CN108767087A - A method of manufacturing LED display modules with multilayer compound glass ceramic substrate - Google Patents
A method of manufacturing LED display modules with multilayer compound glass ceramic substrate Download PDFInfo
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- CN108767087A CN108767087A CN201810474402.3A CN201810474402A CN108767087A CN 108767087 A CN108767087 A CN 108767087A CN 201810474402 A CN201810474402 A CN 201810474402A CN 108767087 A CN108767087 A CN 108767087A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/165—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Abstract
The invention discloses a kind of methods manufacturing LED display modules with multilayer compound glass ceramic substrate.It is printed on multilayer compound glass ceramic substrate or the modes such as sputtering is deposited and make circuit, onboard flip LED luminescence chip is put in corresponding position admittedly, and LED display module semi-finished product are made；The LED wafer of LED display module semi-finished product is face-down, and, baking-curing smooth with the concave lens surface that is filled with epoxy resin, rear weldering is tested to obtain the final product.The luminescence chip lines up array, and the driving circuit of each LED chip is arranged at the back side on composite substrate.The thermal conductivity and coefficient of thermal expansion of substrate of the present invention are close with the coefficient of expansion of LED core plate substrate, reduce failure risk of display module during follow-up use；Shorten the manufacturing process of display module, saves LED encapsulation flow, LED patch flows, greatly improve the production efficiency and reliability of LED display module, and reduce the cost of display module.
Description
Technical field
A kind of method manufacturing LED display modules with multilayer compound glass ceramic substrate of the present invention, belongs to LED encapsulation technologies
Field.
Background technology
As LED display constantly develops to smaller spacing, the mode of traditional single LED assembling SMT cannot expire
Foot requires, and when making high density, high-frequency circuit, the transmission loss of wiring board increases, welds especially traditional epoxy substrate
Connect crash rate increase, circuit noise cannot inhibit well；And traditional ceramics base circuit board its sintering temperature is in 1500-1900
DEG C, graph wiring can only select metal Mo and W hard to tolerate etc. according to sintering method simultaneously, then conductor material, due to the resistance of Mo and W
Rate is higher, and line resistance is big, and signal transmission be easy to cause distortion, increases loss, cloth line thinning is restricted；In order to prevent its
Oxidation, needs to be burnt into the reducing atmospheres such as the protective atmospheres such as nitrogen and hydrogen, is bound to cause a series of scabrous ask in this way
Topic.Traditional ceramics substrate need to use laser cutting, and laser drill etc., it is low, of high cost that there are efficiency, be unfavorable for large-scale production etc.
It is insufficient.And the functional requirement of combined circuit board and display module, develop the novel glass pottery of low-k, high frequency high intensity
Porcelain composite substrate simultaneously makes LED display modules with regard to necessary on this substrate.
Invention content
The present invention provides a kind of method manufacturing LED display modules with multilayer compound glass ceramic substrate, this method works
Skill is simple, is suitable for volume production, and multilayer circuit board obtained is suitable for high-accuracy, high-frequency circuit and uses.
A method of LED display modules being manufactured with multilayer compound glass ceramic substrate, including the work that next coming in order carry out
Sequence：
Using traditional SMT techniques, it is more than 250 DEG C of tin cream in multilayer compound glass ceramic substrate drive surface printing fusing point, is printing
It brushes the auxiliary elements such as drive surface attachment driving IC, the resistance capacitance of tin cream and carries out reflow soldering；
Tin grain size is 100nm ~ 20um, tin cream in multilayer compound glass ceramic substrate LED wafer face print solder paste, the tin cream
Fusing point is 210 ~ 235 DEG C；The flip LED chips upside-down mounting of the horizontal structure of at least one color is attached to pair for printing tin cream
It answers on pad；It is welded using high-precision reflow ovens, LED display module semi-finished product is made；
The tin cream in the LED wafer face can also use spray regime to print.
The plastic, transparent mask of LED display modules is made according to the design requirements such as display pixel spacing and size；It will be made
Plastic, transparent mask concave surface upward, the filling liquid epoxy resin in concave surface；
Upward by the concave surface of manufactured plastic, transparent mask, the filling liquid epoxy resin in concave surface；
The LED wafer of LED display module semi-finished product is face-down, it is smooth with the concave lens surface of populated epoxy resin；
Baking-curing：It first toasts 0.5 hour for 80 DEG C, then 125 DEG C are toasted 1 hour, last 150 DEG C are toasted 4 hours；
Afterwards weldering test to get.
The raw material of the multilayer compound glass ceramic substrate includes the substance of following parts by weight：Ceramic Al2O3Powder 30-40
Part, 20-30 parts of forsterite powder, 35-45 parts of pyrex powder, 85-105 parts of toluene-ethano azeotropic mixture solvent,
1-3 parts of triethyl phosphate, 1-2 parts of binder, 8-10 parts of plasticizer, 1-3 parts of antifoaming agent.The binder is polyvinyl alcohol contracting fourth
Aldehyde, the plasticizer are that mass ratio is dibutyl phthalate：Polyethylene glycol=4:6 composite elasticizer, the antifoaming agent are
N-butyl alcohol.
The manufacturing method of the multilayer compound glass ceramic substrate includes the process of next coming in order progress：Dispensing, ball milling system
Slurry, curtain coating, cross cutting, metallization, lamination hot pressing, dumping sintering, continuity test.
The plastic face mask surface is frosting or smooth surface, and the color of lens mask can be added as needed on toner to adjust
It is whole.The appearance of the display surface of the LED display modules is determined by the outer surface of plastic lens mask.
Compared with prior art, the beneficial effects of the invention are as follows：
The present invention makes circuit by being printed on glass ceramic baseplate or the modes such as sputtering being deposited, then onboard corresponding position
Admittedly putting flip LED luminescence chip, LED chip includes at least one kind of luminescent color.LED luminescence chips line up array, in glass ceramics
The driving circuit of each LED chip is arranged at the back side on substrate.Make the thermal conductivity and coefficient of thermal expansion and LED core of substrate using the technology
The coefficient of expansion of plate substrate is close, and reduces failure risk of display module during follow-up use.It greatly shortens simultaneously aobvious
The manufacturing process for showing module saves traditional LED encapsulation flows and LED patch flows, eliminates bonding steps, this method is straight
It is connected on glass ceramic baseplate and encapsulates, eliminate the packaging and routing on frame the step of, and entire technical process is not necessarily to pasting board,
It is time saving and energy saving, the production efficiency and reliability of LED display modules are greatly improved, and reduce the cost of LED display modules.
Description of the drawings
Fig. 1 LED display modules production flow diagrams of the present invention
The LED wafer face of Fig. 2 LED display modules
The plastic lens mask of Fig. 3 LED display modules
LED display module finished product front views after Fig. 4 fitting encapsulation
Fig. 5 LED display module side views
In figure：20 be LED chip, and 21 be mask, and 22 be concave surface, and 24 be driving IC, and 25 be resistance capacitance, and 26 be power socket, 27
For communication interface seat.
Specific implementation mode
With reference to specific embodiment, the present invention is described in further detail, but protection scope of the present invention is not
Be limited to these embodiments, it is every without departing substantially from the change of present inventive concept or equivalent substitute be included in protection scope of the present invention it
It is interior.
Embodiment 1
A kind of method manufacturing LED display modules with multilayer compound glass ceramic substrate of the present invention, including next coming in order progress
Process：
Using traditional SMT techniques, it is more than 250 DEG C of tin cream in multilayer compound glass ceramic substrate drive surface printing fusing point, is printing
It brushes the auxiliary elements such as drive surface attachment driving IC 24, the resistance capacitance 25 of tin cream and carries out reflow soldering；
Tin grain size is 100nm ~ 20um, tin cream in multilayer compound glass ceramic substrate LED wafer face print solder paste, the tin cream
Fusing point is 210 ~ 235 DEG C；20 upside-down mounting of flip LED chips of the horizontal structure of at least one color is attached at and prints tin cream
Correspondence pad on；It is welded using high-precision reflow ovens, LED display module semi-finished product is made；
The tin cream in the LED wafer face can also use spray regime to print.
According to the design requirements such as display module spacing and size, the plastic, transparent mask 21 of LED display modules, mask are made
Frosting is made in 21 surfaces, and the color of plastic lens mask 21 can be added as needed on toner to adjust；
Upward by the concave surface of manufactured plastic, transparent mask, the filling liquid epoxy resin in concave surface 22；
The LED wafer of LED display module semi-finished product is face-down, it is smooth with the concave lens surface of populated epoxy resin；
Baking-curing：It first toasts 0.5 hour for 80 DEG C, then 125 DEG C are toasted 1 hour, last 150 DEG C are toasted 4 hours；
Weldering test afterwards, in the LED display module semi-finished product corresponding position sources of welding current seat 26 and communication interface Jing Guo abovementioned steps
Seat 27, is then electrified to light and test to obtain the final product.
The plastic face mask surface is frosting or smooth surface, and the color of lens mask can be added as needed on toner to adjust
It is whole.The appearance of the display surface of the LED display modules is determined by the outer surface of plastic lens mask.
The raw material of the multilayer compound glass ceramic substrate includes the substance of following parts by weight：Ceramic Al2O3Powder 30-40
Part, 20-30 parts of forsterite powder, 35-45 parts of pyrex powder, 85-105 parts of toluene-ethano azeotropic mixture solvent,
1-3 parts of triethyl phosphate, 1-2 parts of binder, 8-10 parts of plasticizer, 1-3 parts of antifoaming agent.The binder is polyvinyl alcohol contracting fourth
Aldehyde, the plasticizer are that mass ratio is dibutyl phthalate：Polyethylene glycol=4:6 composite elasticizer, the antifoaming agent are
N-butyl alcohol.
The manufacturing method of the multilayer compound glass ceramic substrate includes the process of next coming in order progress：
Dispensing：It carries out being mixed and made into raw mixture by following weight：Ceramic Al2O330-40 parts of powder, forsterite
20-30 parts of powder, 35-45 parts of pyrex powder；
Slurrying：It is raw mixture in mass ratio：Remove toluene-ethano azeotropic mixture solvent：Triethyl phosphate=95-100：
95-100：1-3 after mixing, is carried out preliminary ball milling 3-6 hours, and diameter of particle is less than 20 μm in the slurry after preliminary ball milling；
By binder polyvinyl butyral 1-2 parts by weight, plasticizer 8-10 parts by weight, antifoaming agent n-butyl alcohol 1-3 parts by weight are added to
In mixture after preliminary ball milling, secondary ball milling is carried out 24-36 hours, obtain the slurry with certain viscosity, after secondary ball milling
Slurry in diameter of particle be less than 500nm；
The plasticizer is that mass ratio is dibutyl phthalate：Polyethylene glycol=4:6 composite elasticizer；
Curtain coating：By the good slurry of ball milling, the 2-3 hour of deaeration under -760mmHg vacuum degrees；Curtain coating is added in slurry after deaeration
Machine is cast into the uniform and fine and close blank of thickness；According to the casting width and edge height, curtain coating for requiring adjustable casting machine
Speed, to control blank thickness and size, precision etc..
Demoulding and predrying are carried out to the blank being cast, predrying temperature is 60 DEG C ~ 100 DEG C；
Cross cutting：The blank being cast is punched out using die cutting die, with the size needed；The punching process
It can be cut into monolithic, can be also cut into flakes；Monolithic can directly be punched and cut through；When being cut into flakes, V-type punching is done at line of demarcation, is rushed
Groove depth is the 70-80% of composite substrate earnestly.
Punching：According to design requirement, mechanical punching in the blank being punched；With silk-screen printing, mask printing or curtain coating
Conductive silver paste or copper slurry are packed into via hole by the mode of type printing.
60 ~ 100 DEG C of drying are carried out to the blank of populated via hole, composite substrate is made；
Composite substrate metallizes and circuit makes：Halftone is made according to designed line requirements, then will with high performance print machine
Conductive silver paste is by forming the circuits of needs on screen painting to composite substrate；It can also be used and directly describe computer in composite base
The circuit of needs is drawn on plate；
Lamination hot pressing：Composite substrate after metallization is put into according to the sequence and the number of plies of design requirement in folded mould, is set on folded mould
In respect of the contraposition column consistent with composite substrate registration holes, ensure aligning accuracy；Mold is processed with alloy steel material, can be prevented repeatedly
It is deformed after use；Pressure is adjusted according to the pressing number of plies and size, and hot pressing temperature controls between 200-350 DEG C；
Size is modified：By the semi-finished product of lamination and hot pressing, finishing size to satisfactory size.
Dumping and sintering processes：Dumping process can carry out in Muffle furnace, and shield inert gas metal line is led in Muffle furnace
Road；For dumping speed depending on size of substrate, heating rate is 0.5-2 DEG C/min, and 3-6 hours are kept the temperature when rising to 500 DEG C, then
It is raised to 900 DEG C with 3.0-5.0 DEG C/min of speed to be sintered, keeps the temperature 3-6 hours at 900 DEG C, then with 1.0-4.0 DEG C/min
It is cooled to room temperature.According to line principle and line alignment, the jig of design specialized to multilayer circuit board carry out continuity test to get
There is the multilayer compound glass ceramic substrate of trace arrangements to finished product.
Embodiment 2
A kind of method manufacturing LED display modules with multilayer compound glass ceramic substrate of the present invention, including next coming in order progress
Process：
Using visual-alignment the accurate spraying microparticles tin cream point of injecting type point tin cream machine to manufactured multilayer circuit board LED wafer
The correspondence pad in face, the tin cream accuracy of measurement gone out every time tin grain size in ± 0.000001g, the tin cream is 100nm ~ 20um, tin
Cream fusing point is 210 ~ 235 DEG C；20 upside-down mounting of flip LED chips of the horizontal structure of at least one color is attached at and prints tin
On the correspondence pad of cream；It is welded using high-precision reflow ovens, LED display module semi-finished product is made；
According to the design requirements such as display module spacing and size, the plastic, transparent mask 21 of LED display modules, 21 table of mask are made
Frosting is made in face, and the color of plastic lens mask 21 can be added as needed on toner to adjust；
Upward by the concave surface of manufactured plastic, transparent mask, the filling liquid epoxy resin in concave surface 22；
The LED wafer of LED display module semi-finished product is face-down, it is smooth with the concave lens surface of populated epoxy resin；
Baking-curing：It first toasts 0.5 hour for 80 DEG C, then 125 DEG C are toasted 1 hour, last 150 DEG C are toasted 4 hours；
Weldering test afterwards, in the LED display module semi-finished product corresponding position sources of welding current seat 26 and communication interface Jing Guo abovementioned steps
Seat 27, is then electrified to light and test to obtain the final product.
The plastic face mask surface is frosting or smooth surface, and the color of lens mask can be added as needed on toner to adjust
It is whole.The appearance of the display surface of the LED display modules is determined by the outer surface of plastic lens mask.
The raw material of the multilayer compound glass ceramic substrate includes the substance of following parts by weight：Ceramic Al2O3Powder 30-40
Part, 20-30 parts of forsterite powder, 35-45 parts of pyrex powder, 85-105 parts of toluene-ethano azeotropic mixture solvent,
1-3 parts of triethyl phosphate, 1-2 parts of binder, 8-10 parts of plasticizer, 1-3 parts of antifoaming agent.The binder is polyvinyl alcohol contracting fourth
Aldehyde, the plasticizer are that mass ratio is dibutyl phthalate：Polyethylene glycol=4:6 composite elasticizer, the antifoaming agent are
N-butyl alcohol.
The manufacturing method of the multilayer compound glass ceramic substrate includes the process of next coming in order progress：
Curtain coating, cross cutting, drilling method and embodiment 1 are consistent.
Surface polishing treatment is carried out to base face.
60 ~ 100 DEG C of drying are carried out to the blank after polishing treatment, composite substrate is made；
PCB circuits are made in every layer of blank using magnetically controlled sputter method for the middle layer of MULTILAYER COMPOSITE substrate；Lamina rara externa is adopted
It is metallized with the method consistent with embodiment 1；
Lamination hot pressing：Monolithic composite substrate after metallization is put into according to the sequence and the number of plies of design requirement in folded mould, mould is folded
On be designed with the contraposition column consistent with composite substrate registration holes, ensure aligning accuracy；Mold is processed with alloy steel material, can be prevented
It is deformed after being used for multiple times；Pressure is adjusted according to the pressing number of plies and size, and hot pressing temperature controls between 200-350 DEG C；
Size finishing, dumping and sintering processes, line conduction test are completed glass ceramic baseplate and are prepared with embodiment 1.
