CN102931180A - LED light source and manufacturing method thereof - Google Patents
LED light source and manufacturing method thereof Download PDFInfo
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- CN102931180A CN102931180A CN2012104684595A CN201210468459A CN102931180A CN 102931180 A CN102931180 A CN 102931180A CN 2012104684595 A CN2012104684595 A CN 2012104684595A CN 201210468459 A CN201210468459 A CN 201210468459A CN 102931180 A CN102931180 A CN 102931180A
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- light source
- fluorescent material
- led light
- chip
- substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Abstract
The invention provides an LED light source and a manufacturing method thereof, and belongs to the technical field of lighting of semiconductors. The LED light source comprises a substrate and a plurality of chips, wherein the chips are fixed on the substrate, mutual connection among chips is achieved through metal wires, and the connection of the chips and the substrate is also achieved through metal wires, and phosphor powder thin plates are glued on the chips. The method for manufacturing the LED light source comprises the following steps: evenly mixing the phosphor powder with high molecular material, curing the mixture in a mould, and then cutting the mixture to serve as the phosphor powder thin plate; fixing the chips on the substrate, using the metal wires to achieve the connection among the chips as well as the connection of the chips and the substrate; and spreading glue water on the chips on the substrate and the metal wires, sticking the phosphor powder thin plates on the chips with glue water, and then carrying out curing. According to the provided LED light source, the problem of precipitation of the phosphor powder is avoided, accordingly the problem of low consistency of optical parameters and color parameters of light sources is also avoided, the separating process is simplified, the production cost is reduced, and the rate of finished products is improved.
Description
Technical field
The method that the invention provides a kind of led light source and make this led light source, this method especially are fit to make the larger COB light source of light-emitting area, belong to field of semiconductor illumination.
Background technology
As lighting technology of new generation, LED development is very fast, and technology constantly promotes, market scale constantly enlarges, and constantly replaces the traditional lighting light fixture by feat of advantages such as energy-saving and environmental protection, all solid state, long-lives.
Method for packing and the technique of current LED are similar, and concrete technology path is: die bond is fixed on chip on substrate or the support with the die bond machine; Bonding wire links to each other with chip, chip chip with bonding equipment with the circuit of support; Point glue with deployed according to a certain percentage fluorescent material and glue mixture, is coated on the chip, then solidifies, and has namely finished basic encapsulation flow process.Present this packaging technology encapsulates enterprise at each, use all very general on various types of products, but this packaging technology also exists some always unsolved problems, it mainly is the variety of issue that fluorescent material precipitates and therefore causes, because phosphor's density is larger, in silica gel or this liquid of epoxy resin, prolongation along with the time, fluorescent material is precipitation constantly, this precipitation shows two aspects: the one, in the some glue process of encapsulation, fluorescent material is grown the precipitation of generation owing to the time of staying in the containers such as syringe, when this precipitation can cause a glue to begin and the light source finished product batch property when finishing inconsistent, the light source fluorescent material amount of beginning time point rubber seal dress is on the low side, and some glue process is placed in the middle or on the high side by the light source fluorescent material amount of rear a period of time encapsulation, and during to end, the fluorescent material amount is seriously on the low side again; The 2nd, behind the glue, the precipitation of fluorescent material on light source, owing to not being just to put into the baking box baking at once behind the light source loading point glue, this is just so that fluorescent material continues precipitation in a period of time before entering baking box.The consistency of light, look parameter that above two problems can cause producing light source is lower, bring a lot of troubles for follow-up sorting, increase a lot of workloads, more serious meeting causes the rate of finished products of product to reduce, and at present in order to improve the brightness of light source, a lot of producers bring into use the larger fluorescent material of granularity, increase along with MODEL OF THE PHOSPHOR PARTICLE SIZE, its weight is also incited somebody to action increase at double, and precipitation is also just more obvious, and the problems referred to above will be more serious.
On the other hand, the led light source that adopts above-mentioned technique encapsulation to make, no matter be SMD or COB light source, its surface all is that non-ordinary light is sliding, approximately horizontal plane, and light is when being mapped to light and dredging material (air) from the close material of light (silica gel or epoxy resin), the two total reflection can occur at the interface, the interface of the two is more smooth, more smooth, the light that total reflection occurs is also just more, and the light that goes out to shoot out is just fewer, and the result causes the direct reduction of the luminous flux of the light source that produces.
