the reflective layer is prepared by sputtering or deposition.
Further wherein the LED is disposed on the PCB by soldering.
Another embodiment of the present invention also provides a display device including the surface light source device according to the present invention.
The invention has the advantages that: on one hand, through the coupling of the LED and the opening of the reflecting layer and the QD layer, the splicing seam between the PCB modules and the position of the PCB corresponding to the reflecting layer are arranged, the blue light emitted by the LED is converted into white light after passing through the QD, and the white light is reflected by the optical scattering material, does not pass through the PCB ink and the slit, but is directly reflected out through the reflecting layer. Therefore, the mosaic phenomenon of blocky uneven brightness caused by inconsistent ink reflectivity and color difference of the PCB can be avoided; on the other hand, the QD layer is packaged in the opening region of the reflecting layer, so that the thin white light area source with high color gamut is realized.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic view of the structure of embodiment 1 of the surface light source device of the present invention.
Fig. 2 is an operation schematic diagram of embodiment 2 of the surface light source device of the present invention.
Fig. 3 is a schematic view of a first production of example 1 of the surface light source device of the present invention.
Fig. 4 is a schematic view of a second production of the surface light source device of the present invention in example 1.
Fig. 5 is a third production schematic view of example 1 of the surface light source device of the present invention.
Fig. 6 is a fourth production schematic view of example 1 of the surface light source device of the present invention.
Fig. 7 is a schematic view of a fifth production of the surface light source device of example 1 of the present invention.
Fig. 8 is a sixth production schematic view of example 1 of the surface light source device of the present invention.
The components in the figure are identified as follows:
100. surface light source device
1. Substrate 2, reflective layer
3. Photoresist layer 4, QD layer
5. Packaging layer 6 and PCB module
61、PCB 62、LED
7. UV light 8, CCD camera
Detailed Description
The following detailed description of the preferred embodiments of the present invention is provided to enable those skilled in the art to make and use the present invention in a complete manner, and is provided for illustration of the technical disclosure of the present invention so that the technical disclosure of the present invention will be more clearly understood and appreciated by those skilled in the art how to implement the present invention. The present invention may, however, be embodied in many different forms of embodiment, and the scope of the present invention should not be construed as limited to the embodiment set forth herein, but rather construed as being limited only by the following description of the embodiment.
The directional terms used in the present invention, such as "up", "down", "front", "back", "left", "right", "inner", "outer", "side", etc., are only directions in the drawings, and are used for explaining and explaining the present invention, but not for limiting the scope of the present invention.
In the drawings, structurally identical elements are represented by like reference numerals, and structurally or functionally similar elements are represented by like reference numerals throughout the several views. In addition, the size and thickness of each component shown in the drawings are arbitrarily illustrated for convenience of understanding and description, and the present invention is not limited to the size and thickness of each component.
When certain components are described as being "on" another component, the component can be directly on the other component; there may also be an intermediate component disposed on the intermediate component and the intermediate component disposed on another component. When an element is referred to as being "mounted to" or "connected to" another element, they are directly "mounted to" or "connected to" the other element or "mounted to" or "connected to" the other element through an intermediate element.
Example 1
As shown in fig. 1, a surface light source device 100 includes: the substrate comprises a substrate 1, a reflecting layer 2, a photoresist layer 3, a QD layer 4, an encapsulation layer 5 and a PCB module 6.
As shown in fig. 1, the reflective layers 2 are disposed on the substrate 1 at intervals, wherein a first opening is formed between two adjacent reflective layers 2; the reflective layer 2 is a metal reflective layer, and specifically, the constituent material of the metal reflective layer includes one or more of aluminum, silver, and titanium. The reflecting layer 2 thus produced can avoid light penetration, has good light reflecting effect, and is favorable for realizing light diffusion, thereby forming a surface light source.
As shown in fig. 1, the photoresist layers 3 are correspondingly disposed on the reflective layer 2, and a second opening is formed between two adjacent photoresist layers 3, where the second opening is disposed corresponding to the first opening; the QD layer 4 is disposed in the first openings between the reflective layers 2; therefore, the thin white surface light source with high color gamut is realized.
