JP2009181883A - Backlight device - Google Patents

Backlight device Download PDF

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JP2009181883A
JP2009181883A JP2008021328A JP2008021328A JP2009181883A JP 2009181883 A JP2009181883 A JP 2009181883A JP 2008021328 A JP2008021328 A JP 2008021328A JP 2008021328 A JP2008021328 A JP 2008021328A JP 2009181883 A JP2009181883 A JP 2009181883A
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light emitting
light
backlight device
reflectance
mounting
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Ryuji Tsuchiya
竜二 土屋
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Toshiba Lighting and Technology Corp
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Harison Toshiba Lighting Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a backlight device for suppressing luminance irregularity when surface-emitting the whole light-emitting face while controlling luminance in light-emitting regions with no sense of discomfort. <P>SOLUTION: The vertical type backlight device 1 includes a diffusion sheet 8 having the light-emitting face 12 set on the outer face side, a mounting board 5 having a mounting face 5a opposed to the inner face side of the diffusion sheet 8, a plurality of LEDs 6 mounted on the mounting face 5a, and a frame 7 surrounding the group of LEDs 6 to form a cavity 10 between the diffusion sheet 8 and the mounting board 5. A reflection factor R1 of the mounting face 5a is set smaller than a reflection factor R2 of an inner peripheral face 7a of the frame 7. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、発光面を形成する拡散板等の光学部材の内面側に、複数の発光ダイオードの発光素子を光源として対向配置した所謂直下型方式のバックライト装置に関する。   The present invention relates to a so-called direct-type backlight device in which light emitting elements of a plurality of light emitting diodes are opposed to each other on the inner surface side of an optical member such as a diffusion plate forming a light emitting surface.

従来より、液晶表示装置等に用いられるバックライト装置においては、拡散板等の内面側に複数の冷陰極蛍光管(CCFL)が光源として対向配置された、所謂直下型方式のバックライト装置が広く採用されている。この種のバックライト装置では、一般に、各CCFLからの出射光を発光面までの空間(空気層)内で混合させることにより、発光面を均一な輝度で白色発光させるよう構成されている。   2. Description of the Related Art Conventionally, in backlight devices used in liquid crystal display devices, so-called direct type backlight devices in which a plurality of cold cathode fluorescent tubes (CCFLs) are arranged as light sources on the inner surface side of a diffusion plate or the like are widely used. It has been adopted. In general, this type of backlight device is configured to emit white light with uniform brightness by mixing light emitted from each CCFL in a space (air layer) to the light emitting surface.

また、近年、バックライト装置においては、液晶表示装置を用いたテレビ等の普及に伴う液晶表示装置の画質向上等の要求に対処し、液晶パネルのセル動作に同期させて各CCFLの点灯を制御する技術が開発されている。例えば、特許文献1には、液晶パネルのフレーム周期に同期してCCFLを点滅点灯させることで動画を表示する際のぼやけを抑制し、液晶表示装置の画質向上を図る技術が開示されている。   Also, in recent years, backlight devices have responded to the demands for improving the image quality of liquid crystal display devices with the spread of televisions using liquid crystal display devices, and controlled the lighting of each CCFL in synchronization with the cell operation of the liquid crystal panel. Technology has been developed. For example, Patent Document 1 discloses a technique for improving image quality of a liquid crystal display device by suppressing blurring when displaying a moving image by blinking and lighting CCFLs in synchronization with a frame period of a liquid crystal panel.

また、直下型方式のバックライト装置において、更に細分化された領域毎に発光面の輝度や色度等を制御するため、CCFLに代えて発光ダイオード(LED)を光源として採用し、発光面に設定された発光領域毎にLEDを個別に点灯制御する技術が提案されている。   In direct type backlight devices, light emitting diodes (LEDs) are used as light sources instead of CCFLs in order to control the luminance and chromaticity of the light emitting surface for each subdivided area. A technique for individually controlling the lighting of LEDs for each set light emitting region has been proposed.