Summary of the invention
The object of the invention is to: solve the precipitation of fluorescent material in traditional LED encapsulation process, and the problem that the light source quality of finished that causes differs.
Another object of the present invention is: solve in traditional LED closed process, light is reflected on the light source surface, and has influence on the problem that luminous intensity reduces.
Led light source provided by the invention and manufacture method, no longer adopt traditional coating fluorescent material and the technique of adhesive mixture, but fluorescent material and macromolecular material are manufactured the fluorescent material thin slice in advance, this fluorescent material thin slice generally is to make after mixing cured by fluorescent material and macromolecular material.
Specifically: the manufacture method of led light source provided by the invention comprises the steps:
S1: fluorescent material and macromolecular material are mixed, curing molding in mould, cutting is as the fluorescent material thin slice;
S2: chip is fixed on the substrate, and with metal wire with between chip and the chip, be connected between chip and the substrate;
S3: adhesive is applied on the chip and metal wire of substrate, again the fluorescent material thin slice is affixed on adhesive, cover on the chip, get final product after the curing.
Above-mentioned macromolecular material can adopt Merlon (PC), polymethyl methacrylate (PMMA), also can adopt a kind of in silica gel or the epoxy resin.
Above-mentioned adhesive can adopt silica gel or epoxy resin.
When above-mentioned macromolecular material adopts Merlon (PC), polymethyl methacrylate (PMMA), for the different bi-material of density is mixed, PC or PMMA preferably select the particle material, and in the process of mixing, preferably add the sticking auxiliary material of tool of some white oils and so on, in order to mix the surface that rear fluorescent material all is bonded at the particle material uniformly.To extrude behind the mixture heating and melting, fluorescent material and macromolecular material just can reach uniform mixing, a fluorescent material can not occur too much or very few in a certain position, have namely avoided the sedimentation problem of fluorescent material; Cooling curing to the mould after the taking-up, is cut to required size and gets final product, as the fluorescent material thin slice.Adopt such method to make the fluorescent material thin slice, the thin slice curing rate is fast, can disposable adding a large amount of macromolecular materials and the mixture of fluorescent material, the problem that can not occur in the conventional method that fluorescent material concentration can change in the syringe, some glue early stage and later stage fluorescent material concentration differs.Simultaneously, after mixing with macromolecular material and fluorescent material, mould carries out extrusion molding, and compound is solidified at short notice, thereby has also avoided the precipitation of fluorescent material in above-mentioned compound, more avoided fluorescent material to be deposited on the chip and chip around.
In addition, when adopting silica gel or epoxy resin to mix with fluorescent material that mixing of materials is even, be positioned in the mould, both can by the moulding that is heating and curing of routine.Avoid equally fluorescent material precipitation in the conventional method, disperseed uneven problem.
By conventional method fixed chip on substrate, and by metal wire chip is connected with substrate with chip, chip, the connected mode between chip and the chip can be series, parallel or series-parallel connection.
Re-use adhesive, for example silica gel or epoxy resin put on chip and the metal wire, are attached on the adhesive after will having made the fluorescent material thin slice again, behind adhesive solidification, namely make led light source.Packaged like this led light source just be there will be no the fluorescent material sedimentation problem, and the light source consistency will improve greatly.
In addition, improvement as this method, in the process of the technique of prefabricated fluorescent powder thin slice, mould inside is manufactured non-shiny surface, the fluorescent material thin slice for preparing like this can produce rough, light be can obviously reduce and total reflection the air event, the luminous flux of Effective Raise light source are transmitted into from adhesive.
In the upper surface or lower surface of fluorescent material thin slice, can wherein simultaneously have the structure of so non-shiny surface, also can have on the two sides.The structure of non-shiny surface can be groove or projection, its cross section can be rectangle, arc surfaced, triangle etc., also can be the shape such as groove, sphere at multistage interval, also these optional cross sectional shapes can be arranged in pairs or groups mutually, can realize technical scheme of the present invention.
Except using formed in mould mode that the fluorescent material sheet surface is formed groove or the projection, also can will carry out machine-shaping to the surface of fluorescent material thin slice by mach method, such as: cut, cut, quarter etc. routine operation, can both realize technical scheme of the present invention.
The present invention also provides a kind of led light source simultaneously, comprises substrate and a plurality of chip, and chip is fixed on the substrate, between chip and the chip, interconnect by metal wire between chip and the substrate, it is characterized in that: be adhesive with the fluorescent material thin slice on the chip.
