CN113764455B - Spliced display panel and spliced display device - Google Patents
Spliced display panel and spliced display device Download PDFInfo
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- CN113764455B CN113764455B CN202111050350.5A CN202111050350A CN113764455B CN 113764455 B CN113764455 B CN 113764455B CN 202111050350 A CN202111050350 A CN 202111050350A CN 113764455 B CN113764455 B CN 113764455B
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- 239000000758 substrate Substances 0.000 claims abstract description 62
- 239000011159 matrix material Substances 0.000 claims description 10
- 238000004806 packaging method and process Methods 0.000 claims description 8
- 230000007246 mechanism Effects 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 3
- 239000004568 cement Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 238000005452 bending Methods 0.000 abstract description 6
- 230000009467 reduction Effects 0.000 abstract description 5
- 230000000694 effects Effects 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
- H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The application discloses a spliced display panel and a spliced display device, wherein the spliced display panel comprises at least two spliced units, each spliced unit is provided with a display area and a binding area adjacent to the display area, and each spliced unit comprises: a substrate base plate, a plurality of LED chips and a flip-chip film; defining one side of the LED chip facing the substrate as a light emitting side, and defining one side of the LED chip far away from the substrate as a backlight side; when two adjacent splicing units are spliced, the flip chip film of one splicing unit extends to the backlight side of the other splicing unit. By changing the spliced display panel to emit light from one side of the substrate, all the flip chip films can be hidden to the backlight side, so that seamless splicing is realized, and the problem of yield reduction caused by excessive bending of the flip chip films can be avoided.
Description
Technical Field
The application relates to the technical field of display, in particular to a spliced display panel and a spliced display device comprising the spliced display panel.
Background
In recent years, LED (light-emitting diode) display has been rapidly developed, and as the pixel size is continuously reduced, application scenes have become wide. The LED display is the main stream of indoor and outdoor large-screen high-definition display in the future from the original indoor and outdoor large-scale remote advertising screens to indoor and outdoor short-distance high-definition display screens.
At present, large-screen LED display mainly adopts a module splicing technology, namely, small-size LED modules are spliced into a large screen with any size. The LED modules which are already produced at present all use PCBs (Printed Circuit Board, printed circuit boards) as substrates, and the disadvantage is that PM (passive matrix) driving is adopted, the number of IC (Integrated Circuit Chip) chips is large, the heat dissipation is poor, the process precision is low, and smaller pixels are difficult to realize. Therefore, the glass-based LED display module gradually highlights the advantages of adopting AM (active matrix) drive, having the advantages of small number of IC chips, better heat dissipation, high process precision, being capable of realizing the pixel size below 0.6mm, and the like. However, in the glass-based LED module, COF (Chip On Film) bonding technology is required, if the bonding is performed according to a conventional bonding method, the COF needs to be sandwiched between the joints, and the COF is bent at a large angle, so that the COF is easily broken, resulting in a reduction in yield, and a truly seamless bonding cannot be realized.
Accordingly, there is an urgent need for improvement in view of the drawbacks existing in the prior art.
Disclosure of Invention
The application aims to provide a spliced display panel and a spliced display device, so as to realize seamless splicing between spliced display panels and avoid the problem of yield reduction caused by excessive bending of a flip chip film.
The embodiment of the application provides a spliced display panel, which comprises at least two spliced units, wherein each spliced unit is provided with a display area and a binding area adjacent to the display area, and the spliced units comprise: a substrate base plate; the LED chips are arranged on the substrate base plate and are positioned in the display area; the flip chip film is arranged on the substrate and is positioned in the binding area; defining one side of the LED chip facing the substrate as a light emitting side, and defining one side of the LED chip far away from the substrate as a backlight side; when two adjacent splicing units are spliced, the flip chip film of one splicing unit extends to the backlight side of the other splicing unit.
Optionally, in some embodiments of the present application, the at least two splicing units include a first splicing unit and a second splicing unit; when the first splicing unit is spliced with the second splicing unit, the flip chip film positioned in the binding area of the first splicing unit extends to the backlight side of the LED chip in the display area of the second splicing unit; the flip chip film located in the binding region of the second splicing unit extends to the backlight side of the LED chip in the display region of the first splicing unit.
Alternatively, in some embodiments of the present application, the substrate is a transparent substrate, including a glass substrate or a polyimide substrate.
Optionally, in some embodiments of the application, each of the splicing units further comprises: and the packaging layer covers the LED chip and the substrate base plate and is positioned in the display area, when two adjacent splicing units are spliced, the flip chip film of one splicing unit is lapped to one side, far away from the LED chip, of the packaging layer of the other splicing unit.
