CN202352723U - LED (light emitting diode) device with even fluorescent powder coating structure - Google Patents
LED (light emitting diode) device with even fluorescent powder coating structure Download PDFInfo
- Publication number
- CN202352723U CN202352723U CN201120447007XU CN201120447007U CN202352723U CN 202352723 U CN202352723 U CN 202352723U CN 201120447007X U CN201120447007X U CN 201120447007XU CN 201120447007 U CN201120447007 U CN 201120447007U CN 202352723 U CN202352723 U CN 202352723U
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- CN
- China
- Prior art keywords
- box dam
- led
- led chip
- led device
- outer lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The utility model discloses an LED (light emitting diode) device with an even fluorescent powder coating structure, comprising a base plate, a box dam molded on the base plate, an LED chip arranged in the box dam, encapsulating colloid filled in the box dam and coated the LED chip, and an outer lens molded on the base plate and coated the box dam, wherein the box dam and the outer lens are in an integrated structure. According to the LED device with the even fluorescent powder coating structure, since the box dam and the outer lens are in the integrated structure, i.e. the box dam and the outer lens are made from a same material, and after the LED device is formed in an encapsulating way, a layered interface does not exist between the box dam and the outer lens, light emitted out of the LED chip can be guaranteed to linearly penetrate through a box dam layer to enter the outer lens without refraction and the interface reflection, and therefore, the LED device is high in light emitting efficiency. Meanwhile, the influence of the box dam is eliminated, so that the reasonable size of the box dam can be freely selected when the box dam is produced, the LED device is convenient to machine and manufacture, and the cost can be preferably controlled.
Description
Technical field
The utility model relates to the LED encapsulation field, relates in particular to a kind of LED device with even fluorescent material applying structure.
Background technology
During " 12 ", the semiconductor lighting industry welcomes a quick formative year as the novel industry of strategy, can predict, and in following a period of time, the competition in white light LEDs market will grow in intensity.Thereby, how to make a kind of high light efficiency, low cost, the white light LED part that bright dipping does not evenly have yellow circle becomes an emphasis of competitively developing in the industry.
In view of light efficiency and light-emitting uniformity, conformal applies a preferable selection of white light LEDs encapsulation beyond doubt; Traditional fluorescent material conformal coating mostly realizes through technologies such as electrophoresis, mould printing, sputters.Yet electrophoresis conformal coating process difficulty is big, the cost cost is high; Mould printing is difficult to be applicable to the LED device architecture of gold thread, and the phosphor powder layer that sputter is made is even inadequately.
In recent years, a kind of employing box dam is made the fluorescent material conformal structure gradually openly in industry.More common box dam structure has two kinds: the one, be installed in the substrate recess behind the preforming box dam, and the one, some glue forms box dam on substrate.Though preformed box dam, the relatively good assurance of its shape and size also will be installed once more, the bad control of structure relative complex and precision, and the cost that therefore causes is higher; And directly put the difficult in shape grasp of box dam that glue is made, the box dam inner surface of producing is arc often, is difficult to guarantee the conformal coating of fluorescent material.Simultaneously, because of the existence of box dam, the light loss of thing followed interface strengthens, and this also is a problem that must overcome again in the industry.
In view of this, it is high very to be necessary to develop a kind of light efficiency, and cost is low, and bright dipping is even, the novel fluorescence applying structure of the yellow circle of nothing.
The utility model content
In view of this, the purpose of the utility model is to provide a kind of LED device with even fluorescent material applying structure, improves light extraction efficiency and reduces cost.
In order to address the above problem, the utility model adopts following technical solution to realize above-mentioned purpose:
A kind of LED device with even fluorescent material applying structure; Comprise substrate, be molded into box dam on the substrate, be arranged on led chip in the box dam, be filled in the packing colloid that coats said led chip in the box dam, be molded into the outer lens that coats said box dam on the substrate, said box dam and outer lens are structure as a whole.
Preferably, said box dam comprises outer box dam and is arranged in the box dam of outer box dam, said packing colloid comprise be filled in in the box dam transparent colloid and be filled in the fluorescent colloid in the outer box dam, said outer box dam and outer lens are structure as a whole.
Preferably, said interior box dam and transparent colloid are structure as a whole.
