CN103096615A - Flexible printed circuit board provided with light emitting diode - Google Patents

Flexible printed circuit board provided with light emitting diode Download PDF

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Publication number
CN103096615A
CN103096615A CN2012104557689A CN201210455768A CN103096615A CN 103096615 A CN103096615 A CN 103096615A CN 2012104557689 A CN2012104557689 A CN 2012104557689A CN 201210455768 A CN201210455768 A CN 201210455768A CN 103096615 A CN103096615 A CN 103096615A
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CN
China
Prior art keywords
emitting diode
layer
thickness
described
light
Prior art date
Application number
CN2012104557689A
Other languages
Chinese (zh)
Inventor
孔德宝
Original Assignee
南京市江宁区丁卯电子科技中心
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 南京市江宁区丁卯电子科技中心 filed Critical 南京市江宁区丁卯电子科技中心
Priority to CN2012104557689A priority Critical patent/CN103096615A/en
Publication of CN103096615A publication Critical patent/CN103096615A/en

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Abstract

A flexible printed circuit board provided with a light emitting diode comprises a substrate, a covering film layer and a heat dissipation part, wherein copper layers are plated on two sides of a polyimide film on the substrate, and the heat dissipation part is formed on the surface of the lower portion of the substrate. Part of the covering film layer is a metal coating layer which is located on the surface of the upper portion of the substrate and is used for installation of the light emitting diode, the other part of the covering film layer is formed by overlying of a stickup layer, a polyimide layer and a Photo Solder Resist (PSR) layer in sequence. According to the flexible printed circuit board provided with the light emitting diode, heating performance of the light emitting diode installed on the flexible printed circuit board can be improved, and the service life of the light emitting diode is prolonged and even brightness can be maintained when backlight components of the light emitting diode are used.

Description

A kind of flexible PCB that light-emitting diode is installed

Technical field

The invention belongs to the light-emitting diode field in flexible PCB that is arranged on.

Background technology

At present, the research of flat display apparatus is quite a lot of, comprises liquid crystal display equipment that gets most of the attention etc.,

wherein the liquid crystal display equipment relies on its contrast rating high, being fit to gradient sign or animation indicates, the advantages such as little power consumption, at notebook computer, desktop computer display and LCD TV field extensive use, and application enlarges gradually, but the own right and wrong at above-mentioned liquid crystal indicator are luminiferous, so for the extra external light source of luminous needs, especially transmissive liquid crystal display device, the back side divergent light source that needs the LCD plates face, the light modulating device of making guiding function is backlight, above-mentioned backlight is can divide into side-light type and straight-down negative according to the mode difference of transmitted light, wherein side-light type back light is in the liquid crystal board side, luminous tube to be set, collocation transparent light guide plate, when making backlight module luminous, light is thrown into LCD screen display frame mode, direct-light-type backlight is in liquid crystal board lower portion selectivity, luminous tube to be installed, the light source that luminous tube is dispersed shows the mode of LCD screen picture by the radiating area that arranges in the middle of luminous tube and liquid crystal board, but the hot-cathode fluorescent lamp or the cold-cathode fluorescence lamp that use in above-mentioned photometry formula backlight, its thickness is too thick, life-span is short, and contain mercury, not environmental protection, the shortcomings such as power consumption is large, so utilize recently the photometry formula backlight of light-emitting diode (LED) array to get most of the attention, has low power consumption, life-span is high, the advantages such as miniaturization, in the notebook backlight source module, light-emitting diode uses as the backlight of liquid crystal indicator, moreover, mobile phone, the liquid crystal indicator of the small size digital electronics such as PDA also uses as backlight with light-emitting diode.

Summary of the invention

The objective of the invention is the heat dissipation problem when solving traditional lumination of light emitting diode in flexible PCB, make the life of electronic product, briliancy is even.

 

The present invention is achieved through the following technical solutions goal of the invention;

A kind of flexible PCB that light-emitting diode is installed, comprise by polyimide film two sides plated the copper layer substrate, cover rete, and the radiating part that forms in the lower surface of described substrate, described covering rete be at the upper face of substrate except the coat of metal that forms for diode installed, remaining part is respectively by adhered layer, and polyimide layer and PSR successively form.

