CN113764455A - Splicing display panel and splicing display device - Google Patents
Splicing display panel and splicing display device Download PDFInfo
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- CN113764455A CN113764455A CN202111050350.5A CN202111050350A CN113764455A CN 113764455 A CN113764455 A CN 113764455A CN 202111050350 A CN202111050350 A CN 202111050350A CN 113764455 A CN113764455 A CN 113764455A
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- 239000004593 Epoxy Substances 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 3
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
- H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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Abstract
The application discloses tiled display panel and tiled display device, tiled display panel includes two at least concatenation units, each concatenation unit all have a display area and with the adjacent district that binds in display area, each concatenation unit all includes: the LED chip comprises a substrate, a plurality of LED chips and a chip on film; defining one side of the LED chip facing the substrate base plate as a light emergent side, and defining one side of the LED chip far away from the substrate base plate as a backlight side; when two adjacent splicing units are spliced, the chip on film of one splicing unit extends to the backlight side of the other splicing unit. The spliced display panel is changed into a mode that light is emitted from one side of the substrate base plate, so that the flip chip film can be completely hidden to the backlight side, seamless splicing is realized, and the problem of yield reduction caused by excessive bending of the flip chip film can be avoided.
Description
Technical Field
The application relates to the technical field of display, in particular to a spliced display panel and a spliced display device comprising the same.
Background
In recent years, light-emitting diode (LED) displays have been rapidly developed, and application scenes have become wide as pixel sizes have been reduced. The LED display screen gradually develops from the original indoor and outdoor large-scale remote advertising screen to the indoor and outdoor short-distance high-definition display screen, and is the mainstream of indoor and outdoor large-screen high-definition display in the future.
At present, the large-screen LED display mainly adopts a module splicing technology, namely small-size LED modules are spliced into a large screen with any size. At present, all LED modules that have been commercialized use a Printed Circuit Board (PCB) as a substrate, and have disadvantages of being driven by a pm (passive matrix), having a large number of ic (integrated Circuit chip) chips, poor heat dissipation, low process precision, and being difficult to realize smaller pixels. Therefore, the glass-based LED display module gradually shows the advantages of the glass-based LED display module, and has the advantages of AM (active matrix) driving, small number of IC (integrated circuit) chips, good heat dissipation, high process precision, realization of the pixel size below 0.6mm and the like. However, the glass-based LED module needs to adopt a COF (Chip On Film) bonding technology, and if the LED module is spliced by a conventional bonding method, the COF needs to be sandwiched between the splicing seams to bend the COF at a large angle, which easily causes COF breakage and reduces yield, and real seamless splicing cannot be realized.
Therefore, improvement is urgently needed to overcome the defects in the prior art.
Disclosure of Invention
An object of this application is to provide a tiled display panel and tiled display device to realize the seamless concatenation between the tiled display panel, avoid because flip chip film buckles the problem that the yield that excessively leads to descends.
The embodiment of the application provides a tiled display panel, tiled display panel includes two at least concatenation units, each concatenation unit all have a display area and with the adjacent district that binds in display area, the concatenation unit includes: a substrate base plate; the LED chips are arranged on the substrate base plate and are positioned in the display area; the chip on film is arranged on the substrate and is positioned in the binding region; defining one side of the LED chip facing the substrate base plate as a light emergent side, and defining one side of the LED chip far away from the substrate base plate as a backlight side; when two adjacent splicing units are spliced, the chip on film of one splicing unit extends to the backlight side of the other splicing unit.
Optionally, in some embodiments of the present application, the at least two splicing units include a first splicing unit and a second splicing unit; when the first splicing unit and the second splicing unit are spliced, the flip chip film positioned in the binding area of the first splicing unit extends to the backlight side of the LED chip in the display area of the second splicing unit; the chip on film positioned in the binding area of the second splicing unit extends to the backlight side of the LED chip in the display area of the first splicing unit.
Optionally, in some embodiments of the present application, the substrate is a transparent substrate, including a glass substrate or a polyimide substrate.
Optionally, in some embodiments of the present application, each of the splicing units further includes: and the packaging layer covers the LED chip and the substrate base plate and is positioned in the display area, and when two adjacent splicing units are spliced, the chip on film of one splicing unit is lapped to one side of the packaging layer of the other splicing unit, which is far away from the LED chip.
Optionally, in some embodiments of the present application, the material of the encapsulation layer includes: epoxy or optical glue.
Optionally, in some embodiments of the present application, each of the splicing units further includes: and the shading matrix is arranged on the light emitting side of the LED chip and exposes the LED chip.
