CN103335236A - Manufacturing technology of high-voltage LED lamp bar, high-voltage LED lamp bank, and assembly method of high-voltage LED lamp bank - Google Patents
Manufacturing technology of high-voltage LED lamp bar, high-voltage LED lamp bank, and assembly method of high-voltage LED lamp bank Download PDFInfo
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Abstract
The invention relates to a manufacturing technology of a high-voltage LED (Light-emitting Diode) lamp bar, a high-voltage LED lamp bank, and an assembly method of the high-voltage LED lamp bank. The manufacturing technology comprises the steps of mounting lamp beads, performing reflow soldering, injecting glue and packaging, the lamp bead mounting step is to mount electrodes of the high-voltage LED lamp beads (12) with corresponding electrodes of an FPC (Flexible Printed Circuit) board (10); the reflow soldering step is to perform the reflow soldering on the FPC board (10) equipped with the high-voltage LED lamp beads (12); and the glue injection and package step is to inject the glue on one side of each high-voltage LED lamp bead (12) equipped with the FPC board (10) after the reflow soldering, thereby forming the high-voltage LED lamp bar (1). According to the manufacturing technology of the high-voltage LED lamp bar, the high-voltage LED lamp bank and the assembly method of the high-voltage LED lamp bank, solar energy is made full use of, thereby being green and environment-friendly, the product application scope is wider, the service life is long, the technical steps are simple, and the manufacturing cost is low.
Description
Technical field
The present invention relates to technical field of semiconductor luminescence, particularly relate to a kind of high-voltage LED lamp bar manufacturing process, high-voltage LED lamp group and assemble method thereof.
Background technology
LED(Light Emitting Diode, light emitting diode) is a kind of solid-state semiconductor devices, it utilizes the solid semiconductor chip as luminescent material, by carrier the compound energy of emitting takes place and causes photo emissions, thereby directly electric energy is converted into luminous energy.The LED light fixture, as a kind of novel green light source product, with its technical characterstic such as efficient, energy-conservation, long-lived, small and exquisite, be widely used in fields such as various indications, demonstration, decoration, backlight, general lighting and urban landscape, the LED product is becoming main force's product of illumination market of new generation, and will effectively spur the high speed development of environmental protection and energy-conservation industry.
LED product of the prior art mostly is low-voltage LED greatly, and its operating voltage is generally about 2V or 3V.The power supply mode of low-voltage LED has two kinds usually, a kind of is that the 220V illuminalive power-supply is carried out the step-down power supply by transformer and drive circuit successively, this mode step-down loss is bigger, have low-voltage, high characteristics of current, heat is concentrated, reasonable radiator structure need be set, and need configuration transformer and drive circuit separately, cost is higher; Another kind is to utilize the photovoltaic solar energy storage device to power by inverter and drive circuit, and this mode has the step-down loss equally, and heat is concentrated, and radiator structure need be set, and needs configuration inverter and drive circuit separately, and cost is still higher.That is to say that low-voltage LED inevitably exists heat dissipation problem and equipment cost problem, so just restricted further developing of LED industry.
For this reason, a kind of high-voltage LED product has appearred in the art, high-voltage LED has high voltage, little characteristics of current, can overcome low-voltage LED substantially radiator structure and cost problem of higher need be set, but the high-quality high-voltage LED of the scarcely suitable manufacturing of existing LED manufacturing process, as disclosing a kind of soft LED lamp band and manufacture method thereof of high waterproof high life among the Chinese patent literature CN102889490A, wherein manufacture method comprises the soft lamp band of making LED semi-finished product; Above-mentioned semi-finished product are implemented encapsulating; Adopt high pressure draught technology that the soft lamp band of LED is blown in the soft transparent casing; Hot pressing is shunk.But there is following shortcoming in said method: (1) said method is after soft lamp band semi-finished product are irritated marine glue to LED, adopt high pressure draught technology that the soft lamp band of LED is blown in the soft transparent casing again, yet because transparent casing and marine glue are not commaterials, rising-heat contracting-cold coefficient difference is bigger, the high-voltage LED lamp bar that adopts this method to produce is spent under the above hot environment at 40 degrees below zero low temperature and 30, the damage of breaking easily, make that high-voltage LED product applicable scope is narrow, service life is shorter; (2) said method adopts high pressure draught technology that the soft lamp band of LED is put in the soft transparent casing, and its processing step complexity makes and produces high-voltage LED lamp bar in this way, and the manufacturing cost of product is higher.