Optionally, in some embodiments of the present application, the material of the encapsulation layer includes: epoxy or optical cement.
Optionally, in some embodiments of the application, each of the splicing units further comprises: the shading matrix is arranged on the light emitting side of the LED chip and exposes the LED chip.
Optionally, in some embodiments of the present application, the LED chip is a tricolor LED chip, including: a red LED chip, a green LED chip, and a blue LED chip; the LED chip is flip-chip fixed on the substrate base plate.
Optionally, in some embodiments of the present application, the LED chip further includes a light reflecting layer disposed on the backlight side of the LED chip.
Optionally, in some embodiments of the application, the light reflecting layer includes: a distributed bragg reflective film or a metallic reflective film.
Correspondingly, an embodiment of the present application further provides a tiled display device, including the tiled display panel described in any one of the above embodiments, where the tiled display device further includes: and at least two splicing mechanisms, wherein each splicing mechanism is arranged corresponding to the splicing unit so as to fix the splicing unit on a frame.
Compared with the prior art, the embodiment of the application provides a spliced display panel, which comprises at least two spliced units, namely a first spliced unit and a second spliced unit; when the first splicing unit is spliced with the second splicing unit, the flip chip film positioned in the binding area of the first splicing unit extends to the backlight side of the LED chip in the display area of the second splicing unit; and the flip chip film positioned in the binding area of the second splicing unit extends to the backlight side of the LED chip in the display area of the first splicing unit. On one hand, the problem of yield reduction caused by large-angle bending of the flip chip film can be avoided; on the other hand, the edges of the substrate base plates of the first splicing unit and the second splicing unit can be completely contacted, so that seamless splicing is realized, and the display effect of the spliced display panel is improved.
Further, a light reflecting layer is arranged on the backlight side of the LED chip, and can effectively improve the light emitting effect of the LED chip and the brightness of the spliced display panel. The packaging layer is arranged to provide protection for the LED chip and prevent failure caused by interference of external environment, and to provide a flat supporting surface for extension of the flip chip film adjacent to the splicing unit. Because the light emitting side is arranged on one side of the substrate, the metal wiring on the substrate can reflect ambient light to influence the ambient contrast, and the light shielding matrix is arranged on the light emitting side of the LED chip, so that the metal wiring can be effectively shielded, the LED chip is exposed, and the contrast of the spliced display panel is improved on the premise that the light emitting effect of the spliced display panel is not influenced, and the display effect is further improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of a tiled display panel according to an embodiment of the present application;
FIG. 2 is a schematic plan view of a tiled display panel according to an embodiment of the present application;
FIG. 3 is a schematic view of another planar structure of the tiled display panel according to the embodiment of the present application;
FIG. 4 is a schematic view of another planar structure of a tiled display panel according to an embodiment of the present application;
fig. 5 is a schematic plan view of a tiled display device according to an embodiment of the application.
The main reference numerals illustrate:
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to fall within the scope of the application. Furthermore, it should be understood that the detailed description is presented herein for purposes of illustration and description only, and is not intended to limit the application. In the present application, unless otherwise indicated, terms such as "upper", "lower", "left" and "right" may be directions of actual use or working states of the apparatus, may refer to directions of the drawings in the drawings, or may refer to two directions opposite to each other; while "inner" and "outer" are for the outline of the device.
An embodiment of the present application provides a tiled display panel 10, where the tiled display panel 10 includes at least two tiled units 100, each of the tiled units having a display area 11 and a binding area 12 adjacent to the display area 11, each of the tiled units 100 including: a substrate base 110; a plurality of LED chips 120, wherein the LED chips 120 are disposed on the substrate 110 and located in the display area 11; the flip chip film 130 is disposed on the substrate 110 and located in the bonding area 12; wherein, a side of the LED chip 120 facing the substrate 110 is defined as a light emitting side, and a side of the LED chip 120 away from the substrate 110 is defined as a backlight side. The light-emitting side refers to the light-emitting side of the LED chip 120, the light-emitting side of the splice unit 100, or the light-emitting side of the splice display panel 10. When two adjacent splice units 100 are spliced, the flip chip film 130 of one splice unit 100 extends to the backlight side of the other splice unit 100.
