CN109976038A - A kind of surface light source device and preparation method thereof, display device - Google Patents

A kind of surface light source device and preparation method thereof, display device Download PDF

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Publication number
CN109976038A
CN109976038A CN201910281844.0A CN201910281844A CN109976038A CN 109976038 A CN109976038 A CN 109976038A CN 201910281844 A CN201910281844 A CN 201910281844A CN 109976038 A CN109976038 A CN 109976038A
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CN
China
Prior art keywords
layer
light source
reflecting layer
pcb
opening
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Granted
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CN201910281844.0A
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Chinese (zh)
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CN109976038B (en
Inventor
熊充
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Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to CN201910281844.0A priority Critical patent/CN109976038B/en
Publication of CN109976038A publication Critical patent/CN109976038A/en
Priority to PCT/CN2020/073521 priority patent/WO2020207102A1/en
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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • G02F1/133602Direct backlight
    • G02F1/133603Direct backlight with LEDs
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • G02F1/133602Direct backlight
    • G02F1/133605Direct backlight including specially adapted reflectors
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • G02F1/133614Illuminating devices using photoluminescence, e.g. phosphors illuminated by UV or blue light

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Planar Illumination Modules (AREA)

Abstract

The present invention relates to a kind of surface light source devices and preparation method thereof, display device.Wherein surface light source device includes: substrate, reflecting layer, photoresist layer, QD layers, encapsulated layer and PCB module.On the one hand, pass through the coupling of the opening and QD in LED and reflecting layer layer, by the position setting of splicing seams and PCB corresponding to the reflecting layer between PCB module, the blue light that LED is issued is converted into white light after QD, white light is no longer pass through PCB ink and slit after being reflected by optical scattering material, but directly reflects away through reflecting layer.It is possible thereby to the mosaic phenomenon of block-like brightness disproportionation caused by avoiding the ink reflectance of PCB and color difference inconsistent;On the other hand, QD layers are packaged in the open area in reflecting layer, are advantageously implemented the white light plane light source for being thinned high colour gamut.