Summary of the invention
For this reason, the technical problem to be solved in the present invention is existing LED fabrication process high-voltage LED lamp bar, can cause that application range of products is narrower, service life is short and processing step is complicated, manufacturing cost is higher, and provide that a kind of application range of products is wide, long service life and processing step is simple, high-voltage LED lamp bar manufacturing process, high-voltage LED lamp group and the assemble method thereof of low cost of manufacture.
For achieving the above object, the present invention is by the following technical solutions:
Technique scheme of the present invention has the following advantages compared to existing technology:
1. the manufacturing process of high-voltage LED lamp bar provided by the invention, comprise and mount the lamp pearl, carry out Reflow Soldering and injecting glue encapsulation step, compare with existing manufacture method, manufacturing process of the present invention is not used transparent casing suit LED lamp bar, it is damaged easily to have overcome transparent casing, influences LED lamp bar shelf life and range of application and complex process, problem that cost is high, has reduced material cost, simplify technology, reduced cost.
2. the manufacturing process of high-voltage LED lamp bar provided by the invention, high-voltage LED lamp pearl is mounted on the FPC substrate, because high-voltage LED lamp pearl, 1W adopts 20 milliamperes of drivings, and existing high-power low-voltage LED lamp pearl, 1W needs 350 milliamperes current drives, the high-voltage LED lamp bar electric current that the present invention makes is little, and heat dissipation capacity is little, has saved the employed aluminium base of market low pressure LE, save raw material, reduced cost.
3. the manufacturing process of high-voltage LED lamp bar provided by the invention, 1. also comprise the step of making high-voltage LED lamp pearl before in step, prior art just is encapsulated led chip usually, and in the manufacturing high-voltage LED lamp pearl step of the present invention, after high-voltage LED chip and current-limiting resistance series connection, be packaged together, increased high-voltage LED lamp pearl reliability, improved the service life of high-voltage LED lamp pearl greatly.
4. the manufacturing process of high-voltage LED lamp bar provided by the invention, after carrying out Reflow Soldering, the one side that the FPC substrate is pasted with high-voltage LED lamp pearl is carried out injecting glue, what adopt is soft epoxide-resin glue, host 560A-583 and curing agent 560B-583, its advantage is that the viscosity of the soft epoxide-resin glue of environment-friendly type is low, good leveling property, antifoam performance is good, but normal temperature or intermediate temperature setting, and curing rate is fast, saved the time of waiting for, improved efficient, flexibility is good after solidifying, and transparency is good, surfacing, light, no bubble, strong adhesion has good solvent resistance after the curing, the moistureproof and waterproof performance is excellent, reached IP67, and can be anti-the high temperature of 40 degree and the low temperature of 40 degree, make the scope of application of high-voltage LED lamp bar wider.
5. the manufacturing process of high-voltage LED lamp bar provided by the invention, 1. also comprise the step of making the FPC substrate before in step, the al nitride ceramic board that is fitted with rolled copper foil or electrolytic copper foil is sent into high temperature furnace, via 1065-1085 ℃ of temperature heating, make the copper metal because of high-temperature oxydation, diffusion, and then the congruent melting interface that produces the copper aluminate with aluminium nitride ceramics, make copper and al nitride ceramic board close adhesion, form the Ceramic Composite copper base, owing to have the congruent melting interface of copper aluminate, the adhesive strength height of copper and al nitride ceramic board, perfect heat-dissipating, technology is simple, cost is low, be fit to large-scale production, and the high-voltage LED chip of the thermal coefficient of expansion of ceramic material and the present invention's employing is close, thermal shock resistance is strong.