As shown in fig. 1, the encapsulation layer 5 is disposed on the photoresist layer 3 and the second opening; the PCB module 6 includes: a PCB 61 and an LED 62, wherein the PCB 61 is arranged on the packaging layer 5, and the LED 62 is arranged on the surface of the PCB 61 facing the packaging layer 5 corresponding to the QD layer 4. Therefore, the PCB 61 can be covered by the reflecting layer 2, blue light emitted by the LED 62 is converted into white light after passing through the QD layer 4, the white light is reflected by the optical scattering material and then does not pass through the printing ink and the slit of the PCB 61, but is directly reflected out through the reflecting layer 2 to form a white surface light source, and the mosaic phenomenon of blocky uneven brightness caused by inconsistent printing ink reflectivity and color difference of the PCB 61 is avoided.
Example 2
Only the differences between the present embodiment and embodiment 1 will be described below, and the descriptions of the differences are omitted here.
As shown in fig. 2, wherein the PCB module 6 comprises 2 numbers. The position of the splicing seam between two adjacent PCB modules 6 is arranged corresponding to the position of the reflecting layer 2. From this can be covered by reflection stratum 2 with concatenation seam and PCB 61 between the PCB module 6, the blue light that sends when LED 62 turns into white light behind QD layer 4, and the white light is no longer through PCB 61 printing ink and slit after being reflected back by optical scattering material, but directly goes out through reflection stratum 2 reflection and forms white area light source, has avoided the inhomogeneous mosaic phenomenon of blocky luminance that leads to of PCB 61's printing ink reflectivity and colour difference.
Example 3
As shown in fig. 3 to 7, the present embodiment also provides a method for manufacturing a surface light source device, which includes: s1, providing a substrate 1, and forming a reflecting layer 2 on the substrate 1 through a sputtering or deposition process; s2, patterning the reflective layers 2 through a mask and an etching process to form a first opening between two adjacent reflective layers 2, thereby obtaining reflective layers 2 disposed at intervals; s3, coating a photoresist on the reflective layer 2 and the first opening, exposing the photoresist with UV light 7 from the back of the substrate 1, and forming a second opening corresponding to the first opening between two adjacent photoresist layers 3, thereby forming the photoresist layer 3 corresponding to the reflective layer 2; s4, spraying a QD solution in the first openings between the reflective layers 2, and curing to obtain a QD layer 4; s5, coating glue on the QD layer 4 and the photoresist layer 3 to form an encapsulation layer 5; s6, the LED 62 is disposed on the surface of the PCB 61 facing the encapsulation layer at a position corresponding to the QD layer 4, specifically, the LED 62 is disposed on the PCB 61 by soldering, and then the PCB module 6 with the LED 62 is disposed on the encapsulation layer 5.
As shown in fig. 8, the method of manufacturing the surface light source device further includes: s7, the LED 62 is immersed in the encapsulation layer 5 and lighted, and the position of the LED 62 is detected and adjusted by the CCD camera 8 to correspond to the position of the QD layer 4.
Another embodiment of the present invention also provides a display device including the surface light source device according to the present invention.
The surface light source device, the method for manufacturing the same, and the display device provided by the present invention are described in detail above. It should be understood that the exemplary embodiments described herein should be considered merely illustrative for facilitating understanding of the method of the present invention and its core ideas, and not restrictive. Descriptions of features or aspects in each exemplary embodiment should generally be considered as applicable to similar features or aspects in other exemplary embodiments. While the present invention has been described with reference to exemplary embodiments, various changes and modifications may be suggested to one skilled in the art. It is intended that the present invention cover the modifications and variations of this invention provided they come within the spirit and scope of the appended claims and their equivalents and improvements made thereto.