Description

A kind of surface light source device and preparation method thereof, display device
Technical field
The present invention relates to field of display technology, and in particular to a kind of surface light source device and preparation method thereof, display device.
Background technique
With the continuous development of LCD technology, the application field of liquid crystal display especially colour liquid crystal display device Constantly widening.It is pulled by the market of liquid crystal display, backlight industry, have an air of prosperity scene.Liquid crystal display is passive Light-emitting component, display screen itself do not shine, but illuminated by backlight below.Backlight and liquid crystal display combination LCD MODULE is constituted together.
So-called backlight (BackLight) is a kind of light source positioned at the behind liquid crystal display (LCD), its illumination effect LCD MODULE (LCM) visual effect will be directly influenced.Backlight is mainly by light source, light guide plate, optical film piece, plastic cement The composition such as frame.Backlight has brightness high, and the service life is long, shines the features such as uniform.Under being then divided into directly according to distribution of light sources position difference Formula backlight and side-light backlight.
Direct-light-type backlight is that light source (LED wafer array) and printed circuit board are placed in backlight bottom, and light is from LED After injection, equably projected by the reflector plate of bottom, then by the diffuser plate on surface, brightness enhancement film.
Side-light backlight is that the side that the light guide plate Jing Guo special designing is arranged in linear or point source of light is made into Backlight.Light guide plate principle is that the interference phenomenon of light is destroyed using the network point distribution at guide-lighting acrylic plate bottom, and linear light source is uniform It is converted into area source, its role is to guide the scattering direction of light, allows the distribution of light is more uniform to make to can't see reflection from front The shadow of point, for improving the brightness of panel, and ensures the uniformity of panel luminance, and wherein the excellent of light guide plate influences backlight It is very big.
LCD backlight is the uniform illumination device of a plane, and the cathode fluorescent tube or LED light bar as light source are arranged It is listed in both sides or one side (may be long side, it is also possible to short side) of entire backlight.Cold cathode tube is linear light source, and LED is This light source is converted to area source and needed using light guide plate by point light source.Light guide plate is generally by the acrylic plastics system of high transparency At, surface is very smooth and flat, so that the total reflection that most of internal light can be regular on its flat surface, without penetrating Out to outside light guide plate.The bottom of the light guide plate of liquid crystal display is printed on the site of white.The position of site is printed in light guide plate On, the no longer regular total reflection of light but can be to projecting above light guide plate.The density for controlling each position site can be controlled How much irradiant light guide plate processed is in this position.The light guide plate mesh point of sophisticated design can allow the light of two sides incidence uniform Paving be dispersed in entire plane.Optical diaphragm can be placed again above light guide plate, these diaphragms play uniform light, and converge big The effects of angular light is observed for front.
Mini-LED is used in TV backlight at present, and common scheme is formed blue light mini-LED piece on PCB Then LED array places optical diffusion sheet and wavelength conversion material diaphragm above LED to generate uniform white light face light Source.Due to the limitation of LED piece board, the size of PCB cannot accomplish very big, it is therefore desirable to which muti-piece PCB is spliced into one piece big Shine area source.Two can be thus led to the problem of, first is that the slit of the stitching portion PCB can bring the tastes problem such as concealed wire, second is that The ink reflectance and the inconsistent mosaic phenomenon that will lead to block-like brightness disproportionation of color difference of every piece of PCB.Wavelength above LED Transition material diaphragm there is also thickness thicker, at high cost problem, is unfavorable for the design requirement of slimming.Therefore it needs to seek one The novel surface light source device of kind has solved the above problems.The present invention addresses, it is also proposed that the slimming of QD scheme designs.
Summary of the invention
It is an object of the present invention to provide a kind of surface light source devices and preparation method thereof, display device, are able to solve The optics such as concealed wire caused by mosaic phenomenon caused by PCB ink difference present in current surface light source device and splicing slit Taste problem.
To solve the above-mentioned problems, an embodiment of the invention provides a kind of surface light source device, including: base Plate, reflecting layer, photoresist layer, QD layers, encapsulated layer and PCB module.Wherein the reflecting layer is arranged at intervals on the substrate, Wherein the first opening is formed between adjacent two reflecting layer;The photoresist layer is correspondingly arranged on the reflecting layer, and adjacent The second opening, the corresponding first opening setting of the second opening are formed between two photoresist layers;Described QD layers is set to institute It states in the first opening between reflecting layer;The encapsulated layer is set in the photoresist layer and second opening;The PCB Module includes: PCB and LED, and the PCB is set on the encapsulated layer, and the LED is arranged at intervals at the PCB described in On the surface of encapsulated layer, wherein the setting position of every LED corresponds to downwards QD layers of the position.