6. the manufacturing process of high-voltage LED lamp bar provided by the invention, and fill dielectric in other parts except circuit and electrode, preferred dielectric is polyphthalamide, this material can anti-200 ℃ continuous high temperature, and under hot conditions, can also guarantee good dimensional stability, thereby improved the service life of high-voltage LED lamp bar; And this material surface is coarse, and the light that high-voltage LED chip lower surface can be shone out reflects away by diffuse reflection, has further strengthened light efficiency.
7. the manufacturing process of high-voltage LED lamp bar provided by the invention utilizes screen process press and web plate tin solder to be coated on the electrode of Ceramic Composite copper base, forms the FPC substrate, adopts the serigraphy coated with solder, the precision height, and technology is simple, easy operating.
8. the manufacturing process of high-voltage LED lamp bar provided by the invention adopts lead-free solder to be coated on the electrode of Ceramic Composite copper base, and environmental protection meets China's electronics and IT products prevention and cure of pollution standard and the RoHS of European Union standard.
9. the manufacturing process of high-voltage LED lamp bar provided by the invention, the composition of tin solder is Sn:Au:Cu:Bi=94～98:0.1～1:0.5～1:1～3, preferred composition is Sn:Au:Cu:Bi=98:0.2:0.7:1.1, the tin solder strong adhesion of mentioned component, can finish welding firmly, reliably, and environmental protection, free from environmental pollution.
10. the manufacturing process of high-voltage LED lamp bar provided by the invention, each zone temperatures of carrying out Reflow Soldering in reflow soldering is followed successively by 327 degrees Fahrenheits, 347 degrees Fahrenheits, 365 degrees Fahrenheits, 392 degrees Fahrenheits, 419 degrees Fahrenheits, 428 degrees Fahrenheits, 455 degrees Fahrenheits and 420 degrees Fahrenheits, and the time that each section stops is all less than 40 seconds.The Reflow Soldering temperature value of setting is lower, can reduce the influence of high temperature to the high-voltage LED chip under the situation that guarantees weld strength, guarantees product quality.
11. the manufacturing process of high-voltage LED lamp bar provided by the invention, adopting solar energy is the power supply of high-voltage LED lamp bar, has realized non-electric energy-saving and environment friendly lighting engineering, save the energy, reduced environmental pollution, realized green illumination, production technology is simple, cost is low, is fit to large-scale production.And, adopt the monocrystalline silicon battery plate to utilize the controller circulation to a plurality of 48 overhead accumulators chargings, greatly reduce cost, increased substantially the transformation efficiency of monocrystalline silicon battery plate simultaneously.
12. the manufacturing process of high-voltage LED lamp bar provided by the invention, when making the FPC substrate, adopt unconventional technology, apply the thick high-temperature insulating paint of 100um (anti-50 degree) at the back side of Ceramic Composite copper base, the front applies high temperature resistant white paint except electrode, can reduce the absorption of light, improve the utilization rate of light.
13. high-voltage LED lamp group provided by the invention and assemble method thereof are directly given the power supply of high-voltage LED lamp bar with battery, have saved inverter and drive circuit, have improved the conversion light efficiency, and use solar energy resources, environmental protection, and saves energy reduces production costs; Control each charge in batteries amount and discharge time by controller, and the lightness of high-voltage LED lamp bar; And give a plurality of storage battery power supplies with a single-crystalline-silicon solar-cell panel, fully improved the single-crystalline-silicon solar-cell panel utilization rate.
14. high-voltage LED lamp group provided by the invention and assemble method thereof, single-crystalline-silicon solar-cell panel arranges according to 10 ° of-20 ° of inclination angles, preferably arranges according to 15 ° of inclination angles, makes single-crystalline-silicon solar-cell panel can accept solar irradiation, the utilization rate height of luminous energy.
Description of drawings
Clearly understood for the content that makes invention is easier, below according to a particular embodiment of the invention and by reference to the accompanying drawings, the present invention is further detailed explanation, wherein
Fig. 1 is the structural representation of high-voltage LED lamp group of the present invention;
Fig. 2 is the sectional view of high-voltage LED encapsulation of the present invention;
Fig. 3 is the structural representation of high-voltage LED lamp bar of the present invention;
Fig. 4 is the schematic diagram of high-voltage LED lamp bar of the present invention.
Reference numeral is expressed as among the figure:
1-high-voltage LED lamp bar, 2-battery, 3-single-crystalline-silicon solar-cell panel, 4-controller, 5-high-voltage LED frame base, the 6-insulating cement, 7-high-voltage LED chip, 8-transparent silica gel, 9-current-limiting resistance, 10-FPC substrate, the 11-tin solder, 12-high-voltage LED lamp pearl, 13-transparent sealing glue, 14-power supply wiring.
The specific embodiment
Embodiment one
Shown in Fig. 1-4, it is the preferred embodiment of high-voltage LED lamp bar manufacturing process of the present invention.
Described high-voltage LED lamp bar manufacturing process may further comprise the steps:
A. make high-voltage LED lamp pearl: with electrode and the high-voltage LED frame base 5(complex copper substrate of current-limiting resistance 9) counter electrode mount, again crystalline substance, curing, bonding wire, the capping of some glue, curing, light splitting color separation and tape package operation are fixed, consolidated to high-voltage LED chip 7 by a glue successively, form high-voltage LED lamp pearl 12.
In this step, described high-voltage LED chip 7 adopts 48 volts of high pressure blue chip ES-AADBHV45B of brilliant first photoelectricity, and the resistance of described current-limiting resistance 9 is 0.5 ohm (error 2% and described current-limiting resistance 9 are Chip-R).In addition, also need to be ready in advance materials such as silica gel KER-3000-M2, silica gel SCR-1018A, silica gel SCR-1018B.Utilize FLW-KR860 full-automatic printer and the Samsung SM421S chip mounter of Dongguan City Kelongwei Automation equipment Co., Ltd that described current-limiting resistance 9 is attached on the described high-voltage LED frame base 5, again 48 volts of high pressure blue chip ES-AADBHV45B are fixed, consolidate crystalline substance, curing, bonding wire, the capping of some glue, curing, light splitting color separation and tape package operation by a glue successively, form described high-voltage LED lamp pearl 12.In the present embodiment, described glue fixedly adopts insulating cement 6 in the operation, and that adopt in the present embodiment is silica gel KER-3000-M2; Adopt transparent silica gel 8 or epoxide-resin glue in the described some glue capping operation, that adopt in the present embodiment is silica gel SCR-1018A and silica gel SCR-1018B.
B. make the FPC substrate: the circuit on FPC substrate 10 comprises substrate body and is molded over described substrate body and the electrode that links to each other with circuit.May further comprise the steps,
A. rolled copper foil or electrolytic copper foil are fitted on the face of al nitride ceramic board (AlN pottery), the copper thickness of described rolled copper foil or described electrolytic copper foil is 30～70 microns; The described al nitride ceramic board that is fitted with described rolled copper foil or described electrolytic copper foil is sent into high temperature furnace, via 1065-1085 ℃ of temperature heating, form the Ceramic Composite copper base.
In this step, the preferred rolled copper foil that adopts is fitted on the face of described al nitride ceramic board, and copper thickness is 50 microns, and the described al nitride ceramic board that will be fitted with described rolled copper foil is afterwards sent into high temperature furnace, via 1075 ℃ of temperature heating, form described Ceramic Composite copper base.
B. according to line design, with the mode of etching copper layer preparation circuit and the electrode (or being referred to as pad) at described Ceramic Composite copper base, and fill dielectric in other parts except circuit and electrode.
In this step, line design according to described high-voltage LED chip 7 and 9 series connection of described current-limiting resistance, mode with etching prepares circuit and electrode at the copper layer of described Ceramic Composite copper base, and fill dielectric in other parts except circuit and electrode, reserve electrode, in the present embodiment, described dielectric adopts polyphthalamide.
C. apply the thick high-temperature insulating paint of 100um at the back side of described Ceramic Composite copper base, the front applies high temperature resistant white paint except electrode.
D. make polynary web plate.
E. utilize screen process press and web plate that tin solder 11 is coated on the electrode of described Ceramic Composite copper base, form described FPC substrate 10.Described tin solder 11 is lead-free tin cream, and its composition is Sn:Au:Cu:Bi=94～98:0.1～1:0.5～1:1～3, and in the present embodiment, the composition of described tin solder is to select Sn:Au:Cu:Bi=98:0.2:0.7:1.1 for use.