その一方で、上述のように複数のLEDを直下配置した場合、各LEDからの出射光が広範囲に亘って相互に影響し合い、その結果、例えば、発光面全体を面発光させようとした場合に中央部の輝度が周辺部よりも相対的に高くなる等の輝度ムラが生じる虞がある。また、発光領域毎に輝度等を制御しようとした場合にも、相互の発光領域間で、漏れ光が所望の発光領域以外の領域に必要以上に影響を及ぼす等の虞がある。   On the other hand, when a plurality of LEDs are arranged directly below as described above, the emitted light from each LED affects each other over a wide range, and as a result, for example, when trying to cause the entire light emitting surface to emit light In addition, there is a risk of uneven brightness such that the brightness at the center is relatively higher than that at the periphery. In addition, when trying to control the luminance or the like for each light emitting area, there is a possibility that leakage light between the light emitting areas may unnecessarily affect areas other than the desired light emitting area.

これに対処し、例えば、非特許文献1には、各LEDの周囲に隔壁を設け、この隔壁を用いて発光領域を区分する技術が開示されている。
特開2004−252127号公報 SID 06 DIGEST 1520-1523 44.4/T.Shirai
To cope with this, for example, Non-Patent Document 1 discloses a technique in which a partition is provided around each LED and the light emitting region is divided using the partition.
JP 2004-252127 A SID 06 DIGEST 1520-1523 44.4 / T.Shirai

しかしながら、上述の非特許文献1に開示された技術のように隔壁を設けた場合、隔壁が発光面上に暗線として現出したり、発光区分があまりにも明瞭となり、発光領域の境界近傍において画像上の発光強度を滑らかにコントロールすることが困難となる等の虞がある。   However, when a partition is provided as in the technique disclosed in Non-Patent Document 1 described above, the partition appears as a dark line on the light-emitting surface, or the light-emitting section becomes too clear, and the image is displayed near the boundary of the light-emitting region. There is a risk that it may be difficult to smoothly control the emission intensity of the light.

本発明は、発光面全体を面発光させた場合の輝度ムラ等を抑制することができ、しかも、発光領域毎の輝度制御を違和感なく行うことができるバックライト装置を提供することを目的とする。   An object of the present invention is to provide a backlight device that can suppress luminance unevenness or the like when the entire light emitting surface is caused to emit light, and can perform luminance control for each light emitting region without a sense of incongruity. .

本発明は、外面側に発光面が設定された光学部材と、前記光学部材の内面側に実装面が対向された実装基板と、前記実装面上に実装された複数の発光素子と、前記発光素子群を囲繞して前記光学部材と前記実装基板との間に空隙を形成する枠体とを備え、前記実装面の反射率を前記枠体の内周面の反射率よりも小さく設定したことを特徴とする。   The present invention includes an optical member having a light emitting surface set on the outer surface side, a mounting substrate having a mounting surface opposed to the inner surface side of the optical member, a plurality of light emitting elements mounted on the mounting surface, and the light emitting device. A frame body that surrounds the element group and forms a gap between the optical member and the mounting substrate, and the reflectance of the mounting surface is set smaller than the reflectance of the inner peripheral surface of the frame body It is characterized by.

本発明のバックライト装置によれば、発光面全体を面発光させた場合の輝度ムラ等を抑制することができ、しかも、発光領域毎の輝度制御を違和感なく行うことができる。   According to the backlight device of the present invention, it is possible to suppress luminance unevenness and the like when the entire light emitting surface is subjected to surface light emission, and to perform luminance control for each light emitting region without a sense of incongruity.

以下、図面を参照して本発明の形態を説明する。図面は本発明の一実施形態に係わり、図1はバックライト装置の要部を示す分解斜視図、図2はバックライト装置の平面図、図3は図2のIII−III線に沿う要部断面図である。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. The drawings relate to an embodiment of the present invention, FIG. 1 is an exploded perspective view showing a main part of the backlight device, FIG. 2 is a plan view of the backlight device, and FIG. 3 is a main part taken along line III-III in FIG. It is sectional drawing.