The thickness of polyimide film described in the present invention is 20~25, and described copper layer thickness is 17~20.3, a kind of flexible PCB that light-emitting diode is installed according to claim 1, is characterized in that; The thickness of described metal Gold plated Layer is 5~6, and the thickness of described adhered layer is 20~25, and the thickness of described polyimide layer is that the thickness of 12, PSR is 18.

Radiating part described in the present invention comprises heat conduction bonding sheet, forms hot conducting membranes layer in the bottom of heat conduction bonding sheet, smears the heat radiation coating agent on hot conducting membranes layer surface and consists of.

The conduction of heat described in the present invention bonding sheet adopts heat resistant adhesive tape, thickness is 30 ~ 70, described hot conducting membranes layer is by the copper of pyroconductivity at 150 ~ 1000 W/mK, aluminium or graphite flake form, thickness is 30 ~ 100, and described heat radiation coating agent is by SiO2, Al2O3, or the strong agent of inorganic matter ceramic coating and the colouring agent mixing formation of Fe3O4 heat conductivity, thickness is 20 ~ 60.

 

Beneficial effect:

Can improve the heating property that is arranged on light-emitting diode in flexible PCB, thereby when using backlight group of light-emitting diode, can extend the life-span of light-emitting diode and keep uniform brilliance.

 

Embodiment

A kind of flexible PCB that light-emitting diode is installed is characterized in that; Comprise by polyimide film two sides plated the copper layer substrate, cover rete, and the radiating part that forms in the lower surface of described substrate, described covering rete be at the upper face of substrate except the coat of metal that forms for diode installed, remaining part is respectively by adhered layer, and polyimide layer and PSR (Photo Solder Resist) successively form.

The thickness of the polyimide film in the present invention is 20~25, and described copper layer thickness is 17~20.3, a kind of flexible PCB that light-emitting diode is installed according to claim 1, is characterized in that; The thickness of described metal Gold plated Layer is 5~6, and the thickness of described adhered layer is 20~25, and the thickness of described polyimide layer is that the thickness of 12, PSR (Photo Solder Resist) is 18.

Radiating part in the present invention comprises heat conduction bonding sheet, forms hot conducting membranes layer in the bottom of heat conduction bonding sheet, smears the heat radiation coating agent on hot conducting membranes layer surface and consists of.

Heat conduction bonding sheet in the present invention adopts heat resistant adhesive tape, thickness is 30 ~ 70 (preferably 50), hot conducting membranes layer is by the copper of pyroconductivity at 150 ~ 1000 W/mK, aluminium or graphite flake form, and thickness is 30 ~ 100, and (preferably 70) described heat radiation coating agent is by SiO2, Al2O3, Fe3O4, SiC, the inorganic matter ceramic coating agent that the heat conductivities such as AlN or BN are strong and colouring agent mix and consist of, and thickness is 20 ~ 60 (preferably 40).

Claims (5)

1. the flexible PCB that light-emitting diode is installed, is characterized in that; Comprise by polyimide film two sides plated the copper layer substrate, cover rete, and the radiating part that forms in the lower surface of described substrate, described covering rete be at the upper face of substrate except the coat of metal that forms for diode installed, remaining part is respectively by adhered layer, and polyimide layer and PSR successively form.
2. a kind of flexible PCB that light-emitting diode is installed according to claim 1, is characterized in that; The thickness of described polyimide film is 20~25, and described copper layer thickness is 17~20.
3. a kind of flexible PCB that light-emitting diode is installed according to claim 1, is characterized in that; The thickness of described metal Gold plated Layer is 5~6, and the thickness of described adhered layer is 20~25, and the thickness of described polyimide layer is that the thickness of 12, PSR is 18.
4. a kind of flexible PCB that light-emitting diode is installed according to claim 1, is characterized in that; Described radiating part comprises heat conduction bonding sheet, forms hot conducting membranes layer in the bottom of heat conduction bonding sheet, smears the heat radiation coating agent on hot conducting membranes layer surface and consists of.
5. a kind of flexible PCB that light-emitting diode is installed according to claim 4, is characterized in that; Described heat conduction bonding sheet adopts heat resistant adhesive tape, thickness is 30 ~ 70, described hot conducting membranes layer is by the copper of pyroconductivity at 150 ~ 1000 W/mK, aluminium or graphite flake form, thickness is that 30 ~ 100 described heat radiation coating agents are by SiO2, Al2O3, Fe3O4, inorganic matter ceramic coating agent and the colouring agent strong etc. heat conductivity mix formation, and thickness is 20 ~ 60.
CN2012104557689A 2012-11-14 2012-11-14 Flexible printed circuit board provided with light emitting diode CN103096615A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012104557689A CN103096615A (en) 2012-11-14 2012-11-14 Flexible printed circuit board provided with light emitting diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012104557689A CN103096615A (en) 2012-11-14 2012-11-14 Flexible printed circuit board provided with light emitting diode

Publications (1)

Publication Number Publication Date
CN103096615A true CN103096615A (en) 2013-05-08

Family

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Family Applications (1)

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CN2012104557689A CN103096615A (en) 2012-11-14 2012-11-14 Flexible printed circuit board provided with light emitting diode

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CN (1) CN103096615A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103335236A (en) * 2013-05-31 2013-10-02 鄂尔多斯市荣泰光电科技有限责任公司 Manufacturing technology of high-voltage LED lamp bar, high-voltage LED lamp bank, and assembly method of high-voltage LED lamp bank
CN105655494A (en) * 2016-03-18 2016-06-08 深圳市华星光电技术有限公司 Substrate of organic light-emitting diode, manufacturing method thereof and organic light-emitting diode

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1646730A (en) * 2002-04-12 2005-07-27 新日本制铁株式会社 Cover for exothermic article excellent in heat absorbing property and surface treated metal sheet therefor, and applications thereof
CN1926685A (en) * 2004-02-26 2007-03-07 奥斯兰姆奥普托半导体有限责任公司 Light-emitting diode arrangement for a high-power light-emitting diode, and method for producing a light-emitting diode arrangement
CN101198216A (en) * 2008-01-07 2008-06-11 史杰 Flexible circuit board of LED illumination array
CN101252164A (en) * 2007-02-22 2008-08-27 夏普株式会社 Surface mounting type light emitting diode and method for manufacturing the same
CN101284946A (en) * 2007-04-10 2008-10-15 信越化学工业株式会社 Heat conductive cured product and making method
CN101883474A (en) * 2009-05-08 2010-11-10 因特弗莱克斯株式会社 Method of manufacturing flexible printed circuit board
CN102321444A (en) * 2011-05-30 2012-01-18 天津安品有机硅材料有限公司 Thermal conductivity acrylic pressure sensitive glue composition and vinylformic acid heat conduction paster

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1646730A (en) * 2002-04-12 2005-07-27 新日本制铁株式会社 Cover for exothermic article excellent in heat absorbing property and surface treated metal sheet therefor, and applications thereof
CN1926685A (en) * 2004-02-26 2007-03-07 奥斯兰姆奥普托半导体有限责任公司 Light-emitting diode arrangement for a high-power light-emitting diode, and method for producing a light-emitting diode arrangement
CN101252164A (en) * 2007-02-22 2008-08-27 夏普株式会社 Surface mounting type light emitting diode and method for manufacturing the same
CN101284946A (en) * 2007-04-10 2008-10-15 信越化学工业株式会社 Heat conductive cured product and making method
CN101198216A (en) * 2008-01-07 2008-06-11 史杰 Flexible circuit board of LED illumination array
CN101883474A (en) * 2009-05-08 2010-11-10 因特弗莱克斯株式会社 Method of manufacturing flexible printed circuit board
CN102321444A (en) * 2011-05-30 2012-01-18 天津安品有机硅材料有限公司 Thermal conductivity acrylic pressure sensitive glue composition and vinylformic acid heat conduction paster

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103335236A (en) * 2013-05-31 2013-10-02 鄂尔多斯市荣泰光电科技有限责任公司 Manufacturing technology of high-voltage LED lamp bar, high-voltage LED lamp bank, and assembly method of high-voltage LED lamp bank
CN105655494A (en) * 2016-03-18 2016-06-08 深圳市华星光电技术有限公司 Substrate of organic light-emitting diode, manufacturing method thereof and organic light-emitting diode

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Application publication date: 20130508

C02 Deemed withdrawal of patent application after publication (patent law 2001)