CN209607761U - A kind of LED packaging and SMD light source - Google Patents
A kind of LED packaging and SMD light source Download PDFInfo
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- CN209607761U CN209607761U CN201821924376.1U CN201821924376U CN209607761U CN 209607761 U CN209607761 U CN 209607761U CN 201821924376 U CN201821924376 U CN 201821924376U CN 209607761 U CN209607761 U CN 209607761U
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Abstract
The utility model discloses a kind of LED packaging, the LED packaging includes lens, frame and LED chip；The bottom of the bowl of the frame is arranged in the LED chip；The lens are fixedly connected on the light-emitting surface of the frame.The utility model is directly using lens as a part of LED packaging, directly lens are engaged with other structures by mechanical be equipped with during the production of LED packaging, under the premise of meeting the light distribution requirements of subsequent SMD light source, the step of eliminating manual assembly lens, improve the production efficiency of SMD light source, eliminate the influence of human error, increase the yields of SMD light source, cost of labor is saved simultaneously, in addition to this, since mechanical precision is higher than artificial, therefore the lens provided in the utility model need the lens of manual assembly much smaller in volume than in the prior art, therefore material cost is also saved.The utility model provides a kind of a kind of SMD light source with above-mentioned beneficial effect simultaneously.
Description
Technical field
The utility model relates to semiconductor lighting devices fields, more particularly to a kind of LED packaging and SMD light source.
Background technique
General illumination market can be divided into traditional lighting and LED illumination two parts, benefit from traditional lighting government restrictive policy
And the energy conservation and environmental protection characteristic of LED technology, LED illumination quickly substitute traditional lighting market, and in illumination market, market
Largest, highest trading volume is exactly general illumination.
The core devices of existing general illumination product are LED light source components, in view of the powerful market of general illumination market
Demand certainly will pull the growth of LED light source component, and in LED light source component, SMD light source is most important Universal LED light
Source, but existing SMD light source is in the production process, needs the predeterminated position connection LED packaging first on substrate, then pass through people
Work is that above-mentioned each LED packaging adds light distribution element (usually lens) manually, to meet the light distribution demand of LED light source,
Therefore the production of SMD light source is faced with the problem that production efficiency is low, at high cost and low yields in the prior art.
Summary of the invention
The purpose of the utility model is to provide a kind of LED packaging and SMD light sources, to solve SMD light in the prior art
Source production efficiency underground, problem at high cost and low yields.
In order to solve the above technical problems, the utility model provides a kind of LED packaging, the LED packaging includes
Lens, frame and LED chip；
The bottom of the bowl of the frame is arranged in the LED chip；
The lens are fixedly connected on the light-emitting surface of the frame.
Optionally, in the LED packaging, the lens are arch lens.
Optionally, in the LED packaging, the vault of the arch lens is provided with lower concave part.
Optionally, in the LED packaging, there is sky on the side of the arch lens and the contact therewith
Hole.
Optionally, in the LED packaging, the arch lens are Nian Jie with the connection type of the frame.
Optionally, in the LED packaging, the arch lens are that silica gel arch lens or epoxy resin arch are saturating
Mirror.
Optionally, in the LED packaging, the frame is any in EMC frame, PCT frame or PPA frame
Kind.
Optionally, in the LED packaging, the LED chip of the LED packaging is using flip-chip technology
The LED chip of the bottom of the bowl of the frame is set.
The utility model additionally provides a kind of SMD light source, and the SMD light source includes any of the above-described kind of LED packaging
LED packaging provided by the utility model, the LED packaging include lens, frame and LED chip；
The bottom of the bowl of the frame is arranged in the LED chip；The lens are fixedly connected on the light-emitting surface of the frame.This
Utility model directly using lens as a part of LED packaging, is matched during the production of LED packaging by machinery
Dress directly engages lens with other structures, under the premise of meeting the light distribution requirements of subsequent SMD light source, eliminates manual assembly
The step of lens, improves the production efficiency of SMD light source, eliminates the influence of human error, in the yields for making SMD light source
It rises, while saving cost of labor, in addition to this, lens provided by the utility model are set to LED envelope by mechanically direct
It fills in device, since mechanical precision is higher than artificial, the lens provided in the utility model need than in the prior art
The lens of manual assembly are much smaller in volume, therefore also save material cost.