図1乃至図3において、符号1は液晶テレビ等に好適なバックライト装置を示し、このバックライト装置1は、光源ユニット2を有する。光源ユニット2は、平板状の実装基板5を有し、この実装基板5の一方の面側に設定された実装面5a上に、発光素子として複数の発光ダイオード(LED)6が実装されて要部が構成されている。この光源ユニット2には、実装面5a上のLED6群を囲繞する枠体7が固設され、枠体7の端部には光学部材としての拡散板8が配置されている。そして、拡散板8の縁辺部及び枠体7にベゼル9が冠設されることにより、拡散板8は、実装基板5との間に所定の空隙(空気層)10を隔てた状態で枠体7に保持されている。   1 to 3, reference numeral 1 denotes a backlight device suitable for a liquid crystal television or the like. The backlight device 1 includes a light source unit 2. The light source unit 2 has a flat mounting substrate 5, and a plurality of light emitting diodes (LEDs) 6 are mounted as light emitting elements on a mounting surface 5 a set on one surface side of the mounting substrate 5. The part is composed. In this light source unit 2, a frame body 7 surrounding the group of LEDs 6 on the mounting surface 5a is fixed, and a diffusion plate 8 as an optical member is disposed at the end of the frame body 7. Then, the bezel 9 is crowned on the edge of the diffusion plate 8 and the frame body 7, so that the diffusion plate 8 is separated from the mounting substrate 5 with a predetermined gap (air layer) 10. 7 is held.

実装基板5は、平面視略矩形形状をなす回路基板で構成されている。この実装基板5は、例えば、難燃性グレードFR−4のプリント配線基板、ガラス不織布とガラス布とエポキシ樹脂とを用いたコンポジット積層基板(CEM−3基板)、或いは、アルミ基板等を用いて構成されている。また、実装基板5の実装面5a側は、例えば、黒色のPETシートが貼着されることにより、反射率R1が20%以下、好ましくは反射率R1が5%の低反射面で構成されている。なお、実装面5a側の反射率R1は、例えば、実装基板5に用いられるレジストの色等によって調整されるものであってもよい。   The mounting board 5 is configured by a circuit board having a substantially rectangular shape in plan view. The mounting substrate 5 is, for example, a flame retardant grade FR-4 printed wiring board, a composite laminated substrate (CEM-3 substrate) using a glass nonwoven fabric, a glass cloth, and an epoxy resin, or an aluminum substrate. It is configured. Further, the mounting surface 5a side of the mounting substrate 5 is constituted by a low reflection surface having a reflectance R1 of 20% or less, preferably a reflectance R1 of 5%, for example, by sticking a black PET sheet. Yes. The reflectance R1 on the mounting surface 5a side may be adjusted by, for example, the color of the resist used for the mounting substrate 5.

各LED6は、例えば、青色の発光体に黄色の蛍光体が付加された面実装型の白色LEDで構成されている。本実施形態において、実装面5aには64個のLED6が実装されるようになっており、これらLED6は、等間隔毎に配置されることで実装面5a上に8×8のマトリクスを形成する。   Each LED 6 is composed of, for example, a surface-mounted white LED in which a yellow phosphor is added to a blue light emitter. In the present embodiment, 64 LEDs 6 are mounted on the mounting surface 5a, and these LEDs 6 are arranged at equal intervals to form an 8 × 8 matrix on the mounting surface 5a. .

ここで、LED6の出射面には、片凸レンズ6aが固設されている。この片凸レンズ6aの光学特性は、例えば、LED6の出力特性や配列状態等に基づくシミュレーション等によって適宜設定されており、これにより、各LED6の法線方向を光軸とする出射光の放射状態等が最適化されている。   Here, a single-convex lens 6 a is fixed to the emission surface of the LED 6. The optical characteristics of the one-convex lens 6a are appropriately set by, for example, simulation based on the output characteristics and arrangement state of the LEDs 6, and thereby the emission state of the emitted light having the normal direction of each LED 6 as the optical axis, etc. Has been optimized.

なお、LED6としては、上述の白色LEDに代えて、例えば、R,G,Bそれぞれ単色の発光体からなるLEDを使用してもよく、さらに、出射光に紫外線を含む発光体にR,G,Bそれぞれに発光する蛍光体を付加したものを使用してもよい。   In addition, as LED6, it replaces with the above-mentioned white LED, for example, you may use LED which consists of R, G, B each single-color light-emitting body, Furthermore, R, G is used for the light-emitting body which contains an ultraviolet-ray in emitted light. , B may be added with phosphors that emit light.