C. mount the lamp pearl: the electrode of several high-voltage LED lamp pearls 12 and the counter electrode of FPC substrate 10 are mounted.
D. carry out Reflow Soldering: the described FPC substrate 10 that will be pasted with described high-voltage LED lamp pearl 12 carries out Reflow Soldering.
In this step, the described FPC substrate 10 that is pasted with described high-voltage LED lamp pearl 12 sent into carry out Reflow Soldering in the reflow soldering, each zone temperatures of carrying out Reflow Soldering in reflow soldering is followed successively by 327 degrees Fahrenheits, 347 degrees Fahrenheits, 365 degrees Fahrenheits, 392 degrees Fahrenheits, 419 degrees Fahrenheits, 428 degrees Fahrenheits, 455 degrees Fahrenheits and 420 degrees Fahrenheits, and the time that each section stops is all less than 40 seconds.Through obtaining justifying high-voltage LED lamp after this step.
E. justifying LED lamp is carried out the unit and peel off, obtain high-voltage LED lamp bar unit.
F. described high-voltage LED lamp bar unit is carried out testing classification.
G. with several described high-voltage LED lamp bar element solder together.In the present embodiment, the length of described high-voltage LED lamp bar unit is 1 meter, with five described high-voltage LED lamp bar element solder together.
H. injecting glue encapsulation: the one side that described FPC substrate 10 is pasted with described high-voltage LED lamp pearl 12 is carried out injecting glue, forms described high-voltage LED lamp bar 1, and described high-voltage LED lamp bar 1 is reserved with power line 14.Notes are transparent sealing glue 13, and what specifically adopt is soft epoxide-resin glue, host 560A-583 and curing agent 560B-583.
I. the described high-voltage LED lamp bar 1 that injecting glue encapsulation back is obtained pastes the band packing.
Afterwards, the described high-voltage LED lamp bar 1 that above-mentioned technology is produced is assembled into high-voltage LED lamp group, and its assemble method may further comprise the steps:
Single-crystalline-silicon solar-cell panel 3 is installed to the place of sunshine abundance by 10 ° of-20 ° of inclination angles, then described single-crystalline-silicon solar-cell panel 3 and controller 4 are electrically connected, again described single-crystalline-silicon solar-cell panel 3 and at least one battery 2 are electrically connected, described battery 2 is solar storage battery, described battery 2 direct and high-voltage LED lamp bar 1 electrical connections then, described controller 4 is electrically connected with described battery 2, described high-voltage LED lamp bar 1 respectively again, obtains described high-voltage LED lamp group.
Particularly, described battery 2 is 48 overhead accumulators, and described single-crystalline-silicon solar-cell panel 3 is the 500W single-crystalline-silicon solar-cell panel; Described single-crystalline-silicon solar-cell panel 3 is electrically connected with two described batteries 2.Earlier the described single-crystalline-silicon solar-cell panel 3 of 500W is installed to the place of sunshine abundance by 15 ° of inclination angles, then described single-crystalline-silicon solar-cell panel 3 and described controller 4 are electrically connected, again described single-crystalline-silicon solar-cell panel 3 and two described batteries 2 are electrically connected, each described battery 2 directly is electrically connected with a described high-voltage LED lamp bar 1 then, described controller 4 is electrically connected with described battery 2, described high-voltage LED lamp bar 1 respectively again, obtain described high-voltage LED lamp group, as shown in Figure 1.
Embodiment two
In the present embodiment, the manufacturing process of high-voltage LED lamp bar may further comprise the steps:
1. mount the lamp pearl: the electrode of several high-voltage LED lamp pearls 12 and the counter electrode of FPC substrate 10 are mounted.
In the present embodiment, described high-voltage LED lamp pearl 12 and described FPC substrate 10 all are commercial products.
2. carry out Reflow Soldering: the described FPC substrate 10 that will be pasted with described high-voltage LED lamp pearl 12 carries out Reflow Soldering.