Detailed description of the invention
For the clearer technical solution for illustrating the utility model embodiment or the prior art, below will to embodiment or
Attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
Some embodiments of the utility model, for those of ordinary skill in the art, without creative efforts,
It is also possible to obtain other drawings based on these drawings.
Fig. 1 is the structural schematic diagram of SMD light source in the prior art；
Fig. 2 is a kind of structural schematic diagram of specific embodiment of LED packaging provided by the utility model；
Fig. 3 is the structural schematic diagram of another specific embodiment of LED packaging provided by the utility model；
Fig. 4 is the structural schematic diagram of another specific embodiment of LED packaging provided by the utility model；
Fig. 5 is the side view of another specific embodiment of LED packaging provided by the utility model；
Fig. 6 is the top view of another specific embodiment of LED packaging provided by the utility model；
Fig. 7 is the schematic diagram that the variation of the light intensity of lens SMD light source with beam projecting angle is not added in the prior art；
Fig. 8 is that the light intensity of another specific embodiment of LED packaging provided by the utility model goes out with light
The schematic diagram of the variation of firing angle degree；
Fig. 9 is a kind of structural schematic diagram of specific embodiment of SMD light source provided by the utility model.
Specific embodiment
In recent years, with the rapid development of technology, LED illumination rapidly rules illumination market, from the point of view of market scale,
Global general-use illumination market scale using traditional technology in 2014 is 56,500,000,000 dollars, and 2015 are 55,900,000,000 dollars, under year-on-year
Sliding 1.07%, it is contemplated that traditional technology general illumination market scale in 2019 by mono- step atrophy of Zhong to 39,800,000,000 dollars, 2014-2019
Year annual average compound growth rate is -6.8%.Global general-use illumination market scale using LED technology in 2014 is 24,100,000,000 dollars,
2015 are 28,900,000,000 dollars, increase by 19.92% on a year-on-year basis, it is contemplated that LED technology general illumination market scale in 2019 is 64,800,000,000 beauty
Member, 2014-2019 annual average compound growth rate are 21.8%.Correspondingly, whole world LED illumination permeability also still 2009
3.3% is promoted to 27.2% in 2015 steadily.LED industry is equally the industry that China gives special assistance to, and government opened from 2009
Beginning subsidizes LED middle and upper reaches industry Zhong row energetically, and production capacity is caused to be expanded rapidly, and LED illumination Product Terminal valence Yi constantly declines,
LED illumination permeability still 2012 3.3% fast liftings to 2016 44%.As China's LED industry middle and upper reaches are integrated
It is basically completed, the space that LED illumination product valence Yi continues drop is limited, and the speed that permeability is promoted will slow down, it is contemplated that following every
Year promotes 6%, arrives the year two thousand twenty, and China's LED illumination permeability is expected to reach 68%.
The core devices of general illumination product are LED light source components, in view of the powerful market demand of general illumination, Shi Bila
Dynamic LED light source component increases.And SMD light source is the most important light source of general illumination, occupies dominant contribution, it is in the prior art
The structural schematic diagram of SMD light source is as shown in Figure 1, so if can be realized as secondary optics on LED packaging
The cost and cost of labor of the materials such as subsequent lid lens are removed in design from, and illumination application end production is very convenient, this will certainly
Bring huge market prospects.
In order to make those skilled in the art better understand the scheme of the utility model, with reference to the accompanying drawing and specific implementation
The utility model is described in further detail for mode.Obviously, described embodiment is only the utility model a part
Embodiment, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not doing
Every other embodiment obtained under the premise of creative work out, fall within the protection scope of the utility model.
The core of the utility model is to provide a kind of LED packaging, the structural representation of specific embodiment one
Figure is as shown in Fig. 2, include lens 1, frame 2 and LED chip 3；
The bottom of the bowl of the frame 2 is arranged in the LED chip 3；
The lens 1 are fixedly connected on the light-emitting surface of the frame 2.
The mode being fixedly connected between said lens 1 and said frame 2 is Nian Jie or pressing mold.
Above-mentioned LED chip 3 can be positive cartridge chip or flip-chip.
The LED chip 3 of above-mentioned LED packaging is that the bottom of the bowl of the frame 2 is arranged in using flip-chip technology
The LED chip 3 in portion.
Said frame 2 is any in EMC frame 2, PCT frame 2 or PPA frame 2.