Further, wherein the reflecting layer is metallic reflector.
Further, wherein the composition material of the metallic reflector includes one of aluminium, silver and titanium or a variety of.
Further, wherein the PCB module includes 2 or 2 or more quantity.
Further, wherein the splicing seams position between the adjacent two PCB module corresponds to the position in the reflecting layer Setting.
Another embodiment of the invention additionally provides a kind of preparation side of surface light source device of the present invention Method, including following steps:
S1 provides a substrate, forms one layer of reflecting layer on the substrate;
S2 carries out patterned process to the reflecting layer using light shield and etch process, adjacent two reflecting layer it Between formed first opening, to obtain the reflecting layer being arranged at intervals on the substrate;
S3 coats photoresist on the reflecting layer and first opening, and carries out UV to photoresist from substrate back Exposure forms the second opening for corresponding to the first opening setting between adjacent two photoresist layer, is correspondingly arranged in institute to be formed State the photoresist layer on reflecting layer;
S4, spraying QD solution by curing process obtains QD layers in the first opening between the reflecting layer;
S5, the coating glue in second opening and the photoresist layer, forms encapsulated layer;
S6, in PCB towards setting LED at QD layer of the position is corresponded on the surface of the encapsulated layer, then by band There is the PCB module of LED to be set on the encapsulated layer.
Further, wherein the preparation method of the surface light source device further include: the LED is immersed the encapsulation by S7 Lighting in layer, is detected by CCD camera and the position for adjusting LED keeps it corresponding with QD layers of position.
Further, wherein the reflecting layer passes through sputtering or deposition preparation.
Further, wherein the LED is set on the PCB by welding.
Another embodiment of the invention additionally provides a kind of display device, including the face of the present invention Light source device.
The invention has the advantages that the present invention relates to a kind of surface light source devices and preparation method thereof, display device, on the one hand, By the coupling of the opening and QD in LED and reflecting layer layer, by between PCB module splicing seams and PCB correspond to the reflection The position setting of layer, the blue light that LED is issued are converted into white light after QD, white light reflected by optical scattering material after no longer By PCB ink and slit, but directly reflected away through reflecting layer.It is possible thereby to avoid the ink reflectance and color difference of PCB The mosaic phenomenon of block-like brightness disproportionation caused by inconsistent;On the other hand, QD layers are packaged in the open area in reflecting layer, It is advantageously implemented the white light plane light source for being thinned high colour gamut.
Detailed description of the invention
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for For those skilled in the art, without creative efforts, it can also be obtained according to these attached drawings other attached Figure.
Fig. 1 is the structural schematic diagram of surface light source device embodiment 1 of the present invention.
Fig. 2 is the operation schematic diagram of surface light source device embodiment 2 of the present invention.
Fig. 3 is the first of surface light source device embodiment 1 of the present invention to prepare schematic diagram.
Fig. 4 is the second of surface light source device embodiment 1 of the present invention to prepare schematic diagram.
Fig. 5 is that the third of surface light source device embodiment 1 of the present invention prepares schematic diagram.
Fig. 6 is the 4th of surface light source device embodiment 1 of the present invention to prepare schematic diagram.
Fig. 7 is the 5th of surface light source device embodiment 1 of the present invention to prepare schematic diagram.
Fig. 8 is the 6th of surface light source device embodiment 1 of the present invention to prepare schematic diagram.
Component mark is as follows in figure:
100, surface light source device
1, substrate 2, reflecting layer
3, photoresist layer 4, QD layer
5, encapsulated layer 6, PCB module
61、PCB 62、LED
7, UV light 8, CCD camera
Specific embodiment
Below in conjunction with Figure of description, the preferred embodiments of the present invention are described in detail, with complete to those of skill in the art It is whole to introduce technology contents of the invention, prove that the present invention can be implemented with citing, so that technology contents disclosed by the invention are more It is clear, so that will more readily understand how implement the present invention by those skilled in the art.However the present invention can pass through many differences The embodiment of form emerges from, and protection scope of the present invention is not limited only to the embodiment mentioned in text, Examples below The range that is not intended to limit the invention of explanation.
The direction term that the present invention is previously mentioned, for example, "upper", "lower", "front", "rear", "left", "right", "inner", "outside", " Side " etc. is only the direction in attached drawing, and direction term used herein is of the invention for explanation and illustration, rather than is used To limit the scope of protection of the present invention.
In the accompanying drawings, the identical component of structure is indicated with same numbers label, everywhere the similar component of structure or function with Like numeral label indicates.In addition, in order to facilitate understanding and description, the size and thickness of each component shown in the drawings are any It shows, the present invention does not limit the size and thickness of each component.