In this step, the described FPC substrate 10 that is pasted with described high-voltage LED lamp pearl 12 is sent into carried out Reflow Soldering in the reflow soldering; Each zone temperatures of carrying out Reflow Soldering in reflow soldering is followed successively by 327 degrees Fahrenheits, 347 degrees Fahrenheits, 365 degrees Fahrenheits, 392 degrees Fahrenheits, 419 degrees Fahrenheits, 428 degrees Fahrenheits, 455 degrees Fahrenheits and 420 degrees Fahrenheits, and the time that each section stops is all less than 40 seconds.
3. injecting glue encapsulation: after carrying out Reflow Soldering, the one side that described FPC substrate 10 is pasted with described high-voltage LED lamp pearl 12 is carried out injecting glue, forms high-voltage LED lamp bar 1, and described high-voltage LED lamp bar 1 is reserved with power line 14.Notes are transparent sealing glue 13, and what specifically adopt is soft epoxide-resin glue, host 560A-583 and curing agent 560B-583.
In other embodiments, the composition of tin solder 11 can also be Sn:Au:Cu:Bi=96:0.6:0.8:2, as long as component ratio satisfies Sn:Au:Cu:Bi=94～98:0.1～1:0.5～1:1～3.
In other embodiments, the copper thickness of rolled copper foil or electrolytic copper foil can also be 30 microns, 42 microns, 55 microns, 60 microns or 70 microns, as long as satisfy the product design requirement.Similarly, the al nitride ceramic board that is fitted with rolled copper foil or electrolytic copper foil is sent into high temperature furnace, furnace temperature can be 1065 ℃, 1070 ℃, 1080 ℃, 1085 ℃, as long as satisfy the product design requirement.
In other embodiments, it is identical with described high-voltage LED lamp bar 1 quantity that high-voltage LED lamp group can include only one, three or more 1, of described high-voltage LED lamp bar, three or more described battery 2(), single-crystalline-silicon solar-cell panel 3 and controller 4.Described single-crystalline-silicon solar-cell panel 3 and described controller 4 are electrically connected, described single-crystalline-silicon solar-cell panel 3 and each described battery 2 are electrically connected, each described battery 2 and a described high-voltage LED lamp bar 1 are electrically connected, and described controller 4 is electrically connected with described battery 2, described high-voltage LED lamp bar 1 respectively.
In other embodiments, the setting angle of described single-crystalline-silicon solar-cell panel 3 also can be 10 °, 12 °, 18 ° or 20 °.
In other embodiments, the supply voltage of battery 2 can be other values, as long as mate with high-voltage LED lamp bar 1; Equally, the power of single-crystalline-silicon solar-cell panel 3 also can be other values, as long as mate with battery 2.
The above-mentioned specific embodiment just is explained in detail technical scheme of the present invention; the present invention has more than and only is confined to above-described embodiment; those skilled in the art should be understood that; the improvement on basis of the present invention of the above-mentioned principle of every foundation and spirit, substitute, all should be within protection scope of the present invention.
Claims (17)
1. the manufacturing process of a high-voltage LED lamp bar is characterized in that: may further comprise the steps,
1. mount the lamp pearl: the electrode of several high-voltage LED lamp pearls (12) and the counter electrode of FPC substrate (10) are mounted;
2. carry out Reflow Soldering: the described FPC substrate (10) that will be pasted with described high-voltage LED lamp pearl (12) carries out Reflow Soldering;
3. injecting glue encapsulation: after carrying out Reflow Soldering, the one side that described FPC substrate (10) is pasted with described high-voltage LED lamp pearl (12) is carried out injecting glue, forms high-voltage LED lamp bar (1).
2. manufacturing process according to claim 1 is characterized in that: further comprising the steps of before 1. in described step,
Make high-voltage LED lamp pearl: the electrode of current-limiting resistance (9) and the counter electrode of high-voltage LED frame base (5) are mounted, again high-voltage LED chip (7) is fixed, consolidated crystalline substance, curing, bonding wire, the capping of some glue, curing, light splitting color separation and tape package operation by a glue successively, form described high-voltage LED lamp pearl (12).
3. manufacturing process according to claim 2 is characterized in that: fixedly adopt insulating cement (6) in the operation at described glue; In described some glue capping operation, adopt transparent silica gel (8) or epoxide-resin glue.