Specifically, referring to fig. 1 and 2, in one embodiment, the tiled display panel 10 includes two tiled units 100, a first tiled unit 101 and a second tiled unit 102, respectively; when the first splicing unit 101 is spliced with the second splicing unit 102, the flip chip film 130 located in the binding area 12 of the first splicing unit 101 extends to the backlight side of the LED chip 120 in the display area 11 of the second splicing unit 102; the flip chip film 130 located in the bonding area 12 of the second stitching unit 102 extends to the backlight side of the LED chip 120 of the display area 11 of the first stitching unit 101. At this time, the substrate 110 of the first splicing unit 101 is seamlessly attached to the substrate 110 of the second splicing unit 102, and the binding region 12 of the first splicing unit 101 is seamlessly attached to the binding region 12 of the second splicing unit 102, so as to improve the display effect of the spliced display panel, and also avoid the problem that the yield of the flip-chip film 130 is reduced due to bending at a large angle.
In an embodiment, when the flip chip 130 located in the bonding area 12 of the second bonding unit 102 extends to the backlight side of the LED chip 120 in the display area 11 of the first bonding unit 101, the flip chip 130 located in the bonding area 12 of the second bonding unit 102 is fixed to the backlight side of the LED chip 120 in the display area 11 of the first bonding unit 101, and the fixing method includes, but is not limited to, optical adhesive fixing, adhesive tape fixing, and the like.
In an embodiment, each of the splicing units 100 further comprises: and a packaging layer 140 covering the LED chip 120 and the substrate 110 and located in the display area 11, wherein when two adjacent splice units 100 are spliced, the flip chip film 130 of one splice unit 100 is overlapped to one side of the packaging layer 140 of the other splice unit 100, which is far away from the LED chip 120. The materials of the encapsulation layer 140 include: epoxy or optical cement. The encapsulation layer 140 may provide protection for the LED chip 120, to prevent the LED chip 120 from failure caused by interference of external environment, for example: water vapor, oxygen, etc.; on the other hand, a flat support surface can be provided for the extension of the flip chip film 130 adjacent to the splice unit 100.
In one embodiment, since the light emitting side is on one side of the substrate 110, the metal traces on the substrate 110 reflect ambient light to affect the ambient contrast, and each of the splice units 100 further includes: a light shielding matrix 150 disposed on the light emitting side of the LED chip 120 and exposing the LED chip 120. Specifically, the light shielding matrix 150 may be disposed on a side of the substrate 110 facing the LED chip 120, or may be disposed on a side of the substrate 110 away from the LED chip 120, so long as the light shielding matrix is disposed on a light emitting side of the LED chip 120. According to the application, the shading matrix 150 is arranged on the light emitting side of the LED chip 120, so that metal wires can be effectively shielded, and meanwhile, the LED chip 120 is exposed, and on the premise of not influencing the light emitting effect of the spliced display panel 10, the contrast ratio of the spliced display panel 10 is improved, and the display effect is further improved.
In the present application, the LED chip 120 is a tricolor LED chip, including: a red LED chip 121, a green LED chip 122, and a blue LED chip 123; the LED chip 120 is flip-chip fixed on the substrate 110, so that the light emitting side faces the substrate 110, and the edges of the substrate 110 of the first and second splicing units 101 and 102 can be completely contacted, so that seamless splicing is achieved, and the display effect of the spliced display panel is improved. In an embodiment, the LED chip 120 further includes a light reflecting layer 124, and the light reflecting layer 124 is disposed on the backlight side of the LED chip 120. The light reflecting layer 124 includes a distributed bragg reflective film or a metal reflective film, for example: silver film, aluminum film, and the like. The light reflecting layer 124 can effectively enhance the light emitting effect of the LED chip 120, and enhance the brightness of the tiled display panel 10.
In the present application, the substrate 110 is a transparent substrate, including a glass substrate or a polyimide substrate, and the transparent substrate enables the light emitting side of the LED chip to be on the side facing the substrate 110, so as to provide a possibility for seamless splicing of the splicing unit 100. In an embodiment, due to the seamless splicing of the splicing unit 100, the edge of the substrate 110 may be subjected to corresponding strengthening treatment or softening treatment, so as to prevent the substrate 110 from being broken due to interference when two adjacent substrates 110 are spliced seamlessly.