When certain components, when being described as " " another component "upper", the component can be placed directly within described another group On part;There may also be an intermediate module, the component is placed on the intermediate module, and the intermediate module is placed in another group On part.When a component is described as " installation is extremely " or " being connected to " another component, the two can be understood as direct " installation " Or " connection " or a component pass through an intermediate module " installation is extremely " or " being connected to " another component.
Embodiment 1
As shown in Figure 1, a kind of surface light source device 100, including: substrate 1, reflecting layer 2, photoresist layer 3, QD layer 4, envelope Fill layer 5 and PCB module 6.
As shown in Figure 1, wherein the reflecting layer 2 is arranged at intervals on the substrate 1, wherein between adjacent two reflecting layer 2 It is formed with the first opening;The reflecting layer 2 is metallic reflector, specifically, the wherein composition material packet of the metallic reflector Include one of aluminium, silver and titanium or a variety of.Thus manufactured reflecting layer 2 can penetrate to avoid light, and light reflection effect is good, favorably In realizing light diffusion, to form area source.
As shown in Figure 1, wherein the photoresist layer 3 is correspondingly arranged on the reflecting layer 2, and adjacent two photoresist layer 3 Between be formed with the second opening, the corresponding first opening setting of the second opening;The QD layer 4 is set to the reflecting layer 2 Between first opening in;Thus it is advantageously implemented the fine flour light source for being thinned high colour gamut.
As shown in Figure 1, the encapsulated layer 5 is set in the photoresist layer 3 and second opening;The PCB module 6 It include: PCB 61 and LED 62, the PCB 61 is set on the encapsulated layer 3, and the LED 62 corresponds to the QD layer 4 and sets The PCB 61 is placed in towards on the surface of the encapsulated layer 5.It is possible thereby to PCB 61 be covered by reflecting layer 2, as LED 62 The blue light of sending is converted into white light after QD layer 4, and white light is no longer pass through 61 oil of PCB after being reflected by optical scattering material Ink and slit, but are directly over reflecting layer 2 and reflect away to form white area source, avoid PCB 61 ink reflectance and The mosaic phenomenon of block-like brightness disproportionation caused by color difference is inconsistent.
Embodiment 2
Only the different place between the present embodiment and embodiment 1 is illustrated below, and its something in common is then herein not It repeats again.
As shown in Fig. 2, wherein the PCB module 6 includes 2 quantity.The wherein spelling between the adjacent two PCB modules 6 The position that seaming position corresponds to the reflecting layer 2 is arranged.It is possible thereby to by 61 quilt of splicing seams and PCB between PCB module 6 Reflecting layer 2 covers, and when the blue light that LED 62 is issued is converted into white light after QD layer 4, white light is reflected back by optical scattering material It is no longer pass through 61 ink of PCB and slit after coming, but is directly over reflecting layer 2 and reflects away to form white area source, is avoided The mosaic phenomenon of block-like brightness disproportionation caused by the ink reflectance and color difference of PCB 61 is inconsistent.
Embodiment 3
As shown in fig. 3 to 7, the present embodiment additionally provides a kind of preparation method of surface light source device, including: S1 is provided One substrate 1 forms one layer of reflecting layer 2 by sputtering or depositing operation on the substrate 1;S2, by light shield and etch process, Patterned process is carried out to the reflecting layer 2, the first opening is formed between adjacent two reflecting layer 2, to be spaced The reflecting layer 2 of setting;S3 coats photoresist on the reflecting layer 2 and first opening, and from 1 back side of substrate to photoetching Glue carries out UV light 7 and exposes, and the second opening for corresponding to the first opening setting is formed between adjacent two photoresist layer 3, to be formed The photoresist layer 3 being correspondingly arranged on the reflecting layer 2;S4, between the reflecting layer 2 first opening in spraying QD it is molten Liquid obtains QD layer 4 by curing process;S5, the coating glue on the QD layer 4 and the photoresist layer 3 form encapsulation Layer 5;S6, in PCB 61 towards setting LED 62 at the position for corresponding to the QD layer 4 on the surface of the encapsulated layer, specifically , the LED 62 is set on the PCB 61 by welding, is then set to the PCB module 6 with LED 62 described On encapsulated layer 5.
As shown in figure 8, the preparation method of the surface light source device further include: the LED 62 is immersed the encapsulation by S7 Lighting in layer 5, is detected by CCD camera 8 and the position for adjusting LED 62 keeps it corresponding with the position of QD layer 4.
Another embodiment of the invention additionally provides a kind of display device, including the face of the present invention Light source device.
Surface light source device provided by the present invention and preparation method thereof, display device are described in detail above.It answers Understand, illustrative embodiments as described herein should be to be considered only as it is descriptive, be used to help to understand method of the invention and Its core concept, and be not intended to restrict the invention.It is usual to the description of features or aspect in each illustrative embodiments The similar features or aspects that should be considered suitable for other exemplary embodiments.Although reference example embodiment describes this Invention, but can suggest that those skilled in the art carries out various change and change.The invention is intended to cover appended claims These variations and change in the range of book, any modification done within the spirit and principles of the present invention, equivalent replacement With improve etc., should all be included in the protection scope of the present invention.

