CN102709454A - Surface-roughened double-layer adhesive structure LED light source and manufacturing method thereof - Google Patents
Surface-roughened double-layer adhesive structure LED light source and manufacturing method thereof Download PDFInfo
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- CN102709454A CN102709454A CN201210172595XA CN201210172595A CN102709454A CN 102709454 A CN102709454 A CN 102709454A CN 201210172595X A CN201210172595X A CN 201210172595XA CN 201210172595 A CN201210172595 A CN 201210172595A CN 102709454 A CN102709454 A CN 102709454A
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Abstract
The invention relates to a surface-roughened double-layer adhesive structure LED light source and a manufacturing method thereof and belongs to the field of semiconductor illumination. Chips are fixed on an aluminum substrate; a transparent adhesive coating covers the chip and the aluminum substrate; a fluorescent powder coating covers the transparent adhesive coating layer; a plurality of through holes are formed on the aluminum substrate; and the surface of the fluorescent powder coating layer is concave-convex rough surface. The manufacturing method comprises the following manufacturing steps: fixing the chips, treating a mould, injecting an adhesive layer, and solidifying and forming. Compared with the prior art, the surface-roughened double-layer adhesive structure LED light source and the manufacturing method thereof have the beneficial effects that in the surface-roughened double-layer adhesive structure LED light source, a silica gel layer is spaced between fluorescent powder and the chips, so that the effect of chip heating on the fluorescent powder is remarkably reduced, and the stability of the fluorescent powder can be remarkably improved; and meanwhile, when the fluorescent powder coating and an air contact surface are roughened, the total reflection ratio of light transmitted from silica gel to air is reduced, and the luminous flux of the light source is directly improved.
Description
Technical field
The present invention relates to a kind of double-deck glue structure led light source and manufacture method of surface coarsening, belong to field of semiconductor illumination.
Background technology
In field of semiconductor illumination, promoting light efficiency is two main research emphasis with improving heat radiation, and also exists interactional relation between these two factors at present, and especially the quality of radiating effect obviously affects the stability of each assembly.With regard to the light source of the integrated encapsulation of present COB, its basic technology is to be encapsulated on the very little aluminium base of area a plurality of chips are integrated, and then fluorescent material and silica-gel mixture are coated on the chip; Though it is simple to make the integrated packaged light source technology of COB like this, the problem that exists also is tangible: after the light source operate as normal, chip will constantly generate heat; Part heat will be transmitted on the fin through aluminium base and perhaps directly be dispersed in the air; Part heat is assembled between chip top layer and fluorescent material, silica gel, the temperature of fluorescent material is obviously raise, and then cause the quantum efficiency of fluorescent material constantly to decay; Light source is after working long hours like this; Its luminous efficiency will progressively reduce, and therefore when light source design and manufacturing, is necessary to consider the influence of the heat of chip to fluorescent material.On the other hand; The led light source surface that present various technology encapsulates out all is the sliding plane of non-ordinary light; The light that chip and fluorescent material sent like this is when this surface of incident; Some light can't be transmitted owing to total reflection, so when encapsulation, also must consider the influence that this factor causes.
Summary of the invention
The present invention is directed to above-mentioned deficiency provides a kind of double-deck glue of surface coarsening to construct led light source and manufacture method.
The present invention adopts following technical scheme:
The double-deck glue structure led light source of a kind of surface coarsening of the present invention comprises fluorescent coating, transparent adhesive tape coating, chip, aluminium base; Described chip is fixed on the aluminium base, and the transparent adhesive tape coating covers on chip and the aluminium base, and fluorescent coating covers on the transparent adhesive tape coating; Arrange several through holes on the described aluminium base, the surface of fluorescent coating is concavo-convex matsurface.
The double-deck glue structure led light source of surface coarsening of the present invention, the surface of aluminium base is silver coating or specular aluminium, silver coating or specular aluminium help promoting the reflection of light effect, and then promote the light emission rate of light source.
The manufacture method of the double-deck glue structure led light source of surface coarsening of the present invention, method is following:
1), chip is fixed on the aluminium base, and with chip links to each other with circuit between the aluminium base;
2), inwall mould through roughened is covered on the chip, and be fixed on the aluminium base, this mould be inverted made aluminium base last then, mould is down;
3) earlier fluorescent material is injected in the mould through through hole, transparent adhesive tape is being injected in the mould through through hole; Put into the drain air of fluorescent coating of vacuum desiccator then, then fluorescent coating is cured;
4), make aluminium base down the die ontology upset of fill accomplishing in the step 3, mould is last, and mold removal gets final product.