Referring to fig. 1 and 3, in an embodiment, the tiled display panel 10 includes at least two tiled units 100, which are respectively a first tiled unit 101 and a second tiled unit 102, in this embodiment, four second tiled units 102 are respectively tiled around the first tiled unit 101, and the substrate 110 of the first tiled unit 101 is in seamless bonding with the substrate 110 of the four adjacent second tiled units 102; the binding area 12 of the first splicing unit 101 is disposed around the display area 11, and the flip chip films 130 are disposed around the first splicing unit 101 and extend to the backlight sides of the LED chips 120 of the display areas 11 of the other four second splicing units 102 respectively; similarly, the other four second stitching units 102 are disposed near the binding region 12 of the first stitching unit 101, and each of the other four second stitching units is provided with the flip chip 130 and extends to the backlight side of the LED chip 120 of the display region 11 of the first stitching unit 101. It can be understood that, in this embodiment, the second splicing units 102 may also serve as the first splicing units 101, that is, when four other second splicing units 102 are spliced around one second splicing unit 102, the second splicing unit 102 located in the middle plays the role of the first splicing unit 101. Thus, the splicing unit 100 of the spliced display panel 10 can be freely combined, and is not limited to the splicing manner shown in fig. 2 to 3.
Referring to fig. 1 and fig. 4, in an embodiment, the tiled display panel 10 includes four tiled units 100, namely, a first tiled unit 101, a second tiled unit 102, a third tiled unit 103, and a fourth tiled unit 104; when the four splicing units 100 are spliced, the flip chip films 130 located in the binding area 12 of the first splicing unit 101 extend to the backlight side of the LED chip 120 of the display area 11 of the second splicing unit 102 and the backlight side of the LED chip 120 of the display area 11 of the third splicing unit 103, respectively; the flip chip 130 located in the bonding area 12 of the second splicing unit 102 extends to the backlight side of the LED chip 120 of the display area 11 of the first splicing unit 101 and the backlight side of the LED chip 120 of the display area 11 of the fourth splicing unit 104, respectively; the flip chip film 130 located in the bonding area 12 of the third splicing unit 103 extends to the backlight side of the LED chip 120 of the display area 11 of the first splicing unit 101 and the backlight side of the LED chip 120 of the display area 11 of the fourth splicing unit 104, respectively; the flip chip 130 located in the bonding area 12 of the fourth bonding unit 104 extends to the backlight side of the LED chip 120 of the display area 11 of the second bonding unit 102 and the backlight side of the LED chip 120 of the display area 11 of the third bonding unit 103, respectively. At this time, the substrate 110 of the first bonding unit 101 and the fourth bonding unit 104 are respectively bonded with the substrate 110 of the second bonding unit 102 and the substrate 110 of the third bonding unit 103 in a seamless manner; the binding areas 12 of the first splicing unit 101 and the fourth splicing unit 104 are respectively and seamlessly attached to the binding areas 12 of the second splicing unit 102 and the third splicing unit 103, so that the display effect of the spliced display panel is improved, and the problem that the yield is reduced due to large-angle bending of the flip-chip film 130 can be avoided.
Accordingly, referring to fig. 5, an embodiment of the present application further provides a tiled display device 1 including the tiled display panel 10 described in any of the above embodiments, where the tiled display device 1 further includes: at least two assembly mechanisms 20, each assembly mechanism 20 corresponds to each assembly unit 100, so that the assembly units 100 are fixed on a frame, a plurality of the assembly display panels 10 are firmly connected, a plurality of small-size assembly display panels 10 are integrated into a whole large-size display panel, and the display effect of the integrated large-size display panel is better due to seamless assembly among the assembly display panels 10, so that the market competitiveness of the product is improved.
In summary, the embodiment of the present application provides a tiled display panel 10, where the tiled display panel 10 includes at least two tiled units 100, namely a first tiled unit 101 and a second tiled unit 102; when the first splicing unit 101 is spliced with the second splicing unit 102, the flip chip film 130 located in the binding area 12 of the first splicing unit 101 extends to the backlight side of the LED chip 120 in the display area 11 of the second splicing unit 102; the flip chip film 130 located in the bonding area 12 of the second stitching unit 102 extends to the backlight side of the LED chip 120 of the display area 11 of the first stitching unit 101. On the one hand, the problem of yield reduction caused by large-angle bending of the flip-chip film 130 can be avoided; on the other hand, the edges of the substrate 110 of the first splicing unit 101 and the second splicing unit 102 can be completely contacted, so that seamless splicing is realized, and the display effect of the spliced display panel 10 is improved.