Said lens 1 are silica-gel lens 1 or epoxy resin lenses 1.
It should be noted that the surface where the above-mentioned opening of light-emitting surface, that is, said frame 2, above-mentioned be fixedly connected indicates above-mentioned
Lens 1 are combined by way of machining with said frame 2, are not easy to separate.
LED packaging provided by the utility model, the LED packaging include lens 1, frame 2 and LED chip
3；The bottom of the bowl of the frame 2 is arranged in the LED chip 3；The lens 1 are fixedly connected on the light out of the frame 2
On face.The a part of the utility model directly by lens 1 as LED packaging, during the production of LED packaging
Directly lens 1 are engaged with other structures by the way that machinery is equipped, under the premise of meeting the light distribution requirements of subsequent SMD light source, are saved
The step of having removed manual assembly lens 1 improves the production efficiency of SMD light source, eliminates the influence of human error, makes SMD light
The yields in source rises, while saving cost of labor, and in addition to this, lens 1 provided by the utility model pass through mechanical straight
It connects and is set in LED packaging, since mechanical precision is higher than artificial, the lens 1 provided in the utility model compare
It needs the lens 1 of manual assembly much smaller in volume in the prior art, therefore also saves material cost.
On the basis of above-mentioned specific embodiment, further the shape of said lens 1 is limited, is embodied
Mode two, structural schematic diagram is as shown in figure 3, include lens 1, frame 2 and LED chip 3；
The bottom of the bowl of the frame 2 is arranged in the LED chip 3；
The lens 1 are fixedly connected on the light-emitting surface of the frame 2；
The lens 1 are arch lens 1, and the vault of the arch lens 1 is provided with lower concave part.
Present embodiment and above-mentioned specific embodiment the difference is that, present embodiment improves
The shape of lens 1 is stated, other structures are identical as above-mentioned specific embodiment, and details are not described herein.
The side view for the LED packaging that present embodiment provides is as shown in figure 5, top view is as shown in Figure 6.
Fig. 7 is the schematic diagram that the variation of the light intensity of lens 1SMD light source with beam projecting angle is not added in the prior art, Fig. 8
For LED packaging provided by this specific embodiment light intensity with beam projecting angle variation schematic diagram, in contrast
It is not difficult to find that the light intensity for the LED potted element that present embodiment provides can be maintained in biggish exiting angle range
Higher level, i.e. irradiated area are wider.
In general illumination field, LED is largely used on wide area space illumination, and most applicable cases require
The light that LED element issues disperses as far as possible, i.e. the irradiating angle of the light of LED element is as big as possible, and said lens 1 have recessed for top
Sunken arch lens 1, total reflection phenomenon when by entering low refractive index dielectric from high refractive index using light carry out secondary light
The irradiating angle comparison of processing, the LED potted element after 1 light distribution of lens in present embodiment, light is existing
The lens 1 manually pasted in technology can greatly reduce 1 volume of lens in the case where guaranteeing that scattering angle is up to standard, reduce material
Cost.
On the basis of above-mentioned specific embodiment, further the contact surface of the lens 1 and the frame 2 is done and is changed
Into, obtain specific embodiment three, structural schematic diagram as shown in figure 4, include lens 1, frame 2 and LED chip 3；
The bottom of the bowl of the frame 2 is arranged in the LED chip 3；
The lens 1 are fixedly connected on the light-emitting surface of the frame 2.
The lens 1 are arch lens 1, and the vault of the arch lens 1 is provided with lower concave part；
There is cavity on the side that the arch lens 1 are contacted with the frame 2.
Present embodiment and above-mentioned specific embodiment the difference is that, present embodiment is to above-mentioned arch
The side that shape lens 1 are contacted with the frame 2 limits, and other structures are identical as above-mentioned specific embodiment, herein not
It is reinflated to repeat.
The mode being fixedly connected between said lens 1 and said frame 2 in the utility model is mostly Nian Jie, and specific real at this
Apply in mode, on the side that above-mentioned arch lens 1 are contacted with the frame 2 have cavity so that above-mentioned arch lens 1 with it is above-mentioned
There are gaps between frame 2 or between above-mentioned arch lens 1 and the fluorescent powder 4 of above-mentioned LED packaging, so that being bonded
Extra bonding agent can be stored in above-mentioned cavity in journey, without overflowing after being squeezed from seam crossing, and then interfere it
The performance of his structure, such as extra bonding agent may be infected with dust, and be attached to above-mentioned 1 outer surface of arch lens, influence LED device
Part light transmission, or it is attached to 2 outer surface of said frame, influence subsequent conduct.Therefore the LED envelope that this specific embodiment provides
Dress device improves the yields of final products.