Upper surface or the lower surface of the fluorescent material thin slice of above-mentioned led light source have non-shiny surface on the one side at least.
Above-mentioned non-shiny surface can be to be groove or projection, and the cross section is rectangle or circular arc.Adopt such structure, both can guarantee to reduce the reflection of light, also be fit to simultaneously processing.
When the cross section of fluorescent material thin slice is circular arc, can play certain optical design effect, the luminous intensity distribution design when being conducive to follow-up light fixture and making;
The thickness of described fluorescent material thin slice can be 0.05～5mm, and preferred 0.1～2mm, the thinner thickness of fluorescent material thin slice are conducive to reduce light loss therein;
Described recess width can be 0.05～2mm, and preferred 0.1～1mm less with groove width under the homalographic, then can portray more grooves, is conducive to like this reduce total reflection, improves optical efficiency;
Described depth of groove can be 0.04～1mm;
Beneficial effect
Compare with existing led light source especially COB light source, the fluorescent material sedimentation problem can not occur in led light source provided by the present invention, therefore also avoided because the low problem of optical color parameter consistency between the light source that the fluorescent material precipitation causes, simplified the sorting operation, even no longer need sorting, shorten the operation that led light source is made, reduced production cost, improved rate of finished products; Because the fluorescent material sheet surface has carried out roughening treatment, designed non-shiny surface on the other hand, reduced all reflective light ratio, improved light extraction efficiency, namely improved the luminous flux of light source, so that the led light source that adopts this method to make is more energy-conservation.
Description of drawings
Fig. 1 is the COB light source cross-sectional view that adopts conventional package technique to produce;
Fig. 2 is the COB light source cross-sectional view that a kind of fluorescent material thin slice with non-shiny surface structure provided by the invention is made;
Fig. 3 is the COB light source cross-sectional view that another kind provided by the invention has the fluorescent material thin slice manufacturing of non-shiny surface structure;
Fig. 4 is the COB light source cross-sectional view that another kind provided by the invention has the fluorescent material thin slice manufacturing of non-shiny surface structure;
Fig. 5 is the COB light source cross-sectional view that another kind provided by the invention has the fluorescent material thin slice manufacturing of non-shiny surface structure;
Fig. 6 is the luminous flux test comparison figure that adopts the COB light source that scheme is made respectively shown in scheme shown in the reference examples and the embodiment 1;
Wherein 1 is the mixture of fluorescent material and adhesive; The 2nd, substrate; 31, the 32nd, enclosure wall glue; 41, the 42,43, the 44th, chip; The 5th, adhesive; The 6th, fluorescent material thin slice, A are spectrum and the intensity that adopts the COB light source of scheme manufacturing shown in Figure 5, and B is spectrum and the intensity that adopts the COB light source that scheme is made shown in the method among Fig. 1.Abscissa is wavelength (nm), and ordinate is relative light intensity.
Embodiment
Reference examples
Referring to Fig. 1, this is a COB light source cross-sectional view that adopts the conventional package method to make, in traditional method for packing, in order to realize that white light conversion becomes white light, it is a glue that a requisite step process is arranged, mixture 1 with fluorescent material and adhesive is coated on the chip exactly, then allow its levelling, because mixture has certain viscosity, therefore its levelling needs a period of time, and during this period of time and said mixture within the time of spot gluing equipment, the capital is precipitated, and the light source that fluorescent material produces is from section, and the concentration of fluorescent material thickens from top to bottom gradually, and this will significantly affect the optical color parameter of the light source of manufacturing, along with the fluorescent powder grain of package application is increasing.This problem will become more obviously and be serious.
Embodiment 1
As shown in Figure 2, a kind of method for preparing led light source comprises the following steps:
At first, the mould of design reservation shape, after the particle material of fluorescent material and Merlon mixed, adopt the Shooting Technique mixture to add in the injection molding machine, produce the phosphor sheet that thickness is 0.05mm by mould, wherein depth of groove is 0.04mm, and recess width is 0.05mm, after the cutting, as fluorescent material thin slice 6.