枠体7は、実装基板5の縁辺部に沿って実装面5aから突出するよう周設された矩形の環状部材で構成されている。この枠体7において、実装基板5と拡散板8との間の空隙10を囲繞する内周面7a(すなわち、LED6群を以上する内周面7a)は、例えば、白色の反射シートが貼着されることにより、反射率R2が80%以上、好ましくは反射率R2が95%の高反射面で構成されている。ここで、内周面7aは、鏡面であることがより好ましい。   The frame body 7 is composed of a rectangular annular member that is provided so as to protrude from the mounting surface 5 a along the edge portion of the mounting substrate 5. In this frame 7, for example, a white reflective sheet is attached to the inner peripheral surface 7 a surrounding the gap 10 between the mounting substrate 5 and the diffusion plate 8 (that is, the inner peripheral surface 7 a including the LED 6 group). As a result, the reflectance R2 is 80% or more, and preferably, the reflectance R2 is 95%. Here, the inner peripheral surface 7a is more preferably a mirror surface.

拡散板8は、実装基板5と略同形の平面視略矩形形状をなす平板状の部材で構成されている。拡散板8の外面側には、レンズシート等からなる複数の光学シート11が貼着され、最外に位置する光学シート11の外面が発光面12として設定されている。   The diffusing plate 8 is composed of a flat plate member having a substantially rectangular shape in plan view that is substantially the same shape as the mounting substrate 5. A plurality of optical sheets 11 made of a lens sheet or the like are attached to the outer surface side of the diffusion plate 8, and the outer surface of the optical sheet 11 positioned at the outermost position is set as the light emitting surface 12.

このように、本実施形態のバックライト装置1は、拡散板8の内面側に複数のLED6が光源として対向配置された、所謂直下型方式のバックライト装置で構成されている。このバックライト装置1を領域発光させるべく、例えば、図2に示すように、発光面12には、等分割された4×4個の発光領域12aが設定されている。また、これらの発光領域12aに対応して、実装基板5上の各LED6は、隣接する2×2個毎の小群にグループ化されている。そして、実装基板5に接続された点灯回路15(図1参照)によって、各LED6がグループ毎にそれぞれ独立駆動されることにより、バックライト装置1は、発光領域毎に所望の輝度を得ることが可能となっている。ここで、各LED6のグループは、例えば、PWM制御によって駆動される。この場合において、各グループに対するPWM信号は、LED6の温度特性等を参照した上で、図示しないフォトセンサやカラーセンサからの信号に基づいてフィードバック制御されることが望ましい。   As described above, the backlight device 1 of the present embodiment is configured by a so-called direct-type backlight device in which a plurality of LEDs 6 are opposed to each other as a light source on the inner surface side of the diffusion plate 8. In order to cause the backlight device 1 to emit light in a region, for example, as shown in FIG. 2, 4 × 4 light emitting regions 12 a that are equally divided are set on the light emitting surface 12. Further, corresponding to these light emitting regions 12a, the LEDs 6 on the mounting substrate 5 are grouped into small groups of 2 × 2 adjacent to each other. Then, each LED 6 is independently driven for each group by the lighting circuit 15 (see FIG. 1) connected to the mounting substrate 5, so that the backlight device 1 can obtain a desired luminance for each light emitting region. It is possible. Here, each group of LEDs 6 is driven by, for example, PWM control. In this case, it is desirable that the PWM signal for each group is feedback-controlled based on signals from a photo sensor and a color sensor (not shown) with reference to the temperature characteristics of the LED 6 and the like.