The utility model additionally provides a kind of SMD light source, and the SMD light source includes any of the above-described kind of LED packaging,
Refer to the prior art for remaining structure, not reinflated herein to repeat.
The a part of the utility model directly by lens 1 as LED packaging, in the process of LED packaging production
In directly lens 1 are engaged with other structures by mechanical equipped, under the premise of meeting the light distribution requirements of subsequent SMD light source,
The step of eliminating manual assembly lens 1 improves the production efficiency of SMD light source, eliminates the influence of human error, makes SMD
The yields of light source rises, while saving cost of labor, and in addition to this, lens 1 provided by the utility model pass through machinery
It is directly arranged in LED packaging, since mechanical precision is than artificial high, the lens 1 provided in the utility model
It needs the lens 1 of manual assembly much smaller in volume than in the prior art, therefore also saves material cost.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with it is other
The difference of embodiment, same or similar part may refer to each other between each embodiment.For being filled disclosed in embodiment
For setting, since it is corresponded to the methods disclosed in the examples, so being described relatively simple, related place is referring to method part
Explanation.
It should be noted that in the present specification, relational terms such as first and second and the like are used merely to one
A entity or operation with another entity or operate distinguish, without necessarily requiring or implying these entities or operation it
Between there are any actual relationship or orders.Moreover, the terms "include", "comprise" or its any other variant are intended to
Cover non-exclusive inclusion, so that the process, method, article or equipment for including a series of elements not only includes those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or setting
Standby intrinsic element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that
There is also other identical elements in the process, method, article or apparatus that includes the element.
Detailed Jie has been carried out to LED packaging provided by the utility model and preparation method thereof and SMD light source above
It continues.Specific case used herein is expounded the principles of the present invention and embodiment, and above embodiments are said
The bright method and its core concept for being merely used to help understand the utility model.It should be pointed out that for the common of the art
For technical staff, without departing from the principle of this utility model, can also to the utility model carry out it is several improvement and
Modification, modifications and modifications also fall within the protection scope of the claims of the utility model.
Claims (6)
1. a kind of LED packaging, which is characterized in that the LED packaging includes lens, frame and LED chip；
The bottom of the bowl of the frame is arranged in the LED chip；
The lens are fixedly connected on the light-emitting surface of the frame；
The lens are arch lens；
There is cavity on the side of the arch lens and the contact therewith；
The LED chip of the LED packaging is the LED that the bottom of bowl of the frame is arranged in using flip-chip technology
Chip.
2. LED packaging as described in claim 1, which is characterized in that the vault of the arch lens is provided with lower concave part.
3. LED packaging as claimed in claim 2, which is characterized in that the connection side of the arch lens and the frame
Formula is bonding.
4. LED packaging as claimed in claim 3, which is characterized in that the arch lens are silica gel arch lens or ring
Oxygen resin arch lens.
5. LED packaging as claimed in claim 4, which is characterized in that the frame is EMC frame, PCT frame or PPA
It is any in frame.
6. a kind of SMD light source, which is characterized in that the SMD light source includes that LED described in any one of claim 1 to 5 such as is encapsulated
Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821924376.1U CN209607761U (en) | 2018-11-19 | 2018-11-19 | A kind of LED packaging and SMD light source |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821924376.1U CN209607761U (en) | 2018-11-19 | 2018-11-19 | A kind of LED packaging and SMD light source |
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| CN209607761U true CN209607761U (en) | 2019-11-08 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109346592A (en) * | 2018-11-19 | 2019-02-15 | 宁波升谱光电股份有限公司 | A kind of LED packaging and preparation method thereof, a kind of SMD light source |
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2018
- 2018-11-19 CN CN201821924376.1U patent/CN209607761U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109346592A (en) * | 2018-11-19 | 2019-02-15 | 宁波升谱光电股份有限公司 | A kind of LED packaging and preparation method thereof, a kind of SMD light source |
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