CN205881936U - LED integrally packaged structure white light chip - Google Patents
LED integrally packaged structure white light chip Download PDFInfo
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- CN205881936U CN205881936U CN201620573568.7U CN201620573568U CN205881936U CN 205881936 U CN205881936 U CN 205881936U CN 201620573568 U CN201620573568 U CN 201620573568U CN 205881936 U CN205881936 U CN 205881936U
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- led
- white light
- chip
- thin
- battery lead
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Abstract
The utility model discloses a LED integrally packaged structure white light chip, including plate electrode, power negative pole and positive, there are power negative pole and positive in plate electrode bottom left and right sides both ends electric connection respectively, the LED support is all installed at both ends about the plate electrode surface, plate electrode through the electrode post electric connection has LED light -emitting component, about well power chip bottom both ends respectively electric connection have the negative pole of access with insert anodal, well power chip top is equipped with the fluorescent glue, fluorescent glue surface mounting has the silica gel lens, thin arogel layer surface is equipped with the refraction board. The device is equipped with thin arogel layer above the LED light source to adopt special ratio mode to press into the thin slice, can have a better reflectivity to blue light LED, and set up the silica gel lens at blue optical chip, can be better reflect the light source, thereby solved the problem of the photochromic uniformity of LED white light source.
Description
Technical field
This utility model relates to LED white light technical field, is specially a kind of LED integrative packaging structure white light chip.
Background technology
White light LEDs generally uses two kinds of methods to be formed, and the first is to utilize " Blue-Ray technology " to cooperatively form white with fluorescent material
Light；The second is multiple monochromatic light mixed method.Both approaches can successfully produce white light parts the most.The white light of conventional package
LED, fluorescent glue typically uses epoxy resin or silica gel, and the result through light decay experiment draws, joins the white light LEDs longevity of powder with silica gel
Life is longer than epoxy resin.One of reason is to be packaged into finished product LED by both the above method, and silica gel is than epoxy resin uv-resistant
Ability is strong and silica gel radiating effect is better than epoxy resin；But the original intensity epoxy to be compared of powder under the same conditions, is joined with silica gel
The low of powder joined by resin, and main is that the refractive index (1.3-1.4) due to silica gel is lower than epoxy resin (more than 1.5), so just
Beginning light efficiency is high not as good as epoxy resin.It is contemplated that in the near future, white light LEDs surely can enter family and replace existing illuminating lamp.
Existing most of LED chip on the market is all monochromatic---red, green, blue color.In order to obtain white light, it is usually taken
Compound mode i.e. coats yellow fluorescent powder on blue chip, is allowed to be mixed into white light.It has the disadvantage in that
1, to be difficult to control to concordance poor for batch point powder amount；When 2, putting powder, uniformity is uneven every time, have color temperature difference different；3, warp
Cross multiple packaging technology, affect light efficiency；If using automatically dropping glue, cost is high.In sum, white light LED lamp not only light efficiency is high
And requiring that process repeatability concordance is good, product cost is high, just can have the market competitiveness.
Utility model content
The purpose of this utility model is to provide a kind of LED integrative packaging structure white light chip, to solve above-mentioned background
The problem proposed in technology.
For achieving the above object, the following technical scheme of this utility model offer: a kind of LED integrative packaging structure white light core
Sheet, including battery lead plate, power cathode and positive source, bottom described battery lead plate, two ends, left and right have been electrically connected with power cathode
And positive source, two ends, described electrode plate surface left and right are mounted on LED support, and described battery lead plate is electrically connected with by electrode column
LED luminescence component, described LED luminescence component is had to include middle power chip, two ends, left and right electricity respectively bottom described middle power chip
Property connect have access negative pole and access positive pole, described middle power chip is arranged over fluorescent glue, and described fluorescent glue surface is provided with
Silica-gel lens, is provided with thin arogel layer between LED support described in two groups, described thin powder film surface is provided with refracting plate.
Preferably, it is provided with prism sheet inside described refracting plate, and prism sheet is horizontal by 30 degree of angles.
Preferably, described silica-gel lens is hemispherical dome structure, and silica-gel lens sphere angle is 125 degree.
Compared with prior art, the beneficial effects of the utility model are: this LED integrative packaging structure white light chip,
LED light source is arranged over thin arogel layer, and uses special proportioning mode to be pressed into thin slice, it is possible to have preferably reflection to blue-ray LED
Rate, and silica-gel lens is set at blue chip, it is possible to preferably light source is reflected, thus solve LED white light source light
The conforming problem of color.
Accompanying drawing explanation
Fig. 1 is this utility model structural representation；
Fig. 2 is this utility model LED luminescence component structural representation.
In figure: 1 battery lead plate, 2 power cathodes, 3 positive sources, 4 LED luminescence components, power chip in 41,42 fluorescent glues,
43 silica-gel lens, 44 access negative poles, 45 access positive pole, 5 electrode columns, 6 LED supports, 7 thin arogel layers, 8 refracting plates.
Detailed description of the invention
Below in conjunction with the accompanying drawing in this utility model embodiment, the technical scheme in this utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of this utility model rather than whole
Embodiment.Based on the embodiment in this utility model, those of ordinary skill in the art are not under making creative work premise
The every other embodiment obtained, broadly falls into the scope of this utility model protection.