Optionally, in some embodiments of the present application, the LED chip is a three-primary-color LED chip, including: the LED chip comprises a red LED chip, a green LED chip and a blue LED chip; the LED chip is fixed on the substrate in an inverted mode.
Optionally, in some embodiments of the present application, the LED chip further includes a light reflecting layer disposed on the backlight side of the LED chip.
Optionally, in some embodiments of the present application, the light reflecting layer comprises: a distributed bragg reflector film or a metallic reflector film.
Correspondingly, an embodiment of the present application further provides a tiled display device including the tiled display panel described in any of the above embodiments, where the tiled display device further includes: at least two assembly mechanisms, each assembly mechanism corresponds to the splice unit setting, in order to incite somebody to action the splice unit is fixed in on a frame.
Compared with the prior art, the embodiment of the application provides a tiled display panel, which comprises at least two tiled units, namely a first tiled unit and a second tiled unit; when the first splicing unit and the second splicing unit are spliced, the flip chip film positioned in the binding area of the first splicing unit extends to the backlight side of the LED chip in the display area of the second splicing unit; the chip on film positioned in the binding area of the second splicing unit extends to the backlight side of the LED chip in the display area of the first splicing unit. On one hand, the problem that the yield is reduced due to large-angle bending of the chip on film can be avoided; on the other hand, the edges of the substrate base plates of the first splicing unit and the second splicing unit can be completely contacted, so that seamless splicing is realized, and the display effect of the spliced display panel is improved.
Furthermore, a light reflecting layer is arranged on the backlight side of the LED chip, the light emitting effect of the LED chip can be effectively improved through the light reflecting layer, and the brightness of the spliced display panel is improved. The packaging layer can protect the LED chip and prevent the LED chip from failure caused by interference of the external environment, and a flat supporting surface can be provided for extension of the flip chip film of the splicing unit adjacent to the LED chip. Because the light-emitting side is in one side of substrate base plate, the metal on the substrate base plate is walked the line and can be reflected ambient light influence environment contrast, and this application is in the light-emitting side of LED chip is provided with the shading matrix, can shelter from the metal effectively and walk the line, exposes simultaneously the LED chip is not influencing under the prerequisite of tiled display panel's light-emitting effect, promote tiled display panel's contrast, and then promote display effect.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a tiled display panel according to an embodiment of the present application;
FIG. 2 is a schematic diagram of a planar structure of the tiled display panel according to the embodiment of the present application;
FIG. 3 is a schematic diagram of another planar structure of the tiled display panel according to the embodiment of the present application;
FIG. 4 is a schematic diagram of another planar structure of the tiled display panel according to the embodiment of the present application;
fig. 5 is a schematic plan view of a tiled display device according to an embodiment of the present application.
Description of the main reference numerals:
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. Furthermore, it should be understood that the detailed description and specific examples, while indicating exemplary embodiments of the invention, are given by way of illustration and explanation only, and are not intended to limit the scope of the invention. In the present application, unless otherwise stated, the use of directional terms such as "upper", "lower", "left" and "right" may refer to the actual use or operation of the device, may refer to the drawing direction in the drawings, and may refer to two opposite directions; while "inner" and "outer" are with respect to the outline of the device.
The embodiment of the present application provides a tiled display panel 10, the tiled display panel 10 includes at least two tiled units 100, and each tiled unit all has a display area 11 and with the bonding area 12 that the display area 11 is adjacent, each tiled unit 100 all includes: a substrate base plate 110; a plurality of LED chips 120, wherein the LED chips 120 are disposed on the substrate base plate 110 and located in the display area 11; a chip on film 130 disposed on the substrate 110 and located in the bonding region 12; the side of the LED chip 120 facing the substrate base plate 110 is defined as a light emitting side, and the side of the LED chip 120 away from the substrate base plate 110 is defined as a backlight side. The light emitting side refers to the light emitting side of the LED chip 120, the light emitting side of the splicing unit 100, and the light emitting side of the spliced display panel 10. When two adjacent splicing units 100 are spliced, the flip-chip film 130 of one splicing unit 100 extends to the backlight side of the other splicing unit 100.