Preferably, the spacing in outer box dam exceeds between the outer wall of the inwall of height and the outer box dam of box dam and interior box dam is identical.
Preferably, the inwall of said box dam is perpendicular to substrate surface.
Preferably, to exceed the height of led chip identical to the distance of led chip sidewall with the box dam inwall for said box dam.
Preferably, also comprise a reflector, be arranged on the substrate that said led chip, packing colloid, box dam, outer lens all are arranged in the cavity of reflector.
Preferably, the upper surface of said outer lens is distributed with a plurality of microlens structures.
Preferably, led chip is a plurality of small-power chips, is arranged in the box dam, and the adjacent LED chip interconnects through gold thread, and the led chip that is positioned at edge is connected with electrode.
Preferably, the height h of said box dam
wHeight h with led chip
xShould satisfy: h
x≤h
w≤2h
x
Compared with prior art; The LED device with even fluorescent material applying structure of the utility model, because box dam and outer lens are set to integrative-structure, promptly box dam has identical material with outer lens; Behind the encapsulated moulding; Do not have layering interfaces between box dam and the outer lens, can guarantee when the light straight line that led chip sends passes box dam layer entering outer lens, refraction and boundary reflection not to occur, light extraction efficiency is high.Simultaneously,, when making box dam, can freely select rational size, make things convenient for processing and fabricating, help controlling cost owing to eliminated the influence of box dam.
Description of drawings
Fig. 1 is the vertical view that the utlity model has the LED device embodiment one of even fluorescent material applying structure;
Fig. 2 is the forward cutaway view of LED device among Fig. 1;
Fig. 3 is the cutaway view that the utlity model has the LED device embodiment two of even fluorescent material applying structure;
Fig. 4 is the cutaway view that the utlity model has the LED device embodiment three of even fluorescent material applying structure;
Fig. 5 is the cutaway view that the utlity model has the LED device embodiment four of even fluorescent material applying structure.
Embodiment
In order to make those skilled in the art understand the technical scheme of the utility model better, the utility model is done further to specify below in conjunction with an accompanying drawing and a preferred embodiment.
Embodiment one
As shown in Figure 1; LED device in the present embodiment with even fluorescent material applying structure; Comprise: substrate 1, be molded into the box dam 2 on the substrate, be arranged on the led chip 3 in the box dam 2; Be filled in the packing colloid 4 that coats said led chip 3 in the box dam 2, be molded into the outer lens 5 that coats said box dam on the substrate.
Wherein, box dam 2 is structure as a whole with outer lens 5.Integrative-structure described in this enforcement is novel is meant: box dam 2 has identical material with outer lens 5; Behind the encapsulated moulding; There is not layering interfaces between box dam 2 and the outer lens 5, can guarantees to pass the box dam layer and refraction and boundary reflection do not occur from the light straight line that led chip sends.Therefore, when the processing box dam, can freely select the box dam size as required.
As shown in Figure 1, box dam 2 is looped around and forms annular closed around the led chip, is preferably circularly, and preferred box dam overall diameter is more than 3mm.As shown in Figure 2, the vertical and substrate surface of the inwall of box dam 2; The vertical section (one side that the edge is tangent with the substrate vertical direction) of preferred box dam is a rectangle.For controlling the fluorescent colloid consumption better, guarantee the even coating of fluorescent colloid, the height h of box dam 2
wBe 1 led chip height h
xTo 2 led chip height h
xBetween, the height h that box dam 2 exceeds led chip equal box dam 2 inwalls to led chip apart from d.
Led chip 3 can be ultraviolet, near ultraviolet or blue-light LED chip, is preferably the gallium nitride base blue light chip.Packing colloid 4 is preferably and contains yellow fluorescent powder for containing in yellow fluorescent powder, green fluorescence method, the red fluorescence powder one or more.Outer lens 5 preferably has the silica gel of scattering particles to be processed, and the shape of outer lens 5 can be planoconvex spotlight, plano-concave lens, shelled peanut type lens, elliposoidal lens, hemispherical lens; Be preferably hemispherical lens.
A kind of LED device that present embodiment provides with even fluorescent material applying structure, its box dam and outer lens are structure as a whole, and because of there be boundary reflection or the refraction that produces in box dam, light extraction efficiency is not high.Simultaneously,, when making box dam, can freely select rational size, make things convenient for processing and fabricating, help controlling cost owing to eliminated the influence of box dam.In addition, the inwall of box dam is perpendicular to substrate surface, and the height h that box dam exceeds led chip equals the structural design apart from d of box dam inwall to led chip, has guaranteed that fluorescent material evenly is coated with around the led chip, effectively avoids the appearance of yellow circle; And box dam height h
wHeight h with led chip
xSatisfy: h
x≤h
w≤2h
xProportionate relationship, help controlling the thickness of packing colloid, avoid blocked up phosphor powder layer to influence light effect, cause degradation problem under the light efficiency.
Embodiment two
As shown in Figure 3, the LED device with even fluorescent material applying structure in the present embodiment comprises: substrate 1; Be molded into the box dam 2 on the substrate; Be arranged on the led chip 3 in the box dam 2, be filled in the packing colloid 4 that coats led chip 3 in the box dam 2, be molded over the outer lens 5 that coats box dam on the substrate 1.
Wherein, box dam 21 and outer box dam 22 in box dam 2 comprises.The height of interior box dam 21 is more than or equal to the height of led chip 3, and outer box dam 22 is higher than interior box dam 21, and outer box dam 22 exceed in the height h1 of box dam 21 equal the inwall of outer box dam 22 and the outer wall spacing d1 of interior box dam 21.
A kind of LED device with even fluorescent material applying structure that present embodiment provides, its basic structure and embodiment one are similar.Led chip is preferably the gallium nitride base blue light chip.Fluorescent colloid is preferably the silica gel that contains the yellow fluorescence powder particles.
A kind of LED device with even fluorescent material applying structure that present embodiment provides separates setting with fluorescent colloid with chip, forms the far field excitation structure, helps improving the light extraction efficiency of LED device.
Embodiment three
As shown in Figure 4; The LED device with even fluorescent material applying structure of present embodiment; Comprise substrate 1, be molded into the box dam 2 on the substrate, be arranged on the led chip 3 in the box dam 2; Be filled in the packing colloid 4 that coats said led chip 3 in the box dam 2, be molded over the outer lens 5 that coats said box dam 2 on the substrate 1.
The LED device that present embodiment provides with even fluorescent material applying structure, its basic structure and embodiment one basically identical, difference is:
Also be provided with reflector 6 on the substrate 1.Utilize the light direction of reflector control device, make light more concentrated, be convenient to the secondary light-distribution that install and use in downstream.
Embodiment four
As shown in Figure 5; The LED device with even fluorescent material applying structure of present embodiment comprises substrate 1, is molded at least one box dam 2 on the substrate 1; Be arranged at least one led chip 3 in the box dam 2; Be electrically connected the gold thread 7 of led chip 3 and electrode 8, be filled in the packing colloid 4 that coats said led chip 3 in the box dam 2, be molded over the outer lens 5 that coats said box dam 2 on the substrate 1.
The LED device that present embodiment provides with even fluorescent material applying structure, its basic structure and embodiment one basically identical, difference is:
Led chip is made up of a plurality of gallium nitride base blue light small-power chips.The LED device that this a plurality of small-power Chip Packaging becomes is compared with the device that high-power chip is packaged into, and it is lower to have higher luminous efficiency and manufacturing cost.
More than the utility model has been carried out detailed introduction, use concrete example in the literary composition principle and the execution mode of the utility model set forth, the explanation of above embodiment just is used to help to understand the method and the core concept thereof of the utility model.Should be understood that; For those skilled in the art; Under the prerequisite that does not break away from the utility model principle, can also carry out some improvement and modification to the utility model, these improvement and modification also fall in the protection range of the utility model claim.
Claims (10)
1. LED device with even fluorescent material applying structure; Comprise substrate, be molded into box dam on the substrate, be arranged on led chip in the box dam, be filled in the packing colloid that coats said led chip in the box dam, be molded into the outer lens that coats said box dam on the substrate; It is characterized in that said box dam and outer lens are structure as a whole.
2. the LED device with even fluorescent material applying structure as claimed in claim 1; It is characterized in that; Said box dam comprises outer box dam and is arranged in the box dam of outer box dam; Said packing colloid comprise be filled in in the box dam transparent colloid and be filled in the fluorescent colloid in the outer box dam, said outer box dam and outer lens are structure as a whole.
3. the LED device with even fluorescent material applying structure as claimed in claim 2 is characterized in that, said interior box dam and transparent colloid are structure as a whole.
4. the LED device with even fluorescent material applying structure as claimed in claim 2 is characterized in that, the spacing in outer box dam exceeds between the outer wall of the inwall of height and the outer box dam of box dam and interior box dam is identical.
5. the LED device with even fluorescent material applying structure as claimed in claim 1 is characterized in that the inwall of said box dam is perpendicular to substrate surface.
6. the LED device with even fluorescent material applying structure as claimed in claim 1 is characterized in that, the height that said box dam exceeds led chip is identical to the distance of led chip sidewall with the box dam inwall.
7. the LED device with even fluorescent material applying structure as claimed in claim 1 is characterized in that, also comprises a reflector, is arranged on the substrate, and said led chip, packing colloid, box dam, outer lens all are arranged in the cavity of reflector.
8. the LED device with even fluorescent material applying structure as claimed in claim 1 is characterized in that the upper surface of said outer lens is distributed with a plurality of microlens structures.
9. the LED device with even fluorescent material applying structure as claimed in claim 1 is characterized in that led chip is a plurality of small-power chips, is arranged in the box dam, and the adjacent LED chip interconnects through gold thread, and the led chip that is positioned at edge is connected with electrode.
10. the LED device with even fluorescent material applying structure as claimed in claim 1 is characterized in that, the height h of said box dam
wHeight h with led chip
xShould satisfy: h
x≤h
w≤2h
x
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120447007XU CN202352723U (en) | 2011-11-11 | 2011-11-11 | LED (light emitting diode) device with even fluorescent powder coating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120447007XU CN202352723U (en) | 2011-11-11 | 2011-11-11 | LED (light emitting diode) device with even fluorescent powder coating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202352723U true CN202352723U (en) | 2012-07-25 |
Family
ID=46541696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120447007XU Expired - Lifetime CN202352723U (en) | 2011-11-11 | 2011-11-11 | LED (light emitting diode) device with even fluorescent powder coating structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202352723U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104022213A (en) * | 2014-04-11 | 2014-09-03 | 深圳市迈克光电子科技有限公司 | Remote phosphor COB integrated light source and preparation method thereof |
| WO2015139194A1 (en) * | 2014-03-18 | 2015-09-24 | 深圳市瑞丰光电子股份有限公司 | Led frame and led illuminant |
| CN105609621A (en) * | 2016-01-22 | 2016-05-25 | 常州市武进区半导体照明应用技术研究院 | 360-degree light source packaging device |
| CN105702838A (en) * | 2016-01-22 | 2016-06-22 | 常州市武进区半导体照明应用技术研究院 | Fluorescent powder coating method |
| CN103872218B (en) * | 2014-03-18 | 2016-09-28 | 深圳市瑞丰光电子股份有限公司 | LED support and LED illuminator |
| US10553765B2 (en) | 2016-11-21 | 2020-02-04 | Nichia Corporation | Method for manufacturing light emitting device |
-
2011
- 2011-11-11 CN CN201120447007XU patent/CN202352723U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015139194A1 (en) * | 2014-03-18 | 2015-09-24 | 深圳市瑞丰光电子股份有限公司 | Led frame and led illuminant |
| CN103872218B (en) * | 2014-03-18 | 2016-09-28 | 深圳市瑞丰光电子股份有限公司 | LED support and LED illuminator |
| CN104022213A (en) * | 2014-04-11 | 2014-09-03 | 深圳市迈克光电子科技有限公司 | Remote phosphor COB integrated light source and preparation method thereof |
| CN105609621A (en) * | 2016-01-22 | 2016-05-25 | 常州市武进区半导体照明应用技术研究院 | 360-degree light source packaging device |
| CN105702838A (en) * | 2016-01-22 | 2016-06-22 | 常州市武进区半导体照明应用技术研究院 | Fluorescent powder coating method |
| US10553765B2 (en) | 2016-11-21 | 2020-02-04 | Nichia Corporation | Method for manufacturing light emitting device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120725 |
|
| CX01 | Expiry of patent term |