このような構成のバックライト装置1において、点灯回路15によってグループ毎にLED6が点灯制御されると、点灯制御されたグループ内の各LED6からの出射光は、その多くが、片凸レンズ6aで調光されることにより、LED6の法線方向に対して所定の放射角以内で空隙10内を進行する。そして、これらの光は、空隙10内で混合さえながら拡散板8に達し、主として対応する発光領域12aの発光に寄与するとともに、その周辺の所定領域の微発光に寄与する。一方、片凸レンズ6aで好適に調光されることなくLED6の法線方向に対して大きな放射角で放射された一部の光や拡散板8で反射した一部の光等は、実装面5aに到達すると、これらの光の多くが、そのまま吸収される。すなわち、実装面5aの反射率R1は小さな反射率(例えば、R1=5%)に設定されているため、実装面5aに到達した光の多くがそのまま吸収される。従って、各LED6から出射された光は、空隙10内で必要以上の広範囲に拡散されることが的確に防止され、所望の発光領域12a毎の輝度制御を違和感なく実現することが可能となる。   In the backlight device 1 having such a configuration, when the lighting circuit 15 controls the lighting of the LEDs 6 for each group, most of the emitted light from each LED 6 in the lighting-controlled group is adjusted by the single convex lens 6a. By being illuminated, the light advances in the gap 10 within a predetermined radiation angle with respect to the normal direction of the LED 6. These lights reach the diffusion plate 8 while being mixed in the gap 10, and contribute mainly to the light emission of the corresponding light emitting region 12 a and also to the light emission of a predetermined region around it. On the other hand, a part of light emitted at a large radiation angle with respect to the normal direction of the LED 6 without being appropriately dimmed by the single convex lens 6a, a part of light reflected by the diffusion plate 8, and the like are mounted on the mounting surface 5a. Most of these lights are absorbed as they are. That is, since the reflectance R1 of the mounting surface 5a is set to a small reflectance (for example, R1 = 5%), most of the light reaching the mounting surface 5a is absorbed as it is. Therefore, the light emitted from each LED 6 is accurately prevented from being diffused over a wide range more than necessary in the gap 10, and the luminance control for each desired light emitting region 12a can be realized without a sense of incongruity.

また、発光面12を全面発光させるべく点灯回路15によって全てのLED6が点灯制御された場合においても、同様に、各LED6からの出射光は、空隙10内で必要以上の広範囲に拡散されることなく、主として対応する発光領域12aの発光に寄与するとともに、その周辺の所定領域の微発光に寄与する。これにより、隣接する発光領域12aのLED6からの光が互いの発光を補完し合い、各発光領域12aの境界近傍における輝度ムラの発生が抑制される。ここで、発光面12上の端部(縁辺部)では、隣接する発光領域12aが存在しないため、周辺のLED6からの補完は期待できないが、枠体7の内周面7aの反射率R2は大きな反射率(例えば、R2=95%)に設定されているため、端部に位置するLED6からの光の一部が、内周面7aで反射して自己の発光領域12aの端部の発光を補完する。これにより、発光面12を全域に渡って発光させた場合の輝度ムラを好適に抑制することが可能となる。   Similarly, even when all the LEDs 6 are controlled to be turned on by the lighting circuit 15 so that the light emitting surface 12 emits light entirely, the emitted light from each LED 6 is similarly diffused in the gap 10 over a wide range more than necessary. It contributes mainly to the light emission of the corresponding light emitting region 12a, and also contributes to the light emission of a predetermined region around it. Thereby, the light from LED6 of the adjacent light emission area | region 12a complements mutual light emission, and generation | occurrence | production of the brightness nonuniformity in the boundary vicinity of each light emission area | region 12a is suppressed. Here, since there is no adjacent light emitting region 12a at the end (edge) on the light emitting surface 12, complementation from the surrounding LED 6 cannot be expected, but the reflectance R2 of the inner peripheral surface 7a of the frame 7 is Since the large reflectance (for example, R2 = 95%) is set, a part of the light from the LED 6 located at the end is reflected by the inner peripheral surface 7a and emitted from the end of the self light emitting region 12a. To complement. Thereby, it is possible to suitably suppress luminance unevenness when the light emitting surface 12 emits light over the entire area.

ここで、図4は、実装面5aの反射率R1を5%、内周面7aの反射率R2を95%(非鏡面)に設定した上述のバックライト装置1を全面発光させた際の発光面12全域に渡る輝度分布のシミュレーション結果であり、図7中の折れ線Aは、当該バックライト装置1の、図2のIII−III線に沿う輝度分布のシミュレーション結果である。   Here, FIG. 4 shows light emission when the above-described backlight device 1 in which the reflectance R1 of the mounting surface 5a is set to 5% and the reflectance R2 of the inner peripheral surface 7a is set to 95% (non-mirror surface) is caused to emit light entirely. 7 is a simulation result of the luminance distribution over the entire surface 12, and a broken line A in FIG. 7 is a simulation result of the luminance distribution of the backlight device 1 along the line III-III in FIG.