Specifically, referring to fig. 1 and fig. 2, in an embodiment, the tiled display panel 10 includes two tiled units 100, a first tiled unit 101 and a second tiled unit 102; when the first splicing unit 101 and the second splicing unit 102 are spliced, the flip-chip film 130 located in the bonding area 12 of the first splicing unit 101 extends to the backlight side of the LED chip 120 in the display area 11 of the second splicing unit 102; the flip chip film 130 located in the bonding area 12 of the second splicing unit 102 extends to the backlight side of the LED chip 120 in the display area 11 of the first splicing unit 101. At this time, the substrate base plate 110 of the first splicing unit 101 is seamlessly attached to the substrate base plate 110 of the second splicing unit 102, and the binding region 12 of the first splicing unit 101 is seamlessly attached to the binding region 12 of the second splicing unit 102, so that the display effect of the spliced display panel is improved, and the problem of yield reduction caused by large-angle bending of the flip chip film 130 can be solved.
In an embodiment, when the flip chip film 130 located in the bonding area 12 of the second splicing unit 102 extends to the backlight side of the LED chip 120 in the display area 11 of the first splicing unit 101, the flip chip film 130 located in the bonding area 12 of the second splicing unit 102 is fixed to the backlight side of the LED chip 120 in the display area 11 of the first splicing unit 101, and the fixing method includes, but is not limited to, optical glue fixing, tape fixing, and the like.
In an embodiment, each of the splicing units 100 further includes: and the packaging layer 140 covers the LED chip 120 and the substrate base plate 110, and is located in the display area 11, when two adjacent splicing units 100 are spliced, the flip chip film 130 of one splicing unit 100 is lapped to one side of the packaging layer 140 of the other splicing unit 100, which is far away from the LED chip 120. The material of the encapsulation layer 140 includes: epoxy or optical glue. The encapsulation layer 140 is disposed to provide protection for the LED chip 120 on one hand, and prevent failure problems of the LED chip 120 caused by external environment interference, such as: water vapor, oxygen, etc.; on the other hand, a flat supporting surface can be provided for the extension of the flip chip film 130 adjacent to the splicing unit 100.
In an embodiment, since the light-emitting side is on one side of the substrate base plate 110, the metal traces on the substrate base plate 110 may reflect the ambient light to affect the ambient contrast, and each of the splicing units 100 further includes: and a light shielding matrix 150 disposed on the light emitting side of the LED chip 120 and exposing the LED chip 120. Specifically, the light shielding matrix 150 may be disposed on a side of the substrate 110 facing the LED chip 120, or may be disposed on a side of the substrate 110 away from the LED chip 120, as long as the light shielding matrix is disposed on a light emitting side of the LED chip 120. This application is in LED chip 120's light-emitting side is provided with shading matrix 150 can shelter from the metal effectively and walk the line, exposes simultaneously LED chip 120 is not influencing under the prerequisite of tiled display panel 10's light-emitting effect, promote tiled display panel 10's contrast, and then promote display effect.
In this application, the LED chip 120 is a three-primary-color LED chip, including: a red LED chip 121, a green LED chip 122, and a blue LED chip 123; the LED chip 120 is fixed on the substrate base plate 110 in an inverted mode, so that the light-emitting side faces the substrate base plate 110, the edges of the substrate base plate 110 of the first splicing unit 101 and the second splicing unit 102 can be completely contacted, seamless splicing is achieved, and the display effect of the spliced display panel is improved. In an embodiment, the LED chip 120 further includes a light reflecting layer 124, and the light reflecting layer 124 is disposed on the backlight side of the LED chip 120. The light reflecting layer 124 includes a distributed bragg reflector film or a metal reflector film, for example: silver films, aluminum films, and the like. The light-reflecting layer 124 can effectively improve the light-emitting effect of the LED chip 120, and improve the brightness of the tiled display panel 10.
In this application, substrate base plate 110 is the transparent base plate, including glass substrate or polyimide substrate, the transparent base plate can make the light-emitting side of LED chip is facing one side of substrate base plate 110, for the seamless concatenation of concatenation unit 100 provides the possibility. In an embodiment, due to the seamless splicing of the splicing unit 100, the edge of the substrate base plate 110 may be subjected to corresponding strengthening treatment or softening treatment, so as to prevent the substrate base plate 110 from cracking caused by interference when two adjacent substrate base plates 110 are spliced seamlessly.
Referring to fig. 1 and fig. 3, in an embodiment, the tiled display panel 10 includes at least two tiled units 100, which are a first tiled unit 101 and a second tiled unit 102, in which four second tiled units 102 are tiled around the first tiled unit 101, and the substrate base plates 110 of the first tiled unit 101 are all seamlessly attached to the substrate base plates 110 of the four second tiled units 102 adjacent to the first tiled unit 101; the bonding area 12 of the first splicing unit 101 is arranged around the display area 11, the chip on films 130 are arranged around the first splicing unit 101, and the chip on films respectively extend to the backlight sides of the LED chips 120 in the display areas 11 of the other four second splicing units 102; similarly, the bonding areas 12 of the other four second splicing units 102 close to the first splicing unit 101 are all provided with the flip-chip films 130, and respectively extend to the backlight sides of the LED chips 120 in the display area 11 of the first splicing unit 101. It can be understood that, in this embodiment, the second splicing unit 102 may also serve as the first splicing unit 101, that is, when the four sides of one of the second splicing units 102 are respectively spliced with other four second splicing units 102, the second splicing unit 102 located in the middle serves as the first splicing unit 101. Therefore, the splicing units 100 of the tiled display panel 10 can be freely combined, and are not limited to the splicing manner shown in fig. 2 to 3.
Referring to fig. 1 and fig. 4, in an embodiment, the tiled display panel 10 includes four tile units 100, which are a first tile unit 101, a second tile unit 102, a third tile unit 103, and a fourth tile unit 104; when the four splicing units 100 are spliced, the flip-chip film 130 located in the bonding area 12 of the first splicing unit 101 extends to the backlight side of the LED chip 120 in the display area 11 of the second splicing unit 102 and the backlight side of the LED chip 120 in the display area 11 of the third splicing unit 103, respectively; the flip chip films 130 located in the bonding area 12 of the second splicing unit 102 extend to the backlight side of the LED chip 120 in the display area 11 of the first splicing unit 101 and the backlight side of the LED chip 120 in the display area 11 of the fourth splicing unit 104, respectively; the flip chip film 130 located in the bonding area 12 of the third splicing unit 103 extends to the backlight side of the LED chip 120 in the display area 11 of the first splicing unit 101 and the backlight side of the LED chip 120 in the display area 11 of the fourth splicing unit 104, respectively; the flip chip film 130 located in the bonding area 12 of the fourth splicing unit 104 extends to the backlight side of the LED chip 120 in the display area 11 of the second splicing unit 102 and the backlight side of the LED chip 120 in the display area 11 of the third splicing unit 103, respectively. At this time, the substrate base plates 110 of the first splicing unit 101 and the fourth splicing unit 104 are respectively seamlessly bonded to the substrate base plate 110 of the second splicing unit 102 and the substrate base plate 110 of the third splicing unit 103; the bonding areas 12 of the first splicing unit 101 and the fourth splicing unit 104 are respectively and seamlessly attached to the bonding areas 12 of the second splicing unit 102 and the third splicing unit 103, so that the display effect of the spliced display panel is improved, and the problem that the yield of the flip chip film 130 is reduced due to large-angle bending can be solved.
Accordingly, referring to fig. 5, an embodiment of the present application further provides a tiled display device 1 including the tiled display panel 10 described in any of the above embodiments, where the tiled display device 1 further includes: at least two amalgamation mechanisms 20, each the amalgamation mechanism 20 corresponds each the concatenation unit 100 sets up to with concatenation unit 100 is fixed in on a frame, thereby realizes a plurality ofly firm the connection between the concatenation display panel 10, in order to integrate a plurality of small-size the concatenation display panel 10 is integrated into a holistic jumbo size display panel, and because each small-size seamless concatenation between the concatenation display panel 10, can make the display effect of jumbo size display panel after the integration better, has promoted the market competition of product.
In summary, the embodiment of the present application provides a tiled display panel 10, where the tiled display panel 10 includes at least two tiled units 100, which are a first tiled unit 101 and a second tiled unit 102; when the first splicing unit 101 and the second splicing unit 102 are spliced, the flip-chip film 130 located in the bonding area 12 of the first splicing unit 101 extends to the backlight side of the LED chip 120 in the display area 11 of the second splicing unit 102; the flip chip film 130 located in the bonding area 12 of the second splicing unit 102 extends to the backlight side of the LED chip 120 in the display area 11 of the first splicing unit 101. On one hand, the problem of yield reduction caused by large-angle bending of the flip chip film 130 can be avoided; on the other hand, the edges of the substrate base plates 110 of the first splicing unit 101 and the second splicing unit 102 can be completely contacted, so that seamless splicing is realized, and the display effect of the spliced display panel 10 is improved.
Further, a reflective layer 124 is disposed on the backlight side of the LED chip 120, and the reflective layer 124 can effectively improve the light emitting effect of the LED chip 120 and improve the brightness of the tiled display panel 10. The encapsulation layer 140 can provide protection for the LED chip 120 to prevent the LED chip 120 from failure due to interference from the external environment, and can provide a flat supporting surface for the extension of the flip chip film 130 adjacent to the splicing unit 100. Because the light-emitting side is in one side of substrate base plate 110, the metal on the substrate base plate 110 is walked and can be reflected ambient light influence environment contrast, and this application is in the light-emitting side of LED chip 120 is provided with shading matrix 150, can shelter from the metal effectively and walk the line, exposes simultaneously LED chip 120 is not influencing under the prerequisite of the light-emitting effect of concatenation display panel 10, promote concatenation display panel 10's contrast, and then promote display effect.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The technical solutions provided by the embodiments of the present application are introduced in detail, and specific examples are applied in the description to explain the principles and embodiments of the present application, and the descriptions of the embodiments are only used to help understanding the method and the core ideas of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. A tiled display panel, comprising: the tiled display panel includes two at least concatenation units, each concatenation unit all have a display area and with the adjacent district that binds in display area, the concatenation unit includes:
a substrate base plate;
the LED chips are arranged on the substrate base plate and are positioned in the display area;
the chip on film is arranged on the substrate and is positioned in the binding region;
defining one side of the LED chip facing the substrate base plate as a light emergent side, and defining one side of the LED chip far away from the substrate base plate as a backlight side; when two adjacent splicing units are spliced, the chip on film of one splicing unit extends to the backlight side of the other splicing unit.
2. The tiled display panel of claim 1, wherein: the at least two splicing units comprise a first splicing unit and a second splicing unit;
when the first splicing unit and the second splicing unit are spliced, the flip chip film positioned in the binding area of the first splicing unit extends to the backlight side of the LED chip in the display area of the second splicing unit; the chip on film positioned in the binding area of the second splicing unit extends to the backlight side of the LED chip in the display area of the first splicing unit.
3. The tiled display panel of claim 1, wherein: the substrate base plate is a transparent base plate and comprises a glass base plate or a polyimide base plate.
4. The tiled display panel of claim 1, wherein: the splicing unit further comprises:
and the packaging layer covers the LED chip and the substrate base plate and is positioned in the display area, and when two adjacent splicing units are spliced, the chip on film of one splicing unit is lapped to one side of the packaging layer of the other splicing unit, which is far away from the LED chip.
5. The tiled display panel of claim 4, wherein: the material of the packaging layer comprises: epoxy or optical glue.
6. The tiled display panel of claim 1, wherein: the splicing unit further comprises:
and the shading matrix is arranged on the light emitting side of the LED chip and exposes the LED chip.
7. The tiled display panel of claim 1, wherein: the LED chip is a tricolor LED chip, and comprises: the LED chip comprises a red LED chip, a green LED chip and a blue LED chip; the LED chip is fixed on the substrate in an inverted mode.
8. The tiled display panel of claim 7, wherein: the LED chip further comprises a reflecting layer, and the reflecting layer is arranged on the backlight side of the LED chip.
9. The tiled display panel of claim 8, wherein: the light reflecting layer includes: a distributed bragg reflector film or a metallic reflector film.
10. A tiled display device, characterized in that: comprising the tiled display panel according to any of the claims 1 to 9, the tiled display arrangement further comprising:
at least two assembly mechanisms, each assembly mechanism corresponds to the splice unit setting, in order to incite somebody to action the splice unit is fixed in on a frame.
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| CN202111050350.5A CN113764455B (en) | 2021-09-08 | 2021-09-08 | Spliced display panel and spliced display device |
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| CN202111050350.5A CN113764455B (en) | 2021-09-08 | 2021-09-08 | Spliced display panel and spliced display device |
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| CN113764455B CN113764455B (en) | 2023-09-01 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114373778A (en) * | 2022-01-24 | 2022-04-19 | 厦门天马微电子有限公司 | Light-emitting panel and display device |
| CN114397781A (en) * | 2021-12-21 | 2022-04-26 | 苏州华星光电技术有限公司 | Backlight module, preparation method thereof and display device |
| WO2023103012A1 (en) * | 2021-12-09 | 2023-06-15 | Tcl华星光电技术有限公司 | Tiled screen and manufacturing method therefor, and display apparatus |
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| CN114397781A (en) * | 2021-12-21 | 2022-04-26 | 苏州华星光电技术有限公司 | Backlight module, preparation method thereof and display device |
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| CN113764455B (en) | 2023-09-01 |
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