Claims (10)

1. a kind of surface light source device characterized by comprising
Substrate,
Reflecting layer, the reflecting layer are arranged at intervals on the substrate, wherein being formed with the first opening between adjacent two reflecting layer;
Photoresist layer, the photoresist layer are correspondingly arranged on the reflecting layer, and are formed with second between adjacent two photoresist layer Opening, the corresponding first opening setting of the second opening;
QD layers, described QD layers be set between the reflecting layer first opening in;
Encapsulated layer, the encapsulated layer are set in the photoresist layer and second opening;And
PCB module, the PCB module include:
PCB, the PCB are set on the encapsulated layer,
LED, the LED are arranged at intervals at the PCB towards on the surface of the encapsulated layer, wherein the setting position of every LED QD layers of the position is corresponded to downwards.
2. surface light source device according to claim 1, which is characterized in that the reflecting layer is metallic reflector.
3. surface light source device according to claim 2, which is characterized in that the composition material of the metallic reflector includes One of aluminium, silver and titanium are a variety of.
4. surface light source device according to claim 1, which is characterized in that the PCB module includes 2 or 2 or more Quantity.
5. surface light source device according to claim 4, which is characterized in that the splicing seams between the adjacent two PCB module The position that position corresponds to the reflecting layer is arranged.
6. a kind of preparation method for preparing surface light source device described in claim 1 characterized by comprising
S1 provides a substrate, forms one layer of reflecting layer on the substrate;
S2 carries out patterned process, the shape between adjacent two reflecting layer to the reflecting layer using light shield and etch process At the first opening, to obtain the reflecting layer being arranged at intervals on the substrate;
S3 coats photoresist on the reflecting layer and first opening, and carries out UV exposure to photoresist from substrate back, The second opening for corresponding to the first opening setting is formed between adjacent two photoresist layer, is correspondingly arranged in the reflection to be formed Photoresist layer on layer;
S4, spraying QD solution by curing process obtains QD layers in the first opening between the reflecting layer;
S5, the coating glue in second opening and the photoresist layer, forms encapsulated layer;
Then S6 will have LED in PCB towards setting LED at QD layer of the position is corresponded on the surface of the encapsulated layer PCB module be set on the encapsulated layer.
7. the preparation method of surface light source device according to claim 6, which is characterized in that further include:
The LED is immersed lighting in the encapsulated layer by S7, is detected by CCD camera and the position for adjusting LED makes itself and QD The position of layer is corresponding.
8. the preparation method of surface light source device according to claim 6, which is characterized in that the reflecting layer by sputtering or Deposition preparation.
9. the preparation method of surface light source device according to claim 6, which is characterized in that the LED passes through welding setting In on the PCB.
10. a kind of display device, which is characterized in that including surface light source device described in claim 1.
CN201910281844.0A 2019-04-09 2019-04-09 Area light source device, preparation method thereof and display device Active CN109976038B (en)

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PCT/CN2020/073521 WO2020207102A1 (en) 2019-04-09 2020-01-21 Area light source device and manufacturing method therefor, display device

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WO2020207102A1 (en) * 2019-04-09 2020-10-15 深圳市华星光电半导体显示技术有限公司 Area light source device and manufacturing method therefor, display device
CN111599909A (en) * 2020-05-21 2020-08-28 东莞市中麒光电技术有限公司 LED display screen module and preparation method thereof
CN114824025A (en) * 2021-01-19 2022-07-29 东莞市中麒光电技术有限公司 LED display module and manufacturing method thereof

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