WO2020207102A1 - Area light source device and manufacturing method therefor, display device - Google Patents

Abstract

The present invention relates to an area light source device and a manufacturing method therefor, and a display device. The area light source device comprises: a substrate, a reflection layer, a photoresist layer, a QD layer, an encapsulation layer and PCB modules. By means of the coupling of an LED with an opening of the reflection layer and the QD layer, a splicing slit between the PCB modules and the PCBs is provided corresponding to the position of the reflection layer, blue light emitted by the LED is converted into white light after passing through the QD, and the white light is reflected back by an optical scattering material and then does not pass through PCB ink and the slit, but is directly reflected by the reflection layer; thus, the mosaic appearance of uneven brightness in blocks due to inconsistency in ink reflectivity and color difference of the PCBs can be avoided. Furthermore, the QD layer is encapsulated in the opening area of the reflection layer, facilitating the realization of a thin white area light source having high color gamut.

Description

Surface light source device, preparation method thereof and display device

This application claims the priority of a Chinese patent application filed with the Chinese Patent Office, the application number is 201910281844.0, and the invention title is "a surface light source device and its preparation method, and display device" on April 9, 2019. The entire content is by reference Incorporated in this application.

Technical field

The invention relates to the field of display technology, in particular to a surface light source device, a preparation method thereof, and a display device.

Background technique

With the continuous development of liquid crystal display technology, the application fields of liquid crystal displays, especially color liquid crystal displays, are constantly expanding. Driven by the liquid crystal display market, the backlight industry is showing a booming scene. The liquid crystal display is a passive light-emitting element. The display itself does not emit light, but is illuminated by the backlight below it. The backlight source and the liquid crystal display are combined to form a liquid crystal display module.

The so-called BackLight is a light source located behind the liquid crystal display (LCD), and its luminous effect will directly affect the visual effect of the liquid crystal display module (LCM). The backlight source is mainly composed of a light source, a light guide plate, an optical film, and a plastic frame. The backlight has the characteristics of high brightness, long life and uniform light emission. According to different light source distribution positions, it is divided into direct-lit backlight and edge-lit backlight.

The direct type backlight is to place the light source (LED chip array) and the printed circuit board at the bottom of the backlight. After the light is emitted from the LED, it passes through the bottom reflector, and then passes through the diffuser and brightness enhancement film on the surface evenly.

The edge-lit backlight is a backlight made by placing a linear or point light source on the side of a specially designed light guide plate. The principle of the light guide plate is to use the dot distribution at the bottom of the light guide acrylic plate to destroy the interference phenomenon of light, and evenly convert the line light source into a surface light source. Its role is to guide the scattering direction of the light and make the light distribution more uniform so that it cannot be seen from the front. The shadow to the reflection point is used to improve the brightness of the panel and to ensure the uniformity of the panel brightness. Among them, the excellent light guide plate has a great influence on the backlight.

The LCD backlight is a flat, uniform lighting device. The cold cathode fluorescent tubes or LED strips as the light source are arranged on both sides or one side of the entire backlight (it may be the long side or the short side). The cold cathode tube is a linear light source, and the LED is a point light source. A light guide plate is needed to convert this light source into a surface light source. The light guide plate is generally made of acrylic plastic with high light transmittance, and the surface is very smooth and flat, so that most of the internal light will be regularly reflected on the flat surface and will not be emitted to the outside of the light guide plate. White dots are printed on the bottom of the light guide plate of the liquid crystal display. At the position where the light guide plate is printed with dots, the light will no longer be totally reflected regularly but will be emitted above the light guide plate. Controlling the density of dots at each position can control how much light the light guide plate emits at this position. Precisely designed light guide plate dots can spread the incident light on both sides evenly on the entire plane. Optical films will be placed above the light guide plate. These films can uniform light and gather large-angle light for frontal observation.

technical problem

At present, Mini-LEDs are used in TV backlights. A common solution is to print blue mini-LEDs on the PCB to form an LED array, and then place an optical diffusion film and a wavelength conversion material film above the LEDs to produce uniform white light. Surface light source. Due to the limitation of the LED printing machine, the size of the PCB cannot be very large, so multiple PCBs need to be spliced into a large light emitting surface light source. This will cause two problems. One is that the slits at the PCB splicing place will bring about taste problems such as dark lines, and the other is that the inconsistency of the ink reflectivity and color difference of each PCB will cause blocky mosaics with uneven brightness. The wavelength conversion material film above the LED also has the problems of thick thickness and high cost, which is not conducive to the design requirements of thinning. Therefore, it is necessary to find a new type of surface light source device to solve the above problems. The present invention sets out to solve the problem and also proposes a thin design of the QD solution.

Technical solutions

An object of the present invention is to provide a surface light source device, a preparation method thereof, and a display device, which can solve the optical taste problems such as mosaic phenomenon caused by PCB ink differences in the current surface light source device and dark lines caused by splicing slits.

In order to solve the above problems, an embodiment of the present invention provides a surface light source device, which includes: a substrate, a reflective layer, a photoresist layer, a QD layer, an encapsulation layer, and a PCB module. The reflective layer is arranged on the substrate at intervals, wherein a first opening is formed between two adjacent reflective layers; the photoresist layer is correspondingly arranged on the reflective layer, and two adjacent photoresist layers A second opening is formed between the second opening, and the second opening is provided corresponding to the first opening; the QD layer is provided in the first opening between the reflective layers; the encapsulation layer is provided on the photoresist layer And the second opening; the PCB module includes: a PCB and an LED, the PCB is arranged on the encapsulation layer, the LEDs are arranged at intervals on the surface of the PCB facing the encapsulation layer, wherein each The setting position of the LED downward corresponds to the position of the QD layer.

Further, wherein the reflective layer is a metal reflective layer.

Further, the constituent material of the metal reflective layer includes one or more of aluminum, silver and titanium.

Further, wherein the PCB module includes two or more than two.

Further, the position of the splicing seam between two adjacent PCB modules corresponds to the position of the reflective layer.

Another embodiment of the present invention also provides a method for preparing the surface light source device of the present invention, which includes the following steps:

S1, providing a substrate, and forming a reflective layer on the substrate;

S2, using a photomask and an etching process to pattern the reflective layer to form a first opening between two adjacent reflective layers, thereby obtaining reflective layers arranged on the substrate at intervals;

S3, coating photoresist on the reflective layer and the first opening, and UV-exposing the photoresist from the back of the substrate to form a first opening corresponding to the first opening between two adjacent photoresist layers Two openings to form a photoresist layer correspondingly disposed on the reflective layer;

S4, spray a QD solution in the first opening between the reflective layers, and undergo curing treatment to obtain a QD layer;

S5, coating glue on the second opening and the photoresist layer to form an encapsulation layer;

S6, disposing an LED on the surface of the PCB facing the encapsulation layer at a position corresponding to the QD layer, and then disposing the PCB module with the LED on the encapsulation layer.

Further, the preparation method of the surface light source device further includes: S7, immersing the LED in the encapsulation layer for lighting, detecting and adjusting the position of the LED to correspond to the position of the QD layer by a CCD camera.

Further, wherein the reflective layer is prepared by sputtering or deposition.

Further, wherein the LED is arranged on the PCB by welding.

Another embodiment of the present invention also provides a display device, which includes the surface light source device related to the present invention.

Beneficial effect

The present invention relates to a surface light source device, a preparation method thereof, and a display device. On the one hand, through the coupling of the LED and the opening of the reflective layer and the QD layer, the splicing seam between PCB modules and the PCB correspond to the reflective layer. The position is set, the blue light emitted by the LED is converted into white light after QD. The white light is reflected by the optical scattering material and no longer passes through the PCB ink and slits, but is directly reflected by the reflective layer. This can avoid the blocky uneven brightness mosaic phenomenon caused by the inconsistency of PCB ink reflectivity and color difference; on the other hand, the QD layer is encapsulated in the opening area of the reflective layer, which is conducive to the realization of a thin white surface with high color gamut light source.

Description of the drawings

In order to more clearly describe the technical solutions in the embodiments of the present invention, the following will briefly introduce the accompanying drawings used in the description of the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

Fig. 1 is a schematic structural diagram of Embodiment 1 of a surface light source device of the present invention.

Fig. 2 is a working schematic diagram of Embodiment 2 of the surface light source device of the present invention.

3 is a schematic diagram of the first preparation of Embodiment 1 of the surface light source device of the present invention.

4 is a schematic diagram of the second preparation of Embodiment 1 of the surface light source device of the present invention.

5 is a schematic diagram of the third preparation of Embodiment 1 of the surface light source device of the present invention.

Fig. 6 is a fourth schematic diagram of the preparation of Embodiment 1 of the surface light source device of the present invention.

FIG. 7 is a fifth schematic diagram of the preparation of Embodiment 1 of the surface light source device of the present invention.

FIG. 8 is a schematic diagram of the sixth preparation of Embodiment 1 of the surface light source device of the present invention.

The components in the figure are identified as follows:

100. Surface light source device

1. Substrates 2. Reflective layer

3. Photoresist layer 4. QD layer

5. Encapsulation layer 6. PCB module

61. PCB 62. LED

7. UV light 8. CCD camera.

Embodiments of the invention

Hereinafter, the preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings in the specification, so as to fully introduce the technical content of the present invention to those skilled in the art, so as to demonstrate that the present invention can be implemented by examples, so that the technical content disclosed by the present invention is clearer and the present invention Those skilled in the art can more easily understand how to implement the present invention. However, the present invention can be embodied by many different forms of embodiments. The protection scope of the present invention is not limited to the embodiments mentioned in the text, and the description of the following embodiments is not intended to limit the scope of the present invention.

The directional terms mentioned in the present invention, such as "up", "down", "front", "rear", "left", "right", "inner", "outer", "side", etc., are only attached The directions in the figures and the directional terms used herein are used to explain and describe the present invention, not to limit the protection scope of the present invention.

In the drawings, components with the same structure are represented by the same numerals, and components with similar structures or functions are represented by similar numerals. In addition, for ease of understanding and description, the size and thickness of each component shown in the drawings are arbitrarily shown, and the present invention does not limit the size and thickness of each component.

When certain components are described as being "on" another component, the component can be directly placed on the other component; there may also be an intermediate component on which the component is placed , And the intermediate component is placed on another component. When a component is described as "installed to" or "connected to" another component, both can be understood as directly "installed" or "connected", or a component is "installed to" or "connected to" through an intermediate component Another component.

Example 1

As shown in FIG. 1, a surface light source device 100 includes: a substrate 1, a reflective layer 2, a photoresist layer 3, a QD layer 4, an encapsulation layer 5, and a PCB module 6.

As shown in FIG. 1, the reflective layer 2 is arranged on the substrate 1 at intervals, and a first opening is formed between two adjacent reflective layers 2; the reflective layer 2 is a metal reflective layer, specifically, wherein The constituent materials of the metal reflective layer include one or more of aluminum, silver and titanium. The reflective layer 2 thus made can avoid light penetration, has a good light reflection effect, and is beneficial to realize light diffusion, thereby forming a surface light source.

As shown in FIG. 1, the photoresist layer 3 is correspondingly disposed on the reflective layer 2, and a second opening is formed between two adjacent photoresist layers 3, and the second opening corresponds to the first The opening is provided; the QD layer 4 is provided in the first opening between the reflective layers 2; thereby, it is beneficial to realize a thin white surface light source with a high color gamut.

As shown in FIG. 1, the packaging layer 5 is disposed on the photoresist layer 3 and the second opening; the PCB module 6 includes: a PCB 61 and an LED 62, and the PCB 61 is disposed on the package On layer 3, the LED 62 corresponding to the QD layer 4 is arranged on the surface of the PCB 61 facing the packaging layer 5. As a result, the PCB 61 can be covered by the reflective layer 2. When the blue light emitted by the LED 62 is converted into white light after passing through the QD layer 4, the white light will not pass through the PCB after being reflected by the optical scattering material. 61 ink and slits, but directly reflected by the reflective layer 2 to form a white surface light source, avoiding the PCB 61's ink reflectivity and chromatic aberration are inconsistent, resulting in blocky uneven brightness mosaic phenomenon.

Example 2

Only the differences between this embodiment and Embodiment 1 will be described below, and the similarities will not be repeated here.

As shown in Fig. 2, the PCB module 6 includes two numbers. The position of the splicing seam between two adjacent PCB modules 6 corresponds to the position of the reflective layer 2. As a result, the splicing seams between the PCB modules 6 and the PCB 61 can be covered by the reflective layer 2. When the blue light emitted by the LED 62 passes through the QD layer 4, it is converted into white light, and the white light is reflected back by the optical scattering material and no longer passes through the PCB 61 The ink and the slit are directly reflected by the reflective layer 2 to form a white surface light source, which avoids the mosaic phenomenon of blocky uneven brightness caused by inconsistent ink reflectivity and color difference of the PCB 61.

Example 3

As shown in FIGS. 3-7, this embodiment also provides a method for manufacturing a surface light source device, which includes: S1, providing a substrate 1, and forming a reflective layer on the substrate 1 through a sputtering or deposition process 2; S2, patterning the reflective layer 2 through a photomask and etching process to form a first opening between two adjacent reflective layers 2 to obtain reflective layers 2 arranged at intervals; S3, in The reflective layer 2 and the first opening are coated with photoresist, and the photoresist is exposed to UV light 7 from the back of the substrate 1, and a setting corresponding to the first opening is formed between two adjacent photoresist layers 3 S4, spray QD solution in the first openings between the reflective layers 2 to form a photoresist layer 3 correspondingly disposed on the reflective layer 2; after curing, obtain a QD layer 4 S5, apply glue on the QD layer 4 and the photoresist layer 3 to form an encapsulation layer 5; S6, at a position corresponding to the QD layer 4 on the surface of the PCB 61 facing the encapsulation layer The LED 62 is arranged. Specifically, the LED 62 is arranged on the PCB 61 by welding, and then the PCB module 6 with the LED 62 is arranged on the packaging layer 5.

As shown in FIG. 8, the preparation method of the surface light source device further includes: S7, immersing the LED 62 in the encapsulation layer 5 for lighting, and detecting and adjusting the position of the LED 62 by the CCD camera 8. The position of layer 4 corresponds.

Another embodiment of the present invention also provides a display device, which includes the surface light source device related to the present invention.

The surface light source device, the preparation method thereof, and the display device provided by the present invention are described in detail above. It should be understood that the exemplary embodiments described herein should only be regarded as descriptive, used to help understand the method and core idea of the present invention, but not to limit the present invention. Descriptions of features or aspects in each exemplary embodiment should generally be considered as applicable to similar features or aspects in other exemplary embodiments. Although the present invention has been described with reference to exemplary embodiments, various changes and modifications can be suggested to those skilled in the art. The present invention intends to cover these changes and modifications within the scope of the appended claims. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention shall be included in the protection scope of the present invention .

Claims (10)

1. A surface light source device, which includes:

   Substrate,

   A reflective layer, the reflective layer is arranged on the substrate at intervals, wherein a first opening is formed between two adjacent reflective layers;

   A photoresist layer, the photoresist layer is correspondingly disposed on the reflective layer, and a second opening is formed between two adjacent photoresist layers, and the second opening is disposed corresponding to the first opening;

   QD layer, the QD layer is disposed in the first opening between the reflective layers;

   An encapsulation layer, the encapsulation layer is disposed in the photoresist layer and the second opening; and

   The PCB module includes:

   PCB, the PCB is arranged on the packaging layer,

   The LEDs are arranged at intervals on the surface of the PCB facing the encapsulation layer, and the arrangement position of each LED corresponds to the position of the QD layer downward.
2. The surface light source device according to claim 1, wherein the reflective layer is a metal reflective layer.
3. The surface light source device according to claim 2, wherein the constituent material of the metal reflective layer includes one or more of aluminum, silver and titanium.
4. The surface light source device according to claim 1, wherein the PCB module includes two or more.
5. 4. The surface light source device according to claim 4, wherein the position of the seam between two adjacent PCB modules corresponds to the position of the reflective layer.
6. A method for preparing the surface light source device according to claim 1, which comprises:

   S1, providing a substrate, and forming a reflective layer on the substrate;

   S2, using a photomask and an etching process to pattern the reflective layer to form a first opening between two adjacent reflective layers, thereby obtaining reflective layers arranged on the substrate at intervals;

   S3, coating photoresist on the reflective layer and the first opening, and UV-exposing the photoresist from the back of the substrate to form a first opening corresponding to the first opening between two adjacent photoresist layers Two openings to form a photoresist layer correspondingly disposed on the reflective layer;

   S4, spray a QD solution in the first opening between the reflective layers, and undergo curing treatment to obtain a QD layer;

   S5, coating glue on the second opening and the photoresist layer to form an encapsulation layer;

   S6, disposing an LED on the surface of the PCB facing the encapsulation layer at a position corresponding to the QD layer, and then disposing the PCB module with the LED on the encapsulation layer.
7. 7. The method for manufacturing a surface light source device according to claim 6, further comprising:

   S7, the LED is immersed in the encapsulation layer for lighting, and the position of the LED is detected and adjusted by a CCD camera to correspond to the position of the QD layer.
8. The method for manufacturing a surface light source device according to claim 6, wherein the reflective layer is prepared by sputtering or deposition.
9. 7. The method for manufacturing a surface light source device according to claim 6, wherein the LED is arranged on the PCB by welding.
10. A display device comprising the surface light source device of claim 1.