また、図5は、実装面5aの反射率R1を5%、内周面7aを反射率R2が95%の鏡面に設定した上述のバックライト装置1を全面発光させた際の発光面12全域に渡る輝度分布のシミュレーション結果であり、図7中の折れ線Bは、当該バックライト装置1の、図2のIII−III線に沿う輝度分布のシミュレーション結果である。   Further, FIG. 5 shows the entire area of the light emitting surface 12 when the above-described backlight device 1 having the mounting surface 5a having a reflectance R1 of 5% and the inner peripheral surface 7a having a mirror surface having a reflectance R2 of 95% emits light. The broken line B in FIG. 7 is the simulation result of the luminance distribution of the backlight device 1 along the line III-III in FIG.

一方、図6は、上述のバックライト装置1において、実装面5aの反射率R1は5%のまま保持したまま、内周面7aの反射率R2を5%に変更し、全面発光させた際の発光面12全域に渡る輝度分布のシミュレーション結果を比較例として示すものであり、図7中の折れ線Cは、当該反射率R2を変更後のバックライト装置1の、図2のIII−III線に沿う輝度分布のシミュレーション結果を比較例として示すものである。   On the other hand, FIG. 6 shows the above-described backlight device 1 when the reflectance R1 of the mounting surface 5a is maintained at 5% and the reflectance R2 of the inner peripheral surface 7a is changed to 5% to emit light entirely. FIG. 7 shows a simulation result of luminance distribution over the entire light emitting surface 12 as a comparative example, and a broken line C in FIG. 7 shows the line III-III in FIG. 2 of the backlight device 1 after changing the reflectance R2. The simulation result of the luminance distribution along is shown as a comparative example.

これらの対比からも明らかなように、実装面5aの反射率R1を低い反射率に設定するとともに、内周面7aの反射率R2を実装面5aの反射率R1よりも相対的に高い反射率に設定することにより、発光面12の端部に暗部が発生することを抑制し、発光面12を全域に渡って高い輝度の均斉度で発光させることが可能となる。さらに、内周面7aを鏡面とすることにより、発光面12を全面発光させた際の輝度の均斉度をより向上させることができる。   As apparent from these comparisons, the reflectance R1 of the mounting surface 5a is set to a low reflectance, and the reflectance R2 of the inner peripheral surface 7a is relatively higher than the reflectance R1 of the mounting surface 5a. By setting to, it is possible to suppress the occurrence of a dark portion at the end portion of the light emitting surface 12, and to emit light with high brightness uniformity over the entire region. Furthermore, by using the inner peripheral surface 7a as a mirror surface, it is possible to further improve the luminance uniformity when the entire light emitting surface 12 emits light.

ところで、上述のバックライト装置1においては、8×8個のLED6を均等配置し、16等分割した発光面12上の各発光領域12aをそれぞれ2×2個のLED6を使用して発光させる場合の一例について説明したが、1の発光領域12a毎のLED6の数、LED6の配置、発光領域12aの形状、発光領域12aの数等は、適用される液晶表示装置の大きさや解像度等によって任意に変更することが可能である。   By the way, in the above-described backlight device 1, 8 × 8 LEDs 6 are evenly arranged, and each light emitting region 12 a on the light emitting surface 12 divided into 16 equal parts is caused to emit light using 2 × 2 LEDs 6. However, the number of the LEDs 6 for each light emitting area 12a, the arrangement of the LEDs 6, the shape of the light emitting area 12a, the number of the light emitting areas 12a, etc. are arbitrarily determined depending on the size and resolution of the liquid crystal display device to be applied. It is possible to change.

例えば、図8,9に示すように、10×10個のLED6を用い、25等分割した発光面12上の各発光領域12aをそれぞれ2×2個のLED6を使用して発光させることも可能である。   For example, as shown in FIGS. 8 and 9, 10 × 10 LEDs 6 can be used, and each light emitting region 12 a on the light emitting surface 12 divided into 25 equal parts can be emitted using 2 × 2 LEDs 6. It is.

さらに、例えば、発光領域12aに対応するグループ間で隣接するLED6の間隔d2を、同一グループ内で隣接するLED6の間隔d1よりも相対的に大きく設定することも可能である。このように構成すれば、例えば、バックライト装置1の一の発光領域12aのみを領域発光させる際に、隣接する他の発光領域12aに対するLED6からの直接的な「漏れ光」の量を抑制することができる。これにより、各LED6の点灯制御による明るさの領域コントロールを鮮明なものとすることが可能となる。   Further, for example, the interval d2 between the LEDs 6 adjacent to each other in the group corresponding to the light emitting region 12a can be set relatively larger than the interval d1 between the LEDs 6 adjacent in the same group. With this configuration, for example, when only one light emitting area 12a of the backlight device 1 emits light, the amount of direct “leakage light” from the LED 6 with respect to another adjacent light emitting area 12a is suppressed. be able to. Thereby, it becomes possible to make the brightness area control by the lighting control of each LED 6 clear.

その一方で、発光区分の過剰な明瞭化を抑制したい場合、実装面5aの反射率R1を高く設定することにより、該当する発光領域12aの周辺領域を微発光させるための光を補うことができる。そして、このように実装面5aの反射率R1を高めることにより、LED6から出射される光の利用効率を向上することができる。なお、この場合においても、発光面12を全面発光させた際の輝度ムラを抑制すべく、実装面5aと内周面7aとの反射率の関係は、R1<R2に設定されていることは勿論である。   On the other hand, when it is desired to suppress excessive clarification of the light emitting section, the light for causing the peripheral region of the corresponding light emitting region 12a to emit light can be supplemented by setting the reflectance R1 of the mounting surface 5a high. . And the utilization efficiency of the light radiate | emitted from LED6 can be improved by raising the reflectance R1 of the mounting surface 5a in this way. Even in this case, the relationship between the reflectances of the mounting surface 5a and the inner peripheral surface 7a is set to R1 <R2 in order to suppress luminance unevenness when the entire light emitting surface 12 emits light. Of course.

このような構成によれば、例えば、図10中に破線でに示すように、LED6から出射される光の利用効率を向上させつつも、全LED6を均等配置した場合の相対輝度特性(図10中に実線で示す)と略同等の相対輝度特性を得ることができる。   According to such a configuration, for example, as indicated by a broken line in FIG. 10, the relative luminance characteristics (FIG. 10) when all the LEDs 6 are evenly arranged while improving the utilization efficiency of the light emitted from the LEDs 6. It is possible to obtain a relative luminance characteristic substantially equivalent to that indicated by a solid line.

なお、上述の実施形態においては、LEDを発光素子として用いた一例について説明したが、本発明はこれに限定されるものではなく、例えば、有機EL等を発光素子として用いることも可能である。   In the above-described embodiment, an example in which an LED is used as a light emitting element has been described. However, the present invention is not limited to this, and for example, an organic EL or the like can also be used as a light emitting element.

バックライト装置の要部を示す分解斜視図An exploded perspective view showing the main part of the backlight device バックライト装置の平面図Plan view of backlight device 図2のIII−III線に沿う要部断面図Cross-sectional view of essential parts along the line III-III in FIG. 実装面の反射率を5%に設定し且つ内周面の反射率を95%に設定したバックライト装置を全面発光させたときの輝度分布のシミュレーション結果を模式的に示す説明図Explanatory drawing which shows typically the simulation result of the luminance distribution when the backlight apparatus which set the reflectance of the mounting surface to 5% and the reflectance of the inner peripheral surface is set to 95% is caused to emit light entirely. 実装面の反射率を5%に設定し且つ内周面を反射率が95%の鏡面に設定したバックライト装置を全面発光させたときの輝度分布のシミュレーション結果を模式的に示す説明図、Explanatory drawing which shows typically the simulation result of the luminance distribution when the backlight apparatus which set the reflectance of the mounting surface to 5% and the inner peripheral surface is set to a mirror surface having a reflectance of 95%, and emits light entirely. 比較例として実装面の反射率及び内周面の反射率を5%に設定したバックライト装置を全面発光させたときの輝度分布のシミュレーション結果を模式的に示す説明図As a comparative example, an explanatory view schematically showing a simulation result of luminance distribution when the backlight device having the reflectance of the mounting surface and the reflectance of the inner peripheral surface set to 5% emits light over the entire surface. バックライト装置を全面発光させたときの図2のIII−III線に沿う各輝度分布のシミュレーション結果を示す説明図Explanatory drawing which shows the simulation result of each luminance distribution along the III-III line | wire of FIG. 2 when a backlight apparatus is made to light-emit the whole surface. バックライト装置の変形例を示す平面図The top view which shows the modification of a backlight apparatus 図8のIX−IX線に沿う要部断面図Cross-sectional view of essential parts along the line IX-IX in FIG. バックライト装置を領域発光させたときの図8のIX−IX線に沿う輝度分布のシミュレーション結果を示す説明図Explanatory drawing which shows the simulation result of the luminance distribution along the IX-IX line of FIG. 8 when the backlight device emits a region.

符号の説明Explanation of symbols

1…バックライト装置、2…光源ユニット、5…実装基板、5a…実装面、6…発光ダイオード(発光素子)、6a…片凸レンズ、7…枠体、7a…内周面、8…拡散板(光学部材))、9…ベゼル、10…空隙、11…光学シート、12…発光面、12a…発光領域、15…点灯回路、R1…反射率(実装面の反射率)、R2…反射率(内周面の反射率)、d1…間隔(グループ内における発光素子の間隔)、d2…間隔(グループ間における発光素子の間隔)   DESCRIPTION OF SYMBOLS 1 ... Backlight apparatus, 2 ... Light source unit, 5 ... Mounting board, 5a ... Mounting surface, 6 ... Light emitting diode (light emitting element), 6a ... Single convex lens, 7 ... Frame, 7a ... Inner peripheral surface, 8 ... Diffusing plate (Optical member)), 9 ... bezel, 10 ... gap, 11 ... optical sheet, 12 ... light emitting surface, 12a ... light emitting region, 15 ... lighting circuit, R1 ... reflectance (reflectance of mounting surface), R2 ... reflectance (Reflectance of inner peripheral surface), d1... Interval (interval of light emitting elements in a group), d2... Interval (interval of light emitting elements between groups)

Claims (4)

外面側に発光面が設定された光学部材と、
前記光学部材の内面側に実装面が対向された実装基板と、
前記実装面上に実装された複数の発光素子と、
前記発光素子群を囲繞して前記光学部材と前記実装基板との間に空隙を形成する枠体とを備え、
前記実装面の反射率を前記枠体の内周面の反射率よりも小さく設定したことを特徴とするバックライト装置。
An optical member having a light emitting surface set on the outer surface side;
A mounting substrate whose mounting surface is opposed to the inner surface of the optical member;
A plurality of light emitting elements mounted on the mounting surface;
A frame that surrounds the light emitting element group and forms a gap between the optical member and the mounting substrate;
The backlight device characterized in that the reflectance of the mounting surface is set smaller than the reflectance of the inner peripheral surface of the frame.
前記枠体の内周面は鏡面であることを特徴とする請求項1記載のバックライト装置。   The backlight device according to claim 1, wherein an inner peripheral surface of the frame is a mirror surface. 前記複数の発光素子は、前記発光面に設定される複数の領域毎にグループ化され、各グループ毎に点灯制御されることを特徴とする請求項1または請求項2に記載のバックライト装置。   The backlight device according to claim 1, wherein the plurality of light emitting elements are grouped for each of a plurality of regions set on the light emitting surface, and lighting control is performed for each group. 前記グループ内における前記発光素子の間隔は、隣接する前記グループ間における前記発光素子の間隔よりも相対的に小さく設定されていることを特徴とする請求項3記載のバックライト装置。   The backlight device according to claim 3, wherein an interval between the light emitting elements in the group is set to be relatively smaller than an interval between the light emitting elements between the adjacent groups.
JP2008021328A 2008-01-31 2008-01-31 Backlight device Abandoned JP2009181883A (en)

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WO2011111516A1 (en) 2010-03-12 2011-09-15 シャープ株式会社 Light-emitting device manufacturing method, light-emitting device, lighting device, backlight, liquid-crystal panel, display device, display device manufacturing method, display device drive method and liquid-crystal display device
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