4. according to the arbitrary described manufacturing process of claim 1-3, it is characterized in that: further comprising the steps of before 1. in described step,
Make the FPC substrate: the circuit on described FPC substrate (10) comprises substrate body and is molded over described substrate body and the electrode that links to each other with circuit, may further comprise the steps,
A. rolled copper foil or electrolytic copper foil are fitted on the face of al nitride ceramic board, the copper thickness of described rolled copper foil or described electrolytic copper foil is 30～70 microns; The described al nitride ceramic board that is fitted with described rolled copper foil or described electrolytic copper foil is sent into high temperature furnace, via 1065-1085 ℃ of temperature heating, form the Ceramic Composite copper base;
B. according to line design, with the mode of etching copper layer preparation circuit and the electrode at described Ceramic Composite copper base, and fill dielectric in other parts except circuit and electrode;
C. apply the thick high-temperature insulating paint of 100um at the back side of described Ceramic Composite copper base, the front applies high temperature resistant white paint except electrode;
D. make polynary web plate;
E. utilize screen process press and polynary web plate that tin solder (11) is coated on the electrode of described Ceramic Composite copper base, form described FPC substrate (10).
5. manufacturing process according to claim 4, it is characterized in that: described dielectric is polyphthalamide.
6. according to claim 4 or 5 described manufacturing process, it is characterized in that: the composition of described tin solder (11) is Sn:Au:Cu:Bi=94～98:0.1～1:0.5～1:1～3.
7. manufacturing process according to claim 6, it is characterized in that: the composition of described tin solder is Sn:Au:Cu:Bi=98:0.2:0.7:1.1.
8. according to the arbitrary described manufacturing process of claim 1-7, it is characterized in that: described step 2. in, the described FPC substrate (10) that will be pasted with described high-voltage LED lamp pearl (12) is sent into and is carried out Reflow Soldering in the reflow soldering; Each zone temperatures of carrying out Reflow Soldering in reflow soldering is followed successively by 327 degrees Fahrenheits, 347 degrees Fahrenheits, 365 degrees Fahrenheits, 392 degrees Fahrenheits, 419 degrees Fahrenheits, 428 degrees Fahrenheits, 455 degrees Fahrenheits and 420 degrees Fahrenheits, and the time that each section stops is all less than 40 seconds.
9. manufacturing process according to claim 8 is characterized in that: 2. obtain justifying high-voltage LED lamp in the back through described step, justifying LED lamp is carried out the unit peel off, obtain high-voltage LED lamp bar unit.
10. manufacturing process according to claim 9, it is characterized in that: after obtaining described high-voltage LED lamp bar unit and described step 3. before, also comprise described high-voltage LED lamp bar unit is carried out testing classification, then with several described high-voltage LED lamp bar element solder step together.
11. manufacturing process according to claim 10 is characterized in that: the length of described high-voltage LED lamp bar unit is 1 meter; With five described high-voltage LED lamp bar element solder together.
12. according to claim 10 or 11 described manufacturing process, it is characterized in that: also comprise that in described step the described high-voltage LED lamp bar (1) that injecting glue encapsulation back is obtained pastes the step of band packing after 3..
13. a high-voltage LED lamp bar that requires the arbitrary described technology of 1-12 to produce aforesaid right is assembled into the assemble method of high-voltage LED lamp group, it is characterized in that: may further comprise the steps,
Single-crystalline-silicon solar-cell panel (3) is installed to the place of sunshine abundance by 10 ° of-20 ° of inclination angles, then described single-crystalline-silicon solar-cell panel (3) and controller (4) are electrically connected, again described single-crystalline-silicon solar-cell panel (3) and at least one battery (2) are electrically connected, described battery (2) is solar storage battery, direct and high-voltage LED lamp bar (1) electrical connection of described battery (2) then, described controller (4) is electrically connected with described battery (2), described high-voltage LED lamp bar (1) respectively again, obtains described high-voltage LED lamp group.