Beneficial effect
Double-deck glue structure led light source and manufacture method that the present invention provides surface coarsening are compared with prior art; In the double-deck glue structure led light source of surface coarsening, fluorescent material and street one silica gel layer, the chip heating will obviously reduce the influence of fluorescent material; The stability of fluorescent material will obviously raise; Fluorescent coating and air contact-making surface have reduced light and have incided airborne total reflection ratio from silica gel through roughening treatment simultaneously, have directly improved the luminous flux of light source.
Description of drawings
Fig. 1 is a sectional structure chart of the present invention;
Fig. 2 is the sectional structure chart of band mould of the present invention;
Fig. 3 is a mould sectional structure chart of the present invention;
Among the figure: the 1st, fluorescent coating, the 2nd, transparent adhesive tape coating, the 3rd, chip, the 4th, aluminium base, the 5th, through hole, the 6th, mould.
Embodiment
Below in conjunction with accompanying drawing to further explain of the present invention:
As shown in the figure: a kind of double-deck glue structure led light source of surface coarsening comprises fluorescent coating 1, transparent adhesive tape coating 2, chip 3, aluminium base 4, through hole 5.
Described chip 3 is fixed on the aluminium base 4, and transparent adhesive tape coating 2 covers on chip 3 and the aluminium base 4, and fluorescent coating 1 covers on the transparent adhesive tape coating 2; Arrange several through holes 5 on the aluminium base 4, the surface of fluorescent coating 1 is concavo-convex matsurface.The surface of aluminium base 4 is silver coating or specular aluminium.
The manufacture method of the double-deck glue structure led light source of surface coarsening, method is following:
Two through holes are arranged on the aluminium base, and one of them is a hole for injecting glue, and another is circulation of air hole 5, on the surface of fluorescent coating 1 semi-cylindrical hill is arranged, this convexity can effectively reduce light from fluorescent coating 2 to airborne total reflection, promote the luminous flux of light source; The manufacturing approach of the double-deck glue structure led light source of this surface coarsening is: on an aluminium base, make two through holes 5 earlier, then chip is fixed on the aluminium base, and carries out chip and chip; Chip is connected with circuit between the aluminium base, and the mould 6 that then an inwall bottom is had semicircular recess covers on the chip and is fixed on the aluminium base 4, then with this main body inversion of mould and aluminium base; Make aluminium base 4 last, mould 6 then injects a certain amount of fluorescent coating glue through one of them through hole down; Then this integral body is put into the vacuum desiccator exhaust; Air in the fluorescent coating glue is drained, and be cured, and then inject silica-gel coating glue; Adopt the same procedure exhaust; And be cured, this integral body with above step gained turns then, and mold removal can obtain the double-deck glue structure led light source of surface coarsening of the present invention.
Claims (3)
1. the double-deck glue structure led light source of a surface coarsening comprises fluorescent coating (1), transparent adhesive tape coating (2), chip (3), aluminium base (4); Described chip (3) is fixed on the aluminium base (4), and transparent adhesive tape coating (2) covers on chip (3) and the aluminium base (4), and fluorescent coating (1) covers on the transparent adhesive tape coating (2); It is characterized in that: described aluminium base (4) is gone up and is arranged several through holes (5), and the surface of fluorescent coating (1) is concavo-convex matsurface.
2. the double-deck glue of surface coarsening according to claim 1 is constructed led light source, and it is characterized in that: the surface of aluminium base (4) is silver coating or specular aluminium.