Claims (8)
1. A surface light source device, comprising:
a substrate, a first electrode and a second electrode,
the reflecting layers are arranged on the substrate at intervals, and a first opening is formed between every two adjacent reflecting layers;
the photoresist layers are correspondingly arranged on the reflecting layer, a second opening is formed between every two adjacent photoresist layers, and the second opening is arranged corresponding to the first opening;
a QD layer disposed in the first opening between the reflective layers;
the packaging layer is arranged in the photoresist layer and the second opening; and
the position of a splicing seam between two adjacent PCB modules is arranged corresponding to the position of the reflecting layer;
the PCB module includes:
a PCB disposed on the encapsulation layer,
LEDs are arranged on the surface, facing the packaging layer, of the PCB at intervals, wherein the arrangement position of each LED downwards corresponds to the position of the QD layer.
2. A surface light source device as claimed in claim 1, characterized in that the reflecting layer is a metal reflecting layer.
3. A surface light source device as claimed in claim 2, wherein the constituent material of the metal reflecting layer includes one or more of aluminum, silver and titanium.
4. A method for manufacturing a surface light source device of claim 1, comprising:
s1, providing a substrate, and forming a reflecting layer on the substrate;
s2, patterning the reflecting layers by using a photomask and an etching process, and forming a first opening between two adjacent reflecting layers to obtain the reflecting layers arranged on the substrate at intervals;
s3, coating photoresist on the reflecting layer and the first openings, carrying out UV exposure on the photoresist from the back side of the substrate, and forming second openings corresponding to the first openings between two adjacent photoresist layers so as to form photoresist layers corresponding to the reflecting layer;
s4, spraying a QD solution in the first openings among the reflecting layers, and curing to obtain a QD layer;
s5, coating glue on the second opening and the photoresist layer to form an encapsulation layer;
s6, arranging LEDs on the surface of the PCB facing the packaging layer, wherein the positions of the LEDs correspond to the QD layer, then arranging more than 2 PCB modules with the LEDs on the packaging layer, and arranging the splicing seams between two adjacent PCB modules corresponding to the position of the reflecting layer.
5. The method of manufacturing a surface light source device as claimed in claim 4, further comprising:
and S7, dipping the LED into the packaging layer and lighting, and detecting and adjusting the position of the LED to correspond to the position of the QD layer through a CCD camera.
6. A method of manufacturing a surface light source device according to claim 4, wherein the reflecting layer is manufactured by sputtering or deposition.
7. The method of manufacturing a surface light source device as claimed in claim 4, wherein the LED is provided on the PCB by soldering.
8. A display device characterized by comprising the surface light source device of claim 1.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910281844.0A CN109976038B (en) | 2019-04-09 | 2019-04-09 | Area light source device, preparation method thereof and display device |
| PCT/CN2020/073521 WO2020207102A1 (en) | 2019-04-09 | 2020-01-21 | Area light source device and manufacturing method therefor, display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910281844.0A CN109976038B (en) | 2019-04-09 | 2019-04-09 | Area light source device, preparation method thereof and display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109976038A CN109976038A (en) | 2019-07-05 |
| CN109976038B true CN109976038B (en) | 2021-04-27 |
Family
ID=67083797
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910281844.0A Active CN109976038B (en) | 2019-04-09 | 2019-04-09 | Area light source device, preparation method thereof and display device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109976038B (en) |
| WO (1) | WO2020207102A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109976038B (en) * | 2019-04-09 | 2021-04-27 | 深圳市华星光电半导体显示技术有限公司 | Area light source device, preparation method thereof and display device |
| CN111599909B (en) * | 2020-05-21 | 2023-07-11 | 东莞市中麒光电技术有限公司 | LED display screen module and preparation method thereof |