Referring to Fig. 1-2, this utility model provides a kind of technical scheme: a kind of LED integrative packaging structure white light chip,
Including battery lead plate 1, power cathode 2 and positive source 3, bottom described battery lead plate 1 two ends, left and right be electrically connected with power supply bear
Pole 2 and positive source 3, two ends, left and right, described battery lead plate 1 surface are mounted on LED support 6, and described battery lead plate 1 is by electrode column 5
Being electrically connected with LED luminescence component 4, described LED luminescence component 4 includes middle power chip 41, bottom described middle power chip 41
Two ends, left and right have been electrically connected with access negative pole 44 and have accessed positive pole 45, and described middle power chip 41 is arranged over fluorescent glue
42, described fluorescent glue 42 surface is provided with silica-gel lens 43, is provided with thin arogel layer 7 described in two groups between LED support 6, described thin
Arogel layer 7 surface is provided with refracting plate 8.
Described refracting plate 8 is internal is provided with prism sheet, and prism sheet is horizontal by 30 degree of angles.Described silica-gel lens 43 is
Hemispherical dome structure, and silica-gel lens 43 sphere angle is 125 degree.
Operation principle: fluorescent glue 42 is covered on middle power chip 41, and blue chip can be made by thin arogel layer 7
The gold-tinted sent with the yellow fluorescent powder of fritter thin slice is mixed to form white light, utilizes silica-gel lens 43 can increase the reflection of light source
Rate, makes light source luminescent penetration power strong.This apparatus structure is simple, reasonable in design, solves that LED white light source is photochromic conforming asks
Topic.
Embodiment the most of the present utility model, for the ordinary skill in the art,
It is appreciated that in the case of without departing from principle of the present utility model and spirit and these embodiments can be carried out multiple change, repair
Changing, replace and modification, scope of the present utility model is defined by the appended claims and the equivalents thereof.
Claims (3)
1. a LED integrative packaging structure white light chip, including battery lead plate (1), power cathode (2) and positive source (3), institute
State two ends, left and right, battery lead plate (1) bottom and be electrically connected with power cathode (2) and positive source (3), it is characterised in that: described
Two ends, battery lead plate (1) left and right, surface are mounted on LED support (6), and described battery lead plate (1) is electrically connected with by electrode column (5)
LED luminescence component (4), described LED luminescence component (4) includes middle power chip (41), and described middle power chip (41) bottom is left
Right two ends have been electrically connected with access negative pole (44) and have accessed positive pole (45), and described middle power chip (41) is arranged over fluorescence
Glue (42), described fluorescent glue (42) surface is provided with silica-gel lens (43), is provided with thin arogel described in two groups between LED support (6)
Layer (7), described thin arogel layer (7) surface is provided with refracting plate (8).
A kind of LED integrative packaging structure white light chip the most according to claim 1, it is characterised in that: described refracting plate
(8) inside is provided with prism sheet, and prism sheet is horizontal by 30 degree of angles.
A kind of LED integrative packaging structure white light chip the most according to claim 1, it is characterised in that: described silica gel is saturating
Mirror (43) is hemispherical dome structure, and silica-gel lens (43) sphere angle is 125 degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620573568.7U CN205881936U (en) | 2016-06-15 | 2016-06-15 | LED integrally packaged structure white light chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620573568.7U CN205881936U (en) | 2016-06-15 | 2016-06-15 | LED integrally packaged structure white light chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205881936U true CN205881936U (en) | 2017-01-11 |
Family
ID=57689403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620573568.7U Expired - Fee Related CN205881936U (en) | 2016-06-15 | 2016-06-15 | LED integrally packaged structure white light chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205881936U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106932951A (en) * | 2017-04-14 | 2017-07-07 | 深圳市华星光电技术有限公司 | LED lamp source and its manufacture method, backlight module |
| CN107195764A (en) * | 2017-06-27 | 2017-09-22 | 常州瑞丰特科技有限公司 | dodging device and preparation method thereof |
| CN108766962A (en) * | 2018-05-25 | 2018-11-06 | 张琴 | Solid state light emitter luminescent system integrated encapsulation structure and production method |
-
2016
- 2016-06-15 CN CN201620573568.7U patent/CN205881936U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106932951A (en) * | 2017-04-14 | 2017-07-07 | 深圳市华星光电技术有限公司 | LED lamp source and its manufacture method, backlight module |
| CN106932951B (en) * | 2017-04-14 | 2018-11-23 | 深圳市华星光电技术有限公司 | LED lamp source and its manufacturing method, backlight module |
| CN107195764A (en) * | 2017-06-27 | 2017-09-22 | 常州瑞丰特科技有限公司 | dodging device and preparation method thereof |
| CN108766962A (en) * | 2018-05-25 | 2018-11-06 | 张琴 | Solid state light emitter luminescent system integrated encapsulation structure and production method |
| CN108766962B (en) * | 2018-05-25 | 2020-01-07 | 张琴 | Solid-state light source light-emitting system integrated packaging structure and manufacturing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170111 Termination date: 20180615 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |