CN205984981U - Bidirectional integration burys formula chip base plate structure that reroutes - Google Patents
Bidirectional integration burys formula chip base plate structure that reroutes Download PDFInfo
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- CN205984981U CN205984981U CN201620866153.9U CN201620866153U CN205984981U CN 205984981 U CN205984981 U CN 205984981U CN 201620866153 U CN201620866153 U CN 201620866153U CN 205984981 U CN205984981 U CN 205984981U
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- copper post
- line layer
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Abstract
The utility model relates to a bidirectional integration burys formula chip base plate structure that reroutes, the structure includes the second line layer (8), the second line layer (8) openly are provided with first connection copper post (1) and first components and parts (2), outer sealed first insulation material (3) in first connection copper post (1) and first components and parts (2), first insulation material (3) openly are provided with the first line layer (4), the first line layer (4) openly are provided with the second and connect copper post (5) and second components and parts (6), copper post (5) and second components and parts (6) outer sealed the 2nd insulating material (7) are connected to the second, the second line layer (8) back is provided with the third and connects copper post (9), is provided with on the third connection copper post (9) pombe (11). The utility model discloses can the multilayer is two -way bury, it is more that passive component pastes the dress number, has practiced thrift the integrated level that has improved packaging technology in the base plate space effectively.
Description
Technical field
This utility model is related to a kind of two-way integrated embedded type chip and reroutes board structure, belongs to semiconductor packaging
Field.
Background technology
Develop towards multifunction, miniaturization direction with electronic device, in electronic system, passive device accounting is also come more
Many.Passive device mainly adopts surface-pasted mode at present, does not occupy the substantial amounts of space of substrate surface, and surface weldering
Point quantity is many and interconnection length is longer, greatly reduces electrical property, reliability of system etc..For saving circuit board/substrate table
Space of planes, and the electronic system more frivolous, performance is more preferable, reliability is higher is provided, surface attaching type passive device is changed
For can embedded type passive device, be all embedded in together with active component the ultimate three-dimensional packaging technology within substrate be considered solve
The trend of problem.Three-dimension packaging structure traditional at present as shown in figure 1, its production method be substrate one side imbed passive,
Active component, pressing or coating insulant, electroplate blind hole technology by laser drilling and bottom function are guided to the second articulamentum
Make line layer again, it yet suffers from following shortcoming：Conventional base plate is yielding and thickness is thicker, is unfavorable for that raising encapsulation is integrated
Degree；Blind hole craft precision is not high and thermal diffusivity, electrically not good, especially for the product of high-frequency high-power for laser drilling plating.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of two-way integrated embedded type for above-mentioned prior art
Chip reroute board structure, it can multi-layer biaxially oriented embedment components and parts, effectively saved substrate space and improve encapsulation work
The integrated level of skill.
The technical scheme in the invention for solving the above technical problem is：A kind of two-way integrated embedded type chip reroutes
Board structure, it includes the second line layer, and described second line layer front is provided with the first connection copper post and the first components and parts, institute
State the first connection copper post and the first components and parts periphery is encapsulated with the first insulant, described first insulant front is provided with
One line layer, described first line layer front is provided with the second connection copper post and the second components and parts, described second connect copper post and
Second components and parts periphery is encapsulated with the second insulant, and the described second line layer back side is provided with the 3rd connection copper post, and described the
Two line layers and the 3rd connection copper post periphery are encapsulated with the 3rd capsulation material, and the plant ball region of described 3rd connection copper post is provided with
Metal ball.
Described first components and parts and the second components and parts are active or passive device.
Compared with prior art, the utility model has the advantage of：
1st, with product little, thin, highdensity require to improve constantly, lead frame or substrate require little and thin, tradition
Substrate is yielding and thickness is thicker, can only one side encapsulation and manufacture difficulty is larger, and the subsidiary metal support plate of this utility model supports
Intensity is big, and two-way can carry out embedment encapsulation, and substrate manufacture is thin and integrated level is higher, and properties of product are more preferably；
2nd, to fill out blind hole craft precision not high for conventional laser drilling, and this utility model uses pure electroplating technology to make to connect gold
Belong to design and manufacture and the product reliability that post can reach Fine pitch, especially high-frequency high-power, electrical and heat dispersion
More preferably；
3rd, the present invention reroutes in chip and forms rewiring technology and Stack Technology by connecting metal column on Process ba- sis
Fusion, effectively shorten chip and element and the conducting distance to outside outfan, it is possible to decrease electrically loss, when shortening transmission
Between, and improving the space availability ratio of thermal diffusivity and structure, the advantage making full use of double technique combination realizes high integration and height
The structure of performance；
4th, the multi-layer biaxially oriented embedment of this utility model, passive device attachment number is more, has effectively saved substrate space and has carried
The high integrated level of packaging technology.
Brief description
Fig. 1 is the schematic diagram of three-dimension packaging structure traditional at present.
Fig. 2 is the schematic diagram that a kind of two-way integrated embedded type chip of this utility model reroutes board structure.
Fig. 3 ~ Figure 15 is the manufacture method that a kind of two-way integrated embedded type chip of this utility model reroutes board structure
Each operation flow chart.
Wherein：
First connection copper post 1
First components and parts 2
First insulant 3
First line layer 4
Second connection copper post 5
Second components and parts 6
Second insulant 7
Second line layer 8
3rd connection copper post 9
3rd insulant 10
Metal ball 11.
Specific embodiment
Below in conjunction with accompanying drawing embodiment, this utility model is described in further detail.
As shown in Fig. 2 the two-way integrated embedded type chip of one of the present embodiment reroutes board structure, it includes second
Line layer 8, described second line layer 8 front is provided with the first connection copper post 1 and the first components and parts 2, described first connection copper post 1
It is encapsulated with the first insulant 3 with the first components and parts 2 periphery, described first insulant 3 front is provided with first line layer 4,
Described first line layer 4 front is provided with the second connection copper post 5 and the second components and parts 6, and described second connects copper post 5 and second yuan
Device 6 periphery is encapsulated with the second insulant 7, described second line layer 8 back side be provided with the 3rd connection copper post 9, described second
Line layer 8 and the 3rd connection copper post 9 periphery are encapsulated with the 3rd capsulation material 10, and the plant ball region of described 3rd connection copper post 9 sets
It is equipped with metal ball 11.
Its manufacture method is as follows：
Step one, take a metal support plate
Referring to Fig. 3, take the suitable metal support plate of a piece of thickness, in one layer of copper material thin film of metal support plate surface preplating；
Step 2, metal support plate front plating the first connection copper post
Referring to Fig. 4, stick photoresistance film on the metal support plate surface completing preplating copper material thin film, entered using exposure imaging equipment
Row graph exposure, development and removal partial graphical photoresistance film, electroplate the first connection copper post in the front surface region exposing metal support plate,
After the completion of the photoresistance film on metal support plate surface is removed；
Step 3, attachment the first components and parts
Referring to Fig. 5, mount the first components and parts in metal support plate front, described first components and parts can be active or passive device
Part, mounting method can be using surface mount, dispensing, whirl coating, plumber's solder or upside-down mounting etc.；
Step 4, metal support plate front cover ground floor insulant
Referring to Fig. 6, cover ground floor insulant in metal support plate front（Can be real by modes such as injection, hot pressing, sprayings
Existing）, it is ground on ground floor insulant surface, till exposing the first connection copper post；
Step 5, ground floor insulant front plating first line layer
Referring to Fig. 7, carry out metalized in ground floor insulant front, then carry out photoresistance film press mold development on surface
Expose regional area, first line layer in exposed area plating, finally carry out fast-etching in ground floor insulant front,
Metal layer beyond removal first line layer；
Step 6, first line layer front plating the second connection copper post
Referring to Fig. 8, stick photoresistance film in first line layer surface, carry out graph exposure, development using exposure imaging equipment
With remove partial graphical photoresistance film, carry out electroplating the second connection copper post in the front surface region exposed, after the completion of by first line layer
The photoresistance film on surface removes；
Step 7, first line layer front mount the second components and parts
Participate in Fig. 9, mount the first components and parts in first line layer front, described first components and parts can be active or passive
Device, mounting method can be using surface mount, dispensing, whirl coating, plumber's solder or upside-down mounting etc.；
Step 8, ground floor insulant front cover second layer insulant
Participate in Figure 10, cover second layer insulant in ground floor insulant front（Injection, hot pressing, spraying can be passed through
Realize etc. mode）, it is ground on second layer insulant surface, till exposing the second connection copper post；
Step 9, removal metal support plate
Referring to Figure 11, metal support plate is removed using etch process；
Step 10, the ground floor insulant back side electroplate the second line layer and the 3rd connection copper post