| CN114824025B (en) * | 2021-01-19 | 2023-07-11 | 东莞市中麒光电技术有限公司 | Micro LED display module and manufacturing method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101126866A (en) * | 2006-08-17 | 2008-02-20 | 奇美电子股份有限公司 | Direct type backlight module and liquid crystal display comprising the backlight module |
| KR20150030425A (en) * | 2013-09-12 | 2015-03-20 | 엘지디스플레이 주식회사 | Columnar Light emitting device and Liquid crystal display device having columnar light emitting device and Method of manufacturing the sames |
| CN106410022A (en) * | 2015-07-31 | 2017-02-15 | 佛山市国星光电股份有限公司 | Manufacturing method of LED packaging device and the LED packaging device |
| CN109037271A (en) * | 2018-08-16 | 2018-12-18 | 京东方科技集团股份有限公司 | Optical device and its manufacturing method, display device |
| CN109065529A (en) * | 2018-09-27 | 2018-12-21 | 武汉华星光电技术有限公司 | Area source, preparation method and the display device using the area source |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018198187A (en) * | 2017-05-25 | 2018-12-13 | キヤノン株式会社 | Light emitting device and display device |
| CN109001936A (en) * | 2017-06-06 | 2018-12-14 | 群创光电股份有限公司 | Light source module and display equipment |
| CN208421467U (en) * | 2018-06-08 | 2019-01-22 | 深圳市瑞丰光电子股份有限公司 | A kind of backlight module, display device and its electronic equipment |
| CN108983499A (en) * | 2018-09-19 | 2018-12-11 | 武汉华星光电技术有限公司 | Backlight module |
| CN109215520B (en) * | 2018-10-11 | 2020-07-10 | 惠州市华星光电技术有限公司 | L ED display screen and manufacturing method thereof |
| CN109976038B (en) * | 2019-04-09 | 2021-04-27 | 深圳市华星光电半导体显示技术有限公司 | Area light source device, preparation method thereof and display device |
-
2019
- 2019-04-09 CN CN201910281844.0A patent/CN109976038B/en active Active
-
2020
- 2020-01-21 WO PCT/CN2020/073521 patent/WO2020207102A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101126866A (en) * | 2006-08-17 | 2008-02-20 | 奇美电子股份有限公司 | Direct type backlight module and liquid crystal display comprising the backlight module |
| KR20150030425A (en) * | 2013-09-12 | 2015-03-20 | 엘지디스플레이 주식회사 | Columnar Light emitting device and Liquid crystal display device having columnar light emitting device and Method of manufacturing the sames |
| CN106410022A (en) * | 2015-07-31 | 2017-02-15 | 佛山市国星光电股份有限公司 | Manufacturing method of LED packaging device and the LED packaging device |
| CN109037271A (en) * | 2018-08-16 | 2018-12-18 | 京东方科技集团股份有限公司 | Optical device and its manufacturing method, display device |
| CN109065529A (en) * | 2018-09-27 | 2018-12-21 | 武汉华星光电技术有限公司 | Area source, preparation method and the display device using the area source |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109976038A (en) | 2019-07-05 |
| WO2020207102A1 (en) | 2020-10-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112241088B (en) | Miniature light-emitting diode lamp panel, backlight module and preparation method thereof | |
| CN109976038B (en) | Area light source device, preparation method thereof and display device | |
| JP5178372B2 (en) | LED backlight system for LCD display | |
| CN106842701B (en) | Backlight module and liquid crystal display | |
| JP4435774B2 (en) | Backlight assembly and liquid crystal display device | |
| CN110068956A (en) | Lighting device and display device | |
| KR100801804B1 (en) | Surface light source unit and device using the same | |
| CN113777826B (en) | Display device | |
| CN213399142U (en) | Display device | |
| WO2022088590A1 (en) | Display device | |
| KR101707574B1 (en) | backlight unit having light blocking pattern and method for forming light blocking pattern of the same | |
| US20200012154A1 (en) | Backlight and backlight production method | |
| CN109164638B (en) | Light emitting module, manufacturing method thereof and direct type backlight source | |
| US11320574B2 (en) | Light guide plate, backlight module and display device | |
| CN110456558B (en) | Optical film material, backlight source and display device | |
| JP2023552154A (en) | Backlight module and display screen | |
| CN114428421B (en) | Display device | |
| JP2019129065A (en) | Illumination device and display device | |
| CN109358451B (en) | Backlight module and display device thereof | |
| CN217387154U (en) | Display device | |
| EP3771940A1 (en) | Surface light source, fabrication method therefor, and display device | |
| CN115327818A (en) | Backlight module, preparation method of backlight module and display device | |
| CN112987394B (en) | Display device | |
| CN113703223A (en) | Backlight module, preparation method thereof and display panel | |
| JP2009181883A (en) | Backlight device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |