CN109215520B

CN109215520B - L ED display screen and manufacturing method thereof

Info

Publication number: CN109215520B
Application number: CN201811182910.0A
Authority: CN
Inventors: 熊充
Original assignee: Huizhou China Star Optoelectronics Technology Co Ltd
Current assignee: Huizhou China Star Optoelectronics Technology Co Ltd
Priority date: 2018-10-11
Filing date: 2018-10-11
Publication date: 2020-07-10
Anticipated expiration: 2038-10-11
Also published as: WO2020073525A1; CN109215520A

Abstract

The application provides a L ED display screen and a manufacturing method thereof, wherein the L ED display screen comprises a glass substrate, optical cement and a L ED display module, the L ED display module is arranged on the glass substrate side by side, the optical cement is arranged between the L ED display module and the glass substrate and is used for packaging L ED chips of the L ED display module and fixing the L ED display module on the glass substrate, and the L ED display module comprises a PCB and L ED chips arranged on one side of the PCB facing the glass substrate, and the L ED chips are completely coated by the optical cement.

Description

L ED display screen and manufacturing method thereof

Technical Field

The application relates to a display technology, in particular to an L ED display screen and a manufacturing method thereof.

Background

At present, L ED display screens are widely applied to outdoor oversized display screens, and a common scheme of the L ED display screen is that chips of red, green and blue three primary colors are packaged in a single L ED device, then the L ED device is printed on a PCB to form an independent display screen module, and a plurality of independent display screen modules are mechanically assembled to form a large-sized display screen.

The minimum interval (the dot spacing) between the pixel of current L ED display screen can only accomplish about 1 millimeter, closely watch occasionally obvious granular sensation, and L ED screen need splice a plurality of independent display module, because the error of mechanical concatenation exists, lead to the display to have the concatenation seam to exist, the concatenation seam is between 0.5 ~ 1 millimeter, in addition, L ED display screen is in the in-process of transportation or loading and unloading, the concatenation seam can grow.

Therefore, it is desirable to provide an L ED display screen with small splicing gap and no obvious granular feeling when viewed and a manufacturing method thereof, so as to solve the above technical problems.

Disclosure of Invention

The embodiment of the application provides an L ED display screen and a manufacturing method thereof, and aims to solve the technical problems that the existing L ED display screen is obvious in granular sensation and large in splicing gaps among display modules when being watched at a short distance.

The embodiment of this application provides an L ED display screen, it includes:

a glass substrate;

a plurality of L ED display modules arranged side by side on the glass substrate, and

an optical adhesive disposed between the plurality of L ED display modules and a glass substrate for encapsulating the L ED chips of the plurality of L ED display modules and for securing the plurality of L ED display modules to the glass substrate;

the L ED display module includes the PCB board, sets up in the PCB face to L ED chip of glass substrate one side and setting up in the PCB board is dorsad be used for the drive of glass substrate one side the luminous drive component of L ED chip, the optical cement totally cladding L ED chip.

In the L ED display screen, the front projection area of the L ED chip is less than or equal to 0.04 square millimeter and more than or equal to 1 square micrometer.

In the L ED display screen of this application, the thickness of the optical cement is greater than the height of the L ED chip.

In the L ED display screen of this application, there is the concatenation gap between adjacent L ED display module, the width of concatenation gap is less than or equal to 0.1 millimeter.

In the L ED display screen, the splicing gaps are filled with a reflecting substance, and the reflecting surface of the reflecting substance faces to the glass substrate.

In the L ED display screen, the optical glue is a high molecular transparent material.

In the L ED display screen of this application, the optical cement is silica gel.

In the L ED display screen of this application, the optical cement includes the interval part between L ED chip and the glass substrate, the thickness of interval part is 90 microns or less.

The application also relates to a manufacturing method of the L ED display screen, which comprises the following steps:

101: providing a glass substrate;

102, coating a layer of optical cement on the glass substrate, wherein the thickness of the optical cement is less than the height of an L ED chip;

fixing L ED display module on a fixing jig, placing the L ED display module on the optical adhesive, immersing part of the L ED chip of the L ED display module in the optical adhesive, wherein the L ED display module comprises a PCB board and the L ED chip arranged on the PCB board;

fixing a plurality of L ED display modules on the same plane by the fixing jig by taking the surface of the glass substrate as a reference plane;

105, injecting the optical cement again around the glass substrate so that the optical cement completely immerses the L ED chip;

106, shortening the splicing gap between the adjacent L ED display modules by adjusting the fixing jig;

107, arranging a pressure plate above the L ED display module to reduce the thickness of the optical adhesive between the L ED display module and the glass substrate;

108: and curing the optical cement, and removing the pressing plate and the fixed jig.

In the method for manufacturing the L ED display screen, the step 106 includes:

and adjusting the fixed jigs to move along the X-axis direction or/and the Y-direction by taking the surface of the glass substrate as a reference plane until the adjacent fixed jigs are contacted with each other.

In the L ED display screen manufacturing method of the present application, the L ED display screen manufacturing method further includes:

109, spraying a reflecting substance in the gaps among the L ED display modules.

In the L ED display screen manufacturing method, the reflecting material is white ink.

In the L ED display screen manufacturing method, the width of the splicing gap between the adjacent L ED display modules is less than or equal to 0.1 mm.

In the manufacturing method of the L ED display screen, the orthographic projection area of the L ED chip is less than or equal to 0.04 square millimeter and more than or equal to 1 square micrometer.

In the L ED display screen manufacturing method, the optical cement is a high-molecular transparent material.

In the L ED display screen manufacturing method, the optical cement is silica gel.

Compared with the L ED display screen and the manufacturing method thereof in the prior art, the L ED display screen and the manufacturing method thereof fix a plurality of L ED display modules on the glass substrate through the optical cement, so that the stability of the L ED display screen is improved, and the phenomenon that the splicing gap between the L ED display modules is enlarged in the transportation, loading and unloading processes is avoided;

in addition, the arrangement that the orthographic projection area of the L ED chip of the L ED display module is less than or equal to 0.04 square millimeter and more than or equal to 1 square micrometer improves the PPI index, enhances the display effect, and solves the technical problems that the granular sensation is obvious and the splicing gap between the display modules is large when the existing L ED display screen is watched at a close distance.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required in the embodiments are briefly described below. The drawings in the following description are only some embodiments of the present application, and it will be obvious to those skilled in the art that other drawings can be obtained from the drawings without inventive effort.

FIG. 1 is a schematic diagram of a preferred embodiment of an L ED display screen of the present application;

fig. 2 is a flowchart of a preferred embodiment of a method for manufacturing an L ED display screen according to the present application.

Detailed Description

Refer to the drawings wherein like reference numbers refer to like elements throughout. The following description is based on illustrated embodiments of the application and should not be taken as limiting the application with respect to other embodiments that are not detailed herein.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an L ED display panel of the present application, an embodiment of a L ED display panel 100 of the present application includes a glass substrate 11, a plurality of L ED display modules 12, and an optical adhesive 13.

The plurality of L ED display modules 12 are arranged side by side on the glass substrate 11, the optical glue 13 is arranged between the plurality of L ED display modules 12 and the glass substrate 11 for encapsulating the L ED chips 122 of the plurality of L ED display modules 12 and for securing the plurality of L ED display modules 12 on the glass substrate 11.

L ED display module 12 comprises PCB 121, L ED chips 122 disposed on the side of PCB 121 facing glass substrate 11, and driving components 123 disposed on the side of PCB 121 facing away from glass substrate 11 for driving L ED chips 122 to emit light, optical glue 13 completely covers L ED chips 121.

The setting of optical cement 13 is passed through to this embodiment, carries out fixed connection with a plurality of L ED display module 12 and glass substrate 11, has improved the stability after the concatenation of a plurality of L ED display module 12, has avoided L ED display screen 100 to lead to L ED display module 12 to become flexible because of collision or vibrations in the process appearance L ED display module 12 between transportation and loading and unloading, and then has increased the condition emergence in concatenation gap.

The glass substrate 11 plays a role in protecting L ED chips 122, and in the manufacturing process of the embodiment, the glass substrate 11 plays a role in a reference plane so as to enable the L ED display modules 12 to be arranged on the same plane, and flatness is improved, the optical adhesive 13 plays a role in packaging L ED chips 122 and enabling the glass substrate 11 and the L ED display modules 12 to be fixedly connected, and the optical adhesive 13 is made of a transparent material and is convenient to transmit light rays emitted by the L ED chips 121, so that the optical adhesive 13 is not only a high-molecular transparent material, but also has functions of isolating water vapor and adhering, and optionally, the optical adhesive 13 is silica gel.