Again with several chips 41,42,43,44 are fixed on the substrate 2 by designing requirement, then bonding wire, use gold thread, the silver line, or the metal wire such as copper cash is according to certain connection, such as parallel connection, series connection or series-parallel connection link to each other chip with circuit between the chip, at last with chip 41,42,43,44 with substrate 2 between circuit link to each other, then with enclosure wall glue 31,32 are coated on the substrate, form a circle, luminous zone and chip 41 with substrate 2,42,43,44 are trapped among in the circle, then deployed adhesive 5 is filled in enclosure wall glue 31, in the 32 besieged city circles, and with luminous zone and chip 41,42,43,44 cover fully, stand-by, in the present embodiment, adhesive adopts silica gel; Then the fluorescent material thin slice 6 with well cutting is attached on the adhesive 5 of substrate 2, then above-mentioned integral body is put into baking oven curing and can be obtained led light source provided by the present invention.
The relative light intensity comparison diagram of the led light source of the luminous flux (intensity) of the led light source of employing this programme manufacturing and conventional point glue formula encapsulation manufacturing as shown in Figure 6, therefrom can see, the relative light intensity of the led light source of employing this programme manufacturing is apparently higher than the accordingly result of conventional point glue formula encapsulation.
As shown in Figure 3, a kind of method for preparing led light source is with the difference of embodiment 1: adopt polymethyl methacrylate (PMMA) to mix with fluorescent material, design specific mould, prepare fluorescent material thin slice 6 by injection mo(u)lding.Have groove structure on the thin slice one side, the both sides of groove are the shape with dome, and recess width is 0.1mm, and depth of groove is 0.09mm, and sheet thickness is 0.1mm.
By fixed chip, injecting glue, stickup thin slice on substrate, can prepare the led light source with the fluorescent material thin slice again.
Embodiment 3
A kind of method for preparing led light source, be with the difference of embodiment 1: recess width is 1mm, and the groove groove depth is 0.6mm, and sheet thickness is 2mm, by fixed chip, injecting glue, stickup thin slice on substrate, can prepare the led light source with the fluorescent material thin slice again.
Embodiment 4
A kind of method for preparing led light source, be with the difference of embodiment 1: recess width is 2mm, and depth of groove is 1mm, and sheet thickness is 5mm, by fixed chip, injecting glue, stickup thin slice on substrate, can prepare the led light source with the fluorescent material thin slice again.
Embodiment 5
Referring to Fig. 3, a kind of method for preparing led light source is with the difference of embodiment 2: adopt silica gel and fluorescent material to mix, put into mould, be heating and curing, prepare the fluorescent material thin slice that the surface has groove structure, recess width is 1.5mm, and the fluorescent material sheet thickness is 2mm.
Again by at fixed chip on the substrate, use the epoxy resin injecting glue, paste thin slice, can prepare the led light source with the fluorescent material thin slice after being heating and curing.
Embodiment 6
Referring to Fig. 4, a kind of method for preparing led light source, be with the difference of embodiment 3: adopt epoxy resin and fluorescent material to mix, put into mould, be heating and curing, have groove structure on the fluorescent material thin slice of preparing, the cross section of groove structure both sides is the groove structure of circular arc, recess width is 1mm, and the thickness of fluorescent material thin slice is 4mm.
Embodiment 7
Referring to Fig. 5, a kind of method for preparing led light source, be with the difference of embodiment 2: design one and have the groove structure mould that cross section not of uniform size is circular shape, then the compound with fluorescent material and PMMA adds in the mould, producing thickness is the fluorescent material thin slice of 5mm, then according to led light source encapsulation requirement, cut and to obtain the fluorescent material thin slice, then the fluorescent material thin slice with well cutting is attached on the silica gel of substrate, then above-mentioned integral body is put into baking oven curing and can be obtained led light source provided by the present invention.
Through test, adopt embodiment 2～embodiment 7 prepared led light sources, the more conventional dispensing method of its fluorescent material has advantages of high conformity, is evenly distributed, and the luminous intensity during its illumination also is better than the light source of common process preparation.
The above describes in detail embodiments of the present invention by reference to the accompanying drawings, but the present invention is not limited to above-mentioned execution mode, in the ken that those of ordinary skills possess, can also under the prerequisite that does not break away from aim of the present invention, make a variety of changes, positive and negative such as the fluorescent material thin slice is pasted mode, thickness, matsurface shape, arrangements of chips mode etc.
Claims (10)
1. a led light source comprises substrate and chip, and chip is fixed on the substrate, between chip and the chip, interconnect by metal wire between chip and the substrate, it is characterized in that: be adhesive with the fluorescent material thin slice on the chip.
2. led light source according to claim 1 is characterized in that: the upper surface of described fluorescent material thin slice or lower surface, one side is non-shiny surface at least.