The present embodiment has higher precision excellent precision requirement higher, the making for putting the smaller display module of spacing
Gesture can be good at controlling tin cream precision using the injecting type tin cream spraying machine of vision positioning, be conducive to the quality guarantee of product.
The present invention is not limited by embodiment illustrated herein, and is to fit to and principles disclosed herein and novelty
The consistent widest range of feature.
Claims (7)
1. a kind of method manufacturing LED display modules with multilayer compound glass ceramic substrate, which is characterized in that including next coming in order
The process of progress：
Using traditional SMT techniques, it is more than 250 DEG C of tin cream in multilayer compound glass ceramic substrate drive surface printing fusing point, is printing
It brushes the auxiliary elements such as drive surface attachment driving IC, the resistance capacitance of tin cream and carries out reflow soldering；
Tin grain size is 100nm ~ 20um, tin cream in multilayer compound glass ceramic substrate LED wafer face print solder paste, the tin cream
Fusing point is 210 ~ 235 DEG C；The flip LED chips upside-down mounting of the horizontal structure of at least one color is attached to pair for printing tin cream
It answers on pad；It is welded using high-precision reflow ovens, LED display module semi-finished product is made；
The plastic, transparent mask of LED display modules is made according to design requirement；Upward by the concave surface of manufactured plastic, transparent mask,
The filling liquid epoxy resin in concave surface；
The LED wafer of LED display module semi-finished product is face-down, it is smooth with the concave lens surface of populated epoxy resin；
The LED display modules that will be posted, carry out baking-curing, first 80 DEG C toast 0.5 hour, then 125 DEG C toast 1 hour, finally
150 DEG C are toasted 4 hours；
Afterwards weldering test to get.
2. a kind of method manufacturing LED display modules with multilayer compound glass ceramic substrate according to claim 1, feature
It is, the plastic face mask surface is frosting or smooth surface, and the color of lens mask can be added as needed on toner to adjust.
3. a kind of method manufacturing LED display modules with multilayer compound glass ceramic substrate according to claim 1, feature
It is, the appearance of the display surface of the LED display modules is determined by the outer surface of plastic lens mask.
4. a kind of method manufacturing LED display modules with multilayer compound glass ceramic substrate according to claim 1, feature
It is, the tin cream in the LED wafer face can also use spray regime to print.
5. a kind of method manufacturing LED display modules with multilayer compound glass ceramic substrate, which is characterized in that the MULTILAYER COMPOSITE
Glass ceramic baseplate raw material includes the substance of following parts by weight：Ceramic Al2O330-40 parts of powder, 20-30 parts of forsterite powder,
35-45 parts of pyrex powder, 85-105 parts of toluene-ethano azeotropic mixture solvent, 1-3 parts of triethyl phosphate, binder
1-2 parts, 8-10 parts of plasticizer, 1-3 parts of antifoaming agent.
6. a kind of method manufacturing LED display modules with multilayer compound glass ceramic substrate according to claim 5,
It is characterized in that, the binder is polyvinyl butyral, and the plasticizer is that mass ratio is dibutyl phthalate：Poly- second
Glycol=4:6 composite elasticizer, the antifoaming agent are n-butyl alcohol.
7. a kind of method manufacturing LED display modules with multilayer compound glass ceramic substrate according to claim 5, feature
It is, the manufacturing method of the multilayer compound glass ceramic substrate includes the process that next coming in order carry out：Dispensing, ball milling slurrying,
Curtain coating, cross cutting, metallization, lamination hot pressing, dumping sintering, continuity test.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022110818A1 (en) * | 2020-11-25 | 2022-06-02 | 深圳市洲明科技股份有限公司 | Solder paste, welding method for led and bonding pad, and led display unit and manufacturing method therefor |
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