In the embodiment of the L ED display screen 100, the thickness of the optical adhesive 13 is greater than the height of the L ED chips 122. the thickness of the optical adhesive 13 is set to be greater than the height of the L ED chips 122, which serves to protect the chip solder, and support and fix the chip solder, since the optical adhesive 13 is interposed between the glass substrate 11 and the L ED display module 12, the optical adhesive 13 serves to support the L ED display module 12, so as to prevent the L ED display module 12 from being stressed during the manufacturing process, and to cause the L ED chips 122 to press the glass substrate 11, thereby damaging the L ED chips 122.

In addition, the thickness of the optical adhesive 13 between the glass substrate 11 and the L ED chip 122 can be adjusted according to actual conditions, when the thickness of the optical adhesive 13 at this portion is smaller, the light transmission of the L ED display screen 100 is better, and the performance of supporting the L ED display module 12 is weaker, while the effective portion of the optical adhesive 13 supported on the L ED display module 12 is L ED chip 122 and PCB board 121, therefore, as long as the supporting performance of the optical adhesive 13 on the PCB board 121 is enough to avoid L ED chip 122 from pressing the glass substrate 11, the thickness of the optical adhesive 13 between the glass substrate 11 and the L ED chip 122 can be reduced as much as possible.

In this embodiment, the thickness of the optical glue 13 between the glass substrate 11 and the L ED chip 122 is less than 100 microns, alternatively, the thickness may be 90 microns, 70 microns, 50 microns, 30 microns, 20 microns, 10 microns, 5 microns, 2 microns, and 1 micron, or even 0 microns.

In the embodiment of the L ED display screen 100, the L ED chips 122 have an orthographic projection area of 0.04 mm square or less and 1 μm square or more.

The area size of L ED chip 122 is set to be 0.04 square millimeter or less and 1 square micrometer or more, compared with L ED chip in the prior art, the size of L ED chip 122 is reduced to achieve PPI index improvement, display effect enhancement, and avoid the phenomenon of obvious granular sensation when viewing L ED display screen 100 at a close distance, wherein, optionally, L ED display module 12 can be mini-L ED or micro-L ED display module.

In the embodiment of the L ED display screen 100, a splicing gap exists between adjacent L ED display modules 12, the width of the splicing gap is less than or equal to 0.1 mm, the splicing gap is reduced, the viewing effect of the L ED display screen 100 is improved, in addition, a reflecting substance 14 is filled in the splicing gap, the reflecting surface of the reflecting substance 14 faces towards the glass substrate 11, the reflecting substance 14 can be white ink, the color of the reflecting substance 14 is consistent with that of the surface of the PCB 121, the splicing gap is hidden, the splicing gap cannot be seen by naked eyes, and the viewing effect is improved.

Referring to fig. 2, the present application further relates to a manufacturing method of an L ED display screen, which includes the steps of:

101: a glass substrate is provided.

And 102, coating a layer of optical cement on the glass substrate, wherein the thickness of the optical cement is less than the height of the L ED chip.

And 103, fixing L ED display modules on a fixing jig, and placing the L ED display modules on the optical adhesive, wherein the L ED chips of the L ED display modules are partially immersed in the optical adhesive, and the L ED display modules comprise a PCB and the L ED chips arranged on the PCB.

And 104, taking the surface of the glass substrate as a reference plane, and fixing the L ED display modules on the same plane through the fixing jig.

And 105, injecting the optical cement again around the glass substrate so that the optical cement completely immerses the L ED chip.

And 106, shortening the splicing gap between the adjacent L ED display modules by adjusting the fixing jig.

And 107, arranging a pressure plate above the L ED display module to reduce the thickness of the optical adhesive between the L ED display module and the glass substrate.

In this embodiment, the structure of the L ED display is the same as the structure of the L ED display 100 of the above embodiment, and the following is a detailed explanation of the above manufacturing method.

Step 101: a glass substrate is provided. Wherein the glass substrate is horizontally disposed.

102, coating a layer of optical cement on the glass substrate, wherein the thickness of the optical cement is smaller than the height of the L ED chip, the thickness of the first layer of optical cement is set to be smaller than the height of the L ED chip, so that the optical cement is prevented from exceeding a PCB of a L ED display module, and the position of the L ED display module is convenient to adjust in the subsequent steps.

And 103, fixing the L ED display module on a fixing jig, placing the L ED display module on optical cement, immersing part of a L ED chip of the L ED display module in the optical cement, and arranging a L ED chip on the PCB of the L ED display module.

In addition, the orthographic projection area of the L ED chip is less than or equal to 0.04 square millimeter and more than or equal to 1 square micrometer, the size of the L ED chip is reduced, the PPI index is improved, the display effect is enhanced, and the phenomenon of obvious granular sensation is avoided when a L ED display screen is watched at a short distance, wherein the L ED display module can be selected from a mini-L ED display module or a micro-L ED display module.

And 104, fixing a plurality of L ED display modules on the same plane by using the surface of the glass substrate as a reference plane through a fixing jig, wherein the L ED display modules are preliminarily positioned and arranged by using the surface of the glass substrate as a reference plane which is horizontally arranged, and the flatness between the L ED display modules is improved.

And 105, injecting optical cement again around the glass substrate to enable the L ED chips to be completely immersed in the optical cement, wherein the L ED display module is fixed and positioned by the fixing jig, and therefore the L ED chips are completely immersed in the optical cement again to achieve the purpose of packaging and protecting the L ED chips.

And 106, shortening a splicing gap between adjacent L ED display modules by adjusting the fixing jig, wherein the step 106 specifically comprises the following steps:

and taking the surface of the glass substrate as a reference plane, and adjusting the fixed jigs to move along the X-axis direction or/and the Y-axis direction until the adjacent fixed jigs are contacted with each other.

So that the stitching gap between L ED display modules is minimized, the width of the stitching gap between adjacent L ED display modules is 0.1 mm or less.

And 107, arranging a pressure plate above the L ED display module to reduce the thickness of the optical adhesive between the L ED display module and the glass substrate, wherein the pressure plate is used for applying pressure to the L ED display module to lower the L ED display module, and in addition, because of the support property of the optical adhesive, the L ED display module needs larger pressure to lower, so that the L ED display module does not quickly lower when the pressure plate is applied, and the L ED chip presses the glass substrate.

Therefore, the thickness of the optical adhesive between the glass substrate and the L ED chip can be adjusted by increasing or decreasing the weight of the pressing plate.

And 108, curing the optical adhesive, and removing the pressing plate and the fixing jig, wherein the stability of the spliced L ED display modules is improved, and the phenomenon that the L ED display modules are loosened due to collision or vibration of a splicing gap between L ED display modules in the transportation, loading and unloading processes of the L ED display screen is avoided, so that the splicing gap is increased.

And 109, spraying a reflecting substance in the gaps among the L ED display modules, wherein the splicing gaps are filled with the reflecting substance, the reflecting surfaces of the reflecting substance face to the glass substrate, and the reflecting substance can be white ink, so that the color of the reflecting substance is consistent with that of the surface of the PCB to hide the splicing gaps, the splicing gaps cannot be seen by naked eyes, and the viewing effect is improved.

As described above, it will be apparent to those skilled in the art that various other changes and modifications can be made based on the technical solution and the technical idea of the present invention, and all such changes and modifications should fall within the protective scope of the appended claims.

Claims

1. An L ED display screen, comprising:

a glass substrate;

the L ED display module includes the PCB board and sets up the PCB face to L ED chip of glass substrate one side, the optical cement totally cladding the plain noodles of L ED chip and the naked part of circumference.

2. An L ED display screen as claimed in claim 1, wherein the L ED chip has an orthographic area equal to or less than 0.04 mm square and equal to or greater than 1 μm square.

3. An L ED display screen according to claim 1, wherein the optical glue has a thickness greater than the height of the L ED chips.

4. An L ED display screen as claimed in claim 1, wherein there is a splice gap between adjacent L ED display modules, the width of the splice gap being 0.1 mm or less.

5. An L ED display screen as claimed in claim 4, wherein the splicing gaps are filled with a reflective substance, the reflective surface of the reflective substance faces the glass substrate.

6. A manufacturing method of an L ED display screen is characterized by comprising the following steps:

101: providing a glass substrate;

105, injecting the optical cement again around the glass substrate to enable the optical cement to be completely immersed in the L ED chip, wherein the optical cement completely covers the light-emitting surface and the circumferential exposed part of the L ED chip;

7. The method for manufacturing an L ED display screen according to claim 6, wherein the step 106 includes:

8. The L ED display screen manufacturing method of claim 6, wherein the L ED display screen manufacturing method further comprises:

9. A method of manufacturing a L ED display screen as claimed in claim 8 wherein the reflective material is white ink.

10. The method of claim 6, wherein the width of the stitching gap between adjacent L ED display modules is 0.1 mm or less.