14. assemble method according to claim 13 is characterized in that: described battery (2) is 48 overhead accumulators, and described single-crystalline-silicon solar-cell panel (3) is the 500W single-crystalline-silicon solar-cell panel; Described single-crystalline-silicon solar-cell panel (3) is installed by 15 ° of inclination angles.
15. a high-voltage LED lamp group that adopts claim 13 or 14 described assemble methods to assemble out is characterized in that: comprise at least one high-voltage LED lamp bar (1), at least one battery (2), single-crystalline-silicon solar-cell panel (3) and controller (4); Described battery (2) is solar storage battery; Described single-crystalline-silicon solar-cell panel (3) and described controller (4) are electrically connected, described single-crystalline-silicon solar-cell panel (3) and described battery (2) are electrically connected, each described battery (2) and a described high-voltage LED lamp bar (1) are electrically connected, and described controller (4) is electrically connected with described battery (2), described high-voltage LED lamp bar (1) respectively.
16. high-voltage LED lamp group according to claim 15 is characterized in that: described single-crystalline-silicon solar-cell panel (3) arranges according to 10 ° of-20 ° of inclination angles.
17. according to claim 15 or 16 described high-voltage LED lamp groups, it is characterized in that: described single-crystalline-silicon solar-cell panel (3) arranges according to 15 ° of inclination angles; Described battery (2) is 48 overhead accumulators, and described single-crystalline-silicon solar-cell panel (3) is the 500W single-crystalline-silicon solar-cell panel; Described single-crystalline-silicon solar-cell panel (3) is electrically connected with two described batteries (2).
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| CN105179965A (en) * | 2015-08-31 | 2015-12-23 | 安徽福恩光电科技有限公司 | Process for producing LED lamp |
| CN105202387A (en) * | 2015-09-09 | 2015-12-30 | 四川甲骨文标识制作有限责任公司 | LED light source and production method thereof |
| WO2018010188A1 (en) * | 2016-07-15 | 2018-01-18 | 四川蓝景光电技术有限责任公司 | Fpc silicone rubber extrusion molding and spot dispensing processing technique for neon led light strip |
| CN109219238A (en) * | 2017-07-03 | 2019-01-15 | 张文耀 | Using silica gel plate as the circuit board of substrate and its manufacturing method |
| CN110052735A (en) * | 2018-11-22 | 2019-07-26 | 哈尔滨理工大学 | A kind of high thermal conductivity low cost composite solder paste and preparation method thereof encapsulated for second level and three-level |
| EP3502544A4 (en) * | 2016-08-18 | 2020-03-25 | Blueview Elec-Optic Tech Co., Ltd | Processing technique for extruded silicone rubber flexible light strip |
| CN111328209A (en) * | 2020-03-04 | 2020-06-23 | 四川移柯智创通信技术有限公司 | Manufacturing process of moisture-proof circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105179965A (en) * | 2015-08-31 | 2015-12-23 | 安徽福恩光电科技有限公司 | Process for producing LED lamp |
| CN105202387A (en) * | 2015-09-09 | 2015-12-30 | 四川甲骨文标识制作有限责任公司 | LED light source and production method thereof |
| WO2018010188A1 (en) * | 2016-07-15 | 2018-01-18 | 四川蓝景光电技术有限责任公司 | Fpc silicone rubber extrusion molding and spot dispensing processing technique for neon led light strip |
| EP3502544A4 (en) * | 2016-08-18 | 2020-03-25 | Blueview Elec-Optic Tech Co., Ltd | Processing technique for extruded silicone rubber flexible light strip |
| CN109219238A (en) * | 2017-07-03 | 2019-01-15 | 张文耀 | Using silica gel plate as the circuit board of substrate and its manufacturing method |
| CN110052735A (en) * | 2018-11-22 | 2019-07-26 | 哈尔滨理工大学 | A kind of high thermal conductivity low cost composite solder paste and preparation method thereof encapsulated for second level and three-level |
| CN111328209A (en) * | 2020-03-04 | 2020-06-23 | 四川移柯智创通信技术有限公司 | Manufacturing process of moisture-proof circuit board |
| CN111328209B (en) * | 2020-03-04 | 2021-03-09 | 四川移柯智创通信技术有限公司 | Manufacturing method of moisture-proof circuit board |
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