3. the double-deck glue of a manufacturing surface coarsening as claimed in claim 1 is constructed the manufacture method of led light source, and it is characterized in that: step is following:
1) chip (3) is fixed on the aluminium base (4), and chip (3) is linked to each other with circuit between the aluminium base (4);
2) mould (6) of an inwall through roughened covered on the chip (3), and be fixed on the aluminium base (4), make aluminium base last this mould inversion then, mould (6) is following;
3) earlier fluorescent material is injected in the mould (6) through through hole, again transparent adhesive tape is injected in the mould (6) through through hole; Put into the drain air of fluorescent coating of vacuum desiccator then, then fluorescent coating is cured;
4) make aluminium base following with filling mould (6) upset of accomplishing in the step 3, mould is last, and mold removal gets final product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210172595XA CN102709454A (en) | 2012-05-30 | 2012-05-30 | Surface-roughened double-layer adhesive structure LED light source and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210172595XA CN102709454A (en) | 2012-05-30 | 2012-05-30 | Surface-roughened double-layer adhesive structure LED light source and manufacturing method thereof |
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| CN102709454A true CN102709454A (en) | 2012-10-03 |
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| CN201210172595XA Pending CN102709454A (en) | 2012-05-30 | 2012-05-30 | Surface-roughened double-layer adhesive structure LED light source and manufacturing method thereof |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102931180A (en) * | 2012-11-19 | 2013-02-13 | 上舜照明（中国）有限公司 | LED light source and manufacturing method thereof |
| CN103810948A (en) * | 2014-03-05 | 2014-05-21 | 利亚德光电股份有限公司 | LED display assembly and manufacturing method thereof |
| CN103855148A (en) * | 2014-01-06 | 2014-06-11 | 深圳市瑞丰光电子股份有限公司 | Led filament and lighting device |
| CN104298001A (en) * | 2014-10-10 | 2015-01-21 | 深圳市华星光电技术有限公司 | Direct type backlight module and production method thereof |
| CN105810799A (en) * | 2016-03-25 | 2016-07-27 | 映瑞光电科技(上海)有限公司 | Preparation method for improving brightness of wafer level white-light LED chip and structure of wafer level white-light LED chip |
| CN105895781A (en) * | 2016-06-02 | 2016-08-24 | 深圳市晶瓷光电有限公司 | Package structure and package method of blue-light LED flip chip |
| CN108490683A (en) * | 2018-03-12 | 2018-09-04 | 安徽芯瑞达科技股份有限公司 | A kind of novel backlight module backlight and preparation method thereof |
| CN111584694A (en) * | 2019-02-19 | 2020-08-25 | 江苏罗化新材料有限公司 | Side-emitting LED chip-scale packaging method |
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| CN101876407A (en) * | 2010-05-17 | 2010-11-03 | 中山大学佛山研究院 | LED light source module |
| US20100283065A1 (en) * | 2009-05-11 | 2010-11-11 | SemiLEDs Optoelectronics Co., Ltd. | Led device with a light extracting rough structure and manufacturing methods thereof |
| CN101982892A (en) * | 2010-08-18 | 2011-03-02 | 深圳市洲明科技股份有限公司 | Packaging structure and method of high-power LED |
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| US20100283065A1 (en) * | 2009-05-11 | 2010-11-11 | SemiLEDs Optoelectronics Co., Ltd. | Led device with a light extracting rough structure and manufacturing methods thereof |
| CN101699638A (en) * | 2009-10-30 | 2010-04-28 | 中山大学 | Phosphor powder film making method and obtained phosphor powder film encapsulating method |
| CN101876407A (en) * | 2010-05-17 | 2010-11-03 | 中山大学佛山研究院 | LED light source module |
| CN101982892A (en) * | 2010-08-18 | 2011-03-02 | 深圳市洲明科技股份有限公司 | Packaging structure and method of high-power LED |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102931180A (en) * | 2012-11-19 | 2013-02-13 | 上舜照明（中国）有限公司 | LED light source and manufacturing method thereof |
| CN103855148A (en) * | 2014-01-06 | 2014-06-11 | 深圳市瑞丰光电子股份有限公司 | Led filament and lighting device |
| CN103855148B (en) * | 2014-01-06 | 2017-03-08 | 深圳市瑞丰光电子股份有限公司 | LED filament and illuminator |
| CN103810948A (en) * | 2014-03-05 | 2014-05-21 | 利亚德光电股份有限公司 | LED display assembly and manufacturing method thereof |
| CN104298001A (en) * | 2014-10-10 | 2015-01-21 | 深圳市华星光电技术有限公司 | Direct type backlight module and production method thereof |
| WO2016054838A1 (en) * | 2014-10-10 | 2016-04-14 | 深圳市华星光电技术有限公司 | Direct type backlight module and manufacture method therefor |
| US9541790B2 (en) | 2014-10-10 | 2017-01-10 | Shenzhen China Star Optoelectronics Technology Co., Ltd | Direct-type backlight module and manufacturing method thereof |
| CN104298001B (en) * | 2014-10-10 | 2017-05-10 | 深圳市华星光电技术有限公司 | Direct type backlight module and production method thereof |
| CN105810799A (en) * | 2016-03-25 | 2016-07-27 | 映瑞光电科技(上海)有限公司 | Preparation method for improving brightness of wafer level white-light LED chip and structure of wafer level white-light LED chip |
| CN105895781A (en) * | 2016-06-02 | 2016-08-24 | 深圳市晶瓷光电有限公司 | Package structure and package method of blue-light LED flip chip |
| CN108490683A (en) * | 2018-03-12 | 2018-09-04 | 安徽芯瑞达科技股份有限公司 | A kind of novel backlight module backlight and preparation method thereof |
| CN111584694A (en) * | 2019-02-19 | 2020-08-25 | 江苏罗化新材料有限公司 | Side-emitting LED chip-scale packaging method |
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Application publication date: 20121003 |