3. led light source according to claim 2, it is characterized in that: described non-shiny surface is on the surface of fluorescent material thin slice groove or projection to be set, the cross section of groove or projection is rectangle or circular arc.
4. led light source according to claim 3, it is characterized in that: described recess width is 0.05～2mm, depth of groove is 0.04～1mm.
5. each described led light source according to claim 1～2, it is characterized in that: the thickness of described fluorescent material thin slice is 0.05～5mm.
6. method of making led light source may further comprise the steps:
S1: fluorescent material and macromolecular material are mixed, curing molding in mould, cutting is as the fluorescent material thin slice;
S2: chip is fixed on the substrate, and with metal wire with between chip and the chip, be connected between chip and the substrate;
S3: adhesive is applied on the chip and metal wire of substrate, again the fluorescent material thin slice is affixed on adhesive, cover on the chip, get final product after the curing;
Described macromolecular material is a kind of in Merlon, polymethyl methacrylate, silica gel or the epoxy resin.
7. the method for manufacturing led light source according to claim 6, it is characterized in that: the macromolecular material described in the step S1 is the particle material; When mixing, also add white oil.
8. the method for manufacturing led light source according to claim 6 is characterized in that: described adhesive is a kind of in silica gel or the epoxy resin.
9. the method for manufacturing led light source according to claim 6 is characterized in that: among the step S1, also need the upper surface of fluorescent material thin slice or the non-shiny surface of the upper formation of at least one side of lower surface.
10. the method for manufacturing led light source according to claim 9 is characterized in that: consist of non-shiny surface by formed in mould method at the fluorescent material thin slice.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2012104684595A CN102931180A (en) | 2012-11-19 | 2012-11-19 | LED light source and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2012104684595A CN102931180A (en) | 2012-11-19 | 2012-11-19 | LED light source and manufacturing method thereof |
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| CN102931180A true CN102931180A (en) | 2013-02-13 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104465965A (en) * | 2014-12-09 | 2015-03-25 | 武汉大学 | Preparation method for fluorescent powder film used for white-light LED wafer level packaging |
| CN115850981A (en) * | 2022-11-10 | 2023-03-28 | Tcl华星光电技术有限公司 | White oil and backlight module |
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| CN101295755A (en) * | 2007-04-27 | 2008-10-29 | 林善仁 | Fluorescent powder thin film for light emitting diode |
| CN201638845U (en) * | 2010-02-02 | 2010-11-17 | 廖珮绫 | LED structure with film structure |
| US20120018761A1 (en) * | 2009-03-27 | 2012-01-26 | Konica Minolta Opto, Inc. | Phosphor member, method of manufacturing phosphor member, and illuminating device |
| CN102468417A (en) * | 2010-11-10 | 2012-05-23 | 三星Led株式会社 | Light emitting device package and method of manufacturing the same |
| CN102709454A (en) * | 2012-05-30 | 2012-10-03 | 上舜照明（中国）有限公司 | Surface-roughened double-layer adhesive structure LED light source and manufacturing method thereof |
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2012
- 2012-11-19 CN CN2012104684595A patent/CN102931180A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101295755A (en) * | 2007-04-27 | 2008-10-29 | 林善仁 | Fluorescent powder thin film for light emitting diode |
| US20120018761A1 (en) * | 2009-03-27 | 2012-01-26 | Konica Minolta Opto, Inc. | Phosphor member, method of manufacturing phosphor member, and illuminating device |
| CN201638845U (en) * | 2010-02-02 | 2010-11-17 | 廖珮绫 | LED structure with film structure |
| CN102468417A (en) * | 2010-11-10 | 2012-05-23 | 三星Led株式会社 | Light emitting device package and method of manufacturing the same |
| CN102709454A (en) * | 2012-05-30 | 2012-10-03 | 上舜照明（中国）有限公司 | Surface-roughened double-layer adhesive structure LED light source and manufacturing method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104465965A (en) * | 2014-12-09 | 2015-03-25 | 武汉大学 | Preparation method for fluorescent powder film used for white-light LED wafer level packaging |
| CN104465965B (en) * | 2014-12-09 | 2018-06-19 | 武汉大学 | A kind of fluorescent powder film preparation method for white light LEDs wafer-level packaging |
| CN115850981A (en) * | 2022-11-10 | 2023-03-28 | Tcl华星光电技术有限公司 | White oil and backlight module |
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Application publication date: 20130213 |