Further, a light reflecting layer 124 is disposed on the backlight side of the LED chip 120, and the light reflecting layer 124 can effectively enhance the light emitting effect of the LED chip 120 and enhance the brightness of the tiled display panel 10. The encapsulation layer 140 can provide protection for the LED chip 120, prevent the LED chip 120 from failure caused by interference of external environment, and provide a flat supporting surface for the extension of the flip chip film 130 adjacent to the splice unit 100. Since the light emitting side is on one side of the substrate 110, the metal wires on the substrate 110 reflect ambient light to affect the ambient contrast, and the light shielding matrix 150 is disposed on the light emitting side of the LED chip 120, so that the metal wires can be effectively shielded, and the LED chip 120 is exposed, so that the contrast of the tiled display panel 10 is improved without affecting the light emitting effect of the tiled display panel 10, and the display effect is further improved.
In the foregoing embodiments, the descriptions of the embodiments are emphasized, and for parts of one embodiment that are not described in detail, reference may be made to related descriptions of other embodiments.
The foregoing has outlined the detailed description of the embodiments of the present application, and the detailed description of the principles and embodiments of the present application is provided herein by way of example only to facilitate the understanding of the method and core concepts of the present application; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in light of the ideas of the present application, the present description should not be construed as limiting the present application.
Claims (9)
1. The utility model provides a splice display panel which characterized in that: the spliced display panel comprises at least two spliced units, each spliced unit is provided with a display area and a binding area adjacent to the display area, and the spliced units comprise:
a substrate base plate;
the LED chips are arranged on the substrate base plate and are positioned in the display area;
the flip chip film is arranged on the substrate and is positioned in the binding area;
defining one side of the LED chip facing the substrate as a light emitting side, and defining one side of the LED chip far away from the substrate as a backlight side; the at least two splicing units comprise a first splicing unit and a second splicing unit, when the first splicing unit is spliced with the second splicing unit, the flip chip film located in the binding area of the first splicing unit extends to the backlight side of the LED chip in the display area of the second splicing unit, and the flip chip film located in the binding area of the second splicing unit extends to the backlight side of the LED chip in the display area of the first splicing unit.
2. The tiled display panel according to claim 1, wherein: the substrate is a transparent substrate and comprises a glass substrate or a polyimide substrate.
3. The tiled display panel according to claim 1, wherein: the splice unit further includes:
and the packaging layer covers the LED chip and the substrate base plate and is positioned in the display area, when two adjacent splicing units are spliced, the flip chip film of one splicing unit is lapped to one side, far away from the LED chip, of the packaging layer of the other splicing unit.
4. A tiled display panel according to claim 3, wherein: the materials of the packaging layer comprise: epoxy or optical cement.
5. The tiled display panel according to claim 1, wherein: the splice unit further includes:
the shading matrix is arranged on the light emitting side of the LED chip and exposes the LED chip.
6. The tiled display panel according to claim 1, wherein: the LED chip is a three-primary-color LED chip and comprises: a red LED chip, a green LED chip, and a blue LED chip; the LED chip is flip-chip fixed on the substrate base plate.
7. The tiled display panel according to claim 6, wherein: the LED chip further comprises a light reflecting layer, and the light reflecting layer is arranged on the backlight side of the LED chip.
8. The tiled display panel according to claim 7, wherein: the light reflecting layer includes: a distributed bragg reflective film or a metallic reflective film.
9. A tiled display device, characterized in that: a tiled display device comprising the tiled display panel according to any of claims 1 to 8, the tiled display device further comprising:
and at least two splicing mechanisms, wherein each splicing mechanism is arranged corresponding to the splicing unit so as to fix the splicing unit on a frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202111050350.5A CN113764455B (en) | 2021-09-08 | 2021-09-08 | Spliced display panel and spliced display device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111050350.5A CN113764455B (en) | 2021-09-08 | 2021-09-08 | Spliced display panel and spliced display device |
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| CN113764455A CN113764455A (en) | 2021-12-07 |
| CN113764455B true CN113764455B (en) | 2023-09-01 |
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| CN114171508A (en) * | 2021-12-09 | 2022-03-11 | Tcl华星光电技术有限公司 | Spliced screen, preparation method thereof and display device |
| CN114397781A (en) * | 2021-12-21 | 2022-04-26 | 苏州华星光电技术有限公司 | Backlight module, preparation method thereof and display device |
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| CN111369900A (en) * | 2020-04-07 | 2020-07-03 | 深圳市华星光电半导体显示技术有限公司 | Spliced screen |
| CN112331090A (en) * | 2020-11-05 | 2021-02-05 | Tcl华星光电技术有限公司 | Display panel, display module and spliced screen |
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| CN113764455A (en) | 2021-12-07 |
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