Referring to Figure 12, carry out metalized at the ground floor insulant back side, then carry out photoresistance film press mold on surface showing
Shadow exposes regional area, electroplates the second line layer and the 3rd connection copper post successively in exposed area, thus forming outer pin, the
First connection copper post and the first components and parts are coupled together by two line layers, complete the rewiring at the first components and parts back side, make first
The function of components and parts in longitudinal extension, finally carries out fast-etching at the ground floor insulant back side, remove the second line layer with
Outer metal layer；
Step 11, attachment the 3rd components and parts
Referring to Figure 13, mount the 3rd components and parts at the second line layer back side, described 3rd components and parts can be active or nothing
Source device, mounting method can be using surface mount, dispensing, whirl coating, plumber's solder or upside-down mounting etc.；
Step 12, ground floor insulant back side overlays third layer insulant
Referring to Figure 14, in ground floor insulant back side overlays third layer insulant（Injection, hot pressing, spraying can be passed through
Realize etc. mode）, it is ground on third layer insulant surface, till exposing the 3rd connection copper post；
Step 13, plant ball, cutting
Referring to Figure 15, in the plant ball region implanted metal ball of the 3rd connection copper post, the semi-finished product having planted metal ball are cut
Become single product.
Described step 5 ~ step 8 may be repeated repeatedly, thus realizing the attachment embedment of multilamellar components and parts.
In addition to the implementation, this utility model also includes other embodiment, all employing equivalents or equivalent
The technical scheme that substitute mode is formed, all should fall within this utility model scope of the claims.
Claims (2)
1. a kind of two-way integrated embedded type chip reroute board structure it is characterised in that：It includes the second line layer（8）, institute
State the second line layer（8）Front is provided with the first connection copper post（1）With the first components and parts（2）, described first connection copper post（1）With
First components and parts（2）Periphery is encapsulated with the first insulant（3）, described first insulant（3）Front is provided with first line
Layer（4）, described first line layer（4）Front is provided with the second connection copper post（5）With the second components and parts（6）, described second connection
Copper post（5）With the second components and parts（6）Periphery is encapsulated with the second insulant（7）, described second line layer（8）The back side is provided with
Three connection copper posts（9）, described second line layer（8）With the 3rd connection copper post（9）Periphery is encapsulated with the 3rd capsulation material（10）, institute
State the 3rd connection copper post（9）Plant ball region be provided with metal ball（11）.
2. the two-way integrated embedded type chip of one kind according to claim 1 reroute board structure it is characterised in that：Described
First components and parts（2）With the second components and parts（6）It is active or passive device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620866153.9U CN205984981U (en) | 2016-08-10 | 2016-08-10 | Bidirectional integration burys formula chip base plate structure that reroutes |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620866153.9U CN205984981U (en) | 2016-08-10 | 2016-08-10 | Bidirectional integration burys formula chip base plate structure that reroutes |
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| Publication Number | Publication Date |
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| CN205984981U true CN205984981U (en) | 2017-02-22 |
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| CN201620866153.9U Active CN205984981U (en) | 2016-08-10 | 2016-08-10 | Bidirectional integration burys formula chip base plate structure that reroutes |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106129052A (en) * | 2016-08-10 | 2016-11-16 | 江阴芯智联电子科技有限公司 | Two-way integrated embedded type chip reroutes board structure and preparation method thereof |
| CN108461458A (en) * | 2018-03-26 | 2018-08-28 | 江苏长电科技股份有限公司 | Surface mount packages structure and preparation method thereof |
-
2016
- 2016-08-10 CN CN201620866153.9U patent/CN205984981U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106129052A (en) * | 2016-08-10 | 2016-11-16 | 江阴芯智联电子科技有限公司 | Two-way integrated embedded type chip reroutes board structure and preparation method thereof |
| CN108461458A (en) * | 2018-03-26 | 2018-08-28 | 江苏长电科技股份有限公司 | Surface mount packages structure and preparation method thereof |
| CN108461458B (en) * | 2018-03-26 | 2020-07-28 | 江苏长电科技股份有限公司 | Surface mounting type packaging structure and manufacturing method thereof |
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